JP2001126520A - Light source substrate for illumination and liquid crystal device - Google Patents

Light source substrate for illumination and liquid crystal device

Info

Publication number
JP2001126520A
JP2001126520A JP30573999A JP30573999A JP2001126520A JP 2001126520 A JP2001126520 A JP 2001126520A JP 30573999 A JP30573999 A JP 30573999A JP 30573999 A JP30573999 A JP 30573999A JP 2001126520 A JP2001126520 A JP 2001126520A
Authority
JP
Japan
Prior art keywords
substrate
light emitting
emitting element
liquid crystal
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP30573999A
Other languages
Japanese (ja)
Other versions
JP3994600B2 (en
Inventor
Yukihisa Kobayashi
幸久 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP30573999A priority Critical patent/JP3994600B2/en
Publication of JP2001126520A publication Critical patent/JP2001126520A/en
Application granted granted Critical
Publication of JP3994600B2 publication Critical patent/JP3994600B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To provide a light source substrate for illumination having a reduced thickness, and a liquid crystal device. SOLUTION: The light source substrate 41 for illumination has a light emitting element substrate 6 on which a light-emitting element 31 is mounted; and a support substrate 7 to which the light emitting element substrate 31 is connected. The light emitting element substrate 6 is attached in such a manner that it protrudes in a thickness direction Z-Z of the support substrate 7. The light source substrate 41 for illumination is formed by connecting the light emitting element substrate 6 attached with a concave portion 37 and the support substrate 7 attached with convex portion 7 to each other. Both substrates 6 and 7 are attached to each other by connection of the concave portion 37 and the convex portion 38, thereby allowing a dimension in the thickness direction Z-Z to be significantly reduced.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、発光素子を備えた
照明用光源基板及びそれを用いて構成される液晶装置に
関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an illumination light source substrate having a light emitting element and a liquid crystal device using the same.

【0002】[0002]

【従来の技術】光を利用して所定の動作を行う電気光学
装置は、例えば、液晶装置、エレクトロルミネッセンス
(EL)素子を用いた光学装置、プラズマディスプレイ
(PDP)、電界放出素子(FED)を用いた光学装置
等のように、従来から種々のものが知られている。
2. Description of the Related Art Electro-optical devices that perform a predetermined operation using light include, for example, a liquid crystal device, an optical device using an electroluminescence (EL) element, a plasma display (PDP), and a field emission element (FED). Various devices such as an optical device used are conventionally known.

【0003】この電気光学装置として液晶装置を考える
と、この液晶装置では、液晶に印加する電圧を制御して
その液晶の配向を制御することにより、その液晶を通過
する光を変調し、もって文字、数字、図形等といった像
を表示する。この液晶装置として、従来、例えば図5
(a)に示す照明用光源基板51を用いたものが知られ
ている。
When a liquid crystal device is considered as the electro-optical device, the liquid crystal device controls the voltage applied to the liquid crystal to control the orientation of the liquid crystal, thereby modulating the light passing through the liquid crystal, thereby forming a character. , Numbers, figures, etc. are displayed. Conventionally, as this liquid crystal device, for example, FIG.
One using an illumination light source substrate 51 shown in FIG.

【0004】この従来の照明用光源基板51は、発光素
子としてのLED(Light EmittingDiode)52を発光
素子基板53に実装し、その発光素子基板53を支持基
板54に接続することによって形成される。支持基板5
4は、例えば、各種の制御回路が搭載される制御基板と
して構成される。この照明用光源基板51が液晶装置の
中に組み込まれると、図5(b)に示すように、LED
52の発光面が導光体56の光取込み面に対向する位置
に配置される。
The conventional light source substrate 51 for illumination is formed by mounting an LED (Light Emitting Diode) 52 as a light emitting element on a light emitting element substrate 53 and connecting the light emitting element substrate 53 to a support substrate 54. Support substrate 5
4 is configured as, for example, a control board on which various control circuits are mounted. When the illumination light source substrate 51 is incorporated in a liquid crystal device, as shown in FIG.
The light emitting surface of 52 is arranged at a position facing the light receiving surface of the light guide 56.

【0005】この照明用光源基板51を用いた液晶装置
では、LED52からの光が導光体56に取り込まれ、
さらにその光出射面から均一な強度の光Rが出射され、
この均一な光が液晶パネル(図示せず)に供給されて文
字等といった可視像の表示のために利用される。
In the liquid crystal device using the illumination light source substrate 51, light from the LED 52 is taken into the light guide 56,
Further, light R of uniform intensity is emitted from the light emission surface,
This uniform light is supplied to a liquid crystal panel (not shown) and used for displaying a visible image such as a character.

【0006】[0006]

【発明が解決しようとする課題】しかしながら、上記従
来の照明用光源基板51では、発光素子基板53が単に
支持基板54の厚さ方向、すなわちZ−Z方向へ何等の
工夫もなくただ単純に接続されているだけであった。こ
のため、従来の照明用光源基板51は、厚さ方向Z−Z
の寸法が大きく、従って、これを用いる液晶装置の厚さ
寸法も大きくなるという問題があった。
However, in the conventional illumination light source substrate 51, the light emitting element substrate 53 is simply connected in the thickness direction of the support substrate 54, that is, in the ZZ direction without any contrivance. Was just being. For this reason, the conventional illumination light source substrate 51 has a thickness direction ZZ
Therefore, there is a problem that the size of the liquid crystal device using the same is also large.

【0007】本発明は、上記の問題点に鑑みて成された
ものであって、厚さ方向の寸法が小さい照明用光源基板
及び液晶装置を提供することを目的とする。
The present invention has been made in view of the above problems, and has as its object to provide an illumination light source substrate and a liquid crystal device having a small dimension in the thickness direction.

【0008】[0008]

【課題を解決するための手段】(1) 上記の目的を達
成するため、本発明に係る照明用光源基板は、発光素子
が実装された発光素子基板と、該発光素子基板が接続さ
れる支持基板とを有し、前記発光素子基板は前記支持基
板の厚さ方向へ張り出す照明用光源基板において、前記
発光素子基板に凹部を設け、前記支持基板に凸部を設
け、前記発光素子基板の凹部に前記支持基板の凸部を嵌
合させた状態で該発光素子基板と該支持基板とを互いに
接続することを特徴とする。
(1) In order to achieve the above object, an illumination light source substrate according to the present invention comprises a light emitting element substrate on which a light emitting element is mounted and a support to which the light emitting element substrate is connected. A light-emitting element substrate, wherein the light-emitting element substrate is provided with a concave portion on the light-emitting element substrate, a convex portion on the support substrate, The light emitting element substrate and the support substrate are connected to each other in a state where the protrusion of the support substrate is fitted in the recess.

