JP4008450B2 - Test fixture - Google Patents

Description

  The present invention relates to a test fixture that holds a lead in contact with a conductor in order to measure electrical characteristics of an electronic device having the lead, and a test fixture that provides a contact member to conduct a lead and a conductor pattern. About.

  In order to measure the electrical characteristics of an electronic device, a signal generator that provides a measurement signal to the electronic device and a signal processing unit that measures the signal output from the electronic device are stabilized on the leads that are external terminals of the electronic device. Must be in contact. Therefore, a test fixture (inspection jig) for holding the electronic device in a predetermined position and bringing the conductor of the measurement substrate connected to the signal generation unit or the signal processing unit into contact with the lead of the electronic device to conduct. Is used.

For example, an electronic device measuring jig disclosed in Patent Document 1 below is formed on a pair of side surfaces of a device support by placing an electronic device having a plurality of leads on an insulating device support. A plurality of leads are held in two rows in a plurality of grooves. Then, two measurement substrates are arranged outside the leads so that the lead of the electronic device and the conductor pattern of the measurement substrate are parallel, and the two blocks are arranged movably outside the measurement substrate. In this block, the conductor pattern was pressed against the lead to achieve conduction.
JP 2004-198303 A

  However, in the electronic device measurement jig as described above, since the conductor pattern of the measurement substrate is formed of a thin layer of a conductor (metal, etc.) such as a copper foil, in order to measure a large number of electronic devices. When the attachment / detachment of the electronic device is repeated, the conductor pattern (copper foil) in contact with the lead is scraped to cause a connection failure, and the electrical characteristics of the electronic device may not be accurately measured.

  Therefore, as shown in FIG. 6, a contact member 103 made of a conductive material (such as gold) is provided at a contact position between the lead 101 of the electronic device 100 and the conductor pattern 102, and the lead 101 is interposed via the contact member 103. It is conceivable that the conductor pattern 102 is electrically connected. Thereby, conduction can be achieved without the lead 101 and the conductor pattern 102 being in direct contact, and even if the electronic device 100 is repeatedly attached and detached, damage to the conductor pattern 102 due to the contact of the lead 101 is suppressed. The pattern 102 is always correctly connected, and the electrical characteristics of the electronic device 100 can be accurately measured.

  However, when the electronic device 100 is configured to be detachable and the lead 101 and the conductor pattern 102 are electrically connected using the contact member 103, the contact member 103 needs to be held at a predetermined position on the conductor pattern 102. is there. At that time, there is a method of pressing the contact member 103 in the direction of the arrow in the figure, but it is difficult to press only the contact member 103 because it is blocked by the contacting lead 101. Further, in order to ensure contact with the lead 101, the contact member 103 can be held at a predetermined position as a secondary effect when the lead 101 is pressed together in the direction of the arrow, but to the lead 101 to take out the electronic device 100. When the pressure is loosened, the holding of the contact member 103 is also released. In order to hold the contact member 103 again, it is necessary to perform a complicated operation of placing the contact member 103 in a predetermined position, bringing the lead 101 into contact, and pressing the lead 101 together in the direction of the arrow.

  Further, when the lead 101 (and the contact member 103) is pressed in the direction of the arrow, a force is applied in the surface direction of the measurement substrate 104, the substrate 104 is deformed, and the conductor pattern 102 made of copper foil is peeled off or damaged. There is a risk that.

  Therefore, the present invention was made in view of the above situation, and by providing a contact member at the contact position between the lead of the electronic device and the conductor pattern, even if the electronic device is repeatedly attached and detached, the damage to the conductor pattern is suppressed, It is a first object to provide a test fixture that achieves a long life by suppressing deformation of the substrate and damage to the conductor pattern because no force is applied to the conductor pattern even when the lead is brought into contact with the contact member. It is a second object of the present invention to provide a test fixture that secures a space for pressing the contact member on a surface different from the contact portion of the contact member with the lead.

Next, means for solving the above problems will be described with reference to the drawings corresponding to the embodiments.
A test fixture 1 according to claim 1 of the present invention is a test fixture 1 for measuring electrical characteristics of an electronic device 2 having leads 3,
A first transmission line 5 in which the lead 3 is arranged and matched so that the characteristic impedance becomes a predetermined value;
A second transmission line 6 formed on a different surface from the first transmission line 5 and having a conductor pattern 10 formed on the surface for leading an electrical signal to an external connector;
A contact member 7 provided on one end of the second transmission line 6 adjacent to the first transmission line 5 and in contact with the conductor pattern 10 and the tip of the lead 3;
It is characterized by comprising.

