JP2004340304A

JP2004340304A - Piping system for semiconductor manufacturing machine, etc.

Info

Publication number: JP2004340304A
Application number: JP2003139222A
Authority: JP
Inventors: Yutaka Okamoto; 裕岡元; Tatsuya Fujii; 達也藤井
Original assignee: Nippon Pillar Packing Co Ltd
Current assignee: Nippon Pillar Packing Co Ltd
Priority date: 2003-05-16
Filing date: 2003-05-16
Publication date: 2004-12-02
Anticipated expiration: 2023-05-16
Also published as: JP3984928B2

Abstract

PROBLEM TO BE SOLVED: To provide a piping system for a semiconductor manufacturing machine, etc., which piping system has a few components, and is inexpensive, and has a tube device having a compact and highly reliable sealing structure. SOLUTION: A casing 1 comprises a fluorocarbon resin tube 4 surrounding the outer periphery of a fluid tube 3, a pair of fluorocarbon resin lid members 5 having a receiving portion 8 for receiving one terminal and the other terminal of the tube 4 respectively and at least one sealing surface 10 provided in the receiving portion and connecting portions 29a, 29b to other piping 28a, 28b, a fluorocarbon resin union nut 6 which is fitted on the terminal of the tube 4 and is screwed into one end of the lid member 5, and at least one seal member 19 formed by bringing the terminal of the tube 4 into close contact with the seal surface 10 of the lid member 5 through pushing the tube 4 from outside through fastening the union nut 6 to one end of the lid member 5. COPYRIGHT: (C)2005,JPO&NCIPI

