JP3984928B2 - Piping system for semiconductor manufacturing equipment - Google Patents

Piping system for semiconductor manufacturing equipment Download PDF

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Publication number
JP3984928B2
JP3984928B2 JP2003139222A JP2003139222A JP3984928B2 JP 3984928 B2 JP3984928 B2 JP 3984928B2 JP 2003139222 A JP2003139222 A JP 2003139222A JP 2003139222 A JP2003139222 A JP 2003139222A JP 3984928 B2 JP3984928 B2 JP 3984928B2
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Prior art keywords
tube
heat exchange
lid member
casing
tubes
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JP2003139222A
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JP2004340304A (en
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裕 岡元
達也 藤井
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Nippon Pillar Packing Co Ltd
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Nippon Pillar Packing Co Ltd
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Priority to JP2003139222A priority Critical patent/JP3984928B2/en
Application filed by Nippon Pillar Packing Co Ltd filed Critical Nippon Pillar Packing Co Ltd
Priority to KR1020040032909A priority patent/KR101042843B1/en
Priority to EP04011193A priority patent/EP1477717B1/en
Priority to DE602004010950T priority patent/DE602004010950T2/en
Priority to TW093113238A priority patent/TW200427504A/en
Priority to US10/844,881 priority patent/US7314239B2/en
Priority to CN2004100432514A priority patent/CN1550747B/en
Publication of JP2004340304A publication Critical patent/JP2004340304A/en
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Publication of JP3984928B2 publication Critical patent/JP3984928B2/en
Priority to US11/938,804 priority patent/US7695026B2/en
Priority to KR1020110005877A priority patent/KR101097621B1/en
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Description

【0001】
【発明の属する技術分野】
本発明は、半導体製造装置や液晶装置、化学薬品製造装置、食品生産ライン等で扱われる流体の配管システムに関する。
【0002】
【従来の技術】
半導体製造装置の配管システムにおいて、半導体デバイスの高集積化に伴い、例えば、半導体ウェットプロセスのソリュ−ションの一つである各種洗浄装置における洗浄工程数は益々増加の一途を辿り、洗浄の清浄度もますます完全性を要求されている。このため、清浄装置に超純水や薬液からなる洗浄液を清浄に供給する技術確立の要求は益々厳しくなっている。現在、薬液は薬液供給システムのうち、調合、希釈、輸送のプロセスで汚染を受けているが、ウェハクリーン度としては、サブクォーターミクロン時代に対応する必要がある。薬液供給システムとしては、大量調整方式が知られている。薬液は受け入れ槽から希釈調合槽にポンプ輸送され、所要の組成や濃度に調整され、供給槽から長距離配管によってポンプ輸送され、ウェットステーションの貯槽にポンプ輸送され、さらにポンプとフィルターを経て洗浄槽に供給される方式である(例えば、特許文献1や特許文献2参照。)
【0003】
この種の半導体製造装置等の配管システムに適用される各種デバイスのうちの一つとして、たとえば、図10、図11に示すような熱交換器がある。この熱交換器は、熱交換チューブ70が通されるケーシング71が充分なシール性を確保して或る程度の内圧に耐えられるようにするために、ケーシング71の本体を構成する円筒状のシェル72の外周に複数本のタイロッドや通しボルト等の金属製締結部材73をその長手方向に沿うよう互いに平行に配するとともに、該金属製締結部材73の両端部をシェル72の両端部に配される蓋部材74に挿通して、該蓋部材74から突出する金属製締結部材73の両端の雄ねじ部にナット75を締め込むことによってシェル72の両端部と蓋部材74との突き合せ面間が密着状にシールされ、これによりケーシング71が密封状に構成されるといったものである(例えば、特許文献3参照。)。また、前記シェル72の両端部と蓋部材74との突き合せ面間にはシール部材であるOリング76が介在されている(前出の特許文献3参照。)。
【0004】
【特許文献1】
特開2000−265945号公報
【特許文献2】
特開平11−70328号公報
【特許文献3】
特開平10−160362号公報
【0005】
【発明が解決しようとする課題】
しかるに、大量調整方式の上記薬液供給システムでは、貯槽・配管・継手・ポンプ・熱交換器・フローメーター・フィルター・脱気モジュール等全てのデバイスの構成部品の各種接液部などからのパーティクルやメタルコンタミネーションの発生が問題視されている。
他方、半導体ウェハ等を洗浄する基板洗浄装置の高速洗浄化に伴う装置全体の大規模化や複雑化が問題視されており、特に、各種デバイスが配備されてなる配管システムはクリーンルームに設置される関係から小型化、コンパクト化が要求される。
【0006】
各種デバイスにはメタル材を使用する場合が多く、メタルコンタミネーションを発生させていると共に、デバイス形状が固定化されていたため、配管システム設計の自由度が小さく、配管のデッドスペースが生じ易く、配管システムが大型になりがちであり、洗浄装置等の機械装置も含めてコンパクト化や低廉化に限度があった。また、既成の配管システムの改造要求に対し、柔軟に対応可能な形状のデバイスが存在せず、配管システム改造にはスペース上の制約が多かった。
【0007】
また、シェル72の両端部と蓋部材74とが複数本のタイロッドや通しボルト等の金属製締結部材73とナット75との締め込みによってシールされる上記熱交換器(デバイス)では、シールするための部品点数が多く、コストアップ、ケーシング構造の大型化を招くばかりか、金属製締結部材73は、硫酸雰囲気などに晒される場所に配置された場合、腐食しやすく、また金属汚染が避けられないため、近年、とくに半導体業界では使用制限の要求が高い。
【0008】
また、金属製締結部材73の締付けの緩みに対して、金属製締結部材73を定期的に増締めする必要があるが、通常金属製締結部材73は複数本、少なくとも4本以上であるため、各金属製締結部材73の増締め度合いにばらつきが生じ易く、このばらつきにより蓋部材74やシェル72の変形を招くおそれがあった。蓋部材74やシェル72の変形が生じると、シェル72の端部と蓋部材74との間にねじれや歪みが生じるため、局部的な応力集中が生じてクリープの進行を助長する問題がある。また、金属製締結部材73の金属製タイロッドと金属製タイロッドシースとの中心軸が一致せず、両者が擦れ合って摺動抵抗が増大し、かつ、金属粉を含む摩耗粉の発生原因となるという問題もあった。さらに、シェル72や蓋部材74の変形が生じた場合、これらの部材交換が必要となるが、これらの部材は通常切削品であり、比較的高価でもあるため、ケーシング構造の交換を行っ熱交換チューブ70継続利用するという再利用が難しい構造でもあった。
【0009】
シェル72の両端部と蓋部材74との突き合せ面間にシール部材としてOリング76を介在させる接続構造の上記熱交換器では、Oリング76を使用するため、耐蝕性や使用温度範囲に制限がある。例えば、Oリング76に接する空間には、高温の薬液を連通させることができない。また、Oリング76の発塵による汚染が問題となることもある。したがって、近年、半導体業界ではこのようなOリング76の使用制限の要求が高い。
【0010】
また、この種熱交換器が、薬液等に使用された場合、そのシェル72や蓋部材74等の構成部材には耐腐食性に優れるPTFEやPFA等のフッ素樹脂が使用されることが多いが、フッ素樹脂は、潤滑性が高いため、シェル72と蓋部材74との間の接続部が配管の震動や熱の影響でクリープし、これによりタイロッドや通しボルト等金属製締結部材73の緩みが発生し、シェル72の両端の接続部から流体漏れが発生する問題があった。
【0011】
シェル72と蓋部材74との間のケーシング接続構造としては、その他に、ネジシールや溶接が採用されることがあるが、あまり効果的ではない。すなわち、単なるネジによる接続シール構造では、高いシール性を得ることができず、耐圧性が充分でなく、かつクリープによる漏れが生じ易い。また溶接は、一般的に熟練技術を必要とし、容易な作業ではないため、生産効率が低いとともに、現場作業性が悪く、現場での保守・点検が困難であるという問題がある。
【0012】
本発明は、このような諸問題点を解決するためになされたものであり、その目的とするところは、金属製締結部材等の金属材を使用しないで、全ての構成部材を合成樹脂製のものにすることを可能にすることによりメタル溶出や金属摩耗粉発生の問題を解消できる半導体製造装置等の配管システムを提供することにある。
また、本発明の目的は、各種デバイスのスリム化、配管システムの小型化、コンパクト化を図れる半導体製造装置等の配管システムを提供することにある。
