JP2008126369A - Dicing blade - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a dicing blade capable of restraining generation of metal burrs while maintaining strength of the blade. <P>SOLUTION: The dicing blade 1 is made of an abrasive layer 2 only formed by combining super abrasives such as diamonds and cBN grains with a bonding agent, and recesses 3 are arranged on an outer peripheral side of the abrasive layer 2. The recesses 3 is arranged not to penetrate the abrasive layer 2, and the depth d of the recesses 3 is 60% or less of the thickness t of the abrasive layer 2. The recesses 3 are arranged on both sides of the abrasive layer 2 in a zigzagged state. The recesses 3 is also arranged to have a slanting angle θ against a normal line binding the center and its outer periphery of the dicing blade 1, and the angle θ is set up to be 20-40 degrees. One of both side surfaces forming the recesses 3 is a curved line wherein an opening at the outer peripheral side of the recesses 3 is enlarged at the plane view. The radius of its curvature r is set up to be 1-4 mm, and approximate 2.5 mm is the most preferable as the radius of curvature. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a dicing blade capable of suppressing metal burrs generated during dicing for a composite material including metal wiring in a component such as an electronic device used for an electronic / semiconductor-related product.

  In order to cope with higher performance of electronic / semiconductor-related products, in the packaging packaging field, there is a demand for smaller size and larger capacity, and there is a tendency that the interval between the metal wirings in the package becomes narrower. Therefore, metal burrs are generated at the time of dicing and short circuit occurs when contacting with an adjacent metal, resulting in a product defect. From such a situation, it is required that no metal burrs are generated during dicing.

  Currently used dicing blades include a rim type in which the outer peripheral portion of the abrasive layer is continuous over the entire circumference, and a notch penetrating the outer peripheral portion of the abrasive layer (hereinafter referred to as “slit”). ) And segment type.

FIG. 4 shows the structure of a conventional dicing blade. FIG. 4A shows a plan view and a side view of a rim type dicing blade, and FIG. 4B shows a plan view and a side view of a segment type dicing blade.
In the case of the rim type shown in FIG. 4 (a), since the abrasive layer 2 is not provided with slits, the outer periphery and side surfaces of the blade are in contact with the metal portion of the work material, and the metal burrs tend to grow and become larger. Yes, metal tends to adhere to the outer periphery and side of the blade.

On the other hand, in the segment type shown in FIG. 4B, slits 22 are provided in the abrasive grain layer 2, and when the metal wiring is cut with this blade, the outer periphery and side surfaces of the blade are the metal parts of the work material. Since the edges of the slits 22 divide the burrs generated by contact with the burrs, the burrs tend to be small. Further, the slit 22 has an effect of preventing metal from adhering to the outer periphery and the side surface of the blade.
However, in order to sufficiently obtain the above-mentioned effects due to the slit, it is necessary to enlarge the slit outer peripheral opening or increase the number of slits. However, this reduces the strength of the blade and breaks the blade. And is likely to cause oblique cutting.

  As an example of the blade used in the above-described application, Patent Document 1 describes a blade in which a concave groove is arranged on the side surface of the blade. However, the one described in Patent Document 1 has a problem that the metal burr tends to be stretched because the edge hits and cuts in a shape almost parallel to the metal portion of the work material.

  Further, Patent Document 2 describes a dicing blade in which a cutting blade is provided with a recess as a blade groove. However, the concave groove of this shape is useful for promoting chip discharge and cooling effect, but does not function effectively for reducing burrs.

  Patent Document 3 describes a blade used for dicing an ultrathin wafer. This blade is provided with a slit that penetrates, and the effect of suppressing clogging of the dicing blade by cutting the adhesive sheet and the effect of suppressing chipping on the back surface of the wafer are described as operational effects, but a burr reduction effect cannot be expected.

  Also in fields other than the dicing blade, Patent Document 4, Patent Document 5, and Patent Document 6 describe a technique in which a groove or slit is provided in an abrasive grain layer. Among these, what is described in Patent Document 4 is a superabrasive cutter in which an oval-shaped protruding portion is formed in an abrasive layer and a recess groove is provided. It is possible to discharge easily and to cut with a small amount of cooling water.

