CN113823185B

CN113823185B - electronic device

Info

Publication number: CN113823185B
Application number: CN202010565270.2A
Authority: CN
Inventors: 洪文彬
Original assignee: Innolux Display Corp
Current assignee: Innolux Corp
Priority date: 2020-06-19
Filing date: 2020-06-19
Publication date: 2023-09-12
Anticipated expiration: 2040-06-19
Also published as: CN113823185A; CN117055256A

Abstract

The invention discloses an electronic device, which comprises a panel, a circuit board and a light shielding element. The panel comprises a side surface, and the side surface is provided with a first area and a second area. The circuit board is fixed to the first area of the side surface, and the circuit board comprises an upper surface. The light shielding member is fixed to the second region of the side surface and the upper surface of the circuit board.

Description

Electronic device

Technical Field

The present invention relates to an electronic device. More particularly, the present invention relates to an electronic device having a panel.

Background

Electronic devices (such as display screens of televisions, notebook computers or smart phones) with display panels are mostly developed towards large screens and narrow frames. However, due to the narrowing frame of the electronic device, light leakage may occur at the edge of the electronic device. Therefore, how to solve the above problems has become an important issue.

Disclosure of Invention

In order to solve the above-mentioned problems, the present invention provides an electronic device, which includes a panel, a circuit board, and a light shielding element. The panel comprises a side surface, and the side surface is provided with a first area and a second area. The circuit board is fixed to the first area of the side surface, and the circuit board comprises an upper surface. The light shielding member is fixed to the second region of the side surface and the upper surface of the circuit board.

Drawings

FIG. 1 is a schematic diagram of an electronic device according to an embodiment of the invention;

FIG. 2 is a schematic diagram of an electronic device according to another embodiment of the invention;

FIG. 3 is a schematic illustration of a panel connected to a circuit board in some embodiments;

fig. 4 is a schematic view of a light shielding layer according to some embodiments of the invention.

Symbol description

100 backlight module

110 frame body

111 floor board

112 side wall

120 luminous element

130 optical film

200 lower polarizer

300 panel

301 upper surface of panel

302 side surfaces of the panel

310 line assembly

311 substrate

312 line layer

312A conductive layer

312B conductive layer

320 optical filter assembly

321 glass substrate

322 color filter layer

323 light shielding layer

340 PI layer

350 planarization layer

400 engagement element

500 top polarizer

501 side of upper polarizer

600 circuit board

601 upper surface of circuit board

602 outer surface of circuit board

610 body

620 Pin

700 light shielding element

800 shielding element

900 conductive element

910 conductive adhesive

920 Anisotropic conductive film

A1 first region

A2 second region

B blocking element

E electronic device

F1 first filter layer

F2 a second filter layer

G: groove

Detailed Description

The following describes an electronic device according to an embodiment of the present invention. However, it should be readily appreciated that the embodiments of the present invention provide many suitable disclosed concepts that can be embodied in a wide variety of specific contexts. The specific embodiments disclosed are illustrative only, and are not intended to limit the scope of the invention in any way.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It is noted that terms such as those defined in commonly used dictionaries should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and the present invention and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

Referring to fig. 1, an electronic device E according to an embodiment of the invention mainly includes a backlight module 100, a lower polarizer 200, a panel 300, a bonding element 400, an upper polarizer 500, a circuit board 600, a light shielding element 700, and a shielding element 800. The backlight module 100 can provide light into the panel 300, and the panel 300 can control the light output amount of the light so that the electronic device E displays different images. The electronic device E may include a thin film transistor liquid crystal display (Thin film transistor liquid crystal display, TFT-LCD), for example, and may be applied to a public information display (public information display, PID), a television (television), a display screen (monitor), a notebook PC (notebook PC), a smart phone (smart phone), or a smart watch (smart watch), but is not limited thereto.

As shown in fig. 1, the backlight module 100 is a direct-type backlight (direct-type backlight), and may include, but is not limited to, a frame 110, at least one light emitting device 120, and an optical film 130. Wherein the frame 110 includes a bottom plate 111 and a sidewall 112 connected to each other. The light emitting element 120 is disposed on the bottom plate 111, and the sidewall 112 surrounds the light emitting element 120. The optical film 130 is disposed on the sidewall 112 and is spaced apart from the light emitting element 120 by a distance. The optical film 130 may include one or more optical films, such as, but not limited to, a brightness enhancing film (brightness enhancement film), a prism film (prism film), a diffusion film (diffusion film), or a diffusion plate (diffusion plate). The light emitting element 120 may include, for example, a Light Emitting Diode (LED), a lamp such as a cold cathode tube (cold cathode fluorescent lamp, CCFL), or other suitable type of light source, the light emitting element 120 may emit light toward the optical film 130, and the light may penetrate the optical film 130 and enter the panel 300. The Light Emitting Diode may include, for example, an Organic Light-Emitting Diode (OLED), a sub-millimeter Light Emitting Diode (mini LED), a micro LED, or a quantum dot Light Emitting Diode (Quantum Dots Light-Emitting Diode, QLED or QD-LED), but is not limited thereto. It should be noted that the backlight module in the present invention may be a side-light type backlight module (side-light type backlight). One of the differences between the edge-lit backlight module and the direct-lit backlight module is that the edge-lit backlight module has a light guide plate (light guide plate), and the light emitting element 120 is disposed in the vicinity of at least one side of the light guide plate.

