CN100366385C - Grinding device and method for determining thickness of grinded material - Google Patents
Grinding device and method for determining thickness of grinded material Download PDFInfo
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- CN100366385C CN100366385C CNB2004100905842A CN200410090584A CN100366385C CN 100366385 C CN100366385 C CN 100366385C CN B2004100905842 A CNB2004100905842 A CN B2004100905842A CN 200410090584 A CN200410090584 A CN 200410090584A CN 100366385 C CN100366385 C CN 100366385C
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
- B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B13/00—Machines or devices designed for grinding or polishing optical surfaces on lenses or surfaces of similar shape on other work; Accessories therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
Abstract
Provided is a technique for determining a thickness by which the thickness of a workpiece highly accurately managed without requiring highly skilled work. The grinding device 100 for grinding the workpiece has a first grinding member 111, a second grinding member 121 arranged oppositely to the first grinding member via the workpiece 101, and a driving means which relatively rotates or oscillates the first grinding member and the second grinding member. The device 100 also has: detecting means 114, 117, which measure the position of a device structure part changed with the changes of the thickness of the workpiece and detects whether the detected value of the thickness corresponding to the thickness below a setting value of the thickness of the workpiece is obtained; and a clocking means which calculates the duration of continuously obtaining the detected value of the thickness corresponding to the thickness below the setting value. The device 100 is composed so that grinding operations are stopped when the duration exceeds a prescribed setting time.
Description
Technical field
The present invention relates to lapping device and ground the thickness decision method of material, the quilt that particularly is used for grinding the device and method of optical elements such as lens grinds the thickness decision technology of material.
Background technology
Usually, when optical elements such as grinding lens, be fixed on the wherein side of top lap and following abrasive disk,, grind by top lap and following abrasive disk relatively being rotated and swinging grinding material.Adopt the device of this Ginding process, known have ball core oscillating-type lapping device and a Ou Sika type lapping device.In the ball core oscillating-type lapping device, a side's (either party up and down) grinding shaft is rotated around set oscillation center, make the rotation of the opposing party's grinding shaft simultaneously.In the Ou Sika type lapping device, side's grinding shaft and abrasive disk can be changed angle ground be connected, make this grinding shaft swing, make the rotation of the opposing party's grinding shaft simultaneously.
In the above-mentioned various lapping device,, detect the position of the device construction part of the regulation mobile along with the varied in thickness of grinding material by the quilt that grinds generation in order to control the thickness that is ground material.Usually, when this device construction has partly arrived the precalculated position, abrasive action is finished, like this, make the thickness that is ground material near desired value (for example with reference to following patent documentation 1).At this moment, measure the position of the device construction part of regulation continuously, measure the amount of grinding of swing each time, set milling time and number of oscillations (with reference to Fig. 1 and Fig. 3 of patent documentation 1), perhaps, detect the desired value (with reference to Figure 12 and Figure 13 of patent documentation 1) that whether has reached the thickness that is ground material.
Patent documentation 1: TOHKEMY 2001-252868 communique
In the above-mentioned Ginding process before, done a lot of effort in order to control the thickness that is ground material accurately, still, the not talkative thickness and precision that is ground material is very high.Especially in ball core oscillating-type lapping device and Ou Sika type lapping device, because the influence of its wobbling action is difficult to the accuracy of detection that the thickness of material is ground in raising, must be according to the measured data of each device, fine setting milling times etc. are very high to staff's technical capability requirement.
Summary of the invention
The present invention makes in order to address the above problem, and its objective is provides a kind of operation that does not need high degree of skill, can grasp the thickness decision technology that is ground material thickness accurately.
The present inventor is in view of said circumstances, through research and result of experiment with keen determination repeatedly, find when lapping device carries out attrition process, to produce little vibration along with abrasive action, this little vibrations hamper the accuracy of detection of thickness detected value improve.This little vibration, ground material the 1st grinding component and the 2nd relatively moving of grinding component and producing in opposite directions, rotation or swing relatively along with holding under the arm, this little vibration is delivered to the device construction part of carrying out being ground the material thickness measurement, like this, make the quilt that obtains that moves grind the vibration of material thickness detected value by checkout gear structure part.This vibration be not the driving structure by Ou Sika type lapping device etc. cause moving up and down, but by abrasive particle and ground material between above-mentioned little vibration of causing of abrasive action produce.The vibration of this thickness detected value, not only be subjected to the influence of the relative-movement state of amplitude of fluctuation, hunting period, rotary speed grade in an imperial examination 1 grinding component and the 2nd grinding component, also be subjected to being ground the influence of the abradant surface curvature of material, the resonance characteristics of device construction etc., so, the vibration of this thickness detected value, not only different in each device, and according to grinding condition, ground the shape etc. of material and different.Like this, the vibrational state of thickness detected value has nothing in common with each other according to situation, in addition, it also is comprehensively to be produced by complicated factors such as grinding condition, the shape of being ground material, device construction, so, in method before, make the accuracy of detection of being ground material thickness detected value is very difficult less than the above-mentioned vibration amplitude of thickness detected value.
