JP4078815B2 - Electroformed thin blade whetstone - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electroformed thin blade grindstone used for cutting of electronic materials and the like, and in particular, an electroformed thin blade used for cutting of electronic materials having a ductile material layer such as polyimide tape and a hard material layer such as a mold resin. It relates to a grindstone.
[0002]
[Prior art]
Conventionally, as a method of manufacturing an electronic component, for example, a hard material layer composed of a mold resin layer serving as a base material of each electronic component is formed on a ductile material layer composed of a single piece of polyimide tape. After forming a pattern made of Cu or the like on each of the mold resin layers, the electronic material sealed with this pattern is placed between the mold resin layers by punching. An electronic component is manufactured by punching out a portion of the polyimide tape to be cut or cutting a portion of the polyimide tape located between the individual mold resin layers with a cutter.
[0003]
However, recently, considering the increase in the number of electronic components that can be manufactured at one time and the efficient use of polyimide tape, a plurality of individual mold resin layers are formed on a single polyimide tape at intervals. Instead, a method of manufacturing an electronic component by forming a single mold resin layer and then cutting it is employed.
That is, as shown in FIG. 3, a mold resin layer 3 is formed over the entire surface of a single polyimide tape 2, and further, individual electronic component patterns are formed on the mold resin layer 3. After forming each one, the electronic material 1 whose pattern is sealed with resin is cut along the cutting line A in FIG. 3 to cut the polyimide tape 2 and the mold resin layer 3 together to produce individual electronic components. It will be.
In this case, since it is necessary to cut not only the polyimide tape 2 but also the hard mold resin layer 3 located on the polyimide tape 2, it is not a punch or a cutter as in the prior art, but, for example, diamond or cBN superabrasive grains The electronic material 1 as described above has been cut using an electroformed thin-blade grindstone that is dispersed in a metal binder phase.
[0004]
[Problems to be solved by the invention]
However, when the above-described electronic material 1 is cut using an electroformed thin blade grindstone in which diamond superabrasive grains are dispersed and arranged in a metal binder phase, the diamond itself does not wear, and thus a long life is obtained. Although it can be obtained, regardless of the shape of the diamond used as the superabrasive grain, an excessive burr is generated in the cutting trace of the polyimide tape 2 located under the mold resin layer 3.
On the other hand, even if the above-mentioned electronic material is cut using an electroformed thin blade whetstone in which cBN superabrasive grains are dispersed and arranged in a metal binder phase, burrs are not formed on the polyimide tape 2 in the initial stage of processing. Although the effect of suppressing the generation is obtained, cBN used as the superabrasive grains has a short life because of its poor wear resistance, and while the hard mold resin layer 3 is being cut and processed In addition, if cBN itself wears due to the lack of wear resistance, it is inevitable that grinding resistance will increase and burrs will be generated on the cut trace of polyimide tape 2.
[0005]
The present invention has been made in view of the above problems, and it is an object of the present invention to provide an electrodeposited thin blade grindstone that can suppress the occurrence of burrs even for a workpiece made of a ductile material and a hard material, and has a long life. And
[0006]
[Means for Solving the Problems]
In order to solve the above-described problems and achieve such an object, the present invention provides a hard material layer made of a ductile material layer made of polyimide tape and a hard resin layer in which superabrasive grains are dispersed and arranged in a metal binder phase. In the electroformed thin-blade grindstone used for cutting an electronic material having the above, a mixed grain of cBN and diamond is used as the superabrasive grain, and the average grain diameter of the cBN is the average grain diameter of the diamond The cBN and diamond are arranged so as to be uniformly dispersed in the metal bonded phase.
With such a configuration, due to the synergistic effect of cBN and diamond, even if a workpiece made of a ductile material and a hard material is cut and processed, the hard material can be cut reliably, and the cut trace of the ductile material can be obtained. It is possible to suppress the generation of burrs and ensure a long life.
