JP4087884B2 - High frequency module - Google Patents

Description

  The present invention relates to a high-frequency module that can be used in the field of wireless devices such as mobile phones and automobile phones, or other various communication devices. In particular, the present invention relates to a high-frequency module that can be used for a VCO (voltage controlled oscillator) using a triplate type stripline resonator, an antenna switch, and the like.

  A conventional example will be described below with reference to the drawings.

  3 to 5 are diagrams showing conventional examples. In FIGS. 3 to 5, 1 is a component mounting surface (front surface), 2 is a bottom surface, 3, 4 and 5 are GND electrodes, 7 is a stripline conductor, 9 is a via (or via hole), 10 and 11 are capacitor electrodes, and 12 is an unnecessary ground capacitance generating portion.

C _{1 to} C ₁₀ are capacitors, C ₁₁ is a variable capacitor, L ₁ and L ₂ are coils, R _{1 to} R ₄ are resistors, VC is a varicap diode (variable capacitance diode), SL is a strip line, Q ₁ , Q ₂ is a transistor, IN is an input terminal, OUT is an output terminal, V _cc is a power supply voltage, and V _CONT is a control voltage input to the input terminal IN.

§1: Description of circuit example of VCO: see FIG. 3 FIG. 3 is a circuit example of a conventional VCO. Hereinafter, a circuit example of a VCO (voltage controlled oscillator) will be described with reference to FIG. Conventionally, a VCO circuit using a stripline resonator as shown is known as a VCO.

This VCO circuit includes capacitors C _{1 to} C ₁₀ , variable capacitors C ₁₁ , coils L ₁ and L ₂ , resistors R _{1 to} R ₄ , varicap diodes (variable capacitance diodes) VC, strip lines SL, and the like. Yes. This circuit is provided with an input terminal IN and an output terminal OUT, and is configured to be used by being connected to a power source of voltage _Vcc .

In the above configuration, the capacitors C ₁ , C ₂ , and C ₃ are high frequency short circuit (bypass) capacitors, and the variable capacitor C ₁₁ is a variable capacitor for adjusting the oscillation frequency. The stripline SL forms a stripline resonator and is part of a circuit that determines the oscillation frequency.

In the circuit, when the control voltage V _CONT is input to the input terminal IN, the circuit oscillates at a frequency corresponding to the control voltage V _CONT and the output signal of the VCO can be taken out from the output terminal OUT.

§2: Description of VCO module: see FIG. 4 FIG. 4 is a sectional view of a conventional VCO module. Hereinafter, an example of the VCO module will be described with reference to FIG. This VCO module example is an example in which each element of the VCO circuit shown in FIG. The multilayer substrate is made of, for example, glass-ceramics that can be fired at a low temperature of 1000 ° C. or less, and the electrode uses a conductor mainly composed of silver.

  In order to reduce the size of the VCO module, a strip line SL, a capacitor, and a coil are built in a multilayer substrate. In this case, two GND electrodes are formed such that the strip line conductor 7 constituting the strip line SL is set as an inner layer of the multilayer substrate, and the strip line conductor 7 is sandwiched by the GND electrodes from both sides in the stacking direction of the multilayer substrate. By providing 3 and 4, a triplate type stripline resonator is obtained.

  In the triplate type stripline resonator, in order to obtain a line impedance required for the design, the gap between the two GND electrodes 3 and 4 and the stripline conductor 7 needs to be spaced to some extent. Will occupy a significant portion of the overall thickness of the VCO module.

In the illustrated example, the transistors Q ₁ and Q ₂ , the varicap diode VC, and the resistors R _{1 to} R ₄ are configured by discrete components and mounted on the component mounting surface (front surface) 1 of the multilayer substrate (not shown).

  The circuit elements other than the components are set inside the multilayer board. In this case, the area in the stacking direction of the multilayer board is divided into an area A on the upper side (component mounting surface 1 side) and a lower side (bottom surface 2 side). In the region B, a triplate-type stripline resonator is set (built-in), and in the region A, other elements (capacitor, coil, etc.) are set.