  According to such a configuration, the contact member 7 is provided at the contact position between the lead 3 and the conductor pattern 10, so that conduction can be achieved without direct contact between the lead 3 and the conductor pattern 10. Thereby, even if attachment / detachment of the electronic device 2 is repeated, damage to the conductor pattern 10 due to the lead 3 (particularly, the tip portion of the lead 3) can be suppressed. Further, since the first and second transmission lines 5 and 6 are configured on different surfaces, for example, the lead 3 is directed toward the conductor pattern 10 for the purpose of surely contacting the lead 3 and the conductor pattern 10. Since no force is applied to the conductor pattern 10 forming surface of the substrate portion 9 constituting the second transmission line 6 when pressed, the deformation of the substrate portion 9 is suppressed, and the conductor pattern 10 is peeled off or damaged. Can be suppressed. Further, since a space is formed on the contact member 7 on a different surface from the other contact portion 12 with which the lead 3 contacts, a sufficient space can be secured for purposes other than the contact of the lead 3.

The test fixture 1 according to claim 2 is configured such that the first transmission line 5 and the second transmission line 6 are orthogonal to each other.
The contact member 7 is formed in a plane parallel to the second transmission line 6 and is in contact with the conductor pattern 10, and the first transmission line 5 of the one contact part 11. And the other contact portion 12 that is formed in a plane that is orthogonal to the one contact portion 11 and parallel to the first transmission line 5 and is in contact with the lead 3 at one end close to the contact portion 11. It is characterized by.

  According to such a configuration, the first and second transmission lines 5 and 6 are formed on surfaces orthogonal to each other, and the contact member 7 is formed in a substantially L-shaped cross section. Since the contact is made from the longitudinal direction, which is the end face of the substrate portion 9 constituting the transmission line 6, sufficient strength against the contact of the leads 3 can be secured to the substrate portion 9. As a result, it is possible to suppress deformation of the substrate portion 9 and suppress peeling and damage of the conductor pattern 10.

  The test fixture 1 according to a third aspect is characterized in that a holding means 13 for holding the contact member 7 at a predetermined position on the second transmission line 6 is provided.

  In the test fixture 1 according to claim 4, the holding means 13 presses the one contact portion 11 of the contact member 7 against the second transmission line 6 surface side by a contact pressing block 14 made of an insulator. It is characterized by that.

  According to such a configuration, it is possible to easily hold only the contact member 7 without being obstructed by the lead 3 or the like by pressing the one contact portion 11 of the contact member 7 with the contact pressing block 14. . Further, the contact member 7 can be held and released, and the contact member 7 can be easily replaced.

  The test fixture 1 according to claim 5 is characterized in that pressing means 15 for elastically deforming the lead 3 of the electronic device 2 is provided.

  The test fixture 1 according to claim 6 is characterized in that the pressing means 15 presses the lead 3 against the surface of the first transmission line 5 by a lead pressing block 16 made of an insulator.

  According to such a configuration, the tip of the lead 3 can be reliably brought into contact with the contact member 7 by elastically deforming the lead 3 itself.

  According to the test fixture of the present invention, the contact member is provided at the contact position between the lead and the conductor pattern, so that conduction can be achieved without direct contact between the lead and the conductor pattern. Thereby, even if attachment / detachment of an electronic device is repeated, damage to the conductor pattern due to the lead is suppressed, and the lead and the conductor pattern are always correctly connected, and the electrical characteristics of the electronic device can be accurately measured. In addition, since no force is applied to the conductor pattern surface of the substrate portion constituting the second transmission line, it is possible to suppress deformation of the substrate portion and further to prevent peeling and damage of the conductor pattern. As a result, the life of the test fixture can be extended, and the cost for the inspection equipment can be reduced. Furthermore, since the replacement cycle of consumable parts such as contact members becomes longer, the operating rate of the equipment is improved.

  In addition, since a space is formed on the contact member on a different (orthogonal) surface from the one contact portion with which the lead contacts, a sufficient space can be secured for purposes other than the contact of the lead.

Embodiments of the present invention will be specifically described below with reference to the drawings.
FIG. 1 is a schematic perspective view showing a main part of an embodiment of a test fixture according to the present invention, and FIG. 2 is a side sectional view showing a state in which holding means and pressing means are provided in FIG.

  As shown in FIG. 1, the test fixture 1 according to the present embodiment has an electronic device 2 in which an electronic device 2 in which a plurality of leads 3 are led out substantially vertically from one end surface 2 a is measured. It is an instrument (jig) used for holding the device 2 and bringing each transmission line into contact with and conducting with each lead 3.

  The test fixture 1 includes a main body 4, a first transmission line 5, a second transmission line 6 substantially orthogonal to the first transmission line 5, and a second transmission line as main components. 6 and a contact member 7 provided at one end close to the first transmission line 5.

  As shown in FIG. 1, the main body 4 holds each member constituting the test fixture 1. The main body 4 is made of a conductor and plays a role of grounding (GND) an electric signal of each transmission line described later.