As shown in fig. 1, the panel 300 may be fixed to the backlight module 100 by the coupling member 400, and the lower polarizer 200 may be disposed between the panel 300 and the backlight module 100. The bonding element 400 may be, for example, a viscous gel, but is not limited thereto. The light provided by the light emitting device 120 may enter the panel 300 after passing through the light film 130 and/or the lower polarizer 200.

The panel 300 includes a circuit assembly 310 and a filter assembly 320. The circuit assembly 310 is disposed between the filter assembly 320 and the backlight module 100, and includes a substrate 311 and a circuit layer 312, wherein the substrate 311 may be a glass substrate, a sapphire substrate or a substrate made of other suitable materials, the circuit layer 312 is disposed on a surface of the glass substrate 311 facing the filter assembly 320, and the circuit layer 312 may include wires made of a metal material (such as aluminum, copper or alloys thereof) and/or a transparent conductive material (such as indium tin oxide). The filter assembly 320 includes a glass substrate 321, a color filter layer 322, and a light shielding layer 323, wherein the color filter layer 322 and the light shielding layer 323 are disposed on a surface of the glass substrate 321 facing the circuit assembly 310. In the present embodiment, the light shielding layer 323 is a black matrix layer (black matrix) having a grid structure, and the color filter layer 322 is surrounded by the light shielding layer 323. More specifically, the color filter layer 322 may include a plurality of small filter layers (not shown) corresponding to a plurality of colors, respectively, and the positions of the different small filter layers correspond to different grids in the black matrix layer, respectively.

The upper polarizer 500 is also disposed on the glass substrate 321 of the filter assembly 320, except that the upper polarizer 500 is disposed on a surface opposite to the surface on which the color filter layer 322 and the light shielding layer 323 are disposed. In other words, as shown in fig. 1, the upper polarizer 500 is disposed on the upper surface 301 of the panel 300.

The circuit board 600 is fixed to the side surface 302 of the panel 300 and is electrically connected to the wiring layer 312 of the panel 300. The side surface 302 is connected to the upper surface 301 and may be divided into a first area A1 and a second area A2, in detail, a portion of the side surface 302 of the panel 300 overlapping the circuit board 600 in a normal direction (for example, in an X direction of fig. 1) of the side surface 302 is divided into the first area A1, and a portion not overlapping the circuit board 600 in the normal direction is divided into the second area A2. Since the second area A2 is not shielded by the circuit board 600 and a gap is formed between the upper polarizer 500 and the junction between the upper surface 301 and the side surface 302, part of the light entering the panel 300 leaves the electronic device E through the second area A2 or the gap after multiple reflections, which causes light leakage at the edge of the electronic device E.

In order to improve the foregoing, the light shielding member 700 may be fixed to the upper surface 601 of the circuit board 600 and the second region A2 of the side surface 302 of the panel 300, and extend to be fixed to the upper polarizer 500 (more specifically, to the side surface 501 of the upper polarizer 500) to shield the second region A2 and the gap between the upper polarizer 500 and the edge of the panel 300. In this way, the light beam can be reduced from leaving the electronic device E from the above position.

In the present embodiment, the circuit board 600 is not completely opaque, and thus the light shielding member 700 may be extendedly fixed to the outer surface 602 of the circuit board 600, so the outer surface 602 refers to the surface of the circuit board 600 in a direction away from the panel 300. It should be noted that, by extending and fixing the light shielding member 700 to the outer surface 602 of the circuit board 600, the contact area between the light shielding member 700 and the circuit board 600 can be increased, and the light shielding member 700 can be more firmly fixed. It should be noted that, in some embodiments of the present invention, the circuit board 600 may be a flexible circuit board (flexible printed circuit, FPC) used in a Chip On Film (COF) structure, but is not limited thereto. In some embodiments, the circuit board 600 may be a higher durometer printed circuit board (printed circuit board, PCB) that typically includes epoxy, or a combination of a flexible circuit board and a printed circuit board.

In the present embodiment, the light shielding element 700 may include a photo-curing gel or a thermosetting gel, such as a ultraviolet curing gel (UV gel) of a press system, but is not limited thereto.

