JP3994600B2 - Light source substrate for illumination and liquid crystal device - Google Patents

Light source substrate for illumination and liquid crystal device Download PDF

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Publication number
JP3994600B2
JP3994600B2 JP30573999A JP30573999A JP3994600B2 JP 3994600 B2 JP3994600 B2 JP 3994600B2 JP 30573999 A JP30573999 A JP 30573999A JP 30573999 A JP30573999 A JP 30573999A JP 3994600 B2 JP3994600 B2 JP 3994600B2
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substrate
light emitting
emitting element
liquid crystal
light
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JP2001126520A (en
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幸久 小林
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Seiko Epson Corp
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Seiko Epson Corp
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  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Description

【0001】
【発明の属する技術分野】
本発明は、発光素子を備えた照明用光源基板及びそれを用いて構成される液晶装置に関する。
【0002】
【従来の技術】
光を利用して所定の動作を行う電気光学装置は、例えば、液晶装置、エレクトロルミネッセンス(EL)素子を用いた光学装置、プラズマディスプレイ(PDP)、電界放出素子(FED)を用いた光学装置等のように、従来から種々のものが知られている。
【0003】
この電気光学装置として液晶装置を考えると、この液晶装置では、液晶に印加する電圧を制御してその液晶の配向を制御することにより、その液晶を通過する光を変調し、もって文字、数字、図形等といった像を表示する。この液晶装置として、従来、例えば図5(a)に示す照明用光源基板51を用いたものが知られている。
【0004】
この従来の照明用光源基板51は、発光素子としてのLED(Light Emitting Diode)52を発光素子基板53に実装し、その発光素子基板53を支持基板54に接続することによって形成される。支持基板54は、例えば、各種の制御回路が搭載される制御基板として構成される。この照明用光源基板51が液晶装置の中に組み込まれると、図5(b)に示すように、LED52の発光面が導光体56の光取込み面に対向する位置に配置される。
【0005】
この照明用光源基板51を用いた液晶装置では、LED52からの光が導光体56に取り込まれ、さらにその光出射面から均一な強度の光Rが出射され、この均一な光が液晶パネル(図示せず)に供給されて文字等といった可視像の表示のために利用される。
【0006】
【発明が解決しようとする課題】
しかしながら、上記従来の照明用光源基板51では、発光素子基板53が単に支持基板54の厚さ方向、すなわちZ−Z方向へ何等の工夫もなくただ単純に接続されているだけであった。このため、従来の照明用光源基板51は、厚さ方向Z−Zの寸法が大きく、従って、これを用いる液晶装置の厚さ寸法も大きくなるという問題があった。
【0007】
本発明は、上記の問題点に鑑みて成されたものであって、厚さ方向の寸法が小さい照明用光源基板及び液晶装置を提供することを目的とする。
【0008】
【課題を解決するための手段】
(1) 上記の目的を達成するため、本発明に係る照明用光源基板は、発光素子が実装された発光素子基板と、該発光素子基板が接続される支持基板とを有し、前記発光素子基板は前記支持基板の厚さ方向へ張り出す照明用光源基板において、前記発光素子基板に凹部を設け、前記支持基板に凸部を設け、前記発光素子基板の凹部に前記支持基板の凸部を嵌合させた状態で該発光素子基板と該支持基板とを互いに接続することを特徴とする。
【0009】
この照明用光源基板によれば、発光素子基板と支持基板とを単に重ね合わせて接続するというのではなく、発光素子基板に設けた凹部と支持基板に設けた凸部とを嵌合させた状態で両者を接続するようにしたので、厚さ方向の寸法を小さく、すなわち全体形状を薄くすることができる。
【0010】
また、支持基板の凸部によって発光素子基板を押え付けることができるので、発光素子に位置ズレが生じることを長期間にわたって防止できる。さらに、発光素子基板の凹部と支持基板の凸部との嵌合により、両基板を互いに直接的に位置決めできるので、両基板を接続するための半田付け処理等を正確且つ迅速に行うことができる。
【0011】
(2) 上記(1)項記載の照明用光源基板においては、前記発光素子を前記発光素子基板上に複数個設けることができ、その場合には、前記凹部は隣り合う発光素子の間に形成されることが望ましい。こうすれば、厚さ寸法をより一層小さくすることができる。
【0012】
(3) 上記(1)項又は(2)項記載の照明用光源基板においては、前記発光素子は前記支持基板の凸部の横に形成される開口に収容されることが望ましい。こうすれば、厚さ寸法をより一層小さくすることができる。
【0013】
(4) 次に、本発明に係る液晶装置は、一対の基板間に液晶を封入して成る液晶パネルと、発光素子が実装された発光素子基板と、該発光素子基板が接続される支持基板と、前記発光素子からの光を前記液晶パネルへ導く導光体とを有する液晶装置において、前記発光素子基板に凹部を設け、前記支持基板に凸部を設け、前記発光素子基板の凹部に前記支持基板の凸部を嵌合させた状態で該発光素子基板と該支持基板とを互いに接続することを特徴とする。
【0014】
この液晶装置によれば、発光素子基板と支持基板とを単に重ね合わせて接続するというのではなく、発光素子基板に設けた凹部と支持基板に設けた凸部とを嵌合させた状態で両者を接続するようにしたので、発光素子基板と支持基板とから成る照明用光源基板の厚さ方向の寸法を小さくでき、その結果、液晶装置の全体形状の厚さを薄くすることができる。
【0015】
