JP3966765B2 - Component holding member reproducing apparatus and component mounting method - Google Patents

Component holding member reproducing apparatus and component mounting method Download PDF

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Publication number
JP3966765B2
JP3966765B2 JP2002151170A JP2002151170A JP3966765B2 JP 3966765 B2 JP3966765 B2 JP 3966765B2 JP 2002151170 A JP2002151170 A JP 2002151170A JP 2002151170 A JP2002151170 A JP 2002151170A JP 3966765 B2 JP3966765 B2 JP 3966765B2
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component
holding surface
component holding
abrasive
pressing
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JP2003347362A (en
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山田　　晃
昌三 南谷
誠 森川
伸也 丸茂
貴晴 前
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Panasonic Corp
Panasonic Holdings Corp
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Panasonic Corp
Matsushita Electric Industrial Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75302—Shape
    • H01L2224/75303—Shape of the pressing surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75743—Suction holding means
    • H01L2224/75745—Suction holding means in the upper part of the bonding apparatus, e.g. in the bonding head

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  • Supply And Installment Of Electrical Components (AREA)
  • Wire Bonding (AREA)

Description

【０００１】
【発明の属する技術分野】
本発明は、例えば、突起電極を有する電子部品を保持する部品保持部材に生じる汚れを除去し当該部品保持部材の再生を行う再生装置、及び該再生装置を有する部品装着装置、並びに部品装着方法に関する。上記部品装着装置では、上記部品保持部材に保持されている上記電子部品の上記突起電極を装着対象物の電極に接触させた状態で超音波振動を作用させて金属接合部どうしを摩擦させ接合を行う。
【０００２】
【従来の技術】
回路基板上の導体ランドに電気接合するための電極、及び上記電極を有する回路パターンを形成した半導体ウエハから切り分けられた半導体チップである、いわゆるベアＩＣチップが存在し、該ベアＩＣチップの上記電極にはワイヤボンディング等により突起電極としてのバンプが形成される。このようにバンプが形成されたベアＩＣチップは、図９に示す超音波振動発生装置９を設けたノズル９３に保持され上記回路基板へ装着される。超音波振動発生装置９は、電圧の印加により圧電素子９１にて発生した振動を超音波ホーン９２にて増幅し、該超音波ホーン９２の端部に取り付けたノズル９３を超音波振動させる。該ノズル９３の先端部分には、上記ベアＩＣチップ３を吸着保持するチップ保持部９５が形成されている。このような構成において、圧電素子９１の上記振動により、ノズル９３及びチップ保持部９５、即ちチップ保持部９５に保持されているベアＩＣチップ３が超音波振動する。
【０００３】
上述のような超音波振動発生装置９を備えた従来のベアチップ装着装置では、ボンディングステージにて約１５０℃に加熱された回路基板２０に対して上記ベアＩＣチップ３のバンプ１１を押圧した後、ベアＩＣチップ３を介してバンプ１１を超音波振動してバンプ１１と回路基板２０の導体ランド２１との間に摩擦熱を発生させて両者の接合を行っている。該接合方法より、ベアＩＣチップなどの部品について、金属接合を伴う接合により、確実な電気接合と高い接合強度を満足して、しかも迅速に回路基板に実装することが可能である。又、チップ保持部９５におけるチップ接触面９５ａを所定の面粗度にて粗面にしておくことで、部品とチップ接触面９５ａとの滑りを抑え振動の伝達性を良くし、超音波接合の作業効率及び接合品質を向上させることができる。
【０００４】
一方、上記超音波振動の印加により、特に、バンプ１１と上記ランド電極部２１とが接合し始めると、ベアＩＣチップ３が振動し難くなることから、ベアＩＣチップ３とチップ保持部９５との接触部分にてベアチップ３に対してチップ保持部９５が擦れる場合がある。よって接合動作を繰り返す内に、チップ接触面９５ａは磨耗し、当初の０．２μｍ〜２μｍ程度の表面粗さが荒れて凹凸の高さが変化したり平面性が低下する。該摩耗は、ベアＩＣチップ３の材料であるＧａＡｓやＳｉ等による機械的摩擦、又はチップ接触面９５ａとベアＩＣチップ３との間に噛み混んでいる異物による傷つき等も関係している。特に、ベアＩＣチップ３がＳＡＷフィルタであるような場合、基盤にＬｉＴａ３やＬｉＮｂＯ３、水晶が用いられており、これらはＳｉ等に比べて硬く、チップ接触面９５ａが特に荒れやすい。
このようなチップ接触面９５ａの上記磨耗は、チップ保持部９５とベアＩＣチップ３との接触面積を減少させることから、チップ保持部９５とベアＩＣチップ３との間の摩擦力が低下する。よって、チップ保持部９５の超音波振動がベアＩＣチップ３に有効に作用しなくなり、その結果、規定の接合強度を得られず、ベアＩＣチップ３と回路基板２０との接合品質が低下するという問題が生じる。
そこで従来では、例えば特開２０００−９１３８５号公報に開示されるように、吸着ノズルにおける吸着面とベアＩＣチップとの間の滑り状態を検出する滑り検出手段を備え、制御手段は、滑り検出手段の検出結果に応じて上記部品吸着面の研磨動作を行うようにしていた。
【０００５】
【発明が解決しようとする課題】
しかしながら、上記公報に開示されるような従来の研磨動作では、粗さの番手が♯８０００〜♯１００００のラッピングペーパーを用い、振動振幅を１〜２μｍで、摩擦接触させるときの荷重も３００ｇ〜５００ｇという条件で研磨を行い、上記吸着面の再生処理を行っていた。このような従来の方法では、ＬＥＤやＳＡＷフィルタ等の比較的小さなベアＩＣチップを実装する比較的小さな面積にてなる吸着面を有する吸着ノズルに対して、常温で短時間にて十分な再生処理を行うことができた。
しかしながら、大型のＬＳＩや液晶のドライバＩＣ等のように、ベアＩＣチップの大きさが大型化してきており、これに伴い上記吸着面の大きさも例えば４ｍｍ四方を超えるものが必要になってきた。このような大型のベアＩＣチップでは、バンプ数が１００を超えるものも珍しくなく、超音波接合を行うときの接合条件は、従来の小形部品の場合よりも過酷になる。その結果、上記吸着ノズルの吸着面の荒れや、Ｓｉ等の付着が従来に比べて顕著であり、吸着面に対する従来の再生処理条件では再生処理に時間を要し、再生処理が不可能な場合も生じる。
【０００６】
又、大型のベアＩＣチップにおいて、該ベアＩＣチップと回路基板との上記接合を行うと伴に、ベアＩＣチップと回路基板との隙間の樹脂封止も行う部品実装方法では、上記吸着ノズルに相当する実装ツールが加熱されている場合がある。このような場合、研磨材として用いていた上記ラッピングペーパーでは、基材のフィルムが１５０℃までしか耐えられず、上記実装ツールを加熱した状態では再生処理ができない場合が生じ、再生処理を行うときには実装ツールの冷却が必要となる。よって、部品実装作業における休止時間が長くなるという問題がある。本発明は、上述したような問題点を解決するためになされたもので、部品保持部材の部品保持面のサイズ及び温度に関係なく当該部品保持面の再生処理が容易に行える、部品保持部材の再生装置及び部品装着装置、並びに部品装着方法を提供することを目的とする。
【０００７】
【課題を解決するための手段】
上記目的を達成するために本発明は以下のように構成する。
本発明の第１態様における部品保持部材再生装置は、部品保持面に部品を保持する部品保持部材と、
上記部品保持面を研磨し該部品保持面を再生する研磨材を研磨材保持台に設け、該研磨材保持台を第１回転軸の軸周り方向へ回転させる研磨材保持台回転装置を有する研磨装置と、
上記部品保持部材に接続され上記部品保持面を上記研磨材へ押圧する押圧装置と、
上記研磨装置及び上記押圧装置が接続され、上記部品保持面を上記研磨材に押圧させる動作制御を上記押圧装置に対して行い、押圧動作では、上記研磨材への上記部品保持面の接触から離脱までの時間経過に伴い押圧荷重を変化させ、かつ上記押圧動作のとき上記研磨材保持台の回転動作制御を上記研磨材保持台回転装置に対して行う制御装置と、を備えたことを特徴とする。
【０００９】
上記第１態様において、上記押圧荷重は、上記接触から離脱までを前半及び後半に分けたとき、上記前半を上記後半に比べて大きい荷重とするようにしてもよい。
【００１０】
上記第１態様において、上記部品保持部材に取り付けられ、上記部品保持面に超音波振動を与え、かつ上記制御装置に接続される超音波振動発生装置をさらに備え、上記制御装置は、上記押圧動作のとき、上記部品保持面を超音波振動させる超音波振動制御を上記超音波振動発生装置に対して行うようにしてもよい。
【００１１】
上記第１態様において、上記部品保持部材に取り付けられ、上記押圧装置による上記部品保持部材の押圧方向に直交する方向へ上記部品保持部材を移動させ、かつ上記制御装置に接続される保持部材移動装置を、上記研磨装置は備え、上記制御装置は、上記押圧動作のとき、上記部品保持部材を移動させる制御を上記保持部材移動装置に対して行うようにしてもよい。