For this reason, the detection error that the present inventor occurs for the vibration that reduces the thickness detected value that produces along with above-mentioned little vibration, in the process that the thickness that is ground material successively decreases because of abrasive action, mensuration obtains setting value the duration of following thickness detected value, this duration is judged to be and has obtained the thickness that the quilt corresponding with above-mentioned setting value grinds material when having surpassed set setting-up time.Especially, above-mentioned setting-up time is fixed on vibration period of the thickness detected value that is accompanied by above-mentioned little vibration when following, can suppress in time through and deviation that the quilt that causes grinds material thickness, so, can very high degree of precision ground control thickness.Specifically, compare, the thickness deviation that is ground material can be reduced to below about 1/3 or 1/3 with such before method that when the thickness detected value has arrived setting value, finishes abrasive action.
Promptly, lapping device of the present invention, be to grind the above-mentioned lapping device that material is used that ground, has the 1st grinding component, across being ground material and above-mentioned the 1st grinding component the 2nd grinding component in opposite directions, make the driving mechanism of relative rotation of above-mentioned the 1st grinding component or swing with above-mentioned the 2nd grinding component, it is characterized in that, have testing agency and time movement, above-mentioned testing agency measures the position along with the above-mentioned device construction part of being ground the varied in thickness of material and changing, can detect whether obtained with as the corresponding thickness detected value of thickness below the setting value of above-mentioned desired value of being ground material thickness; Above-mentioned time movement is obtained the duration that obtains the above-mentioned thickness detected value corresponding with thickness below the above-mentioned setting value constantly, when above-mentioned duration or its aggregate-value have surpassed set setting-up time, stops abrasive action.
Above-mentioned testing agency is not limited to measure above-mentioned thickness detected value itself, as long as whether can finally detect the thickness detected value corresponding with the following thickness of setting value.Therefore, the state of setting value, or the state below setting value have been surpassed as long as can know the thickness detected value.For example, above-mentioned testing agency is a sense switch etc., and when the thickness detected value has arrived setting value when following, this switch carries out the contact switching.
Above-mentioned setting-up time, the time that the vibration period of the above-mentioned thickness detected value that preferably little vibration causes is following.Even setting-up time is set at the time above the vibration period, also can be suppressed at the thickness deviation that is ground material below the vibration amplitude of thickness detected value, but, the objective of the invention is in order to reduce the deviation of thickness, reduce the influence that is subjected to the vibration of thickness detected value, so also can not get any pair of effect that adds even setting-up time surpasses the vibration period.In addition, if arrive the time lengthening of setting value after the following moment, then can strengthen thickness deviation on the contrary because of the grinding rate deviation causes, quilt after the attrition process grinds material.In addition,, must be noted that the corresponding relation that is ground material and setting value, manage miscellaneous owing to ground the thickness of material and the deviation increase of setting value.
Among the present invention, above-mentioned driving mechanism preferably has the wobble drive mechanism that makes the swing of the 1st grinding component and makes the rotary drive mechanism of the 2nd grinding component around its axis rotation.One side's grinding component carries out in the lapping device of wobbling action, though the vibration period of thickness detected value is not necessarily synchronous with its wobbling action,, because the influence of wobbling action, the thickness detected value has bigger vibration, so the accuracy of detection that will improve the thickness detected value is very difficult.But, among the present invention, become the following duration of setting value by observing the thickness detected value, whether surpassed the setting-up time of regulation, can suppress to be amplitude with detecting error less than the thickness detected value, so, can control the thickness that is ground material accurately.
Among the present invention, have the 1st grinding shaft that is fixed on above-mentioned the 1st grinding component, above-mentioned wobble drive mechanism preferably makes above-mentioned the 1st grinding shaft rotate around the oscillation center of regulation.When constructing in this wise (ball core oscillating-type lapping device), by measure the 1st grinding shaft and oscillation center between relative position relation, just can directly obtain above-mentioned thickness detected value, perhaps can detect the thickness detected value whether below setting value.
Among the present invention, preferably constitute as follows, have and to change the 1st grinding shaft that angle ground is connected with above-mentioned the 1st grinding component,, above-mentioned the 1st grinding component is being slided on the above-mentioned curved surface that is ground material or above-mentioned the 2nd grinding component by the wobbling action of the 1st grinding shaft; Above-mentioned testing agency, by measure the 1st grinding component, when on above-mentioned curved surface, sliding at the dead-centre position that grinds direction reciprocating action, detect the corresponding above-mentioned thickness detected value of thickness that whether has obtained with below the above-mentioned setting value.Among the present invention, have and to change the 1st grinding shaft that angle ground is connected with the 1st grinding component, by its wobbling action, make the 1st grinding component in the structure that on the curved surface that is ground material or the 2nd grinding component, slides (Ou Sika (オ ス カ one) type lapping device), slip along with the 1st grinding component, the 1st grinding shaft is grinding direction reciprocating action, so the position of only measuring the 1st grinding shaft can not obtain the thickness detected value.Therefore, at this moment,, detect the thickness detected value whether below setting value by measuring the dead-centre position of this reciprocating action.At this moment similarly, whether surpassed setting-up time according to the duration, the control abrasive action like this, can be controlled the thickness that is ground material with the following precision of the vibration amplitude of thickness detected value.
