JP2006147312A - Connector - Google Patents

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Publication number
JP2006147312A
JP2006147312A JP2004334994A JP2004334994A JP2006147312A JP 2006147312 A JP2006147312 A JP 2006147312A JP 2004334994 A JP2004334994 A JP 2004334994A JP 2004334994 A JP2004334994 A JP 2004334994A JP 2006147312 A JP2006147312 A JP 2006147312A
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substrate
conductive
protection device
connector
terminal
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JP4553306B2 (en
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Yujiro Sugaya
勇次郎 菅谷
Masaru Nagasu
勝 長州
Takanobu Nishikawa
卓延 西川
Akio Yasuda
彰夫 安田
Hiroshi Kawabata
博 川幡
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Iriso Electronics Co Ltd
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Iriso Electronics Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a connector not generating breakage even if a thickness of a base plate of an overvoltage protection device is reduced, capable of easily and surely connecting an overvoltage protection device. <P>SOLUTION: The breakage is not generated even if the thickness of the base plate 51 is reduced, the thickness of the base plate can be reduced comparing with hard material, and error of the position where respective terminals 20 or ground plates 40 contact the over voltage protection device can be absorbed by bending deformation because the base plate 51 of the over voltage protection device 50 is formed by using a member having elasticity in thickness direction. Further, since the respective terminals 20 and engaging parts of ground plates 40 are made to engage with notched parts formed on the base plate 51 and a first and second conduction parts 52, 53, the base plate 51 can be easily and correctly positioned against the respective terminals 20 and ground plates 40, and the respective terminals 20 and ground plates 40 and the base plate 51 can be surely fixed in a width direction. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、例えばフレキシブルプリント回路(FPC)やフレキシブルフラットケーブル(FFC)等を接続するためのコネクタに関するものである。   The present invention relates to a connector for connecting, for example, a flexible printed circuit (FPC) or a flexible flat cable (FFC).

従来、この種のコネクタとしては、FPCやFFC等の接続対象物の一端を所定位置に挿入可能なコネクタ本体と、コネクタ本体内に互いに幅方向に間隔をおいて配置された複数の端子とを備え、各端子をコネクタ本体内に挿入された接続対象物に接触するようにしたものが知られている(例えば、特許文献1参照。)。   Conventionally, this type of connector includes a connector main body in which one end of an object to be connected such as FPC or FFC can be inserted at a predetermined position, and a plurality of terminals arranged in the connector main body at intervals in the width direction. It is known that each terminal is brought into contact with a connection object inserted into the connector body (see, for example, Patent Document 1).

ところで、近年の情報伝達量の増大により、各種電気デバイスにおける高速化、集積化が進み、このためIC等の電子部品における絶縁壁が薄くなり、静電気(ESD)等の過電圧によって電子部品が破壊される問題がある。また、信号のデジタル化によってコネクタ等の配線機器が多極化したことにより、過電圧から電子部品を保護するためには多数の保護装置を取付ける必要があるが、機器の小型化により回路基板上に保護装置を実装するスペースが少なくなっているのも現状である。   By the way, with the increase in the amount of information transmitted in recent years, the speed and integration of various electric devices have progressed. As a result, the insulating walls of electronic components such as ICs have become thinner, and the electronic components have been destroyed by overvoltage such as static electricity (ESD). There is a problem. In addition, due to the digitalization of signals and the increased number of wiring devices such as connectors, it is necessary to install a large number of protective devices to protect electronic components from overvoltages. It is the present situation that the space for mounting is reduced.

そこで、コネクタに過電圧保護装置を取付けることにより、回路基板における保護装置の取付スペースを不要にすることが有効である。即ち、このように形成された過電圧保護装置としては、コネクタの底面に取付けられる基板にコネクタの各端子を挿通する複数の貫通孔を設け、各端子を貫通孔に半田付けするようにしたものが知られている(例えば、特許文献2の図10参照。)。   Therefore, it is effective to eliminate an installation space for the protection device on the circuit board by attaching an overvoltage protection device to the connector. That is, as the overvoltage protection device formed in this way, there is a device in which a plurality of through holes for inserting each terminal of the connector are provided on a substrate attached to the bottom surface of the connector, and each terminal is soldered to the through hole. It is known (see, for example, FIG. 10 of Patent Document 2).

この過電圧保護装置では、各端子に接続した回路に過電圧が生ずると、可変抵抗体によって信号線用端子とグランド用端子とを導通させ、過電圧をグランド用端子を介して外部に放電するようになっている。
特開2002−252049号公報 特表2000−516031号公報
In this overvoltage protection device, when an overvoltage occurs in a circuit connected to each terminal, the signal line terminal and the ground terminal are made conductive by the variable resistor, and the overvoltage is discharged to the outside through the ground terminal. ing.
JP 2002-252049 A Special Table 2000-516031

しかしながら、前記過電圧保護装置では、基板をガラス板、セラミック板等の硬質の部材によって形成しているため、基板の厚さを薄くすると機械的強度が低下し、コネクタに装着する際に破損し易いという欠点がある。このため、基板の厚さ寸法が大きくなり、コネクタ全体の大型化を来すという問題点があった。また、ガラス板やセラミック板からなる基板は弾性または可撓性を有していないため、コネクタの端子に変形させながら圧接することができない。このため、基板の孔に端子を挿入して半田付けするという繁雑な接続作業を必要とし、生産性を低下させるという問題点もあった。   However, in the overvoltage protection device, since the substrate is formed of a hard member such as a glass plate or a ceramic plate, the mechanical strength is reduced when the thickness of the substrate is reduced, and the substrate is easily damaged when attached to the connector. There is a drawback. For this reason, there has been a problem that the thickness dimension of the substrate is increased and the overall size of the connector is increased. Moreover, since the board | substrate which consists of a glass plate or a ceramic board does not have elasticity or flexibility, it cannot press-contact, deform | transforming into the terminal of a connector. For this reason, the complicated connection operation | work which inserts a terminal in the hole of a board | substrate and solders is required, and there also existed a problem that productivity fell.

