JP4101013B2 - Manufacturing method of flexible flat wiring body - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for manufacturing a flexible flat wiring body (FPC) capable of accurately mounting an electronic component on a wiring pattern portion.
[0002]
[Prior art]
Flexible flat wiring bodies (FPC) are used for electrical wiring materials in automobiles where electronic automatic control is progressing, circuit configurations of various electronic devices, and the like. For example, as described in Patent Documents 1 and 2, this wiring body is formed by punching a conductor foil (including a conductor strip) along a predetermined wiring pattern shape with a die to form a wiring pattern portion. It is obtained by covering both surfaces of the wiring pattern part with an insulating film (including insulating tape). In the wiring pattern portion of the flexible flat wiring body obtained in this way, required electronic components such as Hall ICs and other semiconductor chips, resistors, capacitors, terminals, etc. are connected and mounted by soldering etc. The
[0003]
[Patent Document 1]
JP-A-6-68723 (Description of paragraphs 0013 to 0021 and FIGS. 1 to 3)
[Patent Document 2]
JP 7-254770 A (Description of paragraphs 0022 to 0024 and FIG. 4)
[0004]
[Problems to be solved by the invention]
However, when mounting an electronic component on the wiring pattern portion of the flexible flat wiring body obtained in this manner, generally, the portion of the insulating film on the side where the electronic component is mounted is etched, a knife, Since it is necessary to remove the conductive foil of the wiring pattern portion by removing it with a cutter or a file, the work of removing the insulating film is complicated and the work efficiency is lowered, and the conductive foil may be damaged.
[0005]
In order to solve such a problem, as described in Patent Document 2, a window (hole) is formed in advance in a portion where the electronic component of the insulating film on which the electronic component is mounted is mounted. However, even if the window is formed in the correct position, when covering both sides of the wiring pattern part with insulating film, the insulating film is displaced relative to the wiring pattern part, and the electronic components are mounted. There is a problem that the window is not properly arranged at the position to be attempted, and it is difficult to mount the electronic component on the wiring pattern portion with high accuracy.
[0006]
The present invention solves the above-described problems, and provides a method for manufacturing a flexible flat wiring body that can easily mount an electronic component on a wiring pattern portion, has excellent workability, and can accurately mount the electronic component. For the purpose.
[0007]
[Means for Solving the Problems]
In order to achieve the above object, according to the first aspect of the present invention, a conductive foil is punched to form a wiring pattern portion, and both surfaces of the wiring pattern portion are covered with an insulating film. In the manufacturing method of the flexible flat wiring body in which the electronic component is mounted on the conductive foil, the first wiring pattern portion is formed by punching the conductive foil in the component mounting region where the electronic component is mounted first, and the wiring pattern portion is preliminarily formed on the wiring pattern portion. An electronic component is mounted, and then a conductive foil in a wiring region other than the component mounting region is punched to form a second wiring pattern portion, and both surfaces of the first and second wiring pattern portions are covered with an insulating film. It is characterized by.
[0008]
According to such a configuration, it is not difficult to punch out the conductor foil in the component mounting area because the electronic component is mounted, and when the electronic component is mounted, the first is only in the component mounting area. The wiring pattern portion is formed, and the second wiring pattern portion is not yet formed in the wiring region other than the component mounting region, and the decrease in the strength of the conductor foil in the component mounting region can be suppressed, and the strength before the pattern formation can be obtained. Retained.
[0009]
As a result, since the electronic component is mounted on the first wiring pattern portion in the component mounting region maintained at such strength, the portion can be firmly mounted and the electronic component can be mounted on the wiring pattern portion with high accuracy. .
[0010]
In addition, since the electronic components are not mounted after obtaining the flexible flat wiring body, the work of removing the insulating film on the side where the electronic components are mounted is saved, the mounting work is simplified, and the work efficiency is improved. The quality of the flexible flat wiring body can be prevented from being deteriorated without fear of damaging the conductor foil. Further, since it is not necessary to previously form a window for mounting the electronic component at a predetermined portion of the insulating film on the side where the electronic component is mounted, the window is correctly arranged at a position where the electronic component is to be mounted. Therefore, it is possible to eliminate inconveniences that hinder the mounting of electronic components. Moreover, since the electronic component is sealed with an insulating film, the waterproof property of the manufactured flexible flat wiring body can be enhanced.