【0009】この照明用光源基板によれば、発光素子基
板と支持基板とを単に重ね合わせて接続するというので
はなく、発光素子基板に設けた凹部と支持基板に設けた
凸部とを嵌合させた状態で両者を接続するようにしたの
で、厚さ方向の寸法を小さく、すなわち全体形状を薄く
することができる。
According to this light source substrate for illumination, the light emitting element substrate and the supporting substrate are not simply superposed and connected, but the concave portion provided on the light emitting element substrate and the convex portion provided on the supporting substrate are fitted. Since the two are connected in this state, the dimension in the thickness direction can be reduced, that is, the overall shape can be reduced.

【0010】また、支持基板の凸部によって発光素子基
板を押え付けることができるので、発光素子に位置ズレ
が生じることを長期間にわたって防止できる。さらに、
発光素子基板の凹部と支持基板の凸部との嵌合により、
両基板を互いに直接的に位置決めできるので、両基板を
接続するための半田付け処理等を正確且つ迅速に行うこ
とができる。
[0010] Further, since the light emitting element substrate can be pressed by the convex portion of the support substrate, it is possible to prevent the light emitting element from being displaced for a long time. further,
By fitting the concave portion of the light emitting element substrate and the convex portion of the support substrate,
Since both substrates can be directly positioned with respect to each other, a soldering process or the like for connecting both substrates can be performed accurately and quickly.

【0011】(2) 上記(1)項記載の照明用光源基
板においては、前記発光素子を前記発光素子基板上に複
数個設けることができ、その場合には、前記凹部は隣り
合う発光素子の間に形成されることが望ましい。こうす
れば、厚さ寸法をより一層小さくすることができる。
(2) In the illumination light source substrate according to the above (1), a plurality of the light emitting elements can be provided on the light emitting element substrate. In this case, the concave portion is formed by the adjacent light emitting element. It is desirable to be formed between them. In this case, the thickness can be further reduced.

【0012】(3) 上記(1)項又は(2)項記載の
照明用光源基板においては、前記発光素子は前記支持基
板の凸部の横に形成される開口に収容されることが望ま
しい。こうすれば、厚さ寸法をより一層小さくすること
ができる。
(3) In the illumination light source substrate according to the above item (1) or (2), it is preferable that the light emitting element is accommodated in an opening formed beside a convex portion of the support substrate. In this case, the thickness can be further reduced.

【0013】(4) 次に、本発明に係る液晶装置は、
一対の基板間に液晶を封入して成る液晶パネルと、発光
素子が実装された発光素子基板と、該発光素子基板が接
続される支持基板と、前記発光素子からの光を前記液晶
パネルへ導く導光体とを有する液晶装置において、前記
発光素子基板に凹部を設け、前記支持基板に凸部を設
け、前記発光素子基板の凹部に前記支持基板の凸部を嵌
合させた状態で該発光素子基板と該支持基板とを互いに
接続することを特徴とする。
(4) Next, the liquid crystal device according to the present invention comprises:
A liquid crystal panel in which liquid crystal is sealed between a pair of substrates, a light emitting element substrate on which a light emitting element is mounted, a support substrate to which the light emitting element substrate is connected, and guiding light from the light emitting element to the liquid crystal panel In a liquid crystal device having a light guide, the light emitting element substrate is provided with a concave portion, the support substrate is provided with a convex portion, and the light emission is performed in a state where the convex portion of the support substrate is fitted into the concave portion of the light emitting element substrate. The device substrate and the supporting substrate are connected to each other.

【0014】この液晶装置によれば、発光素子基板と支
持基板とを単に重ね合わせて接続するというのではな
く、発光素子基板に設けた凹部と支持基板に設けた凸部
とを嵌合させた状態で両者を接続するようにしたので、
発光素子基板と支持基板とから成る照明用光源基板の厚
さ方向の寸法を小さくでき、その結果、液晶装置の全体
形状の厚さを薄くすることができる。
According to this liquid crystal device, the light emitting element substrate and the supporting substrate are not simply overlapped and connected, but the concave portion provided on the light emitting element substrate and the convex portion provided on the supporting substrate are fitted. Because we connected both in the state,
The dimension in the thickness direction of the illumination light source substrate including the light emitting element substrate and the support substrate can be reduced, and as a result, the thickness of the overall shape of the liquid crystal device can be reduced.

【0015】(5) 上記(4)項記載の液晶装置に関
しては、前記支持基板の凸部の両脇に形成される開口を
ふさぐように、前記発光素子基板と前記支持基板との間
の接続部分の前記導光体が配設された側とは反対側に遮
蔽部材を設けることが望ましい。
(5) In the liquid crystal device according to the above (4), the connection between the light emitting element substrate and the support substrate is closed so as to close the openings formed on both sides of the convex portion of the support substrate. It is desirable to provide a shielding member on a portion of the portion opposite to the side on which the light guide is provided.

【0016】厚さ寸法を小さくするために制御基板に形
成される開口によってLEDを収容する構造を採用する
場合には、この開口を通して、フラックス、ゴミ等が液
晶パネルの側へ侵入するおそれがある。TCPを制御基
板の内部領域端子に接続する前に、当該開口をふさぐよ
うにLED基板と制御基板との接続部分に遮蔽テープを
貼着すれば、そのような液晶パネルへのフラックス等及
びゴミ等の侵入を防止できる。
In the case where a structure for accommodating an LED by an opening formed in the control board in order to reduce the thickness is adopted, there is a possibility that flux, dust and the like may enter the liquid crystal panel through this opening. . Before connecting the TCP to the internal area terminal of the control board, if a shielding tape is attached to the connection portion between the LED board and the control board so as to cover the opening, it is possible to use such a flux or dust to the liquid crystal panel. Can be prevented from entering.

【0017】[0017]

【発明の実施の形態】以下、本発明に係る照明用光源基
板を液晶装置の光源として用いた場合を例に挙げて説明
する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an example in which an illumination light source substrate according to the present invention is used as a light source of a liquid crystal device will be described.