本発明は前記問題点に鑑みてなされたものであり、その目的とするところは、過電圧保護装置の基板を薄く形成しても破損を生ずることがなく、過電圧保護装置を容易且つ確実に接続することのできるコネクタを提供することにある。   The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to connect the overvoltage protection device easily and reliably without causing damage even if the substrate of the overvoltage protection device is formed thin. It is to provide a connector that can be used.

本発明は前記目的を達成するために、基板上に形成された第1導電部と、第1導電部と所定間隔の隙間をおいて基板上に形成された複数の第2導電部と、第1導電部と第2導電部との間に過電圧が生ずると電気抵抗が低下して第1導電部と各第2導電部とを導通する可変抵抗体とからなる過電圧保護装置を備え、第1導電部をグランド部材に接続し、各第2導電部を複数の信号線用端子にそれぞれ接続したコネクタにおいて、前記過電圧保護装置の基板を厚さ方向に可撓性を有する部材によって形成するとともに、基板及び各導電部には各端子及びグランド部材に設けた係合部をそれぞれ係合する切り欠き部を設けている。   In order to achieve the above object, the present invention provides a first conductive portion formed on a substrate, a plurality of second conductive portions formed on the substrate with a predetermined gap from the first conductive portion, When an overvoltage is generated between the first conductive portion and the second conductive portion, the first embodiment includes an overvoltage protection device including a variable resistor that lowers the electrical resistance and electrically connects the first conductive portion and each second conductive portion. In the connector in which the conductive portion is connected to the ground member and each second conductive portion is connected to the plurality of signal line terminals, the substrate of the overvoltage protection device is formed of a member having flexibility in the thickness direction, The substrate and each conductive portion are provided with notches for engaging the engaging portions provided on the terminals and the ground member, respectively.

これにより、過電圧保護装置の基板が厚さ方向に可撓性を有する部材によって形成されることから、基板を薄く形成しても破損を生ずることがなく、硬質の材料に比べて薄く形成することができるとともに、基板の曲げ変形によって端子またはグランド部材と過電圧保護装置との接触位置の誤差が吸収される。また、基板及び各導電部の切り欠き部にそれぞれ各端子及びグランド部材の係合部が係合することから、切り欠き部と係合部との係合により基板が位置決めされるとともに、各導電部を切り欠き部の内周に沿って係合部と接続することができ、更には各端子及びグランド部材と基板とが幅方向に固定される。   As a result, since the substrate of the overvoltage protection device is formed by a member having flexibility in the thickness direction, even if the substrate is formed thin, it is not damaged, and is formed thinner than a hard material. In addition, the error in the contact position between the terminal or ground member and the overvoltage protection device is absorbed by bending deformation of the substrate. In addition, since the engaging portions of the terminals and the ground member are engaged with the notches of the substrate and the conductive portions, respectively, the substrate is positioned by the engagement of the notches and the engaging portions, and The portion can be connected to the engaging portion along the inner periphery of the notch, and each terminal, the ground member, and the substrate are fixed in the width direction.

本発明のコネクタによれば、過電圧保護装置の基板を薄く形成しても破損を生ずることがないので、過電圧保護装置を容易且つ確実に装着することができるとともに、過電圧保護装置の基板を硬質の材料よりも薄く形成することができるので、小型化を図ることができる。この場合、過電圧保護装置と端子またはグランド部材との接触位置の誤差を吸収することができるので、接触不良や装着不良を確実に防止することができる。また、切り欠き部と係合部との係合により、各端子及びグランド部材に対する基板の位置決めを容易且つ確実に行うことができるとともに、各導電部を切り欠き部の内周に沿って係合部と接続することができるので、接続面積を大きくすることができる。更に、各端子及びグランド部材と基板とを幅方向に確実に固定することができるので、接続部分に加わる応力を小さくすることができ、接続信頼性の向上を図ることができる。   According to the connector of the present invention, there is no damage even if the substrate of the overvoltage protection device is formed thin, so that the overvoltage protection device can be easily and reliably mounted, and the substrate of the overvoltage protection device is rigid. Since it can be formed thinner than the material, downsizing can be achieved. In this case, an error in the contact position between the overvoltage protection device and the terminal or the ground member can be absorbed, so that contact failure and mounting failure can be reliably prevented. In addition, the engagement between the notch and the engaging portion enables easy and reliable positioning of the substrate with respect to each terminal and ground member, and each conductive portion is engaged along the inner periphery of the notch. Since it can connect with a part, a connection area can be enlarged. Furthermore, since each terminal and ground member and the substrate can be securely fixed in the width direction, the stress applied to the connection portion can be reduced, and the connection reliability can be improved.