【００１２】
上記第１態様において、上記部品保持面の研磨後において該部品保持面の塵埃を除去する塵埃除去材を除去材保持台に設け、かつ上記除去材保持台を第２回転軸の軸周り方向へ回転させる除去材保持台回転装置を有しかつ上記制御装置に接続される塵埃除去装置を上記研磨装置はさらに備え、上記制御装置は、上記研磨材による上記部品保持面の研磨後、上記部品保持面を上記塵埃除去材に押圧する押圧動作制御を上記押圧装置に対して行い、かつ該塵埃除去材に対する押圧動作制御のとき上記除去材保持台を回転させる回転動作制御を上記除去材保持台回転装置に対して行うようにしてもよい。
【００１３】
上記第１態様において、上記部品保持面の研磨後において該部品保持面の塵埃を除去する塵埃除去布を上記研磨装置はさらに備え、上記制御装置は、上記研磨材による上記部品保持面の研磨後、上記部品保持面を上記塵埃除去布に押圧する押圧動作制御を上記押圧装置に対して行うようにしてもよい。
【００１４】
上記第１態様において、上記研磨材保持台は、上記部品保持面が接触する上記研磨材の研磨面を上記部品保持面に対して平行かつ水平に配置する水平調整部材を有するようにしてもよい。
【００１５】
上記第１態様において、上記研磨装置は、上記第１回転軸を鉛直方向と平行に配置する垂直調整部材をさらに有するようにしてもよい。
【００１６】
上記第１態様において、上記研磨材は、セラミック砥粒結合体、アルカンサス天然砥石、又はダイヤモンド砥石を主成分とするようにしてもよい。
【００１７】
さらに本発明の第２態様における部品装着装置は、突起電極を設けた部品の上記突起電極を装着対象物の電極に接触させて接合する部品装着装置であって、
上記第１態様の部品保持部材再生装置を備えたことを特徴とする。
【００１８】
さらに本発明の第３態様における部品装着方法は、突起電極を設けた部品の上記突起電極を装着対象物の電極部に接触させて、かつ上記部品に超音波振動を与えて上記突起電極と上記電極部とを接合して上記部品を上記装着対象物に装着する部品装着方法であって、
上記装着動作のときに上記部品を保持している部品保持面を、上記装着動作終了後に、回転している研磨材に押圧して上記部品保持面の再生を行い、上記部品保持面の上記研磨材への押圧荷重は、上記研磨材への上記部品保持面の接触から離脱までの時間経過に伴い変化させることを特徴とする。
【００２０】
上記第３態様において、上記部品保持面を上記研磨材へ押圧しながら、上記部品保持面に対して超音波振動を与えるようにしてもよい。
【００２１】
上記第３態様において、上記部品保持面を上記研磨材へ押圧しながら、押圧方向に直交する方向へ、上記部品保持面及び上記研磨材の少なくとも一方を移動させるようにしてもよい。
【００２２】
上記第３態様において、上記部品保持面の上記再生動作後、上記部品保持面を回転している塵埃除去材に押圧して上記部品保持面の塵埃を除去するようにしてもよい。
【００２３】
上記第３態様において、上記部品保持面の上記再生動作後、上記部品保持面を塵埃除去布に押圧して上記部品保持面の塵埃を除去するようにしてもよい。
【００２４】
さらに本発明の第４態様における部品保持部材再生装置は、部品保持面に部品を保持する部品保持部材と、
上記部品保持面を研磨し該部品保持面を再生する研磨材を研磨材保持台に設け、該研磨材保持台及び上記部品保持面を相対的に移動させる相対移動装置と、
上記部品保持部材に接続され上記部品保持面を上記研磨材へ押圧する押圧装置と、
上記相対移動装置及び上記押圧装置が接続され、上記部品保持面を上記研磨材に押圧させる動作制御を上記押圧装置に対して行い、かつ該押圧動作のとき上記研磨材保持台及び上記部品保持面の相対的移動動作制御を上記相対移動装置に対して行う制御装置と、
を備えたことを特徴とする。
【００２５】
【発明の実施の形態】
本発明の実施形態である部品保持部材再生装置、部品装着装置、及び部品装着方法について、図を参照しながら以下に説明する。尚、各図において、同じ構成部分については同じ符号を付している。又、上記部品装着装置は、上記部品保持部材再生装置を備えた装置であり、上記部品装着方法は、上記部品装着装置にて実行される方法である。又、本実施形態では、「部品」として、シリコンウエハ、ＬｉＴａ３、ＬｉＮｂＯ３、及び水晶等の半導体基板上に薄膜技術にて集積回路を形成し、該集積回路の電極にワイヤボンディング技術にてバンプが形成され、さらに個々の上記集積回路部分に切り分けられた、いわゆるベアＩＣチップを例に採る。しかしながら、上記「部品」は、上記ベアＩＣチップに限らず、電子部品や電子部品以外の種々の部品であってもよい。又、「装着対象物」として上記部品が実装される回路基板を例に採るが、これに限定されるものではない。例えば上記装着対象物としては、部品、筐体、又は、フレーム等、回路が形成されているものであってもよい。又、「相対移動装置」として、本実施形態では、実装ヘッドを移動させる保持部材移動装置、並びに研磨装置に備わる研磨材及び回転機構が相当し、さらには研磨材をＸ，Ｙ方向の少なくとも一方向に移動させる移動装置が含まれる。
【００２６】
又、後述するように、本実施形態では、上記ベアＩＣチップを回路基板に実装するときに上記ベアＩＣチップに対して超音波振動を与えるが、該振動について、上記バンプと回路基板の電極部との間に摩擦熱が発生しボンディングステージによる上記回路基板の加熱温度を低下させることができるような振動であれば良く、上記超音波振動に限定されるものではない。
又、以下に説明する実施形態では、バンプは上記ベアＩＣチップに形成されており該バンプを回路基板上の電極部へ接合する場合を例に採るが、これに限定されるものではない。本発明の実施形態における部品保持部材再生装置、部品装着装置、及び部品装着方法は、上述の場合とは逆の場合、つまり回路基板上の電極部にバンプを形成した場合を含めて、部品及び回路基板のいずれか一方に形成されたバンプと、いずれか他方における電極箇所とを接合させる場合も含む。
【００２７】
図１に示すように、本実施形態の部品装着装置１０１は、半導体ウエハ１がダイシングシート２上で個々のベアＩＣチップ３にダイシングされたものを部品として実装ヘッド１３１により吸着する。そして、図４に示すように、プリント配線板などの回路基板２０を装着対象物とし、ベアＩＣチップ３の電極７に形成したバンプ１１と、回路基板２０の電極部２１との超音波接合による機械的接合を伴ってベアＩＣチップ３を回路基板２０に実装する装置であり、さらに、特徴的構成部分の一つとしての研磨装置１６０及び制御装置１８０を備えている。このような部品装着装置１０１は、大別して、部品供給装置１１０と、基板位置決め装置１２０と、部品移送装置１３０と、上記研磨装置１６０と、制御装置１８０とを備える。これらの各構成部分について以下に説明する。
【００２８】
上記部品供給装置１１０は、主に、ウエハ取出装置１１１と、チップ供給装置１１２とを有する。上記ウエハ取出装置１１１には、ウエハ供給マガジン１１３のリフター、及びダイシングシート２のエキスパンダーを含み上記マガジン１１３から上記半導体ウエハ１を取り出し保持する取出機構と、所望のベアＩＣチップ３を突き上げるための突き上げ機構を含みボールネジ構造を有して上記取出機構をＸ，Ｙ方向へ移動させるウエハ移動機構とが備わり、ウエハ取出装置１１１は、半導体ウエハ１の取り出し及び位置決めを行う。上記チップ供給装置１１２には、上記突き上げられたベアＩＣチップ３を例えば吸着にて保持するチップ保持部１１４と、反転位置１１５及び突上位置の間で上記チップ保持部１１４をＸ方向に移動させる移動機構１１６とが備わり、上記チップ保持部１１４にて半導体ウエハ１から保持されたベアＩＣチップ３は、上記移動機構１１６にて反転位置１１５まで移送される。又、上記チップ保持部１１４には、吸着するベアＩＣチップ３の認識を行うための認識カメラが備わる。
上記反転位置１１５には反転装置１１７が設けられており、上記バンプ１１を形成した回路面が上を向いた状態でチップ保持部１１４にて供給されたベアＩＣチップ３について、反転装置１１７は、上記回路面が下を向くように反転させる。
【００２９】
上記基板位置決め装置１２０は、当該部品装着装置１０１の外部より供給される回路基板２０を保持し、回路基板２０の所定位置にベアＩＣチップ３を実装するために回路基板２０の位置決めを行う装置であり、回路基板２０を保持しかつベアＩＣチップ３を実装するときのステージとなる保持テーブルを有し該保持テーブルをＹ方向へ移動させる移動機構１２１と、ベアＩＣチップ３の実装後、該チップ実装済みの回路基板２０の搬送を行う実装済基板搬送装置１２２とを備える。
【００３０】
上記部品移送装置１３０は、上記反転されたベアＩＣチップ３を、上記基板位置決め装置１２０にて位置決めされた回路基板２０の上記所定位置へ実装する装置であり、実装ヘッド１３１と、保持部材移動装置１３２とを備える。上記実装ヘッド１３１には、例えば吸着にて、図５に示す部品保持面１３３ａに上記ベアＩＣチップ３を保持する、ステンレス製の、又はダイス鋼、ハイス鋼、超硬合金、チタン合金、ダイヤモンド、セラミック製等の部品保持部材１３３と、該部品保持部材１３３に接続され該部品保持部材１３３を、鉛直方向に相当し上記Ｘ，Ｙ方向に直交するＺ方向に移動させる押圧装置１３４と、上記部品保持部材１３３に取り付けられ上記部品保持面１３３ａを介してベアＩＣチップ３に超音波振動を与える超音波振動発生装置１３５とが備わる。本実施形態では、４ｍｍ四方のベアＩＣチップ３を保持可能なように、上記部品保持面１３３ａは、最大□１６ｍｍの大きさにてなり、その表面粗さは、例えば０．２μｍ〜２μｍ程度の面粗度に形成されている。又、本実施形態では上記押圧装置１３４として空圧シリンダを有し荷重約５００ｍＮ〜約５００Ｎ程度の加圧を行うが、加圧手段の具体的構成は上記空圧シリンダに限定されるものではない。又、上記超音波振動発生装置１３５は、本実施形態では、上記部品保持面１３３ａにおいて振動数４０ｋＨｚ、振幅０．５〜８μｍ程度の振動を発生する。該振動により、回路基板２０へのベアＩＣチップ３の実装動作では、上記押圧装置１３４にて押圧されている、回路基板２０の電極部２１とベアＩＣチップ３のバンプ１１とに摩擦を生じさせて、両者を超音波接合にて機械的に接合する。
【００３１】
上記部品保持部材１３３には、図５に示すように、部品保持面１３３ａにベアＩＣチップ３を吸着させるための吸引装置１３６が接続され、又、上述したようにベアＩＣチップ３と回路基板２０との隙間の樹脂封止のため、若しくはベアＩＣチップ３と回路基板２０との接合を補助するために、部品保持部材１３３、特に部品保持面１３３ａに対して常温から約２５０℃まで加熱するヒーター部１３７が取り付けられ、さらに、超音波振動発生装置１３５を構成する振動子の発熱を抑えるために冷却装置１３８が取り付けられている。尚、これらの吸引装置１３６、ヒーター部１３７、及び冷却装置１３８は、制御装置１８０に接続され、制御装置１８０にて動作制御される。