The material thickness decision method that ground of the present invention, be to grind to be ground the above-mentioned thickness measuring method that is ground material that adopts in the lapping device that material uses, above-mentioned lapping device has the 1st grinding component, across being ground material and above-mentioned the 1st grinding component above-mentioned the 2nd grinding component in opposite directions, make the driving mechanism of relative rotation of above-mentioned the 1st grinding component or swing with above-mentioned the 2nd grinding component, it is characterized in that, mensuration is along with the position of the above-mentioned device construction part of being ground the varied in thickness of material and changing, detect whether obtained with as the corresponding thickness detected value of thickness below the setting value of above-mentioned desired value of being ground material thickness, obtain the duration that obtains the above-mentioned thickness detected value corresponding constantly, judge whether above-mentioned duration or its aggregate-value have surpassed set setting-up time with thickness below the above-mentioned setting value.In addition, above-mentioned setting-up time was preferably in below the vibration period of the above-mentioned thickness detected value that little vibration causes.
Among the present invention, above-mentioned setting-up time preferably is set at below half of above-mentioned vibration period.But, if the not enough vibration period of setting-up time 5%, receive that then the possibility of the impact that caused by external disturbance etc. or electric noise etc. becomes big.The amount of grinding that grinding rate produced in the vibration period, during fully less than vibration amplitude, setting-up time preferably is about half (50%) of the vibration period of thickness detected value, like this, can reduce the poor of the thickness that ground material and setting value.In fact, because vibration phase has deviation with respect to setting value, and, the amount of grinding that produces in the vibration period be can not ignore mostly with respect to vibration amplitude, so, setting-up time preferably the vibration period half or half below, for example, in 10～65% scope, be preferably in 25～45% the scope.
Description of drawings
Fig. 1 is the general structural map of the major part structure of expression lapping device 100.
Fig. 2 is a curve map of representing to grind with the quilt that lapping device 100 grinds material thickness detected value.
Fig. 3 is a curve map of representing to grind with the quilt that lapping device 100 grinds material thickness detected value.
Fig. 4 is a curve map of representing to grind with the quilt that lapping device 100 grinds material thickness detected value.
Fig. 5 is a curve map of representing to grind with the quilt that lapping device 100 grinds material thickness detected value.
Fig. 6 is the enlarged drawing and the key diagram of representing decision method of the curve map of thickness detected value.
Fig. 7 is the thickness deviation of material is ground in expression by embodiment 1 and 2 quilts that grind a curve map.
Fig. 8 is the thickness deviation of material is ground in expression by the quilt of comparative example 1-4 grinding a curve map.
Fig. 9 is the general structural map of the major part structure of expression lapping device 200.
Figure 10 is the curve map of indication device structure moving curve partly and the part of moving curve is amplified the enlarged drawing of expression.
The specific embodiment
Below, with reference to description of drawings example of the present invention.Fig. 1 is the general structural map that the major part of the lapping device 100 of this example of expression is constructed.Illustrated lapping device 100 is exactly to go up axle ball core oscillating-type lapping device.But, also the last axial region of this lapping device 100 and function, the structure of lower shaft portion can be constituted on the contrary, form lower shaft ball core oscillating-type lapping device.In this lapping device 100, last axial region 110 rotates around oscillation center Fo, and lower shaft portion 120 is rotated around axis.
Be fixed on the 1st grinding shaft (tilting member) 112 at last axial region 110, the 1 grinding components (abrasive disk) 111, the 1st grinding shaft 112 can move freely the earth's axis at axis direction with respect to support unit 113 and prop up.Support unit 113 is driven by the wobble drive mechanism that figure does not show, rotates around oscillation center Fo.On support unit 113, the detector 114 that is made of push switch etc. is being fixed in supporting.In addition, on support unit 113, be provided with stop part (degree is as リ) 115.
The 1st grinding shaft 112 reaches the top of support unit 113, links to each other with fixed part 116.On this fixed part 116, the adjusting parts 117 that are made of micrometer etc. are installed.This regulates the front end 117a of parts 117, and during with the front end 114a butt of above-mentioned detector 114, the output of detector 114 is switched.The state that the front end 114a of detector 114 pushes towards projected direction with the elastomeric element of being schemed not show, can be flexible with prescribed stroke S 1 at axis direction, front end 114a is when regulating the front end 117a butt of parts 117, and front end 114a is urged and withdraws, and above-mentioned detection signal switches.Above-mentioned stroke S1 will guarantee to reach as described later setting value and from allowing mobile enough strokes to the amount of grinding that grinds the end behind front end 117a and the front end 114a butt.In addition, limiting part 118 also is installed on fixed part 116.When this limiting part 118 and above-mentioned stop part 115 butts, limit the moving range of the 1st grinding shaft 112.Limiting part 118 is made of bolt etc., can regulate the position of the grinding direction of its front end.
