JP4027558B2 - パワーモジュール - Google Patents

パワーモジュール Download PDF

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Publication number
JP4027558B2
JP4027558B2 JP2000058676A JP2000058676A JP4027558B2 JP 4027558 B2 JP4027558 B2 JP 4027558B2 JP 2000058676 A JP2000058676 A JP 2000058676A JP 2000058676 A JP2000058676 A JP 2000058676A JP 4027558 B2 JP4027558 B2 JP 4027558B2
Authority
JP
Japan
Prior art keywords
case
support plate
power module
control
insulating substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2000058676A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001250910A (ja
JP2001250910A5 (enExample
Inventor
雅一 深田
泰 中島
健 高梨
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2000058676A priority Critical patent/JP4027558B2/ja
Priority to US09/657,236 priority patent/US6304448B1/en
Priority to DE10054962A priority patent/DE10054962B4/de
Publication of JP2001250910A publication Critical patent/JP2001250910A/ja
Publication of JP2001250910A5 publication Critical patent/JP2001250910A5/ja
Application granted granted Critical
Publication of JP4027558B2 publication Critical patent/JP4027558B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Inverter Devices (AREA)
JP2000058676A 2000-03-03 2000-03-03 パワーモジュール Expired - Fee Related JP4027558B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2000058676A JP4027558B2 (ja) 2000-03-03 2000-03-03 パワーモジュール
US09/657,236 US6304448B1 (en) 2000-03-03 2000-09-07 Power module
DE10054962A DE10054962B4 (de) 2000-03-03 2000-11-06 Leistungsmodul

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000058676A JP4027558B2 (ja) 2000-03-03 2000-03-03 パワーモジュール

Publications (3)

Publication Number Publication Date
JP2001250910A JP2001250910A (ja) 2001-09-14
JP2001250910A5 JP2001250910A5 (enExample) 2005-11-04
JP4027558B2 true JP4027558B2 (ja) 2007-12-26

Family

ID=18579240

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000058676A Expired - Fee Related JP4027558B2 (ja) 2000-03-03 2000-03-03 パワーモジュール

Country Status (3)

Country Link
US (1) US6304448B1 (enExample)
JP (1) JP4027558B2 (enExample)
DE (1) DE10054962B4 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8136917B2 (en) 2007-09-12 2012-03-20 Brother Kogyo Kabushiki Kaisha Image forming apparatus and image forming system

