200528231 九、發明說明： 【發明所屬之技術領域】 本發明係有關於研磨裝置及被研磨材料厚度之判定方 法，特別係有關適於作為供研磨透鏡等光學零件的裝置及 方法的被研磨材料厚度之判定技術。 【先前技術】 一般在研磨透鏡等光學元件情況下，藉由將被研磨材料 固定於上研磨皿及下研磨皿的任一方，使第1研磨皿及第 2研磨J2I相對旋轉並搖動，進行研磨。此種研磨方法已知 有S己置成，一面使一方（上下任一）研磨軸繞既定搖動中 心轉動，一面使另一研磨軸旋轉的球芯搖動型研磨裝置， 以及一研磨軸與研磨皿成任意角度連結，一面使此研磨軸 搖動，一面使另一研磨軸旋轉的奥斯卡型研磨裝置。 上述各種研磨裝置為管理被研磨材料的厚度，檢測隨著 所研磨的被研磨材料的厚度變化移動的既定裝置構造部分 的位置。通常，藉由於該裝置構造部分到達既定位置時結 束研磨動作，努力使被研磨材料的厚度接近目標（例如參 照以下專利文獻1 )。於此情況下，出現連續測定既定裝置 構造部分的位置，測定每一次搖動的研磨量，設定研磨時 間及研磨次數的情形（參照專利文獻1的圖1及圖3 )，以 及檢測是否達到被研磨材料厚度的目標值的情形（參照專 利文獻1的圖1 2及圖1 3 )。 (專利文獻1 )曰本專利特開2 0 0 1 — 2 5 2 8 6 8號公報 【發明内容】 5 312XP/發明說明書(補件)/94-02/93131936 200528231 (發明所欲解決之問題） 雖然於如前述習知研磨方法中設法俾可高精度管 研磨材料的厚度，不過，尚不能說被研磨材料的厚 充分。特別是由於球芯搖動型研磨裝置或奥斯卡型 置難以藉由其搖動動作的影響來提高被研磨材料厚 測精度，故有每一裝置均須按照實測資料等來微調 間等，要求工匠有技術上調整能力的問題。 因此，本發明係解決上述問題者，其技術課題在 不需要高度熟練作業，可高精度管理被研磨材料的 厚度判定技術。 (解決問題之手段） 本申請案發明人有鑑於上述實際情形，反覆精心 實驗，結果發現，於研磨裝置中，在研磨加工時發 作用伴生的微振，此微振妨礙厚度檢測值的檢測精 高。此微振隨著挾持被研磨材料相向並相對旋轉或 第1研磨構件與第2研磨構件的相對移動發生，由 送至進行被研磨材料厚度的測定的裝置構造部分， 藉由檢測裝置構造部分的移動獲得的被研磨材料厚 值振盪。此振盪並非奥斯卡型研磨裝置等的驅動裝 成的上下移動，而是起因於磨粒與被研磨材料間的 用的上述微振所造成者。由於此厚度檢測值的振盪 稱為搖動振幅、搖動週期、旋轉速度等的第1研磨 第2研磨構件的相對移動態樣，亦對被研磨材料的 曲率或裝置構造的共振特性等影響，故不僅每一裝 312XP/發明說明書(補件)/94-02/9313 ] 936 理被 度精度 研磨裝 度的檢 研磨時 於提供 厚度的 檢討及 生研磨 度的提 榣動的 於其傳 故造成 度檢測 置所造 研磨作 不僅對 構件與 研磨面 置不 200528231 同，亦因研磨條件或被研磨材料的形狀等而異。由於厚度 檢測值的振盪態樣如此依狀況而各式各樣，又，研磨條件、 被研磨材料的形狀、裝置構造等的複雜主因重疊發生，故 習知方法極難使被研磨材料的厚度檢測值的檢測精度較檢 測值的上述振盪的振幅小。 因此，本申請案發明人為減低上述微振所造成厚度檢測 值的振盪伴生的檢測誤差，於被研磨材料厚度因研磨作用 而遞減過程中，測定獲得設定值以下厚度檢測值的繼續時 間，在此繼纟買時間超過既定設定時間時，判定獲得對應上 述設定值的被研磨材料厚度。特別是由於藉由使上述設定 時間在上述微振伴生的厚度檢測值的振盪週期以下，可抑 制時間經過所引起被研磨材料厚度的誤差，故可實現極高 精度的厚度管理。具體而言，相較於如習知在厚度檢測值 達到設定值時研磨動作結束的方法，可將被研磨材料厚度 的誤差減低約1 / 3或在此以下。 亦即，本發明研磨裝置係具有第1研磨構件、隔著被研 磨材料而與上述第1研磨構件相對的第2研磨構件以及使 上述第1研磨構件及上述第2研磨構件相對旋轉或搖動的 驅動手段，用以研磨上述被研磨材料者，其特徵在於具有： 檢測手段，其測定隨著上述被研磨材料的厚度變化而變化 的裝置構造部分的位置，可檢出是否獲得與上述被研磨材 料的厚度設定值以下之厚度相對應的厚度檢測值；以及計 時手段，其求出對應上述設定值以下之厚度的上述厚度檢 測值可繼續獲得的繼續時間；且構成在上述繼續時間超過 7 312XP/發明說明書(補件)/94-02/93131936 200528231 既定的設定時間情況下，停止研磨動作。 於此，上述檢測手段不限於測定上述厚度檢測值本身 手段，可為能檢測結果厚度檢測值是否對應設定值以下 厚度的手段。可為能知悉厚度檢測值處於超過設定值的 態及在設定值以下狀態的任一狀態的手段。列舉之，例 有配置成於厚度檢測值在設定值以下時接點切換的開關 等。 特別是以上述設定時間為上述厚度檢測值的振盪週期 以下的時間較佳。雖然即使在設定時間設定為超過振盪 期的時間情況下，仍可將被研磨材料的厚度誤差抑制在 度檢測值的振盪的振幅以下，不過，由於本發明目的在 減低厚度檢測值的振盪的影響以減低厚度誤差，故即使 定時間超過振盪週期，仍未獲得任何附加效果。又，由 加長自變成在設定值以下的時刻起的時間，故起因於研 速度的誤差的研磨加工後被研磨材料的厚度誤差反而擴 的可能性高。進一步由於被研磨材料的厚度與設定值間 差變大，須注意被研磨材料與設定值的對應關係，故亦 管理變得煩複的情況發生。 於本發明中，上述驅動手段以具有使上述第1研磨構 搖動的搖動驅動手段以及使上述第2研磨構件繞其軸線 轉的旋轉驅動手段較佳。雖然一研磨構件進行搖動動作 研磨裝置不限於厚度檢測值的振盪週期與其搖動動作同 ，不過，由於厚度檢測值因搖動動作而振盪更大，故極 提高厚度檢測值的檢測精度。然而，由於本發明可觀察 312XP/發明說明書(補件)/94-02/93 ] 3 ] 936 的 的 狀 如 週 厚 於 設 於 磨 大 的 有 件 旋 的 步 難 厚 8 200528231 度檢測值在設定值以下的繼續時間是否超過既定預定時間 ，抑制檢測誤差，使其小於厚度檢測值的振幅，故可高精 度管理被研磨材料的厚度。 於本發明中，以具有固定於上述第1研磨構件的第1研 磨軸，上述搖動驅動手段配置成使上述第1研磨軸繞既定 搖動中心轉動較佳。於如此構成情況下（於係球芯搖動型 研磨裝置情況下），藉由測定第1研磨軸與搖動中心間的相 對位置關係，可照舊直接獲得上述厚度檢測值，或檢測厚 度檢測值是否在設定值以下。 於本發明中，以具有成任意角度連結於上述第1研磨構 件的第1研磨軸，且構成藉由該第1研磨軸的搖動動作， 使上述第1研磨構件於沿上述被研磨材料或上述第2研磨 構件的曲面上滑動，上述檢測手段構成藉由測定伴隨上述 第1研磨構件於上述曲面上的滑動而朝研磨方向往復動作 的死點位置，檢測是否獲得對應上述設定值以下之厚度的 上述厚度檢測值較佳。由於在具有成任意角度連結於上述 第1研磨構件的第1研磨軸，配置成藉由此搖動動作，使 第1研磨構件於沿被研磨材料或第2研磨構件的曲面上滑 動情況下（於係奥斯卡型研磨裝置情況下），隨著第1研磨 構件的滑動，第1研磨軸沿研磨方向往復動作，故無法僅 藉由測定第1研磨軸的位置來檢測厚度檢測值是否在設定 值以下。於此情況下，亦可藉由按照繼續時間是否超過設 定時間來控制研磨動作，以在厚度檢測值的振盪的振幅以 下的精度管理被研磨材料的厚度。 9 312XP/發明說明書(補件)/94-02/93131936 200528231 其次，本發明被研磨材料厚 研磨裝置中的被研磨材料厚度 第1研磨構件、隔著被研磨材 對的第2研磨構件以及使上述 磨構件相對旋轉或搖動的驅動 材料者，其特徵在於包含有以 磨材料的厚度變化而變化的裝 否獲得與上述被研磨材料的厚 的厚度檢測值；求出對應上述 度檢測值可繼續獲得的繼續時 是否超過既定預定·時間。特別 厚度檢測值的振盪週期以下較 於本發明中，上述設定時間 半以下較佳。然而，於設定時 下，接受干擾等造成的撞擊或 研磨速度在振盪週期中所發生 小情況下，設定時間為厚度檢 % )在減低被研磨材料的厚度 由於在振盪週期内發生的研磨 忽視，故設定時間以成為振盪 ，例如以在1 0〜6 5 %的範圍内 範圍。 【實施方式】 以下一併說明本發明實施形 312XP/發明說明書(補件)/94-02/9313193 6 度之判定方法其係用以判定 之方法，該研磨裝置係具有 料而與上述第1研磨構件相 第1研磨構件及上述第2研 手段，用以研磨上述被研磨 下步驟：測定隨著上述被研 置構造部分的位置，檢出是 度設定值以下之厚度相對應 設定值以下之厚度的上述厚 間；以及判定上述繼續時間 是，上述設定時間以在上述 佳。 以設定在上述振盪週期的一 間不滿振盪週期的5 %情況 電子雜訊的可能性變大。於 研磨量相對於振盪振幅十分 測值的振盪週期約一半（5 0 與設定值的差方面較佳。又 量大多相對於振盪振幅無法 週期約一半或在此以下較佳 較佳，尤佳者為2 5〜4 5 %的 態及圖示例。圖1係範示本 10 200528231 實施形態的研磨裝置1 0 0的主要部分構造的概略構造圖 。圖示例的研磨裝置1 0 0係所謂上軸球芯搖動型研磨裝置。 然而，亦可構成此研磨裝置1 0 0的上軸部與下軸部相反的 功能及構造。此研磨裝置1 0 0配置成上軸部1 1 0繞搖動中 心F 〇轉動，下軸部1 2 0繞軸線旋轉。 於上軸部1 1 0，第1研磨構件（研磨皿）1 1 1固定於第1 研磨軸（搖動構件）1 1 2，此第1研磨軸1 1 2能移動地相對 於支持構件1 1 3沿軸線方向軸支承。支持構件1 1 3配置成 藉未圖示之搖動驅動機構繞搖動中心F 〇轉動。由壓緊開關 等構成的檢測器1 1 4支持固定於支持構件1 1 3。又，於支 持構件1 1 3設置刻度擋止部1 1 5。 第1研磨軸11 2延伸至支持構件1 1 3的上方，連接於固 定構件11 6。由微型儀錶構成的調整構件1 1 7安裝於此固 定構件1 1 6。並且，藉由此調整構件1 1 7的前端1 1 7 a抵接 上述檢測器1 1 4的前端1 1 4 a，切換檢測器1 1 4的輸出。檢 測器1 1 4的前端11 4 a配置成在藉未顯示的彈性構件朝突出 方向推迫狀態下，能沿軸線方向伸縮既定衝程S1，若前端 1 1 4 a抵接調整構件1 1 7的前端1 1 7 a，前端1 1 4 a即被壓縮 而切換上述檢測信號。作為上述衝程S 1，確保容許自如後 述達到設定值且前端1 1 7 a抵接前端1 1 4 a起迄研磨結束為 止期間内研磨量的移動的足夠且充分的衝程。又，限制構 件1 1 8安裝於固定構件1 1 6。藉由此限制構件1 1 8抵接上 述刻度擋止部1 1 5，限制第1研磨軸1 1 2的移動範圍。限 制構件11 8由螺栓等構成，配置成可調整其前端的研磨方 11 312XP/發明說明書(補件)/94-02/9313 ] 936 200528231 向 述 調 研 成 11 可 固 構 端 12 轉 線 及 磨 11 配 第 研 磨 的位置。 且’雖然上述調整構件117固定於第1研磨轴112，上 檢測器114固定於支持構件113,不過，亦可相反地， 整構件⑴固定於支持構件113,檢測器}"固定於第1 :軸112。又，亦可於調整構件117設有檢測功能，構 單純抵接部來替代檢測器1 1 4。 另-方面’雖然上述刻度擋止部i】5固定於支持構件 3,上述限制構件118固定於第丨研磨轴112，不過，亦 刻度擋止部115固定於第1研磨軸112，限制構件m 定於支持構件113。且此限制構件118及刻度擋止部in 成限制手段。設置此限制手段，χ免破壞檢測器的前 1 1 4a ° 另一方面，於下軸部丨20設置第2研磨構件（研磨皿） 1，以及連接固定於此第2研磨構件i 21的第2研磨軸（旋 轴）122。第2研磨軸122藉未顯示之旋轉驅動機構繞軸 旋轉驅動。 於第1研磨構件Π1與第2研磨構件121之間配置透鏡 其他光學兀件等被研磨材料i 〇 1。雖然於圖示例中被研 材料1 0 1藉螺距等適當固定手段固定於第1研磨構件 1，不過，可固定於第2研磨構件12卜第！研磨構件ηι 置成，若上述第1研磨軸1 1 2繞搖動中心F〇轉動，即於 2研磨構件1 21的表面（在被研磨材料丨固定於第j 磨構件Π 1情況下）或被研磨材料！ 〇丨的表面（在被研 材料1 01固定於第2研磨構件} 2丨情況下）上滑動。無 312XP/發明說明書(補件)/94-02/93131936 12 200528231 論如何，第1研磨軸1 1 2均配置成於曲面上滑動。 於上述研磨裝置1 0 0中，在將含有磨粒的漿液供至被研 磨材料1 0 1與第2研磨構件1 2 1 (在被研磨材料1 0 1固定 於第1研磨構件1 1 1情況下）或第1研磨構件1 1 1 (在被 研磨材料1 0 1固定於第2研磨構件1 2 1情況下）之間狀態 下，藉由一面繞搖動中心F 〇搖動第1研磨構件1 1 1，一面 繞第2研磨軸1 2 2的軸線旋轉第2研磨構件1 21，進行研 磨加工。 圖2至圖5係顯示使用上述研磨裝置1 0 0研磨被研磨材 料1 0 1時的被研磨材料1 0 1的厚度檢測值圖表。且，各圖 表的資料所示微細上下移動係檢測器的雜訊或繪圖手段的 振盪伴生的移動，其於以下討論中忽視。由於上述研磨裝 置1 0 0無法檢測此厚度檢測值，故另外安裝藉檢測感測器 等檢測上述研磨裝置1 0 0的第1研磨軸1 1 2或固定於其上 的構件與下軸部1 2 0、支持構件1 1 3或固定於其上的構件 間研磨方向（圖示上下方向）的相對移動的檢測系統來測 定。於此，圖2係自第1研磨軸1 1 2對第1研磨構件所施 壓力為0 . 3 Μ P a時的圖表，圖3係同情形0 . 4 Μ P a，圖4係 同情形0.5MPa，圖5係同情形0.6MPa的圖表。又，於各 圊的資料中，第1研磨軸1 1 2的搖動週期為2. 4秒，第2 研磨軸122的旋轉速度為2000rpm。然而，一般適合設定 搖動週期為1〜6秒，旋轉速度為1 0 0 0〜3 0 0 0 r p m的範圍。 如圖2至圖5所示，被研磨材料1 0 1的厚度檢測值雖然 隨著時間經過，概略上大致直線降低，不過，實際上係微 13 312XP/發明說明書(補件)/94-02/93131936 200528231 振重疊。圖6係放大顯示各圖的厚度檢測值的資料的圖 表。如圖6所示，此厚度檢測值d的振盪的振幅（全振幅） A在圖示例情況下為1 0〜1 5 // m，振盈週期為0 . 9〜1 . 2秒 。由於此振盪的振幅A或週期T受到研磨裝置的構造、尺 寸、構成元件等影響，亦受研磨材料或被研磨材料的形狀 影響，故無法簡單求出。 雖然上述厚度檢測值d的振盪在相對於研磨加工後的被 研磨材料的厚度誤差遠小於振盪的振幅A情況下尚無問 題，不過，精度要求增高會發生容許誤差接近上述振幅A 的問題，造成研磨加工後的被研磨材料的厚度誤差，並且， 在容許誤差小於上述振幅A情況下，須進行移動平均、最 小平方法等各種運算處理及其他雜訊除去處理，無法應付。 此種雜訊除去處理需要高價的檢測器或運算處理手段，導 致研磨裝置的價格高昂化。 本實施形態配置成可藉由調整上述調整構件1 1 7，適當 設定對應被研磨材料1 0 1的厚度目標值的設定值d 〇。例如 設定成於研磨開始前，在安裝被研磨材料1 0 1狀態下，使 調整構件1 1 7的前端1 1 7 a抵接檢測器1 1 4的前端1 1 4 a， 確認檢測器1 1 4的檢測信號切換（例如反轉），以此切換位 置為基準，僅在必要研磨量内，調整構件1 1 7的前端1 1 7 a 脫離檢測器1 1 4。藉此，僅在上述必要研磨量内減少被研 磨材料1 0 1的厚度，設定成在被研磨材料1 0 1的厚度達到 設定值d 〇的時刻，調整構件1 1 7的前端1 1 7 a抵接檢測器 1 1 4的前端1 1 4 a，切換檢測器1 1 4的檢測信號。 14 312XP/發明說明書(補件)/94-02/93131936 200528231 若在如上述進行設定值do的設定狀態下開始研磨，被 研磨材料1 01的厚度即如圖1至圖5所示，徐徐減少，若 不久，如圖6所示，被研磨材料1 01的厚度檢測值d達到 設定值d 〇，調整構件1 1 7的前端1 1 7 a即抵接檢測器1 1 4 的前端1 1 4 a，切換檢測器1 1 4的檢測信號。