With continued reference to fig. 1, the shielding element 800 may be connected to the frame 110 of the backlight module 100 and surrounds the panel 300 and the backlight module 100. Since the light transmittance of the shielding element 800 is low, the light leakage from the area of the circuit board 600 adjacent to the backlight module 100 is reduced, and thus the light shielding element 700 does not necessarily need to extend to the area of the circuit board 600 adjacent to the backlight module 100. That is, in the present embodiment, a part of the outer surface of the circuit board 600 is exposed from the light shielding member 700.

In addition, it should be noted that, in order to reduce the invisible area of the edge of the electronic device E to achieve the narrow frame, the shielding element 800 may not extend above the upper polarizer 500. In other words, the upper polarizer 500 and the shielding member 800 are separated from each other without overlapping when viewed from the normal direction (Z-axis direction) of the upper polarizer 500.

In the present embodiment, the shielding element 800 includes a flexible soft material, such as polyester resin (mylar), a light shielding tape (light shielding tape), or a metal or plastic material with high hardness, but is not limited thereto.

Referring to fig. 2, in another embodiment of the present invention, the upper polarizer 500 has a larger size, and the side 501 thereof is substantially aligned with the side surface 302 of the panel 300. In this embodiment, the light shielding member 700 will not extend to the upper surface 301 of the panel 300, but is directly fixed to the side 501 of the upper polarizer 500, the second area A2 of the side surface 302 of the panel 300, and the upper surface 601 and the outer surface 602 of the circuit board 600.

It should be noted that in the Z-axis direction, the light shielding element 700 will be more convex than the upper surface 301 of the panel 300 to reduce light leakage from the corners of the panel 300.

Referring to fig. 3 and 4, fig. 3 is a detailed schematic diagram illustrating the connection of the panel 300 and the circuit board 600 according to some embodiments. Fig. 4 is a schematic view of a light shielding layer according to some embodiments of the invention. As shown in fig. 3, the circuit board 600 has a body 610 and pins 620, and the conductive elements 900 may connect the pins 620 to the wiring layer 312 of the panel 300 so that the circuit board 600 is electrically connected to the panel 300. The conductive element 900 may include, for example, a conductive paste 910, an anisotropic conductive film (anisotropic conductive film, ACF) 920, other suitable conductive materials, or a combination thereof.

The wiring layer 312 may include a conductive layer or a stack of conductive layers (e.g., conductive layers 312A and 312B in fig. 3) near the connection with the conductive element 900, both of which may be connected with the conductive element 900. In addition, the panel 300 may further include, but is not limited to, an insulating layer 330, a PI layer (polyimide layer) 340, and a planarization layer 350. Wherein the insulating layer 330 may be disposed between the PI layer 340 and the conductive layer 312B, but is not limited thereto.

The filter assembly 320 of the panel 300 is fixed to the circuit assembly 310 by an adhesive element H, wherein the adhesive element H may include, but is not limited to, a sealing compound (Sealant) of the panel 300. Between the adhesive element H and the circuit board 600, a blocking element B may be included to reduce the outflow of the adhesive element H from the side surface 302 of the panel 300. The barrier element B may be, for example, a photo spacer (photo spacer), but is not limited thereto. In some embodiments, blocking element B may not be present.

As shown in fig. 4, the light shielding layer 323 in the panel 300 is spaced apart from the side surface 302 of the panel 300 or is formed with grooves G extending in the Y-axis direction to reduce the introduction of moisture into the electronic device E by the light shielding layer 323. Since light may pass through a gap or groove G between the light shielding layer 323 and the side surface 302. Thus, to further reduce edge leakage of the electronic device E, in some embodiments, one or more filter layers may be disposed between the light shielding layer 323 and the circuit board 600, as shown in FIG. 3.

For example, as shown in fig. 3, a first filter layer F1 and a second filter layer F2 may be disposed between the light shielding layer 323 and the circuit board 600, and the two layers are arranged along the Z-axis direction, so that the first filter layer F1 is located between the second filter layer F2 and the circuit assembly 310. By disposing the first filter layer F1 on the second filter layer F2, most of the light is filtered while passing through the space between the light shielding layer 323 and the circuit board 600, so that the light leakage at the edge of the electronic device E is reduced. In some embodiments, the first filter layer F1 includes a blue filter, and the second filter layer F2 includes a red filter. However, the combination of the above-mentioned filter layers is only an example, and the number and color sequence of the filter layers are not limited thereto in the present invention.

The number of the circuit boards 300 disposed on the side surface 302 of the panel 300 may be one or more, when the electronic device E includes a plurality of circuit boards 600, the circuit boards 600 may be disposed at intervals, and one or more sheet-like elements may be disposed between the circuit boards 600, so that the electronic device E may be kept as flat as possible on the side where the circuit boards 600 are disposed.