上記保持部材移動装置１３２は、上記実装ヘッド１３１を取り付けたボールネジ機構を有し、実装ヘッド１３１を本実施形態ではＸ方向に移動させる。尚、保持部材移動装置１３２による実装ヘッド１３１の移動方向は、上記Ｘ方向に限定されず、該Ｘ方向に直交するＹ方向であってもよい。
【００３２】
このような部品移送装置１３０は、ベアＩＣチップ３の回路基板２０への実装動作のときには、上記保持部材移動装置１３２にて実装ヘッド１３１の位置決めがされた後、実装ヘッド１３１にてベアＩＣチップ３を超音波振動させながら回路基板２０への押圧を行い実装を行う。尚、実装ヘッド１３１及び回路基板２０の位置決めに際しては、実装ヘッド１３１に保持されているベアＩＣチップ３、及び上記移動機構１２１の上記保持テーブルに保持されている回路基板２０の両方を撮像可能な認識カメラ１３９にて、ベアＩＣチップ３及び回路基板２０の実装位置が撮像され、両者の位置決めがなされる。又、詳細後述するが、上記部品保持面１３３ａの再生動作を行うときには、部品保持面１３３ａを研磨材に押圧し、好ましくは部品保持面１３３ａを超音波振動させたり、さらには保持部材移動装置１３２にて実装ヘッド１３１を往復動させたりして、上記部品保持面１３３ａの再生を行う。
【００３３】
上記制御装置１８０は、上述の各構成部分である、部品供給装置１１０、基板位置決め装置１２０、及び部品移送装置１３０の動作制御、さらに以下に説明する研磨装置１６０に関する動作制御を含めて部品装着装置１０１全体の動作制御を行う装置であり、マイクロコンピュータにて構成するのが好ましい。該制御装置１８０の詳しい動作説明は、後述の、部品装着装置１０１における動作説明にて述べる。
【００３４】
上記研磨装置１６０は、上記部品保持部材１３３の部品保持面１３３ａに固着した、ベアＩＣチップ３におけるＳｉやＬｉＴａ３等の基盤材料を除去し、及び上記部品保持面１３３ａの平坦度の修復を行うことで、上記部品保持面１３３ａの再生を行う装置である。以下に詳しく説明する。
図２は、本実施形態の部品装着装置１０１に備わる研磨装置１６０を示しており、該研磨装置１６０は、主な構成部分として、研磨材１６１と、研磨材保持台１６２と、塵埃除去材１６３と、塵埃除去材保持台１６４と、回転機構１６５と、塵埃侵入防止装置１６６と、研磨材吸着装置１６７と、塵埃吸引装置１６８とを備え、本実施形態では、図示するように研磨材１６１と塵埃除去材１６３とが互いに隣接して配置され、上記回転機構１６５にて矢印１６５１方向へ回転される。上記部品保持面１３３ａの再生動作に際し発生する塵埃は、上記塵埃吸引装置１６８にて吸引、除去され、又、塵埃侵入防止装置１６６は、研磨装置１６０への塵埃の侵入を防止する。又、研磨装置１６０における各動作は、制御装置１８０にて制御される。尚、上記塵埃除去材１６３、上記塵埃除去材保持台１６４、上記回転機構１６５、上記塵埃吸引装置１６８、及び制御装置１８０を備えて塵埃除去装置を構成する。上記研磨装置１６０についてさらに詳しく説明する。
【００３５】
研磨装置１６０のフレーム部材１６９に回転可能に支持され鉛直方向に延在する第１回転軸１７０の一端には上記研磨材保持台１６２が取り付けられ、同様に鉛直方向に延在し回転可能に支持される第２回転軸１７１の一端には上記塵埃除去材保持台１６４が取り付けられる。第１回転軸１７０及び第２回転軸１７１の各他端には、上記回転機構１６５に含まれる回転駆動源であるインダクションモータ１６５２の出力軸との間で、駆動ベルト１６５３が巻回されている。よって、研磨材保持台１６２及び塵埃除去材保持台１６４は、第１回転軸１７０及び第２回転軸１７１の軸周り方向である上記矢印１６５１方向へモータ１６５２によりそれぞれ回転する。又、上記回転機構１６５には、上述のように部品保持面１３３ａを研磨材１６１に押圧したときに生じる負荷による研磨材１６１の回転停止を検出するため、上記第１回転軸１７０の回転を検出する回転検出器１６５４が備わり、該回転検出器１６５４は、制御装置１８０へ回転情報を送出する。研磨材１６１を回転させる理由について、研磨材１６１の研磨面は完全な平坦面ではないので、部品保持面１３３ａをムラなく研磨するためである。又、本実施形態では上述のように、第１回転軸１７０及び第２回転軸１７１は、駆動ベルト１６５３にてつながっていることから、第２回転軸１７１側には回転検出器を設けていない。
尚、上記回転機構１６５の内、第１回転軸１７０、モータ１６５２、駆動ベルト１６５３、及び回転検出器１６５４にて、研磨材保持台回転装置を構成する。
【００３６】
図３に示すように、上記研磨材保持台１６２は、本実施形態では吸着動作により研磨材１６１を保持する部材であり、研磨材１６１を載置する載置面１６４１ａを有する例えば円形の上部盤１６４１と、上記第１回転軸１７０に固定される例えば円形の下部盤１６４２と、上部盤１６４１及び下部盤１６４２の間に設けられ図示するようにくびれ部分を有して下部盤１６４２に対して上部盤１６４１を僅かながら首振り可能とする首振り用部材１６４３と、上記下部盤１６４２の４箇所又は３箇所に等間隔に配置され螺合され各先端を上部盤１６４１に接触可能とする４本又は３本の調整用ボルト１６４４とを備える。本実施形態では、上記研磨材１６１は、セラミック砥粒の結合体で、上記部品保持部材１３３の部品保持面１３３ａを超える大きさにてなる方形状をなし、研磨面１６１ａの粗さが♯４００〜♯１５００、ロックウェル硬さが５〜６５のものを用いている。尚、研磨材１６１は、上述のものに限定されることはなく、例えばアルカンサス天然砥石、又はダイヤモンド砥石を主成分とするものであってもよい。尚、研磨材１６１の一実施例として、２０ｍｍ四方、厚み５ｍｍ、研磨面１６１ａの平面度５μｍのものが使用可能である。
上述のように、砥石形態であって、その研磨面１６１ａの粗さ及び硬度を選択した研磨材１６１を備えることで、大きさが例えば４ｍｍ四方を超える部品保持面１３３ａを有する部品保持部材１３３であっても、及び部品保持面１３３ａが加熱される部品保持部材１３３であっても、部品保持面１３３ａの再生処理を容易に行うことができる。
【００３７】
上記研磨材保持台１６２を上述のように構成することで、調整用ボルト１６４４の下部盤１６４２からの突出量を調整して、上部盤１６４１の首振り方向及び傾斜度を調整することが可能である。このように上記載置面１６４１ａの水平度、正確には該載置面１６４１ａに保持される研磨材１６１における上記部品保持面１３３ａの研磨面１６１ａの水平度を調整することが可能であり、上記下部盤１６４２、首振り用部材１６４３、及び調整用ボルト１６４４は、研磨材１６１の研磨面１６１ａの水平状態を調整する水平調整部材と言える。尚、もちろん、上記部品保持面１３３ａも水平状態に配置されている。
【００３８】
又、吸着動作にて研磨材１６１を保持するために、上記載置面１６４１ａには、一又は複数の吸引用開口が形成され、該開口は、上部盤１６４１、首振り用部材１６４３、下部盤１６４２、及び第１回転軸１７０の内部を貫通する吸引用通路１６４５に連通する。該吸引用通路１６４５は、上記研磨材吸着装置１６７の一構成部分である真空ポンプ１６７１につながれており、よって、真空ポンプ１６７１の吸引力により研磨材１６１は載置面１６４１ａに吸着保持される。
このように吸引により研磨材１６１を保持することで、真空ポンプ１６７１を停止させることで容易に研磨材１６１の保持を解除でき研磨材１６１の交換を容易に行うことが可能となる。又、載置面１６４１ａに保持された研磨材１６１の位置ずれを防止し、かつ載置面１６４１ａへ研磨材１６１を載置するときの位置決めのため、方形状にてなる研磨材１６１の対角位置に対応して上記載置面１６４１ａの２箇所には、図２に示すように、それぞれ一対のピン１６４６が植設されている。
【００３９】
上記塵埃除去材保持台１６４は、上記第２回転軸１７１に固定され、塵埃除去材保持台１６４には塵埃除去材１６３が締結部材にて取り付けられている。塵埃除去材１６３は、研磨材１６１による上記部品保持面１３３ａの研磨後において部品保持面１３３ａに付着している塵埃を除去するもので、本実施形態では、ステンレス製で直径が０．２ｍｍ〜１ｍｍにてなる５ｍｍ程度の長さのワイヤを複数、円形状に植設したブラシを用いている。このようなステンレスブラシが好適であるが、これに限定されず同様の効果が得られる他材料と代替することができる。尚、上記円形状の塵埃除去材１６３の直径は、上記部品保持部材１３３の部品保持面１３３ａを超える大きさである。又、既述のように、塵埃除去材保持台１６４は、上記回転機構１６５にて矢印１６５１方向へ回転される。尚、上記回転機構１６５の内、第２回転軸１７１、モータ１６５２、及び駆動ベルト１６５３にて、塵埃除去材保持台回転装置を構成する。
【００４０】
又、塵埃除去材保持台１６４の塵埃除去材載置面には、第２回転軸１７１及び塵埃除去材保持台１６４内を貫通して塵埃吸引装置１６８につながる吸引用通路１７１１が開口する。上記塵埃吸引装置１６８は、塵埃除去材１６３による上記部品保持面１３３ａの清掃時に該部品保持面１３３ａから除去された塵埃、及び上記研磨材１６１による上記部品保持面１３３ａの研磨時に発生する塵埃等の塵埃の除去を行う装置であり、上記塵埃を濾過するフィルター１６８１と、該フィルター１６８１の後段に設置され吸引装置としての排気ポンプ１６８２を備える。
【００４１】
上記塵埃除去材１６３を設けることで、上記部品保持部材１３３の部品保持面１３３ａを研磨して再生処理した後に、部品保持面１３３ａを塵埃除去材１６３に押圧装置１３４にて押圧して、部品保持面１３３ａにおける付着物を除去する清掃処理を行うことができる。よって、部品保持面１３３ａにおける付着物や、部品保持面１３３ａに詰まっている研磨粉等を除去でき、実装動作時において上記付着物等が超音波振動伝達に悪影響を与えるのを防止できる。又、除去された塵埃は、塵埃吸引装置１６８にて塵埃除去材１６３から排除されることから、当該部品装着装置１０１内に塵埃が飛散することを防止できる。
【００４２】
上記塵埃侵入防止装置１６６は、図２に示すように、隣接して配置している研磨材１６１及び塵埃除去材１６３に対して、これらの非使用時における塵埃の付着を防止し、又、研磨材１６１及び塵埃除去材１６３から不必要に当該部品装着装置１０１内への塵埃の飛散を防止するための装置であり、研磨材１６１及び塵埃除去材１６３を覆い保護するカバー部材１６６１と、カバー部材駆動機構１６６２とを備える。該カバー部材駆動機構１６６２は、研磨材１６１及び塵埃除去材１６３を覆わない位置でこれらを使用可能とする開位置と、研磨材１６１及び塵埃除去材１６３の非使用時における位置で研磨材１６１及び塵埃除去材１６３を覆う閉位置との間にて、上記カバー部材１６６１を往復動させる機構であり、駆動源として本実施形態ではエアーシリンダを使用する。さらに該カバー部材駆動機構１６６２には、上記カバー部材１６６１が上記開位置に位置することを検出する開位置検出センサ１６６３、及び上記カバー部材１６６１が上記閉位置に位置することを検出する閉位置検出センサ１６６４が備わる。各センサ１６６３、１６６４における検出情報は、制御装置１８０に送出される。
