JP4020217B2 - コーティング厚さ制御 - Google Patents

コーティング厚さ制御 Download PDF

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Publication number
JP4020217B2
JP4020217B2 JP53142198A JP53142198A JP4020217B2 JP 4020217 B2 JP4020217 B2 JP 4020217B2 JP 53142198 A JP53142198 A JP 53142198A JP 53142198 A JP53142198 A JP 53142198A JP 4020217 B2 JP4020217 B2 JP 4020217B2
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JP
Japan
Prior art keywords
opening
air knife
lips
lip
pair
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP53142198A
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English (en)
Japanese (ja)
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JP2001508358A (ja
JP2001508358A5 (enExample
Inventor
ワラス，グレン
Original Assignee
インダストリアル・オートメーション・サービシズ・ピーティーワイ・リミテッド
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Application filed by インダストリアル・オートメーション・サービシズ・ピーティーワイ・リミテッド filed Critical インダストリアル・オートメーション・サービシズ・ピーティーワイ・リミテッド
Publication of JP2001508358A publication Critical patent/JP2001508358A/ja
Publication of JP2001508358A5 publication Critical patent/JP2001508358A5/ja
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Publication of JP4020217B2 publication Critical patent/JP4020217B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/14—Removing excess of molten coatings; Controlling or regulating the coating thickness
    • C23C2/16—Removing excess of molten coatings; Controlling or regulating the coating thickness using fluids under pressure, e.g. air knives
    • C23C2/18—Removing excess of molten coatings from elongated material
    • C23C2/20—Strips; Plates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B05C11/06—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface with a blast of gas or vapour
    • D—TEXTILES; PAPER
    • D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
    • D21H25/00—After-treatment of paper not provided for in groups D21H17/00 - D21H23/00
    • D21H25/08—Rearranging applied substances, e.g. metering, smoothing; Removing excess material
    • D21H25/16—Rearranging applied substances, e.g. metering, smoothing; Removing excess material with a blast of vapour or gas, e.g. air knife

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Coating Apparatus (AREA)
  • Coating With Molten Metal (AREA)
JP53142198A 1997-01-22 1998-01-22 コーティング厚さ制御 Expired - Fee Related JP4020217B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
AU4732 1991-02-22
AUPO4732A AUPO473297A0 (en) 1997-01-22 1997-01-22 Coating thickness control
PCT/AU1998/000030 WO1998032890A1 (en) 1997-01-22 1998-01-22 Coating thickness control

Publications (3)

Publication Number Publication Date
JP2001508358A JP2001508358A (ja) 2001-06-26
JP2001508358A5 JP2001508358A5 (enExample) 2005-09-08
JP4020217B2 true JP4020217B2 (ja) 2007-12-12

Family

ID=3799036

Family Applications (1)

Application Number Title Priority Date Filing Date
JP53142198A Expired - Fee Related JP4020217B2 (ja) 1997-01-22 1998-01-22 コーティング厚さ制御

Country Status (6)

Country Link
US (1) US6199301B1 (enExample)
JP (1) JP4020217B2 (enExample)
AU (1) AUPO473297A0 (enExample)
DE (1) DE19881989B4 (enExample)
GB (1) GB2336377B (enExample)
WO (1) WO1998032890A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8429834B2 (en) 2009-03-06 2013-04-30 Mitsubishi-Hitachi Metals Machinery, Inc. Gas wiping apparatus