  Specifically, it is as follows. First, in the region B of the multilayer substrate, the GND electrode 3 is provided on the inner bottom layer on the bottom surface 2 side, the stripline conductor 7 is provided on the upper side in the stacking direction, and the GND electrode 4 is further provided on the upper side.

In this way, each pattern is arranged so that the stripline conductor 7 is sandwiched between the GND electrodes 3 and 4 from both sides in the stacking direction to constitute a triplate stripline resonator. Then, one end portion of the stripline conductor 7 is connected to the GND electrode 3 via the via 9, and the other end portion is connected to the capacitor electrode (ungrounded electrode) 11 (for example, one capacitor electrode constituting the capacitor C ₉ ) via the via 9. Connecting.

In the region A, capacitors C _{1 to} C ₁₀ and coils L ₁ and L ₂ are set. In this case, for example, an unnecessary ground capacitance generating portion 12 is generated between the capacitor electrode 11 and the GND electrode 4.

§3: Explanation of warpage of substrate ... see FIG. 5 FIG. 5 is an explanatory view of warpage of a conventional substrate, wherein FIG. A is an example 1 of substrate warpage, and FIG. Hereinafter, warping of the substrate will be described with reference to FIG.

  The VCO module is manufactured by a multilayer substrate in which a plurality of dielectric layers are stacked. In this VCO module, the dielectric layers constituting the multilayer substrate and the electrode layers are basically designed to have substantially the same firing shrinkage ratio, but it is difficult to completely design the same.

  Accordingly, when the electrode arrangement is designed as described above, the substrate is warped after firing the substrate due to a slight difference in firing shrinkage between the dielectric layer and the electrode layer of the substrate. In this case, as shown in FIG. A, convex warpage occurs on the upper side, or as shown in FIG. B, convex warpage occurs on the lower side.

  The conventional apparatus as described above has the following problems.

  (1): In a VCO module in which at least a triplate-type stripline resonator and a plurality of capacitors are built in a multilayer substrate, all the regions A on the upper side of the multilayer substrate in the stacking direction (component mounting surface 1 side) Since the capacitor electrodes are patterned, the electrodes are concentrated on the upper side in the stacking direction.

  During mass production, it is necessary to steadily build up the capacitance accuracy of these capacitors. However, the dielectric layer on which the capacitors are set is not always stable, and the layer thickness varies between production lots. Is the constant variation of the built-in capacitor.

  (2): In order to avoid the variation of the built-in capacitor, it is necessary to determine the thickness of the capacitor layer in advance. However, when the built-in capacitor has a plurality of layers, the layers for determining the thickness are a plurality of layers, so that the thickness determination processing takes time and effort.

  (3): Some capacitors are not grounded, so it is necessary to consider patterning in order to avoid unnecessary grounding capacitance. Therefore, the utilization factor of the electrodes in the multilayer substrate is not always good.

  (4): Particularly, a capacitor for high-frequency short circuit (bypass) has a large constant and needs to be grounded, so it is necessary to set a larger GND electrode. Therefore, for a capacitor that is not grounded, the floating ground capacitance is a great enemy and has been a major cause of the deterioration of the characteristics of the VCO.

  (5): Although the dielectric layers constituting the multilayer substrate and the electrode layers are basically designed to have substantially the same firing shrinkage ratio, it is difficult to design them completely equally. Accordingly, when the electrode arrangement is designed as described above, the substrate is warped after firing the substrate due to a slight difference in firing shrinkage between the dielectric layer and the electrode layer of the substrate.

  If the warp is very small, there is no problem, but if the warp is large, the screen will not be parallel to the substrate surface when an electrode pattern or the like is printed on the surface of the substrate after baking. As a result, the printability is deteriorated, the pattern to be printed is faint and blurred, and the screen is sometimes torn during printing.

  The present invention solves such a conventional problem, reduces the time when performing countermeasures against variations in the dielectric layer for setting capacitors during mass production, prevents warping after firing, and prints the substrate surface. The purpose is to make it easy.