(5) 上記(4)項記載の液晶装置に関しては、前記支持基板の凸部の両脇に形成される開口をふさぐように、前記発光素子基板と前記支持基板との間の接続部分の前記導光体が配設された側とは反対側に遮蔽部材を設けることが望ましい。
【0016】
厚さ寸法を小さくするために制御基板に形成される開口によってLEDを収容する構造を採用する場合には、この開口を通して、フラックス、ゴミ等が液晶パネルの側へ侵入するおそれがある。TCPを制御基板の内部領域端子に接続する前に、当該開口をふさぐようにLED基板と制御基板との接続部分に遮蔽テープを貼着すれば、そのような液晶パネルへのフラックス等及びゴミ等の侵入を防止できる。
【0017】
【発明の実施の形態】
以下、本発明に係る照明用光源基板を液晶装置の光源として用いた場合を例に挙げて説明する。
【0018】
図1は、本発明に係る液晶装置の一実施形態を示している。この液晶装置1は、液晶パネル2と、例えば平板状の導光体3を備えたフレーム4と、発光素子基板としてのLED基板6と、支持基板としての制御基板7と、そして遮蔽部材としての遮蔽テープ8とを有する。導光体3とフレーム4とは樹脂によって一体に形成することもできるし、あるいは、それぞれを別々に形成した上で両者を組み付けることもできる。
【0019】
上記の各要素を組み合わせた状態の断面構造が図2に示されている。図2に示す通り、液晶パネル2は導光体3の発光面(図2の上側面)に対向して配設され、LED基板6は導光体3の側面すなわち光取込み面に対向して配設され、制御基板7は導光体3の非発光面(図2の下側面)に対向して配設され、そして遮蔽テープ8は制御基板7の両脇に形成される開口39をふさぐように、LED基板6と制御基板7との接続部分の導光体3が配設された側とは反対側の表面に配設される。なお、導光体3の非発光面には反射シート25が設けられる。液晶パネル2は、図1において、互いに対向する一対の基板9a及び9bを有し、これらの基板はシール材11によってそれらの周囲が互いに接着される。これらの基板9a及び9bは、例えばガラス等といった硬質な光透過性材料や、プラスチック等といった可撓性を有する光透過性材料等によって形成された基板素材に電極その他の必要要素を付設することによって形成される。
【0020】
図2において、第1基板9aの基板素材12aの液晶側表面、すなわち第2基板9bに対向する面には、例えばコモン電極として作用する第1電極13aが所定のパターンに形成され、その上にオーバーコート層14aが形成され、さらにその上に配向膜16aが形成される。また、基板素材12aの外側表面には光学素子としての偏光板17aが貼着される。
【0021】
第1基板9aに対向する第2基板9bの基板素材12bの液晶側表面、すなわち第1基板9aに対向する面には、例えばセグメント電極として作用する第2電極13bが所定のパターンに形成され、その上にオーバーコート層14bが形成され、さらにその上には配向膜16bが形成される。また、基板素材12bの外側表面には光学素子としての偏光板17bが貼着される。
【0022】
なお、第1基板9a及び第2基板9bの双方又は一方に設けられる光学素子としては、必要に応じて、偏光板17a,17b以外の他の素子、例えば位相差板、光拡散板等が設けられることもある。また、液晶パネル2と導光体3との間には光学素子として半透過反射板が設けられることもある。また、基板素材12a,12bには、必要に応じて、その他の光学要素、例えばカラーフィルタ等を設けることもできる。
【0023】
第1電極13a及び第2電極13bは、例えばITO(Indium Tin Oxide)等といった透明電極によって1000オングストローム程度の厚さに形成され、オーバーコート層14a及び14bは、例えば酸化珪素、酸化チタン又はそれらの混合物等によって800オングストローム程度の厚さに形成され、そして配向膜16a及び16bは、例えばポリイミド系樹脂によって800オングストローム程度の厚さに形成される。
【0024】
第1電極13aは、図1に示すように、複数の直線パターンを互いに平行に配列することによって、いわゆるストライプ状に形成される。一方、第2電極13bは、上記第1電極13aに交差するように複数の直線パターンを互いに平行に配列することによって、やはりストライプ状に形成される。これらの電極13aと電極13bとがドットマトリクス状に交差する複数の点が、像を表示するための画素を形成する。そして、それら複数の画素によって区画形成される領域が、文字等といった像を表示するための表示領域となる。
【0025】
以上のようにして形成された第1基板9a及び第2基板9bのいずれか一方の液晶側表面には、図2に示すように、複数のスペーサ18が分散され、さらにいずれか一方の基板の液晶側表面にシール材11が、例えば印刷等によって図1に示すように枠状に設けられ、さらにそのシール材11の一部に液晶注入口11aが形成される。
【0026】
両基板9a及び9bの間には、図2に示すように、スペーサ18によって保持される均一な寸法、例えば5μm程度の間隙、いわゆるセルギャップが形成され、液晶注入口11a(図1参照)を通してそのセルギャップ内に液晶19が注入され、その注入の完了後、液晶注入口11aが樹脂等によって封止される。
【0027】
図1において、第1基板9aは第2基板9bの外側へ張り出す基板張出し部9cを有し、第1基板9a上の第1電極13aはその基板張出し部9cへ直接に延び出て配線21aとなっている。また、第2基板9bは第1基板9aの外側へ張り出す基板張出し部9dを有し、第2基板9b上の第2電極13bはその基板張出し部9dへ直接に延び出て配線21bとなっている。
【0028】
各電極13a及び13b、それらから延びる各配線21a及び21bは、実際には極めて狭い間隔で多数本がそれぞれの基板9a及び9bの表面全域に形成されるが、図1及びこれから説明する各図では、構造を分かり易く示すために実際の間隔よりも広い間隔でそれらの電極等を模式的に図示し、さらに一部の電極の図示は省略してある。また、液晶が封入される領域内に形成される電極13a及び13bは、直線状に形成されることに限られず、適宜の文字、図形等といったパターンとして形成されることもある。
【0029】
図1において、基板張出し部9c及び9dには、それぞれ、TCP(Tape Carrier Package)22a及び22bが異方性導電接着要素、例えばACF(Anisotropic Conductive Film:異方性導電膜)23によって接続される。
【0030】
ACF23は、周知の通り、一対の端子間を異方性を持たせて電気的に一括接続するために用いられる導電性のある高分子フィルムであって、例えば図2に示すように、熱可塑性又は熱硬化性の樹脂フィルム24の中には多数の導電粒子26を分散状態で含ませることによって形成される。
【0031】
図1において、TCP22a及び22bは、TAB技術を用いて構成されたIC構造体であって、例えば、配線27が形成されたFPC(Flexible Printed Circuit)28に液晶駆動用IC29a及び29bをそれぞれボンディング、例えばギャングボンディングして形成される。符号30a及び符号30bは、外部回路との間で電気的な接続をとるための端子を示している。
