JP3972889B2 - 発光装置およびそれを用いた面状光源 - Google Patents

発光装置およびそれを用いた面状光源 Download PDF

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Publication number
JP3972889B2
JP3972889B2 JP2003366046A JP2003366046A JP3972889B2 JP 3972889 B2 JP3972889 B2 JP 3972889B2 JP 2003366046 A JP2003366046 A JP 2003366046A JP 2003366046 A JP2003366046 A JP 2003366046A JP 3972889 B2 JP3972889 B2 JP 3972889B2
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JP
Japan
Prior art keywords
light
light emitting
wall surface
emitting device
emitting element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2003366046A
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English (en)
Japanese (ja)
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JP2004207688A5 (https=
JP2004207688A (ja
Inventor
昌志 石田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Original Assignee
Nichia Corp
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Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Priority to JP2003366046A priority Critical patent/JP3972889B2/ja
Publication of JP2004207688A publication Critical patent/JP2004207688A/ja
Publication of JP2004207688A5 publication Critical patent/JP2004207688A5/ja
Application granted granted Critical
Publication of JP3972889B2 publication Critical patent/JP3972889B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5366—Shapes of wire connectors the bond wires having kinks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Liquid Crystal (AREA)
  • Light Guides In General And Applications Therefor (AREA)
  • Planar Illumination Modules (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP2003366046A 2002-12-09 2003-10-27 発光装置およびそれを用いた面状光源 Expired - Fee Related JP3972889B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003366046A JP3972889B2 (ja) 2002-12-09 2003-10-27 発光装置およびそれを用いた面状光源

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002356464 2002-12-09
JP2003366046A JP3972889B2 (ja) 2002-12-09 2003-10-27 発光装置およびそれを用いた面状光源

Publications (3)

Publication Number Publication Date
JP2004207688A JP2004207688A (ja) 2004-07-22
JP2004207688A5 JP2004207688A5 (https=) 2006-10-05
JP3972889B2 true JP3972889B2 (ja) 2007-09-05

Family

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Family Applications (1)

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JP2003366046A Expired - Fee Related JP3972889B2 (ja) 2002-12-09 2003-10-27 発光装置およびそれを用いた面状光源

Country Status (1)

Country Link
JP (1) JP3972889B2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8410502B2 (en) 2009-09-01 2013-04-02 Sharp Kabushiki Kaisha Light-emitting device, planar light source including the light-emitting device, and liquid crystal display device including the planar light source

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7419839B2 (en) * 2004-11-12 2008-09-02 Philips Lumileds Lighting Company, Llc Bonding an optical element to a light emitting device
JP4608294B2 (ja) * 2004-11-30 2011-01-12 日亜化学工業株式会社 樹脂成形体及び表面実装型発光装置並びにそれらの製造方法
JP2006351708A (ja) * 2005-06-14 2006-12-28 Toyoda Gosei Co Ltd 発光ダイオードランプ及び光源装置
JP4923771B2 (ja) * 2005-06-17 2012-04-25 三菱化学株式会社 表示装置
JP4778745B2 (ja) * 2005-07-27 2011-09-21 パナソニック株式会社 半導体発光装置及びその製造方法
TWI355100B (en) * 2005-09-30 2011-12-21 Nichia Corp Light-emitting device and backlight unit using the
KR100637476B1 (ko) * 2005-11-09 2006-10-23 알티전자 주식회사 측면발광 다이오드 및 그 제조방법
KR100780176B1 (ko) 2005-11-25 2007-11-27 삼성전기주식회사 측면 방출 발광다이오드 패키지
JP5722759B2 (ja) * 2006-04-21 2015-05-27 日亜化学工業株式会社 発光装置
JP5119621B2 (ja) * 2006-04-21 2013-01-16 日亜化学工業株式会社 発光装置
WO2007135707A1 (ja) 2006-05-18 2007-11-29 Nichia Corporation 樹脂成形体及び表面実装型発光装置並びにそれらの製造方法
KR100792034B1 (ko) * 2006-08-21 2008-01-04 알티전자 주식회사 측면발광 다이오드
WO2008041587A1 (fr) * 2006-09-27 2008-04-10 Masaaki Kano Circuit d'alimentation électrique pour dispositif électrique, dispositif d'éclairage à diodes électroluminescences et batterie équipée d'un circuit d'alimentation en puissance de charge
JP5380774B2 (ja) 2006-12-28 2014-01-08 日亜化学工業株式会社 表面実装型側面発光装置及びその製造方法
EP2136414B1 (en) * 2007-03-26 2015-12-23 Nichia Corporation Side-view light emitting device
JP5196107B2 (ja) * 2007-03-29 2013-05-15 日亜化学工業株式会社 発光装置
JP4983348B2 (ja) * 2007-04-04 2012-07-25 豊田合成株式会社 発光装置
KR101326888B1 (ko) 2007-06-20 2013-11-11 엘지이노텍 주식회사 반도체 발광소자 패키지
US7905618B2 (en) 2007-07-19 2011-03-15 Samsung Led Co., Ltd. Backlight unit
KR100951274B1 (ko) * 2007-07-19 2010-05-06 삼성엘이디 주식회사 백라이트 유닛
JP5358104B2 (ja) * 2008-02-25 2013-12-04 豊田合成株式会社 発光装置
JP5236406B2 (ja) * 2008-03-28 2013-07-17 ローム株式会社 半導体発光モジュールおよびその製造方法
JP5549759B2 (ja) * 2013-05-22 2014-07-16 日亜化学工業株式会社 発光装置及び面発光装置並びに発光装置用パッケージ
JP6414427B2 (ja) 2013-10-03 2018-10-31 日亜化学工業株式会社 発光装置実装構造体
FR3078140B1 (fr) * 2018-02-19 2020-09-11 Automotive Lighting Rear Lamps France Dispositif de signalisation de securite attractive pour un vehicule automobile
JP7778663B2 (ja) * 2022-09-13 2025-12-02 Ｎｉｓｓｈａ株式会社 樹脂成形品の製造方法及び樹脂成形品

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60179058U (ja) * 1984-05-04 1985-11-28 株式会社　シチズン電子 フラツト型発光ダイオ−ド
JPH0350540Y2 (https=) * 1989-02-27 1991-10-29
JP3217322B2 (ja) * 1999-02-18 2001-10-09 日亜化学工業株式会社 チップ部品型発光素子
JP2001015542A (ja) * 1999-07-02 2001-01-19 Sanken Electric Co Ltd 半導体装置及びその製造方法
JP3708026B2 (ja) * 2001-04-12 2005-10-19 豊田合成株式会社 Ｌｅｄランプ
JP4230777B2 (ja) * 2001-05-14 2009-02-25 日亜化学工業株式会社 発光装置及び車両用表示装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8410502B2 (en) 2009-09-01 2013-04-02 Sharp Kabushiki Kaisha Light-emitting device, planar light source including the light-emitting device, and liquid crystal display device including the planar light source

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