JP2004134539A5 - - Google Patents
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- Publication number
- JP2004134539A5 JP2004134539A5 JP2002296798A JP2002296798A JP2004134539A5 JP 2004134539 A5 JP2004134539 A5 JP 2004134539A5 JP 2002296798 A JP2002296798 A JP 2002296798A JP 2002296798 A JP2002296798 A JP 2002296798A JP 2004134539 A5 JP2004134539 A5 JP 2004134539A5
- Authority
- JP
- Japan
- Prior art keywords
- water
- polishing pad
- semiconductor wafer
- polishing
- matrix material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 claims description 79
- 239000004065 semiconductor Substances 0.000 claims description 30
- 235000012431 wafers Nutrition 0.000 claims description 30
- 239000011159 matrix material Substances 0.000 claims description 21
- 239000002245 particle Substances 0.000 claims description 17
- 239000000758 substrate Substances 0.000 claims description 14
- 229920006037 cross link polymer Polymers 0.000 claims description 7
- 238000001514 detection method Methods 0.000 claims description 7
- 230000003287 optical effect Effects 0.000 claims description 7
- 230000000149 penetrating effect Effects 0.000 claims description 6
- 238000002834 transmittance Methods 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 229920002589 poly(vinylethylene) polymer Polymers 0.000 claims description 3
- 238000007517 polishing process Methods 0.000 claims 2
- 238000010030 laminating Methods 0.000 claims 1
- 239000002002 slurry Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000002195 soluble material Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002296798A JP3988611B2 (ja) | 2002-10-09 | 2002-10-09 | 半導体ウエハ用研磨パッド及びこれを備える半導体ウエハ用研磨複層体並びに半導体ウエハの研磨方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002296798A JP3988611B2 (ja) | 2002-10-09 | 2002-10-09 | 半導体ウエハ用研磨パッド及びこれを備える半導体ウエハ用研磨複層体並びに半導体ウエハの研磨方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004134539A JP2004134539A (ja) | 2004-04-30 |
| JP2004134539A5 true JP2004134539A5 (OSRAM) | 2005-06-09 |
| JP3988611B2 JP3988611B2 (ja) | 2007-10-10 |
Family
ID=32286660
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002296798A Expired - Fee Related JP3988611B2 (ja) | 2002-10-09 | 2002-10-09 | 半導体ウエハ用研磨パッド及びこれを備える半導体ウエハ用研磨複層体並びに半導体ウエハの研磨方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3988611B2 (OSRAM) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7086932B2 (en) * | 2004-05-11 | 2006-08-08 | Freudenberg Nonwovens | Polishing pad |
| CN100424830C (zh) * | 2004-04-23 | 2008-10-08 | Jsr株式会社 | 用于抛光半导体晶片的抛光垫、层叠体和方法 |
| JP2006110686A (ja) * | 2004-10-15 | 2006-04-27 | Toyo Tire & Rubber Co Ltd | 研磨パッド |
| JP4839042B2 (ja) * | 2005-08-29 | 2011-12-14 | 伊藤 隆 | タイヤ小組バランス修正装置 |
| US7179151B1 (en) * | 2006-03-27 | 2007-02-20 | Freescale Semiconductor, Inc. | Polishing pad, a polishing apparatus, and a process for using the polishing pad |
| JP7502593B2 (ja) * | 2019-09-30 | 2024-06-19 | 富士紡ホールディングス株式会社 | 研磨パッドの製造方法 |
| KR102744678B1 (ko) | 2019-09-30 | 2024-12-19 | 후지보 홀딩스 가부시키가이샤 | 연마 패드와 그 제조 방법 |
| JP7502592B2 (ja) * | 2019-09-30 | 2024-06-19 | 富士紡ホールディングス株式会社 | 研磨パッド |
| JP7635043B2 (ja) * | 2021-03-24 | 2025-02-25 | 富士紡ホールディングス株式会社 | 研磨パッドの製造方法 |
-
2002
- 2002-10-09 JP JP2002296798A patent/JP3988611B2/ja not_active Expired - Fee Related
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