【0032】
ACF23を挟んで基板張出し部9cとTCP22aとを熱圧着、すなわち加熱下で加圧することにより、TCP22aを基板張出し部9cに接着すると共に、TCP22aの配線27と基板張出し部9c上の配線21aとの間において単一方向の導電性を持つ接続を実現する。また、基板張出し部9dとTCP22bとの間に関しても同様の接着及び導電接続を実現する。
【0033】
以上のようにして形成された液晶パネル2に関して、液晶駆動用IC29a及び29bによって第1電極13a又は第2電極13bのいずれか一方に対して直線パターンに走査電圧を順次印加し、さらに同時にそれらの電極の他方に対して表示画像に基づいたデータ電圧をそれぞれの直線パターンに印加することにより、両電圧の印加によって選択された各画素部分を通過する光を変調し、もって、基板9a又は9bの外側に文字、数字等といった像を表示する。
【0034】
導光体3の非発光面(図1の下側面)側に設けられるLED基板6は、図3(a)に示すように、高さの低い両脇の裾部6aと、それらの裾部6a間に掛け渡された高さの高い梁部6bとによって形成され、発光素子としての複数のLED31がその梁部6bの長手方向に亘って適宜の間隔を開けて実装される。梁部6bの底部には所定間隔をもって切欠き、すなわち凹部37が設けられ、上記複数のLED31は、それらの凹部37を挟むように設けられる。LED基板6の裾部6aには端子32が形成され、LED基板6の内部又は表面には、それらの端子32、LED31及び必要に応じて設けられるその他の電子部品(図示せず)をつなげるための配線(図示せず)が形成される。
【0035】
LED基板6は、図1に示すように、導光体3の非発光面側(図1の下面側)からフレーム4又は導光体3に装着される。この装着は、ネジや接着剤等といった特別な固着手段を用いることなく、例えば、導光体3とフレーム4との間に形成した開口(図示せず)にLED基板6の裾部6aを挿入することによって達成できる。
【0036】
LED基板6の裾部6aがフレーム4又は導光体3に装着された状態で、図4に示すように、LED基板6の梁部6bは導光体3の側面、すなわち光取込み面に対向する位置に配置され、これにより、その梁部6bに実装されたLED31が導光体3の光取込み面に対向して配置される。この状態は、図2の断面構造を見ることによって明らかに理解できる。
【0037】
図3(a)において、制御基板7は、例えばガラスエポキシ樹脂等といった非可撓性の材料によって形成され、その裏面側(図3(a)の下面側)には、制御回路33、内部領域端子34a及び34b、そして辺端部端子36が設けられる。制御回路33は、液晶パネル2(図1参照)の液晶駆動用IC29a,29bの動作を制御したり、LED31の点灯動作を制御したり、あるいは、本液晶装置1が用いられる電子機器、例えば携帯電話機、携帯情報端末機等の動作を制御する。
【0038】
また、内部領域端子34aは、図1に示すように、液晶パネル2から延びるTCP22aの端子30aが接続される端子である。また、内部領域端子34bは、液晶パネル2から延びるもう1つのTCP22bの端子30bが接続される端子である。また、制御基板7のうちLED基板6が接続される辺端部には、複数の凸部38が形成され、そしてこれらの凸部38の両脇に必然的に開口39が形成される。
【0039】
図1において、制御基板7は、LED基板6が装着された状態のフレーム4に対して、導光体3の非発光面側(図1の下面側)から装着される。この装着も、ネジや接着剤等といった特別の固着手段を用いることなく、例えば、フレーム4の適所に固定用の突起(図示せず)を設けておき、その突起を用いて制御基板7を止めることによって達成できる。また、必ずしもそのような固着手段を使用することなく、単に制御基板7をフレーム4でガイドしながら導光体3の上に装着するだけでも良い。
【0040】
このように制御基板7がフレーム4に装着されると、図3(b)に示すように、制御基板7の凸部38がLED基板6の凹部37に嵌合した状態で、LED基板6が制御基板7の厚さ方向Z−Zへ張り出すように、図示の実施形態では両者が互いにほぼ直角方向へ延びるように、LED基板6と制御基板7とが互いに組み付けられる。このとき、各LED31は制御基板7の凸部38の両脇に必然的に形成される開口39の中に収容される。
【0041】
LED基板6と制御基板7とが互いに組み付けられたとき、LED基板6の端子32と制御基板7の辺端部端子36は互いに位置的に一致する位置関係となって互いに接触する。そして、端子32と端子36との当該接触部分を導電接続処理、例えば半田付け等することにより、LED基板6が電気的且つ機械的に制御基板7に接続されて照明用光源基板41が形成される。
【0042】
こうして形成された照明用光源基板41に関しては、LED基板6と制御基板7とが、それぞれに設けた凹部37と凸部38との嵌合によって組み付けられるので、厚さ方向Z−Zの寸法Hを従来の構造(図5参照)の場合に比べて非常に小さく、すなわち全体形状を非常に薄くすることができる。このため、この照明用光源41を用いて構成される液晶装置1の厚さ方向(図1のZ−Z方向)の寸法を薄くできる。
【0043】
また、制御基板7の凸部38によってLED基板6を図1で制御基板7から導光体3の方向へ押さえ付けることができるので、LED31に位置ズレが生じることを長期間にわたって防止できる。さらに、LED基板6の凹部37と制御基板7の凸部38との嵌合により、両基板を互いに直接的に位置決めできるので、両基板を接続するための半田付け処理等を正確且つ迅速に行うことができる。
【0044】
その後、図1において、LED基板6と制御基板7がフレーム4に装着された状態で、制御基板7の開口39をふさぐように、 LED基板6と制御基板7との接続部分の表面で導光体が配設された側とは反対側に遮蔽テープ8を貼着する。この遮蔽テープ8の作用効果については、後述する。
【0045】
図1において、液晶パネル2は、その像表示面側が外側に来るような状態でフレーム4に装着される。このとき、一方のTCP22bは、その先端がフレーム4と導光体3との間に形成される空間Kを図の上下方向へ通るように折り曲げられる。こうして液晶パネル2が導光体3の発光面上にフレーム4に支持されて配置された後、一方のTCP22aはフレーム4に設けた切欠き部42を通して制御基板7の裏側へ折り曲げられ、そして図2に示すように、その先端端子30aが制御基板7の裏面に形成された内部領域端子34aに、例えば半田付け等によって接続される。
【0046】
他方、図1において、もう一方のTCP22bは、同様にして、導光体3及びフレーム4を通って制御基板7の裏側へ折り曲げられ、その先端端子30bが制御基板7の裏面に形成された内部領域端子34bに、例えば半田付け等によって接続される。
【0047】
