JP3911931B2 - Liquid crystal device, method for manufacturing liquid crystal device, and electronic apparatus - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a liquid crystal device that displays images such as letters, numbers, and figures by controlling the orientation of liquid crystal sealed between a pair of substrates, and a method for manufacturing the same. The present invention also relates to an electronic device configured using a liquid crystal device.
[0002]
[Prior art]
In recent years, liquid crystal devices have been widely used in various electronic devices such as mobile phones and portable information terminals.
[0003]
Generally, a liquid crystal device is formed by attaching a lighting device such as a backlight or a liquid crystal driving IC to a liquid crystal panel having a structure in which liquid crystal is sealed between a pair of substrates. In general, a liquid crystal panel is formed by bonding a pair of substrates each having an electrode formed thereon to each other with a sealant and enclosing the liquid crystal in a gap formed between the substrates, a so-called cell gap. .
[0004]
Conventionally, as a method of attaching a liquid crystal driving IC to a liquid crystal panel, that is, mounting, a COG (Chip On Glass) method, a TAB (Tape Automated bonding) method, and various other mounting methods are known. Here, the COG method is a mounting structure in which an IC chip is directly mounted on the surface of a substrate constituting a liquid crystal panel.
[0005]
Also, the TAB method is a method of manufacturing a TCP (Tape Carrier Package) by bonding an IC chip on a long carrier tape using TAB technology, and cutting the TCP into individual wiring pattern units. This is a mounting structure in which an IC chip is mounted on a liquid crystal panel by manufacturing an FPC (Flexible Printed Circuit) and further connecting the FPC to a substrate constituting the liquid crystal panel.
[0006]
In a liquid crystal device, generally, after mounting an IC chip on a liquid crystal panel using various mounting methods as described above, it is necessary to electrically connect a control board on which an appropriate circuit is mounted to the IC chip. . When electrically connecting the control board to the IC chip in this way, conventionally, after connecting the FPC, that is, the flexible board to the board constituting the liquid crystal panel, the control board is connected to the flexible board. The mounting structure was adopted.
[0007]
[Problems to be solved by the invention]
Conventionally, when connecting a control board to a liquid crystal panel via a flexible board, through holes are made at appropriate positions on the flexible board, and marks are formed at appropriate positions on the control board. The positions of the flexible board and the control board are visually adjusted so that the through hole overlaps the mark on the control board side, and in this state, the terminals of the flexible board and the control board are electrically connected. Conductive connection was made by attaching. However, such a conventional connection structure has a problem that it is difficult to always stably and accurately connect the terminals of the flexible substrate and the terminals of the control substrate.
[0008]
The present invention has been made in view of the above problems, and in a liquid crystal device having a structure in which a control substrate is connected to a flexible substrate extending from a substrate constituting a liquid crystal panel, the flexible substrate and the control substrate are provided. The purpose is to always be able to make a stable and accurate connection.
[0009]
[Means for Solving the Problems]
In order to achieve the above object, a method of manufacturing a liquid crystal device according to the present invention includes a pair of substrates that hold liquid crystal, a first flexible substrate that is pressure-bonded to at least one of the pair of substrates, and the pair of substrates. A second flexible substrate that is pressure-bonded to at least one of the substrates and extends in a direction different from the first flexible substrate, and is connected to the first and second flexible substrates on the back side of the pair of substrates. A method of manufacturing a liquid crystal device having a control board arranged in an overlapping manner, wherein the first hole provided in the first flexible board and the second hole of the control board provided corresponding to the first hole. And the first terminal of the first flexible board and the second terminal of the control board corresponding to the first terminal are conductively connected in a state where the pins are inserted and positioned. Bend the first flexible substrate and superimpose the control substrate on the back of the pair of substrates The second flexible board is bent to the back side of the pair of boards, and a third hole provided in the second flexible board and a first of the control board provided corresponding to the third hole are provided. Conductively connecting the third terminal of the second flexible board and the fourth terminal of the control board corresponding to the third terminal in a state where the four holes are overlapped and a pin is inserted and positioned. Features.
In the liquid crystal device manufacturing method, it is preferable that at least two of the first hole, the second hole, the third hole, and the fourth hole are provided.