[0011]
According to a second aspect of the present invention, in the manufacturing method according to the first aspect, a carrier sheet is affixed to a conductive foil in which an electronic component is mounted on the first wiring pattern portion, and a region other than the component mounting region is provided. The conductor foil in the wiring region is punched to form the second wiring pattern portion, the first and second wiring pattern portions are separated from the outer edge portion of the non-wiring region, and the outer edge portion of the conductor foil is peeled off from the carrier sheet. The second wiring pattern portion is left on the carrier sheet side, and one insulating film is overlaid on the carrier sheet so as to sandwich the first and second wiring pattern portions, and the carrier sheet is peeled off from the one insulating film and The first and second wiring pattern portions are transferred onto the film, and the other insulating film is overlaid so that the first and second wiring pattern portions are sandwiched between the first and second wiring pattern portions. By applying Ri, first, in which the both surfaces of the second wiring pattern portion, characterized in that coated with an insulating film.
[0012]
According to such a configuration, in addition to obtaining the same effect as the invention of claim 1, in order to form the second wiring pattern portion by punching the conductor foil in a state where the carrier sheet is attached to the conductor foil, It is preferable because a wiring pattern portion having a complicated and high-density wiring pattern can be formed accurately and reliably.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
Next, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a schematic view showing an embodiment of a method for producing a flexible flat wiring body 39 according to the present invention, and FIGS. 2 to 7 are plan views in respective steps of the method for producing the flexible flat wiring body 39 shown in FIG.
[0014]
First, as shown in FIG. 1, a long copper foil, strip, phosphor bronze foil, strip, aluminum foil, strip and other conductive foil (including conductor strip) 13 wound around a drum 11 are intermittently transferred from the drum 11. The electronic component 17 (see FIG. 3) such as a Hall IC is mounted by the mold of the pattern punching machine 15, for example, the conductor foil 13 in the four component mounting regions is formed in a predetermined pattern shape. In the form, four first wiring pattern portions 19 are formed by punching along a linear shape and a T-shape (see FIG. 2). At this time, unnecessary conductor foil slices (not shown) punched by the pattern punching machine 15 are collected by the scrap collector 21 and recycled (reused).
[0015]
Next, the electronic component 17 is connected and mounted to the conductor foil 13 at a predetermined portion of the four first wiring pattern portions 19 by welding, pressure welding, pressure bonding, or the like by the electronic component mounting machine 23. In the present embodiment, one electronic component 17 is included in each of the three first wiring pattern portions 19 located in the upper part of FIG. 2, and the T-shaped first wiring pattern part located in the lower part of FIG. Two electronic components 17 are mounted on 19 (see FIG. 3).
[0016]
When the electronic component 17 is mounted in this way, it is not difficult to punch the conductor foil 13 in the component mounting region because the electronic component 17 is mounted. Also, when mounting the electronic component 17, Since the first wiring pattern portion 19 is formed only in the component mounting region, and the second wiring pattern portion 27 described later is not formed in the wiring region other than the component mounting region, the strength of the conductor foil 13 is reduced in the component mounting region. Is suppressed, and the strength before the pattern formation is maintained.
[0017]
As a result, since the electronic component 17 is mounted on the first wiring pattern portion 19 in the component mounting region maintained at such strength, the part is firmly mounted, and the electronic component 17 is mounted on the wiring pattern portion 19 with high accuracy. can do.
[0018]
Next, the conductor foil 13 in the wiring region other than the four component mounting regions where the first wiring pattern portion 19 is formed is punched by the mold of the pattern punching machine 25 so that the outer edge portion 26 of the non-wiring region remains. Thus, the second wiring pattern portion 27 is formed (see FIG. 4). At this time, unnecessary conductor foil slices (not shown) punched by the pattern punching machine 25 are collected by the scrap collector 29 and recycled (reused).