然而，此檢測 信號的切換狀態會因厚度檢測值d的振盪而在最初短時間 内結束，檢測信號回復切換前的狀態。本實施形態測定該 檢測信號處於切換狀態時的繼續時間△ t。此繼續時間△ t 的測定於檢測器1 1 4的檢測信號切換時開始，藉由使用檢 測信號回復時停止並重設的計數器電路等，可簡單進行。 本實施形態預先設定設定時間to，與上述繼續時間△ t 比較。繼續時間△ t在設定時間to以下即繼續照舊研磨， 若繼續時間△ t超過設定時間t 〇，研磨裝置1 0 0即停止。 由於實際上難以瞬間停止研磨裝置1 0 0的動作部分，故藉 由切斷搖動驅動機構或旋轉驅動機構的驅動力，或在切斷 驅動力之後制動，或在驅動停止之前解除或減低加壓力等 種種方法來結束研磨動作。上述繼續時間△ t及設定時間 t 〇的判定可藉周知的比較電路等來簡單進行。 於此，上述設定時間t 〇以在圖6所示厚度檢測值d的 振盪週期T以下較佳。由於在繼續時間△ t超過振盪週期T 情形下設定值d 〇與被研磨材料1 0 1的厚度差意味著其在厚 度檢測值的振盪振幅A的一半以上，又由於既是如此，指 的便不是待機，隨著時間經過，被研磨材料1 0 1的厚度只 會變得較設定值d 〇小，故被研磨材料1 0 1的厚度相對於設 15 312XP/發明說明書(補件)/94-02/93131936 200528231 定值d 〇的差擴大，有此差的誤差擴大的可能性。 作為一例子，如圖6所示，例如，厚度檢測值d最 到設定值d 〇時的繼續時間△ t為0 . 3 5 T，其次，達到 值d 〇時的繼續時間△ t為0 . 6 5 T，再其次於達到後， 過設定值d 〇。於此情況下，將設定時間t 〇設定為0. 若於第2次達到設定值do時研磨結束，研磨結束時的 磨材料1 0 1的厚度即成為圖示P點的值。 一般於振盪週期T中研磨的研磨量十分小情況下， 時間△ t為0 . 5 T時被研磨材料1 0 1的厚度大致與設定 一致。然而，由於根據相對於設定值do的上述振盪ί 位，繼續時間△ t不限於與0. 5 Τ —致，故以適當設定 時間t 〇，俾於繼續時間△ t儘可能接近0 . 5 T的時刻進 定較佳。又由於實際上無法忽視於振盪週期T中研磨 磨量，故隨著時間經過，被研磨材料的厚度逐漸較設 do小。因此，若考慮此因素，即以將設定時間to設 0 . 5 T附近以及較此略小的時間較佳。然而，在週期Ί %以下容易受干擾或雜訊影響。因此，例如以0. 1 0〜C 較佳，尤佳者為0 . 2 5〜0 . 5 T。 圖7係顯示於使用本實施形態時被研磨材料1 0 1研 工後的厚度測定結果的圖表，實施例1係在設定時間 0 . 4 T時，實施例2係在設定時間t 〇 = 0 . 5 T時的資料 分別顯示連續5 0次研磨時5 0個被研磨材料的厚度。 之一刻度為1 0 // m。另一方面，圖8係藉由如習知在 達到設定值do時結束研磨的方法進行研磨，比較例1 312XP/發明說明書(補件)/94-02/93131936 初達 設定 不超 5T， 被研 繼續 值d 〇 治相 設定 行判 的研 定值 定於 、的5 I. 65T 磨加 t 〇 = ，其 縱軸 最初 至4 16 200528231 在不同條件下分別各連續進行研磨5 0次的結果。縱軸之一 刻度為1 0 // m。 相對於如上述，於習知方法中，研磨加工後的被研磨材 料厚度誤差在3 0〜5 0 // m以下，使用本實施形態時的被研 磨材料厚度誤差在2 0 // m以下，藉由設定時間最適化，可 在1 0 // m以下。一般說來，上述設定時間t 〇小於0 . 5 丁 在減低研磨加工後的被研磨材料厚度誤差幅度方面較佳。 又，亦可異於上述實施形態，判定繼續時間△ t的累計 值是否超過設定時間to。亦即，於上述圖6所示例子中 ’雖因最初繼、纟買時間△ t = 0 . 3 5 T而未超過設定時間t 〇 = 0 . 5 T，不過，若自接著在設定值d 〇以下的時刻經過0 . 1 5 T， 繼續時間△ t的累計值即超過設定時間to。因此，於第2 次繼續時間△ t = 0 . 6 5 T的最初經過0 . 1 5 T後，研磨結束。 如此，即不會對最初達到設定值do時的振盪相位產生大的 影響，可經常獲得接近設定值d 〇的被研磨材料1 0 1的厚度。 圖9係範示另一研磨裝置2 0 0的主要部分構造的概略構 造圖。此研磨裝置2 0 0雖然配置成上軸部2 1 0搖動，下軸 部2 2 0旋轉，不過，卻是所謂的奥斯卡型研磨裝置，配置 成上軸部2 1 0的第1研磨構件（研磨皿）2 1 1與第1研磨 軸（搖動構件）2 1 2成任意角度連結，藉由第1研磨軸2 1 2 搖動，第1研磨構件2 1 1於被研磨材料2 0 1或第2研磨構 件221的表面（曲面）上滑動。另一方面，第2研磨構件 2 2 1藉由第2研磨軸2 2 2為未圖示之旋轉驅動機構繞軸線 所旋轉驅動而旋轉。 17 312XP/發明說明書(補件)/94-02/9313193 6 200528231 第1研磨軸2 1 2連接於搖動臂2 1 3，此搖動臂2 1 3能轉 動連結於進行搖動運動（圖示左右方向的往復運動）的 驅動構件2 1 4。又，搖動臂2 1 3配置成承受汽缸等構成的 加壓機構2 1 5朝研磨方向（圖示下方）所施加壓力。延長 臂2 1 6連接固定於搖動臂2 1 3，調整構件2 1 7安裝於此延 長臂2 1 6。此調整構件2 1 7配置成可沿移動方向改變其前 端位置，並輸出檢測信號，於其前端抵接後述抵接部2 1 9 時切換信號。 又，支持臂2 1 8連接固定於驅動構件2 1 4，抵接部2 1 9 安裝於此支持臂2 1 8。且雖然於實施例中，調整構件2 1 7 固定於搖動臂2 1 3，抵接部2 1 9固定於驅動構件2 1 4，不過 ，可將抵接部2 1 9固定於搖動臂2 1 3，並將調整構件2 1 7 固定於驅動構件2 1 4。可進一步於本實施形態中設置與研 磨裝置1 0 0相同的調整構件及檢測器。相反地，可使用此 研磨裝置2 0 0的上述調整構件及檢測器於研磨裝置1 0 0。 抵接部2 1 9相對於支持臂2 1 8，能滑動地沿抵接調整構 件2 1 7的方向安裝，平常推壓調整構件2 1 7側，於調整構 件2 1 7不抵接抵接部2 1 9狀態下，保持於碰抵調整構件2 1 7 側的限制位置的狀態。且此種滑動構造可不設於抵接部 2 1 9而設於調整構件2 1 7。確保此滑動構造的衝程量S 2 大於後述第1研磨軸2 1 2的上下動作（往復動作）的振幅。 研磨裝置2 0 0如同研磨裝置1 0 0的情形，在研磨開始前 藉調整構件2 1 7適當進行設定值的設定。又，藉由一面旋 轉第2研磨軸2 2 2，一面利用往復動作驅動構件2 1 4來搖 18 312XP/發明說明書(補件)/94-02/93131936 200528231 動第1研磨軸2 1 2，並藉由第1研磨構件2 1 1於旋轉的被 研磨材料2 0 1或第2研磨構件2 2 1的表面上滑動，進行被 研磨材料2 0 1的研磨。 由於在被研磨材料2 0 1的被研磨面為曲面時，此研磨裝 置2 0 0的第1研磨軸21 2若搖動，第1研磨軸21 2即與搖 動臂2 1 3 —起上下往復動作，故調整構件2 1 7亦再度如圖 1 0所示上下往復移動。因此，於此研磨裝置2 0 0中，被研 磨材料2 0 1的厚度檢測值d不對應調整構件2 1 7的前端位 置。被研磨材料2 0 1的厚度檢測值d係自圖1 0所示調整構 件2 1 7的前端位置等的裝置構造部分的移動曲線減去其搖 動動作伴生的往復動作成分者。亦即，厚度檢測值d對應 上述移動曲線的死點位置（上死點或下死點）的包跡線 d 1或d 2。因此，研磨裝置2 0 0藉由檢測上述移動曲線的死 點位置，判定上述厚度檢測值d是否在設定值do以下。 於圖1 0 —併記載放大上述移動曲線的一部分（三處） 的放大圖。如此放大圖所示，上述微振造成的振盪重疊於 上述移動曲線。因此，自移動曲線減去搖動動作伴生的往 復動作成分的厚度檢測值d亦再度如同圖2至圖5，振盪 重疊。於此，圖1 0中所示一點鏈線d 1係連結上死點間的 包跡線，一點鏈線d2係連結下死點間的包跡線，虛線dO 係顯示設定值的直線（水平線）。 於研磨裝置2 0 0中，繼續時間△ t於死點位置測定。圖 示例對裝置構造部分的移動曲線的下死點位置測定繼續時 間△ t。於此情況下，設定值d 〇的設定作業如圖9所示， 19 312XP/發明說明書(補件)/94-02/93131936 200528231 在配置第1研磨構件2 1 1於下死點的狀態下進行。並且， 如圖1 0的放大圖所示，判定移動曲線下死點在設定值d 〇 以下時的繼續時間△ t是否超過設定時間t 〇這一點與研磨 裝置1 0 0相同。於此情況下，雖然與設定值d 〇間的關係不 僅因振盪相位，亦因移動曲線的下死點的相位而不同，檢 測狀況實質上卻無異於研磨裝置1 0 0的情形。 於圖1 0所示例子中，在以移動曲線為基準，設定值d 〇 較低時，例如最初的繼續時間△ t為0 . 2 5 T，其次為0 · 3 5 T ，於設定值d 〇略大時，例如最初的繼續時間△ t為0 . 4 4 T， 其次為0 . 6 3 T。由於如此，在研磨裝置2 0 0情況下，繼續 時間△ t的變動幅度較研磨裝置1 0 0小，又如果超過該下 死點，此後的繼續時間△ t於次一下死點前不會出現，故 設定時間t 〇以較研磨裝置1 0 0的情形小較佳。 於此研磨裝置2 0 0中應注意要點係上述繼續時間△ t的 測定或繼續時間△ t與設定時間to的比較判定不對移動曲 線的往復動作（上下動作）進行，而是始終對重疊於移動 曲線的振盪進行這一點。亦即，被研磨材料的厚度檢測值 d係自移動曲線減去搖動動作伴生的往復動作成分者，其 原因在於須對此厚度檢測值d進行繼續時間△ t的測定或 繼續時間△ t與設定時間to的比較判定。 且，亦可異於上述，對裝置構造部分的上死點位置測定 繼續時間△ t。於此情況下，設定值do的設定作業如圖9 以實線所示，在配置第1研磨構件2 1 1於上死點的狀態下 進行。又，於此情況下，為檢出被研磨材料2 0 1的厚度在 20 312XP/發明說明書(補件)/94-02/93131936 200528231 設定值do以下，須與上述相反，檢出在上死點，調整構件 2 1 7前端並未離開檢測器2 1 9前端。因此，雖然如同研磨 裝置1 0 0檢測繼續時間△ t，卻使用忽視與上述移動曲線同 步發生的長的繼續時間△ t，亦即存在於相鄰上死點間的繼 續時間△ t，僅用上死點附近的短繼續時間△ t的方法，或 與研磨裝置1 0 0相反，測定調整構件2 1 7前端未抵接檢測 器2 1 9前端的逆繼續時間，以自預定基準時間減去逆繼續 時間的時間作為繼續時間△ t的方法等。例如於後者情況 下，若設定時間to不滿振盪週期T，即以上述基準週期作 為振盪週期T。雖然如此的話，最初繼續時間△ t即為負， 若逆繼續時間在振盪週期T以下，繼續時間△ t即為正， 於其超過設定時間t 〇時進行判定或研磨結束動作。 且，本發明研磨裝置及被研磨材料厚度之判定方法不限 於上述圖示例，當然，在不悖離本發明要旨的範圍内可作 種種變更。例如，於上述各實施形態中，雖然藉由檢出第 1研磨軸的位置，檢出被研磨材料的厚度在設定值以下， 不過，成為位置檢測對象的裝置構造部分不限於上述第1 研磨轴，只要是根據被研磨材料的厚度變化而變化的部位， 任何位置均無妨。具體而言，若是下軸球芯搖動型研磨裝 置即可固定搖動動作的下軸部的球芯位置，檢出上軸部的 位置。 【圖式簡單說明】 圖1係顯示研磨裝置1 0 0的主要部分構造的概略構造 圖。 21 312XP/發明說明書(補件)/94-02/93131936 200528231 圖2係顯示使用研磨裝置1 0 0研磨的被研磨材料厚度檢 測值的圖表。 圖3係顯示使用研磨裝置1 0 0研磨的被研磨材料厚度檢 測值的圖表。 圖4係顯示使用研磨裝置1 0 0研磨的被研磨材料厚度檢 測值的圖表。 圖5係顯示使用研磨裝置1 0 0研磨的被研磨材料厚度檢 測值的圖表。 圖6係厚度檢測值的圖表的放大圖，且係顯示判定方法 的圖表。 圖7係顯示藉實施例1及2研磨的被研磨材料的厚度誤 差的圖表。 圖8係顯示藉比較例1〜4研磨的被研磨材料的厚度誤 差的圖表。 圖9係顯示研磨裝置2 0 0的主要部分構造的概略構造 圖〇 圖1 0係顯示裝置構造部分的移動曲線的圖表及放大顯 示移動曲線的一部分的放大圖。 【主要元件符號說明】 100 > 200 研磨裝置 1 1 0、2 1 0 上軸部 1 11、2 1 1 第1研磨構件 1 1 2、2 1 2 第1研磨軸 1 2 0、2 2 0 下軸部 22 312ΧΡ/發明說明書(補件)/94-02/93131936 200528231200528231 IX. Description of the invention: [Technical field to which the invention belongs] The present invention relates to a method for determining the thickness of a polishing device and a material to be polished, and particularly to a thickness of a material to be polished that is suitable as a device and method for polishing optical components such as lenses. Judgment technology. [Prior art] Generally, when polishing optical elements such as lenses, the first polishing dish and the second polishing J2I are relatively rotated and shaken by fixing the material to be polished on either of the upper polishing dish and the lower polishing dish to perform polishing. . This type of grinding method is known as a ball-shake type grinding device that rotates one (upper or lower) grinding shaft around a predetermined shaking center while rotating the other grinding shaft, and a grinding shaft and a grinding dish. Oscar-type grinding device that is connected at an arbitrary angle while shaking this grinding shaft and rotating the other grinding shaft. The above-mentioned various polishing devices manage the thickness of the material to be polished and detect the position of a predetermined device structure portion that moves as the thickness of the material to be polished changes. Normally, the thickness of the material to be polished is made close to the target by ending the grinding operation when the structure portion of the device reaches a predetermined position (for example, refer to Patent Document 1 