  As shown in FIGS. 1 and 2, the first transmission line 5 includes a substrate portion 8 made of an insulator disposed in the main body 4, a lead 3 of the electronic device 2 disposed on the substrate portion 8, and The main body 4 (GND) is a constituent element, and the characteristic impedance from the lead 3 to the main body 4 (GND) is matched to a predetermined value (about 50Ω in this embodiment). In the present embodiment, the substrate portion 8 is made of Teflon (registered trademark).

  The second transmission line 7 is disposed in the main body 4 so as to be substantially orthogonal to the substrate surface of the substrate part 8 that constitutes the first transmission line 5 described above, and the substrate part 8 and the end parts are arranged with each other. The board part 9 which adjoins, the conductor pattern 10 which is formed on this board | substrate part 9, and leads an electric signal to the external connector which is not shown in figure, and the main body 4 (GND) are made into the component. In the present embodiment, the substrate portion 9 is formed of Teflon (registered trademark) as in the case of the substrate portion 8 constituting the first transmission line 5 described above, and the conductor pattern 10 is made of copper foil or the like. It is made of a thin layer of metal.

  As shown in FIGS. 1 and 2, the contact member 7 is made of a conductive material such as gold, and is provided on one end of the second transmission line 6 near the first transmission line 5. It has been. The contact member 7 is on one contact portion 11 which is a surface parallel to the substrate portion 9 constituting the second transmission line 6 and on the first transmission line 5 side in the longitudinal direction of the one contact portion 11. It is formed at one end, and is composed of the other contact portion 12 which is substantially orthogonal to one contact portion 11 and is parallel to the substrate portion 8 constituting the first transmission line 5, and has a substantially L-shaped cross section. Is formed. Furthermore, one contact portion 11 of the contact member 7 is in contact with the conductor pattern 10, and the other contact portion 12 is in contact with the tip of the lead 3 of the electronic device 2 in a state where the electronic device 2 is disposed.

  As shown in FIG. 2, as the holding means 13 for holding the contact member 7, means for pressing the contact member 7 in the direction of arrow A by the contact pressing block 14 is used. The contact pressing block 14 is formed of, for example, an insulator such as Teflon (registered trademark), and holds the contact member 7 at the predetermined position as described above and makes one contact portion 11 contact the conductor pattern 10.

  Here, the holding means 13 includes means for fixing the contact member 7 at a predetermined position by soldering, in addition to the means for pressing the contact member 7 with the contact pressing block 14 as described above.

  As shown in FIG. 2, the test fixture 1 is provided with pressing means 15 for bringing the lead 3 into contact with the contact member 7 when the electronic device 2 is arranged. As the pressing means 15, like the contact pressing block 14 described above, a lead pressing block 16 made of an insulator such as Teflon (registered trademark) presses the lead 3 in the direction of arrow B. Thereby, the lead 3 is elastically deformed, and the tip portion of the lead 3 can be brought into contact with the other contact portion 12 of the contact member 7 with certainty. In the drawing, the lead pressing block 16 presses the tip of the lead 3, but the present invention is not limited to this, and any part of the lead 3 may be pressed.

  According to the test fixture according to this embodiment, the contact member 7 is provided at the contact position between the lead 3 and the conductor pattern 10, so that conduction can be achieved without direct contact between the lead 3 and the conductor pattern 10. It becomes like this. Thereby, even if attachment / detachment of the electronic device 2 is repeated, damage to the conductor pattern 10 due to the lead 3 (particularly, the tip portion of the lead 3) can be suppressed. In addition, since the first and second transmission lines 5 and 6 are configured to be orthogonal to each other, when the lead 3 is pressed against the contact member 7 by the lead holding block 16, Since no force is applied, it is possible to suppress deformation of the substrate portion 9 and the like, and to suppress peeling and damage of the conductor pattern 10. Further, since a space is formed in the contact member 7 on a surface orthogonal to the other contact portion 12 with which the lead 3 comes into contact, the contact member 7 is sufficient to hold the contact member 7 in a predetermined position. Space can be secured.

  Further, since the lead 3 comes into contact with the contact member 7 from the longitudinal direction which is the end face of the substrate part 9 constituting the second transmission line 6, the lead 3 is brought into contact with the substrate part 9 and the conductor pattern 10 or the lead presser. Sufficient strength can be secured against pressing of the lead 3 by the block 16. As a result, it is possible to suppress deformation of the substrate portion 9 and suppress peeling and damage of the conductor pattern 10.

  Furthermore, by pressing the one contact portion 11 of the contact member 7 with the contact pressing block 14, it is possible to easily hold only the contact member 7 without being obstructed by the lead 3 or the like. Further, the contact member 7 can be held and released, and the contact member 7 can be easily replaced.