  In order to achieve the above object, the present invention incorporates at least a strip line conductor, a plurality of GND electrodes, and a plurality of capacitors in a multilayer substrate in which a plurality of dielectric layers are laminated, In a high-frequency module (such as a VCO module) in which the GND electrodes are arranged on both sides in the stacking direction to form a triplate-type stripline resonator, the triplate-type stripline is provided at a substantially central portion in the stacking direction of the multilayer substrate. A resonator is set, and a capacitor for high-frequency short-circuiting is set on the lower side (bottom side) of the triplate type stripline resonator, and the other side is set on the upper side (component mounting surface side). Capacitors etc. were arranged.

  The GND electrode is formed inside the laminated substrate through an outer dielectric layer. Further, a capacitor electrode is not formed between the GND electrode and the stripline conductor.

  Furthermore, this invention was comprised as follows.

(1): At least a stripline conductor (7), a plurality of GND electrodes, and a plurality of capacitors are built in a multilayer substrate in which a plurality of dielectric layers are laminated, and with respect to the stripline conductor (7), In the high-frequency module in which the GND electrodes (3, 4) are arranged on both sides in the stacking direction to constitute a triplate stripline conductor resonator, the upper side of the stacking direction (parts) Capacitors composed of GND electrodes (3, 4) are arranged on both the mounting surface side) and the lower side (bottom surface side). The capacitor composed of the GND electrodes (3, 4) It is characterized by being formed inside through a layer .

(2) : In the high-frequency module according to (1), no capacitor electrode is formed between the GND electrodes (3, 4) and the stripline conductor (7), and is lower than the GND electrode (3). The shield GND electrode (14) is disposed in the bottom layer on the bottom surface side, and the GND electrode (14) for shielding and the lower GND electrode constituting the triplate-type stripline resonator The hot-side capacitor electrodes (15, 16) constituting the high-frequency short-circuiting capacitor are set between (3) and the electrode arrangement of a sandwich structure.

(Function)
The operation of the present invention based on the above configuration will be described.

  When manufacturing a high frequency module such as a VCO module, a plurality of dielectric layers are prepared, and conductor patterns such as stripline conductors, GND electrodes, capacitor electrodes, etc. are printed on each dielectric layer by printing a conductor paste or the like. Each dielectric layer is laminated by patterning. Thereafter, the multilayer substrate on which the plurality of dielectric layers are laminated is fired.

  In the manufacturing process, each conductor pattern constituting the triplate-type stripline resonator is patterned on a dielectric layer that is substantially in the center in the stacking direction of the multilayer substrate.

  In addition, with respect to the triplate-type stripline resonator, the lower dielectric layer (bottom surface side) of the dielectric layer is patterned with a conductive paste for printing a capacitor electrode constituting a capacitor for high-frequency short-circuiting. On the dielectric layer on the component mounting surface side, a conductor pattern such as a capacitor electrode constituting another capacitor and other elements is patterned by printing a conductor paste or the like.

  By the way, the high-frequency short-circuit capacitor has no problem even if the accuracy of the constant is about ± 30%, for example, but the other capacitors need to have an accuracy of about ± 5%. However, in actual mass production, the capacitors other than the high-frequency short-circuit capacitor built in the multilayer substrate have a constant variation as it is, and a VCO characteristic variation. However, with respect to a high-frequency short-circuit capacitor, variations in the thickness of the dielectric layer are hardly a problem.

  For example, when a multilayer substrate is manufactured by a sheet stacking method, the dielectric layer causes variations in sheet thickness between manufacturing lots due to manufacturing conditions in the process during sheet manufacturing. (In), since the manufacturing conditions are constant, the thickness variation of the sheet is relatively small.

  Therefore, if each pattern is arranged as described above, there is no need to take measures against the sheet thickness for the capacitor for high-frequency short-circuiting. Therefore, the number of layers for dealing with variations in the dielectric layer that sets the capacitor during mass production is small. This saves time and effort for the variation.