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* Cited by examiner, † Cited by third party
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JP4044265B2 (ja) * 2000-05-16 2008-02-06 三菱電機株式会社 パワーモジュール
USD469059S1 (en) 2001-06-18 2003-01-21 Kabushiki Kaisha Toshiba Power converter
US20040118144A1 (en) * 2002-12-20 2004-06-24 Hsu John S. Hermetic inverter/converter chamber with multiple pressure and cooling zones
DE102004010712A1 (de) * 2004-03-04 2005-09-22 Epcos Ag Gehäuse für Hochleistungsbauteile
US8125781B2 (en) 2004-11-11 2012-02-28 Denso Corporation Semiconductor device
JP2006230064A (ja) * 2005-02-16 2006-08-31 Toyota Motor Corp 電力変換ユニット
JP4564937B2 (ja) * 2006-04-27 2010-10-20 日立オートモティブシステムズ株式会社 電気回路装置及び電気回路モジュール並びに電力変換装置
JP5098284B2 (ja) * 2006-10-16 2012-12-12 富士電機株式会社 半導体装置
DE102007029913A1 (de) 2007-06-28 2009-01-02 Robert Bosch Gmbh Elektrisches Steuergerät
JP2009081325A (ja) 2007-09-27 2009-04-16 Sanyo Electric Co Ltd 回路装置
JP4934559B2 (ja) * 2007-09-27 2012-05-16 オンセミコンダクター・トレーディング・リミテッド 回路装置およびその製造方法
TWI402952B (zh) * 2007-09-27 2013-07-21 三洋電機股份有限公司 電路裝置及其製造方法
JP4991467B2 (ja) * 2007-09-27 2012-08-01 オンセミコンダクター・トレーディング・リミテッド 回路モジュールおよびそれを用いた室外機
TW200915970A (en) * 2007-09-27 2009-04-01 Sanyo Electric Co Circuit device, circuit module and outdoor equipment
JP4969388B2 (ja) * 2007-09-27 2012-07-04 オンセミコンダクター・トレーディング・リミテッド 回路モジュール
JP4936466B2 (ja) * 2007-10-23 2012-05-23 ニチコン株式会社 パワー半導体ユニット
DE102007061116A1 (de) * 2007-12-19 2009-06-25 Robert Bosch Gmbh Steuergerätegehäuse
JP2010062511A (ja) * 2008-08-07 2010-03-18 Calsonic Kansei Corp 半導体装置
KR101272726B1 (ko) * 2008-10-28 2013-06-10 가부시키가이샤 어드밴티스트 시험 장치, 회로 모듈, 및 제조 방법
DE102008054923B4 (de) * 2008-12-18 2018-04-26 Infineon Technologies Ag Leistungshalbleitermodul mit in Gehäusewand integriertem Kondensator hoher Kapazität
DE202009016531U1 (de) * 2009-12-04 2011-04-14 Liebherr-Elektronik Gmbh Leistungselektronische Baugruppe und Wechselrichteranordnung
JP5678568B2 (ja) * 2010-10-18 2015-03-04 富士通株式会社 電子機器
DE202011005290U1 (de) 2011-04-14 2011-06-09 Abb Technology Ag Leistungselektronisches Schaltsystem
CA2837050A1 (en) * 2011-05-31 2012-12-06 Eaton Corporation Plug-in composite power distribution assembly and system including same
JP5652346B2 (ja) * 2011-06-30 2015-01-14 株式会社明電舎 パワー半導体モジュール
EP2808226B1 (en) 2012-01-25 2017-10-04 Mitsubishi Electric Corporation Electric power steering device
EP2637489B1 (en) * 2012-03-06 2018-01-24 ABB Schweiz AG Electrical power circuit assembly
DE112012005299T5 (de) * 2012-03-19 2014-09-04 Mitsubishi Electric Corporation Halbleitervorrichtung und Halbleitersystem
WO2013175714A1 (ja) * 2012-05-22 2013-11-28 パナソニック株式会社 半導体装置及びその製造方法
DE102014207115A1 (de) * 2014-04-14 2015-10-15 Zf Friedrichshafen Ag Leistungsverarbeitende Schaltungsanordnung
DE102014007443A1 (de) * 2014-05-21 2015-11-26 Brose Fahrzeugteile Gmbh & Co. Kommanditgesellschaft, Hallstadt Elektrische Baugruppe für ein Kraftfahrzeug und Verfahren zur Montage einer solchen elektrischen Baugruppe
WO2016098759A1 (ja) * 2014-12-17 2016-06-23 日本精工株式会社 端子接続部及び接続方法
CN106340513B (zh) * 2015-07-09 2019-03-15 台达电子工业股份有限公司 一种集成控制电路的功率模块
DE102015222266A1 (de) * 2015-11-11 2017-05-11 Robert Bosch Automotive Steering Gmbh Elektromechanischer Stellantrieb mit redundantem elektronischen Teilsystem
DE102016202547A1 (de) * 2016-02-18 2017-08-24 Zf Friedrichshafen Ag Integriertes Steuergerät für ein Fahrzeug und Verfahren zum Herstellen eines integrierten Steuergerätes für ein Fahrzeug
US10798854B2 (en) 2018-04-25 2020-10-06 Ford Global Technologies, Llc Modular power module with integrated coolant passageway and assemblies thereof
DE102019100412A1 (de) * 2019-01-09 2020-07-09 Seg Automotive Germany Gmbh Stromrichtereinheit und elektrische Maschine
DE102023110166A1 (de) * 2023-04-21 2024-10-24 Danfoss Silicon Power Gmbh Halbleiterleistungsmodul

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8136917B2 (en) 2007-09-12 2012-03-20 Brother Kogyo Kabushiki Kaisha Image forming apparatus and image forming system

Also Published As

Publication number Publication date
DE10054962A1 (de) 2001-09-13
JP2001250910A (ja) 2001-09-14
DE10054962B4 (de) 2004-07-08
US6304448B1 (en) 2001-10-16

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