JP4095354B2 - Metal substrate and manufacturing method thereof - Google Patents

Metal substrate and manufacturing method thereof Download PDF

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JP4095354B2
JP4095354B2 JP2002178004A JP2002178004A JP4095354B2 JP 4095354 B2 JP4095354 B2 JP 4095354B2 JP 2002178004 A JP2002178004 A JP 2002178004A JP 2002178004 A JP2002178004 A JP 2002178004A JP 4095354 B2 JP4095354 B2 JP 4095354B2
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adhesive
wiring board
metal plate
printed wiring
printed
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JP2004022922A (en
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康夫 河嶋
聡 柳浦
伊知郎 城川
政明 村上
洋一 北村
顯 津村
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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【０００１】
【発明の属する技術分野】
この発明は、金属板とプリント配線板を接着剤により貼り合わせた金属基板に関するものである。
【０００２】
【従来の技術】
従来、金属板とプリント配線板を接着する方法として、例えば特開平０５−２５９６５０号広報に示されているように、金属板とプリント配線板の間に接着剤シートを挟み、加熱・加圧することにより貼り合わる技術が広く知られている。このような金属基板は、図７に示すように、金属板１と導電パターン４及びスルーホール５を有するプリント配線板３との間に、半硬化性の接着剤シート（プリプレグ）等を挟み、加熱・加圧することにより形成していた。
【０００３】
【発明が解決しようとする課題】
上記従来の金属基板の製造方法では、プリント配線板３の表面の凹凸やそりを吸収するために、厚めの接着剤層２が必要となり、加熱・加圧時に接着剤がプリント配線板３に設けられたスルーホール５を通って裏面（図７の２０ａ）に到達して、導体パターン４を汚染するという問題があった。また、金属基板の端面から接着剤がはみ出してしまい（図７の２０ｂ）、外形サイズにバラツキが生じるという問題もあった。
【０００４】
また、金属基板が高周波用途に使用される場合、接着剤に導電性および高放熱性が要求され、プリント配線板３の導体パターン４と金属板１との間の接着層２を薄くする必要があり、プリント配線板３のそり、凹凸を吸収することができず、凹部内へ接着剤が充分流れ込まず、凹部〜金属板間で未接着となる等の問題があった。
【０００５】
この発明は、上記のような問題点を解消するためになされたものであり、金属板とプリント配線板を貼り合わせる接着剤の基板からのはみ出しや接着不良を防止すると共に、導電性と高放熱性が要求される部分の接着剤の厚みを薄くすることを目的とする。
【０００６】
【課題を解決するための手段】
請求項１の発明は、金属板と、この金属板の一主面又は両主面に配置されたプリント配線板を接着剤により一体化させる金属基板の製造方法において、導体パターンを除いた凹部に接着剤を印刷したプリント配線板と、一主面又は両主面の全面に接着剤を印刷した金属板とを貼り合わせたことを特徴とする。
【０００７】
請求項２の発明は、金属板と、この金属板の一主面又は両主面に配置されたプリント配線板を接着剤により一体化させる金属基板の製造方法において、上記プリント配線板に形成された導体パターンの放熱部分および金属板との導通部分を除いた面をレジストで被覆し、上記プリント配線板の放熱部分および金属板との導通部分に導電性の接着剤を印刷し、上記導電性の接着剤を印刷したプリント配線板と全面に導電性の接着剤を印刷した金属板とを貼り合わせたことを特徴とする。
【０００８】
請求項３の発明は、請求項１の発明において、プリント配線板の導体パターンを除いた凹部に、導体パターンより高さが高く、かつ導体パターンと接着剤の間に空隙が出来るように接着剤を印刷し、導体パターンより突出した接着剤の体積が上記空隙の体積と同体積になるようにしたことを特徴とする。
【０００９】
請求項４の発明は、金属板と、この金属板の一主面又は両主面に配置されたプリント配線板を接着剤により一体化させた金属基板において、プリント配線板の導体パターンを除いた凹部と上記金属板の間に非導電性接着剤を、上記プリント配線板の導体パターンと上記金属板との間に導電性接着剤を形成したことを特徴とする。
【００１０】
請求項５の発明は、金属板と、この金属板の一主面又は両主面に配置されたプリント配線板を接着剤により一体化させる金属基板の製造方法において、プリント配線板の導体パターンを除いた凹部に非導電性接着剤を印刷したプリント配線板と、非導電性接着剤に対向する部分を除いた全面に導電性接着剤を印刷した金属板とを貼り合わせたことを特徴とする。
【００１１】
請求項６の発明は、金属板と、この金属板の一主面又は両主面に配置されたプリント配線板を接着剤により一体化させた金属基板において、プリント配線板の導体パターンを除いた凹部と上記金属板の間に熱伝導性接着剤を、上記プリント配線板の導体パターンと上記金属板との間に導電性接着剤を形成したことを特徴とする。
【００１２】
請求項７の発明は、金属板と、この金属板の一主面又は両主面に配置されたプリント配線板を接着剤により一体化させる金属基板の製造方法において、導体パターンを除いた凹部に熱伝導性接着剤を印刷したプリント配線板と、熱伝導性接着剤に対向する部分を除いた全面に導電性接着剤を印刷した金属板とを貼り合わせたことを特徴とする。
【００１４】
【発明の実施の形態】
実施の形態１．
図１はこの発明の実施の形態１による金属基板の製造工程を示す断面図であり、以下、図１に基づいて、金属板とプリント配線板を接着剤で貼り付ける方法について説明する。
【００１５】
まず、図１（ａ）及び（ｂ）に示すように、金属板１に接着剤２ａを印刷塗布する。ここで、金属板１への接着剤２ａの塗布は、後述するプリント配線板３の導体パターン４から金属板１への熱抵抗を考慮した厚み、例えば１０〜５０μｍの厚みを持つようにスクリーン印刷により形成する。
【００１６】
一方、図１（ｃ）に示すように、プリント配線板３にはその表裏面に導体パターン４が形成されている。また、プリント配線板３が例えば高周波基板の場合、高周波特性確保のために導体パターン４にはアースに接続するためのスルーホール５が多数形成されている。また、構成部品のはんだ接続のため、導体パターン４の最表層には、金めっきが施されている。