below). In this case, there are cases where the position of the structure of a predetermined device is continuously measured, the amount of grinding per shake is measured, the grinding time and the number of times of grinding are set (refer to Figures 1 and 3 of Patent Document 1), and whether or not the grinding has been reached is detected. A case of a target value of a material thickness (refer to FIG. 12 and FIG. 13 of Patent Document 1). (Patent Document 1) Japanese Patent Laid-Open No. 2 0 1-2 5 2 8 6 8 [Contents of the Invention] 5 312XP / Invention Specification (Supplement) / 94-02 / 93131936 200528231 (Problems to be Solved by the Invention) Although the thickness of the material to be ground with high accuracy is managed in the conventional grinding method as described above, it cannot be said that the thickness of the material to be ground is sufficient. In particular, it is difficult to improve the thickness measurement accuracy of the material being polished by the impact of the rocking-type grinding device or Oscar-type device. Therefore, each device must be fine-tuned according to the measured data. On the ability to adjust. Therefore, the present invention solves the above-mentioned problems, and its technical problem is a technique for determining the thickness of a material to be polished with high accuracy without requiring highly skilled work. (Means for Solving the Problem) In view of the above-mentioned actual situation, the inventor of the present application has conducted meticulous experiments repeatedly and found that in the polishing device, a micro-vibration associated with the micro-vibration occurs during the grinding process, and this micro-vibration hinders the detection precision of the thickness detection value. high. This micro-vibration occurs when the material to be polished is held oppositely and relatively rotates or the relative movement of the first polishing member and the second polishing member occurs. The microvibration is sent to the device structure part for measuring the thickness of the material to be ground, The thickness of the ground material obtained by the movement oscillates. This oscillation is not caused by the up-and-down movement of a driving device such as an Oscar-type polishing device, but is caused by the aforementioned micro-vibration used between the abrasive particles and the material to be polished. The oscillation of the thickness detection value is called the relative movement state of the first grinding second grinding member such as the shaking amplitude, shaking period, and rotation speed. It also affects the curvature of the material to be ground or the resonance characteristics of the device structure. 312XP / Invention Manual (Supplement) / 94-02 / 9313 for each package] 936 Provides a review of the thickness and an improvement of the raw grinding degree during the inspection of the grinding accuracy of the grinding unit. The grinding operation made by the inspection device is not only the same as that of the component and the grinding surface, but also varies depending on the grinding conditions or the shape of the material to be ground. As the thickness of the oscillating state of the detection value varies according to the situation, and the complicated main causes of the grinding conditions, the shape of the material to be ground, and the device structure overlap, it is extremely difficult for the conventional method to detect the thickness of the material to be ground. The detection accuracy of the value is smaller than the amplitude of the oscillation of the detection value. Therefore, in order to reduce the detection error caused by the oscillation of the thickness detection value caused by the micro-vibration, the inventor of the present application measures the duration of obtaining the thickness detection value below the set value during the process of decreasing the thickness of the material to be ground due to the grinding effect. When the subsequent purchase time exceeds a predetermined set time, it is determined that the thickness of the material to be ground corresponding to the set value is obtained. In particular, by setting the above-mentioned time to be less than the oscillation period of the thickness detection value accompanying the micro-vibration, it is possible to suppress the thickness error of the material to be ground caused by the passage of time, so that highly accurate thickness management can be achieved. Specifically, as compared with the conventional method in which the grinding operation ends when the thickness detection value reaches the set value, the error in the thickness of the material to be ground can be reduced by about one third or less. That is, the polishing apparatus of the present invention includes a first polishing member, a second polishing member opposed to the first polishing member via a material to be polished, and a device that rotates or shakes the first polishing member and the second polishing member relatively. The driving means for grinding the material to be ground is characterized by: a detecting means for measuring the position of a device structure part which changes with the thickness of the material to be ground, and detecting whether the same as the material to be ground is obtained A thickness detection value corresponding to the thickness below the set value of the thickness; and a timing means to find a continuation time for which the thickness detection value corresponding to the thickness below the set value can be continuously obtained; and constituted when the above continuation time exceeds 7 312XP / Description of the Invention (Supplement) / 94-02 / 93131936 200528231 In the case of a predetermined set time, the grinding operation is stopped. Here, the detection means is not limited to the means for measuring the thickness detection value itself, but may be a means capable of detecting whether the thickness detection value of the detection result corresponds to a thickness below a set value. It can be a means to know whether the thickness detection value is in a state exceeding the set value or a state below the set value. Examples include switches configured to switch contacts when the thickness detection value is below a set value. In particular, it is preferable that the set time is equal to or shorter than the oscillation period of the thickness detection value. Although the thickness error of the material to be polished can be suppressed below the amplitude of the oscillation of the degree detection value even when the set time is set to exceed the oscillation period, the purpose of the present invention is to reduce the influence of the oscillation of the thickness detection value. In order to reduce the thickness error, no additional effect is obtained even if the fixed time exceeds the oscillation period. In