さらに、本発明の目的は、タイロッドや通しボルト等の金属製締結部材、及びOリングを用いることなく、部品点数の減少、コスト低減を図ることができるとともに、耐圧性の高いケーシング構造及び信頼性の高いシール構造をもつ熱交換器を備える半導体製造装置等の配管システムを提供することにある。
【0013】
また本発明の他の目的は、その構成部材を全てフッ素樹脂で構成しても高いシール性を確保できるとともに、耐薬品性雰囲気への適用、設置が可能となる熱交換器を備える半導体製造装置等の配管システムを提供することにある。
【0014】
【課題を解決するための手段】
本発明は、配管系の途中に熱交換器が介入されている半導体製造装置等の配管システムであって、
前記熱交換器はケーシングの内部に通された熱交換チューブを通過する流体と、ケーシングの内部と熱交換チューブの外部との間を通過する流体との間で熱交換を行うものであり、
前記ケーシングが、前記熱交換チューブの外周を包囲する合成樹脂製のチューブと、このチューブの一端部及び他端部をそれぞれ受け入れる受口部、及びこの受口部内に設けられた少なくとも1つのシール面、前記熱交換チューブの両端部を外部へ導出させるための導出口、前記ケーシングの内部と前記熱交換チューブの外部との間を通過する流体の導入用及び導出用の配管が接続される接続部を備えた1対の合成樹脂製の蓋部材と、前記チューブの一端部及び他端部にそれぞれ外嵌されるとともに前記蓋部材の一端部に螺合される合成樹脂製のユニオンナットと、前記ユニオンナットが前記蓋部材の一端部への螺進による締め付けにより前記チューブをこれの外側から押圧し、この押圧作用により前記チューブの端部と前記蓋部材のシール面とが密着することにより形成された少なくとも1箇所のシール部と、を備え、前記熱交換チューブはその両端部が前記ケーシングの一対の蓋部材の各導出口から導出されて前記ケーシングに貫通していることに特徴を有するものである。
【0015】
この場合において、前記チューブ、前記蓋部材、および前記ユニオンナットは全て耐熱性、耐薬品性に優れるフッ素樹脂や導電性物質を含有する帯電防止フッ素樹脂で成形することができる。
【0016】
【発明の作用効果】
上記構成の配管システムによれば、配管系の途中に介入される熱交換器がユニオンナットを蓋部材の一端部に締め付けるだけの簡単な操作でチューブの端部と蓋部材のシール面とを密着させるシール部を介して確実に密封することができる。したがって、従来のようにタイロッドや通しボルト等の金属製締結部材及びOリングを用いることなく、部品点数を少なくして、安価に且つコンパクトで耐圧性の高いケーシング構造及び信頼性の高いシール構造の熱交換器を得ることができる。
【0017】
熱交換器は、従来のケーシング接続構造のようにタイロッドや通しボルトを使用しない耐圧シール構造で、且つスリムなケーシング構造にすることができ、また単一のユニオンナットによる増締めによりシール性を均一に確保することが可能である。すなわち、チューブの両端部の蓋部材との接続部を単一のユニオンナットでシールするだけで、タイロッドや通しボルトに比べて信頼性の高いシール構造が得られ、しかもスリムなケーシングの熱交換器でもって配管システムの小型化、コンパクト化を図ることができる。また、ユニオンナットの増締めによりシール性をその都度確保することが可能であって、ネジシールやOリングシールと比較しても長期にわたり信頼性の高いものとなる。さらに、単一のユニオンナットを増締めするという簡単な手段で足りるため、溶着による接続構造と異なり現場施工が容易であり、現場での保守・点検も容易に行える。
【0018】
金属製締結部材等の金属材を一切使用しないので、メタル溶出や金属摩耗粉発生の問題を解消できる。
【0019】
ユニオンナットの締め付けによればチューブの端部の外側全周を均等に押圧することができるため、チューブや蓋部材の不慮の変形を招くようなことが無くなる。したがって、これら部材のクリープや交換の問題を解消できる。
【0020】
ユニオンナットの締付けを緩めることによりチューブの端部から蓋部材を簡単に取り外すことができるため、チューブ内に滞留する滞留物の除去が容易に行える。
【0021】
また、この配管システムの配管系に介入される熱交換器は、ユニオンナットの締付けによるだけでチューブに内圧が加わっても十分気密を保つことができて流体漏れを防止できるので、従来のようにOリングを使用しなくて済み、全ての構成部材をフッ素樹脂で成形することで、高温、腐蝕性の強い薬液にもよく対応でき、耐薬品性雰囲気への適用、設置が可能となる。
【0022】
【発明の実施の形態】
本発明の好適な実施形態を図面に基づき説明する。
【0023】
図1は本発明に係る配管システムの一態様例である薬液供給配管システムを含む半導体ウェハ(基板)洗浄装置の全体構成を示す概略断面図である。Aはウェハ(基板)Wが設置されて洗浄される洗浄チャンバー、Bは所望濃度の洗浄液を生成して洗浄チャンバーAへ供給する薬液供給システムである。薬液供給配管システムBは、薬液が原液の状態で貯蔵される薬液貯蔵タンク100と、薬液貯蔵タンク100と連結され、薬液供給を行う薬液供給装置101と、薬液供給装置101と連結され、薬液と混合する超純水の通路となる供給流路管102と、洗浄チャンバーA内に設置されるウェハWの表面と対向するように供給流路管102の下流側端部に設けられ、ウェハWの表面に洗浄液を供給する1対の吐出ノズル103,104と、吐出ノズル103,104から供給する洗浄液の濃度や流量等の各種状態を調節するための制御系105とを備えて構成されている。
【0024】
薬液供給装置101は、薬液供給ポンプ106と、供給流路管102と薬液供給ポンプ106とを連結して流路を形成する連結管107と、連結管107内に供給流路管102内と直接連結するキャピラリー108とを備えて構成されている。薬液供給ポンプ106の駆動により、キャピラリー108から供給流路管102内の超純水中へ薬液が吐出される。
【0025】
供給流路管102には、この供給流路管102内を通過する超純水の流量を調節する流量調節手段109、供給流路管102内を通過する洗浄液の濃度を調節する濃度調節手段110、及び供給流路管102のキャピラリー108との連結部位に配され、洗浄液に回転流を生ぜしめて攪拌し、洗浄液を均一化させる混合手段111が設けられている。
【0026】
制御系105は、薬液供給ポンプ106の薬液の超純水への供給量を調節するとともに、流量調節手段109を駆動する薬液供給制御手段112と、濃度調節手段110を駆動する濃度制御手段113とを備えている。そして、薬液供給制御手段112と濃度制御手段113とが連結され、濃度制御手段113による濃度制御の結果が薬液供給制御手段112にフィードバックされて薬液供給ポンプ106を制御し、薬液の供給量が調節される。
【0027】
本発明は上記薬液供給配管システムBの配管系の適所に熱交換器を介入し、この熱交換器を以下のように構成することに特徴を有する。
【0028】
図1は、上記薬液供給配管システムBの配管系である供給流路管102の途中熱交換器114を介入した場合の実施例を示す。図2に示すように、この熱交換器114はケーシング1の内部(熱交換室)2に通された熱交換チューブ3内を通過する流体と、ケーシング1の内部と熱交換チューブ3の外部との間を通過する流体との間で熱交換を行うものである。
【0029】
図2、図3に示すように、ケーシング1は、熱交換チューブ3の外周を包囲するチューブ4と、このチューブ4の一端部及び他端部をそれぞれ密封状に閉塞する1対の蓋部材5、及び各蓋部材5をチューブ4の端部に締め付けるユニオンナット6を備える。
チューブ4は耐熱性、耐薬品性に優れるPFA、PTFE等のフッ素樹脂や導電性物質を含有する帯電防止フッ素樹脂等の合成樹脂によって筒状に成形され、このチューブ4の両端部には、それぞれ、同じくフッ素樹脂等の合成樹脂からなる蓋部材5を挿入してフッ素樹脂等合成樹脂製のユニオンナット6の締め付けを介して接続する。
【0030】
蓋部材5は、胴壁部7と、この胴壁部7の一端に開放する受口部8、及び胴壁部7の他端を閉塞する底壁部9とを有する形に形成される。そして、図3に示すように、蓋部材5の受口部8の内部には第1〜3のシール面10〜12が設けられる。第1のシール面10は、蓋部材5の受口部8の入口より内奥に、蓋部材5の軸線Cに対して交差状、つまり軸線C方向の外方に向けて漸次拡径するテーパ面により構成される。第2のシール面11は、受口部8の入口に、前記軸線Cに対して交差状、つまり軸線C方向の外方に向けて漸次拡径するテーパ面により構成される。第3のシール面12は、蓋部材5の受口部8の内奥において第1のシール面10よりも径方向外方に軸線Cと平行に形成された環状溝部13により構成される。蓋部材5の受口部8の外周には雄ねじ14が形成されている。
【0031】
一方、チューブ4の一端部及び他端部にはそれぞれフッ素樹脂等合成樹脂製のインナーリング15を圧入する。このインナーリング15は、図3に示すように、チューブ4の端部に圧入されて該端部を断面山形状に拡径膨出させる断面算盤玉形状の圧入部16と、この圧入部16に連設されてチューブ4の端部に突出する突出部17とを有するスリーブ形状に形成されている。断面山形状の圧入部16はこれの一斜面部に外向きテーパ面18を、他斜面部に前記第2のシール面11との間でチューブ4の端部を傾斜状態に挟持して第2のシール部21を形成する内向きテーパ面20をそれぞれ形成している。突出部17の先端には前記第1のシール面10に密着状に当接して第1のシール部19を形成するテーパ面からなる突出端面22、および前記環状溝部13に嵌入して第3のシール部23を形成する円筒部24を形成してなる。このインナーリング15の内径はチューブ4の内径と同一か略同一に設定して流体が滞留することなく、円滑に流動するようにしている。
【0032】
図3に示すように、ユニオンナット6はこれの内周に蓋部材5の雄ねじ14に螺合される雌ねじ25を形成し、かつ一端部に環状鍔部26を内向きに張り出すとともに、該環状鍔部26の内周面の軸方向内端に鋭角または直角の押圧エッジ部26aを設けてある。
【0033】
そして、上記インナーリング15の圧入されたチューブ4の端部を蓋部材5の受口部8に挿入し、該チューブ4の端部の外周に予め遊嵌させたユニオンナット6の雌ねじ25を蓋部材5の雄ねじ14に螺合させて締め付ける。この締付けに伴いユニオンナット6の押圧エッジ部26aがチューブ4の拡径部27の拡径付け根部に当接してインナーリング15を軸方向から押圧する。これにより、図3に示すように、インナーリング15の突出端面22が蓋部材5の第1のシール面10に対し押し付けられて第1のシール部19を形成するとともに、インナーリング15の内向きテーパ面20と蓋部材5の第2のシール面11との間でチューブ4の端部を傾斜状態に挟持して第2のシール部21を形成し、さらにインナーリング15の円筒部24が環状溝部13に圧入して第3のシール部23を形成する。これら第1〜3のシール部19,21,23により信頼性の高いシール機能を発揮する。
【0034】
