JP3983341B2 - 炭化珪素、及び炭化珪素の製造方法 - Google Patents
炭化珪素、及び炭化珪素の製造方法 Download PDFInfo
- Publication number
- JP3983341B2 JP3983341B2 JP12308597A JP12308597A JP3983341B2 JP 3983341 B2 JP3983341 B2 JP 3983341B2 JP 12308597 A JP12308597 A JP 12308597A JP 12308597 A JP12308597 A JP 12308597A JP 3983341 B2 JP3983341 B2 JP 3983341B2
- Authority
- JP
- Japan
- Prior art keywords
- silicon carbide
- grown
- silicon
- layer
- antiphase boundary
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Chemical Vapour Deposition (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12308597A JP3983341B2 (ja) | 1997-04-26 | 1997-04-26 | 炭化珪素、及び炭化珪素の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12308597A JP3983341B2 (ja) | 1997-04-26 | 1997-04-26 | 炭化珪素、及び炭化珪素の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPH10297998A JPH10297998A (ja) | 1998-11-10 |
| JPH10297998A5 JPH10297998A5 (enExample) | 2005-03-17 |
| JP3983341B2 true JP3983341B2 (ja) | 2007-09-26 |
Family
ID=14851843
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12308597A Expired - Fee Related JP3983341B2 (ja) | 1997-04-26 | 1997-04-26 | 炭化珪素、及び炭化珪素の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3983341B2 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3650727B2 (ja) | 2000-08-10 | 2005-05-25 | Hoya株式会社 | 炭化珪素製造方法 |
| JP6702268B2 (ja) * | 2017-06-15 | 2020-05-27 | 信越半導体株式会社 | エピタキシャルウェーハの製造方法 |
| KR20230021993A (ko) * | 2021-08-06 | 2023-02-14 | 주성엔지니어링(주) | SiC 기판의 제조 방법 |
-
1997
- 1997-04-26 JP JP12308597A patent/JP3983341B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH10297998A (ja) | 1998-11-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0632145B1 (en) | Method of forming crystalline silicon carbide coatings | |
| JP7609865B2 (ja) | 複合基板のための高抵抗率ハンドル支持体を形成する方法 | |
| KR101632947B1 (ko) | Sic 에피택셜 필름을 갖는 sic 기판 | |
| EP0619599B1 (en) | Thin film single crystal substrate | |
| KR100287489B1 (ko) | 저온에서결정성탄화규소피막을형성시키는방법 | |
| JP2002220299A (ja) | 単結晶SiC及びその製造方法、SiC半導体装置並びにSiC複合材料 | |
| JPH06216050A (ja) | 単結晶炭化ケイ素層を有するウエーハの製造方法 | |
| EP1751329A1 (en) | Method of growing sic single crystal and sic single crystal grown by same | |
| US6416578B1 (en) | Silicon carbide film and method for manufacturing the same | |
| KR101302845B1 (ko) | 탄화규소 기판의 표면 재구성 방법 | |
| CN117448969A (zh) | 一种超大单晶畴半导体石墨烯及其制备方法 | |
| US20240401229A1 (en) | Composite substrate and manufacturing method thereof | |
| JP3628079B2 (ja) | 炭化珪素薄膜製造方法並びに炭化珪素薄膜および積層基板 | |
| JP3983341B2 (ja) | 炭化珪素、及び炭化珪素の製造方法 | |
| JP3915252B2 (ja) | 炭化けい素半導体基板の製造方法 | |
| JPH10261615A (ja) | SiC半導体の表面モホロジー制御方法およびSiC半導体薄膜の成長方法 | |
| US6475456B2 (en) | Silicon carbide film and method for manufacturing the same | |
| JP3657036B2 (ja) | 炭化ケイ素薄膜および炭化ケイ素薄膜積層基板の製造方法 | |
| JP3735145B2 (ja) | 炭化珪素薄膜およびその製造方法 | |
| JP3405687B2 (ja) | 炭化珪素膜の製造方法 | |
| Maruyama et al. | Growth of (111) HgCdTe on (100) Si by MOVPE using metalorganic tellurium adsorption and annealing | |
| JPH07335562A (ja) | 炭化珪素の成膜方法 | |
| JPH09255495A (ja) | 炭化珪素膜及びその形成方法 | |
| CN116623293A (zh) | 一种复合碳化硅衬底及其制备方法和应用 | |
| JP2000012462A (ja) | シリコンカーバイド結晶膜の形成方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20040422 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20040422 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20070323 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20070417 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070530 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20070703 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20070704 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100713 Year of fee payment: 3 |
|
| R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110713 Year of fee payment: 4 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110713 Year of fee payment: 4 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120713 Year of fee payment: 5 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120713 Year of fee payment: 5 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130713 Year of fee payment: 6 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |