JP4065724B2 - IC socket with internal observation window - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an IC socket with an internal observation window, and more particularly to an IC socket with an internal observation window for observing an IC package through the internal observation window.
[0002]
[Prior art]
In some cases, it is necessary to observe the packaged IC from the outside as it is without removing the package. This internal observation of the packaged IC is generally performed using an electron microscope with the IC actually driven electrically. By this internal observation, it is possible to observe and recognize the formation and connection state of the fine circuit of the IC inside the package, the energized state, and other conditions.
[0003]
[Problems to be solved by the invention]
However, there has been no suitable instrument for applying the IC to the electron microscope in such a state while the packaged IC is energized.
The present invention provides an IC socket with an internal observation window that solves the above-mentioned problems by constituting a single IC socket and providing an internal observation window thereto.
[0004]
[Means for Solving the Problems]
A body part of an IC socket for connecting bumps formed in a matrix on the bottom surface of the IC to an IC testing device via an elongated contactor 7 attached to a float that is elastically biased upward and a pin terminal 50 And a conductive pressing plate 8 having an opening 80 at the center thereof, which is superimposed on the main body of the IC socket, and a slide frame 9 that engages with the conductive pressing plate 8 and blocks its upper surface. An IC socket with an internal observation window was constructed.
[0005]
Here, the conductive pressing plate 8 is formed by hanging a hanging pressing portion 85 made of an inclined surface 81 having an opening 80 at the center lower end portion from the collar portion 82, and the slide frame 9 is composed of a large diameter portion and a small diameter portion. Oval holes 92 are formed at the four corners, and the upper screw 32 is screwed onto the holding post 3.
[0006]
DETAILED DESCRIPTION OF THE INVENTION
An embodiment of the present invention will be described with reference to the examples of FIGS. FIG. 1 is an exploded perspective view of the embodiment, and FIG. 2 is a cross-sectional view of the embodiment.
The main body of the IC socket for internal observation according to the present invention comprises a lower base 1 and an upper base 2. The lower base 1 has pressing post insertion holes 11 formed at four corners thereof, and the pressing posts 3 are press-fitted and fixed. A female screw portion into which the upper screw 32 and the lower screw 31 are screwed is formed on the upper and lower ends of the pressing post 3 by threading. Reference numeral 12 denotes a post insertion hole, which is formed at a total of four locations corresponding to the vicinity of the pressing post 3. Reference numeral 13 denotes float pin insertion holes, which are formed in a total of four locations in the vicinity corresponding to the post insertion holes 12. Reference numeral 14 denotes pin terminal insertion holes, which are arranged in a matrix at equal intervals over a plurality of rows at the periphery.
[0007]
The upper base 2 is formed with a large opening 21 having an IC package guide portion formed of an inclined surface at the center. The lower side of the opening 21 constitutes a float accommodation locking portion 23 over the entire circumference. A pair of positioning pins 24 are formed symmetrically with respect to the opening 21 on the upper surface of the upper base 2. Reference numeral 22 denotes a post insertion hole.
The post 4 has a locking portion 41 at its lower end and is threaded to form a female screw portion 45 at its upper end.
6 indicates a float. The float 6 forms a float bottom wall 62 surrounded by four peripheral walls at the center. Reference numeral 63 denotes a float pin insertion hole through which the float pin 61 is inserted. The lower end portion of the float pin insertion hole 63 forms a spring accommodating portion 64 that accommodates the float spring 60 with an enlarged diameter.
[0008]
Reference numeral 7 denotes an elongated contact. The elongated contact 7 is inserted and fixed in through holes formed at equal intervals over a plurality of rows around the bottom wall 62 of the IC package corresponding to the bumps on the lower surface of the IC package. The upper end portion is exposed on the upper surface.
Reference numeral 5 denotes a circuit board. The circuit board 5 has a contact portion with which the elongated contact 7 comes into contact with the surface thereof, corresponding to the elongated contact 7 and a pin terminal 50 protruding from the lower surface. The pin terminal 50 and the contact portion on the surface are interconnected in a one-to-one correspondence via wiring formed on the circuit board 5. 51 is a float pin insertion hole, 52 is a post insertion hole, and 53 is a pressing post insertion hole. Although a detailed description is omitted, a guide plate 5 ′ for guiding the elongated contact 7 between the bottom surface of the float bottom wall 62 and the circuit board 5 is used in combination.