図2に示すように、上記チューブ4の一端部の蓋部材5には、他の配管である熱交換流体の導入用配管28aが接続される接続部29aを、他端部の蓋部材5には他の配管である導出用配管28bが接続される接続部29bをそれぞれ備える。すなわち、他の配管との接続部29a,29bは、一方の蓋部材5の胴壁部7に温調水等の熱交換流体のインレットポート30を、他方の蓋部材5の胴壁部7にアウトレットポート31をそれぞれ形成し、インレットポート30には熱交換流体の導入用配管28aの端部が、アウトレットポート31には熱交換流体の導出用配管28bの端部がそれぞれフッ素樹脂等合成樹脂製のユニオンナット32、フッ素樹脂等合成樹脂製のインナーリング33を介して接続されて、熱交換流体がインレットポート30、チューブ4内の熱交換室2、アウトレットポート31の順に流通すべく構成されている。
【0035】
インレットポート30及びアウトレットポート31の各内部構造は蓋部材5の受口8の内部構造と同一に構成し(但し、径は異なる)、また熱交換流体の導入用配管28a及び導出用配管28bの各端部には、チューブ4の端部のインナーリング15の断面形状と同様のインナーリング33を圧入してあって、インレットポート30及びアウトレットポート31に対する導入用配管28a及び導出用配管28bの各端部の接続構造は、チューブ4の端部の蓋部材5の受口8に対する接続構造と同様であるため、その詳細な説明は省略する。ただし、このインレットポート30及びアウトレットポート31に対する熱交換流体の導入用配管28a及び導出用配管28bの各端部の接続構造としては、そのほかに、インレットポート30及びアウトレットポート31に対し熱交換流体の導入用配管28a及び導出用配管28bの各端部を直接溶着したり、ねじ接続したりするなどの手段を採用することもできる。つまり、他の配管との接続部29a,29bは溶着、ねじ接続などの接続手段であってもよい。
【0036】
一方、チューブ4の内部には薬液が通過するフッ素樹脂等合成樹脂製のコイルチューブよりなる熱交換チューブ3が通され、この熱交換チューブ3の両端部は蓋部材5の底壁部9に開口した導出口34から導出され、上記薬液供給配管システムBの配管系の供給流路管102の途中に接続される。その熱交換チューブ3の導出端部にはフッ素樹脂等合成樹脂製のユニオンナット35を外嵌して、このユニオンナット35を導出口34にフッ素樹脂等合成樹脂製のフェルール36を介して締め付けることにより該導出口34と熱交換チューブ3の端部との間の隙間を密封している。
【0037】
このように構成された熱交換器は、熱交換チューブ3内を通過する、例えば薬液等の流体と、筒状ケーシング本体4内の熱交換チューブ3の外部を通過する温調水等熱交換流体との間で熱交換が行われるが、熱交換チューブ3内に薬液等の流体を、熱交換チューブ3外部に温調水等熱交換流体をそれぞれ通過させるに代えて、それとは反対に、熱交換チューブ3内に温調水等熱交換流体を、熱交換チューブ3外部に薬液等の流体をそれぞれ通過させることもできる。
【0038】
なお、上記熱交換チューブ3の両端部をケーシング1の外部へ導出させるための導出口34は蓋部材5の胴壁部7に開口し、薬液等の流体のインレットポート30およびアウトレットポート31は蓋部材5の底壁部9に設けることもできる。
【0039】
また、薬液等流体又は温調水等熱交換流体を通過させる熱交換チューブ3は、コイルチューブに代えて、フッ素樹脂製の単一のストレートなチューブで構成すること、あるいは図11に示される従来の熱交換器の場合と同様なフッ素樹脂等合成樹脂製の複数のストレートなチューブで構成することもできる。
【0040】
熱交換器のケーシングの他の実施例)
熱交換器のケーシング1の全体的な形状としては、上記の各実施例のように直管状に形成するに代えて、図に示すごとくL形状、あるいは図に示すごとくU形状などの応用形態を採用することができる。この場合、図に示すL形状のケーシング1では2個の第1,2のチューブ4A,4B,2個の第1,2の蓋部材5A,5B、および1個のエルボ形状のフッ素樹脂等合成樹脂製の接合部材39を使用し、図に示すU形状のケーシング1では3個の第1,2,3のチューブ4A,4B,4C、2個の第1,2の蓋部材5A,5B、および2個のエルボ形状のフッ素樹脂等合成樹脂製の第1,2の接合部材39A,39Bを使用する。
【0041】
に示すL形状のケーシング1においては、それぞれの一端部に第1,2蓋部材5A,5Bが第1のユニオンナット6Aで接続された第1,2のチューブ4A,4Bの他端部同士を、1個のエルボ形状の接合部材39及び1対の第2のユニオンナット40Bで接続する。この場合、第1,2のチューブ4A、4Bの各一端部に対して第1,2の蓋部材5A、5Bを接続する接続構造については、上記した各実施例のチューブ4の端部と蓋部材5との接続構造の場合と同様に構成する。
【0042】
接合部材39はこれの両端に受口41を互いに直交状に連通するよう開口してあり、各受口4の内部構造は蓋部材5の受口部8の内部構造と同一に構成し、第1,2のチューブ4A、4Bの各他端部には各一端部のインナーリング15と同様の断面形状のインナーリング15を圧入してあるため、接合部材39の一端の受口41に第1のチューブ4Aの他端部が、また他端の受口41に第2のチューブ4Bの他端部が、それぞれ、上記第1,2のチューブ4A、4Bの各一端部の第1,2の蓋部材5A、5Bの受口部8に対する接続構造の場合と同様の接続構造を介して接続される。流体チューブ3は接合部材39の内部で直角に曲げられる。
【0043】
に示すU形状のケーシング1においては、それぞれの一端部に蓋部材5が第1のユニオンナット6で接続された第1,2のチューブ4A、4Bの他端部同士間に、第3のチューブ4Cを2個のエルボ形状の接合部材39及び1対の第2のユニオンナット40Bで接続する。この場合においても、第1,2のチューブ4A、4Bの各一端部に対して第1,2の蓋部材5の受口部8を接続する接続構造は上記した各実施例のチューブ4の端部と蓋部材5との接続構造の場合と同様に構成する。そして、第1,2のチューブ4A、4Bの各他端部に対して各接合部材39の受口41を接続する接続構造、および第3のチューブ4Cの両端部に対して各接合部材39の受口41を接続する接続構造は、それぞれ、上記第1,2のチューブ4A、4Bの各一端部の第1,2の蓋部材5の受口部8に対する接続構造の場合と同様に接続される。流体チューブ3は各接合部材39の内部で直角に曲げられる。
なお、ケーシング1は、図のL形状のケーシング1と図のU形状のケーシング1とを組み合わせた形状に構成することもできる。
【0044】
このように熱交換器のケーシング1はL形状あるいはU形状などに形成することにより、配管のデッドスペースを有効に活用してコンパクトな配管システムを組むことができる。また既存配管に新たに熱交換器を設置する場合など配管システムの改造要求に対応できる形状にすることができて有利である。
【0045】
(シール部の他の実施例)
上記チューブ4の端部と蓋部材5の受口部8との間に形成されるシール部としては、図3に示す上記実施例のように第1,2のシール部19,21のほかに、インナーリング15の円筒部24と蓋部材5の環状溝部13による第3のシール部23を付加することによりシール性能をより一層確実に向上させることができるが、必ずしもこれに限定されるものではない。そのほかに、たとえば、図に示すように、第1,2のシール部19,21だけを形成して、第3のシール部23を省略するもの、すなわち蓋部材5の内奥に環状溝部13を設けず、またインナーリング15に円筒部24を設けないものであってもよい。この場合、蓋部材5の内奥に設ける第1のシール面10は、軸線Cに対して第2のシール面11とは逆向きの交差状、つまり軸線C方向の外方に向けて漸次縮径するテーパ面により構成している。
【0046】
また、図に示すように、蓋部材5の受口部8の先端側における端部外周に、チューブ4の内径より径大のテーパ面からなるシール面42を形成し、このシール面42の後方の外周に該シール面42の外径より径大の雄ねじ14を形成している。一方、チューブ4の端部はフレア加工して拡径部43を形成する。かくして、チューブ4の端部の拡径部43を蓋部材5のシール面42上に圧入する。そして、チューブ4に外嵌されているユニオンナット6の雌ねじ25を蓋部材5の雄ねじ14に螺合して締め付け、ユニオンナット6の環状鍔部26の押圧エッジ部26aをチューブ4の外側に当接させて拡径部43の内周面を受口部8のシール面42に軸方向から押し付けて密着させることにより、シール部44を形成することもできる。
【0047】
に示すように、チューブ4の端部にフッ素樹脂等合成樹脂製の断面円弧形状のインナーリング45を圧入して該チューブ4の端部を断面山形状に拡径膨出させ、蓋部材5の雄ねじ14に螺合させたユニオンナット6を螺進させて強く締め付けることによって、チューブ4の端部をインナーリング45とともに、蓋部材5の受口部8の内周に設けたテーパ状のシール面46に対して押し付けて密着させることにより、シール部47を形成するシール構造であってもよい。
【0048】
また、図に示すように、チューブ4の端部にアウタリング48を嵌め込み、チューブ4の末端部を該アウタリング48の外面上に折り返して、蓋部材5の雄ねじ14に螺合させたユニオンナット6を螺進させて強く締め付けることによって、チューブ4の端部をアウタリング48とともに、蓋部材5の受口部8内のシール面49に対して押し付けて密着させることにより、シール部50を形成する、というシール構造であってもよい。
【0049】
勿論、本発明は上記半導体製造装置の薬液供給配管システム以外の各種配管システムにも同様に適用できることは言うまでもない。
【図面の簡単な説明】
【図1】 本発明の配管システムの一例である薬液供給配管システムを含む半導体ウェハ(基板)洗浄装置の全体構成を示す概略断面図である。
【図2】 図1中熱交換器の断面図である。
【図3】 図2の熱交換器のチューブ端部と蓋部材との接続構造の拡大断面図である。
【図4】 熱交換器のケーシングの他例を示す断面図である。
【図5】 熱交換器のケーシングの更に他例を示す断面図である。
【図6】 熱交換器のシール部の他例を示す断面図である。
【図7】 熱交換器のシール部の更に他例を示す断面図である。
【図8】 熱交換器のシール部の更に又、他例を示す断面図である。
【図9】 熱交換器のシール部の更に又、他例を示す断面図である。
【図10】 従来例熱交換器正面図である。
【図11】10の熱交換器の断面図である。
【符号の説明】
1 ケーシング
熱交換チューブ
4,4A,4B,4C チューブ
5,5A,5B 蓋部材
6 第1のユニオンナット
8 受口部
10,11,12,42,46,49 シール面
13 環状溝部
15 インナーリング
16 圧入部
17 突出部
19,21,23,44,47,50 シール部
20 内向きテーパ面
22 突出端面
24 円筒部
28a,28b 流体導入用及び導出用の配管
29a,29b 接続部
39,39A,39B 接合部材
40 第2のユニオンナット
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a fluid piping system handled in a semiconductor manufacturing apparatus, a liquid crystal apparatus, a chemical manufacturing apparatus, a food production line, or the like.
