JP4052221B2 - 冷却システム - Google Patents
冷却システム Download PDFInfo
- Publication number
- JP4052221B2 JP4052221B2 JP2003350822A JP2003350822A JP4052221B2 JP 4052221 B2 JP4052221 B2 JP 4052221B2 JP 2003350822 A JP2003350822 A JP 2003350822A JP 2003350822 A JP2003350822 A JP 2003350822A JP 4052221 B2 JP4052221 B2 JP 4052221B2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- radiator
- temperature
- amount
- igbt
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60K—ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OF TRANSMISSIONS IN VEHICLES; ARRANGEMENT OR MOUNTING OF PLURAL DIVERSE PRIME-MOVERS IN VEHICLES; AUXILIARY DRIVES FOR VEHICLES; INSTRUMENTATION OR DASHBOARDS FOR VEHICLES; ARRANGEMENTS IN CONNECTION WITH COOLING, AIR INTAKE, GAS EXHAUST OR FUEL SUPPLY OF PROPULSION UNITS IN VEHICLES
- B60K1/00—Arrangement or mounting of electrical propulsion units
- B60K2001/003—Arrangement or mounting of electrical propulsion units with means for cooling the electrical propulsion units
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Electric Propulsion And Braking For Vehicles (AREA)
Description
上述の実施形態では、発熱体としてIGBT3等の電気回路を例に説明したが、本発明はこれに限定されるものではない。
Claims (1)
- 走行用動力を発生させる電動モータ(2)を有する車両に適用され、
前記電動モータ(2)に駆動電流を供給する電気回路(3)を冷却する冷却システムであって、
前記電気回路(3)で発生する熱を吸熱し、その吸熱した熱を冷却用の流体に与える吸熱器(4)と、
前記流体の有する熱を放熱させて前記流体を冷却する放熱器(5)と、
前記放熱器(5)と前記吸熱器(4)とを接続して前記流体の循環経路を構成する配管手段(6)と、
前記放熱器(5)と前記吸熱器(4)との間で前記流体を強制的に循環させるポンプ(7)と、
前記電気回路(3)の温度上昇に応じて循環する前記流体の量を増大させて前記電気回路(3)の温度が所定温度以下となるようにするとともに、循環する前記流体の量が最大となった場合においても、前記電気回路(3)の温度が所定温度以下とならない場合には、前記電気回路(3)の出力を低下させる制御装置(8)とを備え、
前記放熱器(5)は、コンデンサ(1b)およびラジエータ(1a)より車両搭載時の高さが低い小型であって、前記コンデンサ(1b)および前記ラジエータ(1a)より車両前方側に配置されており、
前記電気回路(3)の発熱量が前記電動モータ(2)の運転状態に応じて最大発熱量となる状態は数秒程度であり、
前記放熱器(5)の最大放熱量は、前記電気回路(3)の最大発熱量以下であることを特徴とする冷却システム。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003350822A JP4052221B2 (ja) | 2003-10-09 | 2003-10-09 | 冷却システム |
US10/959,029 US20050077031A1 (en) | 2003-10-09 | 2004-10-05 | Cooling system |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003350822A JP4052221B2 (ja) | 2003-10-09 | 2003-10-09 | 冷却システム |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005116877A JP2005116877A (ja) | 2005-04-28 |
JP4052221B2 true JP4052221B2 (ja) | 2008-02-27 |
Family
ID=34419765
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003350822A Expired - Fee Related JP4052221B2 (ja) | 2003-10-09 | 2003-10-09 | 冷却システム |
Country Status (2)
Country | Link |
---|---|
US (1) | US20050077031A1 (ja) |
JP (1) | JP4052221B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101504578B1 (ko) | 2012-09-11 | 2015-03-20 | 주식회사 우진산전 | 철도차량 히트블록의 냉각펌프 자동제어장치 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4675283B2 (ja) | 2006-06-14 | 2011-04-20 | トヨタ自動車株式会社 | ヒートシンクおよび冷却器 |
JP2008275512A (ja) * | 2007-05-01 | 2008-11-13 | Espec Corp | エージング装置 |
CN106984249A (zh) * | 2017-04-12 | 2017-07-28 | 浙江工业大学 | 用于实验室的预警式冷却水循环装置 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04325734A (ja) * | 1991-04-24 | 1992-11-16 | Mitsubishi Electric Corp | 船外機用内燃機関制御装置 |