Description

【０００１】
【発明の属する技術分野】
本発明は、半導体製造装置や液晶装置、化学薬品製造装置、食品生産ライン等で扱われる流体の配管システムに関する。
【０００２】
【従来の技術】
半導体製造装置の配管システムにおいて、半導体デバイスの高集積化に伴い、例えば、半導体ウェットプロセスのソリュ−ションの一つである各種洗浄装置における洗浄工程数は益々増加の一途を辿り、洗浄の清浄度もますます完全性を要求されている。このため、清浄装置に超純水や薬液からなる洗浄液を清浄に供給する技術確立の要求は益々厳しくなっている。現在、薬液は薬液供給システムのうち、調合、希釈、輸送のプロセスで汚染を受けているが、ウェハクリーン度としては、サブクォーターミクロン時代に対応する必要がある。薬液供給システムとしては、大量調整方式が知られている。薬液は受け入れ槽から希釈調合槽にポンプ輸送され、所要の組成や濃度に調整され、供給槽から長距離配管によってポンプ輸送され、ウェットステーションの貯槽にポンプ輸送され、さらにポンプとフィルターを経て洗浄槽に供給される方式である（例えば、特許文献１や特許文献２参照。）
【０００３】
この種の半導体製造装置等の配管システムに適用される各種デバイスのうちの一つとして、たとえば、図１６、図１７に示すような熱交換器がある。この熱交換器は、熱交換チューブ７０が通されるケーシング７１が充分なシール性を確保して或る程度の内圧に耐えられるようにするために、ケーシング７１の本体を構成する円筒状のシェル７２の外周に複数本のタイロッドや通しボルト等の金属製締結部材７３をその長手方向に沿うよう互いに平行に配するとともに、該金属製締結部材７３の両端部をシェル７２の両端部に配される蓋部材７４に挿通して、該蓋部材７４から突出する金属製締結部材７３の両端の雄ねじ部にナット７５を締め込むことによってシェル７２の両端部と蓋部材７４との突き合せ面間が密着状にシールされ、これによりケーシング７１が密封状に構成されるといったものである（例えば、特許文献３参照。）。また、前記シェル７２の両端部と蓋部材７４との突き合せ面間にはシール部材であるＯリング７６が介在されている（前出の特許文献３参照。）。
【０００４】
【特許文献１】
特開２０００−２６５９４５号公報
【特許文献２】
特開平１１−７０３２８号公報
【特許文献３】
特開平１０−１６０３６２号公報
【０００５】
【発明が解決しようとする課題】
しかるに、大量調整方式の上記薬液供給システムでは、貯槽・配管・継手・ポンプ・熱交換器・フローメーター・フィルター・脱気モジュール等全てのデバイスの構成部品の各種接液部などからのパーティクルやメタルコンタミネーションの発生が問題視されている。
他方、半導体ウェハ等を洗浄する基板洗浄装置の高速洗浄化に伴う装置全体の大規模化や複雑化が問題視されており、特に、各種デバイスが配備されてなる配管システムはクリーンルームに設置される関係から小型化、コンパクト化が要求される。
【０００６】
各種デバイスにはメタル材を使用する場合が多く、メタルコンタミネーションを発生させていると共に、デバイス形状が固定化されていたため、配管システム設計の自由度が小さく、配管のデッドスペースが生じ易く、配管システムが大型になりがちであり、洗浄装置等の機械装置も含めてコンパクト化や低廉化に限度があった。また、既成の配管システムの改造要求に対し、柔軟に対応可能な形状のデバイスが存在せず、配管システム改造にはスペース上の制約が多かった。
【０００７】
また、シェル７２の両端部と蓋部材７４とが複数本のタイロッドや通しボルト等の金属製締結部材７３とナット７５との締め込みによってシールされる上記熱交換器（デバイス）では、シールするための部品点数が多く、コストアップ、ケーシング構造の大型化を招くばかりか、金属製締結部材７３は、硫酸雰囲気などに晒される場所に配置された場合、腐食しやすく、また金属汚染が避けられないため、近年、とくに半導体業界では使用制限の要求が高い。
【０００８】
また、金属製締結部材７３の締付けの緩みに対して、金属製締結部材７３を定期的に増締めする必要があるが、通常金属製締結部材７３は複数本、少なくとも４本以上であるため、各金属製締結部材７３の増締め度合いにばらつきが生じ易く、このばらつきにより蓋部材７４やシェル７２の変形を招くおそれがあった。蓋部材７４やシェル７２の変形が生じると、シェル７２の端部と蓋部材７４との間にねじれや歪みが生じるため、局部的な応力集中が生じてクリープの進行を助長する問題がある。また、金属製締結部材７３の金属製タイロッドと金属製タイロッドシースとの中心軸が一致せず、両者が擦れ合って摺動抵抗が増大し、かつ、金属粉を含む摩耗粉の発生原因となるという問題もあった。さらに、シェル７２や蓋部材７４の変形が生じた場合、これらの部材交換が必要となるが、これらの部材は通常切削品であり、比較的高価でもあるため、ケーシング構造の交換を行ってデバイス要素（熱交換チューブ７０）を継続利用するという再利用が難しい構造でもあった。
【０００９】
シェル７２の両端部と蓋部材７４との突き合せ面間にシール部材としてＯリング７６を介在させる接続構造の上記熱交換器では、Ｏリング７６を使用するため、耐蝕性や使用温度範囲に制限がある。例えば、Ｏリング７６に接する空間には、高温の薬液を連通させることができない。また、Ｏリング７６の発塵による汚染が問題となることもある。したがって、近年、半導体業界ではこのようなＯリング７６の使用制限の要求が高い。
【００１０】
また、この種熱交換器が、薬液等に使用された場合、そのシェル７２や蓋部材７４等の構成部材には耐腐食性に優れるＰＴＦＥやＰＦＡ等のフッ素樹脂が使用されることが多いが、フッ素樹脂は、潤滑性が高いため、シェル７２と蓋部材７４との間の接続部が配管の震動や熱の影響でクリープし、これによりタイロッドや通しボルト等金属製締結部材７３の緩みが発生し、シェル７２の両端の接続部から流体漏れが発生する問題があった。
【００１１】
シェル７２と蓋部材７４との間のケーシング接続構造としては、その他に、ネジシールや溶接が採用されることがあるが、あまり効果的ではない。すなわち、単なるネジによる接続シール構造では、高いシール性を得ることができず、耐圧性が充分でなく、かつクリープによる漏れが生じ易い。また溶接は、一般的に熟練技術を必要とし、容易な作業ではないため、生産効率が低いとともに、現場作業性が悪く、現場での保守・点検が困難であるという問題がある。
【００１２】
本発明は、このような諸問題点を解決するためになされたものであり、その目的とするところは、金属製締結部材等の金属材を使用しないで、全ての構成部材を合成樹脂製のものにすることを可能にすることによりメタル溶出や金属摩耗粉発生の問題を解消できる半導体製造装置等の配管システムを提供することにある。
また、本発明の目的は、各種デバイスのスリム化、配管システムの小型化、コンパクト化を図れる半導体製造装置等の配管システムを提供することにある。
さらに、本発明の目的は、タイロッドや通しボルト等の金属製締結部材、及びＯリングを用いることなく、部品点数の減少、コスト低減を図ることができるとともに、耐圧性の高いケーシング構造及び信頼性の高いシール構造をもつチューブデバイスを備える半導体製造装置等の配管システムを提供することにある。
【００１３】
また本発明の他の目的は、その構成部材を全てフッ素樹脂で構成しても高いシール性を確保できるとともに、耐薬品性雰囲気への適用、設置が可能となるチューブデバイスを備える半導体製造装置等の配管システムを提供することにある。
【００１４】
【課題を解決するための手段】
本発明は、配管系の途中に、ケーシングにデバイス要素を配備してあるチューブデバイスが介入されている半導体製造装置等の配管システムであって、
前記ケーシングが、合成樹脂製のチューブと、このチューブの一端部及び他端部をそれぞれ受け入れる受口部及びこの受口部内に設けられた少なくとも１つのシール面を備えた１対の合成樹脂製の蓋部材と、前記チューブの一端部及び他端部にそれぞれ外嵌されるとともに前記蓋部材の一端部に螺合される合成樹脂製のユニオンナットと、前記ユニオンナットが前記蓋部材の一端部への螺進による締め付けにより前記チューブをこれの外側から押圧し、この押圧作用により前記チューブの端部と前記蓋部材のシール面とが密着することにより形成された少なくとも１箇所のシール部と、を備えていることに特徴を有するものである。
【００１５】
この場合において、前記チューブ、前記蓋部材、および前記ユニオンナットは全て耐熱性、耐薬品性に優れるフッ素樹脂や導電性物質を含有する帯電防止フッ素樹脂で成形することができる。
また、前記デバイス要素としては次のようなものが挙げられる。たとえば、前記デバイス要素は前記ケーシング内に通されたフッ素樹脂製の熱交換チューブ、および前記蓋部材に備えられた、前記ケーシングの内部と前記熱交換チューブの外部との間を通過する流体の導入用及び導出用の配管が接続される接続部とすることで、熱交換器とすることができる。また、前記デバイス要素は前記ケーシング内に収容されたフィルター部材とすることで、フィルターデバイスとすることができる。また、前記デバイス要素は前記チューブの両端の蓋部材に組み込まれた超音波式流量計用の超音波発振器及び超音波受信器とすることで、超音波式流量計とすることができる。また、前記デバイス要素は前記蓋部材に組み込まれたエアー抜き用のバルブとすることで、脱気デバイスとすることができる。そのほかに、前記デバイス要素は前記チューブ内に通されたガス透過性チューブ、および蓋部材に設けられた脱気口とすることで、脱気モジュールとすることができる。さらに、前記デバイス要素は前記チューブ内に通されたガス透過性チューブ、および前記蓋部材に設けられた溶解性ガス供給口とすることでガス溶解デバイスとすることができる。
【００１６】
【発明の作用効果】
上記構成の配管システムによれば、配管系の途中に介入されるチューブデバイスがユニオンナットを蓋部材の一端部に締め付けるだけの簡単な操作でチューブの端部と蓋部材のシール面とを密着させるシール部を介して確実に密封することができる。したがって、従来のようにタイロッドや通しボルト等の金属製締結部材及びＯリングを用いることなく、部品点数を少なくして、安価に且つコンパクトで耐圧性の高いケーシング構造及び信頼性の高いシール構造のチューブデバイスを得ることができる。
【００１７】
チューブデバイスは、従来のケーシング接続構造のようにタイロッドや通しボルトを使用しない耐圧シール構造で、且つスリムなケーシング構造にすることができ、また単一のユニオンナットによる増締めによりシール性を均一に確保することが可能である。すなわち、チューブの両端部の蓋部材との接続部を単一のユニオンナットでシールするだけで、タイロッドや通しボルトに比べて信頼性の高いシール構造が得られ、しかもスリムなケーシングのチューブデバイスでもって配管システムの小型化、コンパクト化を図ることができる。また、ユニオンナットの増締めによりシール性をその都度確保することが可能であって、ネジシールやＯリングシールと比較しても長期にわたり信頼性の高いものとなる。さらに、単一のユニオンナットを増締めするという簡単な手段で足りるため、溶着による接続構造と異なり現場施工が容易であり、現場での保守・点検も容易に行える。
【００１８】
金属製締結部材等の金属材を一切使用しないので、メタル溶出や金属摩耗粉発生の問題を解消できる。
【００１９】
ユニオンナットの締め付けによればチューブの端部の外側全周を均等に押圧することができるため、チューブや蓋部材の不慮の変形を招くようなことが無くなる。したがって、これら部材のクリープや交換の問題を解消できる。
【００２０】
ユニオンナットの締付けを緩めることによりチューブの端部から蓋部材を簡単に取り外すことができるため、チューブ内に滞留する滞留物の除去が容易に行える。
【００２１】
また、この配管システムの配管系に介入されるチューブデバイスは、ユニオンナットの締付けによるだけでチューブに内圧が加わっても十分気密を保つことができて流体漏れを防止できるので、従来のようにＯリングを使用しなくて済み、全ての構成部材をフッ素樹脂で成形することで、高温、腐蝕性の強い薬液にもよく対応でき、耐薬品性雰囲気への適用、設置が可能となる。
【００２２】
【発明の実施の形態】
本発明の好適な実施形態を図面に基づき説明する。
【００２３】
図１は本発明に係る配管システムの一態様例である薬液供給配管システムを含む半導体ウェハ（基板）洗浄装置の全体構成を示す概略断面図である。Ａはウェハ（基板）Ｗが設置されて洗浄される洗浄チャンバー、Ｂは所望濃度の洗浄液を生成して洗浄チャンバーＡへ供給する薬液供給システムである。薬液供給配管システムＢは、薬液が原液の状態で貯蔵される薬液貯蔵タンク１００と、薬液貯蔵タンク１００と連結され、薬液供給を行う薬液供給装置１０１と、薬液供給装置１０１と連結され、薬液と混合する超純水の通路となる供給流路管１０２と、洗浄チャンバーＡ内に設置されるウェハＷの表面と対向するように供給流路管１０２の下流側端部に設けられ、ウェハＷの表面に洗浄液を供給する１対の吐出ノズル１０３，１０４と、吐出ノズル１０３，１０４から供給する洗浄液の濃度や流量等の各種状態を調節するための制御系１０５とを備えて構成されている。
【００２４】
薬液供給装置１０１は、薬液供給ポンプ１０６と、供給流路管１０２と薬液供給ポンプ１０６とを連結して流路を形成する連結管１０７と、連結管１０７内に供給流路管１０２内と直接連結するキャピラリー１０８とを備えて構成されている。薬液供給ポンプ１０６の駆動により、キャピラリー１０８から供給流路管１０２内の超純水中へ薬液が吐出される。
【００２５】
供給流路管１０２には、この供給流路管１０２内を通過する超純水の流量を調節する流量調節手段１０９、供給流路管１０２内を通過する洗浄液の濃度を調節する濃度調節手段１１０、及び供給流路管１０２のキャピラリー１０８との連結部位に配され、洗浄液に回転流を生ぜしめて攪拌し、洗浄液を均一化させる混合手段１１１が設けられている。
【００２６】
制御系１０５は、薬液供給ポンプ１０６の薬液の超純水への供給量を調節するとともに、流量調節手段１０９を駆動する薬液供給制御手段１１２と、濃度調節手段１１０を駆動する濃度制御手段１１３とを備えている。そして、薬液供給制御手段１１２と濃度制御手段１１３とが連結され、濃度制御手段１１３による濃度制御の結果が薬液供給制御手段１１２にフィードバックされて薬液供給ポンプ１０６を制御し、薬液の供給量が調節される。
【００２７】
本発明は上記薬液供給配管システムＢの配管系の適所に各種チューブデバイスを介入し、このチューブデバイスを以下のように構成することに特徴を有する。
【００２８】
図１は、上記薬液供給配管システムＢの配管系である供給流路管１０２の途中にチューブデバイスとして熱交換器１１４を介入した場合の実施例を示す。図２に示すように、この熱交換器１１４はケーシング１の内部（熱交換室）２に通された熱交換チューブ３内を通過する流体と、ケーシング１の内部と熱交換チューブ３の外部との間を通過する流体との間で熱交換を行うものである。
【００２９】
図２、図３に示すように、ケーシング１は、熱交換チューブ３の外周を包囲するチューブ４と、このチューブ４の一端部及び他端部をそれぞれ密封状に閉塞する１対の蓋部材５、及び各蓋部材５をチューブ４の端部に締め付けるユニオンナット６を備える。
チューブ４は耐熱性、耐薬品性に優れるＰＦＡ、ＰＴＦＥ等のフッ素樹脂や導電性物質を含有する帯電防止フッ素樹脂等の合成樹脂によって筒状に成形され、このチューブ４の両端部には、それぞれ、同じくフッ素樹脂等の合成樹脂からなる蓋部材５を挿入してフッ素樹脂等合成樹脂製のユニオンナット６の締め付けを介して接続する。
【００３０】
蓋部材５は、胴壁部７と、この胴壁部７の一端に開放する受口部８、及び胴壁部７の他端を閉塞する底壁部９とを有する形に形成される。そして、図３に示すように、蓋部材５の受口部８の内部には第１〜３のシール面１０〜１２が設けられる。第１のシール面１０は、蓋部材５の受口部８の入口より内奥に、蓋部材５の軸線Ｃに対して交差状、つまり軸線Ｃ方向の外方に向けて漸次拡径するテーパ面により構成される。第２のシール面１１は、受口部８の入口に、前記軸線Ｃに対して交差状、つまり軸線Ｃ方向の外方に向けて漸次拡径するテーパ面により構成される。第３のシール面１２は、蓋部材５の受口部８の内奥において第１のシール面１０よりも径方向外方に軸線Ｃと平行に形成された環状溝部１３により構成される。蓋部材５の受口部８の外周には雄ねじ１４が形成されている。
【００３１】
一方、チューブ４の一端部及び他端部にはそれぞれフッ素樹脂等合成樹脂製のインナーリング１５を圧入する。このインナーリング１５は、図３に示すように、チューブ４の端部に圧入されて該端部を断面山形状に拡径膨出させる断面算盤玉形状の圧入部１６と、この圧入部１６に連設されてチューブ４の端部に突出する突出部１７とを有するスリーブ形状に形成されている。断面山形状の圧入部１６はこれの一斜面部に外向きテーパ面１８を、他斜面部に前記第２のシール面１１との間でチューブ４の端部を傾斜状態に挟持して第２のシール部２１を形成する内向きテーパ面２０をそれぞれ形成している。突出部１７の先端には前記第１のシール面１０に密着状に当接して第１のシール部１９を形成するテーパ面からなる突出端面２２、および前記環状溝部１３に嵌入して第３のシール部２３を形成する円筒部２４を形成してなる。このインナーリング１５の内径はチューブ４の内径と同一か略同一に設定して流体が滞留することなく、円滑に流動するようにしている。
【００３２】
図３に示すように、ユニオンナット６はこれの内周に蓋部材５の雄ねじ１４に螺合される雌ねじ２５を形成し、かつ一端部に環状鍔部２６を内向きに張り出すとともに、該環状鍔部２６の内周面の軸方向内端に鋭角または直角の押圧エッジ部２６ａを設けてある。
【００３３】
そして、上記インナーリング１５の圧入されたチューブ４の端部を蓋部材５の受口部８に挿入し、該チューブ４の端部の外周に予め遊嵌させたユニオンナット６の雌ねじ２５を蓋部材５の雄ねじ１４に螺合させて締め付ける。この締付けに伴いユニオンナット６の押圧エッジ部２６ａがチューブ４の拡径部２７の拡径付け根部に当接してインナーリング１５を軸方向から押圧する。これにより、図３に示すように、インナーリング１５の突出端面２２が蓋部材５の第１のシール面１０に対し押し付けられて第１のシール部１９を形成するとともに、インナーリング１５の内向きテーパ面２０と蓋部材５の第２のシール面１１との間でチューブ４の端部を傾斜状態に挟持して第２のシール部２１を形成し、さらにインナーリング１５の円筒部２４が環状溝部１３に圧入して第３のシール部２３を形成する。これら第１〜３のシール部１９，２１，２３により信頼性の高いシール機能を発揮する。
【００３４】
図２に示すように、上記チューブ４の一端部の蓋部材５には、他の配管である熱交換流体の導入用配管２８ａが接続される接続部２９ａを、他端部の蓋部材５には他の配管である導出用配管２８ｂが接続される接続部２９ｂをそれぞれ備える。すなわち、他の配管との接続部２９ａ，２９ｂは、一方の蓋部材５の胴壁部７に温調水等の熱交換流体のインレットポート３０を、他方の蓋部材５の胴壁部７にアウトレットポート３１をそれぞれ形成し、インレットポート３０には熱交換流体の導入用配管２８ａの端部が、アウトレットポート３１には熱交換流体の導出用配管２８ｂの端部がそれぞれフッ素樹脂等合成樹脂製のユニオンナット３２、フッ素樹脂等合成樹脂製のインナーリング３３を介して接続されて、熱交換流体がインレットポート３０、チューブ４内の熱交換室２、アウトレットポート３１の順に流通すべく構成されている。
【００３５】
インレットポート３０及びアウトレットポート３１の各内部構造は蓋部材５の受口８の内部構造と同一に構成し（但し、径は異なる）、また熱交換流体の導入用配管２８ａ及び導出用配管２８ｂの各端部には、チューブ４の端部のインナーリング１５の断面形状と同様のインナーリング３３を圧入してあって、インレットポート３０及びアウトレットポート３１に対する導入用配管２８ａ及び導出用配管２８ｂの各端部の接続構造は、チューブ４の端部の蓋部材５の受口８に対する接続構造と同様であるため、その詳細な説明は省略する。ただし、このインレットポート３０及びアウトレットポート３１に対する熱交換流体の導入用配管２８ａ及び導出用配管２８ｂの各端部の接続構造としては、そのほかに、インレットポート３０及びアウトレットポート３１に対し熱交換流体の導入用配管２８ａ及び導出用配管２８ｂの各端部を直接溶着したり、ねじ接続したりするなどの手段を採用することもできる。つまり、他の配管との接続部２９ａ，２９ｂは溶着、ねじ接続などの接続手段であってもよい。
【００３６】
一方、チューブ４の内部には薬液が通過するフッ素樹脂等合成樹脂製のコイルチューブよりなる熱交換チューブ３が通され、この熱交換チューブ３の両端部は蓋部材５の底壁部９に開口した導出口３４から導出され、上記薬液供給配管システムＢの配管系の供給流路管１０２の途中に接続される。その熱交換チューブ３の導出端部にはフッ素樹脂等合成樹脂製のユニオンナット３５を外嵌して、このユニオンナット３５を導出口３４にフッ素樹脂等合成樹脂製のフェルール３６を介して締め付けることにより該導出口３４と熱交換チューブ３の端部との間の隙間を密封している。
【００３７】
このように構成された熱交換器は、熱交換チューブ３内を通過する、例えば薬液等の流体と、筒状ケーシング本体４内の熱交換チューブ３の外部を通過する温調水等熱交換流体との間で熱交換が行われるが、熱交換チューブ３内に薬液等の流体を、熱交換チューブ３外部に温調水等熱交換流体をそれぞれ通過させるに代えて、それとは反対に、熱交換チューブ３内に温調水等熱交換流体を、熱交換チューブ３外部に薬液等の流体をそれぞれ通過させることもできる。
【００３８】
なお、上記熱交換チューブ３の両端部をケーシング１の外部へ導出させるための導出口３４は蓋部材５の胴壁部７に開口し、薬液等の流体のインレットポート３０およびアウトレットポート３１は蓋部材５の底壁部９に設けることもできる。
【００３９】
また、薬液等流体又は温調水等熱交換流体を通過させる熱交換チューブ３は、コイルチューブに代えて、フッ素樹脂製の単一のストレートなチューブで構成すること、あるいは図１７に示される従来の熱交換器の場合と同様なフッ素樹脂等合成樹脂製の複数のストレートなチューブで構成することもできる。
【００４０】
（チューブデバイスの他の実施例）
チューブデバイスとしては、上記熱交換器１１４以外に、図４、図５に示すフィルターデバイス、図６の超音波式流量計、図７の手動式脱気デバイス、図８の自動式脱気デバイス、図９の脱気モジュールなどを採用することができ、各々が独自に持つ機能に応じて上記薬液供給配管システムＢの配管系の適所に介入配置される。
【００４１】
図４において、フィルターデバイス１１５はケーシング１の内部にデバイス要素としてフィルター部材３を収容する。このフィルター部材３としては、たとえば、セラミックスや活性炭、酸化チタン等の機能性粉末を合成繊維等の担体に含有させて、蓋部材５に設けたインレットポート３０から流入する例えば純水をこのフィルター部材３内に通過させて超純水にしたり、シリカゲル等のイオン交換樹脂を担体に含有させて、インレットポート３０から流入する純水や薬液をこのフィルター部材３内に通過させて純水や薬液中に含まれる金属イオンを除去したりするものである。
【００４２】