以上により、図1に分解して示した液晶装置1が作製されるわけであるが、図3(a)及び図3(b)に示すように、厚さ寸法を小さくするために制御基板7に形成される開口39によってLED31を収容する構造を採用する場合には、この開口39を通して、フラックス、ゴミ等が液晶パネル2の側へ侵入するおそれがある。TCP22a及び22bを制御基板7の内部領域端子34a及び34bに接続する前に、当該開口39をふさぐようにLED基板6と制御基板7との接続部に遮蔽テープ8を貼着すれば、そのような液晶パネル2へのフラックス等及びゴミ等の侵入を防止できる。
【0048】
(その他の実施形態)
以上、好ましい実施形態を挙げて本発明を説明したが、本発明はその実施形態に限定されるものでなく、請求の範囲に記載した発明の範囲内で種々に改変できる。
【0049】
例えば、図1の実施形態では本発明に係る照明用光源基板を液晶装置に適用したが、その照明用光源基板はその他の電気光学装置、例えばEL装置、プラズマディスプレイ等にも適用できる。
【0050】
また、発光素子としてのLEDの個数は特定の数に限定されず、また、その発光素子としてはLED以外の任意の発光要素を適用できる。
【0051】
【発明の効果】
本発明に係る照明用光源基板及び液晶装置によれば、発光素子基板と支持基板とを単に重ね合わせて接続するというのではなく、発光素子基板に設けた凹部と支持基板に設けた凸部とを嵌合させた状態で両者を接続するようにしたので、厚さ方向の寸法を小さく、すなわち全体形状を薄くすることができる。
【0052】
また、支持基板の凸部によって発光素子基板を押さえ付けることができるので、発光素子に位置ズレが生じることを長期間にわたって防止できる。さらに、発光素子基板の凹部と支持基板の凸部との嵌合により、両基板を互いに直接的に位置決めできるので、両基板を接続するための半田付け処理等を正確且つ迅速に行うことができる。
【図面の簡単な説明】
【図1】本発明に係る照明用光源基板の一実施形態及び本発明に係る液晶装置の一実施形態を分解状態で示す斜視図である。
【図2】図1のII−II線に従って液晶装置の断面構造を示す断面図である。
【図3】図1で用いる照明用光源基板を詳しく示す図であって、(a)はLED基板と制御基板とを接続する前の状態を示し、(b)はLED基板と制御基板とを接続した後の状態を示している。
【図4】図1に示す構造の主要部を示す図であって、LED基板を導光体に装着した状態を示す図である。
【図5】従来の照明用光源基板の一例を示す図である。
【符号の説明】
1 液晶装置
2 液晶パネル
3 導光体
4 フレーム
6 LED基板(発光素子基板)
6a 裾部
6b 梁部
7 制御基板(支持基板)
8 遮蔽テープ
9a,9b 基板
9c,9d 基板張出し部
13a,13b 電極
19 液晶
22a,22b TCP(接続用基板)
31 LED(発光素子)
37 凹部
38 凸部
39 開口
41 照明用光源基板
Z 厚さ方向
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an illumination light source substrate including a light emitting element and a liquid crystal device configured using the same.
[0002]
[Prior art]
Examples of the electro-optical device that performs a predetermined operation using light include a liquid crystal device, an optical device using an electroluminescence (EL) element, a plasma display (PDP), an optical device using a field emission element (FED), and the like. As described above, various types are conventionally known.
[0003]
Considering a liquid crystal device as this electro-optical device, this liquid crystal device modulates the light passing through the liquid crystal by controlling the voltage applied to the liquid crystal and controlling the orientation of the liquid crystal, thereby having letters, numbers, An image such as a figure is displayed. As this liquid crystal device, one using a light source substrate 51 for illumination shown in FIG.
[0004]
The conventional illumination light source substrate 51 is formed by mounting an LED (Light Emitting Diode) 52 as a light emitting element on a light emitting element substrate 53 and connecting the light emitting element substrate 53 to a support substrate 54. For example, the support substrate 54 is configured as a control substrate on which various control circuits are mounted. When the illumination light source substrate 51 is incorporated in the liquid crystal device, the light emitting surface of the LED 52 is disposed at a position facing the light capturing surface of the light guide 56 as shown in FIG.
[0005]
In the liquid crystal device using the illumination light source substrate 51, the light from the LED 52 is taken into the light guide 56, and the light R having a uniform intensity is emitted from the light emitting surface. (Not shown) and used to display a visible image such as a character.