  Moreover, the density of the electrode pattern in the stacking direction of the multilayer substrate is substantially symmetrical with respect to the center in the stacking direction. Accordingly, the substrate as a whole can be balanced against the warp after firing of the multilayer substrate, so that the warp of the substrate is reduced. For this reason, the printing process of the substrate surface after substrate baking can be performed satisfactorily, and the occurrence of blurring, blurring and the like is eliminated.

  The present invention has the following effects.

  (1): Capacitors are set efficiently on both sides of the triplate-type stripline resonator, so that it is easy to take measures to deal with variations in the thickness of dielectric layers of capacitors when mass producing high frequency modules such as VCO modules. It becomes.

  (2): Since the capacitors are set efficiently on both sides of the triplate type stripline resonator, the electrodes set in the multilayer substrate can be used efficiently. Therefore, it is not necessary to wastefully increase the number of stacked multilayer substrates. Moreover, the unnecessary arrangement | positioning capacity | capacitance parasitic on a circuit element can be prevented by the efficient arrangement | positioning of an electrode.

  (3): For example, a GND electrode for shielding is set on the bottom surface (lowermost layer), and a high frequency short circuit is provided between this GND electrode and the lower GND electrode constituting the triplate type stripline resonator. The capacitor electrode on the hot side constituting the capacitor is set to have a sandwich structure electrode arrangement.

  In this way, the electrodes in the multilayer substrate can be used effectively, and the capacitance value of the capacitor can be increased efficiently.

  (4): A triplate type stripline resonator is set at a substantially central portion of the multilayer substrate in the stacking direction, and capacitors are arranged on both sides of the stacking direction. Accordingly, the density of the electrode pattern in the stacking direction of the multilayer substrate is substantially symmetrical with respect to the center in the stacking direction, and the entire substrate is balanced against the warp after firing of the multilayer substrate. Warpage is reduced. Therefore, printing of the surface conductor after firing can be performed satisfactorily.

  (5): Some capacitors other than those for high frequency short circuit must not have a grounding capacitance. For these, the triplate should be used in a place where the characteristics of the triplate stripline resonator are less affected. A part of the upper GND electrode constituting the type stripline resonator is removed to set the electrode on one side of the capacitor.

  For this reason, since the capacitor is spaced apart from the GND electrode on the lower side of the triplate type stripline resonator to some extent, the influence of the ground capacitance can be reduced.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  1 and 2 are diagrams showing an embodiment of the present invention. In FIGS. 1 and 2, the same components as those in FIGS. 3 to 5 are denoted by the same reference numerals. Reference numeral 14 denotes a GND electrode, 15 to 18 denote capacitor electrodes, and 19 denotes a pad electrode of a mounted component. Since the VCO circuit used in this embodiment is the same as the conventional circuit shown in FIG. 3, the description will be made with reference to FIG.

§1: Description of the basic configuration of the embodiment, see FIG. 1 FIG. 1 is an explanatory diagram of the basic configuration of the embodiment. The basic configuration of the embodiment will be described below with reference to FIG. In this embodiment, each element of the VCO circuit shown in FIG. 3 is mounted on a multilayer substrate to form a VCO module.

The component mounting surface 1 is a surface on which discrete components (transistors Q ₁ , Q _2, etc.) constituting the VCO module are mounted, and is also referred to as a surface. The bottom surface 2 is the bottom surface side (motherboard side) when the VCO module is mounted on a motherboard or the like. In the following description, the component mounting surface 1 side is also referred to as the upper side, and the bottom surface 2 side is also referred to as the lower side.

  The basic configuration of the VCO module is as follows. As shown in the figure, a region in the stacking direction of a multilayer substrate in which a plurality of dielectric layers are stacked is divided into a region A, a region B, a region C, and a region D from the upper side, and the region C is set as a substantially central region.

  In the region C, a triplate stripline resonator including the stripline conductor 7 and the GND electrodes 3 and 4 disposed on both sides in the stacking direction is disposed.

Further, capacitors C ₁ , C ₂ and C ₃ for high-frequency short-circuiting (bypass) are arranged in a region D below the region C (on the bottom surface 2 side), and above the region C (component mounting surface 1). The remaining capacitors are arranged in the area B on the side), and coils and the like are arranged in the area A on the upper side.