addition, since the time from the time when it becomes less than the set value is lengthened, there is a high possibility that the thickness error of the material to be polished will increase after the grinding process due to the grinding speed error. Furthermore, since the difference between the thickness of the material to be grounded and the set value becomes large, it is necessary to pay attention to the correspondence between the material to be ground and the set value, so that management becomes troublesome. In the present invention, the driving means is preferably a swing driving means for swinging the first polishing structure and a rotary driving means for rotating the second polishing member about its axis. Although a grinding member performs a shaking operation, the grinding device is not limited to the same oscillation period of the thickness detection value as its shaking operation, but since the thickness detection value oscillates more due to the shaking operation, the detection accuracy of the thickness detection value is extremely improved. However, since the present invention can observe 312XP / Invention Specification (Supplements) / 94-02 / 93] 3] 936 is as thick as the circumference is thicker than the step with the rotation of the part with a thickness of 8 200528231 degrees. Whether the continuation time below the set value exceeds a predetermined time, suppresses the detection error and makes it smaller than the amplitude of the thickness detection value, so the thickness of the material to be polished can be managed with high accuracy. In the present invention, it is preferable that the first grinding shaft has a first grinding shaft fixed to the first grinding member, and the swing driving means is arranged to rotate the first grinding shaft around a predetermined swing center. With such a structure (in the case of a core-shake-type grinding device), by measuring the relative positional relationship between the first grinding shaft and the shaking center, the above-mentioned thickness detection value can be directly obtained as usual, or whether the thickness detection value is within Below the set value. In the present invention, the first polishing member is connected to the first polishing member at an arbitrary angle, and the first polishing member is configured to move the first polishing member along the material to be polished or the The second grinding member slides on the curved surface, and the detection means is configured to detect whether a thickness corresponding to the set value or less is obtained by measuring a dead point position that reciprocates in the polishing direction as the first grinding member slides on the curved surface. The thickness detection value is preferable. Since the first polishing shaft having the first polishing member connected to the first polishing member at an arbitrary angle is disposed so that the first polishing member slides along the curved surface of the material to be polished or the second polishing member by the rocking action (on the In the case of an Oscar-type polishing device), as the first polishing member slides, the first polishing shaft reciprocates in the polishing direction. Therefore, it is not possible to detect whether the thickness detection value is less than a set value by only measuring the position of the first polishing shaft. . In this case, the thickness of the material to be polished can be managed with an accuracy below the amplitude of the oscillation of the thickness detection value by controlling the grinding operation according to whether the continuation time exceeds the set time. 9 312XP / Invention Specification (Supplement) / 94-02 / 93131936 200528231 Next, the first material to be polished has a thickness of the material to be ground in the device for thickening the material to be ground according to the present invention, a second grinding member with a pair of materials to be ground, and The driving member for the relative rotation or shaking of the grinding member is characterized by including whether the thickness of the grinding material is changed with the thickness of the grinding material to obtain a thickness detection value that is thicker than that of the material to be ground; the detection value corresponding to the degree may be continued Whether the obtained continuation exceeds the predetermined time. In particular, the oscillation period of the thickness detection value is preferably less than or equal to half the set time in the present invention. However, at the time of setting, when the impact or grinding speed caused by interference is small in the oscillation cycle, the setting time is the thickness inspection%) In reducing the thickness of the material to be polished, the grinding is ignored during the oscillation cycle, Therefore, the time is set to become an oscillation, for example, in a range of 10 to 65%. [Embodiment] The following is a description of the 312XP / Invention Specification (Supplement) / 94-02 / 9313193 6 degree judgment method of the present invention, which is a method for judging. The polishing member phase is the first polishing member and the second grinding means, which are used to grind the ground to be polished. The next step is to measure the position of the structured structure to be studied, and detect that the thickness is equal to or less than the degree setting value and corresponding to the setting value or less. The thickness of the thickness; and it is determined that the continuation time is that the set time is within the above range. The probability of electronic noise becomes greater at 5% of the period of less than the specified oscillation period. The grinding amount is about half of the oscillation period with the measured value of the oscillation amplitude being about half (the difference between 50 and the set value is better. Most of the amount can not be about half of the oscillation amplitude or the period is less than or better than this, especially the better This is an example of the state and diagram of 25 to 45%. Fig. 1 is a schematic diagram showing the structure of the main part of the grinding apparatus 100 of the 200528231 embodiment. The grinding apparatus 100 of the diagram example is a so-called Upper shaft ball core swing type grinding device. However, the upper shaft portion and the lower shaft portion of the grinding device 100 can also be configured to have the opposite function and structure. This grinding device 100 is configured to swing around the upper shaft portion 1 1 0 The center F 〇 rotates, and the lower shaft portion 12 rotates around the axis. At the upper shaft portion 1 10, the first grinding member (grinding dish) 1 1 1 is fixed to the first grinding shaft (swing member) 1 1 2. This first 1The grinding shaft 1 1 2 is movably supported axially with respect to