(1) In order to achieve the above object, a liquid crystal device according to the present invention includes a liquid crystal, a pair of substrates sandwiching the liquid crystal, a flexible substrate connected to at least one of the pair of substrates, In a liquid crystal device having a control board connected to a flexible board, the flexible board is provided with a through hole, the control board is provided with a hole, and the flexible board has a through hole and the control board. The holes of the control board are overlapped with each other in a state where the flexible board and the control board are connected to each other.
[0010]
According to this liquid crystal device, the flexible substrate is provided with a through hole, and the control substrate is provided with a hole. If the holes are overlapped and a pin is inserted into the overlapped portion, the flexible substrate is flexible. The relative positions of the board and the control board can be easily adjusted to a specific state, and therefore, the terminals of the both can always be stably and easily conductively connected.
[0011]
(2) In the liquid crystal device described in (1) above, it is desirable to provide at least two through holes in the flexible substrate and holes in the control substrate. In this way, the alignment of the flexible substrate and the control substrate can be performed with higher accuracy than in the case where the combination of holes is one.
[0012]
(3) In a certain type of liquid crystal device, two flexible substrates can be provided on a pair of substrates constituting a liquid crystal panel so as to extend in two different directions, and a control substrate is stacked on the pair of substrates. Further, the two flexible substrates can be connected to the control substrate in a state of being bent to the back side of the pair of substrates. Regarding the liquid crystal device having this structure, each of the flexible substrates extending in the two directions is provided with a through hole, and the control substrate is provided with a hole corresponding to each of the flexible substrates extending in the two directions. Can do.
[0013]
Also in the liquid crystal device having this configuration, if the through hole on the flexible substrate side and the hole on the control substrate side are overlapped and a pin is inserted into the overlapped portion, the relative position between the flexible substrate and the control substrate Can be easily aligned in a specific state, so that both terminals can always be stably and easily conductively connected.
[0014]
(4) Next, a method for manufacturing a liquid crystal device according to the present invention includes a liquid crystal, a pair of substrates that sandwich the liquid crystal, a flexible substrate connected to at least one of the pair of substrates, and the flexible In a liquid crystal device manufacturing method for manufacturing a liquid crystal device having a control substrate connected to a conductive substrate, a common pin is inserted into a through hole provided in the flexible substrate and a hole provided in the control substrate And a step of conducting conductive connection between the terminal of the flexible substrate and the terminal of the control substrate in a state of being in an open state.
[0015]
According to this manufacturing method, the through-hole on the flexible substrate side and the hole on the control substrate side are overlapped and a pin is inserted into the overlapped portion, so that the relative relationship between the flexible substrate and the control substrate is achieved. The position can be easily adjusted to a specific state. Therefore, both terminals can always be stably and easily conductively connected.
[0016]
(5) Next, an electronic apparatus according to the present invention is an electronic apparatus having a liquid crystal device and a housing for housing the liquid crystal device, wherein the liquid crystal device is any one of (1) to (3) above. It is comprised by the liquid crystal device as described in above.
[0017]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 1 shows an embodiment of a liquid crystal device according to the present invention in an exploded state. The liquid crystal device 1 shown here includes a liquid crystal panel 2 having a panel structure for sandwiching liquid crystal, a first flexible substrate 3a and a second flexible substrate 3b extending in two directions from the liquid crystal panel 2, and these And the control board 4 connected to the flexible boards 3a and 3b.
[0018]
FIG. 2 shows a configuration when the assembled liquid crystal device 1 is viewed from the direction corresponding to the arrow II in FIG. As shown in FIG. 2, the control substrate 4 is disposed so as to overlap the back side of the liquid crystal panel 2, and the first flexible substrate 3 a and the second flexible substrate 3 b are respectively from the front side to the back side of the liquid crystal panel 2. Then, it is conductively connected to the control board 4 in a bent state.
[0019]
In FIG. 1, the liquid crystal panel 2 includes a pair of substrates 7 a and 7 b that are arranged to face each other and are bonded together by a sealing material 6. As shown in FIG. 3, the first substrate 7a has a substrate material 8a, and a liquid crystal side surface of the substrate material 8a, that is, a surface facing the second substrate 7b, serves as one of a common electrode or a segment electrode. One electrode 9a is formed in a predetermined pattern, an overcoat layer 11a is formed thereon, and an alignment film 12a is further formed thereon.