KR940010453A (ko) * | 1992-10-01 | 1994-05-26 | 가나이 쯔도무 | 전기 자동차의 냉각 시스템 및 이것에 이용되는 전기 모터 |
WO1995034438A1 (en) * | 1994-06-10 | 1995-12-21 | Westinghouse Electric Corporation | Electrical vehicle propulsion system |
US6357517B1 (en) * | 1994-07-04 | 2002-03-19 | Denso Corporation | Cooling apparatus boiling and condensing refrigerant |
US5870267A (en) * | 1996-07-25 | 1999-02-09 | Konami Co., Ltd. | Semiconductor integrated circuit device with overheating protector and method of protecting semiconductor integrated circuit against overheating |
US6215682B1 (en) * | 1998-09-18 | 2001-04-10 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor power converter and its applied apparatus |
US6246581B1 (en) * | 1999-10-12 | 2001-06-12 | International Business Machines Corporation | Heated PCB interconnect for cooled IC chip modules |
JP4337200B2 (ja) * | 1999-12-20 | 2009-09-30 | 株式会社デンソー | 車両用シート空調システム |
US6808015B2 (en) * | 2000-03-24 | 2004-10-26 | Denso Corporation | Boiling cooler for cooling heating element by heat transfer with boiling |
EP2234154B1 (en) * | 2000-04-19 | 2016-03-30 | Denso Corporation | Coolant cooled type semiconductor device |
JP2002168547A (ja) * | 2000-11-20 | 2002-06-14 | Global Cooling Bv | 熱サイホンによるcpu冷却装置 |
JP3594900B2 (ja) * | 2000-12-19 | 2004-12-02 | 株式会社日立製作所 | ディスプレイ装置一体型コンピュータ |
JP3607608B2 (ja) * | 2000-12-19 | 2005-01-05 | 株式会社日立製作所 | ノート型パソコンの液冷システム |
JP3616005B2 (ja) * | 2000-12-20 | 2005-02-02 | 本田技研工業株式会社 | ハイブリッド車両の冷却装置 |
US6792550B2 (en) * | 2001-01-31 | 2004-09-14 | Hewlett-Packard Development Company, L.P. | Method and apparatus for providing continued operation of a multiprocessor computer system after detecting impairment of a processor cooling device |
US6655922B1 (en) * | 2001-08-10 | 2003-12-02 | Rockwell Automation Technologies, Inc. | System and method for detecting and diagnosing pump cavitation |
US6898072B2 (en) * | 2002-01-16 | 2005-05-24 | Rockwell Automation Technologies, Inc. | Cooled electrical terminal assembly and device incorporating same |
TWI234063B (en) * | 2002-05-15 | 2005-06-11 | Matsushita Electric Ind Co Ltd | Cooling apparatus for electronic equipment |
US6600649B1 (en) * | 2002-05-24 | 2003-07-29 | Mei-Nan Tsai | Heat dissipating device |
US6664751B1 (en) * | 2002-06-17 | 2003-12-16 | Ford Motor Company | Method and arrangement for a controlling strategy for electronic components in a hybrid electric vehicle |
US6772603B2 (en) * | 2002-12-20 | 2004-08-10 | Ut-Battelle, Llc | Methods and apparatus for thermal management of vehicle systems and components |
-
2003
- 2003-10-09 JP JP2003350822A patent/JP4052221B2/ja not_active Expired - Fee Related
-
2004
- 2004-10-05 US US10/959,029 patent/US20050077031A1/en not_active Abandoned
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101504578B1 (ko) | 2012-09-11 | 2015-03-20 | 주식회사 우진산전 | 철도차량 히트블록의 냉각펌프 자동제어장치 |
Also Published As
Publication number | Publication date |
---|---|
JP2005116877A (ja) | 2005-04-28 |
US20050077031A1 (en) | 2005-04-14 |
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