【００４３】
さらに研磨装置１６０は、上記第１回転軸１７０及び第２回転軸１７１の垂直状態を調整する垂直調整部材１７２を備えている。本実施形態では、垂直調整部材１７２は、図３に示すように、研磨装置１６０のフレーム部材１６９のベース板１６９１の角部の３箇所又は４箇所に、該ベース板１６９１の厚み方向に沿って螺合した調整ボルト１７２１が相当する。各箇所における調整ボルト１７２１のねじ込み量を調整することで、上記フレーム部材１６９を設置している基礎台１７３に対して該フレーム部材１６９の傾斜を調整し、第１回転軸１７０及び第２回転軸１７１の軸方向が、ベアＩＣチップ３が実装される回路基板２０の実装面に対して垂直となるように、又は、上記部品保持部材１３３の部品保持面１３３ａに対して垂直となるように、垂直調整が可能である。
【００４４】
尚、上述の塵埃除去材保持台１６４における水平状態、及び上述の垂直状態の具体的な調整方法や調整用構造は、本実施形態のものに限定されるものではなく、当業者により想到可能な形態を採ることが可能である。
このように、研磨材１６１の研磨面１６１ａを部品の実装対象となる平面に対して平行とする水平状態や、回転中心軸１７０、１７１を部品の実装対象となる平面に対して垂直とする垂直状態が得られることで、部品保持部材１３３の部品保持面１３３ａを部品の実装対象となる平面に対して平行に研磨することができ、部品保持面１３３ａを研磨して再生処理をすることによって部品保持面１３３ａの向きに狂いが生じることを防止することができる。又、大きさが例えば４ｍｍ四方を超える部品保持面１３３ａを有する部品保持部材１３３であっても、及び部品保持面１３３ａが加熱される部品保持部材１３３であっても、部品保持面１３３ａの再生処理を容易に行うことができる。
【００４５】
以上のように構成される部品装着装置１０１における部品装着動作について以下に説明する。該部品装着動作には、本実施形態における特徴の一つである、部品保持部材１３３の部品保持面１３３ａの再生動作を含む。このような部品装着動作は、制御装置１８０にて制御され、その動作プログラムデータは、制御装置１８０内、又は外部のメモリ１８１に予め記憶され、あるいは、ＣＤ−ＲＯＭ等の記録媒体から供給することができ、さらには通信回線を通じてダウンロードすることもできる。
尚、以下の部品装着動作説明の内、上記ベアＩＣチップ３の回路基板２０への装着動作に関しては、従来の部品装着装置における装着動作に類似することから略説し、上記部品保持部材１３３の部品保持面１３３ａの再生動作について詳しく説明する。
【００４６】
上記ウエハ取出装置１１１にて、ウエハ供給マガジン１１３から取り出されエキスパンドされた後に突き上げられた一つのベアＩＣチップ３は、部品供給装置１１０にて保持され反転装置１１５にて表裏を反転される。反転されたベアＩＣチップ３は、実装ヘッド１３１における部品保持部材１３３の部品保持面１３３ａに吸着保持され、保持部材移動装置１３２にてＸ方向における実装位置に位置決めされる。一方、基板位置決め装置１２０における移動機構１２１の保持テーブルに保持された回路基板２０は、Ｙ方向における実装位置に位置決めされる。Ｘ，Ｙ方向における実装位置の位置決め終了後、実装ヘッド１３１の押圧装置１３４を動作させ、上記部品保持部材１３３の部品保持面１３３ａに保持されているベアＩＣチップ３のバンプ１１が回路基板２０の電極部２１に押圧され、かつ実装ヘッド１３１の超音波振動発生装置１３５の作動によりバンプ１１と電極部２１とが摩擦され接合する。このようにして回路基板２０へのベアＩＣチップ３の実装が終了した後、実装済基板搬送装置１２２にて部品実装済み回路基板が次工程へ搬送される。このようにして各回路基板２０へベアＩＣチップ３が順次実装され次工程へ搬送される。
【００４７】
上記再生動作について説明する。尚、該再生動作が実行される前には、上述したように、上記塵埃除去材保持台１６４に備わる上記調整用ボルト１６４４、及び研磨装置１６０におけるフレーム部材１６９に設けた上記調整ボルト１７２１にて、研磨材１６１の上記研磨面１６１ａを予め水平に、かつ部品保持面１３３ａに対して平行に調整しておく。
上述のように一つ若しくは複数のベアＩＣチップ３の実装動作が終了した後、次の実装動作を開始する前に、保持部材移動装置１３２を動作させて実装ヘッド１３１における部品保持部材１３３の部品保持面１３３ａを、研磨装置１３０の研磨材１６１の上方へ移動させる。一方、研磨装置１６０においては、上記回転機構１６５、上記塵埃侵入防止装置１６６、上記研磨材吸着装置１６７、及び上記塵埃吸引装置１６８が動作され、上記カバー部材１６６１を開位置に配置し、かつ研磨材１６１を研磨材保持台１６２に吸着しながら約１００ｒｐｍ〜１２００ｒｐｍ範囲内の回転数であり、主には部品保持面１３３ａの汚れ具合等に基づいて設定した回転数にて回転させる。又、上述のように部品保持面１３３ａをＸ方向に往復動させて研磨動作を行う場合、例えば、往路では荒削り用として研磨材１６１の回転を遅くし復路では仕上げ用として回転を速くするような制御を行うことができる。
【００４８】
上記移動後、制御装置１８０内の制御機能を果たす一部分であり図６に示す押圧制御部１８２の制御にて上記押圧装置１３４を動作させて上記部品保持面１３３ａを上記研磨材１６１に押圧する。印加する荷重は、上述のように約５００ｍＮ〜約５００Ｎ程度の範囲内の値であり、例えば部品保持面１３３ａの大きさに基づいて設定値を変化させる。一例としては、部品保持面１３３ａが□１６ｍｍの大きさにてなるとき約５０Ｎである。本実施形態では、上記押圧動作に加えて、図６に示す超音波振動制御部１８３の制御により上記超音波振動発生装置１３５にて上記部品保持面１３３ａを超音波振動させ、かつ図６に示す移動制御部１８４の制御により上記保持部材移動装置１３２にて実装ヘッド１３１ごと部品保持面１３３ａをＸ方向に往復動させる。本実施形態では、上記往復動は、一往復であり、その移動速度は、約１〜５ｍｍ／ｓｅｃの範囲内の値であり、例えば部品保持面１３３ａの汚れ具合及び大きさに基づいて設定値を変化させる。又、上述のように部品保持面１３３ａをＸ方向に往復動させて研磨動作を行う場合、例えば、往路では荒削り用として部品保持部材１３３の移動速度を遅くし復路では仕上げ用として移動を速くするような制御を行うことができる。
尚、その移動距離は、回転している研磨材１６１の大きさの範囲内である。
又、上記研磨動作中に部品保持面１３３ａから除去される塵埃等は、塵埃吸引装置１６８にて吸引され、当該部品装着装置１０１内に飛散することはない。本実施形態では部品保持面１３３ａの上記往復動が終了した時点で、部品保持面１３３ａの研磨動作が終了する。しかしながら、上記往復回数は、上記一往復に限定するものではなく、部品保持面１３３ａの汚れ具合に基づいて適宜設定すればよい。
【００４９】
本実施形態では、上記研磨動作のとき、部品保持面１３３ａの研磨材１６１への押圧力を、部品保持面１３３ａの研磨材１６１への接触から離脱までの時間経過に伴い変化させている。その一例として本実施形態では、往路と復路とにおいて、それぞれ異なる押圧力にて上記押圧動作を行い、上記往路における押圧力を上記復路における押圧力に比べて大きくしている。具体的には、往路における押圧力は、部品保持面１３３ａの大きさが例えば□１０ｍｍであるとき、約２５Ｎであり、復路における押圧力は約１０Ｎである。又、例えば往路の押圧力は、復路の約１．５〜１０００倍であり、例えば部品保持面１３３ａの大きさ、さらには汚れ具合を加味して設定される。
尚、上記時間経過に伴う上記押圧力の変化は、上述の例に限定されるものではなく、部品保持面１３３ａの研磨材１６１への接触から離脱までの時間経過に伴い連続的に滑らかに上記押圧力を変化させてもよい。
又、使用とともに研磨材１６１は目詰まりしてくるので、ドレッシング作業におけるいわゆる目直しを行う機構を備えるようにしてもよい。
【００５０】
又、上述のように本実施形態では、回転している研磨材１６１に対する部品保持面１３３ａの押圧動作時に、上記超音波振動動作及び上記往復動作を行っているが、これらは作用させなくてもよいし、いずれか一方のみを作用させてもよい。
【００５１】
上述のように部品保持面１３３ａを研磨材１６１に押圧して研磨することで、部品保持面１３３ａに固着したベアＩＣチップ３の基盤材料を除去し、部品保持面１３３ａの面粗度を所定の範囲内に修復して、部品保持面１３３ａの再生処理を行うことができる。よって、部品実装時における超音波接合の条件が過酷な４ｍｍ四方以上のベアＩＣチップ３を保持する部品保持部材１３３であって、該部品保持部材１３３が加熱される場合であっても、部品保持面１３３ａの再生を行うことができ、部品保持面１３３ａの面粗度の劣化に起因する部品と回路基板との接合不良を防ぐことができる。
又、研磨材１６１が回転していることで、さらには部品保持面１３３ａがＸ方向に移動することで、部品保持面１３３ａの再生処理効率を向上でき、より短時間での再生処理が達成でき、部品実装作業における休止時間を短くすることができる。
【００５２】
上述のように本実施形態では、実装動作回数を判断基準として、再生動作を実行したが、その他、上記部品保持面１３３ａの撮像情報の画像処理結果から得られる部品保持面１３３ａの汚れ状態に基づいて再生動作を行うか否かを判断するようにしても良いし、ベアＩＣチップ３の実装動作時における超音波振動の振動状態に基づいて再生動作を行うか否かを判断する等、当業者が想到可能な手段を採ることができる。
【００５３】
又、上述のように研磨動作において、本実施形態では研磨材１６１は、回転するがＸ，Ｙ方向には移動しない。しかしながら該構造に限定されるものではなく、例えば、図７に示すように、研磨材１６１をＸ及びＹ方向の少なくとも一方向に相対移動装置にて移動させながら、回転させてもよい。さらに、研磨材１６１をＸ及びＹ方向の少なくとも一方向に相対移動装置にて移動させ、かつ回転機構１６５にて回転させながら、部品保持面１３３ａも保持部材移動装置１３２にてＸ方向に移動させても良いし、部品保持面１３３ａは停止させた状態であっても良い。
又、研磨材１６１及び部品保持面１３３ａの少なくとも一方がＸ及びＹ方向の少なくとも一方向に移動する構造を採るときには、研磨材１６１の上記回転動作を中止してもよい。
【００５４】