[0020]
Further, a polarizing plate 13a as an optical element is attached to the outer surface of the substrate material 8a, for example, by sticking, and a transflective plate 14 as an optical element is attached to the outer side, for example, by sticking, and further to the outer side. The light guide 16 is attached by sticking, for example. That is, in the liquid crystal device 1 of the present embodiment, the upper side surface of FIG. 3 is an image display surface. As shown in FIG. 1, a light emitting source, for example, an LED element 17 is provided on one side of the light guide 16, and light emitted from these LED elements 17 is uniformly distributed over the entire surface of the liquid crystal panel 2 by the light guide 16. To be spread.
[0021]
In FIG. 3, the second substrate 7b facing the first substrate 7a has a substrate material 8b. The liquid crystal side surface of the substrate material 8b, that is, the surface facing the first substrate 7a, is a common electrode or segment electrode. The second electrode 9b acting as the other is formed in a predetermined pattern, the overcoat layer 11b is formed thereon, and the alignment film 12b is further formed thereon.
[0022]
Further, a retardation plate 18 as an optical element is attached to the outer surface of the substrate material 8b by, for example, sticking, and a polarizing plate 13b as an optical element is further attached thereon by, for example, sticking.
[0023]
In addition, as an optical element provided in both or one of the 1st board | substrate 7a and the 2nd board | substrate 7b, another element, for example, a light diffusing plate etc., can be considered as needed other than the above-mentioned thing. Further, the substrate materials 8a and 8b can be provided with other optical elements, such as a color filter, if necessary.
[0024]
The substrate materials 8a and 8b are formed in a predetermined shape, for example, a rectangular shape or a square shape, using a hard light-transmitting material such as glass, or a light-transmitting material having flexibility such as plastic. Further, the first electrode 7a and the second electrode 7b are formed to a thickness of about 1000 angstroms by a transparent electrode such as ITO (Indium Tin Oxide), for example, and the overcoat layers 11a and 11b are made of, for example, silicon oxide, titanium oxide or The alignment film 12a, 12b is formed to a thickness of about 800 Å by, for example, a polyimide resin.
[0025]
As shown in FIG. 1, the first electrode 9 a is formed in a so-called stripe shape by arranging a plurality of linear patterns in parallel with each other. On the other hand, the second electrode 9b is also formed in a stripe shape by arranging a plurality of linear patterns parallel to each other so as to intersect the first electrode 9a. A plurality of points where these electrodes 9a and 9b intersect in a dot matrix form a pixel for displaying an image. An area partitioned by the plurality of pixels is a display area for displaying an image such as a character.
[0026]
As shown in FIG. 3, a plurality of spacers 19 are dispersed on the liquid crystal side surface of one of the first substrate 7a and the second substrate 7b formed as described above. A sealing material 6 is provided on the liquid crystal side surface in a frame shape as shown in FIG. 1, for example, by printing. Further, a liquid crystal injection port 6 a is formed at an appropriate position of the sealing material 6.
[0027]
A uniform dimension held by the spacer 19, for example, a gap of about 5 μm, that is, a so-called cell gap is formed between the substrates 7a and 7b, and the liquid crystal 21 is injected into the cell gap through the liquid crystal injection port 6a. After completion of the above, the liquid crystal inlet 6a is sealed with resin or the like.
[0028]
In FIG. 1, the first substrate 7 a has a substrate protruding portion 7 c that extends outside the second substrate 7 b and further outside the sealing material 6. The first electrode 9a on the first substrate 7a directly extends to the substrate overhanging portion 7c to form a wiring 22a. Further, the second substrate 7b has a substrate overhanging portion 7d that projects outside the first substrate 7a and further outside the sealing material 6. Then, the second electrode 9b on the second substrate 7b extends directly to the substrate overhanging portion 7d to form a wiring 22b.
[0029]
In reality, a large number of electrodes 9a and 9b and wirings 22a and 22b connected to the electrodes 9a and 9b are formed over the entire surface of each of the substrates 7a and 7b at an extremely narrow interval. However, in FIG. In order to show the above in an easy-to-understand manner, these electrodes and the like are schematically shown at intervals wider than the actual intervals, and some of the electrodes are not shown. In addition, the electrodes 9a and 9b are not limited to being formed in a straight line shape, and may be formed as a pattern such as an appropriate character or figure.