the support member 1 1 3 in the axial direction. The support member 1 1 3 is configured to rotate around a swing center F by a swing drive mechanism (not shown). It is composed of a pressure switch and the like The detector 1 1 4 supports fixed to the supporting member 1 1 3. Moreover, the supporting structure 1 1 3 is provided with a scale stopper 1 1 5. The first grinding shaft 11 2 extends above the supporting member 1 1 3 and is connected to the fixing member 11 6. The adjustment member 1 1 7 composed of a micrometer is mounted on this fixing member 1 1 6. Furthermore, by adjusting the front end 1 1 7 a of the component 1 1 7 to abut the front end 1 1 4 a of the above-mentioned detector 1 1 4, the output of the detector 1 1 4 is switched. The front end 11 4 a is configured to be able to expand and contract a predetermined stroke S1 in the axial direction in a state of being pushed in a protruding direction by an elastic member not shown. If the front end 1 1 4 a abuts the front end 1 1 7 a of the adjustment member 1 1 7, The front end 1 1 a is compressed to switch the detection signal. As the stroke S 1, it is ensured that the grinding amount within the period from when the front end 1 1 7 a comes into contact with the front end 1 1 4 a until the end of the grinding is allowed as described later. Sufficient and sufficient stroke for movement. In addition, the restricting member 1 1 8 is attached to the fixed member 1 1 6. The restricting member 1 1 8 abuts the scale stopper 1 1 5 to restrict the first grinding shaft 1 1 2 The moving range of the restricting member 11 8 is composed of a bolt or the like, and is arranged to adjust the grinding side of the front end 1 1 312XP / Invention Manual (Supplements) / 94-02 / 9313] 936 200528231 The above-mentioned survey was completed. 11 The solid end 12 Turning wire and grinding 11 The position of the first grinding. And 'Although the above-mentioned adjustment member 117 is fixed to the first The grinding shaft 112 and the upper detector 114 are fixed to the support member 113. However, the entire member ⑴ may be fixed to the support member 113, and the detector} is fixed to the first shaft 112. In addition, a detection function may be provided in the adjustment member 117, and a simple contact portion may be configured instead of the detector 1 1 4. On the other hand, although the scale stopper i] 5 is fixed to the support member 3 and the restriction member 118 is fixed to the first grinding shaft 112, the scale stopper 115 is also fixed to the first grinding shaft 112 and the restriction member m定 于 Supporting member 113. In addition, the restricting member 118 and the scale stopper in constitute a restricting means. With this restriction means, χ avoids damage to the front 1 1 4a of the detector. On the other hand, a second grinding member (grinding dish) 1 is installed on the lower shaft portion 20, and the second grinding member i 21 is connected and fixed to the second grinding member i 21. 2 grinding shaft (rotary shaft) 122. The second polishing shaft 122 is rotationally driven by a rotation driving mechanism (not shown). Between the first polishing member Π1 and the second polishing member 121, a lens to be polished, such as other optical elements, is disposed. In the example shown in the figure, the material 1 0 1 being researched is fixed to the first grinding member 1 by a suitable fixing means such as a pitch, but it can be fixed to the second grinding member 12! The grinding member is set so that if the above-mentioned first grinding shaft 1 1 2 rotates around the shaking center F0, it is on the surface of the 2 grinding member 1 21 (in the case where the material to be polished is fixed to the j-th grinding member Π 1) or is Abrasive material! 〇 丨 the surface (when the material under investigation 1 01 is fixed to the second abrasive member} 2 丨) slides. None 312XP / Invention Manual (Supplement) / 94-02 / 93131936 12 200528231 Regarding how, the first grinding shafts 1 1 2 are arranged to slide on the curved surface. In the above-mentioned polishing device 100, when the slurry containing abrasive particles is supplied to the material to be polished 1 0 1 and the second polishing member 1 2 1 (when the material to be polished 1 0 1 is fixed to the first polishing member 1 1 1 Bottom) or the first polishing member 1 1 1 (when the material to be polished 1 0 1 is fixed to the second polishing member 1 2 1), the first polishing member 1 is shaken by one side around the swing center F 〇 1. The second polishing member 1 21 is rotated around one axis of the second polishing shaft 1 2 2 to perform a polishing process. 2 to 5 are graphs showing the thickness detection values of the material to be ground 101 when the material to be ground 10 is ground using the above-mentioned grinding apparatus 100. Moreover, the movement caused by the noise of the fine up-down detector or the vibration of the drawing means shown in the data of each chart is ignored in the following discussion. Since the above-mentioned grinding device 100 cannot detect the thickness detection value, a first grinding shaft 1 1 2 which detects the above-mentioned grinding device 1 0 by a detection sensor or the like, or a member fixed thereto and the lower shaft portion 1 are additionally installed. 20, the supporting member 1 1 3, or the relative movement detection system of the member fixed to the grinding direction (up and down direction shown in the figure) of the detection system for measurement. Here, FIG. 2 is a graph when the pressure applied to the first grinding member from the first grinding shaft 1 1 2 is 0.3 MPa, and FIG. 3 is the same situation as 0.4 MPa, and FIG. 4 is the same situation. 0.5MPa, Figure 5 is a graph of 0.6MPa in the same situation. Further, in the data of each frame, the shaking period of the first grinding shaft 1 12 is 2.4 seconds, and the rotation speed of the second grinding shaft 122 is 2000 rpm. However, it is generally suitable to set the shaking period to 1 to 6 seconds and the rotation speed to be in the range of 100 to 300 r p m. As shown in FIGS. 2 to 5, although the thickness detection value of the material to be ground 1 0 1 roughly decreases linearly with the passage of time, it is actually slightly 13 312XP / Invention Specification (Supplement) / 94-02 / 93131936 200528231 The vibrations overlap. Fig. 6 is a graph showing enlarged data of thickness detection values in each graph. As shown in FIG. 6, the amplitude (full amplitude) A of the oscillation of the thickness detection value d is 10 to 15 // m in the case of the example in the figure, and the vibration surplus period is 0.9 to 1.2 seconds. Since the amplitude A or period T of this oscillation is affected by the structure, size, constituent elements, etc. of the polishing device, and also by the shape of the polishing material or the material