このフィルターデバイス１１５のケーシング１は、チューブ４と、このチューブ４の両端部を密封状に閉塞する蓋部材５、及び蓋部材５をチューブ４の端部に締め付けるユニオンナット６を備える。蓋部材５，５に設けたインレットポート３０およびアウトレットポート３１が上記薬液供給配管システムＢの配管系の適所に接続される。これらチューブ４、蓋部材５、及びユニオンナット６の各構成は上記熱交換器１１４のそれら部材の構成と同様であるため同一部材、同一要素には同一符号を付してその説明は省略する。
【００４３】
図５はフィルターデバイス１１５の他例を示す。このフィルターデバイス１１６は、ケーシング１の内部に、デバイス要素として中空糸膜よりなるフィルター部材３を収容してなり、例えば純水をこのフィルター部材３内に通過させて超純水にするものとした以外は、上記フィルターデバイス１１５のものと同様の構成であり、このため同一部材、同一要素には同一符号を付してその説明は省略する。
【００４４】
図６において、超音波式流量計１１７は、上記熱交換器１１４の場合と同様に、ケーシング１が、チューブ４と、このチューブ４の両端部を密封状に閉塞する蓋部材５、及び蓋部材５をチューブ４の端部に締め付けるユニオンナット６を備える。そしてデバイス要素として、ケーシング１のチューブ４の両端の蓋部材５，５の一方の底壁部９に超音波式流量計用の超音波発振器５１を、他方の底壁部９に超音波受信器５２をそれぞれ組み込んでいる。
しかるときは、一方の蓋部材５の胴壁部７に設けたインレットポート３０から流入してチューブ４内を他方の蓋部材５に設けたアウトレットポート３１に向かって流れる、例えば純水や超純水、または薬液の流れにより、超音波がドップラー変位することを利用して流量を計測することができる、というものである。蓋部材５，５に設けたインレットポート３０およびアウトレットポート３１が上記薬液供給配管システムＢの配管系の適所に接続される。その他の、ケーシング１の構造、チューブ４の端部と蓋部材５との接続構造などは上記熱交換器１１４の場合と同様であるため同一部材、同一要素には同一符号を付してその説明は省略する。
【００４５】
図７において、手動式脱気デバイス１１８は、ケーシング１が、縦向き姿勢に配されるチューブ４と、このチューブ４の上下端部を密封状に閉塞する上下１対の蓋部材５、及び各蓋部材５をチューブ４の上下端部にそれぞれ締め付けるユニオンナット６を備える。そしてデバイス要素として、上方の蓋部材５の胴壁部７にインレットポート３０を、底壁部９にエアー抜きチューブ５３、及び手動式のエアー抜き用バルブ５４を組み込んでいる。下方の蓋部材５の胴壁部７にアウトレットポート３１を設けている。しかるときは、エアー抜き用バルブ５４を開放することにより、上方の蓋部材５のインレットポート３０からチューブ４内に滞留して下方の蓋部材５のアウトレットポート３１に流出する、例えば純水や超純水、または薬液中の気泡を除去することができる、というものである。蓋部材５，５に設けたインレットポート３０およびアウトレットポート３１が上記薬液供給配管システムＢの配管系の適所に接続される。その他の、ケーシング１、チューブ４の端部と蓋部材５との接続構造などは上記熱交換器１１４の場合と同様であるため同一部材、同一要素には同一符号を付してその説明は省略する。
【００４６】
図８において、自動式脱気デバイス１１９は、縦向き姿勢に配されたチューブ４の外側に配置した液面センサー５６に連動して作用する自動式のエア抜き用バルブ５５をエアー抜きチューブ５３に設けて、液面センサー５６でチューブ４内の液面を感知すると、エアー抜き用バルブ５５を開き、液中に溜まったエアーを排出するようにした以外は、図７の手動式脱気デバイスの場合の構成及び作用と同様である。このため同一部材、同一要素には同一符号を付してその説明は省略する。
【００４７】
図９において、脱気モジュール１２０は、デバイス要素として、チューブ４内に発泡フッ素樹脂からなる複数本のガス透過性チューブ５７を集束状態に通すとともに、蓋部材５に脱気口５８を設けたものである。ガス透過性チューブ５７の両端部はチューブ４の両端の蓋部材５の各底壁９に設けた導入口５９及び導出口６０にそれぞれ通された流入配管６１及び流出配管６２に連通接続される。流入配管６１及び流出配管６２が上記薬液供給配管システムＢの配管系の適所に接続される。
【００４８】
いま、真空ポンプ等によってチューブ４内を脱気口５８から減圧しながら、例えば薬液を流入配管６１からガス透過性チューブ５７内に通過させると、薬液中に溶存する空気等のガスはガス透過性チューブ５７の周壁を透過してガス透過性チューブ５７の外側に除去され脱気作用が行われ、脱気処理後の薬液は流出配管６２に排出されるといった脱気モジュールである。その他の、ケーシング１、チューブ４の端部と蓋部材５との接続構造などは上記熱交換器１１４の場合と同様であるため同一部材、同一要素には同一符号を付してその説明は省略する。
【００４９】
図９に示す脱気モジュール１２０は、ガス溶解デバイスとしても用いることができる。ガス溶解デバイスとして用いる場合は、脱気口５８を溶解性ガス供給口として使用し、オゾン等の溶解性ガスをチューブ４内に加圧供給しながら、例えば超純水や薬液を流入配管６１からガス透過性チューブ５７内に通過させると、チューブ４内の溶解性ガスがガス透過性チューブ５７の周壁を透過して該ガス透過性チューブ５７内の超純水や薬液に溶解させ、溶解処理後の被処理液は流出配管６２に排出させるといったガス溶解デバイスにも用いることができる。
【００５０】
（チューブデバイスのケーシングの他の実施例）
チューブデバイスのケーシング１の全体的な形状としては、上記の各実施例のように直管状に形成するに代えて、図１０に示すごとくＬ形状、あるいは図１１に示すごとくＵ形状などの応用形態を採用することができる。この場合、図１０に示すＬ形状のケーシング１では２個の第１，２のチューブ４Ａ，４Ｂ，２個の第１，２の蓋部材５Ａ，５Ｂ、および１個のエルボ形状のフッ素樹脂等合成樹脂製の接合部材３９を使用し、図１０に示すＵ形状のケーシング１では３個の第１，２，３のチューブ４Ａ，４Ｂ，４Ｃ、２個の第１，２の蓋部材５Ａ，５Ｂ、および２個のエルボ形状のフッ素樹脂等合成樹脂製の第１，２の接合部材３９Ａ，３９Ｂを使用する。
【００５１】
図１０に示すＬ形状のケーシング１においては、それぞれの一端部に第１，２蓋部材５Ａ，５Ｂが第１のユニオンナット６Ａで接続された第１，２のチューブ４Ａ，４Ｂの他端部同士を、１個のエルボ形状の接合部材３９及び１対の第２のユニオンナット４０Ｂで接続する。この場合、第１，２のチューブ４Ａ、４Ｂの各一端部に対して第１，２の蓋部材５Ａ、５Ｂを接続する接続構造については、上記した各実施例のチューブ４の端部と蓋部材５との接続構造の場合と同様に構成する。
【００５２】
接合部材３９はこれの両端に受口４１を互いに直交状に連通するよう開口してあり、各受口４の内部構造は蓋部材５の受口部８の内部構造と同一に構成し、第１，２のチューブ４Ａ、４Ｂの各他端部には各一端部のインナーリング１５と同様の断面形状のインナーリング１５を圧入してあるため、接合部材３９の一端の受口４１に第１のチューブ４Ａの他端部が、また他端の受口４１に第２のチューブ４Ｂの他端部が、それぞれ、上記第１，２のチューブ４Ａ、４Ｂの各一端部の第１，２の蓋部材５Ａ、５Ｂの受口部８に対する接続構造の場合と同様の接続構造を介して接続される。流体チューブ３は接合部材３９の内部で直角に曲げられる。
【００５３】
図１１に示すＵ形状のケーシング１においては、それぞれの一端部に蓋部材５が第１のユニオンナット６で接続された第１，２のチューブ４Ａ、４Ｂの他端部同士間に、第３のチューブ４Ｃを２個のエルボ形状の接合部材３９及び１対の第２のユニオンナット４０Ｂで接続する。この場合においても、第１，２のチューブ４Ａ、４Ｂの各一端部に対して第１，２の蓋部材５の受口部８を接続する接続構造は上記した各実施例のチューブ４の端部と蓋部材５との接続構造の場合と同様に構成する。そして、第１，２のチューブ４Ａ、４Ｂの各他端部に対して各接合部材３９の受口４１を接続する接続構造、および第３のチューブ４Ｃの両端部に対して各接合部材３９の受口４１を接続する接続構造は、それぞれ、上記第１，２のチューブ４Ａ、４Ｂの各一端部の第１，２の蓋部材５の受口部８に対する接続構造の場合と同様に接続される。流体チューブ３は各接合部材３９の内部で直角に曲げられる。
なお、ケーシング１は、図１０のＬ形状のケーシング１と図１１のＵ形状のケーシング１とを組み合わせた形状に構成することもできる。
【００５４】
このようにチューブデバイスのケーシング１はＬ形状あるいはＵ形状などに形成することにより、配管のデッドスペースを有効に活用してコンパクトな配管システムを組むことができる。また既存配管に新たにチューブデバイスを設置する場合など配管システムの改造要求に対応できる形状にすることができて有利である。
【００５５】
（シール部の他の実施例）
上記チューブ４の端部と蓋部材５の受口部８との間に形成されるシール部としては、図３に示す上記実施例のように第１，２のシール部１９，２１のほかに、インナーリング１５の円筒部２４と蓋部材５の環状溝部１３による第３のシール部２３を付加することによりシール性能をより一層確実に向上させることができるが、必ずしもこれに限定されるものではない。そのほかに、たとえば、図１２に示すように、第１，２のシール部１９，２１だけを形成して、第３のシール部２３を省略するもの、すなわち蓋部材５の内奥に環状溝部１３を設けず、またインナーリング１５に円筒部２４を設けないものであってもよい。この場合、蓋部材５の内奥に設ける第１のシール面１０は、軸線Ｃに対して第２のシール面１１とは逆向きの交差状、つまり軸線Ｃ方向の外方に向けて漸次縮径するテーパ面により構成している。
【００５６】
また、図１３に示すように、蓋部材５の受口部８の先端側における端部外周に、チューブ４の内径より径大のテーパ面からなるシール面４２を形成し、このシール面４２の後方の外周に該シール面４２の外径より径大の雄ねじ１４を形成している。一方、チューブ４の端部はフレア加工して拡径部４３を形成する。かくして、チューブ４の端部の拡径部４３を蓋部材５のシール面４２上に圧入する。そして、チューブ４に外嵌されているユニオンナット６の雌ねじ２５を蓋部材５の雄ねじ１４に螺合して締め付け、ユニオンナット６の環状鍔部２６の押圧エッジ部２６ａをチューブ４の外側に当接させて拡径部４３の内周面を受口部８のシール面４２に軸方向から押し付けて密着させることにより、シール部４４を形成することもできる。
【００５７】
図１４に示すように、チューブ４の端部にフッ素樹脂等合成樹脂製の断面円弧形状のインナーリング４５を圧入して該チューブ４の端部を断面山形状に拡径膨出させ、蓋部材５の雄ねじ１４に螺合させたユニオンナット６を螺進させて強く締め付けることによって、チューブ４の端部をインナーリング４５とともに、蓋部材５の受口部８の内周に設けたテーパ状のシール面４６に対して押し付けて密着させることにより、シール部４７を形成するシール構造であってもよい。
【００５８】
また、図１５に示すように、チューブ４の端部にアウタリング４８を嵌め込み、チューブ４の末端部を該アウタリング４８の外面上に折り返して、蓋部材５の雄ねじ１４に螺合させたユニオンナット６を螺進させて強く締め付けることによって、チューブ４の端部をアウタリング４８とともに、蓋部材５の受口部８内のシール面４９に対して押し付けて密着させることにより、シール部５０を形成する、というシール構造であってもよい。
【００５９】
勿論、本発明は上記半導体製造装置の薬液供給配管システム以外の各種配管システムにも同様に適用できることは言うまでもない。
【図面の簡単な説明】
【図１】本発明の配管システムの一例である薬液供給配管システムを含む半導体ウェハ（基板）洗浄装置の全体構成を示す概略断面図である。
【図２】図１中のチューブデバイスの一例である熱交換器の断面図である。
【図３】図２の熱交換器のチューブ端部と蓋部材との接続構造の拡大断面図である。
【図４】チューブデバイスの他例であるフィルターデバイスの断面図である。
【図５】フィルターデバイスの他例を示す断面図である。
【図６】チューブデバイスの他例である超音波式流量計の断面図である。
【図７】チューブデバイスの更に他例である手動式脱気デバイスの断面図である。
【図８】チューブデバイスの更に又、他例である自動式脱気デバイスの断面図である。
【図９】チューブデバイスの更に又、他例である脱気モジュールの断面図である。
【図１０】チューブデバイスのケーシングの他例を示す断面図である。
【図１１】チューブデバイスのケーシングの更に他例を示す断面図である。
【図１２】チューブデバイスのシール部の他例を示す断面図である。
【図１３】チューブデバイスのシール部の更に他例を示す断面図である。
【図１４】チューブデバイスのシール部の更に又、他例を示す断面図である。
【図１５】チューブデバイスのシール部の更に又、他例を示す断面図である。
【図１６】従来例のチューブデバイス（熱交換器）の正面図である。
【図１７】図１６の熱交換器の断面図である。
【符号の説明】
１ケーシング
３フィルター部材
４，４Ａ，４Ｂ，４Ｃチューブ
５，５Ａ，５Ｂ蓋部材
６第１のユニオンナット
８受口部
１０，１１，１２，４２，４６，４９シール面
１３環状溝部
１５インナーリング
１６圧入部
１７突出部
１９，２１，２３，４４，４７，５０シール部
２０内向きテーパ面
２２突出端面
２４円筒部
２８ａ，２８ｂ流体導入用及び導出用の配管
２９ａ，２９ｂ接続部
３９，３９Ａ，３９Ｂ接合部材
４０第２のユニオンナット
５１超音波発振器
５２超音波受信器
５４エアー抜き用の手動式のバルブ
５５エアー抜き用の自動式のバルブ
５７ガス透過性チューブ
５８脱気口・溶解性ガス供給口
１１４熱交換器
１１５，１１６フィルターデバイス
１１７超音波式流量計
１１８手動式脱気デバイス
１１９自動式脱気デバイス
１２０脱気モジュール[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a fluid piping system used in a semiconductor manufacturing device, a liquid crystal device, a chemical manufacturing device, a food production line, and the like.
[0002]
[Prior art]
2. Description of the Related Art In a piping system of a semiconductor manufacturing apparatus, with the increase in the degree of integration of semiconductor devices, for example, the number of cleaning steps in various cleaning apparatuses, which is one of the solutions of a semiconductor wet process, is increasing steadily, and the cleanliness of the cleaning Increasingly, integrity is required. For this reason, there is an increasing demand for establishing a technology for supplying a cleaning device with a cleaning liquid composed of ultrapure water or a chemical solution to a cleaning device. At present, chemicals are contaminated during the preparation, dilution, and transportation processes of the chemical supply system, but the wafer cleanliness level must be compatible with the sub-quarter micron era. As a chemical liquid supply system, a mass adjustment method is known. The chemical is pumped from the receiving tank to the dilution tank, adjusted to the required composition and concentration, pumped from the supply tank by long-distance piping, pumped to the wet station storage tank, and further passed through the pump and filter to the washing tank. (For example, see Patent Document 1 and Patent Document 2).
[0003]
As one of various devices applied to a piping system such as this type of semiconductor manufacturing apparatus, for example, there is a heat exchanger as shown in FIGS. This heat exchanger has a cylindrical shell constituting a main body of the casing 71 in order to ensure that the casing 71 through which the heat exchange tube 70 is passed has sufficient sealing performance and withstands a certain internal pressure. A plurality of metal fastening members 73 such as tie rods and through bolts are arranged in parallel with each other along the longitudinal direction on the outer circumference of the 72, and both ends of the metal fastening members 73 are arranged at both ends of the shell 72. By inserting nuts 75 into male screw portions at both ends of a metal fastening member 73 protruding from the cover member 74, an abutting surface between both ends of the shell 72 and the cover member 74 is provided. The casing 71 is tightly sealed, whereby the casing 71 is configured to be sealed (for example, see Patent Document 3). Further, an O-ring 76 serving as a seal member is interposed between the butting surfaces of the shell 72 and the lid member 74 (see Patent Document 3 mentioned above).
[0004]
[Patent Document 1]
JP 2000-265945 A
[Patent Document 2]
JP-A-11-70328
[Patent Document 3]
JP-A-10-160362
[0005]
[Problems to be solved by the invention]
However, in the above-mentioned chemical liquid supply system of the mass adjustment type, particles and metal from various liquid contact parts of all device components such as storage tanks, piping, fittings, pumps, heat exchangers, flow meters, filters, degas modules, etc. The occurrence of contamination is regarded as a problem.
On the other hand, large-scale and complicated apparatuses have been regarded as problems due to high-speed cleaning of a substrate cleaning apparatus for cleaning semiconductor wafers and the like. In particular, a piping system in which various devices are arranged is installed in a clean room. Therefore, miniaturization and compactness are required.
[0006]
In many cases, metal materials are used for various devices, which generate metal contamination and have a fixed device shape, so the flexibility of piping system design is small, and dead space in piping is likely to occur. The system tends to be large, and there has been a limit to compactness and cost reduction, including mechanical devices such as cleaning devices. In addition, there was no device having a shape capable of flexibly responding to a request for remodeling an existing piping system, and there were many restrictions on space in remodeling a piping system.
[0007]