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US6749390B2 (en) 1997-12-15 2004-06-15 Semitool, Inc. Integrated tools with transfer devices for handling microelectronic workpieces
US6752584B2 (en) 1996-07-15 2004-06-22 Semitool, Inc. Transfer devices for handling microelectronic workpieces within an environment of a processing machine and methods of manufacturing and using such devices in the processing of microelectronic workpieces
US6749391B2 (en) 1996-07-15 2004-06-15 Semitool, Inc. Microelectronic workpiece transfer devices and methods of using such devices in the processing of microelectronic workpieces
US6921467B2 (en) * 1996-07-15 2005-07-26 Semitool, Inc. Processing tools, components of processing tools, and method of making and using same for electrochemical processing of microelectronic workpieces
US6565729B2 (en) * 1998-03-20 2003-05-20 Semitool, Inc. Method for electrochemically depositing metal on a semiconductor workpiece
TW593731B (en) * 1998-03-20 2004-06-21 Semitool Inc Apparatus for applying a metal structure to a workpiece
US6497801B1 (en) * 1998-07-10 2002-12-24 Semitool Inc Electroplating apparatus with segmented anode array
US7020537B2 (en) * 1999-04-13 2006-03-28 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US6368475B1 (en) * 2000-03-21 2002-04-09 Semitool, Inc. Apparatus for electrochemically processing a microelectronic workpiece
WO2000061837A1 (en) 1999-04-13 2000-10-19 Semitool, Inc. Workpiece processor having processing chamber with improved processing fluid flow
US7351314B2 (en) 2003-12-05 2008-04-01 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US6916412B2 (en) * 1999-04-13 2005-07-12 Semitool, Inc. Adaptable electrochemical processing chamber
US7264698B2 (en) 1999-04-13 2007-09-04 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US20030038035A1 (en) * 2001-05-30 2003-02-27 Wilson Gregory J. Methods and systems for controlling current in electrochemical processing of microelectronic workpieces
US7351315B2 (en) 2003-12-05 2008-04-01 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7189318B2 (en) * 1999-04-13 2007-03-13 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7438788B2 (en) 1999-04-13 2008-10-21 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US7585398B2 (en) * 1999-04-13 2009-09-08 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7160421B2 (en) 1999-04-13 2007-01-09 Semitool, Inc. Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US6623609B2 (en) 1999-07-12 2003-09-23 Semitool, Inc. Lift and rotate assembly for use in a workpiece processing station and a method of attaching the same
AU2001259504A1 (en) * 2000-05-24 2001-12-03 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
WO2002004887A1 (en) * 2000-07-08 2002-01-17 Semitool, Inc. Methods and apparatus for processing microelectronic workpieces using metrology
KR20030018175A (ko) * 2001-08-27 2003-03-06 주식회사 포스코 에어나이프 노즐과 강판사이의 간격측정장치
AU2002343330A1 (en) 2001-08-31 2003-03-10 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US6630360B2 (en) 2002-01-10 2003-10-07 Advanced Micro Devices, Inc. Advanced process control (APC) of copper thickness for chemical mechanical planarization (CMP) optimization
US6991710B2 (en) * 2002-02-22 2006-01-31 Semitool, Inc. Apparatus for manually and automatically processing microelectronic workpieces
US20030159921A1 (en) * 2002-02-22 2003-08-28 Randy Harris Apparatus with processing stations for manually and automatically processing microelectronic workpieces
US6893505B2 (en) * 2002-05-08 2005-05-17 Semitool, Inc. Apparatus and method for regulating fluid flows, such as flows of electrochemical processing fluids
US20040031167A1 (en) * 2002-06-13 2004-02-19 Stein Nathan D. Single wafer method and apparatus for drying semiconductor substrates using an inert gas air-knife
US7114903B2 (en) * 2002-07-16 2006-10-03 Semitool, Inc. Apparatuses and method for transferring and/or pre-processing microelectronic workpieces
KR20040048263A (ko) * 2002-12-02 2004-06-07 주식회사 포스코 폭방향 에어 송풍량이 조절이 가능한 에어나이프 장치
US20050092611A1 (en) * 2003-11-03 2005-05-05 Semitool, Inc. Bath and method for high rate copper deposition
KR100903180B1 (ko) * 2006-05-22 2009-06-17 주식회사 엘지화학 리튬이온 폴리머 전지용 분리막의 코팅량 조절방법
WO2007142396A1 (en) * 2006-06-05 2007-12-13 Posco Gas wiping apparatus
CN1928147B (zh) * 2006-09-12 2012-09-19 攀钢集团攀枝花钢铁研究院 用于控制镀锌层厚度的气刀
EP2140944A1 (en) * 2008-07-03 2010-01-06 Linde AG Adjustable baffles for gas wiping
DE102008058513B4 (de) * 2008-11-21 2011-03-10 Berger, Bernd, Dr.-Ing. Vorrichtung zum Entfernen von Flüssigkeit von der Oberfläche eines bewegten Bandes und Bandbearbeitungsanlage mit solch einer Vorrichtung
JP5602371B2 (ja) * 2009-03-06 2014-10-08 三菱日立製鉄機械株式会社 ガスワイピング装置
KR101125649B1 (ko) * 2010-05-24 2012-03-27 삼성에스디아이 주식회사 활물질 코팅 장치 및 이를 이용한 코팅 방법
JP5857577B2 (ja) * 2011-09-22 2016-02-10 日本電気株式会社 塗工ダイヘッド
CN103510032B (zh) * 2012-06-20 2015-12-02 鞍钢股份有限公司 冷轧热镀锌镀层均匀度的偏差值控制方法
KR102362174B1 (ko) 2018-10-01 2022-02-10 주식회사 엘지에너지솔루션 슬롯 다이 코터의 상부 토출구와 하부 토출구 간의 거리를 조절하는 슬롯 다이 코터 조정 장치 및 이를 포함하는 전극 활물질 코팅 시스템