That is, a triplate-type stripline resonator is set in a substantially central region C of the multilayer substrate, and high-frequency short-circuit capacitors C ₁ , C ₂ , and C ₃ are set in a lower region D thereof. In the upper region B of the triplate-type stripline resonator, characteristic-exposing capacitors C _{4 to} C ₁₀ are set, and in the upper region A, other elements (coils and the like) are set.

  In this case, a part of the GND electrode 4 is removed, and the capacitor electrode 11 is set in that part. The capacitor electrode 11 and the capacitor electrode 10 set in the layer above the capacitor electrode 11 are connected to a grounded capacitor. Constitute. The reason for this arrangement is as follows.

(1): High frequency short-circuit capacitors C ₁ , C ₂ , and C ₃ constituting the VCO are all connected to GND (grounded), and other capacitors C _{4 to} C ₁₀ for allowing signals to pass therethrough. The constant (capacity) is larger (5 to 10 times).

Therefore, in order to obtain the capacitance value efficiently, the high frequency short-circuit capacitors C ₁ , C ₂ , and C ₃ have a lower region D of the triplate-type stripline resonator in which a sandwich structure can be easily formed with the GND electrode. Is suitable.

(2): Capacitors other than the high frequency short-circuit capacitors C ₁ , C ₂ , C ₃ (characteristic capacitors C _{4 to} C ₁₀ ) determine the signal frequency, output power, signal C / N ratio, etc. The constant (capacitance) is smaller than that of a capacitor for high-frequency short-circuiting.

Further, each capacitor other than the high frequency short circuit capacitors C ₁ , C ₂ , and C ₃ is connected to a component (such as a transistor) mounted on the component mounting surface 1 and is not connected (grounded) to the GND electrode. Therefore, the region B on the upper side (the component mounting surface 1 side) of the triplate type stripline resonator is suitable in the stacking direction of the multilayer substrate.

That is, for the capacitors other than the high-frequency short-circuit capacitors C ₁ , C ₂ , and C ₃ that should not have a ground capacitance, a place that has little influence on the characteristics of the triplate stripline resonator (for example, strip A part of the GND electrode 4 may be removed on the upper side of the line conductor 7 where the line conductor 7 is not patterned, and an electrode on one side of the capacitor (capacitor electrode 11) may be set in that region.

  Since the capacitor electrode 11 corresponding to the above is located at a certain distance from the GND electrode 3 on the lower side of the triplate-type stripline resonator, the influence of the ground capacitance can be reduced.

(3): Capacitors C ₁ , C ₂ , C ₃ for high-frequency short-circuiting do not have any problem even if the accuracy of the constant is about ± 30%, but other capacitors need accuracy of about ± 5% It is. However, in actual mass production, the built-in capacitor of the multilayer substrate has a constant variation with the dielectric layer thickness variation unchanged.

  For example, when a multilayer substrate is manufactured by a sheet lamination method, the dielectric layer causes a thickness variation between manufacturing lots due to manufacturing conditions in the process at the time of manufacturing the sheet. However, since manufacturing conditions are constant within one sheet (within a manufacturing lot), variations in sheet thickness are relatively small. Actually, it is about ± 10% between lots and about ± 3% within a lot.

Therefore, when mass production over many lots is performed, the capacitors C ₁ , C ₂ , and C ₃ for short-circuiting the high frequency can be built in the substrate without any problem, but the other capacitors cannot be built in as they are.

  However, since the electrodes of each capacitor are formed by screen printing, the ratio of constants between the capacitors is always constant. Accordingly, if the thickness of the manufactured sheet is known, it can be stably manufactured if a capacitor screen suitable for the thickness is prepared for mass production.

  Therefore, in order to make a capacitor with a built-in substrate, the number of layers for determining the sheet thickness can be reduced by patterning the electrode on one side of the capacitor in one screen (on the same dielectric layer) as much as possible. Efficient.