【0018】図1は、本発明に係る液晶装置の一実施形
態を示している。この液晶装置1は、液晶パネル2と、
例えば平板状の導光体3を備えたフレーム4と、発光素
子基板としてのLED基板6と、支持基板としての制御
基板7と、そして遮蔽部材としての遮蔽テープ8とを有
する。導光体3とフレーム4とは樹脂によって一体に形
成することもできるし、あるいは、それぞれを別々に形
成した上で両者を組み付けることもできる。
FIG. 1 shows an embodiment of the liquid crystal device according to the present invention. The liquid crystal device 1 includes a liquid crystal panel 2 and
For example, a frame 4 having a flat light guide 3, an LED substrate 6 as a light emitting element substrate, a control substrate 7 as a support substrate, and a shielding tape 8 as a shielding member are provided. The light guide 3 and the frame 4 can be integrally formed of resin, or they can be formed separately and then assembled together.

【0019】上記の各要素を組み合わせた状態の断面構
造が図2に示されている。図2に示す通り、液晶パネル
2は導光体3の発光面(図2の上側面)に対向して配設
され、LED基板6は導光体3の側面すなわち光取込み
面に対向して配設され、制御基板7は導光体3の非発光
面(図2の下側面)に対向して配設され、そして遮蔽テ
ープ8は制御基板7の両脇に形成される開口39をふさ
ぐように、LED基板6と制御基板7との接続部分の導
光体3が配設された側とは反対側の表面に配設される。
なお、導光体3の非発光面には反射シート25が設けら
れる。液晶パネル2は、図1において、互いに対向する
一対の基板9a及び9bを有し、これらの基板はシール
材11によってそれらの周囲が互いに接着される。これ
らの基板9a及び9bは、例えばガラス等といった硬質
な光透過性材料や、プラスチック等といった可撓性を有
する光透過性材料等によって形成された基板素材に電極
その他の必要要素を付設することによって形成される。
FIG. 2 shows a cross-sectional structure in which the above-described components are combined. As shown in FIG. 2, the liquid crystal panel 2 is disposed so as to face the light emitting surface (the upper side surface in FIG. 2) of the light guide 3, and the LED substrate 6 faces the side surface of the light guide 3, that is, the light receiving surface. The control board 7 is provided so as to face the non-light-emitting surface (the lower side face in FIG. 2) of the light guide 3, and the shielding tape 8 covers the openings 39 formed on both sides of the control board 7. As described above, the connection portion between the LED board 6 and the control board 7 is provided on the surface opposite to the side on which the light guide 3 is provided.
Note that a reflection sheet 25 is provided on the non-light-emitting surface of the light guide 3. In FIG. 1, the liquid crystal panel 2 has a pair of substrates 9a and 9b facing each other. These substrates 9a and 9b are formed by attaching electrodes and other necessary elements to a substrate material formed of a hard light-transmitting material such as glass or a flexible light-transmitting material such as plastic. It is formed.

【0020】図2において、第1基板9aの基板素材1
2aの液晶側表面、すなわち第2基板9bに対向する面
には、例えばコモン電極として作用する第1電極13a
が所定のパターンに形成され、その上にオーバーコート
層14aが形成され、さらにその上に配向膜16aが形
成される。また、基板素材12aの外側表面には光学素
子としての偏光板17aが貼着される。
In FIG. 2, the substrate material 1 of the first substrate 9a
On the liquid crystal side surface of 2a, that is, on the surface facing the second substrate 9b, for example, a first electrode 13a acting as a common electrode is provided.
Are formed in a predetermined pattern, an overcoat layer 14a is formed thereon, and an alignment film 16a is further formed thereon. Further, a polarizing plate 17a as an optical element is adhered to the outer surface of the substrate material 12a.

【0021】第1基板9aに対向する第2基板9bの基
板素材12bの液晶側表面、すなわち第1基板9aに対
向する面には、例えばセグメント電極として作用する第
2電極13bが所定のパターンに形成され、その上にオ
ーバーコート層14bが形成され、さらにその上には配
向膜16bが形成される。また、基板素材12bの外側
表面には光学素子としての偏光板17bが貼着される。
On the liquid crystal side surface of the substrate material 12b of the second substrate 9b facing the first substrate 9a, that is, on the surface facing the first substrate 9a, for example, a second electrode 13b acting as a segment electrode is formed in a predetermined pattern. The overcoat layer 14b is formed thereon, and the alignment film 16b is further formed thereon. Further, a polarizing plate 17b as an optical element is adhered to the outer surface of the substrate material 12b.

【0022】なお、第1基板9a及び第2基板9bの双
方又は一方に設けられる光学素子としては、必要に応じ
て、偏光板17a,17b以外の他の素子、例えば位相
差板、光拡散板等が設けられることもある。また、液晶
パネル2と導光体3との間には光学素子として半透過反
射板が設けられることもある。また、基板素材12a,
12bには、必要に応じて、その他の光学要素、例えば
カラーフィルタ等を設けることもできる。
The optical element provided on both or one of the first substrate 9a and the second substrate 9b may be, if necessary, an element other than the polarizing plates 17a and 17b, for example, a retardation plate or a light diffusion plate. Etc. may be provided. In addition, a semi-transmissive reflector may be provided between the liquid crystal panel 2 and the light guide 3 as an optical element. Further, the substrate material 12a,
The 12b may be provided with other optical elements, for example, a color filter, if necessary.

【0023】第1電極13a及び第2電極13bは、例
えばITO(Indium Tin Oxide)等といった透明電極に
よって1000オングストローム程度の厚さに形成さ
れ、オーバーコート層14a及び14bは、例えば酸化
珪素、酸化チタン又はそれらの混合物等によって800
オングストローム程度の厚さに形成され、そして配向膜
16a及び16bは、例えばポリイミド系樹脂によって
800オングストローム程度の厚さに形成される。
The first electrode 13a and the second electrode 13b are formed of a transparent electrode such as ITO (Indium Tin Oxide) to a thickness of about 1000 Å, and the overcoat layers 14a and 14b Or a mixture thereof, etc.
The alignment films 16a and 16b are formed to a thickness of about 800 angstroms using, for example, a polyimide resin.