【００１７】
図１（ｄ）は上記プリント配線板３に接着剤２ｂを塗布した図を示し、ここでの接着剤２ｂは、プリント配線板３の導体パターン４を除いた部分６にのみスクリーン印刷により塗布する。この時、塗布する接着剤２ｂの厚みは導体パターン４の高さより大きく、また導体パターン４と接着剤２ｂの間には、空隙が出来るように印刷する。
【００１８】
次に、図１（ｅ）に示すように、接着剤２ａが塗布された金属板１と、接着剤２ｂが塗布されたプリント配線板３とを貼り合わせ、図１（ｆ）に示すように、錘７により０.１kgf/cm2の荷重を接着剤２に与え、室温〜１７５℃で１時間〜１２時間程度、接着剤硬化を行う。
【００１９】
以上のように実施の形態１によれば、金属板１とプリント配線板３の間の全面の接着面圧がほぼ一様となって、接着剤２がプリント配線板３の端面より部分的にはみ出すことが無くなり、また接着剤２がスルーホール５を通ってプリント配線板３表面の導体パターン４を短絡させることを防止し、また、プリント配線板３の導体パターン４を除いた部分６で未接着が発生することも防止できる。
【００２０】
なお、接着面圧力による僅かな量の接着剤２のはみ出しは、導体パターン４と接着剤２との空隙に退避できるため、上記はみ出しによる弊害を防止することが出来る。通常、導体パターン４は最表層が金めっきのため、接着剤２との密着性に劣るが、導体パターン４を除いた部分６と接着していることにより、全体として良好な密着性が確保できる。
【００２１】
実施の形態２．
図２はこの発明の実施の形態２による金属基板の製造工程を示す断面図であり、以下、図２に基づいて、金属板とプリント配線板を接着剤で貼り付ける方法について説明する。
【００２２】
まず、図２（ａ）及び（ｂ）に示すように、金属板１に接着剤２ａを印刷塗布する。ここで、金属板１への接着剤２ａの塗布は、後述するプリント配線板３の導体パターン４から金属板１への熱抵抗を考慮した厚み、例えば１０〜５０μｍの厚みを持つようにスクリーン印刷により形成する。
【００２３】
一方、図２（ｃ）に示すように、プリント配線板３にはその表裏面に導体パターン４が形成されており、プリント配線板３が例えば高周波基板の場合、高周波特性確保のために導体パターン４にはアースに接続するためのスルーホール５が多数形成されている。また、導体パターン４の放熱／導通部分９以外の部分をレジスト８で被覆し、導体パターン４の放熱／導通部分９のみに金めっきが施されている。
【００２４】
そして、図２（ｄ）に示すように、導体パターン４の放熱／導通部分９にのみスクリーン印刷により接着剤２を印刷する。その際、接着剤２の厚みはレジスト８の高さより大きく、またレジスト８と接着剤２の間には、空隙が出来るように印刷する。
【００２５】
その後は、図２（ｅ）及び（ｆ）に示すように、接着剤２ａが塗布された金属板１と、接着剤２ｂが塗布されたプリント配線板３とを貼り合わせ、錘７により０.１kgf/cm2の荷重を接着剤２に与え、室温〜１７５℃で１時間〜１２時間程度、接着剤硬化を行う。
【００２６】
以上のように実施の形態２によれば、金属板１とプリント配線板３の間の全面の接着面圧がほぼ一様となって、接着剤２が部分的にはみ出すことが無くなり、接着剤２がスルーホール５を通ってプリント配線板３表面の導体パターン４を短絡させることを防止し、また、プリント配線板３の放熱／導通部分９と金属板１の間で未接着が発生することを防止できる。
【００２７】
なお、接着面圧力による僅かな量の接着剤２はみ出しは、レジスト８と接着剤２ｂの空隙に退避できるため、上記はみ出しによる弊害を防止することが出来る。通常、放熱／導通部分９は最表層が金めっきのため、接着剤２との密着性が劣るが、レジスト８と接着していることにより、全体として良好な密着性が確保できる。
【００２８】
実施の形態３．
図３はこの発明の実施の形態３による金属基板の製造工程を示す断面図であり、以下、図３に基づいて、金属板とプリント配線板を接着剤で貼り付ける方法について説明する。
【００２９】
まず、図３（ａ）及び（ｂ）に示すように、金属板１に接着剤２ａを印刷塗布する。その後、図３（ｃ）に示すように、金属板１の接着剤２ａ上に、例えばテフロン基板（テフロンは登録商標）に代表される接着剤２ａが付着しにくい抑え板１０を載せ、その上に錘１１を搭載して接着剤２ａの表面を平坦化する。
【００３０】
一方、図３（ｄ）及び（ｅ）に示すように、プリント配線板３の導体パターン４を除いた部分６にスクリーン印刷により接着剤２ｂを塗布する。この時、塗布する接着剤２ｂの厚みは導体パターン４の高さより大きく、また導体パターン４と接着剤２ｂの間には、空隙が出来るように印刷する。
【００３１】
次に、図３（ｆ）に示すように、プリント配線板３に形成した接着剤２ｂ上に、例えばテフロン基板（テフロンは登録商標）に代表される接着剤２ｂが付着しにくい抑え板１０を載せ、その上に錘１１を搭載して接着剤２ｂの表面を平坦化する。この時、図３（ｉ）に示すように、プリント配線板３の接着剤２ｂの導体パターン４から突出した部分１２の体積が、導体パターン４と接着剤２ｂとの境界に設けられた空隙１３の体積とほぼ同じになる様に接着剤２ｂの高さを錘１１の重量により調節する。
【００３２】
その後は、図３（ｇ）及び（ｈ）に示すように、接着剤２ａが塗布された金属板１と、接着剤２ｂが塗布されたプリント配線板３とを貼り合わせ、錘７により０.１kgf/cm2の荷重を接着剤２に与え、室温〜１７５℃で１時間〜１２時間程度、接着剤硬化を行う。
【００３３】
以上のように実施の形態３によれば、金属板１とプリント配線板３との間の接着面圧力による僅かな量の接着剤２のはみ出しは、導体パターン４と接着剤２との境界に設けられた空隙に退避できるため、上記はみ出しによる弊害をより高精度に防止することが出来る。
【００３４】
実施の形態４．
図４はこの発明の実施の形態４による金属基板の製造工程を示す断面図であり、以下、図４に基づいて、金属板とプリント配線板を接着剤で貼り付ける方法について説明する。
【００３５】
図４（ｃ）及び（ｄ）に示すように、プリント配線板３の導体パターン４を除いた部分６にスクリーン印刷により非導電性接着剤１４を塗布する。この時、塗布する接着剤１４の厚みは導体パターン４の高さより大きく、また導体パターン４と接着剤１４の間には、空隙が出来るように印刷する。
【００３６】
一方、図４（ａ）及び（ｂ）に示すように、金属板１に、プリント配線板３に印刷された非導電性接着剤１４と対向する部分を除いた全面に導電性接着剤１６を印刷する。
【００３７】
その後は、図２（ｅ）及び（ｆ）に示すように、導電性接着剤１６が塗布された金属板１と、非導電性接着剤１４が塗布されたプリント配線板３とを貼り合わせ、錘７による荷重を双方の接着剤に与えて貼り付ける。
【００３８】
以上のように実施の形態４によれば、プリント配線板３の導体パターン４と金属板１との間に導電性接着剤１６を介在させることにより放熱性と導電性を確保することができる。また、導電性接着剤１６に比べて密着性に優れる非導電性接着剤１４を導体パターン４を除いた部分６と金属板１の間に介在させることにより密着性を向上させることができる。更に、非導電性接着剤１４の使用により、接着剤コストを低減できる。