上述の研磨動作による再生処理動作の一実施例を以下に示す。上記押圧装置１３４により部品保持面１３３ａに印加する荷重が約５Ｎ〜約５０Ｎで、上記超音波振動発生装置１３５による超音波振動は、周波数を４０ｋＨｚ、振動の振幅を０．５〜８μｍとし、研磨材１６１としてセラミック砥粒の結合体で、粗さが♯４００〜♯１５００、ロックウェル硬さが５〜６５のものを用い、研磨材１６１を１００ｒｐｍ〜１２００ｒｐｍの速さで回転させ、実装ヘッド１３１つまり部品保持面１３３ａを１〜５ｍｍ／ｓｅｃの速度で１０〜２０ｍｍ移動させた。該実施例の場合、約１４秒にて十分な面粗度に部品保持面１３３ａを再生することができた。
【００５５】
次に上記清掃動作について説明する。本実施形態では、上記研磨動作後、さらに、図６に示す塵埃除去制御部１８５の制御により下記の清掃動作を行う。しかしながら、該清掃動作は必須の工程ではない。
上記清掃動作は以下のように行われる。即ち、まず、上記研磨動作の終了とともに上記押圧装置１３４を動作させて、一旦、部品保持面１３３ａを研磨材１６１より上昇させた後、保持部材移動装置１３２を動作させ実装ヘッド１３１ごと部品保持面１３３ａを上記塵埃除去材１６３の上方までＸ方向に移動させる。このとき、上記回転機構１６５の動作により塵埃除去材１６３は既に回転している。部品保持面１３３ａが上記塵埃除去材１６３の上方に移動した後、再び押圧装置１３４を動作させて部品保持面１３３ａを下降させ塵埃除去材１６３に押圧させる。該押圧力としては、約５００ｍＮ〜約５０Ｎの範囲であり、例えば部品保持面１３３ａの大きさに基づいて設定値を変化させることができる。
【００５６】
部品保持面１３３ａを塵埃除去材１６３に押圧しているときに部品保持面１３３ａから除去される塵埃は、上記塵埃吸引装置１６８にて吸引され、部品装着装置１０１内に飛散することはない。
又、上記塵埃除去材１６３による部品保持面１３３ａの清掃動作の際、さらに上記超音波振動発生装置１３５を動作させ部品保持面１３３ａを超音波振動させてもよく、さらに、保持部材移動装置１３２にて実装ヘッド１３１ごと部品保持面１３３ａをＸ方向に移動させてもよい。
【００５７】
上述のように研磨動作度後に塵埃除去材１６３による清掃動作を行うことで、研磨動作によって部品保持面１３３ａに存在する付着物や、部品保持面１３３ａに詰まっている研磨粉等を除去することができる。さらに、超音波振動を作用させながら上記清掃動作を行うことで、部品保持面１３３ａの清掃が超音波振動による摩擦でさらに効率良く、短時間で達成できる。よって、上記清掃処理のための時間を短縮することができ、部品実装作業における休止時間を短くすることができる。
尚、上述した研磨動作、さらには清掃動作による部品保持面１３３ａの再生処理は、制御装置１８０により、最適な条件に制御され実行される。
【００５８】
部品保持面１３３ａの上記清掃動作用の塵埃除去材１６３は、本実施形態のブラシを用いた構成に限定されるものではない。例えば、図８に示すように、上記上部盤１６４１の載置面１６４１ａにガラス板１９０を吸着保持し、該ガラス板１９０の支持面１９０ａに塵埃除去材１９１を設けても良い。該塵埃除去材１９１としては、例えば不織布からなる洗浄布を用いることができ、塵埃除去材１９１に部品保持面１３３ａを押圧する。尚、その他の構成及び動作は、上述のブラシ形態の塵埃除去材１６３を備えた場合に同じである。ガラス板１９０を用いることで、部品保持面１３３ａの押圧時にガラス板１９０は金属板の場合のように弾性変形を生じないことから、上述の調整用ボルト１６４４等にて水平調整した上記支持面１９０ａの水平状態を維持することができる。尚、ガラス板１９０は、磨きガラスで平面度の高いものを用いるのが好適である。しかしながら、ガラス板１９０に限定するものではなく、ガラス板１９０と同様の効果が得られる部材であれば、そのような部材を用いることができる。
【００５９】
又、塵埃除去材１９１の洗浄布に連続したものを用い、ガラス板１９０上で塵埃除去材１９１を移動させる供給ローラ１９２１、巻取りローラ１９２２、モータ１９２３を有する移送装置１９２を設け、塵埃除去材１９１を移動させるのが好ましい。該構成により、１回あるいは必要回数の清掃処理を終える都度、塵埃除去材１９１を移送したり、清掃中に、間欠的又は連続的に移送したりすることで、塵埃除去材１９１を順次更新していくことが自動的に達成できる。よって、塵埃除去材１９１を清掃動作毎に交換する必要がなく、清掃処理を安定して繰り返し行うことができる。
【００６０】
上述した塵埃除去材１９１を用いた構造であっても、塵埃除去材１６３を備えた場合と同様の効果を得ることができる。又、洗浄布にてなる塵埃除去材１９１は、湿式のものを用いると、研磨後の部品保持面１３３ａに付いた付着物を除去する際に当該部品装着装置１０１内に粉塵が飛散するのをより効果的に防止でき、好適である。尚、上記塵埃吸引装置１６８を備えていることから、乾式の洗浄布でも塵埃の飛散は十分に防止することができる。
【００６１】
尚、上述の説明では、部品装着装置１０１に研磨装置１６０が備わる形態の場合について説明した。一方、図２に示すように、少なくとも、上記研磨装置１６０内の研磨材１６１、研磨材保持台１６２、第１回転軸１７０、及び回転機構１６５、上記部品保持部材１３３、上記押圧装置１３４、並びに上記制御装置１８０にて、部品保持部材再生装置を構成することもできる。さらに、該部品保持部材再生装置には、上記超音波発生装置１３５、上記保持部材移動装置１３２、並びに研磨装置１６０内の塵埃除去材１６３、除去材保持台１６４、及び塵埃吸引装置１６８を備えることもできる。
【００６２】
【発明の効果】
以上詳述したように本発明の第１態様の部品保持部材再生装置、第２態様の部品装着装置、及び第３態様の部品装着方法によれば、部品保持部材を押圧する押圧装置、研磨装置、及び制御装置を備え、上記研磨装置に備わる研磨材に上記部品保持部材の部品保持面を押圧して研磨し該部品保持面の再生を行うようにした。よって、部品保持部材の部品保持面のサイズ及び温度に関係なく当該部品保持面の再生を容易に行うことができる。
【００６３】
さらに、上記制御装置の制御により、部品保持面を研磨材へ押圧するときの荷重を変化させることにより、より効果的に部品保持面の再生処理を行うことができる。
さらに、超音波振動発生装置を備え、上記制御装置の制御により部品保持面を研磨材へ押圧するとき超音波振動させることで、より効果的に部品保持面の再生処理を行うことができる。
さらに、保持部材移動装置を備え、上記制御装置の制御により部品保持面を研磨材へ押圧するとき部品保持面を移動させることで、より効果的に部品保持面の再生処理を行うことができる。
【００６４】
さらに、上記研磨装置に塵埃除去装置を備え、上記研磨動作後に、上記部品保持面を塵埃除去材に押圧することで、研磨動作により部品保持面に付着している塵埃を除去することができる。よって、部品保持面の上記再生処理後における清浄度をより向上させることができ、部品実装動作において部品保持面の付着物等が部品と回路基板との接合に悪影響を与えるのを防止することができる。
【００６５】
又、上記研磨装置に塵埃除去布を備え、上記研磨動作後に、上記部品保持面を塵埃除去布に押圧して部品保持面に付着している塵埃を除去することもできる。又、研磨材の研磨面を部品保持面に対して平行かつ水平とする水平調整部材を備え、さらに研磨材を支持する回転軸の鉛直度を調整する垂直調整部材を備えることで、部品保持面を水平に調整でき、偏りなく部品保持面の再生処理を行うことができる。
【００６６】
又、本発明の第４態様の部品保持部材再生装置によれば、部品保持部材を押圧する押圧装置、研磨部を有する相対移動装置、及び制御装置を備え、上記相対移動装置に備わる研磨材に上記部品保持部材の部品保持面を押圧して、研磨材及び部品保持面を相対的に移動させて部品保持面を研磨し該部品保持面の再生を行うようにした。よって、部品保持部材の部品保持面のサイズ及び温度に関係なく当該部品保持面の再生を容易に行うことができる。
【図面の簡単な説明】
【図１】 本発明の実施形態の部品装着装置の斜視図である。
【図２】 図１に示す部品装着装置に備わる研磨装置の斜視図である。
【図３】 図２に示す研磨装置の構造を説明するための図である。
【図４】 図１に示す部品装着装置に備わる部品保持部材にてベアＩＣチップを回路基板の電極部に接合している状態を示す図である。
【図５】 図１に示す部品装着装置に備わる部品保持部材の斜視図である。
【図６】 図１に示す部品装着装置に備わる制御装置の機能を説明するためのブロック図である。
【図７】 図１に示す部品装着装置に備わる研磨装置の変形例における斜視図である。
【図８】 図１に示す部品装着装置に備わる研磨装置の別の変形例における斜視図である。
【図９】 従来の部品装着装置の構造を示す図である。
【符号の説明】
３…ベアＩＣチップ、１１…バンプ、２０…回路基板、２１…電極部、
１０１…部品装着装置、１３２…保持部材移動装置、
１３３…部品保持部材、１３３ａ…部品保持面、１３４…押圧装置、
１３５…超音波振動発生装置、１６０…研磨装置、
１６１…研磨材、１６１ａ…研磨面、１６２…研磨材保持台、
１６３…塵埃除去材、１６４…塵埃除去材保持台、１７０…第１回転軸、
１６５…回転機構、１８０…制御装置、１９１…塵埃除去材、
１６４１…上部盤、１６４２…下部盤、１６４３…首振り部材、
１６４４…調整用ボルト。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to, for example, a playback device that removes dirt generated on a component holding member that holds an electronic component having protruding electrodes and regenerates the component holding member, a component mounting device having the playback device, and a component mounting method. . In the component mounting apparatus, ultrasonic bonding is applied to cause the metal joints to be rubbed and bonded while the protruding electrodes of the electronic components held by the component holding member are in contact with the electrodes of the mounting object. Do.