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US2568492A (en) * 1949-04-16 1951-09-18 Gen Aniline & Film Corp Adjustable nozzle
US3272176A (en) * 1964-04-13 1966-09-13 Du Pont Air knife
BE758803A (fr) * 1969-11-12 1971-04-16 Jones & Laughlin Steel Corp Procede pour controler le revetement d'un substrat
FR2090313B1 (enExample) * 1970-05-27 1974-04-26 Italsider Spa
US4041895A (en) * 1975-09-29 1977-08-16 Republic Steel Corporation Coating thickness and distribution control
US4106429A (en) * 1977-05-23 1978-08-15 Beloit Corporation Air knife with adjustable lip
US4270702A (en) * 1978-04-26 1981-06-02 Albany International Corp. Adjustable orifice air knife
DD152143A1 (de) * 1980-07-22 1981-11-18 Lothar Werk Vorrichtung zur erzeugung gleichmaessig dicker metallschichten auf feuermetallisiertem bandstahl
US4359964A (en) * 1981-05-20 1982-11-23 Beloit Corporation Air knife coater with pivoted lip
US4697542A (en) * 1985-05-13 1987-10-06 The Kohler Coating Machinery Corporation Adjustable nozzle for coating equipment
ATE45390T1 (de) * 1986-06-12 1989-08-15 Duma Konstruktionsbuero Abblasvorrichtung zum kontinuierlichen beidseitigen beschichten von metallband.
DE4024229C1 (enExample) * 1990-07-31 1991-07-18 Heinrich 4100 Duisburg De Pannenbecker
US5221345A (en) * 1990-10-12 1993-06-22 National Galvanizing Inc. Method and apparatus for coating a strip
GB9106925D0 (en) * 1991-04-03 1991-05-22 Air Controls Installations Cha Air knife
FR2690170B1 (fr) * 1992-04-17 1995-03-31 Clecim Sa Dispositif à lame d'air de régulation d'un dépôt métallique.
ATE197822T1 (de) * 1994-07-14 2000-12-15 Fontaine Eng & Maschinen Gmbh Vorrichtung und verfahren zum kontrollieren der beschichtungsgewicht eines metallüberzuges mittels blasdüsen
FR2726288B1 (fr) * 1994-10-27 1997-01-17 Clecim Sa Dispositif a lame d'air pour le reglage de l'epaisseur d'un depot

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8429834B2 (en) 2009-03-06 2013-04-30 Mitsubishi-Hitachi Metals Machinery, Inc. Gas wiping apparatus
DE102010008989B4 (de) 2009-03-06 2018-07-26 Primetals Technologies Japan, Ltd. Gasabstreifvorrichtung

Also Published As

Publication number Publication date
GB9916682D0 (en) 1999-09-15
AUPO473297A0 (en) 1997-02-20
WO1998032890A1 (en) 1998-07-30
GB2336377B (en) 2001-07-25
GB2336377A (en) 1999-10-20
DE19881989T1 (de) 2000-02-10
US6199301B1 (en) 2001-03-13
JP2001508358A (ja) 2001-06-26
DE19881989B4 (de) 2009-05-14

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