【００３９】
実施の形態５．
図５はこの発明の実施の形態５による、金属板とプリント配線板を貼り合わせた金属基板を示す断面図である。
【００４０】
本実施の形態では、プリント配線板３の導体パターン４を除いた部分６にスクリーン印刷により高熱伝導性接着剤１７を塗布する。この時、塗布する接着剤１７の厚みは導体パターン４の高さより大きく、また導体パターン４と接着剤１７の間には、空隙が出来るように印刷する。一方、金属板１には、プリント配線板３に印刷された高熱伝導性接着剤１７と対向する部分を除いた全面に導電性接着剤１６を印刷する。そして、導電性接着剤１６が塗布された金属板１と、高熱伝導性接着剤１７が塗布されたプリント配線板３とを貼り合わせ、錘７による荷重を双方の接着剤に与えて貼り付ける。
【００４１】
以上のように本実施の形態によれば、プリント配線板３の導体パターン４を除いた部分６にのみ高熱伝導性接着剤１７を、金属板１に導電性接着剤１６を印刷して貼り合わせたので、導電性接着剤１６のみで接着した場合に比べ、放熱性および密着性が向上する。
【００４２】
実施の形態６．
図６はこの発明の実施の形態６による、金属板とプリント配線板を貼り合わせた金属基板を示す断面図である。
【００４３】
図において、金属板１と、導電パターン４及びスルーホール５が形成されたプリント配線板３とは、双方に印刷された接着剤２により貼り合わされている。プリント配線板３と接着剤層２は、スルーホール３の位置では、最表面がＡｕ等のめっきが施された導体パターン４と接着されているため、密着性が乏しいが、スルーホール３間では、導体パターン４を除いた凹部６と樹脂同士等の強固な接着がなされている。そして、このプリント配線板３に配設するスルーホール５間のピッチを、内外層に配線された高周波回路から発生する電磁波の波長（λ）の１／４以下でかつ最大になるようにする。また、各スルーホール５間に可能な限り導体パターン４を除いた部分６を設ける。
【００４４】
本実施の形態によれば、高周波回路から発生する電磁波の漏れをシールドすることができ、他の回路に悪影響を与えることがない。その結果、高周波特性に優れかつプリント配線板と金属板との密着性に優れた金属基板を提供することができる。
【００４５】
【発明の効果】
以上のようにこの発明によれば、以下に述べる効果を達成する。
【００４６】
請求項１の発明によれば、プリント配線板の導体パターンを除いた凹部と金属板と間の接着が、プリント配線板側に印刷した接着剤により確実になされるため、金属板とプリント配線板の導体パターンとの接着剤膜厚を最小限にすることができる。その結果、例えば高周波プリント配線板に要求される放熱性、導電性を満足すると共に、金属基板端面からの接着剤のはみ出しやプリント配線板の導体パターンに設けられたスルーホールからの接着剤のしみ出しを防止することができる。また、プリント配線板の導体パターンは部品のはんだ付のため、通常、最表面が金めっきが施されており、一般に接着剤との密着性に劣るが、導体パターンを除いた凹部と金属板が接着されているため、全体として良好な密着性を確保することができる。
【００４７】
請求項２の発明によれば、プリント配線板の導体パターンは部品のはんだ付のため、最表面が金めっきされており、一般に接着剤との密着性に劣るが、被覆されたレジストと金属板が接着されているため、全体として良好な密着性を確保することができる。また、導体パターンを分断することなく、接着がなされるため、強固なアースを設けることができ、高周波特性に優れる。
【００４８】
請求項３の発明によれば、接着剤のはみ出し量をより高精度に制御することができる。
【００４９】
請求項４及び請求項５の発明において、プリント配線板の導体パターンと金属板とは放熱およびアースを取るために導電性接着剤を使うが、プリント配線板の導体パターン以外の面はアースを取る必要もなく、非導電性接着剤を使用してもかまわない。一般的に非導電性接着剤は導電性接着剤に比べて接着力が強いためこのようにすることにより、接合強度を大きくすることが出来る。
【００５０】
請求項６及び請求項７の発明によれば、プリント配線板の導体パターンと金属板とは放熱およびアースを取るために導電性接着剤を使うが、プリント配線板の導体パターン以外の面はアースを取る必要もなく、非導電性接着剤を使用してもかまわないが、搭載素子の発熱が大きい場合は、高熱伝導性接着剤を用いることにより、接着性を確保しつつ放熱性を高めることが出来る。
【図面の簡単な説明】
【図１】 この発明の実施の形態１による金属基板の製造工程を示す断面図である。
【図２】 この発明の実施の形態２による金属基板の製造工程を示す断面図である。
【図３】 この発明の実施の形態３による金属基板の製造工程を示す断面図である。
【図４】 この発明の実施の形態４による金属基板の製造工程を示す断面図である。
【図５】 この発明の実施の形態５による金属基板を示す断面図である。
【図６】 この発明の実施の形態６による金属基板を示す断面図である。
【図７】 従来の金属基板を示す断面図である。
【符号の説明】
１ 金属板、２，２ａ，２ｂ 接着剤、３ プリント配線板、４ 導体パターン、５ スルーホール、６ 凹部、７ 錘、８ レジスト、１０ 抑え板、１１錘、１４ 非導電性接着剤、１６ 導電性接着剤、１７ 高熱伝導性接着剤。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a metal substrate in which a metal plate and a printed wiring board are bonded together with an adhesive.
[0002]
[Prior art]
Conventionally, as a method of adhering a metal plate and a printed wiring board, for example, as disclosed in Japanese Patent Application Laid-Open No. 05-259650, an adhesive sheet is sandwiched between the metal plate and the printed wiring board, and then applied by heating and pressing. The matching technology is widely known. As shown in FIG. 7, such a metal substrate sandwiches a semi-curable adhesive sheet (prepreg) or the like between the metal plate 1 and the printed wiring board 3 having the conductive pattern 4 and the through hole 5. It was formed by heating and pressing.