【0024】第1電極13aは、図1に示すように、複
数の直線パターンを互いに平行に配列することによっ
て、いわゆるストライプ状に形成される。一方、第2電
極13bは、上記第1電極13aに交差するように複数
の直線パターンを互いに平行に配列することによって、
やはりストライプ状に形成される。これらの電極13a
と電極13bとがドットマトリクス状に交差する複数の
点が、像を表示するための画素を形成する。そして、そ
れら複数の画素によって区画形成される領域が、文字等
といった像を表示するための表示領域となる。
As shown in FIG. 1, the first electrode 13a is formed in a so-called stripe shape by arranging a plurality of linear patterns in parallel with each other. On the other hand, the second electrode 13b is formed by arranging a plurality of linear patterns parallel to each other so as to intersect with the first electrode 13a.
Again, it is formed in a stripe shape. These electrodes 13a
A plurality of points where the pixel and the electrode 13b intersect in a dot matrix form pixels for displaying an image. An area defined by the plurality of pixels is a display area for displaying an image such as a character.

【0025】以上のようにして形成された第1基板9a
及び第2基板9bのいずれか一方の液晶側表面には、図
2に示すように、複数のスペーサ18が分散され、さら
にいずれか一方の基板の液晶側表面にシール材11が、
例えば印刷等によって図1に示すように枠状に設けら
れ、さらにそのシール材11の一部に液晶注入口11a
が形成される。
The first substrate 9a formed as described above
As shown in FIG. 2, a plurality of spacers 18 are dispersed on one of the liquid crystal side surfaces of the second substrate 9b and the sealing material 11 on the liquid crystal side surface of one of the substrates.
For example, the sealing material 11 is provided in a frame shape by printing or the like as shown in FIG.
Is formed.

【0026】両基板9a及び9bの間には、図2に示す
ように、スペーサ18によって保持される均一な寸法、
例えば5μm程度の間隙、いわゆるセルギャップが形成
され、液晶注入口11a(図1参照)を通してそのセル
ギャップ内に液晶19が注入され、その注入の完了後、
液晶注入口11aが樹脂等によって封止される。
As shown in FIG. 2, between the substrates 9a and 9b, uniform dimensions held by spacers 18,
For example, a gap of about 5 μm, that is, a so-called cell gap is formed, and the liquid crystal 19 is injected into the cell gap through the liquid crystal injection port 11a (see FIG. 1).
The liquid crystal injection port 11a is sealed with a resin or the like.

【0027】図1において、第1基板9aは第2基板9
bの外側へ張り出す基板張出し部9cを有し、第1基板
9a上の第1電極13aはその基板張出し部9cへ直接
に延び出て配線21aとなっている。また、第2基板9
bは第1基板9aの外側へ張り出す基板張出し部9dを
有し、第2基板9b上の第2電極13bはその基板張出
し部9dへ直接に延び出て配線21bとなっている。
In FIG. 1, the first substrate 9a is the second substrate 9
The first electrode 13a on the first substrate 9a extends directly to the substrate overhang 9c to form a wiring 21a. Also, the second substrate 9
b has a substrate overhang 9d that extends outside the first substrate 9a, and the second electrode 13b on the second substrate 9b extends directly to the substrate overhang 9d to form a wiring 21b.

【0028】各電極13a及び13b、それらから延び
る各配線21a及び21bは、実際には極めて狭い間隔
で多数本がそれぞれの基板9a及び9bの表面全域に形
成されるが、図1及びこれから説明する各図では、構造
を分かり易く示すために実際の間隔よりも広い間隔でそ
れらの電極等を模式的に図示し、さらに一部の電極の図
示は省略してある。また、液晶が封入される領域内に形
成される電極13a及び13bは、直線状に形成される
ことに限られず、適宜の文字、図形等といったパターン
として形成されることもある。
In practice, a large number of the electrodes 13a and 13b and the wirings 21a and 21b extending therefrom are formed at very narrow intervals over the entire surface of each of the substrates 9a and 9b. In each of the drawings, the electrodes and the like are schematically illustrated at intervals wider than the actual intervals in order to clearly show the structure, and some of the electrodes are not illustrated. Further, the electrodes 13a and 13b formed in the region where the liquid crystal is sealed are not limited to being formed in a linear shape, but may be formed as a pattern such as an appropriate character or graphic.

【0029】図1において、基板張出し部9c及び9d
には、それぞれ、TCP(Tape Carrier Package)22
a及び22bが異方性導電接着要素、例えばACF(An
isotropic Conductive Film:異方性導電膜)23によ
って接続される。
In FIG. 1, the substrate overhangs 9c and 9d
Has a TCP (Tape Carrier Package) 22
a and 22b are anisotropic conductive adhesive elements such as ACF (An
The connection is made by an isotropic conductive film (23).

【0030】ACF23は、周知の通り、一対の端子間
を異方性を持たせて電気的に一括接続するために用いら
れる導電性のある高分子フィルムであって、例えば図2
に示すように、熱可塑性又は熱硬化性の樹脂フィルム2
4の中には多数の導電粒子26を分散状態で含ませるこ
とによって形成される。
As is well known, the ACF 23 is a conductive polymer film used for electrically connecting the pair of terminals anisotropically and collectively connecting them.
As shown in the figure, a thermoplastic or thermosetting resin film 2
4 is formed by including a large number of conductive particles 26 in a dispersed state.

【0031】図1において、TCP22a及び22b
は、TAB技術を用いて構成されたIC構造体であっ
て、例えば、配線27が形成されたFPC(Flexible P
rinted Circuit)28に液晶駆動用IC29a及び29
bをそれぞれボンディング、例えばギャングボンディン
グして形成される。符号30a及び符号30bは、外部
回路との間で電気的な接続をとるための端子を示してい
る。
In FIG. 1, TCPs 22a and 22b
Is an IC structure formed by using the TAB technology. For example, an FPC (Flexible P
liquid crystal driving ICs 29a and 29
b is formed by bonding, for example, gang bonding. Reference numerals 30a and 30b indicate terminals for making electrical connection with an external circuit.