[0006]
[Problems to be solved by the invention]
However, in the conventional illumination light source substrate 51, the light emitting element substrate 53 is simply connected in the thickness direction of the support substrate 54, that is, in the ZZ direction without any ingenuity. For this reason, the conventional illumination light source substrate 51 has a problem that the dimension in the thickness direction ZZ is large, and therefore the thickness dimension of the liquid crystal device using the same is also large.
[0007]
The present invention has been made in view of the above-described problems, and an object thereof is to provide an illumination light source substrate and a liquid crystal device having a small size in the thickness direction.
[0008]
[Means for Solving the Problems]
(1) In order to achieve the above object, an illumination light source substrate according to the present invention includes a light emitting element substrate on which a light emitting element is mounted, and a support substrate to which the light emitting element substrate is connected. The substrate is a light source substrate for illumination projecting in the thickness direction of the support substrate, wherein the light emitting element substrate is provided with a recess, the support substrate is provided with a protrusion, and the light emitting element substrate is provided with a protrusion on the support substrate. The light emitting element substrate and the support substrate are connected to each other in a fitted state.
[0009]
According to this light source substrate for illumination, the light emitting element substrate and the support substrate are not simply overlapped and connected, but the concave portion provided on the light emitting element substrate and the convex portion provided on the support substrate are fitted. Therefore, the dimension in the thickness direction can be reduced, that is, the overall shape can be reduced.
[0010]
In addition, since the light emitting element substrate can be pressed by the convex portion of the support substrate, it is possible to prevent the light emitting element from being displaced for a long period of time. Furthermore, since the two substrates can be directly positioned by fitting the concave portion of the light emitting element substrate and the convex portion of the support substrate, the soldering process for connecting the two substrates can be performed accurately and quickly. .
[0011]
(2) In the illumination light source substrate according to the above (1), a plurality of the light emitting elements can be provided on the light emitting element substrate, and in this case, the concave portion is formed between adjacent light emitting elements. It is desirable that In this way, the thickness dimension can be further reduced.
[0012]
(3) In the illumination light source substrate described in the above item (1) or (2), it is desirable that the light emitting element is accommodated in an opening formed beside the convex portion of the support substrate. In this way, the thickness dimension can be further reduced.
[0013]
(4) Next, a liquid crystal device according to the present invention includes a liquid crystal panel in which liquid crystal is sealed between a pair of substrates, a light emitting element substrate on which the light emitting element is mounted, and a support substrate to which the light emitting element substrate is connected. And a light guide for guiding light from the light emitting element to the liquid crystal panel, the light emitting element substrate is provided with a recess, the support substrate is provided with a protrusion, and the light emitting element substrate is provided with a recess. The light emitting element substrate and the support substrate are connected to each other in a state where the convex portions of the support substrate are fitted.
[0014]
According to this liquid crystal device, the light emitting element substrate and the support substrate are not simply overlapped and connected, but both the concave portion provided on the light emitting element substrate and the convex portion provided on the support substrate are fitted together. Thus, the dimension in the thickness direction of the illumination light source substrate composed of the light emitting element substrate and the support substrate can be reduced, and as a result, the overall shape of the liquid crystal device can be reduced in thickness.
[0015]
(5) With regard to the liquid crystal device according to the above (4), the connection portion between the light emitting element substrate and the support substrate so as to close the openings formed on both sides of the convex portion of the support substrate. It is desirable to provide a shielding member on the side opposite to the side where the light guide is disposed.
[0016]
When adopting a structure in which the LED is accommodated by an opening formed in the control board in order to reduce the thickness dimension, there is a possibility that flux, dust, etc. may enter the liquid crystal panel through the opening. Before connecting the TCP to the internal area terminal of the control board, if a shielding tape is affixed to the connection part of the LED board and the control board so as to block the opening, such as flux to the liquid crystal panel and dust etc. Can be prevented from entering.
[0017]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the case where the illumination light source substrate according to the present invention is used as a light source of a liquid crystal device will be described as an example.
[0018]
FIG. 1 shows an embodiment of a liquid crystal device according to the present invention. The liquid crystal device 1 includes a liquid crystal panel 2, a frame 4 provided with a flat light guide 3, for example, an LED substrate 6 as a light emitting element substrate, a control substrate 7 as a support substrate, and a shielding member. And a shielding tape 8. The light guide 3 and the frame 4 can be integrally formed of resin, or both can be assembled after being formed separately.
[0019]
FIG. 2 shows a cross-sectional structure in which the above elements are combined. As shown in FIG. 2, the liquid crystal panel 2 is disposed to face the light emitting surface (upper side surface of FIG. 2) of the light guide 3, and the LED substrate 6 faces the side surface of the light guide 3, that is, the light capturing surface. The control board 7 is arranged to face the non-light emitting surface (the lower side of FIG. 2) of the light guide 3, and the shielding tape 8 blocks the openings 39 formed on both sides of the control board 7. Thus, it arrange | positions on the surface on the opposite side to the side by which the light guide 3 was arrange | positioned of the connection part of the LED board 6 and the control board 7. FIG. A reflective sheet 25 is provided on the non-light emitting surface of the light guide 3. The liquid crystal panel 2 has a pair of substrates 9 a and 9 b facing each other in FIG. 1, and these substrates are bonded to each other by a sealing material 11. These substrates 9a and 9b are formed by attaching electrodes and other necessary elements to a substrate material formed of a hard light-transmitting material such as glass or a flexible light-transmitting material such as plastic. It is formed.
[0020]
In FIG. 2, a first electrode 13a acting as a common electrode, for example, is formed in a predetermined pattern on the liquid crystal side surface of the substrate material 12a of the first substrate 9a, that is, the surface facing the second substrate 9b. An overcoat layer 14a is formed, and an alignment film 16a is further formed thereon. A polarizing plate 17a as an optical element is attached to the outer surface of the substrate material 12a.
[0021]
On the liquid crystal side surface of the substrate material 12b of the second substrate 9b facing the first substrate 9a, that is, the surface facing the first substrate 9a, for example, a second electrode 13b acting as a segment electrode is formed in a predetermined pattern, An overcoat layer 14b is formed thereon, and an alignment film 16b is further formed thereon. A polarizing plate 17b as an optical element is attached to the outer surface of the substrate material 12b.