[0002]
[Prior art]
There is a so-called bare IC chip, which is a semiconductor chip cut from a semiconductor wafer on which a circuit pattern having the electrode is formed, and an electrode for electrical bonding to a conductor land on the circuit board, and the electrode of the bare IC chip Bumps as protruding electrodes are formed by wire bonding or the like. The bare IC chip on which the bumps are formed in this way is held by the nozzle 93 provided with the ultrasonic vibration generating device 9 shown in FIG. 9 and attached to the circuit board. The ultrasonic vibration generator 9 amplifies the vibration generated in the piezoelectric element 91 by application of a voltage with an ultrasonic horn 92, and ultrasonically vibrates the nozzle 93 attached to the end of the ultrasonic horn 92. A tip holding portion 95 for sucking and holding the bare IC chip 3 is formed at the tip of the nozzle 93. In such a configuration, the vibration of the piezoelectric element 91 causes ultrasonic vibration of the nozzle 93 and the chip holding unit 95, that is, the bare IC chip 3 held by the chip holding unit 95.
[0003]
In the conventional bare chip mounting apparatus provided with the ultrasonic vibration generator 9 as described above, after pressing the bumps 11 of the bare IC chip 3 against the circuit board 20 heated to about 150 ° C. on the bonding stage, The bumps 11 are ultrasonically oscillated through the bare IC chip 3 to generate frictional heat between the bumps 11 and the conductor lands 21 of the circuit board 20 to join them. By this joining method, parts such as bare IC chips can be mounted on a circuit board quickly while satisfying reliable electrical joining and high joining strength by joining with metal joining. In addition, by making the chip contact surface 95a of the chip holding portion 95 rough with a predetermined surface roughness, slip between the component and the chip contact surface 95a is suppressed, and vibration transmission is improved. Work efficiency and joining quality can be improved.
[0004]
On the other hand, since the bare IC chip 3 becomes difficult to vibrate when the ultrasonic vibration is applied, particularly when the bump 11 and the land electrode portion 21 start to be joined, the bare IC chip 3 and the chip holding portion 95 are not easily vibrated. The chip holding part 95 may be rubbed against the bare chip 3 at the contact portion. Accordingly, the chip contact surface 95a wears out while repeating the bonding operation, the initial surface roughness of about 0.2 μm to 2 μm is roughened, and the height of the unevenness is changed or the flatness is lowered. The wear is also related to mechanical friction due to GaAs, Si, or the like, which is the material of the bare IC chip 3, or damage due to foreign matter biting between the chip contact surface 95 a and the bare IC chip 3. In particular, when the bare IC chip 3 is a SAW filter, the base is LiTa. 3 And LiNbO 3 Quartz is used, which is harder than Si and the chip contact surface 95a is particularly rough.
Since the wear of the chip contact surface 95a reduces the contact area between the chip holding part 95 and the bare IC chip 3, the frictional force between the chip holding part 95 and the bare IC chip 3 is reduced. Therefore, the ultrasonic vibration of the chip holding portion 95 does not effectively act on the bare IC chip 3, and as a result, the prescribed bonding strength cannot be obtained, and the bonding quality between the bare IC chip 3 and the circuit board 20 is deteriorated. Problems arise.
Therefore, conventionally, as disclosed in, for example, Japanese Patent Application Laid-Open No. 2000-91385, a slip detection unit that detects a slip state between the suction surface of the suction nozzle and the bare IC chip is provided. According to the detection result, the polishing operation of the component suction surface is performed.
[0005]
[Problems to be solved by the invention]
However, in the conventional polishing operation as disclosed in the above publication, a lapping paper with a roughness count of # 8000 to # 10000 is used, the vibration amplitude is 1 to 2 μm, and the load when frictionally contacting is also 300 g to 500 g. Polishing was performed under the above conditions, and the adsorption surface was regenerated. In such a conventional method, sufficient regeneration processing is performed at room temperature in a short time for a suction nozzle having a suction surface having a relatively small area for mounting a relatively small bare IC chip such as an LED or a SAW filter. Was able to do.
However, the size of the bare IC chip, such as a large-scale LSI or a liquid crystal driver IC, has been increased, and accordingly, the size of the suction surface is required to exceed 4 mm square, for example. In such a large bare IC chip, it is not uncommon for the number of bumps to exceed 100, and the bonding conditions when performing ultrasonic bonding are more severe than those of conventional small components. As a result, when the suction surface of the suction nozzle is rougher or adheres to Si and the like is more noticeable than in the past, it takes time for the regeneration process under the conventional regeneration process conditions for the suction surface, and the regeneration process is impossible. Also occurs.
[0006]
In addition, in a large-sized bare IC chip, in the component mounting method in which the bare IC chip and the circuit board are bonded together and the gap between the bare IC chip and the circuit board is sealed with resin, The corresponding mounting tool may be heated. In such a case, in the wrapping paper used as an abrasive, the base film can only withstand up to 150 ° C., and there is a case where the reproduction process cannot be performed in a state where the mounting tool is heated. The mounting tool needs to be cooled. Therefore, there is a problem that the downtime in the component mounting work becomes long. The present invention has been made in order to solve the above-described problems. A component holding member that can be easily regenerated regardless of the size and temperature of the component holding surface of the component holding member. It is an object of the present invention to provide a playback device, a component mounting device, and a component mounting method.
[0007]
[Means for Solving the Problems]
In order to achieve the above object, the present invention is configured as follows.
The component holding member reproducing device according to the first aspect of the present invention includes a component holding member that holds a component on a component holding surface;
Polishing having an abrasive holding table rotating device that polishes the component holding surface and regenerates the component holding surface on an abrasive holding table, and rotates the abrasive holding table in the direction around the first rotation axis. Equipment,
A pressing device connected to the component holding member and pressing the component holding surface against the abrasive;
The polishing device and the pressing device are connected, and an operation control for pressing the component holding surface against the abrasive is performed on the pressing device, In the pressing operation, the pressing load is changed with the lapse of time from the contact of the component holding surface to the abrasive to the separation, and the above And a control device that controls the rotational movement of the abrasive material holding table with respect to the abrasive material holding table rotating device during the pressing operation.
[0009]
In the first aspect, when the pressing load is divided into the first half and the second half from the contact to the release, the first half may be a larger load than the second half.
[0010]
In the first aspect, the control device further includes an ultrasonic vibration generating device attached to the component holding member, applying ultrasonic vibration to the component holding surface, and connected to the control device. At this time, ultrasonic vibration control for ultrasonically vibrating the component holding surface may be performed on the ultrasonic vibration generator.
[0011]
In the first aspect, the holding member moving device that is attached to the component holding member, moves the component holding member in a direction orthogonal to the pressing direction of the component holding member by the pressing device, and is connected to the control device The polishing device may be provided, and the control device may control the holding member moving device to move the component holding member during the pressing operation.
[0012]
In the first aspect, a dust removing material for removing dust on the component holding surface after the polishing of the component holding surface is provided on the removing material holding table, and the removing material holding table is arranged in a direction around the second rotation shaft. The polishing apparatus further comprises a dust removing device having a rotating device for rotating the removing material holding table to be rotated and connected to the control device, and the control device holds the component after polishing the component holding surface with the abrasive. Rotating operation control for rotating the removing material holding table is performed by performing a pressing operation control for pressing the surface against the dust removing material on the pressing device, and rotating the removing material holding table at the time of pressing operation control on the dust removing material. You may make it carry out with respect to an apparatus.
[0013]
In the first aspect, the polishing apparatus further includes a dust removing cloth that removes dust on the component holding surface after polishing the component holding surface, and the control device is configured to polish the component holding surface with the abrasive. Further, pressing operation control for pressing the component holding surface against the dust removing cloth may be performed on the pressing device.
[0014]
In the first aspect, the abrasive holding table may include a horizontal adjustment member that arranges the polishing surface of the abrasive that the component holding surface is in contact with and parallel to the component holding surface. .
[0015]
In the first aspect, the polishing apparatus may further include a vertical adjustment member that arranges the first rotation shaft in parallel with the vertical direction.
[0016]
In the first aspect, the abrasive may be mainly composed of a ceramic abrasive grain bonded body, an alkanesas natural grindstone, or a diamond grindstone.
[0017]
Furthermore, the component mounting apparatus according to the second aspect of the present invention is a component mounting apparatus that joins the protruding electrode of the component provided with the protruding electrode in contact with the electrode of the mounting object,
The component holding member reproducing apparatus according to the first aspect is provided.
[0018]
Furthermore, in the component mounting method according to the third aspect of the present invention, the protruding electrode of the component provided with the protruding electrode is brought into contact with the electrode portion of the mounting object, and ultrasonic vibration is applied to the component so that the protruding electrode and the A component mounting method for bonding the electrode part and mounting the component to the mounting target,
After the mounting operation, the component holding surface holding the component during the mounting operation is pressed against the rotating abrasive material to regenerate the component holding surface. The pressing load of the component holding surface on the abrasive is changed with the lapse of time from contact of the component holding surface to the abrasive to separation. It is characterized by that.
[0020]
In the third aspect, ultrasonic vibration may be applied to the component holding surface while pressing the component holding surface against the abrasive.
[0021]
In the third aspect, at least one of the component holding surface and the abrasive may be moved in a direction orthogonal to the pressing direction while pressing the component holding surface against the abrasive.
[0022]
In the third aspect, after the regenerating operation of the component holding surface, the component holding surface may be pressed against a rotating dust removing material to remove dust on the component holding surface.
[0023]
In the third aspect, after the regenerating operation of the component holding surface, the component holding surface may be pressed against a dust removing cloth to remove dust on the component holding surface.
[0024]
Furthermore, the component holding member reproducing apparatus according to the fourth aspect of the present invention includes a component holding member that holds a component on the component holding surface,
A relative movement device that polishes the component holding surface and regenerates the component holding surface on an abrasive holding table, and relatively moves the abrasive holding table and the component holding surface;
A pressing device connected to the component holding member and pressing the component holding surface against the abrasive;
The relative movement device and the pressing device are connected to control the pressing device to press the component holding surface against the abrasive, and the abrasive holding table and the component holding surface are operated during the pressing operation. A control device that controls the relative movement of the relative movement device;
It is provided with.