Further, in the heat exchanger (device) in which the both ends of the shell 72 and the lid member 74 are sealed by tightening the nut 75 and the metal fastening member 73 such as a plurality of tie rods or through bolts. Not only increases the number of parts, increases the cost and increases the size of the casing structure, but also when the metal fastening member 73 is arranged in a place exposed to a sulfuric acid atmosphere or the like, it is easily corroded, and metal contamination is inevitable. Therefore, in recent years, there is a high demand for use restrictions, especially in the semiconductor industry.
[0008]
In addition, it is necessary to periodically retighten the metal fastening member 73 in response to the loosening of the metal fastening member 73. However, since there are usually a plurality of metal fastening members 73 and at least four or more, Variations in the degree of tightening of the metal fastening members 73 are likely to occur, and this variation may cause deformation of the lid member 74 and the shell 72. If the lid member 74 or the shell 72 is deformed, twisting or distortion occurs between the end of the shell 72 and the lid member 74, causing a local stress concentration to promote creep. In addition, the central axes of the metal tie rod and the metal tie rod sheath of the metal fastening member 73 do not coincide with each other, and the two rub against each other to increase the sliding resistance and to cause wear powder including metal powder. There was also a problem. Further, when the shell 72 or the cover member 74 is deformed, these members need to be replaced. However, since these members are usually cut products and relatively expensive, the casing structure is replaced and the device is replaced. It was also difficult to reuse the element (heat exchange tube 70).
[0009]
In the above heat exchanger having a connection structure in which an O-ring 76 is interposed as a seal member between both end portions of the shell 72 and the abutting surface of the lid member 74, the use of the O-ring 76 limits the corrosion resistance and the operating temperature range. There is. For example, the space in contact with the O-ring 76 cannot communicate a high-temperature chemical. In addition, contamination of the O-ring 76 due to dust generation may be a problem. Therefore, in recent years, there is a high demand in the semiconductor industry to restrict the use of such O-rings 76.
[0010]
When this type of heat exchanger is used for a chemical solution or the like, a fluorine resin such as PTFE or PFA, which has excellent corrosion resistance, is often used for components such as the shell 72 and the cover member 74. Since the fluororesin has high lubricity, the connection between the shell 72 and the lid member 74 creeps due to the vibration or heat of the pipe, thereby loosening the metal fastening members 73 such as tie rods and through bolts. Therefore, there is a problem that the fluid leaks from the connection portions at both ends of the shell 72.
[0011]
As a casing connection structure between the shell 72 and the lid member 74, a screw seal or welding may be adopted, but this is not very effective. That is, with a connection seal structure using only a screw, high sealing properties cannot be obtained, pressure resistance is not sufficient, and leakage due to creep is likely to occur. In addition, welding generally requires skill and is not an easy operation, so that there is a problem that production efficiency is low, workability on site is poor, and maintenance / inspection on site is difficult.
[0012]
The present invention has been made in order to solve such problems, and it is an object of the present invention not to use a metal material such as a metal fastening member, and to make all the constituent members made of synthetic resin. An object of the present invention is to provide a piping system for a semiconductor manufacturing apparatus or the like which can solve the problems of metal elution and generation of metal abrasion powder by making it possible.
Another object of the present invention is to provide a piping system such as a semiconductor manufacturing apparatus that can achieve slimness of various devices and downsizing and downsizing of a piping system.
Further, an object of the present invention is to reduce the number of parts and cost without using metal fastening members such as tie rods and through bolts and O-rings, and to provide a casing structure with high pressure resistance and reliability. It is an object of the present invention to provide a piping system such as a semiconductor manufacturing apparatus provided with a tube device having a high sealing structure.
[0013]
Another object of the present invention is to provide a semiconductor manufacturing apparatus including a tube device that can ensure high sealing performance even when all of its constituent members are made of a fluororesin, and that can be applied to and installed in a chemical resistant atmosphere. To provide a piping system.
[0014]
[Means for Solving the Problems]
The present invention is a piping system such as a semiconductor manufacturing apparatus in which a tube device in which a device element is provided in a casing is interposed in the middle of a piping system,
The casing comprises a pair of synthetic resin tubes each including a synthetic resin tube, a receiving portion for receiving one end and the other end of the tube, and at least one sealing surface provided in the receiving portion. A lid member, a union nut made of synthetic resin that is externally fitted to one end and the other end of the tube and screwed to one end of the lid member, and the union nut is connected to one end of the lid member. By pressing the tube from the outside by screwing, at least one seal portion formed by tightly contacting the end portion of the tube and the sealing surface of the lid member by this pressing action, It is characterized by having.
[0015]
In this case, the tube, the lid member, and the union nut can be all formed of a fluororesin having excellent heat resistance and chemical resistance or an antistatic fluororesin containing a conductive substance.
The following are examples of the device element. For example, the device element is a fluorine resin heat exchange tube passed through the casing, and the introduction of a fluid provided between the inside of the casing and the outside of the heat exchange tube provided on the lid member. A heat exchanger can be obtained by using a connecting portion to which the pipes for use and lead-out are connected. Further, the device element may be a filter device housed in the casing, thereby forming a filter device. The device element may be an ultrasonic oscillator and an ultrasonic receiver for an ultrasonic flow meter incorporated in the lid members at both ends of the tube, thereby forming an ultrasonic flow meter. Further, the device element may be a degassing device by using an air vent valve incorporated in the lid member. In addition, the device element may be a gas permeable tube passed through the tube, and a deaeration port provided in the lid member, thereby forming a deaeration module. Furthermore, the device element can be a gas-dissolving device by using a gas-permeable tube passed through the tube and a dissolvable gas supply port provided in the lid member.
[0016]
Effects of the Invention
According to the piping system having the above configuration, the tube device interposed in the middle of the piping system makes the end portion of the tube and the sealing surface of the lid member adhere to each other by a simple operation of simply tightening the union nut to one end of the lid member. Sealing can be reliably performed via the seal portion. Therefore, the number of parts is reduced, without using a metal fastening member such as a tie rod or a through bolt and an O-ring as in the related art, and an inexpensive, compact, highly pressure-resistant casing structure and a highly reliable seal structure are provided. A tube device can be obtained.
[0017]
The tube device has a pressure-resistant seal structure that does not use tie rods or through bolts as in the conventional casing connection structure, and can be made into a slim casing structure, and uniform sealing performance is achieved by tightening with a single union nut. It is possible to secure. In other words, by simply sealing the joints of the tube with the lid members at both ends with a single union nut, a highly reliable sealing structure can be obtained compared to tie rods and through bolts, and a tube device with a slim casing. Thus, the size and size of the piping system can be reduced. In addition, it is possible to secure the sealing performance each time by increasing the tightening of the union nut, and it is highly reliable for a long time as compared with a screw seal or an O-ring seal. Furthermore, since simple means of tightening a single union nut is sufficient, site construction is easy, unlike the connection structure by welding, and maintenance and inspection at the site can be easily performed.
[0018]
Since no metal material such as a metal fastening member is used, problems of metal elution and generation of metal abrasion powder can be solved.
[0019]
According to the tightening of the union nut, the entire outer periphery of the end of the tube can be evenly pressed, so that accidental deformation of the tube and the lid member does not occur. Therefore, the problem of creep and replacement of these members can be solved.
[0020]
By loosening the tightening of the union nut, the lid member can be easily removed from the end of the tube, so that the stagnation remaining in the tube can be easily removed.
[0021]
In addition, the tube device interposed in the piping system of this piping system can maintain a sufficient airtightness even if internal pressure is applied to the tube only by tightening the union nut and can prevent fluid leakage. By eliminating the need for a ring, and by molding all the components with a fluororesin, it can cope well with high-temperature, highly corrosive chemical solutions, and can be applied and installed in a chemical-resistant atmosphere.
[0022]
BEST MODE FOR CARRYING OUT THE INVENTION
A preferred embodiment of the present invention will be described with reference to the drawings.
[0023]