Above-mentioned adjusting parts 117 are fixed on the 1st grinding shaft 112, and above-mentioned detector 114 is fixed on the support unit 113, still, also can will regulate parts 117 and be fixed on the support unit 113 on the contrary, and detector 114 is fixed on the 1st grinding shaft 112.In addition, also can measuring ability be set, replace detector 114, only constitute abutting part regulating parts 117.
On the other hand, above-mentioned stop part 115 is fixed on the support unit 113, and above-mentioned limiting part 118 is fixed on the 1st grinding shaft 112, still, also can be fixed on stop part 115 on the 1st grinding shaft 112, and limiting part 118 is fixed on the support unit 113.In addition, limiting part 118 and stop part 115 are construed as limiting mechanism.This limiting mechanism is not damaged for the leading section 114a that makes detector 114 and is provided with.
In lower shaft portion 120, be provided with the 2nd grinding component (abrasive disk) 121 and be fixedly connected on the 2nd grinding shaft (rotating shaft) 122 on the 2nd grinding component 121.The 2nd grinding shaft 122 is driven by the rotary drive mechanism that figure does not show, rotates around axis.
Between the 1st grinding component 111 and the 2nd grinding component 121, the quilt that is disposing lens or other optical element etc. grinds material 101.In illustrated example, ground material 101 usefulness best efforts sellings suitable fixed mechanisms such as (ピ Star チ) to be fixed on the 1st grinding component 111, but also can be fixed on the 2nd grinding component 121.When above-mentioned the 1st grinding shaft 112 rotated around oscillation center Fo, the 1st grinding component 111 (when being ground material 101 and being fixed on the 1st grinding component 111) or the surface when being fixed on the 2nd grinding component 121 (ground material 101) of being ground material 101 was gone up slip on the surface of the 2nd grinding component 121.Which kind of situation no matter, the 1st grinding shaft 112 all is to slide on curved surface.
In the above-mentioned lapping device 100, under the slurries that contain abrasive particle having been supplied to the state that is ground between material 101 and the 2nd grinding component 121 (when being ground material 101 and being fixed on the 1st grinding component 111) or the 1st grinding component 111 when being fixed on the 2nd grinding component 121 (quilt grind material 101), the 1st grinding component 111 is swung on one side around oscillation center Fo, make of the axis rotation of the 2nd grinding component 121 on one side, thereby carry out attrition process around the 2nd grinding shaft 122.
Fig. 2 to Fig. 5 is the curve map of expression thickness detected value when being ground material 101 with 100 grindings of above-mentioned lapping device, that ground material 101.Fine moving up and down shown in the data of each curve is along with the noise of detector and the vibration of drawing mechanism produce, and in the following description it ignored.This thickness detected value, in above-mentioned lapping device 100, can not detect, so, other detection system must be installed to be measured, the detection system that this is other, with the 1st grinding shaft 112 of the above-mentioned lapping device 100 of detections such as detecting sensor or parts fixed thereon, and lower shaft portion 120 or support unit 113 or be fixed on parts on them between the rate of travel of grinding direction (above-below direction among the figure).Among Fig. 2, are 0.3MPa from 112 pairs the 1st grinding component applied pressures of the 1st grinding shaft.Among Fig. 3 0.4MPa.Among Fig. 4 0.5MPa.Among Fig. 5 0.6MPa.In addition, in the data of each figure, be 2.4 seconds the hunting period of the 1st grinding shaft 112, and the rotary speed of the 2nd grinding shaft 122 is 2000rpm.But usually, set hunting period aptly 1～6 second scope, rotary speed is in the scope of 1000～3000rpm.
To shown in Figure 5, ground the thickness detected value of material 101 as Fig. 2,, but in fact have small vibration overlapping along with reducing point-blank of time through about.Fig. 6 is the figure that the data of the thickness detected value of each figure is amplified expression.As shown in Figure 6, amplitude (double amplitude) A of the vibration of this thickness detected value d is 10～15 μ m in illustrated example, and the period T of vibration is 0.9～1.2 second.The amplitude A of this vibration and period T are subjected to the influence of the structure, size, formation material etc. of lapping device, also are subjected to grinding condition simultaneously, ground the influence of the shape of material, can not obtain simply.
If the admissible error that the quilt after the attrition process grinds material thickness is fully bigger than the amplitude A of vibration, also problem is little in the vibration of then above-mentioned thickness detected value d, but, when required precision height, admissible error during near above-mentioned amplitude A, then produced problem, caused the quilt after the attrition process to grind the thickness deviation of material, simultaneously, if admissible error during less than above-mentioned amplitude A, then must be carried out the various computings or other the noise of rolling average, least square method etc. and remove processing, otherwise can not be corresponding.This noise is removed processing, needs the detector and the computing mechanism of high price, has improved the price of lapping device.