[0003]
[Problems to be solved by the invention]
In the above conventional method for manufacturing a metal substrate, a thick adhesive layer 2 is required to absorb irregularities and warpage on the surface of the printed wiring board 3, and the adhesive is provided on the printed wiring board 3 during heating and pressing. There is a problem that the conductive pattern 4 is contaminated by reaching the back surface (20a in FIG. 7) through the through-hole 5 formed. In addition, the adhesive protrudes from the end face of the metal substrate (20b in FIG. 7), and there is a problem that the outer size varies.
[0004]
When the metal substrate is used for high frequency applications, the adhesive is required to have conductivity and high heat dissipation, and the adhesive layer 2 between the conductor pattern 4 of the printed wiring board 3 and the metal plate 1 needs to be thin. There is a problem that the warp and unevenness of the printed wiring board 3 cannot be absorbed, the adhesive does not sufficiently flow into the recess, and the adhesive is not bonded between the recess and the metal plate.
[0005]
The present invention has been made to solve the above-mentioned problems, and prevents the adhesive that bonds the metal plate and the printed wiring board from sticking out from the substrate and poor adhesion, and also provides conductivity and high heat dissipation. The purpose is to reduce the thickness of the adhesive at the part where the property is required.
[0006]
[Means for Solving the Problems]
According to a first aspect of the present invention, there is provided a method for manufacturing a metal substrate in which a metal plate and a printed wiring board disposed on one or both main surfaces of the metal plate are integrated with an adhesive. A printed wiring board printed with an adhesive and a metal plate printed with an adhesive on the entire surface of one main surface or both main surfaces are bonded together.
[0007]
According to a second aspect of the present invention, there is provided a metal substrate manufacturing method in which a metal plate and a printed wiring board disposed on one or both main surfaces of the metal plate are integrated with an adhesive, and formed on the printed wiring board. a surface excluding the conductive portion of the heat radiation portion and the metal plate conductor pattern was coated with resist, and printing the conductive adhesive on the conductive portion of the heat radiation portion and the metal plate of the printed wiring board, the conductive characterized in that the adhesive printed printed circuit board and the whole surface of the bonding the conductive metal plate where the adhesive is printed.
[0008]
The invention of claim 3 is an adhesive according to the invention of claim 1, in which the height of the recessed portion excluding the conductor pattern of the printed wiring board is higher than the conductor pattern and a gap is formed between the conductor pattern and the adhesive. The volume of the adhesive protruding from the conductor pattern is the same as the volume of the gap.