[0009]
Reference numeral 8 denotes a conductive pressing plate. The conductive pressing plate 8 is formed of a synthetic resin such as polyetherimide and imparts conductivity by performing gold sputtering on the surface. A hanging pressing portion 85 made of an inclined surface 81 having an opening 80 at the center lower end portion is formed by hanging from the flange portion 82. This opening 80 forms a part of the internal observation window. The drooping pressing portion 85 has a shape complementary to the opening 21 of the upper base 2. Reference numeral 83 denotes a pair of positioning pin fitting holes penetratingly formed in the collar portion 82, and is formed corresponding to the pair of positioning pins 24 symmetrically with respect to the hanging presser portion 85. On the lower surface of the conductive pressing plate 8, float pin pressing portions 84 are formed at a total of four locations corresponding to the float pin insertion holes 63 formed in the lower base 1.
[0010]
By the way, if it is assumed that the holding plate 8 is not conductive, the friction between the holding plate 8 and the package on the surface of the IC while the IC is being handled by handling with fingers. Static electricity is generated by this, and these are charged. This charge reaches several thousand volts or more, and this discharges due to some condition, destroying the inside of the IC. When observing the inside of the IC with an electron microscope, if no conductivity is given to the opening 80 of the pressing plate 8, static electricity is generated and charged in this portion. This electrification affects the image of the electron microscope, and the image becomes blurred and unclear, which hinders observation. Here, by providing conductivity to the surface of the pressing plate 8, generation of static electricity, charging and discharging can be prevented, and the internal destruction of the IC and the adverse effect on the image of the electron microscope caused by this can be prevented. Can do.
[0011]
Reference numeral 9 denotes a slide frame in which a square hole 91 is formed, and an oval opening 92 having a large diameter portion and a small diameter portion is formed at four corners. This square hole 91 also forms a part of the internal observation window. The internal observation window is finally constituted by the opening 80 of the conductive pressing plate 8 and the square hole 91 of the slide frame 9. An upper screw 32 is screwed into the holding post 3. The slide frame 9 is engaged with the conductive presser plate 8 to prevent the slide frame 9 from being raised on the small post portion of the oval opening 92 while being screwed to the presser post 3 by the upper screw 32. When the large-diameter portion of the oval opening 92 corresponds to the threaded portion of the upper screw 32, the slide frame 9 is detached from the pressing post 3, and the conductive pressing plate 8 is released from the lifting prevention.
[0012]
Reference numeral 10 denotes a mounting plate, and the IC socket of the present invention is assembled and used in a state of being fixed to the mounting plate 10. 101 is a pressing post insertion hole, and 102 is a pin terminal insertion hole.
Next, the assembly order of the IC socket will be described.
(Step 1) First, the pressing post 3 is press-fitted and fixed in the pressing post insertion hole 11 of the lower base 1. The post 4 is inserted into the post insertion hole 12 of the lower base 1 from the lower surface side. Then, the float pin 61 is inserted through the float pin insertion hole 63.
[0013]
(Step 2) Next, the circuit board 5 is superposed on the upper surface of the lower base 1. At this time, the circuit board 5 positions the pin terminal 50 to face the pin terminal insertion hole 14, positions the float pin insertion hole 63 to face the float pin 61, and positions the post insertion hole 52 to face the post 4. Then, the presser post insertion hole 53 is overlapped with the presser post 3 facing and positioned.
(Step 3) The pressing post insertion hole 101 of the mounting plate 10 is positioned corresponding to the pressing post 3, and the mounting plate 10 and the pin terminal insertion holes of the lower base 1 are aligned and positioned on the lower surface of the lower base 1. The lower base 1 and the mounting plate 10 are integrally coupled by overlapping the mounting plate 10 and screwing the lower screw 31 into the threaded female threaded portion of the presser post 3.
[0014]
(Step 4) The float spring 60 is fitted to each of the four float pins 61 protruding from the surface of the mounting plate 10.
(Step 5) The float 6 is superimposed on the circuit board 5. At this time, the float 6 is superimposed on the circuit board 5 in a state where the spring accommodating portion 64 of the float 6 is positioned corresponding to the float pin 61.
(Step 6) The upper base 2 is combined with the lower base 1. At this time, the post insertion hole 22 is positioned so as to face the post 4, and the float housing locking portion 23 formed over the entire circumference on the lower side of the opening 21 is positioned so as to face the float 6, and the upper base 2 is moved to the lower base 1. The float 6 is accommodated in the float accommodation locking portion 23 by being superimposed on each other.
[0015]
(Step 7) The bind screw 42 is screwed into the female screw portion 45 of the upper end portion of the post 4 with the washer 44 and the spring washer 43 interposed between the head and the upper end portion of the post 4. To do. Thereby, the upper base 2 is combined and fixed to the lower base 1.
(Step 8) Finally, the upper screw 32 is attached to the female screw portion at the upper end of the pressing post 3.