  (4): As described above, the density of the electrode pattern in the stacking direction of the multilayer substrate is substantially symmetrical with respect to the center in the stacking direction, and the electrode layers having slightly different firing shrinkage rates and the dielectric Since the substrate as a whole can be balanced against the warpage of the multilayer substrate after firing, the warpage of the substrate is reduced.

§2: Description by specific example (see FIG. 2) FIG. 2 is a cross-sectional view of the VCO module of the embodiment. Hereinafter, a specific example of the VCO module will be described with reference to FIG.

When the VCO having the circuit configuration is designed with a multilayer substrate, as described above, the capacitors C ₁ , C ₂ , C ₃ for high-frequency short-circuiting and other capacitors are set separately. In this case, the high-frequency short-circuit capacitors C ₁ , C ₂ and C ₃ may have a constant accuracy of ± 30%, but the other capacitors (C _{4 to} C ₁₀ ) have a constant accuracy of ± 5. % Or less is required.

For example, when designing a VCO module for 1GH _Z bands, constants of the capacitors for high frequency short circuit C _1, C _2, C ₃ is about 30 pF, other capacitors C ₄ -C ₁₀ becomes less than 10pF.

  As shown in the figure, the multilayer substrate is configured by laminating a plurality of dielectric layers, and the region in the laminating direction is divided into region A, region B, region C, and region D from above, and the region C is substantially omitted. The area in the center part. Then, a triplate type stripline resonator composed of the stripline conductor 7 and the two GND electrodes 3 and 4 is set in a region C at the substantially center in the stacking direction of the multilayer substrate.

  In this case, the GND electrode 3 is set at an arbitrary interval on the lower side (bottom surface 2 side) of the stripline conductor 7, and the GND electrode is set on the upper side (component mounting surface 1 side) with an arbitrary interval. 4 is set. The stripline conductor 7 is arranged (sandwich structure) so as to be sandwiched between the two GND electrodes 3 and 4 from both sides in the stacking direction to constitute a triplate stripline resonator.

Also, high frequency short-circuit capacitors C ₁ , C ₂ , C ₃ are arranged in a region D below the region C where the triplate type stripline resonator is set, and a region B above the region C is disposed. Sets the characteristic-determining capacitors C _{4 to} C ₁₀ , and further sets other elements (coils, etc.) in the upper region A.

  The strip line conductor 7, the GND electrodes 3 and 4, the capacitor electrode, the coil, and the like are formed on each dielectric layer as a conductor pattern, for example, by printing a conductor paste. Hereinafter, each region will be described in detail.

(1): The high-frequency short-circuit capacitors C ₁ , C ₂ , and C ₃ set in the region D are set as follows. In the region D, the shielding GND electrode 14 is set as a solid pattern (an electrode patterned on substantially the entire surface of the dielectric layer) on the bottom surface 2 side (lowermost layer).

And between the GND electrode 14 and the GND electrode 3 constituting the triplate type stripline resonator, the capacitor electrodes 15, 16 on the hot side of the capacitors C ₁ , C ₂ , C ₃ for high-frequency short-circuiting. Is set to be an electrode arrangement of a sandwich structure. In this case, one end portions of the hot-side capacitor electrodes 15 and 16 are connected to predetermined patterns in the regions B and A by the vias 9.

  In this way, the electrodes in the multilayer substrate can be used effectively, and the capacitance value of the capacitor can be increased efficiently.

(2): Capacitors set in the region B. Capacitors C ₄ , C ₆ , and C ₇ are capacitors that ground one of the electrodes, so they are set above the GND electrode 4 constituting the triplate-type stripline resonator. .

In this case, for example, hot-side capacitor electrodes 17 and 18 are set in the region B, and the capacitor electrodes 17 and 18 and the GND electrode 4 constitute the capacitors C ₄ , C ₆ and C ₇ . Arrange so as to obtain the required capacitance value.