In this example,, can suitably set the corresponding setting value do of desired value with the thickness that is ground material 101 by regulating above-mentioned adjusting parts 117.For example, before grinding beginning, the state that is ground material 101 is being installed, make the front end 117a of adjusting parts 117 and the front end 114a butt of detector 114, the detection signal of confirming detector 114 switches (for example upset), with this switching position is benchmark, makes the front end 117a that regulates parts 117 leave the required amount of grinding of detector 114.Like this, the thickness that is ground material 101 has reduced above-mentioned required amount of grinding, when the thickness that is ground material 101 becomes setting value do, regulates the front end 117a of parts 117 and the front end 114a butt of detector 114, and the detection signal of detector 114 switches.
As mentioned above, under the state that setting value do has been set, when beginning to grind, to shown in Figure 5, the thickness that is ground material 101 reduces gradually, soon as Fig. 1, as shown in Figure 6, when the thickness detected value d that is ground material 101 reaches setting value do, regulate the front end 117a of parts 117 and the front end 114a butt of detector 114, the detection signal of detector 114 switches.But the switching state of this detection signal finishes at short notice owing to the vibration of thickness detected value d, and detection signal resets into the state before switching.In this example, the duration Δ t when measuring this detection signal and becoming switching state.The mensuration of this duration Δ t when the detection signal of detector 114 switches, stops when detection signal restores, and the counting circuit of reseting by employing can carry out simply.
In this example, pre-set setting-up time to compares with above-mentioned duration Δ t.Duration Δ t continues to grind when setting-up time to is following, and when the duration, Δ t surpassed setting-up time to, lapping device 100 stopped.In fact, it is difficult that action part moment ground of lapping device 100 is stopped, so, apply brake force with the driving force of cutting off wobble drive mechanism and rotary drive mechanism or on the basis that cuts off driving force or driving stops before, remove or reduce the whole bag of tricks such as plus-pressure, make the abrasive action end.Above-mentioned duration Δ t and the judgement of setting-up time to, available known comparison circuit etc. carry out simply.
Above-mentioned setting-up time to is preferably in below the vibration period T of thickness detected value d shown in Figure 6.When the above-mentioned duration, Δ t surpassed vibration period T, mean that setting value do and the difference of being ground material 101 thickness are vibration amplitude A over half of thickness detected value, so, do not mean that longer standby.In addition, along with the process of time, the thickness that is ground material 101 is reduced to littler than setting value do gradually, so, ground of the difference increase of the thickness of material 101 for setting value do, the deviation of this difference also may increase.
As an example, as shown in Figure 6, for example, the duration Δ t when thickness detected value d reaches setting value do at first is 0.35T, and the duration Δ t when arriving setting value do for the second time is 0.65T, and then after arriving, just no longer surpasses setting value do.At this moment, if setting-up time to is set at 0.5T, grinds when arriving setting value do the 2nd time and finish, the thickness that the quilt when grinding finishes grinds material 101 is the value that diagram P is ordered.
Usually, abundant hour of the amount of grinding that grinds at vibration period T, the quilt the when duration, Δ t was 0.5T grinds the thickness of material 101, with setting value do basically identical.But owing to the phase place with respect to the above-mentioned vibration that sets value do, duration Δ t is not necessarily consistent with 0.5T.So, preferably suitably set setting-up time to, to judge near the moment of 0.5T as far as possible at duration Δ t.In addition, in fact, since very important at the amount of grinding of vibration period T grinding, so along with the process of time, the thickness that is ground material is littler than setting value do gradually.Therefore, consider these factors, preferably be set at setting-up time near the 0.5T or than its short slightly time.But, if setting-up time at below 5% of period T, then is subjected to the influence of external disturbance and noise etc. easily.Therefore, preferably at 0.10～0.65T, better at 0.25～0.5T.
When Fig. 7 represents to adopt this example, ground the thickness measurement result after material 101 attrition process.Among the embodiment 1, the data when being setting-up time to=0.4T.Among the embodiment 2, the data when being setting-up time to=0.5T, 50 quilts when representing continuous grind for 50 times respectively grind the thickness of material.A scale of the longitudinal axis is 10 μ m.Fig. 8 be expression with before such, the end abrasive method is ground when reaching setting value do at first.Comparative example 1 to 4 is illustrated in the result who carries out 50 continuously grindings under the different conditions respectively.A scale of the longitudinal axis is 10 μ m.
As mentioned above, in the method before, the deviation that the quilt after the attrition process grinds material thickness is 30～50 μ m amplitudes, with respect to this, when adopting this example, the thickness deviation that is ground material is below 20 μ m, by making the setting-up time optimization, can reach below the 10 μ m.Usually, preferably make above-mentioned setting-up time to reduce the deviation amplitude that the quilt after the attrition process grinds material thickness less than 0.5T.