[0022]
In addition, as an optical element provided in both or one side of the 1st board | substrate 9a and the 2nd board | substrate 9b, elements other than polarizing plate 17a, 17b, for example, a phase difference plate, a light diffusing plate, etc. are provided as needed. Sometimes. A transflective plate may be provided as an optical element between the liquid crystal panel 2 and the light guide 3. Further, the substrate materials 12a and 12b can be provided with other optical elements such as a color filter, if necessary.
[0023]
The first electrode 13a and the second electrode 13b are formed to a thickness of about 1000 angstroms by a transparent electrode such as ITO (Indium Tin Oxide), and the overcoat layers 14a and 14b are made of, for example, silicon oxide, titanium oxide, or their The alignment films 16a and 16b are formed with a thickness of about 800 angstroms by, for example, a polyimide resin.
[0024]
As shown in FIG. 1, the first electrode 13 a is formed in a so-called stripe shape by arranging a plurality of linear patterns in parallel with each other. On the other hand, the second electrode 13b is also formed in a stripe shape by arranging a plurality of linear patterns parallel to each other so as to intersect the first electrode 13a. A plurality of points where these electrodes 13a and 13b intersect in a dot matrix form a pixel for displaying an image. An area partitioned by the plurality of pixels is a display area for displaying an image such as a character.
[0025]
As shown in FIG. 2, a plurality of spacers 18 are dispersed on the liquid crystal side surface of one of the first substrate 9a and the second substrate 9b formed as described above. A sealing material 11 is provided on the liquid crystal side surface in a frame shape as shown in FIG. 1 by, for example, printing, and a liquid crystal injection port 11 a is formed in a part of the sealing material 11.
[0026]
As shown in FIG. 2, a uniform dimension held by the spacer 18, for example, a gap of about 5 μm, a so-called cell gap, is formed between the substrates 9a and 9b, and is passed through the liquid crystal inlet 11a (see FIG. 1). Liquid crystal 19 is injected into the cell gap, and after the injection is completed, the liquid crystal injection port 11a is sealed with resin or the like.
[0027]
In FIG. 1, the first substrate 9a has a substrate overhanging portion 9c that protrudes to the outside of the second substrate 9b, and the first electrode 13a on the first substrate 9a directly extends to the substrate overhanging portion 9c to form the wiring 21a. It has become. Further, the second substrate 9b has a substrate overhanging portion 9d that protrudes to the outside of the first substrate 9a, and the second electrode 13b on the second substrate 9b extends directly to the substrate overhanging portion 9d to become a wiring 21b. ing.
[0028]
The electrodes 13a and 13b and the wirings 21a and 21b extending from the electrodes 13a and 21b are actually formed on the entire surface of the respective substrates 9a and 9b at a very narrow interval. In FIG. In order to show the structure in an easy-to-understand manner, the electrodes and the like are schematically shown at intervals wider than the actual intervals, and some of the electrodes are not shown. In addition, the electrodes 13a and 13b formed in the region where the liquid crystal is sealed are not limited to being formed in a straight line, and may be formed as a pattern such as an appropriate character or figure.
[0029]
In FIG. 1, TCP (Tape Carrier Package) 22a and 22b are connected to the substrate overhanging portions 9c and 9d by anisotropic conductive adhesive elements, for example, ACF (Anisotropic Conductive Film) 23, respectively. .
[0030]
As is well known, the ACF 23 is a conductive polymer film that is used to electrically connect a pair of terminals with anisotropy and is electrically connected. For example, as shown in FIG. Alternatively, it is formed in the thermosetting resin film 24 by including a large number of conductive particles 26 in a dispersed state.
[0031]
In FIG. 1, TCPs 22a and 22b are IC structures configured by using TAB technology. For example, liquid crystal driving ICs 29a and 29b are bonded to an FPC (Flexible Printed Circuit) 28 in which wirings 27 are formed, respectively. For example, it is formed by gang bonding. Reference numerals 30a and 30b indicate terminals for electrical connection with an external circuit.
[0032]
The substrate overhanging portion 9c and the TCP 22a are sandwiched between the ACF 23 by thermocompression bonding, that is, the pressure is applied under heating, so that the TCP 22a is bonded to the substrate overhanging portion 9c, and the TCP 27a wiring 27 and the wiring over the substrate overhanging portion 9c To achieve a unidirectional conductive connection between them. Further, the same adhesion and conductive connection are realized between the substrate overhanging portion 9d and the TCP 22b.
[0033]
With respect to the liquid crystal panel 2 formed as described above, a scanning voltage is sequentially applied in a linear pattern to either the first electrode 13a or the second electrode 13b by the liquid crystal driving ICs 29a and 29b, and at the same time, By applying a data voltage based on the display image to each of the linear patterns to the other of the electrodes, the light passing through each pixel portion selected by the application of both voltages is modulated, so that the substrate 9a or 9b Images such as letters and numbers are displayed on the outside.
[0034]
As shown in FIG. 3 (a), the LED substrate 6 provided on the non-light emitting surface (lower side surface of FIG. 1) side of the light guide 3 includes a skirt 6a on both sides having a low height, and skirts thereof. A plurality of LEDs 31 serving as light emitting elements are mounted at appropriate intervals in the longitudinal direction of the beam portion 6b. The bottom of the beam portion 6 b is notched with a predetermined interval, that is, a recess 37 is provided, and the plurality of LEDs 31 are provided so as to sandwich the recess 37. Terminals 32 are formed on the skirt 6a of the LED board 6, and the terminals 32, LEDs 31 and other electronic components (not shown) provided as needed are connected to the inside or the surface of the LED board 6. Wiring (not shown) is formed.