FIG. 1 is a schematic cross-sectional view showing the entire configuration of a semiconductor wafer (substrate) cleaning apparatus including a chemical liquid supply piping system which is an example of a piping system according to the present invention. A is a cleaning chamber in which a wafer (substrate) W is installed and cleaned, and B is a chemical liquid supply system that generates a cleaning liquid having a desired concentration and supplies the cleaning liquid to the cleaning chamber A. The chemical solution supply piping system B is connected to the chemical solution storage tank 100 in which the chemical solution is stored in the form of a stock solution, the chemical solution storage tank 100, and is connected to the chemical solution supply device 101 for supplying the chemical solution. The supply flow pipe 102 serving as a passage of the ultrapure water to be mixed is provided at the downstream end of the supply flow pipe 102 so as to face the surface of the wafer W installed in the cleaning chamber A. The apparatus includes a pair of discharge nozzles 103 and 104 for supplying the cleaning liquid to the surface, and a control system 105 for adjusting various states such as the concentration and flow rate of the cleaning liquid supplied from the discharge nozzles 103 and 104.
[0024]
The chemical liquid supply device 101 includes a chemical liquid supply pump 106, a connection pipe 107 that connects the supply flow path pipe 102 and the chemical liquid supply pump 106 to form a flow path, and a direct connection between the connection pipe 107 and the inside of the supply flow path pipe 102. And a capillary 108 to be connected. By driving the chemical supply pump 106, the chemical is discharged from the capillary 108 into ultrapure water in the supply flow pipe 102.
[0025]
The supply flow pipe 102 has a flow rate adjusting means 109 for adjusting the flow rate of the ultrapure water passing through the supply flow pipe 102, and a concentration adjusting means 110 for adjusting the concentration of the cleaning liquid passing through the supply flow pipe 102. And a mixing means 111 which is disposed at a portion of the supply channel tube 102 connected to the capillary 108, generates a rotational flow in the cleaning liquid, agitates the cleaning liquid, and homogenizes the cleaning liquid.
[0026]
The control system 105 adjusts the amount of the chemical solution supplied to the ultrapure water by the chemical solution supply pump 106, and controls the chemical solution supply control device 112 for driving the flow rate adjusting device 109, the concentration control device 113 for driving the concentration adjusting device 110, It has. The chemical liquid supply control means 112 and the concentration control means 113 are connected, and the result of the concentration control by the concentration control means 113 is fed back to the chemical liquid supply control means 112 to control the chemical liquid supply pump 106, and the supply amount of the chemical liquid is adjusted. Is done.
[0027]
The present invention is characterized in that various tube devices are interposed at appropriate places in the piping system of the chemical solution supply piping system B, and the tube devices are configured as follows.
[0028]
FIG. 1 shows an embodiment in which a heat exchanger 114 is interposed as a tube device in the middle of a supply flow pipe 102 which is a piping system of the chemical liquid supply piping system B. As shown in FIG. 2, the heat exchanger 114 includes a fluid passing through the heat exchange tube 3 passed through the inside (heat exchange chamber) 2 of the casing 1, a fluid inside the casing 1, and an outside of the heat exchange tube 3. Heat exchange with a fluid passing between the two.
[0029]
As shown in FIGS. 2 and 3, the casing 1 includes a tube 4 surrounding the outer periphery of the heat exchange tube 3, and a pair of lid members 5 each sealingly closing one end and the other end of the tube 4. And a union nut 6 for fastening each lid member 5 to the end of the tube 4.
The tube 4 is formed into a tubular shape with a synthetic resin such as a fluororesin having excellent heat resistance and chemical resistance, such as PFA and PTFE, and an antistatic fluororesin containing a conductive substance. Similarly, a lid member 5 made of a synthetic resin such as a fluororesin is inserted, and the connection is made by tightening a union nut 6 made of a synthetic resin such as a fluororesin.
[0030]
The lid member 5 is formed to have a body wall portion 7, a receiving portion 8 opened at one end of the body wall portion 7, and a bottom wall portion 9 closing the other end of the body wall portion 7. Then, as shown in FIG. 3, first to third sealing surfaces 10 to 12 are provided inside the receiving portion 8 of the lid member 5. The first sealing surface 10 has a tapered shape that crosses the axis C of the lid member 5, that is, gradually expands outward in the direction of the axis C, at a position inside the entrance of the receiving portion 8 of the lid member 5. It is composed of planes. The second sealing surface 11 is formed at the entrance of the receiving portion 8 by a tapered surface that crosses the axis C, that is, gradually increases in diameter outward in the direction of the axis C. The third seal surface 12 is formed by an annular groove 13 formed in the inner part of the receiving portion 8 of the lid member 5 and radially outward of the first seal surface 10 in parallel with the axis C. A male screw 14 is formed on the outer periphery of the receiving portion 8 of the lid member 5.
[0031]
On the other hand, an inner ring 15 made of a synthetic resin such as a fluororesin is pressed into one end and the other end of the tube 4. As shown in FIG. 3, the inner ring 15 is press-fitted into the end of the tube 4 to expand and expand the end into a mountain-shaped cross-section. It is formed in a sleeve shape having a protruding portion 17 which is continuously provided and protrudes from the end of the tube 4. The press-fitting portion 16 having a mountain-shaped cross section is formed by holding the end of the tube 4 in an inclined state between the outwardly tapered surface 18 on one slope and the second sealing surface 11 on the other slope. The tapered inward surfaces 20 forming the seal portions 21 are formed. At the tip of the projecting portion 17, a projecting end surface 22 formed of a tapered surface which is in close contact with the first seal surface 10 to form a first seal portion 19, and a third end which fits in the annular groove portion 13. A cylindrical portion 24 forming the seal portion 23 is formed. The inner diameter of the inner ring 15 is set to be equal to or substantially equal to the inner diameter of the tube 4 so that the fluid flows smoothly without stagnation.
[0032]
As shown in FIG. 3, the union nut 6 has a female screw 25 formed on the inner periphery thereof, the female screw 25 being screwed to the male screw 14 of the lid member 5, and an annular flange 26 protruding inward at one end. An acute or right angle pressing edge portion 26a is provided at an axial inner end of the inner peripheral surface of the annular flange portion 26.
[0033]
Then, the end of the tube 4 into which the inner ring 15 is press-fitted is inserted into the receiving portion 8 of the lid member 5, and the female screw 25 of the union nut 6 loosely fitted in advance on the outer periphery of the end of the tube 4 is closed. It is screwed into the male screw 14 of the member 5 and tightened. With this tightening, the pressing edge portion 26a of the union nut 6 comes into contact with the enlarged diameter root portion of the enlarged diameter portion 27 of the tube 4 and presses the inner ring 15 from the axial direction. Thereby, as shown in FIG. 3, the protruding end surface 22 of the inner ring 15 is pressed against the first seal surface 10 of the lid member 5 to form the first seal portion 19, and the inner ring 15 faces inward. The end of the tube 4 is sandwiched between the tapered surface 20 and the second seal surface 11 of the lid member 5 in an inclined state to form a second seal portion 21, and the cylindrical portion 24 of the inner ring 15 is annular. The third seal portion 23 is formed by press-fitting into the groove portion 13. The first to third seal portions 19, 21 and 23 exhibit a highly reliable sealing function.
[0034]
As shown in FIG. 2, the lid member 5 at one end of the tube 4 has a connecting portion 29a to which a heat exchange fluid introduction pipe 28a, which is another pipe, is connected, and the lid member 5 at the other end. Is provided with a connecting portion 29b to which a lead-out pipe 28b, which is another pipe, is connected. That is, the connection portions 29a and 29b to the other pipes are provided with the inlet port 30 for heat exchange fluid such as temperature control water in the body wall 7 of one lid member 5 and the body wall 7 of the other lid member 5. An outlet port 31 is formed, and an end of the heat exchange fluid introducing pipe 28a is formed at the inlet port 30, and an end of the heat exchange fluid outlet pipe 28b is formed at the outlet port 31. Is connected via an union nut 32 and an inner ring 33 made of synthetic resin such as fluororesin, so that the heat exchange fluid flows through the inlet port 30, the heat exchange chamber 2 in the tube 4, and the outlet port 31 in this order. I have.
[0035]
The internal structure of each of the inlet port 30 and the outlet port 31 is the same as the internal structure of the receiving port 8 of the cover member 5 (however, the diameter is different), and the inlet pipe 28a and the outlet pipe 28b for the heat exchange fluid are provided. At each end, an inner ring 33 having the same cross-sectional shape as the inner ring 15 at the end of the tube 4 is press-fitted, and each of an inlet pipe 28a and an outlet pipe 28b for the inlet port 30 and the outlet port 31 is inserted. The connection structure at the end is the same as the connection structure of the end of the tube 4 to the receptacle 8 of the lid member 5, and thus a detailed description thereof will be omitted. However, the connection structure of each end of the heat exchange fluid introducing pipe 28a and the discharge pipe 28b to the inlet port 30 and the outlet port 31 is, in addition, the heat exchange fluid is connected to the inlet port 30 and the outlet port 31. Means such as direct welding or screw connection of each end of the introduction pipe 28a and the lead-out pipe 28b may be employed. That is, the connection portions 29a and 29b with other pipes may be connection means such as welding and screw connection.