The features of the foregoing embodiments may be mixed and matched at will without departing from the spirit or conflict of the invention.

In summary, the present invention provides an electronic device including a panel, a circuit board, and a light shielding element. The panel comprises a side surface, and the side surface is provided with a first area and a second area. The circuit board is fixed to the first area of the side surface, and the circuit board comprises an upper surface. The light shielding member is fixed to the second region of the side surface and the upper surface of the circuit board.

Although the present invention has been described with reference to the above embodiments and their advantages, it should be understood that the invention can be modified, substituted and practiced by those of ordinary skill in the art without departing from the spirit and scope of the present invention. Furthermore, the scope of the present application is not intended to be limited to the particular embodiments of the process, machine, manufacture, composition of matter, means, methods and steps described in the specification, unless a person of ordinary skill in the art would understand from the present disclosure that the process, machine, manufacture, composition of matter, means, methods and steps are currently or later developed in the art that perform substantially the same function or achieve substantially the same result as the described embodiments herein. Accordingly, the present invention is intended to cover such processes, machines, manufacture, compositions of matter, means, methods, or steps. In addition, each claim constitutes a separate embodiment, and the scope of the invention also includes combinations of the individual claims and embodiments.

While the invention has been disclosed in connection with the preferred embodiments described above, it is not intended to be limiting. Those skilled in the art will appreciate that many modifications and variations may be made without departing from the spirit and scope of the invention. The scope of the invention should therefore be determined only by the following claims. Furthermore, each claim is to be construed as a separate embodiment, and various claims and combinations of embodiments are intended to be within the scope of the invention.

Claims

1. An electronic device, comprising:

a panel including a side surface, the side surface having a first region and a second region;

a circuit board fixed to the first region of the side surface, the circuit board including an upper surface; and

a light shielding element secured to the second region of the side surface and the upper surface of the circuit board, wherein the circuit board includes an outer surface, and the light shielding element is secured to the outer surface of the circuit board, and a portion of the outer surface of the circuit board is exposed from the light shielding element.

2. The electronic device of claim 1, wherein the panel comprises an upper surface, and the light shielding element is affixed to the upper surface of the panel.

3. The electronic device of claim 1, further comprising an upper polarizer disposed on the panel, wherein the light shielding element is secured to the upper polarizer.

4. The electronic device of claim 1, wherein the panel comprises an upper surface and the first region is connected to the upper surface of the panel.

5. The electronic device of claim 1, further comprising an upper polarizer disposed on the panel, wherein the upper polarizer has a side surface aligned with the side surface of the panel.

6. The electronic device of claim 5, wherein the panel comprises an upper surface, the upper polarizer is disposed on the upper surface of the panel, and the light shielding element is more convex than the upper surface of the panel.

7. The electronic device of claim 1, further comprising a shielding element surrounding the panel, and the light shielding element is disposed between the panel and the shielding element.

8. The electronic device of claim 7, further comprising an upper polarizer disposed on the panel, wherein the upper polarizer and the shielding element are separated from each other when viewed along a normal direction of the upper polarizer.

9. The electronic device of claim 1, further comprising a conductive element, wherein the panel comprises a wiring layer, and the circuit board is electrically connected to the wiring layer through the conductive element.

10. The electronic device of claim 9, wherein the wiring layer comprises a plurality of conductive layers.

11. The electronic device of claim 9, wherein the conductive element comprises a conductive paste and an anisotropic conductive film.

12. The electronic device of claim 1, wherein the panel comprises:

a line assembly;

a light filtering component;

the pasting element is arranged between the circuit component and the optical filtering component and is fixedly connected to the circuit component and the optical filtering component; and

the blocking element is arranged between the circuit component and the light filtering component and between the pasting element and the circuit board.

13. The electronic device of claim 1, wherein the panel comprises a light shielding layer and a first filter layer, and the first filter layer is disposed between the light shielding layer and the circuit board.

14. The electronic device of claim 13, wherein the panel further comprises a circuit assembly and a second filter layer disposed between the light shielding layer and the circuit board, and the first filter layer is disposed between the second filter layer and the circuit assembly.

15. The electronic device of claim 1, further comprising a plurality of circuit boards and at least one sheet element disposed between the circuit boards.

16. The electronic device of claim 1, comprising a backlight module and a bonding element, wherein the bonding element is disposed between the backlight module and the panel, and the panel is fixed to the backlight module by the bonding element.

17. The electronic device of claim 16, comprising a lower polarizer disposed between the backlight module and the panel.

18. The electronic device of claim 1, wherein the light shielding element comprises a light-curable gel or a heat-curable gel.