【0032】ACF23を挟んで基板張出し部9cとT
CP22aとを熱圧着、すなわち加熱下で加圧すること
により、TCP22aを基板張出し部9cに接着すると
共に、TCP22aの配線27と基板張出し部9c上の
配線21aとの間において単一方向の導電性を持つ接続
を実現する。また、基板張出し部9dとTCP22bと
の間に関しても同様の接着及び導電接続を実現する。
The substrate overhang portion 9c and the T
The TCP 22a is bonded to the substrate overhang portion 9c by thermocompression bonding with the CP 22a, that is, pressing under heating, and a unidirectional conductivity is provided between the wiring 27 of the TCP 22a and the wiring 21a on the substrate overhang portion 9c. Realize the connection that has. Further, similar bonding and conductive connection are realized between the substrate overhang portion 9d and the TCP 22b.

【0033】以上のようにして形成された液晶パネル2
に関して、液晶駆動用IC29a及び29bによって第
1電極13a又は第2電極13bのいずれか一方に対し
て直線パターンに走査電圧を順次印加し、さらに同時に
それらの電極の他方に対して表示画像に基づいたデータ
電圧をそれぞれの直線パターンに印加することにより、
両電圧の印加によって選択された各画素部分を通過する
光を変調し、もって、基板9a又は9bの外側に文字、
数字等といった像を表示する。
The liquid crystal panel 2 formed as described above
With respect to, a scanning voltage is sequentially applied to one of the first electrode 13a and the second electrode 13b in a linear pattern by the liquid crystal driving ICs 29a and 29b, and simultaneously, the other of the electrodes is based on a display image. By applying data voltage to each linear pattern,
The light passing through each pixel portion selected by the application of both voltages is modulated, so that a character,
Displays images such as numbers.

【0034】導光体3の非発光面(図1の下側面)側に
設けられるLED基板6は、図3(a)に示すように、
高さの低い両脇の裾部6aと、それらの裾部6a間に掛
け渡された高さの高い梁部6bとによって形成され、発
光素子としての複数のLED31がその梁部6bの長手
方向に亘って適宜の間隔を開けて実装される。梁部6b
の底部には所定間隔をもって切欠き、すなわち凹部37
が設けられ、上記複数のLED31は、それらの凹部3
7を挟むように設けられる。LED基板6の裾部6aに
は端子32が形成され、LED基板6の内部又は表面に
は、それらの端子32、LED31及び必要に応じて設
けられるその他の電子部品(図示せず)をつなげるため
の配線(図示せず)が形成される。
The LED substrate 6 provided on the non-light-emitting surface (lower surface in FIG. 1) of the light guide 3 is, as shown in FIG.
A plurality of LEDs 31 serving as light emitting elements are formed by lower side hem portions 6a on both sides and a higher beam portion 6b bridged between the hem portions 6a, and a plurality of LEDs 31 as light emitting elements are arranged in the longitudinal direction of the beam portion 6b. Are mounted at appropriate intervals over the entire area. Beam 6b
Are notched at predetermined intervals at the bottom of the
Are provided, and the plurality of LEDs 31
7 are provided. A terminal 32 is formed on the foot 6a of the LED substrate 6, and the terminal 32, the LED 31, and other electronic components (not shown) provided as needed are connected to the inside or the surface of the LED substrate 6. Wiring (not shown) is formed.

【0035】LED基板6は、図1に示すように、導光
体3の非発光面側(図1の下面側)からフレーム4又は
導光体3に装着される。この装着は、ネジや接着剤等と
いった特別な固着手段を用いることなく、例えば、導光
体3とフレーム4との間に形成した開口(図示せず)に
LED基板6の裾部6aを挿入することによって達成で
きる。
As shown in FIG. 1, the LED substrate 6 is mounted on the frame 4 or the light guide 3 from the non-light emitting surface side of the light guide 3 (the lower surface side in FIG. 1). For this mounting, for example, the skirt 6a of the LED substrate 6 is inserted into an opening (not shown) formed between the light guide 3 and the frame 4 without using a special fixing means such as a screw or an adhesive. Can be achieved by doing

【0036】LED基板6の裾部6aがフレーム4又は
導光体3に装着された状態で、図4に示すように、LE
D基板6の梁部6bは導光体3の側面、すなわち光取込
み面に対向する位置に配置され、これにより、その梁部
6bに実装されたLED31が導光体3の光取込み面に
対向して配置される。この状態は、図2の断面構造を見
ることによって明らかに理解できる。
With the skirt 6a of the LED substrate 6 mounted on the frame 4 or the light guide 3, as shown in FIG.
The beam portion 6b of the D substrate 6 is disposed at the side surface of the light guide 3, that is, at a position facing the light receiving surface, whereby the LED 31 mounted on the beam portion 6b faces the light receiving surface of the light guide 3. Placed. This state can be clearly understood by looking at the cross-sectional structure of FIG.

【0037】図3(a)において、制御基板7は、例え
ばガラスエポキシ樹脂等といった非可撓性の材料によっ
て形成され、その裏面側(図3(a)の下面側)には、
制御回路33、内部領域端子34a及び34b、そして
辺端部端子36が設けられる。制御回路33は、液晶パ
ネル2(図1参照)の液晶駆動用IC29a,29bの
動作を制御したり、LED31の点灯動作を制御した
り、あるいは、本液晶装置1が用いられる電子機器、例
えば携帯電話機、携帯情報端末機等の動作を制御する。
In FIG. 3A, the control board 7 is formed of a non-flexible material such as a glass epoxy resin, and has a rear surface (a lower surface side in FIG. 3A)
A control circuit 33, internal area terminals 34a and 34b, and edge terminals 36 are provided. The control circuit 33 controls the operation of the liquid crystal driving ICs 29a and 29b of the liquid crystal panel 2 (see FIG. 1), controls the lighting operation of the LED 31, or an electronic device using the liquid crystal device 1, for example, a portable device. It controls the operation of telephones, personal digital assistants, etc.

【0038】また、内部領域端子34aは、図1に示す
ように、液晶パネル2から延びるTCP22aの端子3
0aが接続される端子である。また、内部領域端子34
bは、液晶パネル2から延びるもう1つのTCP22b
の端子30bが接続される端子である。また、制御基板
7のうちLED基板6が接続される辺端部には、複数の
凸部38が形成され、そしてこれらの凸部38の両脇に
必然的に開口39が形成される。
As shown in FIG. 1, the internal area terminal 34a is connected to the terminal 3 of the TCP 22a extending from the liquid crystal panel 2.
0a is a terminal to be connected. Also, the internal area terminal 34
b is another TCP 22b extending from the liquid crystal panel 2.
Are connected to the terminal 30b. In addition, a plurality of protrusions 38 are formed at an edge of the control board 7 to which the LED board 6 is connected, and openings 39 are necessarily formed on both sides of these protrusions 38.