図1乃至図11は本発明の一実施形態を示すもので、図1はコネクタの正面側斜視図、図2はその背面側斜視図、図3は過電圧保護装置の正面図、図4はその側面断面図、図5はその分解斜視図、図6は基板の正面図、図7は端子及び過電圧保護装置の要部斜視図、図8はその要部側面断面図、図9はグランドプレート及び過電圧保護装置の要部斜視図、図10及び図11はコネクタの側面断面図である。   1 to 11 show an embodiment of the present invention. FIG. 1 is a front perspective view of a connector, FIG. 2 is a rear perspective view thereof, FIG. 3 is a front view of an overvoltage protection device, and FIG. 5 is an exploded perspective view of the substrate, FIG. 6 is a front view of the substrate, FIG. 7 is a perspective view of the main part of the terminal and the overvoltage protection device, FIG. 8 is a side cross-sectional view of the main part, and FIG. FIG. 10 and FIG. 11 are side cross-sectional views of the connector.

このコネクタは、接続対象物としてのフレキシブル回路Aの一端を挿入可能なコネクタ本体10と、コネクタ本体10内に互いに幅方向に等間隔で配置された複数の端子20と、フレキシブル回路Aを各端子20側に押圧する押圧部材30と、回路基板Bのグランド電極に接続される一対のグランドプレート40と、過電圧発生時に各端子20と各グランドプレート40とを導通する過電圧保護装置50とから構成されている。   This connector includes a connector main body 10 into which one end of a flexible circuit A as a connection object can be inserted, a plurality of terminals 20 arranged at equal intervals in the width direction within the connector main body 10, and the flexible circuit A as each terminal. And a pair of ground plates 40 connected to the ground electrode of the circuit board B, and an overvoltage protection device 50 that electrically connects each terminal 20 and each ground plate 40 when an overvoltage occurs. ing.

フレキシブル回路Aは、いわゆるフレキシブルプリント回路(FPC)からなり、その先端側の上方の面には複数の電気接点(図示せず)が互いに幅方向に間隔をおいて設けられている。尚、接続対象物としては、フレキシブルフラットケーブル(FFC)等であってもよい。   The flexible circuit A is a so-called flexible printed circuit (FPC), and a plurality of electrical contacts (not shown) are provided at intervals in the width direction on the upper surface on the tip side. In addition, as a connection target object, a flexible flat cable (FFC) etc. may be sufficient.

コネクタ本体10は合成樹脂の成型品からなり、前面側を開口した箱状に形成されている。即ち、コネクタ本体10は、上面部11、底面部12及び側面部13からなり、前面開口部からフレキシブル回路Aが挿入されるようになっている。コネクタ本体10には複数の端子孔10aが互いに幅方向に等間隔で設けられ、各端子孔10aには各端子20がそれぞれ保持されるようになっている。コネクタ本体10の幅方向両側には各グランドプレート40を保持するための一対の長孔13aが設けられ、各長孔13aはコネクタ本体10の上下方向に貫通するように形成されている。また、コネクタ本体10の各側面部13には押圧部材30を係合するための切り欠き部13bが設けられ、各切り欠き部13bはコネクタ本体10の前後方向に延びるように形成されている。   The connector main body 10 is made of a synthetic resin molded product, and is formed in a box shape having an open front side. That is, the connector main body 10 includes an upper surface portion 11, a bottom surface portion 12, and a side surface portion 13, and the flexible circuit A is inserted from the front opening. The connector body 10 is provided with a plurality of terminal holes 10a at equal intervals in the width direction, and the terminals 20 are held in the terminal holes 10a, respectively. A pair of long holes 13 a for holding each ground plate 40 is provided on both sides in the width direction of the connector body 10, and each long hole 13 a is formed so as to penetrate in the vertical direction of the connector body 10. Each side surface portion 13 of the connector main body 10 is provided with a notch portion 13b for engaging the pressing member 30, and each notch portion 13b is formed to extend in the front-rear direction of the connector main body 10.

各端子20は導電性の金属板からなり、コネクタ本体10の各端子孔10aにそれぞれ保持されている。各端子20は、互いに上下方向に間隔をおいて前方に二股状に延びる弾性片部21及び固定片部22を有し、固定片部22はコネクタ本体10の底面部12に固定されている。また、各端子20の後端側はコネクタ本体10の背面側に露出しており、その下端側には回路基板Bに接続される基板接続部23が設けられている。更に、各端子20の後端側には過電圧保護装置50側に係合する係合部24が設けられ、係合部24の後端面24aと端子20の後端面20aとの間には後方に位置する段差24bが形成されている。   Each terminal 20 is made of a conductive metal plate and is held in each terminal hole 10 a of the connector body 10. Each terminal 20 has an elastic piece portion 21 and a fixing piece portion 22 that extend in a bifurcated manner with a space therebetween in the vertical direction, and the fixing piece portion 22 is fixed to the bottom surface portion 12 of the connector main body 10. Further, the rear end side of each terminal 20 is exposed on the back side of the connector main body 10, and a board connecting portion 23 connected to the circuit board B is provided on the lower end side thereof. Further, an engagement portion 24 that engages the overvoltage protection device 50 side is provided on the rear end side of each terminal 20, and the rear end surface 24 a of the engagement portion 24 and the rear end surface 20 a of the terminal 20 are located rearward. A step 24b is formed.