(Step 9) Up to (Step 8), the assembly of the IC socket with an internal observation window according to the present invention is completed. Here, the IC socket with the internal observation window is completed by combining and attaching the conductive pressing plate 8 and the slide frame 9 to the upper base 2 in this order.
[0016]
In the state shown in FIG. 1A in which the IC package with the internal observation window remains assembled and the IC package, the conductive pressing plate 8 and the slide frame 9 are not mounted, the float 6 is moved by the float spring 60. Biased upward with the upper surface of the circuit board 5 as a fulcrum, the elongated contactor 7 is in a state in which contact between the lower end of the elongated contactor 7 and the contact on the surface of the circuit board 5 is blocked.
In order to perform internal observation of the IC package using the IC socket with the internal observation window, the IC package is attached to the float bottom wall 62 via the IC package guide portion formed by the inclined surface of the opening 21 of the upper base 2. Include. Here, with the positioning pin fitting hole 83 correspondingly positioned to the positioning pin 24, the hanging pressing portion 85 of the conductive pressing plate 8 is positioned and fitted to the IC package guide portion of the opening 21 of the upper base 2. . Here, by pressing down the conductive pressing plate 8, the IC package and the float bottom wall 62 in which the IC package is incorporated are pressed down via the hanging pressing portion 85 against the upward bias of the float spring 60. As a result, the elongate contact 7 attached to the float bottom wall 62 is brought into contact with the contact formed on the surface of the circuit board 5 at its lower end. When the conductive presser plate 8 is pressed down, the slide frame 9 is screwed onto the upper end of the presser post 3 by the upper screw 16 through the oblong holes 92 formed at the four corners thereof, and the float spring 60 is engaged. It is held by preventing the conductive pressing plate 8 from being raised by the upward bias. Therefore, the contact state between the elongated contact 7 and the contact formed on the surface of the circuit board 5 is maintained.
[0017]
When the IC package is in contact between the elongated contact 7 and the contact formed on the surface of the circuit board 5, the IC package is connected to an external IC test apparatus connected via the pin terminal 50. Electrical connection can be made as follows.
IC → bump on the lower surface of the IC package → elongated contact 7 fixed to the float bottom wall 62 → contact point formed on the surface of the circuit board 5 → wiring formed on the circuit board 5 → protruding from the lower surface of the circuit board 5 Pin terminal 50 to be formed → External IC test apparatus Here, a packaged IC is incorporated in the above IC socket with an internal observation window, this IC socket is applied to an electron microscope, and the IC is actually electrically driven. The inside of the IC can be observed from the outside of the package through the internal observation window.
[0018]
【The invention's effect】
As described above, according to the present invention, an appropriate IC socket with an internal observation window is provided in which a packaged IC is energized and the IC is applied to an electron microscope in this state. It has become possible to easily observe and recognize the formation and connection state of the fine circuit, the energized state, and other conditions.
[Brief description of the drawings]
FIG. 1 is an exploded perspective view of an embodiment.
FIG. 2 is a sectional view of the embodiment.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Lower base 11 Pressing post insertion hole 12 Post insertion hole 13 Float pin insertion hole 14 Pin terminal insertion hole 2 Upper base 21 Opening 22 Post insertion hole 23 Float accommodation latching part 24 Positioning pin 3 Holding post 31 Lower screw 32 Upper screw 4 Post 41 Locking portion 45 Female thread portion 5 Circuit board 5 'guide plate 50 Pin terminal 51 Float pin insertion hole 52 Post insertion hole 53 Holding post insertion hole 6 Float 60 Float spring 62 Float bottom wall 63 Float pin insertion hole 64 Spring accommodation Part 7 Elongated contact 8 Conductive holding plate 80 Opening 81 Inclined surface 82 Hook part 83 Positioning pin fitting hole 84 Float pin pressing part 85 Suspension holding part 9 Slide frame 91 Square hole 92 Oval hole 10 Mounting plate 101 Holding post 101 Insertion hole 102 Pin terminal insertion hole

Claims (2)

An IC test apparatus through a narrow contact attached to a float that is elastically biased upward and bumps arranged in a matrix on the bottom surface of the IC, and a pin terminal connected to the long contact Comprising an IC socket body connected to
A conductive holding plate 8 which is superimposed on the body of the IC socket and has an opening 80 in the center;
An IC socket with an internal observation window, characterized by comprising a slide frame that engages with a conductive pressing plate and prevents the plate from rising. In the IC socket with an internal observation window according to claim 1,
The conductive pressing plate is formed by hanging a hanging pressing portion made of an inclined surface with an opening at the center lower end portion from the collar portion,
An IC socket with an internal observation window, characterized in that the slide frame is formed with an oval opening having a large-diameter portion and a small-diameter portion at four corners, and an upper screw is screwed onto the holding post.

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