[0019]
Next, the first and second wiring pattern portions 19 and 27 were formed and wound around the drum 31 disposed above and below the conductor foil 13 on which the electronic component 17 was mounted on the first wiring pattern portion 19. A long insulating film (including insulating tape) 33 is intermittently sent out from each drum 31, and the first and second wiring pattern portions 19 and 27 and the outer edge portion 26 of the conductor foil 13 are insulated by an insulating film applicator 35. The first and second wiring pattern portions 19 and 27 and the outer edge portion 26 are bonded to each other so as to sandwich the electronic component 17 from above and below and to be attached by thermocompression bonding. Both surfaces are covered with an insulating film 33 (see FIG. 5). As the insulating film 33, for example, an insulating film obtained by laminating an insulating film body such as polyethylene terephthalate and an insulating adhesive layer such as a polyolefin-based adhesive is used.
[0020]
Next, the first and second wiring pattern portions 19 and 27 formed on the conductor foil 13 are punched out by the wiring pattern portion die cutting machine 37 and separated from the outer edge portion 26, thus obtaining the flexible flat wiring body 39 (FIG. 6). Note that the perforated outer edge portion 26 (see FIG. 7) of the conductor foil 13 left by punching out the first and second wiring pattern portions 19 and 27 is recovered by the scrap collector 41 and recycled (reused). .
[0021]
FIG. 8 is a schematic view showing another embodiment in the method for manufacturing the flexible flat wiring body 61 according to the present invention, and FIGS. 9 to 13 are plan views in respective steps of the method for manufacturing the flexible flat wiring body 61 shown in FIG. .
[0022]
The manufacturing method of the flexible flat wiring body 61 of this embodiment will be described. The electronic component 17 is connected to the conductor foil 13 at a predetermined portion of the first wiring pattern portion 19 by the electronic component mounting machine 23 by welding, pressure welding, pressure bonding, or the like. The process up to the mounting is the same as the process of the method for manufacturing the flexible flat wiring body of the above embodiment, so that the description thereof will be omitted and the subsequent processes will be described.
[0023]
Adhered to the surface (bottom surface) of the conductor foil 13 on which the electronic component 17 is mounted on the first wiring pattern portion 19 on which the electronic component 17 is not mounted, wound on a drum 43 disposed below the surface. A long carrier sheet (including a carrier tape) 45 having an agent layer is intermittently fed out from the drum 43, superimposed by a carrier sheet affixing machine 47, and bonded by thermocompression bonding (see FIG. 9). .
[0024]
Next, the conductive foil 13 in the wiring region other than the four component mounting regions where the first wiring pattern portion 19 is formed is punched by the die of the pattern punching machine 49 so that the outer edge portion 26 of the non-wiring region remains. In addition to forming the second wiring pattern portion 27, the first and second wiring pattern portions 19 and 27 are separated from the outer edge portion 26 of the non-wiring region, and the outer edge portion 26 is peeled off from the carrier sheet 45 so that the first and second wiring pattern portions 27 are separated. The wiring pattern portions 19 and 27 are left on the carrier sheet 45 side (see FIG. 10). On the other hand, the outer edge portion 26 (see FIG. 8) of the conductor foil 13 peeled off from the carrier sheet 45 is wound up and collected on the drum 51 and recycled (reused). The pattern punching machine 49 may use a half-cut press type punching machine having a Victoria blade in order to prevent the carrier sheet 45 from being damaged when the conductor foil 13 is punched to form the second wiring pattern portion 27. desirable. Note that unnecessary conductor foil sections (not shown) punched by the pattern punching machine 49 are collected by the scrap collecting unit 29 and recycled (reused).
[0025]
Next, the first and second wiring pattern portions 19 and 27 that are left and affixed on the carrier sheet 45 side and the drum 31 disposed above the electronic component 17 mounted on the first wiring pattern portion 19 are attached. One of the long insulating films 33 wound up (upper) is intermittently sent out from the drum 31 and is first and second attached to the carrier sheet 45 by the first insulating film applicator 53. 2 The one insulating film 33 is overlapped so as to sandwich the wiring pattern portions 19 and 27 and cover the electronic component 17 mounted on the first wiring pattern portion 19, and bonded by thermocompression bonding. Further, the carrier sheet 45 is peeled off from the one insulating film 33, and the first and second wiring pattern portions 19 and 27 are transferred to the one insulating film 33 (see FIG. 11). ). On the other hand, the carrier sheet 45 peeled off from the insulating film 33 is wound up and collected on the drum 57 and recycled (reused).