to be polished, it cannot be easily obtained. Although the oscillation of the thickness detection value d with respect to the thickness error of the material to be ground after the grinding process is far less than the amplitude A of the oscillation, there is a problem that an increase in accuracy requires an allowable error close to the amplitude A, resulting in The thickness error of the material to be ground after the grinding process, and if the allowable error is smaller than the above-mentioned amplitude A, various arithmetic processing such as moving average and least square method and other noise removal processing must be performed, which cannot cope with it. Such noise removal processing requires an expensive detector or arithmetic processing method, resulting in an expensive polishing apparatus. In the present embodiment, by adjusting the adjustment member 1 1 7 described above, a set value d 0 corresponding to a target thickness value of the material to be polished 1 0 1 is appropriately set. For example, before the grinding is started, the front end 1 1 7 of the adjustment member 1 1 7 is in contact with the front end 1 1 4 a of the detector 1 1 7 while the material to be ground 1 1 is mounted, and the detector 1 1 is confirmed. The detection signal of 4 is switched (for example, reversed), and based on the switching position, the front end 1 1 7 a of the adjustment member 1 1 7 is separated from the detector 1 1 4 only within the necessary grinding amount. Thereby, the thickness of the material to be ground 1 0 1 is reduced only within the above-mentioned necessary grinding amount, and it is set to adjust the front end 1 1 7 a of the member 1 1 7 when the thickness of the material to be ground 1 0 1 reaches the set value d 〇. The abutting end 1 1 4 a of the detector 1 1 4 switches the detection signal of the detector 1 1 4. 14 312XP / Invention Manual (Supplement) / 94-02 / 93131936 200528231 If grinding is started under the setting state of the setting value do as described above, the thickness of the material to be ground 101 is as shown in Figures 1 to 5, and it gradually decreases. If, shortly, as shown in FIG. 6, the thickness detection value d of the material to be ground 101 reaches the set value d 0, the front end 1 1 7 a of the adjustment member 1 1 7 will abut the front end 1 1 4 of the detector 1 1 4 a. The detection signal of the detector 1 1 4 is switched. However, the switching state of the detection signal is terminated in the first short time due to the oscillation of the thickness detection value d, and the detection signal returns to the state before switching. In this embodiment, the continuation time Δt when the detection signal is switched is measured. The measurement of this continuing time Δt is started when the detection signal of the detector 1 1 4 is switched, and can be easily performed by using a counter circuit that is stopped and reset when the detection signal is restored. In this embodiment, the set time to is set in advance and compared with the above-mentioned continuation time Δt. The continuous time Δt is below the set time to continue the grinding as usual. If the continue time Δt exceeds the set time t0, the grinding device 100 is stopped. Actually, it is difficult to stop the moving part of the grinding device 100 momentarily. Therefore, by cutting off the driving force of the rocking driving mechanism or the rotary driving mechanism, or braking after cutting off the driving force, or releasing or reducing the pressing force before the driving is stopped. Various methods are used to end the grinding operation. The determination of the above-mentioned continuation time Δt and the set time t 0 can be easily performed by a known comparison circuit or the like. Here, it is preferable that the set time t 0 is equal to or less than the oscillation period T of the thickness detection value d shown in FIG. 6. Since the difference between the set value d 〇 and the material to be ground 1 1 when the continuation time Δ t exceeds the oscillation period T means that it is more than half of the oscillation amplitude A of the thickness detection value, and because it is the case, it means that it is not Standby, as time passes, the thickness of the material to be ground 1 0 1 will only become smaller than the set value d 〇, so the thickness of the material to be ground 1 0 1 is 15 312XP / Invention Manual (Supplement) / 94- 02/93131936 200528231 The difference between the fixed value d 〇 is enlarged, and the error of this difference may be enlarged. As an example, as shown in FIG. 6, for example, the continuous time Δt when the thickness detection value d reaches the set value d0 is 0.35T, and the second, the continuous time Δt when the value d0 reaches 0 is 0. 6 5 T, followed by reaching the set value d0. In this case, the set time t 0 is set to 0. If the polishing is completed when the set value do is reached for the second time, the thickness of the abrasive material 1 0 1 at the end of polishing becomes the value at the point P in the figure. Generally, in the case where the amount of polishing to be polished in the oscillation period T is very small, the thickness of the material to be polished 110 when the time Δt is 0.5 T is approximately the same as the setting. However, since the continuation time Δt is not limited to 0.5 T according to the above-mentioned oscillating bit with respect to the set value do, the time t 0 is appropriately set so that the continuation time Δt is as close to 0.5 T as possible. Time is better. Since the amount of grinding and polishing in the oscillation period T cannot be ignored in practice, the thickness of the material to be ground gradually becomes smaller than the set do as time passes. Therefore, if this factor is taken into consideration, it is better to set the set time to around 0.5 T and a slightly shorter time. However, below the period Ί%, it is susceptible to interference or noise. Therefore, for example, 0.1 to 0 ~ C is preferable, and 0.2 5 to 0.5 T is particularly preferable. FIG. 7 is a graph showing the thickness measurement results of the material to be polished 1 to 1 when using this embodiment. Example 1 is at a set time of 0.4 T, and Example 2 is at a set time of t 0 = 0 The data at 5 T each show the thickness of 50 ground materials during 50 consecutive grindings. One scale is 1 0 // m. On the other hand, FIG. 8 is a method for polishing by a conventional method that ends the polishing when the set value do is reached. Comparative Example 1 312XP / Invention Specification (Supplement) / 94-02 / 93131936 The initial setting is not more than 5T. The research continued value d 〇 The ruled value of the phase setting is determined to be 5 I. 65T grinding t 〇 =, the vertical axis of which is from the beginning to 4 16 200528231 The results of continuous grinding for 50 times