【0039】図1において、制御基板7は、LED基板
6が装着された状態のフレーム4に対して、導光体3の
非発光面側(図1の下面側)から装着される。この装着
も、ネジや接着剤等といった特別の固着手段を用いるこ
となく、例えば、フレーム4の適所に固定用の突起(図
示せず)を設けておき、その突起を用いて制御基板7を
止めることによって達成できる。また、必ずしもそのよ
うな固着手段を使用することなく、単に制御基板7をフ
レーム4でガイドしながら導光体3の上に装着するだけ
でも良い。
In FIG. 1, the control board 7 is mounted on the frame 4 on which the LED board 6 is mounted, from the non-light emitting surface side of the light guide 3 (the lower surface side in FIG. 1). In this mounting, for example, a fixing projection (not shown) is provided at an appropriate position of the frame 4 without using a special fixing means such as a screw or an adhesive, and the control board 7 is stopped using the projection. Can be achieved by: Further, the control board 7 may be simply mounted on the light guide 3 while guiding the control board 7 with the frame 4 without necessarily using such fixing means.

【0040】このように制御基板7がフレーム4に装着
されると、図3(b)に示すように、制御基板7の凸部
38がLED基板6の凹部37に嵌合した状態で、LE
D基板6が制御基板7の厚さ方向Z−Zへ張り出すよう
に、図示の実施形態では両者が互いにほぼ直角方向へ延
びるように、LED基板6と制御基板7とが互いに組み
付けられる。このとき、各LED31は制御基板7の凸
部38の両脇に必然的に形成される開口39の中に収容
される。
When the control board 7 is mounted on the frame 4 in this manner, as shown in FIG. 3 (b), the LE 38 is engaged with the projection 38 of the control board 7 in the recess 37 of the LED board 6.
The LED board 6 and the control board 7 are assembled together so that the D board 6 extends in the thickness direction ZZ of the control board 7 and in the illustrated embodiment, both extend in a direction substantially perpendicular to each other. At this time, each LED 31 is accommodated in an opening 39 which is necessarily formed on both sides of the convex portion 38 of the control board 7.

【0041】LED基板6と制御基板7とが互いに組み
付けられたとき、LED基板6の端子32と制御基板7
の辺端部端子36は互いに位置的に一致する位置関係と
なって互いに接触する。そして、端子32と端子36と
の当該接触部分を導電接続処理、例えば半田付け等する
ことにより、LED基板6が電気的且つ機械的に制御基
板7に接続されて照明用光源基板41が形成される。
When the LED board 6 and the control board 7 are assembled together, the terminal 32 of the LED board 6 and the control board 7
Are in contact with each other in a positional relationship that is mutually coincident with each other. The contact portion between the terminal 32 and the terminal 36 is conductively connected, for example, by soldering, so that the LED board 6 is electrically and mechanically connected to the control board 7 to form the light source board 41 for illumination. You.

【0042】こうして形成された照明用光源基板41に
関しては、LED基板6と制御基板7とが、それぞれに
設けた凹部37と凸部38との嵌合によって組み付けら
れるので、厚さ方向Z−Zの寸法Hを従来の構造(図5
参照)の場合に比べて非常に小さく、すなわち全体形状
を非常に薄くすることができる。このため、この照明用
光源41を用いて構成される液晶装置1の厚さ方向(図
1のZ−Z方向)の寸法を薄くできる。
In the illumination light source substrate 41 thus formed, the LED substrate 6 and the control substrate 7 are assembled by fitting the concave portions 37 and the convex portions 38 provided respectively, so that the thickness direction ZZ Of the conventional structure (FIG. 5)
), That is, the overall shape can be made very thin. For this reason, the dimension of the liquid crystal device 1 configured using the illumination light source 41 in the thickness direction (ZZ direction in FIG. 1) can be reduced.

【0043】また、制御基板7の凸部38によってLE
D基板6を図1で制御基板7から導光体3の方向へ押さ
え付けることができるので、LED31に位置ズレが生
じることを長期間にわたって防止できる。さらに、LE
D基板6の凹部37と制御基板7の凸部38との嵌合に
より、両基板を互いに直接的に位置決めできるので、両
基板を接続するための半田付け処理等を正確且つ迅速に
行うことができる。
The LE 38 is formed by the projection 38 of the control board 7.
Since the D board 6 can be pressed in the direction from the control board 7 to the light guide 3 in FIG. 1, it is possible to prevent the LED 31 from being displaced for a long time. In addition, LE
By fitting the concave portion 37 of the D substrate 6 and the convex portion 38 of the control substrate 7, the two substrates can be directly positioned with respect to each other, so that the soldering process for connecting the two substrates can be performed accurately and quickly. it can.

【0044】その後、図1において、LED基板6と制
御基板7がフレーム4に装着された状態で、制御基板7
の開口39をふさぐように、 LED基板6と制御基板
7との接続部分の表面で導光体が配設された側とは反対
側に遮蔽テープ8を貼着する。この遮蔽テープ8の作用
効果については、後述する。
Thereafter, in FIG. 1, the control board 7 is mounted on the frame 4 with the LED board 6 and the control board 7 mounted.
A shielding tape 8 is attached to the surface of the connection portion between the LED substrate 6 and the control substrate 7 on the side opposite to the side on which the light guide is provided so as to cover the opening 39 of the LED substrate 6. The function and effect of the shielding tape 8 will be described later.

【0045】図1において、液晶パネル2は、その像表
示面側が外側に来るような状態でフレーム4に装着され
る。このとき、一方のTCP22bは、その先端がフレ
ーム4と導光体3との間に形成される空間Kを図の上下
方向へ通るように折り曲げられる。こうして液晶パネル
2が導光体3の発光面上にフレーム4に支持されて配置
された後、一方のTCP22aはフレーム4に設けた切
欠き部42を通して制御基板7の裏側へ折り曲げられ、
そして図2に示すように、その先端端子30aが制御基
板7の裏面に形成された内部領域端子34aに、例えば
半田付け等によって接続される。
In FIG. 1, the liquid crystal panel 2 is mounted on the frame 4 such that the image display surface side is on the outside. At this time, one of the TCPs 22b is bent so that the tip thereof passes through a space K formed between the frame 4 and the light guide 3 in the vertical direction in the drawing. After the liquid crystal panel 2 is thus supported and arranged on the light emitting surface of the light guide 3 by the frame 4, one TCP 22 a is bent to the back side of the control board 7 through the cutout 42 provided in the frame 4,
Then, as shown in FIG. 2, the tip terminal 30a is connected to the internal area terminal 34a formed on the back surface of the control board 7 by, for example, soldering.