Further, what is described in Patent Document 5 is a blade saw in which a circumferential groove having a bottom surface of the disk-shaped base metal is provided between the inner diamond abrasive layer and the outer diamond abrasive layer. However, the effect of this is to stably increase the cutting accuracy without shaking the hard plate material. Moreover, although what was described in patent document 6 is a diamond cutting grindstone provided with slits penetrating the outer peripheral portion of the segment chip, which is an abrasive grain layer, and the bonding surface side, the effect of this is always during cutting. The purpose is to make the number of abrasive grains in contact with the work material uniform and maintain a stable sharpness from the beginning to the end of use.
Therefore, none of Patent Document 4, Patent Document 5, and Patent Document 6 has a burr reduction effect.

Japanese Patent Laid-Open No. 2001-300855 JP-A-6-188308 JP 2005-129743 A Japanese Patent Laid-Open No. 5-111877 JP-A-10-128673 JP-A-11-70473

  The present invention has been made to solve such problems, and an object of the present invention is to provide a dicing blade capable of suppressing the generation of metal burrs while maintaining the strength of the blade.

  In order to solve the above-described problems, the dicing blade of the present invention is composed of an abrasive layer formed by bonding superabrasive grains with a binder, and a recess that does not penetrate in the thickness direction on the outer peripheral side of the abrasive layer. Is a dicing blade provided in a staggered manner on both side surfaces of the abrasive layer, wherein the recess is provided inclined with respect to the radial direction, and one of the side surfaces forming the recess is viewed in plan view. It is characterized by a curve that widens the outer peripheral side opening of the recess.

  The concave portion is provided so as to be inclined with respect to the radial direction, and one of both side surfaces forming the concave portion is curved so that the outer peripheral side opening of the concave portion becomes wide when viewed in plan. When the dicing blade hits the electronic component, the contact of the concave portion becomes smooth, so that the metal burr generated by cutting can be effectively cut by the edge of the concave portion, and the effect of reducing the metal burr is great.

  Further, since the recesses are provided so as not to penetrate in the thickness direction on the outer peripheral side of the abrasive layer, and are provided in a staggered manner on both side surfaces of the abrasive layer, the strength of the dicing blade can be maintained and the grinding liquid Is intensively supplied to the work material, so the cooling effect is great.

In this invention, the curvature radius of the said curve is 1 mm or more and 4 mm or less, It is characterized by the above-mentioned.
If the radius of curvature of the curve is less than 1 mm, metal burrs are likely to occur because the edge of the recess is cut in a state of being nearly parallel to the work material having the metal part. On the other hand, when the radius of curvature of the curve exceeds 4 mm, the curve slope becomes gentle and the curve approaches the circumferential direction of the abrasive layer, so that the burr reduction effect becomes small.

In the present invention, the inclination angle of the concave portion with respect to the radial direction is 20 ° or more and 40 ° or less.
If the inclination angle with respect to the radial direction of the concave portion is less than 20 °, the edge of the concave portion is not preferable because it approaches parallel to the burr, and if it exceeds 40 °, the inclination of the concave portion approaches the circumferential direction of the abrasive layer. Reduction effect is reduced.

In the present invention, the depth of the recess is 60% or less of the thickness of the abrasive layer.
When the depth of the concave portion exceeds 60% of the thickness of the abrasive layer, the strength of the dicing blade is lowered, and the bottom surface of the concave portion is likely to be damaged or obliquely cut.

  According to the present invention, it is possible to realize a dicing blade capable of suppressing the generation of metal burrs while maintaining the strength of the blade.

Below, the dicing blade of this invention is demonstrated based on the embodiment.
FIG. 1 shows the structure of a dicing blade according to an embodiment of the present invention. FIG. 1A shows the surface of the dicing blade of the present invention, and FIG. (C) is a side view, (d) is an enlarged view of (c). Further, (e) is an enlarged detail view of a portion A in (a).

In FIG. 1, a dicing blade 1 is composed only of an abrasive layer 2 formed by bonding superabrasive grains such as diamond and cBN with a binder without using a base metal, and the outer peripheral side of the abrasive layer 2 Is provided with a recess 3. A mounting hole 4 is provided on the inner peripheral side of the abrasive grain layer 2. The thickness of the abrasive grain layer 2 is of a thin blade type of about 0.1 mm.
The recess 3 is provided without penetrating the abrasive grain layer 2, and the depth d of the recess 3 is 60% or less of the thickness t of the abrasive grain layer 2. The recesses 3 are provided in a staggered manner on both side surfaces of the abrasive layer 2.

  As shown in FIG. 1E, the recess 3 is provided so as to have an inclination angle of an angle θ with respect to a normal line connecting the center and the outer periphery of the dicing blade 1, and the angle θ is 20 ° or more and 40 °. ° or less. Further, one of both side surfaces forming the concave portion 3 has a curve that widens the outer peripheral side opening portion of the concave portion 3 when viewed in plan, and has a radius of curvature r of 1 mm or more and 4 mm or less. About 5 mm is most preferable.