[0036]
On the other hand, a heat exchange tube 3 made of a coil tube made of a synthetic resin such as a fluororesin through which a chemical solution passes passes through the inside of the tube 4, and both ends of the heat exchange tube 3 are opened to the bottom wall 9 of the lid member 5. The liquid is supplied from the outlet 34 and connected to the supply flow pipe 102 of the piping system of the chemical liquid supply piping system B. A union nut 35 made of a synthetic resin such as a fluororesin is externally fitted to the leading end of the heat exchange tube 3, and the union nut 35 is fastened to the outlet 34 via a ferrule 36 made of a synthetic resin such as a fluororesin. This seals the gap between the outlet 34 and the end of the heat exchange tube 3.
[0037]
The heat exchanger configured in this manner passes through the heat exchange tube 3, for example, a fluid such as a chemical solution, and a heat exchange fluid such as temperature regulating water passing outside the heat exchange tube 3 in the cylindrical casing body 4. The heat exchange is performed between the heat exchange tube 3 and the heat exchange fluid such as a temperature control water and the like. It is also possible to pass a heat exchange fluid such as temperature-regulated water into the exchange tube 3 and a fluid such as a chemical solution outside the heat exchange tube 3.
[0038]
Outlets 34 for leading both ends of the heat exchange tube 3 to the outside of the casing 1 are opened in the body wall 7 of the lid member 5, and an inlet port 30 and an outlet port 31 for a fluid such as a chemical solution are covered with a lid. It can also be provided on the bottom wall 9 of the member 5.
[0039]
In addition, the heat exchange tube 3 through which a fluid such as a chemical solution or a heat exchange fluid such as temperature-regulated water passes may be constituted by a single straight tube made of fluororesin instead of the coil tube, or a conventional one shown in FIG. And a plurality of straight tubes made of a synthetic resin such as a fluorine resin as in the case of the heat exchanger.
[0040]
(Other Examples of Tube Device)
As the tube device, in addition to the heat exchanger 114, the filter device shown in FIGS. 4 and 5, the ultrasonic flow meter of FIG. 6, the manual deaeration device of FIG. 7, the automatic deaeration device of FIG. The degassing module shown in FIG. 9 and the like can be adopted, and they are interposed and arranged at appropriate places in the piping system of the chemical liquid supply piping system B according to the functions that each has independently.
[0041]
In FIG. 4, the filter device 115 accommodates the filter member 3 as a device element inside the casing 1. As the filter member 3, for example, a functional powder such as ceramics, activated carbon, or titanium oxide is contained in a carrier such as a synthetic fiber, and pure water flowing from an inlet port 30 provided in the cover member 5 is filtered. 3 into ultrapure water or an ion-exchange resin such as silica gel contained in a carrier. Pure water or a chemical solution flowing from the inlet port 30 is passed through the filter member 3 so that pure water or a chemical Or to remove metal ions contained in.
[0042]
The casing 1 of the filter device 115 includes a tube 4, a lid member 5 for sealing both ends of the tube 4 in a sealed manner, and a union nut 6 for fastening the lid member 5 to an end of the tube 4. An inlet port 30 and an outlet port 31 provided on the lid members 5 are connected to appropriate positions in a piping system of the chemical liquid supply piping system B. Since the respective configurations of the tube 4, the lid member 5, and the union nut 6 are the same as those of the heat exchanger 114, the same members and the same components are denoted by the same reference numerals, and description thereof will be omitted.
[0043]
FIG. 5 shows another example of the filter device 115. The filter device 116 contains a filter member 3 made of a hollow fiber membrane as a device element inside the casing 1. For example, pure water is passed through the filter member 3 to make ultrapure water. Except for the above, the configuration is the same as that of the filter device 115 described above. Therefore, the same members and the same elements are denoted by the same reference numerals and description thereof will be omitted.
[0044]
In FIG. 6, the ultrasonic flowmeter 117 includes a tube 1, a lid member 5 for sealing both ends of the tube 4 in a sealed manner, and a lid member, similarly to the case of the heat exchanger 114. It has a union nut 6 for tightening 5 to the end of the tube 4. As device elements, an ultrasonic oscillator 51 for an ultrasonic flowmeter is provided on one bottom wall 9 of the lid members 5 at both ends of the tube 4 of the casing 1, and an ultrasonic receiver is provided on the other bottom wall 9. 52 are incorporated.
In such a case, for example, pure water or ultrapure water flows from the inlet port 30 provided in the body wall portion 7 of one lid member 5 and flows through the tube 4 toward the outlet port 31 provided in the other lid member 5. That is, the flow rate can be measured using the Doppler displacement of ultrasonic waves due to the flow of water or a chemical solution. An inlet port 30 and an outlet port 31 provided on the lid members 5 are connected to appropriate positions in a piping system of the chemical liquid supply piping system B. The other structures of the casing 1 and the connection structure between the end of the tube 4 and the lid member 5 are the same as those of the heat exchanger 114, and therefore the same members and the same elements are denoted by the same reference numerals and their description. Is omitted.
[0045]
In FIG. 7, the manual deaeration device 118 includes a tube 4 in which the casing 1 is disposed in a vertical position, a pair of upper and lower lid members 5 that seal the upper and lower ends of the tube 4 in a sealed manner, and A union nut 6 for fastening the lid member 5 to the upper and lower ends of the tube 4 is provided. As the device elements, the inlet port 30 is incorporated in the body wall portion 7 of the upper lid member 5, the air vent tube 53 and the manual air vent valve 54 are incorporated in the bottom wall portion 9. An outlet port 31 is provided in the body wall portion 7 of the lower lid member 5. At this time, by opening the air vent valve 54, the air stays in the tube 4 from the inlet port 30 of the upper lid member 5 and flows out to the outlet port 31 of the lower lid member 5, for example, pure water or ultra-pure water. That is, air bubbles in pure water or a chemical solution can be removed. An inlet port 30 and an outlet port 31 provided on the lid members 5 are connected to appropriate positions in a piping system of the chemical liquid supply piping system B. The other connection structure between the end of the casing 1 and the tube 4 and the lid member 5 is the same as that of the heat exchanger 114, and therefore the same members and the same elements are denoted by the same reference numerals and description thereof will be omitted. I do.
[0046]
In FIG. 8, the automatic deaeration device 119 includes an automatic air bleeding valve 55 that operates in conjunction with a liquid level sensor 56 disposed outside the tube 4 arranged in the vertical position, to the air bleeding tube 53. When the liquid level sensor 56 detects the liquid level in the tube 4 with the liquid level sensor 56, the air vent valve 55 is opened and the air accumulated in the liquid is discharged, except for the manual degassing device shown in FIG. This is the same as the configuration and operation in the case. For this reason, the same members and the same elements are denoted by the same reference numerals and description thereof will be omitted.
[0047]
In FIG. 9, a degassing module 120 is a device in which a plurality of gas-permeable tubes 57 made of a foamed fluororesin are passed through a tube 4 as a device element in a bundled state, and a degassing port 58 is provided in a lid member 5. It is. Both ends of the gas permeable tube 57 are connected to an inflow pipe 61 and an outflow pipe 62 respectively passed through an inlet 59 and an outlet 60 provided in each bottom wall 9 of the lid member 5 at both ends of the tube 4. The inflow pipe 61 and the outflow pipe 62 are connected to appropriate locations in the piping system of the chemical solution supply piping system B.
[0048]
Now, for example, when a chemical solution is passed from the inflow pipe 61 into the gas permeable tube 57 while the inside of the tube 4 is depressurized from the deaeration port 58 by a vacuum pump or the like, gas such as air dissolved in the chemical solution becomes gas permeable. This is a degassing module that passes through the peripheral wall of the tube 57 and is removed to the outside of the gas permeable tube 57 to perform degassing, and the chemical solution after degassing is discharged to the outflow pipe 62. The other connection structure between the end of the casing 1 and the tube 4 and the lid member 5 is the same as that of the heat exchanger 114, and therefore the same members and the same elements are denoted by the same reference numerals and description thereof will be omitted. I do.
[0049]
The degassing module 120 shown in FIG. 9 can also be used as a gas dissolving device. When used as a gas dissolving device, the deaeration port 58 is used as a dissolving gas supply port, and while a dissolving gas such as ozone is supplied under pressure into the tube 4, for example, ultrapure water or a chemical solution is supplied from the inflow pipe 61. When the gas passes through the gas permeable tube 57, the soluble gas in the tube 4 passes through the peripheral wall of the gas permeable tube 57 and is dissolved in ultrapure water or a chemical solution in the gas permeable tube 57. The liquid to be treated can be used for a gas dissolving device that discharges the liquid to the outflow pipe 62.