In addition, with above-mentioned example differently, can judge also whether the integrating value of duration Δ t has surpassed setting-up time to.That is, in the above-mentioned example shown in Figure 6, because initial duration Δ t=0.35T, so, be no more than setting-up time to=0.5T, still, the moment below becoming setting value do, then the integrating value of duration Δ t surpassed setting-up time to when beginning to have passed through 0.15T.Therefore, behind the initial 0.15T that has passed through the 2nd duration Δ t=0.65T, grind and finish.Like this, the too big of vibration phase when not being subjected to reach setting value do at first influences, and can obtain grinding near the quilt of setting value do usually the thickness of material 101.
Fig. 9 is the general structural map of the major part structure of another lapping device 200 of expression.This lapping device 200, last axial region 210 swings, lower shaft portion 220 constitutes rotatably, is Ou Sika type lapping device.The 1st grinding component (abrasive disk) 211 of last axial region 210 is being connected with the 1st grinding shaft (tilting member) 212 changeable angle ground, by 212 swings of the 1st grinding shaft, the 1st grinding component 211 is gone up on the surface (curved surface) of being ground material 201 or the 2nd grinding component 221 and is slided.On the other hand, the rotary drive mechanism of being schemed not show by the 2nd grinding shaft 222 drives and rotates 221 rotations of the 2nd grinding component around axis.
The 1st grinding shaft 212 is connected with swing arm 213, and this swing arm 213 is connected with the driver part 214 that carries out oscillating motion (reciprocating motion of left and right directions among the figure) rotationally.In addition, swing arm 213 is subjected to towards the plus-pressure that grinds direction (below among the figure) by the pressing mechanism 215 that is made of cylinder etc.Fixedly connected extension arm 216 on swing arm 213 is installed with on this extension arm 216 and regulates parts 217.This regulates parts 217, can change the position of its front end at moving direction, and output detection signal, and when its front end and abutting part described later 219 butts, detection signal switches.
In addition, fixedly connected supporting arm 218 is installed with abutting part 219 on this supporting arm 218 on driver part 214.In the illustrated example, regulate parts 217 and be fixed on the swing arm 213, abutting part 219 is to be fixed on the driver part 214, still, also abutting part 219 can be fixed on the swing arm 213, will regulate parts 217 and be fixed on the driver part 214.In addition, in this example, adjusting parts and the detector same with lapping device 100 can be set also.Anti-, the above-mentioned adjusting parts and the abutting part of this lapping device 200 also can be used for lapping device 100.
Abutting part 219 supporting arm 218 is relatively sliding with the direction of regulating parts 217 butts, and always be urged towards regulating parts 217 sides, regulate parts 217 not with the state of abutting part 219 butts under, keeping the state of colliding with the restriction site of regulating parts 217 sides.In addition, this sliding structure can not be an abutting part 219 also, regulates on the parts 217 and be located at.The path increment S2 of this sliding structure should guarantee the amplitude greater than moving up and down (toward double action) of aftermentioned the 1st grinding shaft 212.
In the lapping device 200, with lapping device 100 similarly, before grinding beginning, the setting that suitably sets value with adjusting parts 217.In addition, Yi Bian make 222 rotations of the 2nd grinding shaft, Yi Bian make driver part 214 reciprocating actions, like this, make 212 swings of the 1st grinding shaft, therefore, the 1st grinding component 211 grinds on the surface of material 201 or the 2nd grinding component 221 at the quilt of rotation and slides, and the grinding of carrying out being ground material 201.
In this lapping device 200, if what ground material 201 is curved surface by abradant surface, during 212 swings of the 1st grinding shaft, the 2nd grinding shaft 212 up and down reciprocatingly move with swing arm 213, so, regulate the position of parts 217 and also up and down reciprocatingly move as illustrated in fig. 10.Therefore, in this lapping device 200, the thickness detected value d that is ground material 201 is not corresponding with the front position of regulating parts 217.Being ground the thickness detected value d of material 201, is from the moving curve of the device construction part of the front position of adjusting parts 217 shown in Figure 10 etc., deducts the value of the past double action composition of following its wobbling action.That is, thickness detected value d is corresponding with the envelope d1 or the d2 of the dead-centre position (top dead centre or lower dead center) of above-mentioned moving curve.Therefore, in lapping device 200,, judge whether above-mentioned thickness detected value d has arrived below the setting value do by detecting the dead-centre position of above-mentioned moving curve.
Figure 10 is the enlarged drawing that the part (3 positions) of above-mentioned moving curve is amplified in expression.From these enlarged drawings as can be known, on above-mentioned moving curve, overlapping the vibration that causes by above-mentioned little vibration.Therefore, deduct the thickness detected value d of the past double action composition of following wobbling action from moving curve, also with Fig. 2 to Fig. 5 similarly, have vibration overlapping.Chain-dotted line d1 shown in Figure 10 is the envelope that connects between top dead centre, and chain-dotted line d2 is the envelope that connects between lower dead center, and dotted line d0 is the straight line (horizontal line) of expression setting value.