[0002]
[Prior art]
In semiconductor manufacturing equipment piping systems, as semiconductor devices become highly integrated, for example, the number of cleaning steps in various cleaning equipment, which is one of the solutions of semiconductor wet processes, continues to increase. More and more integrity is required. For this reason, the request | requirement of the technique establishment which supplies the cleaning liquid which consists of an ultrapure water or a chemical | medical solution to a cleaning apparatus cleanly becomes increasingly severe. At present, the chemical solution is contaminated by the process of preparation, dilution, and transportation in the chemical solution supply system, but the wafer cleanliness needs to correspond to the sub-quarter micron era. A mass adjustment method is known as a chemical solution supply system. The chemical solution is pumped from the receiving tank to the dilution preparation tank, adjusted to the required composition and concentration, pumped from the supply tank by a long-distance pipe, pumped to the storage tank of the wet station, and then the washing tank through the pump and filter (See, for example, Patent Document 1 and Patent Document 2).
[0003]
As one of various devices applied to a piping system such as this type of semiconductor manufacturing apparatus, there is a heat exchanger as shown in FIGS. 10 and 11 , for example. This heat exchanger has a cylindrical shell that constitutes the main body of the casing 71 in order to ensure that the casing 71 through which the heat exchange tube 70 is passed has sufficient sealing performance and can withstand a certain level of internal pressure. A plurality of metal fastening members 73 such as tie rods and through bolts are arranged in parallel to each other along the longitudinal direction on the outer periphery of 72, and both ends of the metal fastening members 73 are arranged at both ends of the shell 72. By inserting nuts 75 into male screw portions at both ends of the metal fastening member 73 protruding from the lid member 74, the gap between the abutting surfaces of the shell 72 and the lid member 74 is increased. The casing 71 is hermetically sealed, and the casing 71 is thus hermetically sealed (see, for example, Patent Document 3). Further, an O-ring 76 as a seal member is interposed between the abutting surfaces of the both ends of the shell 72 and the lid member 74 (see the above-mentioned Patent Document 3).
[0004]
[Patent Document 1]
JP 2000-265945 A [Patent Document 2]
JP-A-11-70328 [Patent Document 3]
Japanese Patent Laid-Open No. 10-160362
[Problems to be solved by the invention]
However, in the above-mentioned chemical supply system with a large volume adjustment method, particles and metal from various wetted parts of all device components such as storage tanks, piping, joints, pumps, heat exchangers, flow meters, filters, deaeration modules, etc. Contamination is regarded as a problem.
On the other hand, the large scale and complexity of the entire apparatus due to the high-speed cleaning of the substrate cleaning apparatus for cleaning semiconductor wafers and the like are regarded as problems. Particularly, the piping system in which various devices are installed is installed in a clean room. From the relationship, downsizing and downsizing are required.
[0006]
Metal materials are often used for various devices, and metal contamination is generated, and the device shape is fixed, so the degree of freedom in piping system design is small, piping dead space is likely to occur, piping The system tends to be large, and there is a limit to compactness and cost reduction including mechanical devices such as cleaning devices. In addition, there is no device with a shape that can flexibly respond to the demand for modification of the existing piping system, and there were many space restrictions in the modification of the piping system.
[0007]
In addition, in the heat exchanger (device) in which both end portions of the shell 72 and the lid member 74 are sealed by tightening a metal fastening member 73 such as a plurality of tie rods or through bolts and a nut 75, the sealing is performed. The number of parts is large, which increases the cost and enlarges the casing structure. When the metal fastening member 73 is placed in a place exposed to a sulfuric acid atmosphere or the like, it is easily corroded and metal contamination is unavoidable. Therefore, in recent years, there is a high demand for use restriction particularly in the semiconductor industry.
[0008]
In addition, it is necessary to periodically tighten the metal fastening member 73 against loosening of the metal fastening member 73, but usually there are a plurality of metal fastening members 73, at least four or more, The degree of tightening of each metal fastening member 73 is likely to vary, and this variation may cause deformation of the lid member 74 and the shell 72. When the lid member 74 or the shell 72 is deformed, a twist or distortion occurs between the end portion of the shell 72 and the lid member 74, so that there is a problem that local stress concentration occurs and promotes the progress of creep. Moreover, the center axis | shaft of the metal tie rod of the metal fastening member 73 and a metal tie rod sheath does not correspond, both rub against each other, sliding resistance increases, and it becomes a cause of generation | occurrence | production of the abrasion powder containing metal powder. There was also a problem. Further, if the deformation of the shell 72 and the lid member 74 has occurred, although these members replacement is needed, these members are usually cut products, since some relatively expensive, by performing the replacement of the casing structure heat It was also a structure that was difficult to reuse by continuously using the exchange tube 70.
[0009]
In the heat exchanger having the connection structure in which the O-ring 76 is interposed as a seal member between the abutting surfaces of the both ends of the shell 72 and the lid member 74, the O-ring 76 is used, so that the corrosion resistance and the operating temperature range are limited. There is. For example, a high temperature chemical cannot be communicated with the space in contact with the O-ring 76. Further, contamination due to dust generation of the O-ring 76 may be a problem. Therefore, in recent years, there is a high demand for such use restriction of the O-ring 76 in the semiconductor industry.
[0010]
Further, when this kind of heat exchanger is used for a chemical solution or the like, a fluororesin such as PTFE or PFA having excellent corrosion resistance is often used for the constituent members such as the shell 72 and the lid member 74. Since the fluororesin has high lubricity, the connecting portion between the shell 72 and the lid member 74 creeps due to the vibration of the piping and the influence of heat, and thereby the metal fastening member 73 such as a tie rod or a through bolt is loosened. There is a problem in that fluid leakage occurs from the connecting portions at both ends of the shell 72.
[0011]
As the casing connection structure between the shell 72 and the lid member 74, a screw seal or welding may be employed in addition, but it is not very effective. That is, with a simple sealing connection structure using screws, high sealing performance cannot be obtained, pressure resistance is not sufficient, and leakage due to creep tends to occur. In addition, welding generally requires skilled techniques and is not an easy operation, so that there are problems in that production efficiency is low, on-site workability is poor, and on-site maintenance and inspection are difficult.
[0012]
The present invention has been made in order to solve such various problems, and the object of the present invention is to use all synthetic members made of synthetic resin without using metal materials such as metal fastening members. An object of the present invention is to provide a piping system such as a semiconductor manufacturing apparatus that can solve the problems of metal elution and metal wear powder generation by making it possible.
Another object of the present invention is to provide a piping system such as a semiconductor manufacturing apparatus that can reduce the size of various devices, reduce the size of the piping system, and reduce the size of the piping system.
Furthermore, an object of the present invention is to reduce the number of parts and reduce the cost without using a metal fastening member such as a tie rod or a through-bolt and an O-ring, and a highly pressure-resistant casing structure and reliability. Another object of the present invention is to provide a piping system such as a semiconductor manufacturing apparatus including a heat exchanger having a high sealing structure.