[0050]
(Other Examples of Casing of Tube Device)
As the overall shape of the casing 1 of the tube device, instead of being formed into a straight tube as in each of the above embodiments, an applied form such as an L shape as shown in FIG. 10 or a U shape as shown in FIG. Can be adopted. In this case, the L-shaped casing 1 shown in FIG. 10 has two first and second tubes 4A and 4B, two first and second lid members 5A and 5B, and one elbow-shaped fluororesin. A joining member 39 made of a synthetic resin is used, and in the U-shaped casing 1 shown in FIG. 10, three first, second, and third tubes 4A, 4B, 4C, two first and second lid members 5A, 5B and two first and second joining members 39A and 39B made of synthetic resin such as an elbow-shaped fluororesin.
[0051]
In the L-shaped casing 1 shown in FIG. 10, the other ends of the first and second tubes 4A, 4B in which the first and second lid members 5A, 5B are connected to the respective one ends by the first union nut 6A. Are connected to each other by one elbow-shaped joining member 39 and a pair of second union nuts 40B. In this case, the connection structure for connecting the first and second lid members 5A and 5B to one end of each of the first and second tubes 4A and 4B is described below. The structure is the same as that of the connection structure with the member 5.
[0052]
The joining member 39 is opened at both ends thereof so as to communicate the receiving ports 41 at right angles to each other. The internal structure of each receiving port 4 is the same as the internal structure of the receiving section 8 of the lid member 5. Since the inner ring 15 having the same cross-sectional shape as the inner ring 15 at each end is press-fitted into the other end of each of the tubes 1A and 4B, the first tube is inserted into the socket 41 at one end of the joining member 39. The other end of the second tube 4B is connected to the other end of the tube 4A, and the other end of the second tube 4B is connected to the other end 41 of the first and second tubes 4A and 4B. The lid members 5A and 5B are connected via the same connection structure as that of the connection structure to the receptacle 8. The fluid tube 3 is bent at a right angle inside the joining member 39.
[0053]
In the U-shaped casing 1 shown in FIG. 11, a lid member 5 is connected to one end of each of the first and second tubes 4 A and 4 B by a first union nut 6. The tube 4C is connected by two elbow-shaped joining members 39 and a pair of second union nuts 40B. Also in this case, the connection structure for connecting the receptacle 8 of the first and second lid members 5 to one end of each of the first and second tubes 4A and 4B is the same as that of the end of the tube 4 of each of the above-described embodiments. The configuration is the same as in the case of the connection structure between the unit and the lid member 5. Then, a connection structure for connecting the receptacle 41 of each joining member 39 to the other end of each of the first and second tubes 4A and 4B, and the connecting structure of each joining member 39 to both ends of the third tube 4C. The connection structure for connecting the receptacle 41 is connected in the same manner as the connection structure for the receptacle 8 of the first and second lid members 5 at one end of the first and second tubes 4A and 4B, respectively. You. The fluid tube 3 is bent at a right angle inside each joint member 39.
Note that the casing 1 may be configured in a shape obtained by combining the L-shaped casing 1 in FIG. 10 and the U-shaped casing 1 in FIG.
[0054]
As described above, by forming the casing 1 of the tube device into an L shape or a U shape, a compact piping system can be assembled by effectively utilizing the dead space of the piping. Further, it is advantageous that the shape can be adapted to a modification request of the piping system such as a case where a tube device is newly installed in the existing piping.
[0055]
(Other Examples of Sealing Part)
As the seal portion formed between the end of the tube 4 and the receiving portion 8 of the lid member 5, in addition to the first and second seal portions 19 and 21 as in the embodiment shown in FIG. By adding the third seal portion 23 formed by the cylindrical portion 24 of the inner ring 15 and the annular groove portion 13 of the lid member 5, the sealing performance can be more reliably improved, but is not necessarily limited to this. Absent. In addition, for example, as shown in FIG. 12, only the first and second seal portions 19 and 21 are formed and the third seal portion 23 is omitted, that is, the annular groove portion 13 is provided in the inner part of the lid member 5. May not be provided, and the cylindrical portion 24 may not be provided on the inner ring 15. In this case, the first sealing surface 10 provided inside the lid member 5 has a crossing shape opposite to the axis C with respect to the second sealing surface 11, that is, gradually contracts outward in the direction of the axis C. It is constituted by a tapered surface that has a diameter.
[0056]
As shown in FIG. 13, a sealing surface 42 formed of a tapered surface having a diameter larger than the inner diameter of the tube 4 is formed on the outer periphery of the end of the receiving portion 8 of the lid member 5 on the distal end side. A male screw 14 having a diameter larger than the outer diameter of the sealing surface 42 is formed on the outer periphery at the rear. On the other hand, the end of the tube 4 is flared to form an enlarged diameter portion 43. Thus, the enlarged diameter portion 43 at the end of the tube 4 is pressed into the sealing surface 42 of the lid member 5. Then, the female screw 25 of the union nut 6 externally fitted to the tube 4 is screwed into the male screw 14 of the lid member 5 and tightened, and the pressing edge 26 a of the annular flange 26 of the union nut 6 is applied to the outside of the tube 4. The sealing portion 44 can also be formed by pressing the inner peripheral surface of the enlarged diameter portion 43 against the sealing surface 42 of the receiving portion 8 from the axial direction so as to be in close contact therewith.
[0057]
As shown in FIG. 14, an inner ring 45 made of synthetic resin such as fluororesin and having an arc-shaped cross section is press-fitted into the end of the tube 4 to expand and expand the end of the tube 4 into a mountain-shaped cross section. The union nut 6 screwed into the male screw 14 of FIG. 5 is screwed forward and strongly tightened, so that the end of the tube 4 together with the inner ring 45 is tapered at the inner periphery of the receptacle 8 of the lid member 5. A seal structure in which the seal portion 47 is formed by pressing the seal surface 46 into close contact therewith may be employed.
[0058]
As shown in FIG. 15, a union in which an outer ring 48 is fitted into the end of the tube 4, the end of the tube 4 is folded over the outer surface of the outer ring 48, and screwed to the male screw 14 of the lid member 5. By screwing the nut 6 and tightening it tightly, the end of the tube 4 is pressed together with the outer ring 48 against the sealing surface 49 in the receiving portion 8 of the lid member 5 so that the sealing portion 50 is tightly attached. The seal structure may be formed.
[0059]
Of course, it goes without saying that the present invention can be similarly applied to various piping systems other than the chemical supply piping system of the semiconductor manufacturing apparatus.
[Brief description of the drawings]
FIG. 1 is a schematic cross-sectional view showing an overall configuration of a semiconductor wafer (substrate) cleaning apparatus including a chemical solution supply piping system which is an example of a piping system of the present invention.
FIG. 2 is a cross-sectional view of a heat exchanger which is an example of the tube device in FIG.
FIG. 3 is an enlarged cross-sectional view of a connection structure between a tube end and a lid member of the heat exchanger of FIG. 2;
FIG. 4 is a sectional view of a filter device which is another example of the tube device.
FIG. 5 is a cross-sectional view showing another example of the filter device.
FIG. 6 is a sectional view of an ultrasonic flowmeter which is another example of the tube device.
FIG. 7 is a cross-sectional view of a manual deaeration device as still another example of the tube device.
FIG. 8 is a sectional view of an automatic deaeration device as still another example of the tube device.
FIG. 9 is a sectional view of a degassing module which is still another example of the tube device.
FIG. 10 is a sectional view showing another example of the casing of the tube device.
FIG. 11 is a sectional view showing still another example of the casing of the tube device.
FIG. 12 is a cross-sectional view showing another example of the sealing portion of the tube device.
FIG. 13 is a cross-sectional view showing still another example of the sealing portion of the tube device.
FIG. 14 is a cross-sectional view showing still another example of the sealing portion of the tube device.
FIG. 15 is a cross-sectional view showing still another example of the sealing portion of the tube device.
FIG. 16 is a front view of a conventional tube device (heat exchanger).
FIG. 17 is a cross-sectional view of the heat exchanger of FIG.
[Explanation of symbols]
1 casing
3 Filter member
4,4A, 4B, 4C tube
5,5A, 5B Lid member
6 First union nut
8 Receiving part
10, 11, 12, 42, 46, 49 Sealing surface
13 annular groove
15 Inner ring
16 Press-fit section
17 Projection
19, 21, 23, 44, 47, 50 Seal part
20 Inward tapered surface
22 Projecting end face
24 cylindrical part
28a, 28b Piping for fluid introduction and discharge
29a, 29b connection
39, 39A, 39B Joining member
40 Second union nut
51 Ultrasonic oscillator
52 ultrasonic receiver
54 Manual valve for venting
55 Automatic valve for bleeding air
57 Gas permeable tube
58 Deaeration port / soluble gas supply port
114 heat exchanger
115,116 Filter device
117 Ultrasonic flowmeter
118 Manual degassing device
119 Automatic deaeration device
120 Degassing module