In the lapping device 200, the duration, Δ t was determined at dead-centre position.In the illustrated example, the bottom dead center position of device construction moving curve is partly measured duration Δ t.At this moment, the setting operation of setting value do is to carry out under the state that the 1st grinding component 211 is configured in lower dead center as shown in phantom in Figure 9.Shown in the enlarged drawing of Figure 10, whether the lower dead center of judging moving curve has surpassed setting-up time to this point for the duration Δ t of setting value do when following, identical with lapping device 100.At this moment, Zhen Dong phase place not only, the phase place of moving curve lower dead center, also the relation with setting value do is different.Detected status and lapping device 100 are substantially basic identical.
In the example shown in Figure 10, be benchmark with the moving curve, do is when lower for setting value, and the continuous time Δ t of for example tentative palpation is 0.25T, and the next one is 0.35T; When setting value do was bigger slightly than it, for example, initial duration Δ t was 0.44T, and the next one is 0.63T.Like this, in lapping device 200, the amplitude of fluctuation of duration Δ t with in lapping device 100, compare little, in addition, served as this after bottom dead center, duration Δ t is not thereafter occurring to the preceding of next lower dead center, so setting-up time Δ t cans be compared to little in lapping device 100 most.
It should be noted in this lapping device 200, the mensuration of above-mentioned duration Δ t and duration Δ t and setting-up time to compare to determine, not that past double action (up and down moving) to moving curve is carried out, and be that vibration overlapping on moving curve is carried out all the time.That is, being ground the thickness detected value d of material, is to remove the past double action composition that is accompanied by swing from moving curve, must carry out the mensuration of duration Δ t and comparing to determine of duration Δ t and setting-up time to this thickness detected value d.
In addition, with above-mentioned different be also can measure duration Δ t to the top dead center position of device construction part.At this moment, the setting operation of setting value do shown in the solid line of Fig. 9, is to carry out under the state that the 1st grinding component 211 is configured in top dead centre.In addition, at this moment, be setting value do when following,, must detect the front end that the front end of regulating parts 217 at top dead centre no longer deviates from abutting part 219 with on the contrary above-mentioned when detecting the thickness that ground material 201.Therefore, adopt following method, similarly detect duration Δ t with lapping device 100, still, ignore and synchronous long duration Δ t, the duration Δ t that promptly between adjacent top dead centre, exists that produces of above-mentioned moving curve, only with near the short duration Δ t the top dead centre; Perhaps, with lapping device 100 on the contrary, front end that measure to regulate parts 217 not with duration of leaving of the front end butt of abutting part 219, from the fiducial time of stipulating, deducting the time of leaving the duration, as duration Δ t.For example, under the latter's the situation, if setting-up time to not enough vibration period T, then the said reference time as vibration period T.Like this, originally, though duration Δ t bear,, leaving the duration is when the vibration period, T was following, the duration, Δ t just became, and when it surpasses setting-up time to, judged and ground tenth skill.
In addition, lapping device of the present invention and quilt are ground material thickness decision method, have more than and are defined in above-mentioned illustrated example, can do various changes in the scope that does not break away from main idea of the present invention.For example, in above-mentioned each example, be by detecting the position of the 1st grinding shaft, detecting the thickness that is ground material has arrived below the setting value, but, device construction as the position probing object partly is not limited to above-mentioned the 1st grinding shaft, also can be any position, so long as all can in the position that is changed along with grinding the material varied in thickness.Specifically, if lower shaft ball core oscillating-type lapping device, also the ball core fixed-site of the lower shaft portion of wobbling action can be lived the position of axial region in the detection.
Claims (7)
1. lapping device is used for grinding and is ground material, has the 1st grinding component, across being ground in opposite directions the 2nd grinding component of material and above-mentioned the 1st grinding component, making the relative driving mechanism that rotates or swing with above-mentioned the 2nd grinding component of above-mentioned the 1st grinding component, it is characterized in that,
Have testing agency and time movement, above-mentioned testing agency measures the position along with the above-mentioned device construction part of being ground the varied in thickness of material and changing, can detect whether obtained with as the corresponding thickness detected value of thickness below the setting value of above-mentioned desired value of being ground material thickness; Above-mentioned time movement is obtained the duration that obtains the above-mentioned thickness detected value corresponding with thickness below the above-mentioned setting value constantly, when above-mentioned duration or its aggregate-value have surpassed set setting-up time, stops abrasive action.
2. lapping device as claimed in claim 1 is characterized in that, above-mentioned setting-up time is the following time of vibration period of the above-mentioned thickness detected value that causes of little vibration.
3. lapping device as claimed in claim 1 or 2 is characterized in that, above-mentioned driving mechanism has the wobble drive mechanism that makes above-mentioned the 1st grinding component swing and makes the rotary drive mechanism of above-mentioned the 2nd grinding component around its axis rotation.
4. lapping device as claimed in claim 3 is characterized in that, has the 1st grinding shaft that is fixed on above-mentioned the 1st grinding component, and above-mentioned wobble drive mechanism makes above-mentioned the 1st grinding shaft rotate around the oscillation center of regulation.