[0013]
Another object of the present invention is to provide a semiconductor manufacturing apparatus equipped with a heat exchanger that can ensure high sealing performance even when all of its constituent members are made of fluororesin, and can be applied and installed in a chemical resistant atmosphere. It is to provide a piping system.
[0014]
[Means for Solving the Problems]
The present invention is a piping system such as a semiconductor manufacturing apparatus in which a heat exchanger is interposed in the middle of a piping system,
The heat exchanger performs heat exchange between a fluid passing through a heat exchange tube passed through the inside of the casing and a fluid passing between the inside of the casing and the outside of the heat exchange tube,
The casing is made of a synthetic resin that surrounds the outer periphery of the heat exchange tube, a receiving portion that receives one end and the other end of the tube, and at least one sealing surface provided in the receiving portion. , A lead-out port for leading both ends of the heat exchange tube to the outside, and a connection part to which piping for introducing and leading the fluid passing between the inside of the casing and the outside of the heat exchange tube is connected A pair of synthetic resin lid members, and a synthetic resin union nut that is externally fitted to one end and the other end of the tube and screwed to one end of the lid member; A union nut presses the tube from the outside by tightening it by screwing to one end of the lid member, and the end of the tube and the seal of the lid member are pressed by this pressing action. DOO is and a seal portion of the at least one location is formed by close contact, the heat exchanger tube through the casing at both ends is derived from the outlet of the pair of cover members of said casing It has a feature in being.
[0015]
In this case, the tube, the lid member, and the union nut can all be formed of a fluororesin excellent in heat resistance and chemical resistance or an antistatic fluororesin containing a conductive substance.
[0016]
[Effects of the invention]
According to the piping system configured as described above, the heat exchanger intervening in the middle of the piping system closely contacts the end of the tube and the sealing surface of the cover member by simply tightening the union nut to one end of the cover member. It is possible to reliably seal through the seal portion. Therefore, without using metal fastening members such as tie rods and through-bolts and O-rings as in the past, the number of parts is reduced, and the casing structure is inexpensive, compact and has high pressure resistance, and a highly reliable seal structure. A heat exchanger can be obtained.
[0017]
The heat exchanger has a pressure-resistant sealing structure that does not use tie rods or through-bolts, as in the conventional casing connection structure, and can be made into a slim casing structure, and the sealing performance is uniform by tightening with a single union nut. It is possible to ensure. In other words, a seal structure with higher reliability than tie rods and through-bolts can be obtained by simply sealing the connection parts of the tube with the lid members at both ends with a single union nut, and a slim casing heat exchanger. Therefore, the piping system can be reduced in size and size. Further, it is possible to ensure the sealing performance each time by tightening the union nut, and it is highly reliable over a long period of time as compared with a screw seal or an O-ring seal. Furthermore, since a simple means of tightening a single union nut is sufficient, unlike the connection structure by welding, on-site construction is easy, and on-site maintenance and inspection can be easily performed.
[0018]
Since no metal material such as a metal fastening member is used, the problem of metal elution and metal wear powder generation can be solved.
[0019]
By tightening the union nut, the entire outer periphery of the end portion of the tube can be pressed evenly, so that no accidental deformation of the tube or the lid member is eliminated. Therefore, the problem of creep or replacement of these members can be solved.
[0020]
Since the lid member can be easily removed from the end of the tube by loosening the union nut, it is possible to easily remove the stagnant material remaining in the tube.
[0021]
In addition, the heat exchanger intervening in the piping system of this piping system can maintain sufficient airtightness even when internal pressure is applied to the tube just by tightening the union nut and prevent fluid leakage. O-rings are not required, and all the structural members are molded with fluororesin, so that they can cope well with high temperature and highly corrosive chemicals, and can be applied and installed in a chemical resistant atmosphere.
[0022]
DETAILED DESCRIPTION OF THE INVENTION
A preferred embodiment of the present invention will be described with reference to the drawings.
[0023]
FIG. 1 is a schematic cross-sectional view showing the entire configuration of a semiconductor wafer (substrate) cleaning apparatus including a chemical liquid supply piping system which is an embodiment of the piping system according to the present invention. A is a cleaning chamber in which a wafer (substrate) W is installed and cleaned, and B is a chemical solution supply system that generates a cleaning solution having a desired concentration and supplies it to the cleaning chamber A. The chemical solution supply piping system B is connected to the chemical solution storage tank 100 in which the chemical solution is stored in the state of an undiluted solution, the chemical solution supply device 101 that supplies the chemical solution, and is connected to the chemical solution supply device 101. Provided at the downstream end of the supply flow channel pipe 102 so as to face the surface of the wafer W installed in the cleaning chamber A and the supply flow channel pipe 102 serving as a passage of the ultra pure water to be mixed. A pair of discharge nozzles 103 and 104 for supplying cleaning liquid to the surface and a control system 105 for adjusting various states such as the concentration and flow rate of the cleaning liquid supplied from the discharge nozzles 103 and 104 are provided.
[0024]
The chemical liquid supply apparatus 101 includes a chemical liquid supply pump 106, a connection pipe 107 that connects the supply flow path pipe 102 and the chemical liquid supply pump 106 to form a flow path, and a direct connection between the supply flow path pipe 102 and the connection pipe 107. And a capillary 108 to be connected. By driving the chemical solution supply pump 106, the chemical solution is discharged from the capillary 108 into the ultrapure water in the supply flow channel 102.
[0025]
The supply channel pipe 102 includes a flow rate adjusting unit 109 that adjusts the flow rate of ultrapure water that passes through the supply channel tube 102, and a concentration adjustment unit 110 that adjusts the concentration of the cleaning liquid that passes through the supply channel tube 102. , And a mixing means 111 that is disposed at a connection portion of the supply flow channel tube 102 with the capillary 108 and generates a rotational flow in the cleaning liquid and agitates it to make the cleaning liquid uniform.
[0026]
The control system 105 adjusts the supply amount of the chemical solution supplied from the chemical solution supply pump 106 to the ultrapure water, and also supplies a chemical solution supply control unit 112 that drives the flow rate adjustment unit 109 and a concentration control unit 113 that drives the concentration adjustment unit 110. It has. Then, the chemical liquid supply control means 112 and the concentration control means 113 are connected, and the result of the concentration control by the concentration control means 113 is fed back to the chemical liquid supply control means 112 to control the chemical liquid supply pump 106 to adjust the supply amount of the chemical liquid. Is done.
[0027]
The present invention is characterized in that the intervention of the heat exchanger in place of the pipeline in the chemical supply piping system B, and constitute the heat exchanger as follows.
[0028]
Figure 1 shows an embodiment in which intervene the heat exchanger 114 in the middle of the supply flow pipe 102 is a piping system of the chemical supply piping system B. As shown in FIG. 2, the heat exchanger 114 includes a fluid passing through the heat exchange tube 3 passed through the inside (heat exchange chamber) 2 of the casing 1, the inside of the casing 1, and the outside of the heat exchange tube 3. Heat exchange with the fluid passing between the two.
[0029]
As shown in FIGS. 2 and 3, the casing 1 includes a tube 4 that surrounds the outer periphery of the heat exchange tube 3, and a pair of lid members 5 that seal one end and the other end of the tube 4 in a sealing manner. , And a union nut 6 for fastening each lid member 5 to the end of the tube 4.
The tube 4 is formed into a cylindrical shape with a synthetic resin such as a PFA or PTFE fluororesin having excellent heat resistance and chemical resistance, or an antistatic fluororesin containing a conductive material. Similarly, a lid member 5 made of a synthetic resin such as a fluororesin is inserted and connected by tightening a union nut 6 made of a synthetic resin such as a fluororesin.
[0030]
The lid member 5 is formed to have a body wall part 7, a receiving part 8 that opens to one end of the body wall part 7, and a bottom wall part 9 that closes the other end of the body wall part 7. And as shown in FIG. 3, the 1st-3rd seal surfaces 10-12 are provided in the inside of the opening part 8 of the cover member 5. As shown in FIG. The first seal surface 10 is a taper that gradually increases in diameter toward the inside of the axis C of the lid member 5, that is, toward the outside in the direction of the axis C, inward from the entrance of the receiving portion 8 of the lid member 5. Consists of surfaces. The second seal surface 11 is formed at the entrance of the receiving port 8 by a tapered surface that intersects the axis C, that is, gradually increases in diameter toward the outside in the direction of the axis C. The third seal surface 12 is constituted by an annular groove portion 13 formed radially inward of the first seal surface 10 and in parallel with the axis C at the inner back of the receiving portion 8 of the lid member 5. A male screw 14 is formed on the outer periphery of the receiving portion 8 of the lid member 5.
[0031]
On the other hand, an inner ring 15 made of a synthetic resin such as a fluororesin is press-fitted into one end and the other end of the tube 4. As shown in FIG. 3, the inner ring 15 is press-fitted into the end portion of the tube 4, and a press-in portion 16 having an abacus cross-sectional shape that expands and expands the end portion into a cross-sectional mountain shape. It is formed in a sleeve shape having a protrusion 17 that is provided continuously and protrudes from the end of the tube 4. The press-fitting portion 16 having a mountain-shaped cross section is formed by sandwiching the end portion of the tube 4 in an inclined state between the outwardly tapered surface 18 on one slope portion and the second seal surface 11 on the other slope portion. The inwardly tapered surfaces 20 that form the seal portions 21 are formed. At the tip of the projecting portion 17, the projecting end surface 22 formed of a tapered surface that is in close contact with the first seal surface 10 to form the first seal portion 19, and the annular groove portion 13 are fitted. The cylindrical part 24 which forms the seal part 23 is formed. An inner diameter of the inner ring 15 is set to be the same as or substantially the same as the inner diameter of the tube 4 so that the fluid flows smoothly without stagnation.