  According to the above-described embodiment (shown in FIGS. 1 and 2), each of the substrate portions 8 and 9 is entirely formed of Teflon (registered trademark), but is shown in FIG. Thus, it is good also as a structure by which the one end part of the board | substrate part 9 which comprises the 2nd transmission line 6 is reinforced with the reinforcement member 20 which consists of hard synthetic resins. As a result, the other contact portion 12 of the contact member 7 extends on the end surface of the reinforcing member 20 and the strength of the portion where the lead 3 contacts is increased. The load can be reduced. Therefore, for example, even when the electronic device 2 is attached or detached more than a specified number of times, damage to the substrate unit 9 can be suppressed.

  In addition, according to the embodiment shown in FIGS. 1 and 2, the contact member 7 has a substantially L-shaped cross section. However, as shown in FIG. 4, the contact member 30 has a substantially U-shaped cross section. It is good also as a structure currently formed in the shape. The contact member 30 is bent so that the lower end portion of one contact portion 31 facing in the vertical direction is substantially parallel to the other contact portion 32 in contact with the lead 3 of the electronic device 2. 33 is provided. Further, the substrate portion 9 constituting the second transmission line 6 is provided with a substantially rectangular hole 34 into which the bent portion 33 can be inserted, and the conductor pattern 10 has an upper end portion with a hole portion 34. It is bent along the inner surface and slightly enters the inside of the hole 34. When the contact member 30 is attached, the bent portion 34 is inserted into the hole 34 of the substrate portion 9, and the outer surface of the bent portion 33 comes into contact with the conductor pattern 10. As a result, the contact member 30 is prevented from shifting in the horizontal direction, and is more reliably held at a predetermined position.

  Further, according to the embodiment shown in FIGS. 1 and 2, the contact member 7 is provided on the substrate portion 9 constituting the second transmission line 6, and the other contact portion 12 of the contact member 7 is the substrate portion 9. However, as shown in FIG. 5 (a), the contact member 7 has the other contact portion 12 in contact with the lead 3 in advance as a contact retainer made of a hard synthetic resin or the like. It is good also as a structure extended to the upper surface of the block 40, attaching to this contact-holding block 40, and pressing down to the board | substrate part 9 by this contact-holding block 40 as shown in FIG.5 (b) after that. As a result, the contact holding block 40 side receives the pressure from the lead holding block 16 that brings the lead 3 into contact with the contact member 7, and the load on the board portion 9 can be reduced as described above. The effect that damage of 9 can be suppressed is acquired.

It is a schematic perspective view which shows the principal part of one Embodiment of the test fixture by this invention. It is a sectional side view which shows the state which provided the holding means and the press means in FIG. It is a sectional side view which shows the principal part of other embodiment. It is a sectional side view which shows the principal part of other embodiment. It is a sectional side view which shows the principal part of other embodiment. It is a sectional side view which shows the state which provided the contact member in the conventional test fixture, and electrically connected the lead | read | reed and the conductor.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Test fixture 2 ... Electronic device 3 ... Lead 5 ... 1st transmission line 6 ... 2nd transmission line 7 ... Contact member 10 ... Conductor pattern 11 ... One contact part 12 ... Other contact part 13 ... Holding means 14 ... Contact pressing block 15 ... Pressing means 16 ... Lead pressing block

Claims (6)

A test fixture (1) for measuring electrical characteristics of an electronic device (2) having a lead (3), comprising:
A first transmission line (5) in which the leads are arranged and matched so that the characteristic impedance is a predetermined value;
A second transmission line (6) formed on a different surface from the first transmission line, on which a conductor pattern (10) for leading an electrical signal to an external connector is formed;
A contact member (7) provided on one end of the second transmission line close to the first transmission line, in contact with the conductor pattern and with the leading end of the lead;
A test fixture characterized by comprising: The first transmission line and the second transmission line are configured on surfaces orthogonal to each other,
The contact member is formed in a plane parallel to the second transmission line, and is in contact with the first transmission line of the one contact part and the one contact part (11) in contact with the conductor pattern One end includes a contact portion (12) that is perpendicular to the one contact portion and parallel to the first transmission line, and that contacts the lead, and has a substantially L-shaped cross section. The test fixture according to claim 1.   3. The test fixture according to claim 1, further comprising holding means (13) for holding the contact member at a predetermined position on the second transmission line.   The test fixture according to claim 3, wherein the holding means presses the one contact portion of the contact member against the second transmission line surface side by a contact pressing block (14) made of an insulator. .   5. The test fixture according to claim 1, further comprising pressing means (15) for elastically deforming the lead of the electronic device.   6. The test fixture according to claim 5, wherein the pressing means presses the lead against the first transmission line surface side by a lead holding block made of an insulator.

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