5. lapping device as claimed in claim 3, it is characterized in that, have and to change the 1st grinding shaft that angle ground is connected with above-mentioned the 1st grinding component,, above-mentioned the 1st grinding component is being slided on the above-mentioned curved surface that is ground material or above-mentioned the 2nd grinding component by the wobbling action of the 1st grinding shaft;
Above-mentioned testing agency, by measure above-mentioned the 1st grinding component, when on curved surface, sliding at the dead-centre position that grinds reciprocating action on the direction, detect the corresponding above-mentioned thickness detected value of thickness that whether has obtained with below the above-mentioned setting value.
6. ground the thickness decision method of material, be to grind to be ground the above-mentioned thickness measuring method that is ground material that adopts in the lapping device that material uses, above-mentioned lapping device has the 1st grinding component, across being ground in opposite directions above-mentioned the 2nd grinding component of material and above-mentioned the 1st grinding component, making the relative driving mechanism that rotates or swing of above-mentioned the 1st grinding component with above-mentioned the 2nd grinding component, it is characterized in that
Mensuration is along with the position of the above-mentioned device construction part of being ground the varied in thickness of material and changing, detect whether obtained with as the corresponding thickness detected value of thickness below the setting value of above-mentioned desired value of being ground material thickness, obtain the duration that obtains the above-mentioned thickness detected value corresponding constantly, judge whether above-mentioned duration or its aggregate-value have surpassed set setting-up time with thickness below the above-mentioned setting value.
7. the material thickness decision method that ground as claimed in claim 6 is characterized in that above-mentioned setting-up time is below the vibration period of the above-mentioned thickness detected value that little vibration causes.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003375100A JP4105622B2 (en) | 2003-11-05 | 2003-11-05 | Polishing apparatus and method for determining thickness of material to be polished |
| JP375100/2003 | 2003-11-05 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1613606A CN1613606A (en) | 2005-05-11 |
| CN100366385C true CN100366385C (en) | 2008-02-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100905842A Expired - Fee Related CN100366385C (en) | 2003-11-05 | 2004-11-04 | Grinding device and method for determining thickness of grinded material |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4105622B2 (en) |
| KR (1) | KR100705848B1 (en) |
| CN (1) | CN100366385C (en) |
| TW (1) | TWI275444B (en) |
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| JP5453459B2 (en) * | 2010-01-29 | 2014-03-26 | 有限会社コジマエンジニアリング | Grinding method of lens spherical surface using dish-shaped grinding wheel |
| WO2011117050A2 (en) * | 2010-03-25 | 2011-09-29 | Essilor International (Compagnie Générale d'Optique) | Process for controlling the polishing process of an optical element |
| CN109483394B (en) * | 2018-09-13 | 2023-12-12 | 西安航晨机电科技股份有限公司 | Ultra-precise spherical surface machining device and method for hemispherical harmonic oscillator |
| CN109352431B (en) * | 2018-09-17 | 2020-04-21 | 上海理工大学 | Ultrasonic vibration grinding removal amount in-place detection device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10106984A (en) * | 1996-09-27 | 1998-04-24 | Ebara Corp | Polishing method and controller in polishing equipment for semiconductor wafer |
| JP2001015467A (en) * | 1999-06-30 | 2001-01-19 | Nec Corp | End point detector of polishing |
| JP2001252868A (en) * | 2000-03-09 | 2001-09-18 | Olympus Optical Co Ltd | Method and device for machining lens |
| US6530822B1 (en) * | 1999-12-29 | 2003-03-11 | United Microelectronics Corp. | Method for controlling polishing time in chemical-mechanical polishing process |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1076464A (en) * | 1996-08-30 | 1998-03-24 | Canon Inc | Polishing method and polishing device using therewith |
-
2003
- 2003-11-05 JP JP2003375100A patent/JP4105622B2/en not_active Expired - Lifetime
-
2004
- 2004-10-21 TW TW093131936A patent/TWI275444B/en not_active IP Right Cessation
- 2004-11-04 KR KR1020040089170A patent/KR100705848B1/en not_active IP Right Cessation
- 2004-11-04 CN CNB2004100905842A patent/CN100366385C/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10106984A (en) * | 1996-09-27 | 1998-04-24 | Ebara Corp | Polishing method and controller in polishing equipment for semiconductor wafer |
| JP2001015467A (en) * | 1999-06-30 | 2001-01-19 | Nec Corp | End point detector of polishing |
| US6530822B1 (en) * | 1999-12-29 | 2003-03-11 | United Microelectronics Corp. | Method for controlling polishing time in chemical-mechanical polishing process |
| JP2001252868A (en) * | 2000-03-09 | 2001-09-18 | Olympus Optical Co Ltd | Method and device for machining lens |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI275444B (en) | 2007-03-11 |
| KR100705848B1 (en) | 2007-04-10 |
| JP2005138199A (en) | 2005-06-02 |
| TW200528231A (en) | 2005-09-01 |
| KR20050043661A (en) | 2005-05-11 |
| JP4105622B2 (en) | 2008-06-25 |
| CN1613606A (en) | 2005-05-11 |
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