[0030]
In FIG. 1, the first flexible substrate 3a is configured using, for example, a TAB technique. Specifically, the first flexible substrate 3a is formed by bonding a liquid crystal driving IC 26a as an IC chip to the flexible film 24a on which the wiring pattern 23a is formed. Further, a plurality of, for example, two through holes 27a are provided in the flexible film 24a in the vicinity of both side portions of the liquid crystal driving IC 26a, and the input bumps of the liquid crystal driving IC 26a are provided at the front end side of the flexible film 24a. The terminal 28a connected to is provided. The first flexible substrate 3a is mounted on the substrate overhanging portion 7c by an ACF (Anisotropic Conductive Film) 29a.
[0031]
As is well known, the ACF 29a is a conductive polymer film that is used to electrically connect a pair of terminals with anisotropy, and is thermoplastic as shown in FIG. 3, for example. Alternatively, it is formed by dispersing conductive particles 32 in a thermosetting resin film 31.
[0032]
The substrate overhanging portion 7c and the first flexible substrate 3a are thermocompression-bonded with the ACF 29a, that is, pressurizing under heating, thereby mechanically bonding the first flexible substrate 3a to the substrate overhanging portion 7c. A connection having conductivity in a single direction is realized between the wiring pattern 23a of the first flexible substrate 3a and the wiring 22a on the substrate extension 7c.
[0033]
In FIG. 1, a second flexible substrate 3b extending in a direction different from the first flexible substrate 3a, in the case of the present embodiment, at a right angle, is used using the TAB technique in the same manner as the first flexible substrate 3a. Specifically, it is formed by bonding a liquid crystal driving IC 26b as an IC chip to a flexible film 24b on which a wiring pattern 23b is formed. In addition, a plurality of, for example, two through holes 27b are provided in the flexible film 24b on both sides of the liquid crystal driving IC 26b, and the leading edge of the flexible film 24b is connected to the input bumps of the liquid crystal driving IC 26b. A terminal 28b is provided.
[0034]
Similar to the first flexible substrate 3a, the second flexible substrate 3b is conductively connected to the substrate overhanging portion 7d by the ACF 29b. Specifically, the substrate overhanging portion 7d and the second flexible substrate 3b are thermocompression-bonded with the ACF 29b, that is, the second flexible substrate 3b is mechanically applied to the substrate overhanging portion 7d by pressurizing under heating. In addition, a connection having conductivity in a single direction is realized between the wiring pattern 23b of the second flexible substrate 3b and the wiring 22b on the substrate overhanging portion 7d.
[0035]
The control board 4 is formed of a hard board material such as glass epoxy resin. The control board 4 includes a circuit for supplying power and control signals to the liquid crystal driving ICs 26a and 26b, a control circuit for controlling an electronic device in which the liquid crystal device 1 is incorporated, such as a mobile phone, and the like. Is installed. In FIG. 1, these circuits are schematically indicated by reference numeral 33, and two terminals 34 a and 34 b electrically connected to the circuit 33 are formed at appropriate positions on the control board 4.
[0036]
Further, holes 36a and 36b are provided in the vicinity of both ends of the terminals 34a and 34b, respectively. In the present embodiment, the hole 36a on the terminal 34a side is formed as a through hole, and the hole 36b on the terminal 34b side is formed as a through hole or a non-through hole.
[0037]
When the liquid crystal device 1 as described above is manufactured, first, the liquid crystal panel 2 is formed using a known process, and the polarizing plates 13a and 13b are formed on the outer surfaces of the pair of substrates 7a and 7b constituting the liquid crystal panel 2. Optical elements such as 13b, transflective plate 14 and retardation plate 18 are mounted. Next, the first flexible substrate 3a and the second flexible substrate 3b are connected to the pair of substrates 7a and 7b using ACFs 29a and 29b, respectively, and the light guide 16 is formed on the back surface side of the first substrate 7a. Wear.
[0038]
After that, as shown in FIG. 1, a pair of first pins 37 that are manufacturing jigs are inserted into both the hole 36a of the control board 4 and the through hole 27a of the first flexible board 3a. By this pin insertion, the relative positions of the control board 4 and the first flexible board 3a are accurately positioned, whereby the terminals 28a of the first flexible board 3a and the terminals 34a of the control board 4 are accurately set. To touch. In this state, conductive connection processing, for example, soldering is performed, and both terminals 28a and 34a are conductively connected. At this time, the control board 4 and the first flexible board are mechanically connected.