[0009]
The invention of claim 4 is a metal substrate in which a metal plate and a printed wiring board disposed on one or both main surfaces of the metal plate are integrated with an adhesive, and the conductor pattern of the printed wiring board is removed. A non-conductive adhesive is formed between the recess and the metal plate, and a conductive adhesive is formed between the conductor pattern of the printed wiring board and the metal plate.
[0010]
The invention of claim 5 includes a metal plate, in the manufacturing method of the metal substrate to be integrated by the adhesive printed wiring board which is arranged on one main surface or both main surfaces of the metal plate, the conductor pattern of the printed wiring board A printed wiring board printed with a non-conductive adhesive in the removed recess and a metal plate printed with a conductive adhesive on the entire surface excluding the portion facing the non-conductive adhesive .
[0011]
The invention according to claim 6 is a metal substrate in which a metal plate and a printed wiring board disposed on one or both main surfaces of the metal plate are integrated with an adhesive, and the conductor pattern of the printed wiring board is removed. A heat conductive adhesive is formed between the recess and the metal plate, and a conductive adhesive is formed between the conductor pattern of the printed wiring board and the metal plate.
[0012]
The invention of claim 7, a metal plate, in the manufacturing method of the metal substrate to be integrated by the adhesive printed wiring board which is arranged on one main surface or both main surfaces of the metal plate, the recess except for conductor patterns It is characterized in that a printed wiring board printed with a heat conductive adhesive and a metal plate printed with a conductive adhesive on the entire surface excluding a portion facing the heat conductive adhesive are bonded together.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
Embodiment 1 FIG.
FIG. 1 is a cross-sectional view showing a metal substrate manufacturing process according to Embodiment 1 of the present invention. Hereinafter, a method of attaching a metal plate and a printed wiring board with an adhesive will be described with reference to FIG.
[0015]
First, as shown in FIGS. 1A and 1B, an adhesive 2 a is printed on the metal plate 1. Here, the adhesive 2a is applied to the metal plate 1 by screen printing so as to have a thickness in consideration of the thermal resistance from the conductor pattern 4 of the printed wiring board 3 to the metal plate 1 to be described later, for example, 10 to 50 μm. To form.
[0016]
On the other hand, as shown in FIG. 1C, the printed wiring board 3 has conductor patterns 4 formed on the front and back surfaces thereof. When the printed wiring board 3 is, for example, a high-frequency board, the conductor pattern 4 has a large number of through holes 5 for connection to the ground in order to ensure high-frequency characteristics. In addition, gold plating is applied to the outermost layer of the conductor pattern 4 for solder connection of the component parts.
[0017]
FIG. 1 (d) shows a diagram in which an adhesive 2 b is applied to the printed wiring board 3, and the adhesive 2 b here is applied only to a portion 6 of the printed wiring board 3 excluding the conductor pattern 4 by screen printing. . At this time, the thickness of the adhesive 2b to be applied is larger than the height of the conductor pattern 4, and printing is performed so that a gap is formed between the conductor pattern 4 and the adhesive 2b.
[0018]
Next, as shown in FIG. 1 (e), the metal plate 1 coated with the adhesive 2a and the printed wiring board 3 coated with the adhesive 2b are bonded together, as shown in FIG. 1 (f). Then, a weight of 0.1 kgf / cm 2 is applied to the adhesive 2 by the weight 7 and the adhesive is cured at room temperature to 175 ° C. for about 1 hour to 12 hours.
[0019]
As described above, according to the first embodiment, the adhesive surface pressure on the entire surface between the metal plate 1 and the printed wiring board 3 becomes substantially uniform, and the adhesive 2 is partially from the end surface of the printed wiring board 3. This prevents the adhesive 2 from short-circuiting the conductive pattern 4 on the surface of the printed wiring board 3 through the through-hole 5, and also prevents the adhesive 6 from remaining in the portion 6 of the printed wiring board 3 excluding the conductive pattern 4. The occurrence of adhesion can also be prevented.
[0020]
In addition, since the protrusion of the slight amount of the adhesive 2 due to the adhesive surface pressure can be retreated into the gap between the conductor pattern 4 and the adhesive 2, the adverse effect due to the protrusion can be prevented. Usually, the conductive pattern 4 is inferior in adhesiveness with the adhesive 2 because the outermost layer is gold plating, but by adhering to the portion 6 excluding the conductive pattern 4, good overall adhesiveness can be secured. .
[0021]
Embodiment 2. FIG.
FIG. 2 is a cross-sectional view showing a metal substrate manufacturing process according to Embodiment 2 of the present invention. Hereinafter, a method for attaching a metal plate and a printed wiring board with an adhesive will be described with reference to FIG.
[0022]
First, as shown in FIGS. 2A and 2B, an adhesive 2 a is printed on the metal plate 1. Here, the adhesive 2a is applied to the metal plate 1 by screen printing so as to have a thickness in consideration of the thermal resistance from the conductor pattern 4 of the printed wiring board 3 to the metal plate 1 to be described later, for example, 10 to 50 μm. To form.
[0023]
On the other hand, as shown in FIG. 2 (c), the printed wiring board 3 has conductor patterns 4 formed on the front and back surfaces. When the printed wiring board 3 is a high-frequency substrate, for example, the conductive pattern is used to ensure high-frequency characteristics. A number of through holes 5 for connecting to the ground are formed in 4. Further, a portion other than the heat dissipation / conduction portion 9 of the conductor pattern 4 is covered with a resist 8, and only the heat dissipation / conduction portion 9 of the conductor pattern 4 is plated with gold.