On the other hand, the capacitors C ₅ , C ₈ , C ₉ , and C _{10 that} are not grounded are the GND electrode 4, the portions that have little influence on the characteristics as a resonator are removed, and these capacitors are set in that region. For example, capacitor electrodes 10 and 11 which are not grounded are set, and the capacitors C ₅ , C ₈ , C ₉ and C ₁₀ are constituted by these electrodes. If it does in this way, each said capacitor | condenser can be formed by a single layer (area | region B is a single layer). Therefore, for mass production, prepare a screen that only determines the thickness of the dielectric layer between them, and changes the pattern area according to the thickness of the electrode on one side of the capacitor placed on the upper side in the stacking direction of the dielectric layer. In this case, it is possible to cope with variations in the capacitance of capacitors during mass production.

(3): In the area A of the multilayer substrate, the patterns of the coils L ₁ and L ₂ and the wiring connecting the elements are set. In the variable capacitor C ₁₁ , one capacitor electrode is set inside the substrate, and the other capacitor electrode is set on the component mounting surface 1. Then, the electrodes set on the component mounting surface 1 are used for trimming so that the frequency can be adjusted.

Two transistors Q ₁ and Q ₂ , a varicap diode VC, and four resistors are mounted on the surface of the multilayer substrate thus manufactured, that is, the component mounting surface 1. However, for the resistor, there is no problem even if a printed resistor is used.

(Other examples)
Although the embodiments have been described above, the present invention can also be implemented as follows.

(1) In the above-described embodiment, the VCO module, although designed as 1GH _Z bands, the present invention can be designed VCO module at any frequency band. In particular, in a few 100 MHz _Z bands, since the capacitance of the capacitor is increased, the number of stacked capacitors in the substrate inevitably becomes large. Therefore, the capacitor layer of the above embodiment may be further multilayered.

  In this case, the high-frequency short-circuit capacitor set on the lower side of the multilayer substrate is arranged so that the shield GND electrode 14 is always on the outer side and has a sandwich structure with the hot-side capacitor electrodes 15 and 16.

  Also, each capacitor (characteristic output capacitor) set on the upper side (region B) of the triplate-type stripline resonator is configured such that one capacitor electrode is covered from the upper side in the stacking direction, and the other capacitor electrode is Pattern.

  (2): Not limited to the VCO module having the circuit configuration shown in the above embodiment, the present invention can be applied to other similar VCO modules.

  (3): Not only the VCO module but also various high-frequency modules such as an antenna switch using a strip line can be similarly applied.

  (4): The material of the dielectric layer constituting the capacitor layer may be the same as the other layers, or a dielectric having a higher dielectric constant than the other layers may be used. Further, the thickness of the dielectric layer may be the same as that of the other layers, or may be thinner than the other layers.

It is basic composition explanatory drawing of an Example. It is VCO module sectional drawing of an Example. It is a circuit example of a conventional VCO. It is sectional drawing of the conventional VCO module. It is explanatory drawing of the curvature of the conventional board | substrate.

Explanation of symbols

1 Component mounting surface (surface)
2 Bottom surface 3, 4, 5, 14 GND electrode 7 Strip line conductor 10, 11, 15-18 Capacitor electrode

Claims (2)

On a multilayer substrate with multiple dielectric layers stacked,
At least a stripline conductor (7), a plurality of GND electrodes, and a plurality of capacitors are incorporated,
In the high frequency module in which the GND electrodes (3, 4) are arranged on both sides in the stacking direction with respect to the stripline conductor (7) to constitute a triplate stripline conductor resonator,
With respect to the triplate-type stripline conductor resonator, a capacitor composed of a GND electrode (3, 4) is disposed on both the upper side (component mounting surface side) and the lower side (bottom surface side) in the stacking direction,
The high frequency module according to claim 1, wherein the capacitor composed of the GND electrodes (3, 4) is formed inside a laminated substrate through an outer dielectric layer. A capacitor electrode is not formed between the GND electrodes (3, 4) and the stripline conductor (7), and is below the GND electrode (3) and is used as a shield on the bottom layer on the bottom surface side. A GND electrode (14) of
Between the shield GND electrode (14) and the lower GND electrode (3) constituting the triplate-type stripline resonator, the hot-side capacitor electrode (15 16) is set to be an electrode arrangement of a sandwich structure.

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