[0039]
Next, the first flexible substrate 3a and the control substrate 4 connected to each other are bent to the back side of the liquid crystal panel 2, that is, the back side of the light guide 16 as shown by the arrow A, and shown in FIG. As described above, the control substrate 4 is disposed on the back surface side of the first substrate 7a of the liquid crystal panel 2, and is mounted by, for example, sticking. Thereafter, the second flexible substrate 3b is bent from the front surface side to the back surface side of the liquid crystal panel 2 as indicated by an arrow B. At this time, the through hole 27b of the second flexible substrate 3b and the hole 36b of the control substrate 4 are substantially overlapped.
[0040]
Next, the second pin 38, which is a manufacturing jig, is inserted into both the through hole 27b of the second flexible substrate 3b and the hole 36b of the control substrate 4. At this time, when the hole 36b is a through hole, the tip of the second pin 38 reaches the light guide 16 through the control board 4, while when the hole 36b is a non-through hole, The tip of the 2 pin 38 stops at the midway position of the control board 4.
[0041]
By inserting the second pin 38 into the through hole 27b and the hole 36b as described above, the relative position of the second flexible substrate 3b with respect to the control substrate 4 is accurately positioned, thereby the second flexible substrate 3b. The terminal 28b of the conductive substrate 3b and the terminal 34b of the control substrate 4 are in accurate contact. In this state, conductive connection processing, for example, soldering is performed, and both terminals 28b and 34b are conductively connected. At this time, the second flexible substrate 3 b is mechanically connected to the control substrate 4.
[0042]
Thus, the liquid crystal device 1 is completed. In the liquid crystal device 1, the through hole 27a of the first flexible substrate 3a and the control substrate 4 are connected in a state where the first flexible substrate 3a and the control substrate 4 are connected to each other. The holes 36a overlap each other. Further, the through hole 27b of the second flexible substrate 3b and the hole 36b of the control substrate 4 overlap each other in a state where the second flexible substrate 3b and the control substrate 4 are connected to each other.
[0043]
With respect to the liquid crystal device 1 manufactured as described above, a scanning voltage is applied to each of the first electrode 9a and the second electrode 9b for each row by the liquid crystal driving ICs 26a and 26b. On the other hand, the data voltage based on the display image is applied to each pixel to modulate the light passing through each pixel portion selected by applying both voltages, so that the outside of the substrate 7a or 7b is In the case of the form, images such as letters and numbers are displayed outside the second substrate 7b.
[0044]
As described above, in the present embodiment, the first flexible board 3a and the control board 4 are positioned by inserting the first pins 37 (see FIG. 1), and the second flexible board 3b and the control board 4 are positioned. Since positioning is performed by inserting the second pin (see FIG. 2), the terminals 28a and 28b of the flexible boards 3a and 3b are controlled as compared with the conventional case where the positioning is performed visually based on the holes and marks. The terminals 34a and 34b of the substrate 4 can always be stably and easily and accurately conductively connected.
[0045]
Hereinafter, a cellular phone as an example of an electronic apparatus including the liquid crystal device illustrated in FIGS. 1 and 2 will be described with reference to FIG.
[0046]
A cellular phone 100 shown here is configured by storing various components such as an antenna 101, a speaker 102, a liquid crystal device P, a key switch 103, a microphone 104, and the like in an exterior case 106 as a casing. In addition, a control circuit board 107 on which a control circuit for controlling the operation of each component described above is provided inside the outer case 106.
[0047]
In the cellular phone 100, a signal input through the key switch 103 and the microphone 104, reception data received by the antenna 101, and the like are input to the control circuit of the control circuit board 107. Then, the control circuit displays an image such as a number, a character, or a pattern on the display surface of the liquid crystal device P based on various input data, and further transmits transmission data from the antenna 101.
[0048]
(Other embodiments)
The present invention has been described with reference to the preferred embodiments. However, the present invention is not limited to the embodiments, and various modifications can be made within the scope of the invention described in the claims.
[0049]
For example, in the embodiment of FIG. 1, the control substrate 4 is connected to the first flexible substrate 3 a by soldering or the like, and then the first flexible substrate 3 a is bent to the back side of the liquid crystal panel 2. The substrate 4 is disposed on the back surface side of the liquid crystal panel 2, and then the second flexible substrate 3b is bent to the back surface side of the liquid crystal panel 2 and the second flexible substrate 3b is soldered to the control substrate 4 or the like. Connected.