[0026]
Next, the other (lower) long insulating film 33 wound around the drum 31 disposed below the one insulating film 33 to which the first and second wiring pattern portions 19 and 27 are transferred is drummed. The second insulating film 33 is superposed on the lower surface of the one insulating film 33 so that the first and second wiring pattern portions 19 and 27 are sandwiched by the second insulating film sticking machine 55. The both surfaces of the first and second wiring pattern portions 19 and 27 are covered with the insulating film 33 by being bonded by thermocompression bonding (see FIG. 12).
[0027]
Next, the first and second wiring pattern portions 19 and 27 whose upper and lower surfaces are covered with the insulating film 33 are punched out by the wiring pattern portion die cutting machine 59 and separated from the outer edge portion 60 of the insulating film 33, and thus the flexible flat A wiring body 61 is obtained (see FIG. 13). Note that the perforated outer edge portion 60 (see FIG. 13) of the insulating film 33 left by punching out the first and second wiring pattern portions 19 and 27 is recovered by the scrap collector 41 and recycled (reused). . When the electronic component 17 is mounted in this manner, the second wiring pattern portion 27 is formed by punching the conductive foil 13 with the carrier sheet 45 attached to the conductive foil 13, so that a complicated and high-density wiring pattern is formed. This is preferable because the wiring pattern portion having the above can be formed accurately and reliably.
[0028]
【The invention's effect】
As described above, according to the method for manufacturing a flexible flat wiring body described in claim 1 of the present invention, the first wiring pattern portion is formed by first punching the conductor foil in the component mounting region where the electronic component is mounted. Then, electronic components are mounted in advance on the wiring pattern portion, and then, the second wiring pattern portion is formed by punching the conductive foil in the wiring region other than the component mounting region, and the first and second wiring pattern portions Since both sides are covered with insulating film, there is no difficulty in punching the conductor foil in the component mounting area because the electronic component is mounted, and when mounting electronic components The first wiring pattern portion is formed only in the region, and the second wiring pattern portion is not yet formed in the wiring region other than the component mounting region. Reduction is suppressed small, it is held in strength before substantially patterning. As a result, since the electronic component is mounted on the first wiring pattern portion in the component mounting region maintained at such strength, the portion can be firmly mounted and the electronic component can be mounted on the wiring pattern portion with high accuracy. .
[0029]
In addition, since the electronic components are not mounted after obtaining the flexible flat wiring body, the work of removing the insulating film on the side where the electronic components are mounted is saved, the mounting work is simplified, and the work efficiency is improved. The quality of the flexible flat wiring body can be prevented from being deteriorated without fear of damaging the conductor foil. Further, since it is not necessary to previously form a window for mounting the electronic component at a predetermined portion of the insulating film on the side where the electronic component is mounted, the window is correctly arranged at a position where the electronic component is to be mounted. Therefore, it is possible to eliminate inconveniences that hinder the mounting of electronic components. Moreover, since the electronic component is sealed with an insulating film, the waterproof property of the manufactured flexible flat wiring body can be enhanced.
[0030]
According to the method for manufacturing a flexible flat wiring body described in claim 2 of the present invention, in the manufacturing method according to claim 1, a carrier sheet is affixed to a conductor foil in which an electronic component is mounted on the first wiring pattern portion. The conductor foil in the wiring region other than the component mounting region is punched to form the second wiring pattern portion, and the first and second wiring pattern portions are separated from the outer edge portion of the non-wiring region, and the outer edge portion of the conductor foil is separated from the carrier sheet. The first and second wiring pattern portions are left on the carrier sheet side, and one insulating film is overlapped and pasted on the carrier sheet so as to sandwich the first and second wiring pattern portions. The first and second wiring pattern portions are transferred to the film after being peeled from the insulating film, and the first and second wiring pattern portions are sandwiched between the first and second insulating films. Since the other insulating film is laminated and pasted on both sides of the first and second wiring pattern portions with the insulating film, the same effect as described above can be obtained, and the carrier foil can be coated with the carrier foil. Since the second wiring pattern portion is formed by punching the conductor foil in a state where the sheet is attached, it is preferable because a wiring pattern portion having a complicated and high-density wiring pattern can be formed accurately and reliably.
[Brief description of the drawings]
FIG. 1 is a schematic view showing an embodiment of a method for producing a flexible flat wiring body according to the present invention.