In addition, since the average particle size of the cBN is 50 to 200% of the average particle size of the diamond, the excellent effect that both improvement of wear resistance and suppression of burrs can be achieved more reliably. can do. Here, when the average particle size of cBN is smaller than 50% of the average particle size of diamond, diamond characteristics are more conspicuous than cBN, and the generation of burrs cannot be suppressed. On the other hand, when the average particle size of cBN is larger than 200% of the average particle size of diamond, the characteristics of cBN are more conspicuous than diamond and wear resistance is inferior.
[0007]
The superabrasive grains may be 5 to 35 vol% of the metal binder phase.
Here, when the superabrasive grains are smaller than 5 vol% of the metal binder phase, the content of the superabrasive grains is too small, so that the cutting process becomes impossible. On the other hand, when the superabrasive grain is larger than 35 vol% of the metal binder phase, the content of the superabrasive grain is too large, so that the strength of the metal binder phase is reduced and the number of superabrasive grains acting on the workpiece at a time is large. The sharpness will deteriorate.
[0008]
The cBN is 20 to 90 vol% of the superabrasive grains.
Here, when cBN is smaller than 20 vol% of the superabrasive grains, the ratio of cBN to the diamond is too small, and the effect of suppressing the generation of burrs cannot be obtained. On the other hand, cBN is 90 vol% of the superabrasive grains. If it is larger, the ratio of diamond to cBN is too small, and the effect of improving wear resistance cannot be obtained.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the accompanying drawings.
FIG. 1 is an enlarged sectional view of a cutting edge portion of an electroformed thin blade grindstone according to the present embodiment, and FIG. 2 is a plan view of the electroformed thin blade grindstone.
[0011]
As shown in FIGS. 1 and 2, the electroformed thin blade whetstone 10 according to the present embodiment has a substantially ring-shaped thin plate shape whose thickness is set in the range of several tens μm to several hundred μm, and the whole is an abrasive layer. At the same time, the outer peripheral portion is a cutting edge portion 11 having a ring shape.
This electroformed thin blade whetstone 10 is formed by dispersing mixed grains of cBN 13 and diamond 14 as superabrasive grains 15 in a metallic binder phase 12 made of, for example, Ni, Co, or an alloy thereof. Are arranged so that both the cBN 13 and the diamond 14 are uniformly dispersed in the metal bonded phase 12.
[0012]
Further, the superabrasive grains 15 composed of the cBN 13 and the diamond 14 are 15 to 35 vol% with respect to the metal binder phase 12, and the cBN 13 is 20 to 90 vol% with respect to the super abrasive grains 15.
Furthermore, the average particle size of cBN13 is 50 to 200% of the average particle size of diamond 15.
[0013]
In addition, the cutting edge portion 11 captures the shavings generated during the cutting process and easily discharges them to the outside so that clogging is less likely to occur. A plurality of slits 16 are formed at predetermined intervals toward the inner peripheral side. The slit 16 is formed, for example, by scraping the outer peripheral edge of the electroformed thin blade grindstone 10 into a predetermined shape by performing electric discharge machining using a wire or the like or grinding using a grindstone or the like.
[0014]
Such an electroformed thin-blade grindstone 10 has an inner peripheral portion sandwiched between mounting flanges and attached to the grindstone shaft, and is fastened and fixed by a nut, and is rotated around the axis of the grindstone shaft while the outer peripheral portion The cutting edge portion 11 cuts the electronic material 1 in which the polyimide tape 2 and the mold resin layer 3 as shown in FIG.
[0015]
According to the electroformed thin blade whetstone 10 according to the present embodiment, by using a mixed grain of cBN 13 and diamond 14 as superabrasive grains 15, their synergistic effect, that is, the effect of suppressing burr of cBN and the diamond. It becomes possible to achieve both the effects of ensuring wear resistance, even when cutting the electronic material 1 in which the mold resin layer 3 is laminated on the polyimide tape 2 as described above, This hard mold resin layer 3 can be reliably cut and processed, and it is possible to suppress the occurrence of burrs on the cut traces of the polyimide tape 2, and it is possible to ensure wear resistance and obtain a long life. .