押圧部材30は合成樹脂の成型品からなり、コネクタ本体10の外部に配置される幅方向一対の操作部31と、コネクタ本体10内に配置される押圧片32と、コネクタ本体10の両側部に位置する左右一対のアーム部33とから構成されている。各操作部31の間にはフレキシブル回路Aを挿通可能な凹部34が設けられ、押圧片32は凹部34からコネクタ本体10側に延びている。押圧片32は先端側に向かって厚さ寸法が徐々に小さくなるように形成され、各端子20の固定片部22とフレキシブル回路Aとの間に挿入されるようになっている。各アーム部33は操作部31から後方に向かって延び、それぞれコネクタ本体10の各切り欠き部13b内に前後方向に移動自在に挿入されている。また、各アーム部33の先端には切り欠き部13bの前端部に係止する係止部33aが幅方向に突出するように設けられている。   The pressing member 30 is made of a synthetic resin molded product, and has a pair of widthwise operation portions 31 disposed outside the connector body 10, a pressing piece 32 disposed in the connector body 10, and both side portions of the connector body 10. It is comprised from the left-right paired arm part 33 located. A concave portion 34 through which the flexible circuit A can be inserted is provided between the operation portions 31, and the pressing piece 32 extends from the concave portion 34 to the connector body 10 side. The pressing piece 32 is formed so that the thickness dimension gradually decreases toward the distal end side, and is inserted between the fixed piece portion 22 of each terminal 20 and the flexible circuit A. Each arm portion 33 extends rearward from the operation portion 31, and is inserted into each notch portion 13b of the connector body 10 so as to be movable in the front-rear direction. Further, a locking portion 33a that locks to the front end portion of the notch portion 13b is provided at the tip of each arm portion 33 so as to protrude in the width direction.

各グランドプレート40は略L字状に屈曲した金属板からなり、その一端側をコネクタ本体10の長孔13aに下方から挿入されている。各グランドプレート40の他端側にはコネクタ本体10の底面側から側方に延びるグランド接続部41が設けられ、グランド接続部41は回路基板Bに接続されるようになっている。また、各グランドプレート40の後端側はコネクタ本体10の背面側に露出しており、その後端面40aは各端子20の後端面20aとコネクタ本体10の背面側において前後方向の位置が揃うように配置されている。更に、各グランドプレート40の後端側には過電圧保護装置50側に係合する係合部42が設けられ、係合部42の後端面42aとグランドプレート40の後端面40aとの間には後方に位置する段差42bが形成されている。   Each ground plate 40 is made of a metal plate bent in a substantially L shape, and one end thereof is inserted into the elongated hole 13a of the connector body 10 from below. A ground connection portion 41 extending laterally from the bottom surface side of the connector main body 10 is provided on the other end side of each ground plate 40, and the ground connection portion 41 is connected to the circuit board B. Further, the rear end side of each ground plate 40 is exposed on the back side of the connector main body 10, and the rear end surface 40 a is aligned in the front-rear direction on the rear end surface 20 a of each terminal 20 and the back side of the connector main body 10. Has been placed. Furthermore, an engagement portion 42 that engages with the overvoltage protection device 50 is provided on the rear end side of each ground plate 40, and between the rear end surface 42 a of the engagement portion 42 and the rear end surface 40 a of the ground plate 40. A step 42b located rearward is formed.

過電圧保護装置50は、横長に形成された基板51と、基板51の一方の面上に形成された第1導電部52と、基板51の一方の面上に形成された複数の第2導電部53と、第1導電部52と第2導電部53との間に介在する可変抵抗体54と、可変抵抗体54を覆う被覆部材55とからなる。   The overvoltage protection device 50 includes a horizontally long substrate 51, a first conductive portion 52 formed on one surface of the substrate 51, and a plurality of second conductive portions formed on one surface of the substrate 51. 53, a variable resistor 54 interposed between the first conductive portion 52 and the second conductive portion 53, and a covering member 55 covering the variable resistor 54.

基板51は厚さ方向に可撓性を有するフィルム状の部材によって形成され、フィルム状部材としては厚さ75ミクロン以下の透明な合成樹脂が用いられる。基板51の下端側には各端子20の係合部24及び各グランドプレート40の係合部42を係合する切り欠き部51aが設けられ、各切り欠き部51aは各導電部52,53に対応する位置にそれぞれ配置されている。また、基板51の他方の面には基板51と同一外形に形成された粘着テープ56が貼付けられ、粘着テープ56は周知の両面粘着テープからなる。   The substrate 51 is formed of a film-like member having flexibility in the thickness direction, and a transparent synthetic resin having a thickness of 75 microns or less is used as the film-like member. On the lower end side of the substrate 51, a notch 51 a for engaging the engaging portion 24 of each terminal 20 and the engaging portion 42 of each ground plate 40 is provided, and each notch 51 a is connected to each conductive portion 52, 53. It is arranged at the corresponding position. Moreover, the adhesive tape 56 formed in the same external shape as the board | substrate 51 is affixed on the other surface of the board | substrate 51, and the adhesive tape 56 consists of a well-known double-sided adhesive tape.