under different conditions. . One of the vertical axes has a scale of 1 0 // m. In contrast to the above, in the conventional method, the thickness error of the material to be ground after grinding is less than 30 to 5 0 // m, and the thickness error of the material to be ground when using this embodiment is less than 2 0 // m. By optimizing the set time, it can be less than 1 0 // m. Generally speaking, the above-mentioned set time t 0 is less than 0.5 d. It is better in reducing the thickness error thickness of the material to be ground after the grinding process. Also, different from the above embodiment, it may be determined whether or not the accumulated value of the continuous time Δt exceeds the set time to. That is, in the example shown in FIG. 6 above, 'Although the initial succession and purchase time Δt = 0.35 T has not exceeded the set time t 〇 = 0.5 T, but if it continues at the set value d When the time below 0.15 elapses, the cumulative value of the continuous time Δt exceeds the set time to. Therefore, at the second continuous time Δt = 0.65 T, after the first 0.15 T elapses, the polishing is completed. In this way, the thickness of the material to be polished close to the set value d0 can be always obtained without significantly affecting the oscillation phase when the set value do is first reached. Fig. 9 is a schematic configuration diagram illustrating the structure of a main part of another polishing apparatus 2000. Although this grinding device 2 0 is arranged such that the upper shaft portion 2 10 shakes and the lower shaft portion 2 20 rotates, it is a so-called Oscar-type grinding device, which is arranged as a first grinding member of the upper shaft portion 2 10 ( Grinding dish) 2 1 1 is connected to the first grinding shaft (rocking member) 2 1 2 at an arbitrary angle, and the first grinding shaft 2 1 2 is shaken, and the first grinding member 2 1 1 is attached to the material to be ground 2 0 1 or the first 2 The surface (curved surface) of the polishing member 221 slides. On the other hand, the second polishing member 2 2 1 is rotated by the second polishing shaft 2 2 2 which is rotationally driven around an axis by a rotation driving mechanism (not shown). 17 312XP / Invention Manual (Supplement) / 94-02 / 9313193 6 200528231 The first grinding shaft 2 1 2 is connected to the swing arm 2 1 3, and this swing arm 2 1 3 can be rotatably connected to perform a swing motion (left and right directions as shown in the figure) Reciprocating motion) of the driving member 2 1 4. In addition, the swing arm 2 1 3 is arranged to receive a pressure applied by a pressure mechanism 2 1 5 constituted by a cylinder or the like in a polishing direction (below the figure). The extension arm 2 1 6 is connected and fixed to the swing arm 2 1 3, and the adjustment member 2 1 7 is installed on the extension arm 2 1 6. The adjusting member 2 1 7 is configured to change the position of the front end in the moving direction, and outputs a detection signal, and the signal is switched when the front end abuts the abutting portion 2 1 9 described later. The support arm 2 1 8 is connected and fixed to the driving member 2 1 4, and the abutment portion 2 1 9 is mounted on the support arm 2 1 8. And in the embodiment, the adjusting member 2 1 7 is fixed to the swing arm 2 1 3 and the abutting portion 2 1 9 is fixed to the driving member 2 1 4; however, the abutting portion 2 1 9 may be fixed to the swing arm 2 1 3, and fix the adjusting member 2 1 7 to the driving member 2 1 4. In this embodiment, an adjustment member and a detector similar to those of the grinding device 100 can be further provided. Conversely, the above-mentioned adjustment member and detector of the polishing device 200 can be used in the polishing device 100. The abutting portion 2 1 9 is slidably mounted in the direction of abutting the adjusting member 2 1 7 with respect to the supporting arm 2 1 8. The side of the adjusting member 2 1 7 is usually pushed, and the adjusting member 2 1 7 does not abut against the abutment. In the state of the part 2 1 9, it is maintained in a state where it abuts against the restriction position on the side of the adjusting member 2 1 7. In addition, such a sliding structure may be provided on the adjusting member 2 1 7 instead of the abutting portion 2 1 9. It is ensured that the stroke amount S 2 of this sliding structure is larger than the amplitude of the vertical movement (reciprocating movement) of the first grinding shaft 2 1 2 described later. The grinding device 2 0 0 is the same as the grinding device 1 0 0, and the setting value is appropriately set by the adjusting member 2 1 7 before the grinding is started. In addition, while rotating the second grinding shaft 2 2 2 and using the reciprocating driving member 2 1 4 to shake 18 312XP / Invention Manual (Supplement) / 94-02 / 93131936 200528231, the first grinding shaft 2 1 2 was moved. The first abrasive member 2 1 1 is slid on the surface of the rotating material to be polished 201 or the second abrasive member 2 2 1 to polish the material to be polished 201. When the surface to be polished of the material to be polished 21 is curved, if the first grinding shaft 21 2 of the grinding device 2 0 is shaken, the first grinding shaft 21 2 and the swing arm 2 1 3 move up and down together. Therefore, the adjusting member 2 1 7 moves up and down again and again as shown in FIG. 10. Therefore, in this grinding device 2000, the thickness detection value d of the material to be ground 21 does not correspond to the front end position of the adjustment member 2 1 7. The thickness detection value d of the material to be ground 2 1 is obtained by subtracting the reciprocating motion component accompanying the rocking motion from the movement curve of the device structure portion such as the front end position of the adjustment member 2 1 7 shown in FIG. 10. That is, the thickness detection value d corresponds to the envelope trace d 1 or d 2 of the dead point position (top dead point or lower dead point) of the above-mentioned movement curve. Therefore, the polishing device 200 determines whether the thickness detection value d is equal to or less than the set value do by detecting the dead point position of the movement curve. An enlarged view of a part (three places) of the above-mentioned movement curve is shown in FIG. 10. As shown in the enlarged view, the oscillation caused by the micro-vibration is superimposed on the movement curve. Therefore, the thickness detection value d of the repetitive motion component associated with the shaking motion is subtracted from the movement curve again as in Figs. 2 to 5, and the oscillations overlap. Here, the one-dot chain line d1 shown in FIG. 10 is an envelope trace connecting the upper dead points, the one-dot chain line d2 is an envelope trace connecting the lower dead points, and the dotted line dO is a straight line (horizontal line) showing a set value ). In the polishing apparatus 2000, the continuous time Δt is measured at the dead point position. The figure illustrates the measurement of the bottom dead center position of the movement curve of the device structure. In this case, the setting operation of the set value d 〇 is shown in FIG. 19. 