  The width w of the opening on the outer peripheral side of the recess 3 is not less than 1 mm and not more than 2 mm, and the width u in the center direction of the recess 3 is not more than 20 times the thickness of the abrasive grain layer 2. When the width w of the opening on the outer peripheral side of the recess 3 is less than 1 mm, it is not preferable because the effect of dividing the edge of the burr generated by the blade contacting the metal part of the work material is reduced. The opening becomes too wide, the edge cutting load (resistance) increases, and the edge wear rate increases. Further, when the width U in the central direction of the recess 3 exceeds 20 times the thickness of the abrasive grain layer 2, it interferes with a generally used flange, the blade strength is reduced, and the bottom of the recess is damaged or obliquely cut. Prone to occur.

  FIG. 2 shows an operation when an electronic component is ground using the dicing blade of the present invention. FIG. 2 shows the shape of the edge of the recess 3. In the dicing blade 1 of the present invention, one of the both side surfaces where the recess 3 is formed has a wide opening on the outer peripheral side of the recess 3 when viewed in plan. Therefore, when the package 13 having the metal portion 12 having the through hole 11 and formed of copper or the like is cut with the dicing blade 1, the contact with the concave portion 3 becomes smooth. The metal burrs generated by cutting can be effectively cut by the edges of the recesses 3, and the effect of reducing the metal burrs is great.

  For comparison with this, FIG. 3 shows an operation when an electronic component is ground using a conventional dicing blade having a slit. As shown in the figure, one of both side surfaces forming the slit 22 is linear when viewed from above, so that the metal portion 12 having the through hole 11 and formed of copper or the like is provided. When the provided package 13 is cut by the dicing blade 21, the edge of the slit 22 hits linearly, so the deburring effect is small.

Test examples are shown below.
Abrasive grains made of synthetic diamond having a particle diameter of 20 to 40 μm are bonded using a binder mixed with copper and tin having an average particle diameter of 2 to 10 μm with a concentration of 75, and a dicing blade having a structure shown in FIG. The dicing blade was manufactured and tested under the test conditions shown in Table 1.

  Tables 2 and 3 show the specifications of the recesses in each example and comparative example. Those shown in Table 2 are obtained by changing the depth of the concave portion, and those shown in Table 3 are obtained by changing the inclination angle of the concave portion and the curvature radius of the curve. Table 4 shows the slit specifications in the conventional example.

  Table 5 shows the test results for the above examples, comparative examples, and conventional examples.

In Table 5, the grinding ratio is an amount defined by the amount of work material deleted per unit wear volume of the abrasive layer. That is, it can be obtained by grinding ratio = work material removal volume ÷ abrasive layer wear volume.
From the above test results, it can be seen that the occurrence of metal burrs can be suppressed by having the structure of the present invention, and the power consumption and the grinding ratio are also good.

  The present invention can be used as a dicing blade capable of suppressing the generation of metal burrs while maintaining the strength of the blade.

It is a figure which shows the structure of the dicing blade which concerns on embodiment of this invention. It is a figure which shows the operation | movement at the time of grinding an electronic component using the dicing blade of this invention. It is a figure which shows the operation | movement at the time of grinding an electronic component using the dicing blade which has the conventional slit. It is a figure which shows the structure of the conventional dicing blade.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Dicing blade 2 Abrasive grain layer 3 Recessed part 4 Mounting hole 11 Through hole 12 Metal part 13 Package

Claims (4)

  A dicing blade comprising an abrasive layer formed by bonding superabrasive grains with a binder, and recesses that do not penetrate in the thickness direction are provided in a staggered manner on both sides of the abrasive layer on the outer peripheral side of the abrasive layer. And the said recessed part is inclined and provided with respect to radial direction, and one of the both sides | surfaces which form the said recessed part is a curve so that the outer peripheral side opening part of a recessed part may become large when planarly viewed. A dicing blade characterized by that.   The dicing blade according to claim 1, wherein a curvature radius of the curve is 1 mm or more and 4 mm or less.   The dicing blade according to claim 1, wherein an inclination angle of the concave portion with respect to a radial direction is 20 ° or more and 40 ° or less.   The dicing blade according to any one of claims 1 to 3, wherein a depth of the concave portion is 60% or less of a thickness of the abrasive grain layer.

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