[0032]
As shown in FIG. 3, the union nut 6 is formed with a female screw 25 screwed to the male screw 14 of the lid member 5 on the inner periphery thereof, and an annular flange 26 is projected inwardly at one end, An acute angle or right angle pressing edge portion 26 a is provided at the axially inner end of the inner peripheral surface of the annular flange portion 26.
[0033]
Then, the end portion of the tube 4 into which the inner ring 15 is press-fitted is inserted into the receiving portion 8 of the lid member 5, and the female screw 25 of the union nut 6 previously loosely fitted to the outer periphery of the end portion of the tube 4 is covered with the lid. The male screw 14 of the member 5 is screwed and tightened. Along with this tightening, the pressing edge portion 26a of the union nut 6 abuts on the diameter increasing root portion of the diameter expanding portion 27 of the tube 4 to press the inner ring 15 from the axial direction. As a result, as shown in FIG. 3, the protruding end surface 22 of the inner ring 15 is pressed against the first seal surface 10 of the lid member 5 to form the first seal portion 19, and the inward direction of the inner ring 15. The end of the tube 4 is sandwiched between the tapered surface 20 and the second seal surface 11 of the lid member 5 to form a second seal portion 21, and the cylindrical portion 24 of the inner ring 15 is annular. A third seal portion 23 is formed by press-fitting into the groove portion 13. These first to third seal portions 19, 21, 23 exhibit a highly reliable seal function.
[0034]
As shown in FIG. 2, the lid member 5 at one end of the tube 4 is connected to a connecting portion 29 a to which a heat exchange fluid introduction pipe 28 a, which is another pipe, is connected to the lid member 5 at the other end. Are each provided with a connecting portion 29b to which a lead-out piping 28b, which is another piping, is connected. That is, the connection portions 29a and 29b with other pipes are provided with an inlet port 30 for heat exchange fluid such as temperature control water on the trunk wall portion 7 of one lid member 5 and on the trunk wall portion 7 of the other lid member 5. An outlet port 31 is formed, the end of the heat exchange fluid introduction pipe 28a is formed in the inlet port 30, and the end of the heat exchange fluid outlet pipe 28b is made of the synthetic resin such as fluororesin in the outlet port 31, respectively. Are connected via an inner ring 33 made of synthetic resin such as fluororesin, and the heat exchange fluid flows through the inlet port 30, the heat exchange chamber 2 in the tube 4, and the outlet port 31 in this order. Yes.
[0035]
The internal structures of the inlet port 30 and the outlet port 31 are the same as the internal structure of the receiving port 8 of the lid member 5 (however, the diameter is different), and the heat exchange fluid introduction pipe 28a and the lead-out pipe 28b An inner ring 33 similar to the cross-sectional shape of the inner ring 15 at the end of the tube 4 is press-fitted into each end, and each of the inlet pipe 28a and outlet pipe 28b with respect to the inlet port 30 and outlet port 31 is inserted. Since the connection structure of the end portion is the same as the connection structure of the end portion of the tube 4 to the receiving port 8 of the lid member 5, the detailed description thereof is omitted. However, as a connection structure of each end of the heat exchange fluid introduction pipe 28 a and the outlet pipe 28 b to the inlet port 30 and the outlet port 31, the heat exchange fluid is connected to the inlet port 30 and the outlet port 31. It is also possible to adopt means such as welding each end of the introduction pipe 28a and the lead-out pipe 28b directly or by screw connection. That is, the connection portions 29a and 29b with other pipes may be connection means such as welding and screw connection.
[0036]
On the other hand, inside the tube 4 is passed a heat exchange tube 3 made of a coil tube made of synthetic resin such as fluorine resin through which a chemical solution passes, and both ends of the heat exchange tube 3 are opened in the bottom wall portion 9 of the lid member 5. It is led out from the outlet 34 and is connected in the middle of the supply flow path pipe 102 of the piping system of the chemical solution supply piping system B. A union nut 35 made of a synthetic resin such as a fluororesin is fitted on the lead-out end portion of the heat exchange tube 3, and the union nut 35 is fastened to a lead-out port 34 via a ferrule 36 made of a synthetic resin such as a fluororesin. Thus, the gap between the outlet 34 and the end of the heat exchange tube 3 is sealed.
[0037]
The heat exchanger configured as described above is a heat exchange fluid such as a temperature-controlled water that passes through the heat exchange tube 3, for example, a fluid such as a chemical solution and the outside of the heat exchange tube 3 in the cylindrical casing body 4. However, instead of passing a fluid such as a chemical solution inside the heat exchange tube 3 and a heat exchange fluid such as temperature-controlled water outside the heat exchange tube 3, It is also possible to pass a heat exchange fluid such as temperature-controlled water through the exchange tube 3 and a fluid such as a chemical solution outside the heat exchange tube 3.
[0038]
A lead-out port 34 for leading both ends of the heat exchange tube 3 to the outside of the casing 1 opens in the body wall portion 7 of the lid member 5, and an inlet port 30 and an outlet port 31 for a fluid such as a chemical solution are lids. It can also be provided on the bottom wall 9 of the member 5.
[0039]
The heat exchange tubes 3 to pass drug solution fluid or temperature regulating water such as thermal exchange fluid, in place of the coil tube, it consist of a single straight tube made of fluorine resin, or conventional, shown in Figure 11 It is also possible to use a plurality of straight tubes made of synthetic resin such as fluororesin as in the case of the heat exchanger.
[0040]
(Another embodiment of the heat exchanger casing)
The overall shape of the casing 1 of the heat exchanger, instead of forming the straight tube as in the above embodiments, applications such as U-shaped as shown in L shape or 5, as shown in FIG. 4 A form can be adopted. In this case, in the L-shaped casing 1 shown in FIG. 4 , two first and second tubes 4A and 4B, two first and second lid members 5A and 5B, one elbow-shaped fluororesin, etc. In the U-shaped casing 1 shown in FIG. 4 using a synthetic resin joining member 39, three first, second and third tubes 4A, 4B, 4C, two first and second lid members 5A, 5B and two elbow-shaped joining members 39A and 39B made of synthetic resin such as an elbow-shaped fluororesin are used.
[0041]
In the L-shaped casing 1 shown in FIG. 4 , the other end portions of the first and second tubes 4A and 4B in which the first and second lid members 5A and 5B are connected to the respective one end portions by the first union nut 6A. The two are connected by one elbow-shaped joining member 39 and a pair of second union nuts 40B. In this case, for the connection structure for connecting the first and second lid members 5A and 5B to the respective one end portions of the first and second tubes 4A and 4B, the end portion and the lid of the tube 4 of each of the above-described embodiments are used. The configuration is the same as in the case of the connection structure with the member 5.
[0042]
The joint member 39 is opened at both ends thereof so that the receiving ports 41 communicate with each other orthogonally. The internal structure of each receiving port 4 is the same as the internal structure of the receiving portion 8 of the lid member 5, and Since the inner ring 15 having the same cross-sectional shape as the inner ring 15 at each one end is press-fitted into each other end of each of the first and second tubes 4A and 4B, the first end is inserted into the receiving port 41 at one end of the joining member 39. The other end of the tube 4A and the other end of the second tube 4B at the receiving port 41 at the other end are the first and second ends of the first and second tubes 4A and 4B, respectively. It connects via the connection structure similar to the case of the connection structure with respect to the receiving part 8 of lid member 5A, 5B. The fluid tube 3 is bent at a right angle inside the joining member 39.
[0043]
In the U-shaped casing 1 shown in FIG. 5 , a third member is interposed between the other end portions of the first and second tubes 4 </ b> A and 4 </ b> B in which the lid member 5 is connected to one end portion by a first union nut 6. Are connected by two elbow-shaped joining members 39 and a pair of second union nuts 40B. Even in this case, the connection structure for connecting the receiving portion 8 of the first and second lid members 5 to the respective one end portions of the first and second tubes 4A and 4B is the end of the tube 4 of each of the above-described embodiments. The configuration is the same as in the case of the connection structure between the cover and the lid member 5. And the connection structure which connects the receptacle 41 of each joining member 39 with respect to each other end part of 1st, 2nd tubes 4A and 4B, and each joining member 39 with respect to the both ends of 3rd tube 4C The connection structure for connecting the receiving port 41 is connected in the same manner as in the case of the connecting structure for the receiving port portion 8 of the first and second lid members 5 at the respective one end portions of the first and second tubes 4A and 4B. The The fluid tube 3 is bent at a right angle inside each joining member 39.
Note that the casing 1 can also be configured in a combination of the L-shaped casing 1 in FIG. 4 and the U-shaped casing 1 in FIG. 5 .
[0044]
Thus, by forming the casing 1 of the heat exchanger into an L shape or a U shape, a compact piping system can be assembled by effectively utilizing the dead space of the piping. In addition, it is advantageous in that it can be made into a shape that can meet the demand for modification of the piping system, such as when a new heat exchanger is installed in the existing piping.