[0024]
Then, as shown in FIG. 2 (d), the adhesive 2 is printed by screen printing only on the heat radiation / conduction portion 9 of the conductor pattern 4. At this time, the thickness of the adhesive 2 is larger than the height of the resist 8, and printing is performed so that a gap is formed between the resist 8 and the adhesive 2.
[0025]
Thereafter, as shown in FIGS. 2 (e) and 2 (f), the metal plate 1 coated with the adhesive 2 a and the printed wiring board 3 coated with the adhesive 2 b are bonded to each other with a weight 7. A load of 1 kgf / cm 2 is applied to the adhesive 2 and the adhesive is cured at room temperature to 175 ° C. for about 1 to 12 hours.
[0026]
As described above, according to the second embodiment, the adhesive surface pressure on the entire surface between the metal plate 1 and the printed wiring board 3 becomes substantially uniform, and the adhesive 2 does not partially protrude. 2 prevents the conductor pattern 4 on the surface of the printed wiring board 3 from being short-circuited through the through-hole 5, and non-adhesion occurs between the heat dissipation / conduction portion 9 of the printed wiring board 3 and the metal plate 1. Can be prevented.
[0027]
In addition, since a slight amount of the adhesive 2 protruding due to the adhesive surface pressure can be retreated into the gap between the resist 8 and the adhesive 2b, the above-described adverse effects due to the protrusion can be prevented. Usually, the heat dissipation / conduction portion 9 is inferior in adhesion to the adhesive 2 because the outermost layer is gold-plated, but by adhering to the resist 8, good adhesion can be ensured as a whole.
[0028]
Embodiment 3 FIG.
FIG. 3 is a cross-sectional view showing a metal substrate manufacturing process according to Embodiment 3 of the present invention. Hereinafter, a method of attaching a metal plate and a printed wiring board with an adhesive will be described with reference to FIG.
[0029]
First, as shown in FIGS. 3A and 3B, an adhesive 2 a is printed on the metal plate 1. Thereafter, as shown in FIG. 3 (c), on the adhesive 2a of the metal plate 1, for example, a restraining plate 10 to which an adhesive 2a typified by a Teflon substrate (Teflon is a registered trademark) hardly adheres is placed. The weight 11 is mounted on the surface to flatten the surface of the adhesive 2a.
[0030]
On the other hand, as shown in FIGS. 3D and 3E, an adhesive 2b is applied to the portion 6 of the printed wiring board 3 excluding the conductor pattern 4 by screen printing. At this time, the thickness of the adhesive 2b to be applied is larger than the height of the conductor pattern 4, and printing is performed so that a gap is formed between the conductor pattern 4 and the adhesive 2b.
[0031]
Next, as shown in FIG. 3 (f), on the adhesive 2b formed on the printed wiring board 3, for example, a holding plate 10 on which an adhesive 2b represented by a Teflon substrate (Teflon is a registered trademark) is difficult to adhere. The weight 11 is mounted thereon, and the surface of the adhesive 2b is flattened. At this time, as shown in FIG. 3I, the volume of the portion 12 protruding from the conductor pattern 4 of the adhesive 2b of the printed wiring board 3 is the gap 13 provided at the boundary between the conductor pattern 4 and the adhesive 2b. The height of the adhesive 2b is adjusted by the weight of the weight 11 so as to be substantially the same as the volume of the weight 11.
[0032]
Thereafter, as shown in FIGS. 3 (g) and (h), the metal plate 1 coated with the adhesive 2a and the printed wiring board 3 coated with the adhesive 2b are bonded together, and the weight 7 is adjusted to 0.5. A load of 1 kgf / cm 2 is applied to the adhesive 2 and the adhesive is cured at room temperature to 175 ° C. for about 1 to 12 hours.
[0033]
As described above, according to the third embodiment, a slight amount of the adhesive 2 protruding due to the adhesive surface pressure between the metal plate 1 and the printed wiring board 3 is at the boundary between the conductor pattern 4 and the adhesive 2. Since it is possible to retreat into the provided gap, it is possible to prevent the adverse effects caused by the protrusions with higher accuracy.
[0034]
Embodiment 4 FIG.
FIG. 4 is a cross-sectional view showing a metal substrate manufacturing process according to Embodiment 4 of the present invention. Hereinafter, a method of attaching a metal plate and a printed wiring board with an adhesive will be described with reference to FIG.
[0035]
As shown in FIGS. 4C and 4D, a non-conductive adhesive 14 is applied to the portion 6 of the printed wiring board 3 excluding the conductor pattern 4 by screen printing. At this time, the thickness of the adhesive 14 to be applied is larger than the height of the conductor pattern 4, and printing is performed so that a gap is formed between the conductor pattern 4 and the adhesive 14.
[0036]
On the other hand, as shown in FIGS. 4A and 4B, the conductive adhesive 16 is applied to the entire surface of the metal plate 1 except for the portion facing the nonconductive adhesive 14 printed on the printed wiring board 3. Print.
[0037]
After that, as shown in FIGS. 2E and 2F, the metal plate 1 coated with the conductive adhesive 16 and the printed wiring board 3 coated with the non-conductive adhesive 14 are bonded together. The load by the weight 7 is applied to both adhesives and pasted.
[0038]
As described above, according to the fourth embodiment, heat dissipation and conductivity can be ensured by interposing the conductive adhesive 16 between the conductor pattern 4 of the printed wiring board 3 and the metal plate 1. Further, the adhesion can be improved by interposing the non-conductive adhesive 14, which is superior in adhesion as compared with the conductive adhesive 16, between the portion 6 excluding the conductor pattern 4 and the metal plate 1. Further, the use of the non-conductive adhesive 14 can reduce the adhesive cost.
[0039]
Embodiment 5. FIG.