Claims

A piping system such as a semiconductor manufacturing apparatus in which a tube device having a device element provided in a casing is interposed in the middle of the piping system,
Said casing,
A pair of synthetic resin tubes having a synthetic resin tube, a receiving portion for receiving one end and the other end of the tube, and at least one sealing surface provided in the receiving portion; ,
A union nut made of a synthetic resin screwed to one end and the other end of the tube, and screwed to one end of the lid member,
The union nut presses the tube from the outside thereof by screwing to one end of the lid member, and the pressing action forms the end of the tube and the sealing surface of the lid member in close contact. At least one sealed portion,
A piping system for a semiconductor manufacturing apparatus or the like, comprising:

A sealing surface formed by a tapered surface that gradually expands toward the outside in the axial direction of the lid member, wherein the sealing portion has an inner portion deeper than an inlet of a receiving portion of the lid member, and an end portion of the tube. The inner ring is press-fitted so as to expand its end into a mountain-shaped cross-section, and is formed by close contact with a protruding end surface formed of a tapered surface formed at the tip of a protruding portion protruding from the end of the tube. The piping system of the semiconductor manufacturing apparatus or the like according to claim 1, wherein

The sealing portion has a sealing surface formed by a tapered surface intersecting with the axis of the lid member at the entrance of the receiving portion of the lid member, and the end portion of the tube has a mountain-shaped cross section at the end portion. A seal portion is formed by sandwiching the end of the tube in an inclined state between the inner ring and the inwardly tapered surface formed on the slope of the press-fit portion of the inner ring press-fit so as to expand and expand. A piping system such as the semiconductor manufacturing apparatus according to claim 1.

An inner ring in which the seal portion is press-fitted into an end portion of the tube in an annular groove formed radially outward of the seal surface inside the receiving portion of the lid member and parallel to the axis of the lid member. The piping system for a semiconductor manufacturing apparatus or the like according to claim 2, wherein a cylindrical portion formed at a tip of the protruding portion is fitted to form a seal portion.

A piping system such as a semiconductor manufacturing apparatus in which a tube device having a device element provided in a casing is interposed in the middle of the piping system,
The casing includes first and second synthetic resin tubes arranged at right angles to each other, and a synthetic resin lid member is provided at one end of each of the first and second tubes with a first union made of synthetic resin. The other ends of the first and second tubes are connected to each other by one elbow-shaped synthetic resin joining member and a pair of synthetic resin second union nuts.
The lid member has a receiving portion for receiving one end of each of the first and second tubes, and at least one sealing surface provided in the receiving portion,
The first union nut is externally fitted to one end of each of the first and second tubes, and is screwed to one end of the lid member. The first union nut is screwed to one end of the lid member to tighten the screw. Each of the first and second tubes is pressed from the outside thereof, and by this pressing action, one end of each of the first and second tubes is brought into close contact with the sealing surface of the lid member to form at least one seal portion. And
The joining member is formed so that the receiving ports communicate with each other at right angles at both ends, the other end of the first tube is provided at one receiving port, and the other end of the second tube is provided at the other receiving port. Are connected through the same connection structure as in the case of the connection structure of the one end of each of the first and second tubes to the receptacle of the lid member, wherein the piping is a semiconductor manufacturing apparatus or the like. system.

A piping system such as a semiconductor manufacturing apparatus in which a tube device having a device element provided in a casing is interposed in the middle of the piping system,
The casing is a synthetic resin first and second tubes arranged in parallel and opposed to each other, and a synthetic resin first union nut connected to one end of each of the first and second tubes. A lid member and a synthetic resin second joint nut connected between the other ends of the first and second tubes by two elbow-shaped synthetic resin joining members and a pair of synthetic resin second union nuts. And three tubes,
The lid member has a receiving portion for receiving one end of each of the first and second tubes, and at least one sealing surface provided in the receiving portion,
The first union nut is externally fitted to one end of each of the first and second tubes, and is screwed to one end of the lid member. The first union nut is screwed to one end of the lid member to tighten the screw. Each of the first and second tubes is pressed from the outside thereof, and by this pressing action, one end of each of the first and second tubes is brought into close contact with the sealing surface of the lid member to form at least one seal portion. And
A third connecting structure for connecting the receiving ports of the respective connecting members to the other ends of the first and second tubes; The connection structures for connecting the receptacles of the respective joining members to both ends of the tube are connected in the same manner as the connection structure for the receptacles of the lid members at one end of the first and second tubes, respectively. A piping system for a semiconductor manufacturing device or the like.

The piping system of a semiconductor manufacturing device or the like according to any one of claims 1 to 6, wherein the tube, the lid member, and the union nut are all made of a fluororesin.

The device element is for introducing a fluid that passes between the inside of the casing and the outside of the heat exchange tube, which is provided on the lid member and provided with the heat exchange tube made of fluororesin passed through the casing. The piping system for a semiconductor manufacturing apparatus or the like according to claim 1, wherein the piping system is a connection part to which the piping for connection is connected.

The piping system of a semiconductor manufacturing apparatus or the like according to any one of claims 1 to 7, wherein the device element is a filter member housed in the casing.

The semiconductor manufacturing apparatus according to any one of claims 1 to 7, wherein the device elements are an ultrasonic oscillator and an ultrasonic receiver for an ultrasonic flowmeter incorporated in lid members at both ends of the tube. Etc. plumbing system.

The piping system of a semiconductor manufacturing apparatus or the like according to any one of claims 1 to 7, wherein the device element is a manual or automatic valve for air release incorporated in the lid member.

The piping system of a semiconductor manufacturing apparatus or the like according to any one of claims 1 to 7, wherein the device elements are a gas permeable tube passed through the tube and a deaeration port provided in a lid member. .

The semiconductor manufacturing apparatus according to any one of claims 1 to 7, wherein the device elements are a gas permeable tube passed through the tube and a soluble gas supply port provided in the lid member. Plumbing system.

14. The piping system of a semiconductor manufacturing apparatus or the like according to claim 12, wherein the gas-permeable tube is made of a foamed fluororesin.