[0045]
(Another embodiment of the seal part)
As the seal portion formed between the end portion of the tube 4 and the receiving portion 8 of the lid member 5, in addition to the first and second seal portions 19 and 21, as in the embodiment shown in FIG. The sealing performance can be more reliably improved by adding the third seal portion 23 formed by the cylindrical portion 24 of the inner ring 15 and the annular groove portion 13 of the lid member 5, but is not necessarily limited to this. Absent. In addition, for example, as shown in FIG. 6 , only the first and second seal portions 19 and 21 are formed and the third seal portion 23 is omitted, that is, the annular groove portion 13 in the inner part of the lid member 5. The inner ring 15 may not be provided with the cylindrical portion 24. In this case, the first sealing surface 10 provided in the inner part of the lid member 5 is gradually contracted toward the axis C in the opposite direction to the second sealing surface 11, that is, outward in the direction of the axis C. The taper surface is formed with a diameter.
[0046]
Further, as shown in FIG. 7 , a seal surface 42 formed of a tapered surface having a diameter larger than the inner diameter of the tube 4 is formed on the outer periphery of the end portion on the distal end side of the receiving portion 8 of the lid member 5. A male screw 14 having a diameter larger than the outer diameter of the seal surface 42 is formed on the rear outer periphery. On the other hand, the end portion of the tube 4 is flared to form the enlarged diameter portion 43. Thus, the enlarged diameter portion 43 at the end of the tube 4 is press-fitted onto the seal surface 42 of the lid member 5. Then, the female screw 25 of the union nut 6 fitted on the tube 4 is screwed and tightened to the male screw 14 of the lid member 5, and the pressing edge portion 26 a of the annular flange portion 26 of the union nut 6 is applied to the outside of the tube 4. The seal portion 44 can also be formed by bringing the inner peripheral surface of the enlarged-diameter portion 43 into contact with the seal surface 42 of the receiving portion 8 from the axial direction in close contact.
[0047]
As shown in FIG. 8 , the inner ring 45 having a circular arc shape made of a synthetic resin such as a fluororesin is press-fitted into the end portion of the tube 4 to expand and expand the end portion of the tube 4 into a cross-sectional mountain shape. The end of the tube 4 together with the inner ring 45 and the inner periphery of the receiving portion 8 of the lid member 5 are tapered by screwing and tightening the union nut 6 screwed into the male screw 14. A seal structure may be used in which the seal portion 47 is formed by being pressed against the seal surface 46 and brought into close contact therewith.
[0048]
Further, as shown in FIG. 9 , a union in which an outer ring 48 is fitted into the end portion of the tube 4, a distal end portion of the tube 4 is folded back on the outer surface of the outer ring 48, and is screwed into the male screw 14 of the lid member 5. By screwing and tightening the nut 6, the end portion of the tube 4 together with the outer ring 48 is pressed against the seal surface 49 in the receiving portion 8 of the lid member 5 to bring the seal portion 50 into close contact. It may be a seal structure of forming.
[0049]
Needless to say, the present invention can be similarly applied to various piping systems other than the chemical solution supply piping system of the semiconductor manufacturing apparatus.
[Brief description of the drawings]
FIG. 1 is a schematic cross-sectional view showing an overall configuration of a semiconductor wafer (substrate) cleaning apparatus including a chemical liquid supply piping system which is an example of a piping system of the present invention.
FIG. 2 is a sectional view of the heat exchanger in FIG.
3 is an enlarged cross-sectional view of a connection structure between a tube end portion and a lid member of the heat exchanger of FIG. 2;
FIG. 4 is a cross-sectional view showing another example of the casing of the heat exchanger .
FIG. 5 is a cross-sectional view showing still another example of the casing of the heat exchanger .
FIG. 6 is a cross-sectional view showing another example of the seal portion of the heat exchanger .
FIG. 7 is a cross-sectional view showing still another example of the seal portion of the heat exchanger .
FIG. 8 is a cross-sectional view showing still another example of the seal portion of the heat exchanger .
FIG. 9 is a cross-sectional view showing still another example of the seal portion of the heat exchanger .
10 is a front view of a heat exchanger of the prior art.
11 is a cross-sectional view of the heat exchanger of Figure 10.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Casing 3 Heat exchange tube 4,4A, 4B, 4C Tube 5,5A, 5B Lid member 6 1st union nut 8 Receiving part 10,11,12,42,46,49 Sealing surface 13 Annular groove 15 Inner ring 16 Press-fit portion 17 Protruding portion 19, 21, 23, 44, 47, 50 Seal portion 20 Inwardly tapered surface 22 Protruding end surface 24 Cylindrical portion 28a, 28b Pipes 29a, 29b for introducing and discharging fluids 39, 39A, 39B Joining member 40 Second union nut

Claims (7)

配管系の途中に熱交換器が介入されている半導体製造装置等の配管システムであって、
前記熱交換器はケーシングの内部に通された熱交換チューブを通過する流体と、ケーシングの内部と熱交換チューブの外部との間を通過する流体との間で熱交換を行うものであり、
前記ケーシングが、
前記熱交換チューブの外周を包囲する合成樹脂製のチューブと、このチューブの一端部及び他端部をそれぞれ受け入れる受口部、及びこの受口部内に設けられた少なくとも1つのシール面、前記熱交換チューブの両端部を外部へ導出させるための導出口、前記ケーシングの内部と前記熱交換チューブの外部との間を通過する流体の導入用及び導出用の配管が接続される接続部を備えた1対の合成樹脂製の蓋部材と、
前記チューブの一端部及び他端部にそれぞれ外嵌されるとともに前記蓋部材の一端部に螺合される合成樹脂製のユニオンナットと、
前記ユニオンナットが前記蓋部材の一端部への螺進による締め付けにより前記チューブをこれの外側から押圧し、この押圧作用により前記チューブの端部と前記蓋部材のシール面とが密着することにより形成された少なくとも1箇所のシール部と、
を備え、前記熱交換チューブはその両端部が前記ケーシングの一対の蓋部材の各導出口から導出されて前記ケーシングに貫通していることを特徴とする、半導体製造装置等の配管システム。
A piping system such as a semiconductor manufacturing apparatus in which a heat exchanger is interposed in the middle of the piping system,
The heat exchanger performs heat exchange between a fluid passing through a heat exchange tube passed through the inside of the casing and a fluid passing between the inside of the casing and the outside of the heat exchange tube,
The casing is
A synthetic resin tube surrounding the outer periphery of the heat exchange tube, a receiving portion for receiving one end portion and the other end portion of the tube, and at least one sealing surface provided in the receiving portion, the heat exchange 1 having a lead-out port for leading both ends of the tube to the outside, and a connection part to which piping for introducing and leading out the fluid passing between the inside of the casing and the outside of the heat exchange tube is connected A pair of synthetic resin lid members;
A synthetic resin union nut that is externally fitted to one end and the other end of the tube and screwed to one end of the lid member;
The union nut is formed by pressing the tube from the outside by tightening by screwing to one end of the lid member, and the end of the tube and the sealing surface of the lid member are brought into close contact by the pressing action. At least one sealed portion,
A piping system for a semiconductor manufacturing apparatus or the like, wherein both ends of the heat exchange tube are led out from the outlets of the pair of lid members of the casing and penetrate the casing .