第1導電部52は基板51の一方の面に形成された厚さ3ミクロン以上の金属製被膜からなり、図6に示すように基板51の幅方向(長手方向)両端側から上端側を長手方向に延びるように連続して形成されている。また、第1導電部52には基板51の切り欠き部51aに対応する切り欠き部52aが設けられている。   The first conductive portion 52 is made of a metal film having a thickness of 3 microns or more formed on one surface of the substrate 51, and the upper end side is elongated from both ends in the width direction (longitudinal direction) of the substrate 51 as shown in FIG. It is formed continuously so as to extend in the direction. Further, the first conductive portion 52 is provided with a notch 52 a corresponding to the notch 51 a of the substrate 51.

各第2導電部53は第1導電部52と同様、基板51の一方の面に形成された厚さ3ミクロン以上の金属製被膜からなり、図6に示すように基板51の幅方向両端側を除く下端側に互いに幅方向に間隔をおいて設けられている。また、各第2導電部53の上端側には第1導電部52に近接するギャプ形成部53aが設けられ、第1導電部52とギャプ形成部53aとの間に40ミクロン以下の隙間からなるギャップ53bが形成されている。この場合、各第2導電部53のギャップ53bは基板51の長手方向に沿って一直線上に配置されている。また、第2導電部53には基板51の切り欠き部51aに対応する切り欠き部53cが設けられている。   Each of the second conductive portions 53 is made of a metal film having a thickness of 3 microns or more formed on one surface of the substrate 51, like the first conductive portion 52, and as shown in FIG. Are provided at a lower end side excluding a distance in the width direction. Further, a gap forming portion 53a adjacent to the first conductive portion 52 is provided on the upper end side of each second conductive portion 53, and a gap of 40 microns or less is formed between the first conductive portion 52 and the gap forming portion 53a. A gap 53b is formed. In this case, the gap 53 b of each second conductive portion 53 is arranged on a straight line along the longitudinal direction of the substrate 51. Further, the second conductive portion 53 is provided with a notch portion 53 c corresponding to the notch portion 51 a of the substrate 51.

可変抵抗体54は、例えば非線形抵抗材料を用いた周知の材料によって形成され、過電圧が生じていないときは高い電気抵抗を有しており、過電圧が生ずると活性化して直ちに電気抵抗の低い材料に変化する性質のものである。尚、同様の性質を有するものであれば、他の種類の材料を用いるようにしてもよい。可変抵抗体54は各第2導電部53のギャップ53bを覆うように基板51の長手方向に沿って延びる一直線状に形成され、図4に示すように各第2導電部53のギャプ形成部53a及び第1導電部52に亘るようにギャップ53b内に充填されている。尚、可変抵抗体54は、液状の原材料を基板51に塗布または印刷して硬化させることにより、基板51の長手方向に沿って延びるように一直線状に形成されている。   The variable resistor 54 is formed of a well-known material using, for example, a non-linear resistance material, and has a high electric resistance when no overvoltage occurs. When the overvoltage occurs, the variable resistor 54 is activated and immediately becomes a material having a low electric resistance. It has a changing nature. Note that other types of materials may be used as long as they have similar properties. The variable resistor 54 is formed in a straight line extending along the longitudinal direction of the substrate 51 so as to cover the gap 53b of each second conductive portion 53, and the gap forming portion 53a of each second conductive portion 53 as shown in FIG. In addition, the gap 53 b is filled so as to extend over the first conductive portion 52. The variable resistor 54 is formed in a straight line so as to extend along the longitudinal direction of the substrate 51 by applying or printing a liquid raw material on the substrate 51 and curing it.

被覆部材55はウレタン等の絶縁性部材からなり、可変抵抗体54を覆うように基板51の長手方向に沿って延びる一直線状に形成されている。   The covering member 55 is made of an insulating member such as urethane, and is formed in a straight line extending along the longitudinal direction of the substrate 51 so as to cover the variable resistor 54.

過電圧保護装置50はコネクタ本体10の背面側に配置され、基板51の他方の面側を粘着テープ56によって各端子20の後端面20a及び各グランドプレート40の後端面40aに貼付けられている。その際、第1導電部52の両端側に対応する切り欠き部51a,52aには各グランドプレート40の係合部42が係合し、各グランドプレート40は導電性樹脂57によってそれぞれ第1導電部52の両端側に接続される。また、各第2導電部53に対応する切り欠き部51a,53cには各端子20の係合部24が係合し、各端子20は導電性樹脂57によってそれぞれ各第2導電部53に接続される。この場合、図8及び図9に示すように係合部24,42の段差24b,42bは、各導電部53,54を含む基板51の厚さtとほぼ同等の寸法に形成されており、各係合部24,42の後端面24a,42aが切り欠き部51a,52a,53cに係合した状態で基板51上の各導電部52,53とほぼ同一平面上に位置するようになっている。更に、基板51の一方の面側及び各導電性樹脂57はウレタン等の絶縁性のコーティング58によって被覆される。   The overvoltage protection device 50 is disposed on the back side of the connector main body 10, and the other surface side of the substrate 51 is attached to the rear end surface 20 a of each terminal 20 and the rear end surface 40 a of each ground plate 40 with an adhesive tape 56. At that time, the engaging portions 42 of the respective ground plates 40 are engaged with the notches 51 a and 52 a corresponding to both end sides of the first conductive portion 52, and the respective ground plates 40 are respectively electrically conductive by the conductive resin 57. It is connected to both ends of the part 52. Further, the notch portions 51 a and 53 c corresponding to the respective second conductive portions 53 are engaged with the engaging portions 24 of the respective terminals 20, and the respective terminals 20 are connected to the respective second conductive portions 53 by the conductive resin 57. Is done. In this case, as shown in FIGS. 8 and 9, the steps 24 b and 42 b of the engaging portions 24 and 42 are formed to have dimensions substantially equal to the thickness t of the substrate 51 including the respective conductive portions 53 and 54. The rear end surfaces 24a, 42a of the respective engaging portions 24, 42 are positioned on substantially the same plane as the respective conductive portions 52, 53 on the substrate 51 in a state where the rear end surfaces 24a, 42a are engaged with the notches 51a, 52a, 53c. Yes. Further, one surface side of the substrate 51 and each conductive resin 57 are covered with an insulating coating 58 such as urethane.