【0046】他方、図1において、もう一方のTCP2
2bは、同様にして、導光体3及びフレーム4を通って
制御基板7の裏側へ折り曲げられ、その先端端子30b
が制御基板7の裏面に形成された内部領域端子34b
に、例えば半田付け等によって接続される。
On the other hand, in FIG.
2b is similarly bent to the back side of the control board 7 through the light guide 3 and the frame 4, and its tip terminal 30b
Are the internal area terminals 34b formed on the back surface of the control board 7.
Are connected by, for example, soldering.

【0047】以上により、図1に分解して示した液晶装
置1が作製されるわけであるが、図3(a)及び図3
(b)に示すように、厚さ寸法を小さくするために制御
基板7に形成される開口39によってLED31を収容
する構造を採用する場合には、この開口39を通して、
フラックス、ゴミ等が液晶パネル2の側へ侵入するおそ
れがある。TCP22a及び22bを制御基板7の内部
領域端子34a及び34bに接続する前に、当該開口3
9をふさぐようにLED基板6と制御基板7との接続部
に遮蔽テープ8を貼着すれば、そのような液晶パネル2
へのフラックス等及びゴミ等の侵入を防止できる。
As described above, the liquid crystal device 1 disassembled and shown in FIG. 1 is manufactured.
As shown in (b), when adopting a structure for accommodating the LED 31 by the opening 39 formed in the control board 7 in order to reduce the thickness dimension, through this opening 39,
There is a possibility that flux, dust and the like may enter the liquid crystal panel 2 side. Before connecting the TCPs 22a and 22b to the internal area terminals 34a and 34b of the control board 7,
If the shielding tape 8 is attached to the connection portion between the LED board 6 and the control board 7 so as to cover the
It is possible to prevent the flux and the like and the dust from entering the space.

【0048】(その他の実施形態)以上、好ましい実施
形態を挙げて本発明を説明したが、本発明はその実施形
態に限定されるものでなく、請求の範囲に記載した発明
の範囲内で種々に改変できる。
(Other Embodiments) The present invention has been described with reference to the preferred embodiments. However, the present invention is not limited to the embodiments, and various modifications may be made within the scope of the invention described in the claims. Can be modified.

【0049】例えば、図1の実施形態では本発明に係る
照明用光源基板を液晶装置に適用したが、その照明用光
源基板はその他の電気光学装置、例えばEL装置、プラ
ズマディスプレイ等にも適用できる。
For example, in the embodiment shown in FIG. 1, the illumination light source substrate according to the present invention is applied to a liquid crystal device. However, the illumination light source substrate can be applied to other electro-optical devices, for example, EL devices, plasma displays, and the like. .

【0050】また、発光素子としてのLEDの個数は特
定の数に限定されず、また、その発光素子としてはLE
D以外の任意の発光要素を適用できる。
Further, the number of LEDs as light emitting elements is not limited to a specific number.
Any light emitting element other than D can be applied.

【0051】[0051]

【発明の効果】本発明に係る照明用光源基板及び液晶装
置によれば、発光素子基板と支持基板とを単に重ね合わ
せて接続するというのではなく、発光素子基板に設けた
凹部と支持基板に設けた凸部とを嵌合させた状態で両者
を接続するようにしたので、厚さ方向の寸法を小さく、
すなわち全体形状を薄くすることができる。
According to the illumination light source substrate and the liquid crystal device of the present invention, the light emitting element substrate and the support substrate are not simply connected to each other by overlapping, but the recess provided in the light emitting element substrate and the support substrate are connected to each other. Since the two are connected in a state where the provided protrusions are fitted, the dimension in the thickness direction is small,
That is, the overall shape can be reduced.

【0052】また、支持基板の凸部によって発光素子基
板を押さえ付けることができるので、発光素子に位置ズ
レが生じることを長期間にわたって防止できる。さら
に、発光素子基板の凹部と支持基板の凸部との嵌合によ
り、両基板を互いに直接的に位置決めできるので、両基
板を接続するための半田付け処理等を正確且つ迅速に行
うことができる。
Further, since the light emitting element substrate can be pressed by the convex portion of the support substrate, it is possible to prevent the light emitting element from being displaced for a long time. Furthermore, since the two substrates can be directly positioned with respect to each other by fitting the concave portion of the light emitting element substrate and the convex portion of the support substrate, soldering processing for connecting the two substrates can be performed accurately and quickly. .

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明に係る照明用光源基板の一実施形態及び
本発明に係る液晶装置の一実施形態を分解状態で示す斜
視図である。
FIG. 1 is a perspective view showing an embodiment of an illumination light source substrate according to the present invention and an embodiment of a liquid crystal device according to the present invention in an exploded state.

【図2】図1のII−II線に従って液晶装置の断面構
造を示す断面図である。
FIG. 2 is a cross-sectional view illustrating a cross-sectional structure of the liquid crystal device taken along line II-II of FIG.

【図3】図1で用いる照明用光源基板を詳しく示す図で
あって、(a)はLED基板と制御基板とを接続する前
の状態を示し、(b)はLED基板と制御基板とを接続
した後の状態を示している。
FIGS. 3A and 3B are diagrams showing in detail an illumination light source substrate used in FIG. 1, wherein FIG. 3A shows a state before an LED substrate and a control substrate are connected, and FIG. This shows the state after connection.

【図4】図1に示す構造の主要部を示す図であって、L
ED基板を導光体に装着した状態を示す図である。
FIG. 4 is a diagram showing a main part of the structure shown in FIG. 1;
It is a figure showing the state where an ED board was attached to a light guide.

【図5】従来の照明用光源基板の一例を示す図である。FIG. 5 is a diagram showing an example of a conventional illumination light source substrate.

