JP3988611B2 - 半導体ウエハ用研磨パッド及びこれを備える半導体ウエハ用研磨複層体並びに半導体ウエハの研磨方法 - Google Patents

半導体ウエハ用研磨パッド及びこれを備える半導体ウエハ用研磨複層体並びに半導体ウエハの研磨方法 Download PDF

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JP3988611B2
JP3988611B2 JP2002296798A JP2002296798A JP3988611B2 JP 3988611 B2 JP3988611 B2 JP 3988611B2 JP 2002296798 A JP2002296798 A JP 2002296798A JP 2002296798 A JP2002296798 A JP 2002296798A JP 3988611 B2 JP3988611 B2 JP 3988611B2
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Prior art keywords
polishing
polishing pad
semiconductor wafer
water
translucent member
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Expired - Fee Related
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JP2002296798A
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Japanese (ja)
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JP2004134539A (ja
JP2004134539A5 (OSRAM
Inventor
浩司 志保
幸生 保坂
亨 長谷川
信夫 川橋
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JSR Corp
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JSR Corp
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  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2002296798A 2002-10-09 2002-10-09 半導体ウエハ用研磨パッド及びこれを備える半導体ウエハ用研磨複層体並びに半導体ウエハの研磨方法 Expired - Fee Related JP3988611B2 (ja)

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Application Number Priority Date Filing Date Title
JP2002296798A JP3988611B2 (ja) 2002-10-09 2002-10-09 半導体ウエハ用研磨パッド及びこれを備える半導体ウエハ用研磨複層体並びに半導体ウエハの研磨方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002296798A JP3988611B2 (ja) 2002-10-09 2002-10-09 半導体ウエハ用研磨パッド及びこれを備える半導体ウエハ用研磨複層体並びに半導体ウエハの研磨方法

Publications (3)

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JP2004134539A JP2004134539A (ja) 2004-04-30
JP2004134539A5 JP2004134539A5 (OSRAM) 2005-06-09
JP3988611B2 true JP3988611B2 (ja) 2007-10-10

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JP2002296798A Expired - Fee Related JP3988611B2 (ja) 2002-10-09 2002-10-09 半導体ウエハ用研磨パッド及びこれを備える半導体ウエハ用研磨複層体並びに半導体ウエハの研磨方法

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Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7086932B2 (en) * 2004-05-11 2006-08-08 Freudenberg Nonwovens Polishing pad
WO2005104199A1 (ja) * 2004-04-23 2005-11-03 Jsr Corporation 半導体ウエハ用研磨パッド及びこれを備える半導体ウエハ用研磨複層体並びに半導体ウエハの研磨方法
JP2006110686A (ja) * 2004-10-15 2006-04-27 Toyo Tire & Rubber Co Ltd 研磨パッド
JP4839042B2 (ja) * 2005-08-29 2011-12-14 伊藤 隆 タイヤ小組バランス修正装置
US7179151B1 (en) * 2006-03-27 2007-02-20 Freescale Semiconductor, Inc. Polishing pad, a polishing apparatus, and a process for using the polishing pad
JP7502592B2 (ja) * 2019-09-30 2024-06-19 富士紡ホールディングス株式会社 研磨パッド
US20220347815A1 (en) 2019-09-30 2022-11-03 Fujibo Holdingus, Inc. Polishing pad and method for manufacturing same
JP7502593B2 (ja) * 2019-09-30 2024-06-19 富士紡ホールディングス株式会社 研磨パッドの製造方法
JP7635043B2 (ja) * 2021-03-24 2025-02-25 富士紡ホールディングス株式会社 研磨パッドの製造方法

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JP2004134539A (ja) 2004-04-30

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