以上のように構成されたコネクタにおいては、各端子20の基板接続部23及び各グランドプレート40のグランド接続部41を回路基板Bに半田付けすることにより、各端子20が回路基板Bに実装される。また、フレキシブル回路Aをコネクタに接続する場合は、図10に示すように押圧部材30を前方に引き出した状態でフレキシブル回路Aをコネクタ本体10内に挿入し、図11に示すように押圧部材30をコネクタ本体10の後方に向かって移動させると、フレキシブル回路Aと固定片部22との間に押圧片32が圧入され、フレキシブル回路Aと各端子20の弾性片部22が互いに圧接して電気的に接続される。   In the connector configured as described above, each terminal 20 is mounted on the circuit board B by soldering the board connection part 23 of each terminal 20 and the ground connection part 41 of each ground plate 40 to the circuit board B. The When the flexible circuit A is connected to the connector, the flexible circuit A is inserted into the connector body 10 with the pressing member 30 pulled forward as shown in FIG. 10, and the pressing member 30 as shown in FIG. Is moved toward the rear of the connector body 10, the pressing piece 32 is press-fitted between the flexible circuit A and the fixed piece portion 22, and the flexible circuit A and the elastic piece portion 22 of each terminal 20 are pressed against each other to be electrically connected. Connected.

また、前記コネクタにおいて、フレキシブル回路A側に静電気等の過電圧が生ずると、過電圧が生じた信号線の端子20と各グランドプレート40との間が過電圧保護装置50によって導通し、回路基板B側の回路が過電圧から保護される。即ち、フレキシブル回路Aの何れかの信号線に過電圧が生ずると、可変抵抗体54が直ちに低電気抵抗材料に変化する。これにより、可変抵抗体54を介して端子20と各グランドプレート40とが導通し、過電圧が各グランドプレート40を介して接地側に放電される。尚、可変抵抗体54の特性はギャップ53bの大きさに依存する。   Further, in the connector, when an overvoltage such as static electricity is generated on the flexible circuit A side, the overvoltage protection device 50 conducts between the terminal 20 of the signal line where the overvoltage is generated and each ground plate 40, and the circuit board B side is electrically connected. The circuit is protected from overvoltage. That is, when an overvoltage occurs in any signal line of the flexible circuit A, the variable resistor 54 immediately changes to a low electrical resistance material. As a result, the terminal 20 and each ground plate 40 are electrically connected via the variable resistor 54, and an overvoltage is discharged to the ground side via each ground plate 40. The characteristic of the variable resistor 54 depends on the size of the gap 53b.

このように、本実施形態のコネクタによれば、過電圧保護装置50の基板51を厚さ方向に可撓性を有する部材によって形成したので、基板51を薄く形成しても破損を生ずることがなく、過電圧保護装置50を容易且つ確実に装着することができる。この場合、基板51を厚さ方向に曲げても破損することがないので、硬質の材料に比べて基板51を薄く形成することができ、小型化を図ることができる。更に、基板51の曲げ変形によって各端子20または各グランドプレート40との接触位置の誤差を吸収することができるので、接触不良や装着不良を確実に防止することができる。   Thus, according to the connector of the present embodiment, since the substrate 51 of the overvoltage protection device 50 is formed by a member having flexibility in the thickness direction, no damage occurs even if the substrate 51 is formed thin. The overvoltage protection device 50 can be easily and reliably attached. In this case, even if the substrate 51 is bent in the thickness direction, the substrate 51 is not damaged. Therefore, the substrate 51 can be formed thinner than a hard material, and the size can be reduced. Further, since the error of the contact position with each terminal 20 or each ground plate 40 can be absorbed by bending deformation of the substrate 51, contact failure and mounting failure can be reliably prevented.