[0016]
Moreover, when the ratio with respect to the metal binder phase 12 of the superabrasive grain 15 is too small, the superabrasive grain provided for a cutting process will decrease too much and a cutting process will become impossible. On the other hand, when the ratio of the superabrasive grains 15 to the metal binder phase 12 is too large, the strength of the metal binder phase 12 is reduced, and the number of superabrasive grains acting on the workpiece at a time increases and the sharpness deteriorates. . Therefore, in the present embodiment, the superabrasive grains 15 are set in an optimal range of 5 to 35 vol% of the metal binder phase 12, thereby maintaining a stable cutting process and, furthermore, the strength of the metal binder phase 12. It does not lead to a drop, or the sharpness is lost and the occurrence of burrs is not promoted.
In order to make the above-described effect more reliable, it is preferable to set the superabrasive grains 15 in a range of 10 to 30 vol% of the metal binder phase 12.
[0017]
Moreover, when the ratio of cBN13 to superabrasive grains 15 is too small, the amount of cBN13 is too small with respect to diamond 14, and the effect of suppressing the generation of burrs cannot be obtained. On the other hand, the ratio of cBN13 to superabrasive grains 15 If it is too large, the amount of diamond 14 is too small relative to cBN13, and the effect of improving the wear resistance cannot be obtained. Therefore, in this embodiment, by setting cBN13 in the optimal range of 20 to 90 vol% of the superabrasive grains 15, both improvement in wear resistance and suppression of burrs can be achieved.
In addition, in order to make the above-described effect more reliable, it is preferable to set the cBN 13 to be in the range of 50 to 70 vol% of the superabrasive grains 15.
[0018]
On the other hand, if the average particle size of cBN13 is too small with respect to the average particle size of diamond 14, the effect brought about by cBN is reduced, and only the diamond characteristics are conspicuous, so that the generation of burrs cannot be suppressed. When the average particle size of cBN13 is too large with respect to the average particle size of diamond 14, the effect produced by the diamond is reduced, and only the properties of cBN are conspicuous, resulting in poor wear resistance. Therefore, in this embodiment, the average particle size of cBN12 is set to an optimal range of 50 to 200% of the average particle size of diamond 13, thereby improving both wear resistance and suppressing burrs. The excellent effect of being able to be made can be made more reliable .
[0019]
【The invention's effect】
As described above, the electroformed thin-blade grindstone according to the present invention uses a mixed grain of cBN and diamond as superabrasive grains, and the average particle diameter of cBN is 50 to 200% of the average grain diameter of diamond. By arranging so that cBN and diamond are uniformly dispersed in the binder phase , even if a work made of a ductile material and a hard material is cut by the synergistic effect of these cBN and diamond, It is possible to reliably cut the hard material and to suppress the occurrence of burrs in the ductile material, and to ensure wear resistance and extend the life.
[Brief description of the drawings]
FIG. 1 is an enlarged cross-sectional view of a cutting edge portion of an electroformed thin blade grindstone according to the present embodiment.
FIG. 2 is a plan view of an electroformed thin blade grindstone according to the present embodiment.
FIG. 3 is a cross-sectional view showing an electronic material as a workpiece.
[Explanation of symbols]
1 Electronic material (work)
2 Polyimide tape (ductile material layer)
3 Mold resin (hard material layer)
10 Electroformed Thin Blade Grinding Wheel 11 Cutting Edge 12 Metal Bond Phase 13 cBN
14 Diamond 15 Super abrasive

Claims (3)

In an electroformed thin blade grindstone used for cutting an electronic material in which superabrasive grains are dispersed and arranged in a metal binder phase and have a ductile material layer made of polyimide tape and a hard material layer made of mold resin ,
As the superabrasive grains, a mixed grain of cBN and diamond is used, and the average grain size of the cBN is 50 to 200% of the average grain size of the diamond, An electroformed thin-blade grindstone, wherein cBN and diamond are arranged so as to be uniformly dispersed. In the electroformed thin blade grindstone according to claim 1,
The superabrasive grain is 5 to 35 vol% of the metal binder phase. In the electroformed thin blade grindstone according to claim 1 or claim 2,
The electroformed thin-blade grindstone, wherein the cBN is 20 to 90 vol% of the superabrasive grains.

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