FIG. 5 is a sectional view showing a metal substrate on which a metal plate and a printed wiring board are bonded together according to Embodiment 5 of the present invention.
[0040]
In the present embodiment, the high thermal conductive adhesive 17 is applied to the portion 6 of the printed wiring board 3 excluding the conductor pattern 4 by screen printing. At this time, the thickness of the adhesive 17 to be applied is larger than the height of the conductor pattern 4, and printing is performed so that a gap is formed between the conductor pattern 4 and the adhesive 17. On the other hand, the conductive adhesive 16 is printed on the entire surface of the metal plate 1 except for the portion facing the high thermal conductive adhesive 17 printed on the printed wiring board 3. Then, the metal plate 1 to which the conductive adhesive 16 is applied and the printed wiring board 3 to which the high thermal conductive adhesive 17 is applied are bonded together, and the load by the weight 7 is applied to both the adhesives to be bonded.
[0041]
As described above, according to the present embodiment, the high thermal conductive adhesive 17 is printed only on the portion 6 of the printed wiring board 3 excluding the conductor pattern 4 and the conductive adhesive 16 is printed on the metal plate 1 and bonded together. Therefore, compared with the case where it adhere | attaches only with the conductive adhesive 16, heat dissipation and adhesiveness improve.
[0042]
Embodiment 6 FIG.
FIG. 6 is a cross-sectional view showing a metal substrate on which a metal plate and a printed wiring board are bonded according to Embodiment 6 of the present invention.
[0043]
In the figure, a metal plate 1 and a printed wiring board 3 on which a conductive pattern 4 and a through hole 5 are formed are bonded together by an adhesive 2 printed on both sides. The printed wiring board 3 and the adhesive layer 2 have poor adhesion because the outermost surface is adhered to the conductive pattern 4 plated with Au or the like at the position of the through-hole 3. The concave portion 6 excluding the conductor pattern 4 is firmly bonded to the resin or the like. Then, the pitch between the through holes 5 arranged on the printed wiring board 3 is set to ¼ or less of the wavelength (λ) of the electromagnetic wave generated from the high frequency circuit wired on the inner and outer layers. Further, a portion 6 excluding the conductor pattern 4 as much as possible is provided between the through holes 5.
[0044]
According to the present embodiment, leakage of electromagnetic waves generated from the high frequency circuit can be shielded, and other circuits are not adversely affected. As a result, it is possible to provide a metal substrate that has excellent high-frequency characteristics and excellent adhesion between the printed wiring board and the metal plate.
[0045]
【The invention's effect】
As described above, according to the present invention, the following effects are achieved.
[0046]
According to the first aspect of the present invention, since the adhesion between the concave portion excluding the conductor pattern of the printed wiring board and the metal plate is surely made by the adhesive printed on the printed wiring board side, the metal plate and the printed wiring board. It is possible to minimize the adhesive film thickness with the conductor pattern. As a result, for example, it satisfies the heat dissipation and electrical conductivity required for high-frequency printed wiring boards, and the adhesive sticks out from the end face of the metal substrate and through the through holes provided in the conductor pattern of the printed wiring board. It is possible to prevent the sticking out. In addition, the conductor pattern of the printed wiring board is usually soldered to the parts, so the outermost surface is usually gold-plated and generally has poor adhesion to the adhesive. Since it is bonded, it is possible to ensure good adhesion as a whole.
[0047]
According to the invention of claim 2, the conductive pattern of the printed wiring board is gold-plated on the outermost surface for soldering parts, and is generally inferior in adhesion to the adhesive, but the coated resist and metal plate As a result, it is possible to ensure good adhesion as a whole. Further, since the bonding is performed without dividing the conductor pattern, a strong ground can be provided and the high frequency characteristics are excellent.
[0048]
According to invention of Claim 3, the protrusion amount of an adhesive agent can be controlled with higher precision.
[0049]
In the inventions of claim 4 and claim 5, the conductive pattern of the printed wiring board and the metal plate use a conductive adhesive for heat dissipation and grounding, but the surface other than the conductive pattern of the printed wiring board is grounded. There is no need, and a non-conductive adhesive may be used. In general, a non-conductive adhesive has a stronger adhesive strength than a conductive adhesive, and thus the bonding strength can be increased.
[0050]
According to the invention of claim 6 and claim 7, the conductive pattern of the printed wiring board and the metal plate use the conductive adhesive for heat dissipation and grounding, but the surface other than the conductive pattern of the printed wiring board is grounded. It is possible to use non-conductive adhesive, but if the mounted element generates a large amount of heat, use a highly thermally conductive adhesive to increase heat dissipation while ensuring adhesiveness. I can do it.
[Brief description of the drawings]
FIG. 1 is a sectional view showing a metal substrate manufacturing process according to a first embodiment of the present invention.
FIG. 2 is a sectional view showing a metal substrate manufacturing process according to a second embodiment of the present invention.
FIG. 3 is a sectional view showing a metal substrate manufacturing process according to a third embodiment of the present invention.
FIG. 4 is a sectional view showing a metal substrate manufacturing process according to a fourth embodiment of the present invention.
FIG. 5 is a sectional view showing a metal substrate according to a fifth embodiment of the present invention.
FIG. 6 is a sectional view showing a metal substrate according to a sixth embodiment of the present invention.
FIG. 7 is a cross-sectional view showing a conventional metal substrate.
[Explanation of symbols]
1 Metal plate, 2, 2a, 2b Adhesive, 3 Printed wiring board, 4 Conductor pattern, 5 Through hole, 6 Recess, 7 Weight, 8 Resist, 10 Restraining plate, 11 Weight, 14 Non-conductive adhesive, 16 Conductive Adhesive, 17 High thermal conductive adhesive.