[0050]
Instead of such a method, the first flexible substrate 3a and the second flexible substrate 3b are sequentially or simultaneously placed in a state where the control substrate 4 is disposed in advance on the back side of the liquid crystal panel 2 as shown in FIG. Flexible by conductive connection processing such as soldering or the like while inserting pins 37 and 38 between the flexible substrates 3a and 3b and the control substrate 4 while bending to the back side of the liquid crystal panel 2, that is, the control substrate 4 side. It is also possible to employ a method in which the conductive substrates 3a and 3b and the control substrate 4 are conductively connected.
[0051]
In the embodiment shown in FIG. 1, a pair, that is, two holes are provided between the flexible boards 3a and 3b and the control board 4. However, the number of holes should be one or three or more. You can also.
[0052]
In the embodiment shown in FIG. 1, the case where the present invention is applied to both the two flexible substrates 3 a and 3 b extending in two directions of the liquid crystal panel 2 is illustrated, but either one of the flexible substrates is used. However, the present invention is also included in the present invention.
[0053]
The embodiment shown in FIG. 1 is an embodiment in which the present invention is applied to a TAB liquid crystal device, but the present invention naturally applies to a COG liquid crystal device and other types of liquid crystal devices. Applicable.
[0054]
In this embodiment, an example of application to a manufacturing method of a liquid crystal display device is shown. However, the present invention is not limited to an active matrix liquid crystal device but a flat panel other than a liquid crystal device, for example, a plasma display panel, an EL ( The present invention can also be applied to a method of manufacturing an electro-optical device such as an electroluminescence panel or other various devices. Furthermore, although the case where the liquid crystal device of the present invention is used for a mobile phone as an electronic device has been illustrated, the liquid crystal device of the present invention can be used in any other electronic device such as a portable information terminal, an electronic notebook, a video camera finder, etc. It can also be applied.
[0055]
【The invention's effect】
According to the liquid crystal device and the method for manufacturing the same according to the present invention, the flexible substrate is provided with a through hole, and the control substrate is provided with a hole. If inserted, the relative positions of the flexible substrate and the control substrate can be easily aligned to a specific state, and thus the terminals of both can be always stably and simply conductively connected accurately.
[Brief description of the drawings]
FIG. 1 is a perspective view showing an embodiment of a liquid crystal device and a manufacturing method thereof according to the present invention in an exploded state.
FIG. 2 is a perspective view showing a structure when the liquid crystal device is viewed from the back side according to the arrow II in FIG.
3 is a cross-sectional view showing a cross-sectional structure of the liquid crystal device according to the line III-III in FIG.
FIG. 4 is a perspective view showing an embodiment of an electronic apparatus according to the invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Liquid crystal device 2 Liquid crystal panel 3a, 3b Flexible board 4 Control board 7a, 7b Board 7c, 7d Substrate overhanging part 8a, 8b Substrate material 9a, 9b Electrode 21 Liquid crystal 22a, 22b Wiring 23a, 23b Wiring pattern 24a, 24b Possible Flexible film 26a, 26b Liquid crystal driving IC
27a, 27b Through hole 28a, 28b Terminal 34a, 34b Terminal 36a, 36b Hole 37, 38 pin

Claims (2)

A pair of substrates holding a liquid crystal;
A first flexible substrate that is crimped to at least one of the pair of substrates, a second flexible substrate that is crimped to at least one of the pair of substrates and extends in a direction different from the first flexible substrate, and A liquid crystal device manufacturing method including a control substrate connected to the first and second flexible substrates and arranged on the back side of the pair of substrates,
In the state where the first hole provided in the first flexible substrate and the second hole of the control substrate provided corresponding to the first hole are overlapped and the pin is inserted and positioned, the first possible The first terminal of the flexible board and the second terminal of the control board corresponding to the first terminal are conductively connected, and then the first flexible board is bent to place the control board on the back surfaces of the pair of boards. Superposition,
The second flexible substrate is bent to the back side of the pair of substrates, and a third hole provided in the second flexible substrate and a fourth hole of the control substrate provided corresponding to the third hole And the third terminal of the second flexible board and the fourth terminal of the control board corresponding to the third terminal are conductively connected in a state where the pins are inserted and positioned. A method for manufacturing a liquid crystal display device.   2. The method of manufacturing a liquid crystal device according to claim 1, wherein at least two of the first hole, the second hole, the third hole, and the fourth hole are provided.

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