また、基板51及び第1及び第2の導電部52,53の切り欠き部51a,52a,53cに各端子20及び各グランドプレート40の係合部24,42をそれぞれ係合するようにしたので、各端子20及び各グランドプレート40に対する位置決めを容易且つ確実に行うことができる。この場合、各導電部52,53を切り欠き部52a,53cの内周に沿って係合部24,42と接続することができるので、接続面積を大きくすることができる。更に、各端子20及び各グランドプレート40と基板51とを幅方向に確実に固定することができるので、導電性樹脂57に加わる応力を小さくすることができ、接続信頼性の向上を図ることができる。   In addition, the terminals 20 and the engaging portions 24 and 42 of the ground plates 40 are engaged with the substrate 51 and the cutout portions 51a, 52a and 53c of the first and second conductive portions 52 and 53, respectively. The positioning with respect to each terminal 20 and each ground plate 40 can be performed easily and reliably. In this case, since each conductive part 52 and 53 can be connected with the engaging parts 24 and 42 along the inner periphery of the notch parts 52a and 53c, a connection area can be enlarged. Furthermore, since each terminal 20, each ground plate 40, and the board | substrate 51 can be fixed reliably in the width direction, the stress added to the conductive resin 57 can be made small, and the connection reliability can be improved. it can.

また、各端子20及び各グランド部材40の切り欠き部51a,52a,53cに各係合部24,42を係合すると、各係合部24,42の後端面24a,42aが基板51上の各導電部52,53とほぼ同一平面上に位置するようにしたので、導電性樹脂57を凹凸のない接続面上に形成することができ、常に良好な接続状態を得ることができる。この場合、接続面を上方に向けて水平に保持しながら導電性樹脂57を形成することができるので、未硬化状態の導電性樹脂57の流動を確実に防止することができ、接続作業における位置決め精度の向上、作業の効率化及び接続品質の向上を図ることができる。   Further, when the engaging portions 24, 42 are engaged with the notches 51 a, 52 a, 53 c of the terminals 20 and the ground members 40, the rear end surfaces 24 a, 42 a of the engaging portions 24, 42 are on the substrate 51. Since the conductive portions 52 and 53 are located on substantially the same plane, the conductive resin 57 can be formed on a connection surface without unevenness, and a good connection state can always be obtained. In this case, since the conductive resin 57 can be formed while holding the connection surface horizontally upward, it is possible to reliably prevent the uncured conductive resin 57 from flowing, and positioning in the connection work. It is possible to improve accuracy, improve work efficiency, and improve connection quality.

更に、各導電部52,53と各グランドプレート40及び各端子20とをそれぞれ導電性樹脂8によって接続することにより、半田付けのように繁雑な接続作業を必要としないので、生産性の向上を図ることができる。   Further, since each conductive portion 52, 53 and each ground plate 40 and each terminal 20 are connected by the conductive resin 8, a complicated connection work such as soldering is not required, thereby improving productivity. Can be planned.

また、基板51及び各導電性樹脂57を絶縁性のコーティング58によって被覆するようにしたので、過電圧保護装置50を外部の物品との接触による破損や電気ショートから確実に保護することができる。   In addition, since the substrate 51 and each conductive resin 57 are covered with the insulating coating 58, the overvoltage protection device 50 can be reliably protected from damage due to contact with an external article or an electrical short circuit.

更に、各導電部52,53をそれぞれ金属製薄膜によって基板51の一方の面と一体に形成したので、第1及び第2導電部52,53間のギャップ53bをエッチング加工等により精度よく形成することができ、可変抵抗体54の特性に影響するギャップ53bの大きさを常に正確に設定することができる。   Furthermore, since each of the conductive portions 52 and 53 is formed integrally with one surface of the substrate 51 by a metal thin film, the gap 53b between the first and second conductive portions 52 and 53 is formed with high precision by etching or the like. Therefore, the size of the gap 53b that affects the characteristics of the variable resistor 54 can always be set accurately.

また、基板51を透明に形成したので、基板51の他方の面側からギャップ4b内の可変抵抗体54を外部から目視することができ、例えば可変抵抗体54の液状原料が不適正に塗布されていた場合など、可変抵抗体の形成不良の検査を非破壊により行うことができる。   Further, since the substrate 51 is formed transparently, the variable resistor 54 in the gap 4b can be seen from the outside from the other surface side of the substrate 51. For example, the liquid material of the variable resistor 54 is improperly applied. In such a case, it is possible to perform non-destructive inspection for the formation failure of the variable resistor.

更に、各第2導電部53のギャップ53bを基板51の長手方向に沿って一直線上に配置したので、可変抵抗体54の液状原料を塗布する際、ギャップ53bの配列方向に沿って直線状の線引き塗布が可能となり、印刷による場合は原材料の液抜けが良好になる。従って、可変抵抗体54を常に精度よく形成することができる。   Furthermore, since the gaps 53b of the second conductive portions 53 are arranged in a straight line along the longitudinal direction of the substrate 51, when applying the liquid material of the variable resistor 54, the gaps 53b are linear along the arrangement direction of the gaps 53b. Drawing application becomes possible, and in the case of printing, the liquid drainage of the raw material becomes good. Therefore, the variable resistor 54 can always be formed with high accuracy.

尚、前記実施形態では、押圧部材30によってフレキシブル回路Aを各端子20に圧接させるようにしたものを示したが、押圧部材を用いずに接続対象物を直接圧入する構造のものなど、他の構成からなるコネクタであってもよい。   In addition, in the said embodiment, although what pressed the flexible circuit A to each terminal 20 with the press member 30 was shown, other things, such as a thing of the structure which press-fits a connection target directly, without using a press member. The connector which consists of a structure may be sufficient.