19 312XP / Invention Manual (Supplement) / 94-02 / 93131936 200528231 In a state where the first grinding member 2 1 1 is disposed at the bottom dead center get on. In addition, as shown in the enlarged view of FIG. 10, it is the same as that of the polishing apparatus 100 whether the continuing time Δt when the dead point under the movement curve is equal to or less than the set value d0 exceeds the set time t0. In this case, although the relationship with the set value d0 differs not only due to the oscillating phase but also the phase of the bottom dead point of the moving curve, the detection condition is substantially the same as that of the polishing device 100. In the example shown in FIG. 10, when the set value d is low based on the movement curve, for example, the initial continuation time Δt is 0.25 T, followed by 0 · 3 5 T at the set value d. When 〇 is slightly larger, for example, the initial continuation time Δt is 0.44 T, and then 0.63 T. Because of this, in the case of the grinding device 2000, the fluctuation time of the continuous time Δt is smaller than that of the grinding device 100, and if it exceeds the bottom dead point, the subsequent time Δt will not appear before the next dead point. Therefore, the time t 0 is set to be smaller than the case of the grinding device 100. In this grinding device 2000, the main points to be noted are the measurement of the above-mentioned continuation time Δt or the comparison of the continuation time Δt and the set time to determine that the reciprocating action (up-and-down action) of the moving curve is not performed, but always overlaps the movement The oscillation of the curve carries this out. That is, the thickness detection value d of the material to be grounded is obtained by subtracting the reciprocating motion component associated with the rocking motion from the movement curve, because the thickness detection value d must be measured for the duration Δt or the duration Δt and the setting. Comparison judgment of time to. In addition, it is also possible to measure the continuation time Δt for the top dead center position of the device structure portion different from the above. In this case, the setting operation of the set value do is performed in a state where the first polishing member 2 1 1 is disposed at the top dead center as shown by a solid line in FIG. 9. In addition, in this case, in order to detect that the thickness of the material to be ground 21 is below 20 312XP / Invention Specification (Supplement) / 94-02 / 93131936 200528231, the set value do must be opposite to the above, and the detection must be performed on top Point, the front end of the adjusting member 2 1 7 does not leave the front end of the detector 2 1 9. Therefore, although the detection time Δt is detected by the grinding device 100, a long time Δt that neglects to occur in synchronization with the above-mentioned movement curve, that is, a time Δt existing between adjacent top dead points, is used. The method of short continuous time Δt near the top dead center, or the opposite of the grinding device 1 0 0, measures the reverse continuous time of the front end of the adjusting member 2 1 7 without contacting the detector 2 1 9 to subtract from the predetermined reference time The time of the reverse continuation time is used as a method of the continuation time Δt. For example, in the latter case, if the set time to is less than the oscillation period T, the reference period is used as the oscillation period T. In spite of this, the initial continuation time Δt is negative, and if the reverse continuation time is less than the oscillation period T, the continuation time Δt is positive, and when it exceeds the set time t 0, a judgment or polishing end operation is performed. In addition, the method for determining the thickness of the polishing device and the material to be polished of the present invention is not limited to the examples shown in the above drawings, and of course, various changes can be made without departing from the scope of the present invention. For example, in each of the above-mentioned embodiments, although the thickness of the material to be polished is detected to be less than a set value by detecting the position of the first polishing shaft, the device structure portion that is the object of position detection is not limited to the first polishing shaft. As long as it is a part that changes according to the thickness of the material to be polished, any position is fine. Specifically, if the lower shaft core rocking type grinding device is used, the position of the core of the lower shaft portion in the rocking operation can be fixed, and the position of the upper shaft portion can be detected. [Brief Description of the Drawings] Fig. 1 is a schematic configuration diagram showing the structure of a main part of a polishing apparatus 100. 21 312XP / Invention Manual (Supplement) / 94-02 / 93131936 200528231 Fig. 2 is a graph showing the thickness detection value of the material to be ground polished by the grinding device 100. Fig. 3 is a graph showing the detected thickness values of the material to be ground polished with the grinding device 100. Fig. 4 is a graph showing the thickness detection values of the material to be ground polished with the grinding device 100. Fig. 5 is a graph showing the detected thicknesses of the material to be ground polished with the grinding device 100. Fig. 6 is an enlarged view of a graph of thickness detection values, and is a graph showing a determination method. Fig. 7 is a graph showing the thickness error of the material to be polished polished in Examples 1 and 2. Fig. 8 is a graph showing the thickness error of the material to be polished polished in Comparative Examples 1 to 4. Fig. 9 shows a schematic structure of the main part of the polishing device 200. Fig. 10 Fig. 10 shows a graph of the movement curve of the structure of the device and an enlarged view showing a part of the movement curve. [Description of main component symbols] 100 > 200 Grinding device 1 1 0, 2 1 0 Upper shaft part 1 11, 2 1 1 First grinding member 1 1 2, 2 1 2 First grinding shaft 1 2 0, 2 2 0 Lower shaft part 22 312XP / Invention manual (Supplement) / 94-02 / 93131936 200528231
1 2 1 > 22 1 第： 2研磨 構件 1 2 2 > 222 第 2研磨 軸 312XP/發明說明書(補件)例-02/93131936 231 2 1 > 22 1 No .: 2 grinding member 1 2 2 > 222 No. 2 grinding shaft 312XP / Invention specification (Supplement) example-02 / 93131936 23