[0035]
As shown in FIG. 1, the LED substrate 6 is mounted on the frame 4 or the light guide 3 from the non-light emitting surface side (the lower surface side in FIG. 1) of the light guide 3. For this mounting, for example, the skirt 6a of the LED board 6 is inserted into an opening (not shown) formed between the light guide 3 and the frame 4 without using any special fixing means such as screws or adhesives. Can be achieved.
[0036]
With the skirt 6a of the LED substrate 6 mounted on the frame 4 or the light guide 3, the beam 6b of the LED substrate 6 faces the side surface of the light guide 3, that is, the light capturing surface, as shown in FIG. Accordingly, the LED 31 mounted on the beam portion 6b is arranged to face the light capturing surface of the light guide 3. This state can be clearly understood by looking at the cross-sectional structure of FIG.
[0037]
In FIG. 3A, the control board 7 is formed of an inflexible material such as glass epoxy resin, for example, and on the back side (the lower side of FIG. 3A), the control circuit 33 and the internal region are formed. Terminals 34a and 34b and side edge terminals 36 are provided. The control circuit 33 controls the operation of the liquid crystal driving ICs 29a and 29b of the liquid crystal panel 2 (see FIG. 1), controls the lighting operation of the LED 31, or an electronic device in which the present liquid crystal device 1 is used, for example, a mobile phone. Control the operation of telephones, personal digital assistants, etc.
[0038]
Further, as shown in FIG. 1, the internal region terminal 34 a is a terminal to which a terminal 30 a of the TCP 22 a extending from the liquid crystal panel 2 is connected. The internal region terminal 34b is a terminal to which a terminal 30b of another TCP 22b extending from the liquid crystal panel 2 is connected. In addition, a plurality of convex portions 38 are formed on the side end portion of the control substrate 7 to which the LED substrate 6 is connected, and openings 39 are inevitably formed on both sides of the convex portions 38.
[0039]
In FIG. 1, the control board 7 is attached from the non-light emitting surface side (lower surface side in FIG. 1) of the light guide 3 to the frame 4 in a state where the LED board 6 is attached. For this mounting, for example, a fixing protrusion (not shown) is provided at an appropriate position of the frame 4 without using a special fixing means such as a screw or an adhesive, and the control board 7 is stopped using the protrusion. Can be achieved. Further, it is not always necessary to use such fixing means, and the control board 7 may be simply mounted on the light guide 3 while being guided by the frame 4.
[0040]
When the control board 7 is mounted on the frame 4 in this way, the LED board 6 is in a state where the convex part 38 of the control board 7 is fitted in the concave part 37 of the LED board 6 as shown in FIG. In the illustrated embodiment, the LED board 6 and the control board 7 are assembled to each other so that both extend in a direction substantially perpendicular to each other so as to project in the thickness direction ZZ of the control board 7. At this time, each LED 31 is accommodated in an opening 39 inevitably formed on both sides of the convex portion 38 of the control board 7.
[0041]
When the LED board 6 and the control board 7 are assembled to each other, the terminals 32 of the LED board 6 and the side edge terminals 36 of the control board 7 are in contact with each other in a positional relationship that coincides with each other. Then, the contact portion between the terminal 32 and the terminal 36 is subjected to conductive connection processing such as soldering, whereby the LED substrate 6 is electrically and mechanically connected to the control substrate 7 to form the illumination light source substrate 41. The
[0042]
With respect to the illumination light source substrate 41 formed in this way, the LED substrate 6 and the control substrate 7 are assembled by fitting the concave portion 37 and the convex portion 38 provided in each, so that the dimension H in the thickness direction Z-Z. Is much smaller than that of the conventional structure (see FIG. 5), that is, the overall shape can be made very thin. For this reason, the dimension in the thickness direction (the ZZ direction in FIG. 1) of the liquid crystal device 1 configured using the illumination light source 41 can be reduced.
[0043]
Further, since the LED substrate 6 can be pressed from the control substrate 7 toward the light guide 3 in FIG. 1 by the convex portion 38 of the control substrate 7, it is possible to prevent the positional deviation of the LED 31 from occurring for a long period of time. Further, since the two substrates can be directly positioned by fitting the concave portion 37 of the LED substrate 6 and the convex portion 38 of the control substrate 7, a soldering process for connecting the two substrates is performed accurately and quickly. be able to.
[0044]
Thereafter, in FIG. 1, in a state where the LED board 6 and the control board 7 are mounted on the frame 4, light is guided on the surface of the connection portion between the LED board 6 and the control board 7 so as to close the opening 39 of the control board 7. The shielding tape 8 is stuck on the side opposite to the side where the body is disposed. The effect of the shielding tape 8 will be described later.
[0045]
In FIG. 1, the liquid crystal panel 2 is mounted on the frame 4 with the image display surface side facing outward. At this time, one of the TCPs 22b is bent so that its tip passes through the space K formed between the frame 4 and the light guide 3 in the vertical direction in the figure. Thus, after the liquid crystal panel 2 is arranged on the light emitting surface of the light guide 3 so as to be supported by the frame 4, one TCP 22 a is bent to the back side of the control board 7 through the notch portion 42 provided in the frame 4. As shown in FIG. 2, the tip terminal 30a is connected to an internal region terminal 34a formed on the back surface of the control board 7, for example, by soldering.
[0046]
On the other hand, in FIG. 1, the other TCP 22 b is similarly bent through the light guide 3 and the frame 4 to the back side of the control board 7, and the tip terminal 30 b is formed on the back side of the control board 7. The region terminal 34b is connected by, for example, soldering.
[0047]
As described above, the liquid crystal device 1 shown in the exploded view in FIG. 1 is manufactured. As shown in FIGS. 3A and 3B, the control board 7 is used to reduce the thickness dimension. When the structure in which the LED 31 is accommodated by the opening 39 formed in the above is adopted, there is a possibility that flux, dust or the like may enter the liquid crystal panel 2 through the opening 39. Before connecting the TCPs 22a and 22b to the internal area terminals 34a and 34b of the control board 7, if the shielding tape 8 is attached to the connection part of the LED board 6 and the control board 7 so as to close the opening 39, such as Intrusion of flux and dust into the liquid crystal panel 2 can be prevented.
