JP4035453B2 - 構造体、構造体の製造方法、及び該構造体を用いたデバイス - Google Patents

構造体、構造体の製造方法、及び該構造体を用いたデバイス Download PDF

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Publication number
JP4035453B2
JP4035453B2 JP2003031015A JP2003031015A JP4035453B2 JP 4035453 B2 JP4035453 B2 JP 4035453B2 JP 2003031015 A JP2003031015 A JP 2003031015A JP 2003031015 A JP2003031015 A JP 2003031015A JP 4035453 B2 JP4035453 B2 JP 4035453B2
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aluminum
silicon
germanium
substrate
atomic
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Japanese (ja)
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JP2004223695A (ja
JP2004223695A5 (hr
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和彦 福谷
透 田
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Canon Inc
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Canon Inc
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JP2003031015A 2002-02-12 2003-02-07 構造体、構造体の製造方法、及び該構造体を用いたデバイス Expired - Fee Related JP4035453B2 (ja)

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JP2003031015A JP4035453B2 (ja) 2002-02-12 2003-02-07 構造体、構造体の製造方法、及び該構造体を用いたデバイス

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002034006 2002-02-12
JP2002340944 2002-11-25
JP2003031015A JP4035453B2 (ja) 2002-02-12 2003-02-07 構造体、構造体の製造方法、及び該構造体を用いたデバイス

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JP2004223695A JP2004223695A (ja) 2004-08-12
JP2004223695A5 JP2004223695A5 (hr) 2006-03-23
JP4035453B2 true JP4035453B2 (ja) 2008-01-23

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Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4865200B2 (ja) * 2003-08-07 2012-02-01 キヤノン株式会社 ナノ構造体及びその製造方法
JP4965835B2 (ja) * 2005-03-25 2012-07-04 キヤノン株式会社 構造体、その製造方法、及び該構造体を用いたデバイス
JP2007146214A (ja) * 2005-11-25 2007-06-14 Canon Inc 相分離膜及び構造体の製造方法
JP5016957B2 (ja) * 2006-03-17 2012-09-05 キヤノン株式会社 凹凸構造を有する型及び光学素子用型の製造方法並びに光学素子
JP5964744B2 (ja) * 2012-12-26 2016-08-03 富士フイルム株式会社 半導体膜の製造方法
WO2015120893A1 (en) * 2014-02-13 2015-08-20 Mimsi Materials Ab Method of coating a substrate so as to provide a controlled in-plane compositional modulation

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