前記シール部が、前記蓋部材の受口部の入口より内奥に、該蓋部材の軸線方向の外方に向けて漸次拡径するテーパ面により構成されるシール面と、前記チューブの端部に該端部を断面山形状に拡径膨出させるように圧入されたインナーリングの、前記チューブの端部から突出する突出部の先端に形成したテーパ面からなる突出端面との密着により形成されている、請求項1に記載の半導体製造装置等の配管システム。  The seal portion is formed by a taper surface that gradually increases in diameter toward the outer side in the axial direction of the lid member inward from the entrance of the receiving portion of the lid member, and an end portion of the tube The inner ring press-fitted so as to expand the diameter of the end portion into a cross-sectional mountain shape is formed by close contact with a protruding end surface formed of a tapered surface formed at the tip of the protruding portion protruding from the end portion of the tube. A piping system for a semiconductor manufacturing apparatus or the like according to claim 1. 前記シール部が、前記蓋部材の受口部の入口に、該蓋部材の軸線に対して交差するテーパ面により構成されたシール面と、前記チューブの端部に該端部を断面山形状に拡径膨出させるように圧入されたインナーリングの圧入部の斜面部に形成された内向きテーパ面との間で前記チューブの端部を傾斜状態に挟持してシール部を形成している、請求項1又は2に記載の半導体製造装置等の配管システム。  The sealing portion has a sealing surface formed by a tapered surface intersecting the axis of the lid member at the inlet of the receiving portion of the lid member, and the end portion of the tube has a mountain-shaped cross section. The seal portion is formed by sandwiching the end portion of the tube in an inclined state with an inwardly tapered surface formed on the slope portion of the press-fitting portion of the inner ring press-fitted so as to expand the diameter, A piping system for a semiconductor manufacturing apparatus or the like according to claim 1 or 2. 前記シール部が、蓋部材の受口部の内奥の前記シール面よりも径方向外方に蓋部材の軸線と平行に形成された環状溝部に、前記チューブの端部に圧入されたインナーリングの突出部の先端に形成した円筒部を嵌入してシール部を形成している、請求項2又は3に記載の半導体製造装置等の配管システム。  An inner ring in which the seal portion is press-fitted into the end portion of the tube in an annular groove portion formed in parallel with the axis of the lid member outward in the radial direction from the seal surface inside the receiving portion of the lid member The piping system of a semiconductor manufacturing apparatus or the like according to claim 2 or 3, wherein a cylindrical portion formed at the tip of the projecting portion is fitted to form a seal portion. 配管系の途中に熱交換器が介入されている半導体製造装置等の配管システムであって、
前記熱交換器はケーシングの内部に通された熱交換チューブを通過する流体と、ケーシングの内部と熱交換チューブの外部との間を通過する流体との間で熱交換を行うものであり、
前記ケーシングが、互いに直角に配され、かつ前記熱交換チューブの外周を包囲する合成樹脂製の第1,2のチューブを備えるとともに、第1,2のチューブの各一端部に合成樹脂製の蓋部材を合成樹脂製の第1のユニオンナットで接続し、第1,2のチューブの他端部同士を、1個のエルボ形状の合成樹脂製の接合部材及び1対の合成樹脂製の第2のユニオンナットで接続しており、
前記蓋部材は前記第1,2のチューブの各一端部を受け入れる受口部、及びこの受口部内に設けられた少なくとも1つのシール面、前記熱交換チューブの両端部を外部へ導出させるための導出口、前記ケーシングの内部と前記熱交換チューブの外部との間を通過する流体の導入用及び導出用の配管が接続される接続部を備えており、
前記第1のユニオンナットは、前記第1,2のチューブの各一端部に外嵌されるとともに前記蓋部材の一端部に螺合され、前記蓋部材の一端部への螺進による締め付けにより前記第1,2の各チューブをこれの外側から押圧し、この押圧作用により前記第1,2のチューブの各一端部と前記蓋部材のシール面とを密着させて少なくとも1箇所のシール部を形成しており、
前記接合部材は、両端に受口を互いに直交状に連通するよう形成し、一端の受口に第1のチューブの他端部が、また他端の受口に第2のチューブの他端部が、それぞれ、前記第1,2の各チューブの一端部の蓋部材の受口に対する接続構造の場合と同様の接続構造を介して接続され、前記熱交換チューブは前記接合部材の内部で直角に曲げられかつこの熱交換チューブの両端部が前記ケーシングの一対の蓋部材の各導出部から導出されて前記ケーシングに貫通していることを特徴とする、半導体製造装置等の配管システム。
A piping system such as a semiconductor manufacturing apparatus in which a heat exchanger is interposed in the middle of the piping system,
The heat exchanger performs heat exchange between a fluid passing through a heat exchange tube passed through the inside of the casing and a fluid passing between the inside of the casing and the outside of the heat exchange tube,
The casing includes first and second synthetic resin tubes that are arranged at right angles to each other and surround the outer periphery of the heat exchange tube, and a synthetic resin lid at each end of the first and second tubes. The members are connected by a first union nut made of synthetic resin, and the other ends of the first and second tubes are connected to one elbow-shaped synthetic resin joining member and a pair of synthetic resin second members. Is connected with a union nut,
The lid member receives a first end of each of the first and second tubes, at least one sealing surface provided in the first receiving portion, and leads both ends of the heat exchange tube to the outside. A lead-out port, and a connecting portion to which piping for introducing and leading out the fluid passing between the inside of the casing and the outside of the heat exchange tube is connected ;
The first union nut is externally fitted to one end of each of the first and second tubes and screwed to one end of the lid member, and is tightened by screwing into one end of the lid member. Each of the first and second tubes is pressed from the outside thereof, and the one end portion of the first and second tubes and the sealing surface of the lid member are brought into close contact with each other by the pressing action to form at least one seal portion. And
The joint member is formed so that the receiving ports communicate with each other at both ends so as to be orthogonal to each other, the other end of the first tube is at the receiving port at one end, and the other end of the second tube is at the receiving port at the other end. Are connected via a connection structure similar to the connection structure of the lid member at one end of each of the first and second tubes, and the heat exchange tube is perpendicular to the inside of the joining member. A piping system for a semiconductor manufacturing apparatus or the like, characterized in that both ends of the heat exchange tube are bent and led out from the lead-out portions of the pair of lid members of the casing and penetrate the casing .
配管系の途中に熱交換器が介入されている半導体製造装置等の配管システムであって、
前記熱交換器はケーシングの内部に通された熱交換チューブを通過する流体と、ケーシングの内部と熱交換チューブの外部との間を通過する流体との間で熱交換を行うものであり、
前記ケーシングが、互いに平行に対向配備される合成樹脂製の第1,2のチューブと、第1,2のチューブの各一端部に合成樹脂製の第1のユニオンナットで接続した合成樹脂製の蓋部材と、第1,2のチューブの他端部同士間に2個のエルボ形状の合成樹脂製の接合部材及び1対の合成樹脂製の第2のユニオンナットで接続した合成樹脂製の第3のチューブとを備え、前記第1,第2,第3のチューブは前記熱交換チューブの外周を包囲しており、
前記蓋部材は前記第1,2のチューブの各一端部を受け入れる受口部、及びこの受口部内に設けられた少なくとも1つのシール面、前記熱交換チューブの両端部を外部へ導出させるための導出口、前記ケーシングの内部と前記熱交換チューブの外部との間を通過する流体の導入用及び導出用の配管が接続される接続部を備えており、
前記第1のユニオンナットは、前記第1,2のチューブの各一端部に外嵌されるとともに前記蓋部材の一端部に螺合され、前記蓋部材の一端部への螺進による締め付けにより前記第1,2の各チューブをこれの外側から押圧し、この押圧作用により前記第1,2のチューブの各一端部と前記蓋部材のシール面とを密着させて少なくとも1箇所のシール部を形成しており、
前記接合部材は、両端に受口を互いに直交状に連通するよう形成し、第1,2のチューブの各他端部に対して各接合部材の受口を接続する接続構造、および第3のチューブの両端部に対して各接合部材の受口を接続する接続構造は、それぞれ、前記第1,2のチューブの各一端部の蓋部材の受口に対する接続構造の場合と同様に接続され、前記熱交換チューブは各接合部材の内部で直角に曲げられかつかつこの熱交換チューブの両端部が前記ケーシングの一対の蓋部材の各導出部から導出されて前記ケーシングに貫通していることを特徴とする、半導体製造装置等の配管システム。
A piping system such as a semiconductor manufacturing apparatus in which a heat exchanger is interposed in the middle of the piping system,
The heat exchanger performs heat exchange between a fluid passing through a heat exchange tube passed through the inside of the casing and a fluid passing between the inside of the casing and the outside of the heat exchange tube,
Synthetic resin first and second tubes made of synthetic resin facing each other in parallel with each other, and a synthetic resin first union nut connected to one end of each of the first and second tubes. Synthetic resin first connected by two elbow-shaped synthetic resin joining members and a pair of synthetic resin second union nuts between the lid member and the other ends of the first and second tubes. 3 and the first, second and third tubes surround the outer periphery of the heat exchange tube ,
The lid member receives a first end of each of the first and second tubes, at least one sealing surface provided in the first receiving portion, and leads both ends of the heat exchange tube to the outside. A lead-out port, and a connecting portion to which piping for introducing and leading out the fluid passing between the inside of the casing and the outside of the heat exchange tube is connected ;
The first union nut is externally fitted to one end of each of the first and second tubes and screwed to one end of the lid member, and is tightened by screwing into one end of the lid member. Each of the first and second tubes is pressed from the outside thereof, and the one end portion of the first and second tubes and the sealing surface of the lid member are brought into close contact with each other by the pressing action to form at least one seal portion. And
The connecting member is formed so that the receiving ports are communicated with each other in an orthogonal manner at both ends, and a connecting structure for connecting the receiving ports of the connecting members to the other end portions of the first and second tubes, and a third The connection structure for connecting the receiving port of each joining member to both ends of the tube is connected in the same manner as in the case of the connecting structure for the receiving port of the lid member at each one end of the first and second tubes , The heat exchange tube is bent at right angles inside each joining member, and both ends of the heat exchange tube are led out from the lead-out portions of the pair of lid members of the casing and penetrate the casing. Piping system for semiconductor manufacturing equipment.
前記チューブ、前記蓋部材、および前記ユニオンナットが全てフッ素樹脂からなる、請求項1ないし6のいずれか1項に記載の半導体製造装置等の配管システム。  The piping system for a semiconductor manufacturing apparatus or the like according to any one of claims 1 to 6, wherein the tube, the lid member, and the union nut are all made of a fluororesin.
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JP2003139222A JP3984928B2 (en) 2003-05-16 2003-05-16 Piping system for semiconductor manufacturing equipment
EP04011193A EP1477717B1 (en) 2003-05-16 2004-05-11 Tube device, and piping system including the tube device
DE602004010950T DE602004010950T2 (en) 2003-05-16 2004-05-11 Tubular device and conduit system with such a device
TW093113238A TW200427504A (en) 2003-05-16 2004-05-11 Tube device, and piping system including the tube device
KR1020040032909A KR101042843B1 (en) 2003-05-16 2004-05-11 Tube device and plumbing system having the tube device
US10/844,881 US7314239B2 (en) 2003-05-16 2004-05-13 Tube device, and piping system including the tube device
CN2004100432514A CN1550747B (en) 2003-05-16 2004-05-14 Tube device, and piping system including the tube device
US11/938,804 US7695026B2 (en) 2003-05-16 2007-11-13 Tube device, and piping system including the tube device
KR1020110005877A KR101097621B1 (en) 2003-05-16 2011-01-20 Tube device and plumbing system having the tube device

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KR101249721B1 (en) 2012-09-05 2013-04-02 주식회사 화승알앤에이 Dual pipe for heat exchange
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