FIG. 2 is a plan view showing a state in which a first wiring pattern portion is formed on a conductor foil in FIG.
3 is a plan view showing a state where an electronic component is mounted on a first wiring pattern portion of a conductor foil in FIG.
4 is a plan view showing a state in which a second wiring pattern portion is formed on the conductor foil in FIG. 1. FIG.
FIG. 5 is a plan view showing a state in which both surfaces of the first and second wiring pattern portions are covered with an insulating film in FIG. 1;
6 is a plan view showing a state in which a flexible flat wiring body is obtained by separating the first and second wiring pattern portions from the outer edge portion in FIG. 1;
7 is a plan view showing a perforated outer edge portion of the conductor foil left by punching out the first and second wiring pattern portions in FIG. 1. FIG.
FIG. 8 is a schematic view showing another embodiment of the method for producing a flexible flat wiring body according to the present invention.
9 is a plan view showing a state in which a carrier sheet is attached to a conductor foil in which electronic components are mounted on a first wiring pattern portion in FIG.
FIG. 10 is a cross-sectional view of the conductive foil in the wiring region other than the component mounting region, in which a second wiring pattern portion is formed by punching out the outer edge portion of the non-wiring region, and the first and second wiring pattern portions are It is a top view which shows the state separated from the outer edge part and left on the carrier sheet side.
In FIG. 8, one insulating film is overlapped and attached to the carrier sheet so as to sandwich the first and second wiring pattern portions, and the carrier sheet is peeled off from the one insulating film and the first, It is a top view which shows the state which transcribe | transferred the 2nd wiring pattern part.
FIG. 12 in FIG. 8 insulates both surfaces of the first and second wiring pattern portions by attaching the other insulating film so as to sandwich the first and second wiring pattern portions on one insulating film. It is a top view which shows the state coat | covered with the film.
FIG. 13 is a plan view showing a state in which the first and second wiring pattern portions are separated from the outer edge portion of the insulating film to obtain a flexible flat wiring body in FIG. 8;
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 11 Drum 13 Conductor foil 15 Pattern punching machine 17 Electronic component 19 1st wiring pattern part 21 Scrap collector 23 Electronic component mounting machine 25 Pattern punching machine 26 Outer edge part 27 Second wiring pattern part 29 Scrap collector 31 Drum 33 Insulating film 35 Insulating film pasting machine 37 Wiring pattern part die cutting machine 39 Flexible flat wiring body 41 Scrap collector 43 Drum 45 Carrier sheet 47 Carrier sheet pasting machine 49 Pattern punching machine 51 Drum 53 First insulating film pasting machine 55 Second insulating film pasting machine 57 Drum 59 Wiring pattern part die cutting machine 60 Outer edge part 61 Flexible flat wiring body

Claims (2)

In a manufacturing method of a flexible flat wiring body in which a conductive foil is punched to form a wiring pattern portion, both surfaces of the wiring pattern portion are covered with an insulating film, and an electronic component is mounted on the wiring pattern portion. First, the conductive foil in the component mounting area where the component is mounted is punched first to form the first wiring pattern portion, and electronic components are mounted in advance on the wiring pattern portion, and then the conductor in the wiring region other than the component mounting region A method for producing a flexible flat wiring body, comprising: punching a foil to form a second wiring pattern portion, and covering both surfaces of the first and second wiring pattern portions with an insulating film. A carrier sheet is affixed to a conductor foil having an electronic component mounted on the first wiring pattern portion, and a second wiring pattern portion is formed by punching the conductor foil in a wiring region other than the component mounting region. 2 Separate the wiring pattern part from the outer edge part of the non-wiring area, peel off the outer edge part of the conductor foil from the carrier sheet, leaving the first and second wiring pattern parts on the carrier sheet side, and the first and second wirings on the carrier sheet. One insulating film is laminated and pasted so as to sandwich the pattern portion, the carrier sheet is peeled off from one insulating film, the first and second wiring pattern portions are transferred to the film, and the first and second wiring films are transferred to the first insulating film. By overlaying and pasting the other insulating film so as to sandwich the second wiring pattern portion, both surfaces of the first and second wiring pattern portions are covered with the insulating film. Method of manufacturing a flexible flat wiring body according to claim 1, characterized in that the covering.

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