【符号の説明】[Explanation of symbols]

1 液晶装置 2 液晶パネル 3 導光体 4 フレーム 6 LED基板(発光素子基板) 6a 裾部 6b 梁部 7 制御基板(支持基板) 8 遮蔽テープ 9a,9b 基板 9c,9d 基板張出し部 13a,13b 電極 19 液晶 22a,22b TCP(接続用基板) 31 LED(発光素子) 37 凹部 38 凸部 39 開口 41 照明用光源基板 Z 厚さ方向 REFERENCE SIGNS LIST 1 liquid crystal device 2 liquid crystal panel 3 light guide 4 frame 6 LED substrate (light emitting element substrate) 6 a foot 6 b beam 7 control substrate (support substrate) 8 shielding tape 9 a, 9 b substrate 9 c, 9 d substrate overhang 13 a, 13 b electrode Reference Signs List 19 liquid crystal 22a, 22b TCP (connection substrate) 31 LED (light emitting element) 37 concave portion 38 convex portion 39 opening 41 illumination light source substrate Z thickness direction

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 FI テーマコート゛(参考) G09F 9/00 336 F21Y 101:02 // F21Y 101:02 G02F 1/1335 530 ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) G09F 9/00 336 F21Y 101: 02 // F21Y 101: 02 G02F 1/1335 530

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 発光素子が実装された発光素子基板と、
該発光素子基板が接続される支持基板とを有し、前記発
光素子基板は前記支持基板の厚さ方向へ張り出す照明用
光源基板において、 前記発光素子基板に凹部を設け、前記支持基板に凸部を
設け、前記発光素子基板の凹部に前記支持基板の凸部を
嵌合させた状態で該発光素子基板と該支持基板とを互い
に接続することを特徴とする照明用光源基板。
A light emitting element substrate on which the light emitting element is mounted;
A support substrate to which the light-emitting element substrate is connected, wherein the light-emitting element substrate is a lighting light source substrate that projects in the thickness direction of the support substrate; A light source substrate for lighting, wherein the light emitting device substrate and the support substrate are connected to each other in a state where a portion is provided and a convex portion of the support substrate is fitted into a concave portion of the light emitting device substrate.
【請求項2】 前記発光素子は前記発光素子基板上に複
数個設けられ、前記凹部は隣り合う発光素子の間に形成
されることを特徴とする請求項1に記載の照明用光源基
板。
2. The light source substrate for illumination according to claim 1, wherein a plurality of the light emitting elements are provided on the light emitting element substrate, and the recess is formed between adjacent light emitting elements.
【請求項3】 前記発光素子は前記支持基板の凸部の横
に形成される開口に収容されることを特徴とする請求項
1又は請求項2に記載の照明用光源基板。
3. The light source substrate for illumination according to claim 1, wherein the light emitting element is accommodated in an opening formed beside a convex portion of the support substrate.
【請求項4】 一対の基板間に液晶を封入して成る液晶
パネルと、発光素子が実装された発光素子基板と、該発
光素子基板が接続される支持基板と、前記発光素子から
の光を前記液晶パネルへ導く導光体とを有する液晶装置
において、 前記発光素子基板に凹部を設け、前記支持基板に凸部を
設け、前記発光素子基板の凹部に前記支持基板の凸部を
嵌合させた状態で該発光素子基板と該支持基板とを互い
に接続することを特徴とする液晶装置。
4. A liquid crystal panel in which liquid crystal is sealed between a pair of substrates, a light emitting element substrate on which a light emitting element is mounted, a support substrate to which the light emitting element substrate is connected, and light from the light emitting element. In a liquid crystal device having a light guide for guiding to the liquid crystal panel, a concave portion is provided in the light emitting element substrate, a convex portion is provided in the support substrate, and a convex portion of the support substrate is fitted in the concave portion of the light emitting element substrate. A liquid crystal device, wherein the light emitting element substrate and the support substrate are connected to each other in a state in which the light emitting element substrate is in an inclined state.
【請求項5】 前記支持基板の凸部の両脇に形成される
開口をふさぐように、前記発光素子基板と前記支持基板
との間の接続部分の前記導光体が配設された側とは反対
側に遮蔽部材を設けたことを特徴とする請求項4に記載
の液晶装置。
5. A connection portion between the light emitting element substrate and the support substrate, on a side where the light guide is provided, so as to cover openings formed on both sides of the convex portion of the support substrate. The liquid crystal device according to claim 4, wherein a shielding member is provided on the opposite side.
JP30573999A 1999-10-27 1999-10-27 Light source substrate for illumination and liquid crystal device Expired - Fee Related JP3994600B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP30573999A JP3994600B2 (en) 1999-10-27 1999-10-27 Light source substrate for illumination and liquid crystal device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30573999A JP3994600B2 (en) 1999-10-27 1999-10-27 Light source substrate for illumination and liquid crystal device

Publications (2)

Publication Number Publication Date
JP2001126520A true JP2001126520A (en) 2001-05-11
JP3994600B2 JP3994600B2 (en) 2007-10-24

Family

ID=17948768

Family Applications (1)

Application Number Title Priority Date Filing Date
JP30573999A Expired - Fee Related JP3994600B2 (en) 1999-10-27 1999-10-27 Light source substrate for illumination and liquid crystal device

Country Status (1)

Country Link
JP (1) JP3994600B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008084713A (en) * 2006-09-28 2008-04-10 Kyocera Corp Light source component, and display device equipped with it
JP2009238397A (en) * 2008-03-26 2009-10-15 Epson Imaging Devices Corp Illuminating device, liquid crystal device, and electronic equipment
JP2020022872A (en) * 2018-08-03 2020-02-13 株式会社バンダイ Liquid crystal display device and toy using the same

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008084713A (en) * 2006-09-28 2008-04-10 Kyocera Corp Light source component, and display device equipped with it
JP4624328B2 (en) * 2006-09-28 2011-02-02 京セラ株式会社 Light source component and display device including the same
JP2009238397A (en) * 2008-03-26 2009-10-15 Epson Imaging Devices Corp Illuminating device, liquid crystal device, and electronic equipment
JP2020022872A (en) * 2018-08-03 2020-02-13 株式会社バンダイ Liquid crystal display device and toy using the same
JP7469027B2 (en) 2018-08-03 2024-04-16 株式会社バンダイ Liquid crystal display device and toy using the same

Also Published As

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