JP4100315B2 - 電気光学装置の製造方法 - Google Patents

電気光学装置の製造方法 Download PDF

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Publication number
JP4100315B2
JP4100315B2 JP2003337820A JP2003337820A JP4100315B2 JP 4100315 B2 JP4100315 B2 JP 4100315B2 JP 2003337820 A JP2003337820 A JP 2003337820A JP 2003337820 A JP2003337820 A JP 2003337820A JP 4100315 B2 JP4100315 B2 JP 4100315B2
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Japan
Prior art keywords
conductive particles
substrate
semiconductor device
electro
bumps
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Expired - Fee Related
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JP2003337820A
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English (en)
Japanese (ja)
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JP2005108992A (ja
JP2005108992A5 (enExample
Inventor
敏一 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
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Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP2003337820A priority Critical patent/JP4100315B2/ja
Publication of JP2005108992A publication Critical patent/JP2005108992A/ja
Publication of JP2005108992A5 publication Critical patent/JP2005108992A5/ja
Application granted granted Critical
Publication of JP4100315B2 publication Critical patent/JP4100315B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Liquid Crystal (AREA)
  • Wire Bonding (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP2003337820A 2003-09-29 2003-09-29 電気光学装置の製造方法 Expired - Fee Related JP4100315B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003337820A JP4100315B2 (ja) 2003-09-29 2003-09-29 電気光学装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003337820A JP4100315B2 (ja) 2003-09-29 2003-09-29 電気光学装置の製造方法

Publications (3)

Publication Number Publication Date
JP2005108992A JP2005108992A (ja) 2005-04-21
JP2005108992A5 JP2005108992A5 (enExample) 2006-04-13
JP4100315B2 true JP4100315B2 (ja) 2008-06-11

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ID=34533529

Family Applications (1)

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JP2003337820A Expired - Fee Related JP4100315B2 (ja) 2003-09-29 2003-09-29 電気光学装置の製造方法

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JP (1) JP4100315B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101309319B1 (ko) 2006-11-22 2013-09-13 삼성디스플레이 주식회사 액정표시장치 구동회로 및 그의 제조방법과 액정표시장치구동회로가 실장 된 액정표시장치
KR20220097742A (ko) * 2020-12-31 2022-07-08 삼성디스플레이 주식회사 표시 장치 및 표시 장치 제조 방법

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Publication number Publication date
JP2005108992A (ja) 2005-04-21

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