本発明の一実施形態を示すコネクタの正面側斜視図The front side perspective view of the connector which shows one Embodiment of this invention コネクタの背面側斜視図Rear perspective view of the connector 過電圧保護装置の正面図Front view of overvoltage protection device 過電圧保護装置の側面断面図Side cross-sectional view of overvoltage protection device 過電圧保護装置の分解斜視図Exploded perspective view of overvoltage protection device 基板の正面図Front view of board 端子及び過電圧保護装置の要部斜視図Perspective view of main parts of terminal and overvoltage protection device 端子及び過電圧保護装置の要部側面断面図Side sectional view of the main part of the terminal and overvoltage protection device グランドプレート及び過電圧保護装置の要部斜視図Perspective view of main parts of ground plate and overvoltage protection device コネクタの側面断面図Side sectional view of connector コネクタの側面断面図Side sectional view of connector

符号の説明Explanation of symbols

10…コネクタ本体、20…端子、24…係合部、40…グランドプレート、42…係合部、50…過電圧保護装置、51…基板、52…第1導電部、53…第2導電部、53b…ギャップ、54…可変抵抗体、57…導電性樹脂、58…コーティング、A…フレキシブル回路、B…回路基板。   DESCRIPTION OF SYMBOLS 10 ... Connector main body, 20 ... Terminal, 24 ... Engagement part, 40 ... Ground plate, 42 ... Engagement part, 50 ... Overvoltage protection apparatus, 51 ... Board | substrate, 52 ... 1st electroconductive part, 53 ... 2nd electroconductive part, 53b ... Gap, 54 ... Variable resistor, 57 ... Conductive resin, 58 ... Coating, A ... Flexible circuit, B ... Circuit board.

Claims (4)

基板上に形成された第1導電部と、第1導電部と所定間隔の隙間をおいて基板上に形成された複数の第2導電部と、第1導電部と第2導電部との間に過電圧が生ずると電気抵抗が低下して第1導電部と各第2導電部とを導通する可変抵抗体とからなる過電圧保護装置を備え、第1導電部をグランド部材に接続し、各第2導電部を複数の信号線用端子にそれぞれ接続したコネクタにおいて、
前記過電圧保護装置の基板を厚さ方向に可撓性を有する部材によって形成するとともに、
基板及び各導電部には各端子及びグランド部材に設けた係合部をそれぞれ係合する切り欠き部を設けた
ことを特徴とするコネクタ。
A first conductive part formed on the substrate, a plurality of second conductive parts formed on the substrate with a predetermined gap from the first conductive part, and between the first conductive part and the second conductive part And an overvoltage protection device comprising a variable resistor that conducts between the first conductive portion and each second conductive portion when an overvoltage occurs, and the first conductive portion is connected to a ground member. In the connector where each of the two conductive portions is connected to a plurality of signal line terminals,
While forming the substrate of the overvoltage protection device by a member having flexibility in the thickness direction,
The board and each conductive part are provided with the notch part which each engages with the engaging part provided in each terminal and the ground member. The connector characterized by the above-mentioned.
前記各端子及びグランド部材の係合部を基板上の導電部とほぼ同一平面上に位置するように形成した
ことを特徴とする請求項1記載のコネクタ。
The connector according to claim 1, wherein the engaging portions of the terminals and the ground member are formed so as to be located on substantially the same plane as the conductive portion on the substrate.
前記各導電部を各端子及びグランド部材にそれぞれ導電性樹脂によって接続した
ことを特徴とする請求項1または2記載のコネクタ。
The connector according to claim 1, wherein each conductive portion is connected to each terminal and a ground member by a conductive resin.
前記基板及び導電性樹脂を絶縁性部材によって被覆した
ことを特徴とする請求項3記載のコネクタ。
The connector according to claim 3, wherein the substrate and the conductive resin are covered with an insulating member.
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KR100957769B1 (en) 2007-03-02 2010-05-13 기가 바이트 테크놀러지 컴퍼니 리미티드 Circuit for preventing surge, connector and electronic apparatus thereof
US20100224601A1 (en) * 2009-03-04 2010-09-09 Iriso Electronics Co., Ltd. Laser welding method
JP2010272488A (en) * 2009-05-25 2010-12-02 Littelfuse Inc Incorporation of electrostatic protection portion into small connector
JP2013000863A (en) * 2011-06-20 2013-01-07 Hitachi Koki Co Ltd Electric tool
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CN104737384A (en) * 2012-10-18 2015-06-24 山一电机株式会社 Receptacle connector, plug connector and electrical connector provided with receptacle connector and plug connector

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KR100957769B1 (en) 2007-03-02 2010-05-13 기가 바이트 테크놀러지 컴퍼니 리미티드 Circuit for preventing surge, connector and electronic apparatus thereof
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JP2010272488A (en) * 2009-05-25 2010-12-02 Littelfuse Inc Incorporation of electrostatic protection portion into small connector
JP2013000863A (en) * 2011-06-20 2013-01-07 Hitachi Koki Co Ltd Electric tool
KR101344933B1 (en) * 2011-10-13 2013-12-27 주식회사 씨엔플러스 connector assembly
CN104737384A (en) * 2012-10-18 2015-06-24 山一电机株式会社 Receptacle connector, plug connector and electrical connector provided with receptacle connector and plug connector
US9705218B2 (en) 2012-10-18 2017-07-11 Yamaichi Electronics Co., Ltd. Receptacle connector, plug connector and electrical connector provided with receptacle connector and plug connector

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