Claims (7)

金属板と、この金属板の一主面又は両主面に配置されたプリント配線板を接着剤により一体化させる金属基板の製造方法において、
導体パターンを除いた凹部に接着剤を印刷したプリント配線板と、一主面又は両主面の全面に接着剤を印刷した金属板とを貼り合わせたことを特徴とする金属基板の製造方法。In the method of manufacturing a metal substrate, in which a metal plate and a printed wiring board disposed on one main surface or both main surfaces of the metal plate are integrated by an adhesive,
A method for producing a metal substrate, comprising: a printed wiring board having an adhesive printed in a recess excluding a conductor pattern; and a metal plate having an adhesive printed on the entire surface of one main surface or both main surfaces. 金属板と、この金属板の一主面又は両主面に配置されたプリント配線板を接着剤により一体化させる金属基板の製造方法において、
上記プリント配線板に形成された導体パターンの放熱部分および金属板との導通部分を除いた面をレジストで被覆し、上記プリント配線板の放熱部分および金属板との導通部分に導電性の接着剤を印刷し、上記導電性の接着剤を印刷したプリント配線板と全面に導電性の接着剤を印刷した金属板とを貼り合わせたことを特徴とする金属基板の製造方法。In the method of manufacturing a metal substrate, in which a metal plate and a printed wiring board disposed on one main surface or both main surfaces of the metal plate are integrated by an adhesive,
Covering the surface except the conduction portion of the heat radiation portion and the metal plate conductor pattern formed on the printed wiring board with a resist, a conductive adhesive to a conductive portion of the heat radiation portion and the metal plate of the printed circuit board the print method for producing a metal substrate, characterized in that bonding the above conductive printed wiring board and the adhesive is printed in the entire surface metal was printed conductive adhesive plate. 上記プリント配線板の導体パターンを除いた凹部に、導体パターンより高さが高く、かつ導体パターンと接着剤の間に空隙が出来るように接着剤を印刷し、導体パターンより突出した接着剤の体積が上記空隙の体積と同体積になるようにしたことを特徴とする請求項１に記載の金属基板の製造方法。  The volume of the adhesive protruding from the conductor pattern is printed on the concave portion of the printed wiring board excluding the conductor pattern so that the height is higher than the conductor pattern and a gap is formed between the conductor pattern and the adhesive. The metal substrate manufacturing method according to claim 1, wherein the volume is the same as the volume of the gap. 金属板と、この金属板の一主面又は両主面に配置されたプリント配線板を接着剤により一体化させた金属基板において、
上記プリント配線板の導体パターンを除いた凹部と上記金属板の間に非導電性接着剤を、上記プリント配線板の導体パターンと上記金属板との間に導電性接着剤を形成したことを特徴とする金属基板。In a metal substrate in which a metal plate and a printed wiring board arranged on one main surface or both main surfaces of this metal plate are integrated with an adhesive,
A non-conductive adhesive is formed between the concave portion excluding the conductive pattern of the printed wiring board and the metal plate, and a conductive adhesive is formed between the conductive pattern of the printed wiring board and the metal plate. Metal substrate. 金属板と、この金属板の一主面又は両主面に配置されたプリント配線板を接着剤により一体化させる金属基板の製造方法において、
上記プリント配線板の導体パターンを除いた凹部に非導電性接着剤を印刷したプリント配線板と、上記非導電性接着剤に対向する部分を除いた全面に導電性接着剤を印刷した金属板とを貼り合わせたことを特徴とする金属基板の製造方法。In the method of manufacturing a metal substrate, in which a metal plate and a printed wiring board disposed on one main surface or both main surfaces of the metal plate are integrated by an adhesive,
A printed wiring board in which a non-conductive adhesive is printed in a recess excluding a conductor pattern of the printed wiring board, and a metal plate in which a conductive adhesive is printed on the entire surface excluding a portion facing the non-conductive adhesive; A method for producing a metal substrate, characterized in that: 金属板と、この金属板の一主面又は両主面に配置されたプリント配線板を接着剤により一体化させた金属基板において、
上記プリント配線板の導体パターンを除いた凹部と上記金属板の間に熱伝導性接着剤を、上記プリント配線板の導体パターンと上記金属板との間に導電性接着剤を形成したことを特徴とする金属基板。In a metal substrate in which a metal plate and a printed wiring board arranged on one main surface or both main surfaces of this metal plate are integrated with an adhesive,
A heat conductive adhesive is formed between the concave portion excluding the conductor pattern of the printed wiring board and the metal plate, and a conductive adhesive is formed between the conductor pattern of the printed wiring board and the metal plate. Metal substrate. 金属板と、この金属板の一主面又は両主面に配置されたプリント配線板を接着剤により一体化させる金属基板の製造方法において、
導体パターンを除いた凹部に熱伝導性接着剤を印刷したプリント配線板と、上記熱伝導性接着剤に対向する部分を除いた全面に導電性接着剤を印刷した金属板とを貼り合わせたことを特徴とする金属基板の製造方法。In the method of manufacturing a metal substrate, in which a metal plate and a printed wiring board disposed on one main surface or both main surfaces of the metal plate are integrated by an adhesive,
A printed wiring board printed with a heat conductive adhesive in the recesses excluding the conductor pattern and a metal plate printed with a conductive adhesive on the entire surface excluding the portion facing the heat conductive adhesive A metal substrate manufacturing method characterized by the above.
JP2002178004A 2002-06-19 2002-06-19 Metal substrate and manufacturing method thereof Expired - Fee Related JP4095354B2 (en)

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