[0025]
DETAILED DESCRIPTION OF THE INVENTION
A component holding member reproducing device, a component mounting device, and a component mounting method according to embodiments of the present invention will be described below with reference to the drawings. In addition, in each figure, the same code | symbol is attached | subjected about the same component. The component mounting device is a device including the component holding member reproducing device, and the component mounting method is a method executed by the component mounting device. In this embodiment, the “component” is a silicon wafer, LiTa. 3 LiNbO 3 A so-called bare IC in which an integrated circuit is formed on a semiconductor substrate such as quartz by thin film technology, bumps are formed on electrodes of the integrated circuit by wire bonding technology, and further separated into individual integrated circuit portions. Take the tip as an example. However, the “component” is not limited to the bare IC chip, but may be an electronic component or various components other than the electronic component. Further, a circuit board on which the above components are mounted is taken as an example of the “mounting object”, but is not limited thereto. For example, the mounting target may be a component, a casing, a frame, or the like on which a circuit is formed. In this embodiment, the “relatively moving device” corresponds to a holding member moving device that moves the mounting head, and an abrasive and a rotation mechanism provided in the polishing device. Further, the abrasive is at least one in the X and Y directions. A moving device that moves in the direction is included.
[0026]
Further, as will be described later, in this embodiment, when the bare IC chip is mounted on the circuit board, ultrasonic vibration is applied to the bare IC chip. Any vibration may be used as long as frictional heat is generated between them and the heating temperature of the circuit board by the bonding stage can be lowered, and is not limited to the ultrasonic vibration.
In the embodiment described below, the bump is formed on the bare IC chip and the bump is joined to the electrode portion on the circuit board. However, the present invention is not limited to this. The component holding member reproducing device, the component mounting device, and the component mounting method in the embodiment of the present invention are the reverse of the above case, that is, including the case where bumps are formed on the electrode portions on the circuit board, This includes a case where a bump formed on one of the circuit boards is bonded to an electrode location on the other.
[0027]
As shown in FIG. 1, the component mounting apparatus 101 of the present embodiment sucks a semiconductor wafer 1 diced into individual bare IC chips 3 on a dicing sheet 2 as a component by a mounting head 131. Then, as shown in FIG. 4, the circuit board 20 such as a printed wiring board is an object to be mounted, and the bumps 11 formed on the electrodes 7 of the bare IC chip 3 and the electrode portions 21 of the circuit board 20 are ultrasonically bonded. It is a device for mounting the bare IC chip 3 on the circuit board 20 with mechanical bonding, and further includes a polishing device 160 and a control device 180 as one of characteristic components. Such a component mounting apparatus 101 is roughly divided into a component supply device 110, a substrate positioning device 120, a component transfer device 130, the polishing device 160, and a control device 180. Each of these components will be described below.
[0028]
The component supply device 110 mainly includes a wafer take-out device 111 and a chip supply device 112. The wafer take-out device 111 includes a lifter for the wafer supply magazine 113 and an expander for the dicing sheet 2, a take-out mechanism for taking out and holding the semiconductor wafer 1 from the magazine 113, and a push-up for pushing up the desired bare IC chip 3. A wafer moving mechanism that includes a mechanism and has a ball screw structure and moves the take-out mechanism in the X and Y directions, and a wafer take-out device 111 takes out and positions the semiconductor wafer 1. The chip supply unit 112 moves the chip holding unit 114 in the X direction between the chip holding unit 114 that holds the pushed-up bare IC chip 3 by suction, for example, and the reverse position 115 and the protruding position. The bare IC chip 3 held from the semiconductor wafer 1 by the chip holding unit 114 is transferred to the inversion position 115 by the moving mechanism 116. The chip holding unit 114 is provided with a recognition camera for recognizing the bare IC chip 3 to be sucked.
A reversing device 117 is provided at the reversing position 115. With respect to the bare IC chip 3 supplied by the chip holding unit 114 with the circuit surface on which the bumps 11 are formed facing upward, the reversing device 117 is The circuit surface is inverted so that it faces down.
[0029]
The board positioning device 120 is a device that holds the circuit board 20 supplied from the outside of the component mounting apparatus 101 and positions the circuit board 20 in order to mount the bare IC chip 3 at a predetermined position of the circuit board 20. A moving mechanism 121 that holds the circuit board 20 and serves as a stage for mounting the bare IC chip 3 and moves the holding table in the Y direction; and after mounting the bare IC chip 3, the chip And a mounted substrate transfer device 122 that transfers the mounted circuit board 20.
[0030]
The component transfer device 130 is a device for mounting the inverted bare IC chip 3 on the predetermined position of the circuit board 20 positioned by the substrate positioning device 120, and includes a mounting head 131 and a holding member moving device. 132. The mounting head 131 is made of stainless steel or die steel, high-speed steel, cemented carbide, titanium alloy, diamond, which holds the bare IC chip 3 on the component holding surface 133a shown in FIG. A component holding member 133 made of ceramic, etc., a pressing device 134 connected to the component holding member 133 and moving the component holding member 133 in the Z direction corresponding to the vertical direction and perpendicular to the X and Y directions, and the component An ultrasonic vibration generator 135 that is attached to the holding member 133 and applies ultrasonic vibration to the bare IC chip 3 through the component holding surface 133a is provided. In the present embodiment, the component holding surface 133a has a maximum size of 16 mm so that the 4 mm square bare IC chip 3 can be held, and the surface roughness thereof is, for example, about 0.2 μm to 2 μm. It is formed with surface roughness. In this embodiment, a pneumatic cylinder is provided as the pressing device 134 and pressurization is performed with a load of about 500 mN to about 500 N. However, the specific configuration of the pressurizing means is not limited to the pneumatic cylinder. . In the present embodiment, the ultrasonic vibration generator 135 generates vibrations having a vibration frequency of 40 kHz and an amplitude of about 0.5 to 8 μm on the component holding surface 133a. Due to the vibration, in the mounting operation of the bare IC chip 3 on the circuit board 20, friction is generated between the electrode portion 21 of the circuit board 20 and the bump 11 of the bare IC chip 3 pressed by the pressing device 134. Both are mechanically joined by ultrasonic joining.
[0031]
As shown in FIG. 5, the component holding member 133 is connected to a suction device 136 for adsorbing the bare IC chip 3 to the component holding surface 133a. As described above, the bare IC chip 3 and the circuit board 20 are also connected. Heater for heating the component holding member 133, in particular, the component holding surface 133a, from room temperature to about 250 ° C. for resin sealing of the gap between them and for assisting the bonding of the bare IC chip 3 and the circuit board 20 The unit 137 is attached, and further, a cooling device 138 is attached to suppress the heat generation of the vibrator constituting the ultrasonic vibration generator 135. Note that the suction device 136, the heater unit 137, and the cooling device 138 are connected to the control device 180 and controlled in operation by the control device 180.
The holding member moving device 132 has a ball screw mechanism to which the mounting head 131 is attached, and moves the mounting head 131 in the X direction in this embodiment. The moving direction of the mounting head 131 by the holding member moving device 132 is not limited to the X direction, and may be the Y direction orthogonal to the X direction.
[0032]
In such a component transfer device 130, when the mounting operation of the bare IC chip 3 on the circuit board 20 is performed, the mounting head 131 is positioned by the holding member moving device 132, and then the mounting head 131 performs the bare IC chip. 3 is ultrasonically vibrated and pressed against the circuit board 20 for mounting. When positioning the mounting head 131 and the circuit board 20, it is possible to image both the bare IC chip 3 held by the mounting head 131 and the circuit board 20 held by the holding table of the moving mechanism 121. The recognition camera 139 images the mounting positions of the bare IC chip 3 and the circuit board 20 and positions them. As will be described in detail later, when performing the regenerating operation of the component holding surface 133a, the component holding surface 133a is pressed against the abrasive, preferably the component holding surface 133a is ultrasonically vibrated, and further the holding member moving device 132. The mounting head 131 is reciprocated to regenerate the component holding surface 133a.
[0033]
The control device 180 includes a component mounting device including operation control of the component supply device 110, the substrate positioning device 120, and the component transfer device 130, which are the above-described components, and operation control related to the polishing device 160 described below. 101 is an apparatus that controls the operation of the entire apparatus 101, and is preferably configured by a microcomputer. A detailed operation description of the control device 180 will be described later in the operation description of the component mounting apparatus 101.
[0034]
The polishing device 160 includes Si and LiTa in the bare IC chip 3 fixed to the component holding surface 133a of the component holding member 133. 3 The component holding surface 133a is regenerated by removing the base material such as and the like and repairing the flatness of the component holding surface 133a. This will be described in detail below.
FIG. 2 shows a polishing apparatus 160 provided in the component mounting apparatus 101 of the present embodiment. The polishing apparatus 160 includes an abrasive 161, an abrasive holder 162, and a dust remover 163 as main components. A dust removing material holding base 164, a rotation mechanism 165, a dust intrusion prevention device 166, an abrasive adsorbing device 167, and a dust suction device 168. In this embodiment, as shown in FIG. The dust removing material 163 is disposed adjacent to each other, and is rotated in the direction of the arrow 1651 by the rotating mechanism 165. The dust generated during the regenerating operation of the component holding surface 133a is sucked and removed by the dust suction device 168, and the dust intrusion prevention device 166 prevents the dust from entering the polishing device 160. Each operation in the polishing apparatus 160 is controlled by the control apparatus 180. The dust removing device 163, the dust removing material holding base 164, the rotating mechanism 165, the dust suction device 168, and the control device 180 constitute a dust removing device. The polishing apparatus 160 will be described in more detail.
[0035]
The abrasive holding base 162 is attached to one end of the first rotating shaft 170 that is rotatably supported by the frame member 169 of the polishing apparatus 160 and extends in the vertical direction, and similarly extends in the vertical direction and is rotatably supported. The dust removing material holding base 164 is attached to one end of the second rotating shaft 171 to be operated. A driving belt 1653 is wound around each other end of the first rotating shaft 170 and the second rotating shaft 171 between an output shaft of an induction motor 1652 which is a rotation driving source included in the rotating mechanism 165. . Accordingly, the abrasive material holding table 162 and the dust removing material holding table 164 are rotated by the motor 1652 in the direction of the arrow 1651, which is the direction around the first rotating shaft 170 and the second rotating shaft 171, respectively. Further, the rotation mechanism 165 detects the rotation of the first rotating shaft 170 in order to detect the rotation stop of the abrasive 161 caused by the load generated when the component holding surface 133a is pressed against the abrasive 161 as described above. The rotation detector 1654 is provided, and the rotation detector 1654 sends rotation information to the control device 180. The reason for rotating the abrasive 161 is that the polishing surface of the abrasive 161 is not a completely flat surface, and therefore the component holding surface 133a is polished evenly. In the present embodiment, as described above, since the first rotating shaft 170 and the second rotating shaft 171 are connected by the drive belt 1653, no rotation detector is provided on the second rotating shaft 171 side. .