[0048]
(Other embodiments)
The present invention has been described with reference to the preferred embodiments. However, the present invention is not limited to the embodiments, and various modifications can be made within the scope of the invention described in the claims.
[0049]
For example, in the embodiment of FIG. 1, the illumination light source substrate according to the present invention is applied to the liquid crystal device, but the illumination light source substrate can also be applied to other electro-optical devices such as EL devices and plasma displays.
[0050]
Further, the number of LEDs as light emitting elements is not limited to a specific number, and any light emitting element other than LEDs can be applied as the light emitting elements.
[0051]
【The invention's effect】
According to the illumination light source substrate and the liquid crystal device according to the present invention, the light emitting element substrate and the support substrate are not simply overlapped and connected, but the concave portion provided on the light emitting element substrate and the convex portion provided on the support substrate are provided. Since both of them are connected in a state of being fitted, the dimension in the thickness direction can be reduced, that is, the overall shape can be reduced.
[0052]
In addition, since the light emitting element substrate can be pressed by the convex portion of the support substrate, it is possible to prevent the light emitting element from being displaced for a long period of time. Furthermore, since the two substrates can be directly positioned by fitting the concave portion of the light emitting element substrate and the convex portion of the support substrate, the soldering process for connecting the two substrates can be performed accurately and quickly. .
[Brief description of the drawings]
FIG. 1 is a perspective view showing an embodiment of a light source substrate for illumination according to the present invention and an embodiment of a liquid crystal device according to the present invention in an exploded state.
FIG. 2 is a cross-sectional view showing a cross-sectional structure of the liquid crystal device according to the line II-II in FIG.
FIG. 3 is a diagram showing in detail the light source substrate for illumination used in FIG. 1, wherein (a) shows a state before the LED substrate and the control substrate are connected, and (b) shows the LED substrate and the control substrate. The state after connection is shown.
4 is a diagram showing a main part of the structure shown in FIG. 1, and is a diagram showing a state where an LED substrate is mounted on a light guide. FIG.
FIG. 5 is a diagram showing an example of a conventional illumination light source substrate.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Liquid crystal device 2 Liquid crystal panel 3 Light guide 4 Frame 6 LED substrate (light emitting element substrate)
6a Hem 6b Beam 7 Control board (support board)
8 Shielding tape 9a, 9b Substrate 9c, 9d Substrate overhanging portion 13a, 13b Electrode 19 Liquid crystal 22a, 22b TCP (connection substrate)
31 LED (light emitting element)
37 Concave part 38 Convex part 39 Opening 41 Light source substrate Z for illumination Thickness direction

Claims (4)

発光素子が実装された発光素子基板と、該発光素子基板が接続される支持基板とを有し、前記発光素子基板は前記支持基板の厚さ方向へ張り出す照明用光源基板において、
前記発光素子基板に凹部が設けられ、前記支持基板に凸部が設けられ、前記発光素子基板の凹部に前記支持基板の凸部を嵌合させた状態で該発光素子基板と該支持基板とが互いに接続され、
前記発光素子は前記支持基板の凸部の横に形成される開口に収容されることを特徴とする照明用光源基板。
A light-emitting element substrate on which a light-emitting element is mounted; and a support substrate to which the light-emitting element substrate is connected. The light-emitting element substrate extends in the thickness direction of the support substrate.
The light emitting element substrate is provided with a concave portion, the support substrate is provided with a convex portion, and the convex portion of the support substrate is fitted into the concave portion of the light emitting element substrate. Connected to each other,
The light source substrate for illumination, wherein the light emitting element is accommodated in an opening formed beside a convex portion of the support substrate.
前記発光素子は前記発光素子基板上に複数個設けられ、前記凹部は隣り合う発光素子の間に形成されることを特徴とする請求項1に記載の照明用光源基板。  The illumination light source substrate according to claim 1, wherein a plurality of the light emitting elements are provided on the light emitting element substrate, and the concave portion is formed between adjacent light emitting elements. 一対の基板間に液晶を封入して成る液晶パネルと、発光素子が実装された発光素子基板と、該発光素子基板が接続される支持基板と、前記発光素子からの光を前記液晶パネルへ導く導光体とを有する液晶装置において、
前記発光素子基板に凹部が設けられ、前記支持基板に凸部が設けられ、前記発光素子基板の凹部に前記支持基板の凸部を嵌合させた状態で該発光素子基板と該支持基板とが互いに接続され、
前記発光素子は前記支持基板の凸部の横に形成される開口に収容されることを特徴とすることを特徴とする液晶装置。
A liquid crystal panel in which liquid crystal is sealed between a pair of substrates, a light emitting element substrate on which a light emitting element is mounted, a support substrate to which the light emitting element substrate is connected, and light from the light emitting element is guided to the liquid crystal panel. In a liquid crystal device having a light guide,
The light emitting element substrate is provided with a concave portion, the support substrate is provided with a convex portion, and the convex portion of the support substrate is fitted into the concave portion of the light emitting element substrate. Connected to each other,
The liquid crystal device, wherein the light emitting element is accommodated in an opening formed beside a convex portion of the support substrate.
前記支持基板の凸部の両脇に形成される開口をふさぐように、前記発光素子基板と前記支持基板との間の接続部分の前記導光体が配設された側とは反対側に遮蔽部材を設けたことを特徴とする請求項3に記載の液晶装置。  The connection portion between the light emitting element substrate and the support substrate is shielded on the side opposite to the side where the light guide is disposed so as to block the openings formed on both sides of the convex portion of the support substrate. The liquid crystal device according to claim 3, further comprising a member.
JP30573999A 1999-10-27 1999-10-27 Light source substrate for illumination and liquid crystal device Expired - Fee Related JP3994600B2 (en)

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