JP4041107B2 - 研磨方法 - Google Patents
研磨方法 Download PDFInfo
- Publication number
- JP4041107B2 JP4041107B2 JP2004275562A JP2004275562A JP4041107B2 JP 4041107 B2 JP4041107 B2 JP 4041107B2 JP 2004275562 A JP2004275562 A JP 2004275562A JP 2004275562 A JP2004275562 A JP 2004275562A JP 4041107 B2 JP4041107 B2 JP 4041107B2
- Authority
- JP
- Japan
- Prior art keywords
- pad
- slurry
- test paper
- polishing
- value
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/0056—Control means for lapping machines or devices taking regard of the pH-value of lapping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Description
図1は本発明の第1の実施形態に係る研磨方法を採用する研磨装置の一例を示す上面図、図2は図1の研磨装置のA−A線断面図である。
第2の実施形態は、第1の実施形態とは異なる場所にpH試験紙12を配置するものである。
上述した第1および第2の実施形態では、pH試験紙12を用いてスラリのpH値を測定した。pH測定は、物質中の水素イオン濃度を測定するものであるが、イオン濃度を測定する手段は、必ずしもpH測定に限らない。
2 パッド
3 スラリ
4a,4b ノズル
6 ウエハ
8 下層パッド
10 上層パッド
11 孔
12 pH試験紙
13 撮像装置
Claims (5)
- ターンテーブルを回転させながら、該ターンテーブル上に配設されたパッドの上面にスラリを供給して、前記パッドの上面に配設された被研磨対象物を前記パッドに押圧して研磨し、
研磨中に、前記パッド上のスラリに含まれる特定イオンのイオン濃度をイオン試験紙で検出することを特徴とする研磨方法。 - 前記パッドには、前記ターンテーブル上に配設される第1層と、この第1層上に配設され少なくとも1箇所に下面まで貫通する孔が形成された第2層とが形成され、
前記孔の内部に配設された前記イオン試験紙を撮像装置にて撮像し、
前記撮像装置による撮像画像に基づいて前記イオン濃度を検出することを特徴とする請求項1に記載の研磨方法。 - 前記パッドの外縁に配設された突出部に配置された前記イオン試験紙で前記イオン濃度を検出することを特徴とする請求項1に記載の研磨方法。
- 前記イオン試験紙を前記パッドの回転に同期させて撮像装置にて撮像することを特徴とする請求項1乃至3のいずれかに記載の研磨方法。
- 前記撮像装置による撮像画像の色調値と所定の基準画像の色調値とを比較し、
前記撮像画像の色調値と前記基準画像の色調値との差分値を所定値と比較した結果に基づいて、警報処理を行うか否かを決定することを特徴とする請求項2または4に記載の研磨方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004275562A JP4041107B2 (ja) | 2004-09-22 | 2004-09-22 | 研磨方法 |
US11/231,755 US7172492B2 (en) | 2004-09-22 | 2005-09-22 | Polishing method and polishing system |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004275562A JP4041107B2 (ja) | 2004-09-22 | 2004-09-22 | 研磨方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006088261A JP2006088261A (ja) | 2006-04-06 |
JP4041107B2 true JP4041107B2 (ja) | 2008-01-30 |
Family
ID=36099845
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004275562A Expired - Fee Related JP4041107B2 (ja) | 2004-09-22 | 2004-09-22 | 研磨方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7172492B2 (ja) |
JP (1) | JP4041107B2 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5571409B2 (ja) * | 2010-02-22 | 2014-08-13 | 株式会社荏原製作所 | 半導体装置の製造方法 |
JP5619559B2 (ja) * | 2010-10-12 | 2014-11-05 | 株式会社ディスコ | 加工装置 |
JP6115939B2 (ja) * | 2013-03-12 | 2017-04-19 | 株式会社荏原製作所 | 研磨液の性状測定装置 |
TWI701103B (zh) * | 2018-02-14 | 2020-08-11 | 台灣積體電路製造股份有限公司 | 研磨設備、檢測裝置以及半導體基板的研磨方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04232283A (ja) * | 1990-12-28 | 1992-08-20 | Seikosha Co Ltd | エッチングモニターテープ |
JPH08252765A (ja) * | 1995-03-16 | 1996-10-01 | Fujitsu Ltd | 研磨装置、研磨布搬送装置、研磨布貼付装置、及び研磨布 |
AU720428B2 (en) * | 1996-10-16 | 2000-06-01 | Environmental Test Systems, Inc. | Device and method for the determination of water |
US6028006A (en) | 1997-08-01 | 2000-02-22 | Texas Instruments Incorporated | Method for maintaining the buffer capacity of siliceous chemical-mechanical silicon polishing slurries |
US6071818A (en) * | 1998-06-30 | 2000-06-06 | Lsi Logic Corporation | Endpoint detection method and apparatus which utilize an endpoint polishing layer of catalyst material |
GB2345657B (en) | 1999-01-13 | 2001-08-15 | United Microelectronics Corp | Lifetime self-indicated polishing pad |
DE20214971U1 (de) * | 2002-09-27 | 2002-11-28 | Klocke Verpackungs-Service GmbH, 76356 Weingarten | Vorrichtung zur Ermittlung und Anzeige mindestens einer physikalischen, chemischen oder biologischen Eigenschaft einer Testflüssigkeit |
-
2004
- 2004-09-22 JP JP2004275562A patent/JP4041107B2/ja not_active Expired - Fee Related
-
2005
- 2005-09-22 US US11/231,755 patent/US7172492B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US7172492B2 (en) | 2007-02-06 |
JP2006088261A (ja) | 2006-04-06 |
US20060068684A1 (en) | 2006-03-30 |
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