Of the rotating mechanism 165, the first rotating shaft 170, the motor 1652, the driving belt 1653, and the rotation detector 1654 constitute an abrasive holding table rotating device.
[0036]
As shown in FIG. 3, the abrasive material holding table 162 is a member that holds the abrasive material 161 by an adsorption operation in the present embodiment, and has, for example, a circular upper plate having a mounting surface 1641a on which the abrasive material 161 is placed. 1641, for example, a circular lower board 1642 fixed to the first rotating shaft 170, and an upper board 1641 and a lower board 1642 provided between the upper board 1641 and the lower board 1642 and having a constricted portion as shown in the drawing. Four swinging members 1643 that allow the board 1641 to swing slightly and four or three parts of the lower board 1642 that are arranged at equal intervals and screwed so that each tip can contact the upper board 1641 or Three adjustment bolts 1644 are provided. In the present embodiment, the abrasive 161 is a combination of ceramic abrasive grains and has a square shape with a size exceeding the component holding surface 133a of the component holding member 133. The roughness of the polishing surface 161a is # 400. ~ # 1500, having a Rockwell hardness of 5 to 65. Note that the abrasive 161 is not limited to the above-described one, and may be, for example, an alkanesas natural grindstone or a diamond grindstone as a main component. As an example of the abrasive 161, a 20 mm square, a thickness of 5 mm and a polished surface 161a having a flatness of 5 μm can be used.
As described above, a component holding member 133 having a component holding surface 133a that is in the form of a grindstone and has a size that exceeds 4 mm square, for example, by providing the abrasive 161 that selects the roughness and hardness of the polishing surface 161a. Even when the component holding surface 133a is heated, the component holding surface 133a can be easily regenerated.
[0037]
By configuring the abrasive holding base 162 as described above, it is possible to adjust the amount of protrusion of the adjusting bolt 1644 from the lower board 1642 and adjust the swing direction and the inclination of the upper board 1641. is there. Thus, it is possible to adjust the level of the mounting surface 1641a described above, more precisely, the level of the polishing surface 161a of the component holding surface 133a in the abrasive 161 held on the mounting surface 1641a. The lower board 1642, the swinging member 1643, and the adjustment bolt 1644 can be said to be horizontal adjustment members that adjust the horizontal state of the polishing surface 161a of the abrasive 161. Of course, the component holding surface 133a is also arranged horizontally.
[0038]
Further, in order to hold the abrasive 161 by the suction operation, one or a plurality of suction openings are formed in the placement surface 1641a, and the openings include an upper board 1641, a swinging member 1643, and a lower board. 1642 and a suction passage 1645 penetrating through the inside of the first rotating shaft 170. The suction passage 1645 is connected to a vacuum pump 1671 which is a constituent part of the abrasive adsorbing device 167. Accordingly, the abrasive 161 is adsorbed and held on the mounting surface 1641a by the suction force of the vacuum pump 1671.
By holding the abrasive 161 by suction in this manner, the holding of the abrasive 161 can be easily released by stopping the vacuum pump 1671, and the abrasive 161 can be easily replaced. In addition, for preventing positioning of the abrasive 161 held on the mounting surface 1641a and positioning the abrasive 161 on the mounting surface 1641a, the diagonal of the rectangular abrasive 161 is placed. As shown in FIG. 2, a pair of pins 1646 are implanted in two places on the placement surface 1641a described above corresponding to the positions.
[0039]
The dust removing material holding base 164 is fixed to the second rotating shaft 171, and the dust removing material holding base 164 is attached with a dust removing material 163 with a fastening member. The dust removing material 163 removes dust adhering to the component holding surface 133a after the polishing of the component holding surface 133a by the abrasive 161. In this embodiment, the dust removing material 163 is made of stainless steel and has a diameter of 0.2 mm to 1 mm. A brush in which a plurality of wires having a length of about 5 mm are implanted in a circular shape is used. Such a stainless brush is suitable, but is not limited to this, and can be replaced with other materials that can obtain the same effect. The diameter of the circular dust removing material 163 is larger than the component holding surface 133a of the component holding member 133. As described above, the dust removing material holding base 164 is rotated in the direction of the arrow 1651 by the rotating mechanism 165. Of the rotating mechanism 165, the second rotating shaft 171, the motor 1652, and the driving belt 1653 constitute a dust removing material holding table rotating device.
[0040]
Further, a suction passage 1711 that passes through the second rotary shaft 171 and the dust removal material holding table 164 and connects to the dust suction device 168 opens on the dust removal material mounting surface of the dust removal material holding table 164. The dust suction device 168 is configured to remove dust removed from the component holding surface 133a when the component holding surface 133a is cleaned by the dust removing material 163, dust generated when the component holding surface 133a is polished by the abrasive 161, and the like. It is a device for removing dust, and includes a filter 1681 for filtering the dust, and an exhaust pump 1682 as a suction device installed at a subsequent stage of the filter 1681.
[0041]
By providing the dust removing material 163, the component holding surface 133 a of the component holding member 133 is polished and regenerated, and then the component holding surface 133 a is pressed against the dust removing material 163 by the pressing device 134 to hold the component. A cleaning process for removing deposits on the surface 133a can be performed. Therefore, the deposit on the component holding surface 133a, the abrasive powder clogged on the component holding surface 133a, and the like can be removed, and the deposit and the like can be prevented from adversely affecting ultrasonic vibration transmission during the mounting operation. Further, since the removed dust is removed from the dust removing material 163 by the dust suction device 168, the dust can be prevented from scattering in the component mounting device 101.
[0042]
As shown in FIG. 2, the dust intrusion prevention device 166 prevents the adhesion of the dust when not in use to the abrasive 161 and the dust remover 163 disposed adjacent to each other and polishes them. A cover member 1661 for covering and protecting the abrasive 161 and the dust removing material 163, and a cover member for preventing the dust from being unnecessarily scattered from the material 161 and the dust removing material 163 into the component mounting apparatus 101. A driving mechanism 1662. The cover member driving mechanism 1662 is configured so that the abrasive 161 and the dust removing material 163 can be used in positions that do not cover the abrasive 161 and the dust removing material 163, and the abrasive 161 and the dust removing material 163 are not used. This is a mechanism for reciprocating the cover member 1661 with a closed position covering the dust removing material 163, and an air cylinder is used as a drive source in the present embodiment. Further, the cover member driving mechanism 1662 includes an open position detection sensor 1663 that detects that the cover member 1661 is located at the open position, and a closed position detection that detects that the cover member 1661 is located at the closed position. A sensor 1664 is provided. Detection information in each of the sensors 1663 and 1664 is sent to the control device 180.
[0043]
Further, the polishing apparatus 160 includes a vertical adjusting member 172 that adjusts the vertical state of the first rotating shaft 170 and the second rotating shaft 171. In the present embodiment, as shown in FIG. 3, the vertical adjustment member 172 has three or four corners of the base plate 1691 of the frame member 169 of the polishing apparatus 160 along the thickness direction of the base plate 1691. The adjustment bolt 1721 screwed is equivalent. By adjusting the screwing amount of the adjusting bolt 1721 at each location, the inclination of the frame member 169 is adjusted with respect to the base 173 on which the frame member 169 is installed, and the first rotating shaft 170 and the second rotating shaft The axial direction of 171 is perpendicular to the mounting surface of the circuit board 20 on which the bare IC chip 3 is mounted, or so as to be perpendicular to the component holding surface 133a of the component holding member 133. Vertical adjustment is possible.
[0044]
It should be noted that the specific adjustment method and adjustment structure in the horizontal state and the vertical state in the dust removing material holding table 164 are not limited to those in the present embodiment, and can be conceived by those skilled in the art. It is possible to take a form.
Thus, the horizontal state in which the polishing surface 161a of the abrasive 161 is parallel to the plane on which the component is to be mounted, and the vertical state in which the rotation center axes 170 and 171 are perpendicular to the plane on which the component is to be mounted. By obtaining the state, the component holding surface 133a of the component holding member 133 can be polished in parallel to the plane on which the component is to be mounted, and the component holding surface 133a is polished and subjected to a regeneration process. It is possible to prevent a deviation in the direction of the holding surface 133a. In addition, even if the component holding member 133 has a component holding surface 133a having a size exceeding 4 mm square, for example, and the component holding member 133 is heated, the component holding surface 133a is regenerated. Can be easily performed.
[0045]
The component mounting operation in the component mounting apparatus 101 configured as described above will be described below. The component mounting operation includes a regenerating operation of the component holding surface 133a of the component holding member 133, which is one of the features of the present embodiment. Such component mounting operation is controlled by the control device 180, and the operation program data is stored in advance in the control device 180 or in the external memory 181 or supplied from a recording medium such as a CD-ROM. It can also be downloaded via a communication line.
In the following description of the component mounting operation, the mounting operation of the bare IC chip 3 on the circuit board 20 is briefly described because it is similar to the mounting operation in the conventional component mounting apparatus, and the components of the component holding member 133 are described. The reproducing operation of the holding surface 133a will be described in detail.
[0046]
The bare IC chip 3 pushed out after being taken out from the wafer supply magazine 113 and expanded by the wafer take-out device 111 is held by the component supply device 110 and inverted by the reversing device 115. The inverted bear IC chip 3 is sucked and held on the component holding surface 133a of the component holding member 133 in the mounting head 131, and is positioned at the mounting position in the X direction by the holding member moving device 132. On the other hand, the circuit board 20 held on the holding table of the moving mechanism 121 in the board positioning device 120 is positioned at the mounting position in the Y direction. After the positioning of the mounting positions in the X and Y directions is completed, the pressing device 134 of the mounting head 131 is operated, and the bumps 11 of the bare IC chip 3 held on the component holding surface 133 a of the component holding member 133 are formed on the circuit board 20. The bump 11 and the electrode part 21 are rubbed and joined by the operation of the ultrasonic vibration generator 135 of the mounting head 131 while being pressed by the electrode part 21. After mounting the bare IC chip 3 on the circuit board 20 in this way, the mounted circuit board 122 transports the component-mounted circuit board to the next process. In this way, the bare IC chips 3 are sequentially mounted on each circuit board 20 and conveyed to the next process.
[0047]
The reproduction operation will be described. Before the regeneration operation is performed, as described above, the adjustment bolt 1644 provided in the dust removing material holding base 164 and the adjustment bolt 1721 provided on the frame member 169 in the polishing apparatus 160 are used. The polishing surface 161a of the polishing material 161 is adjusted in advance to be horizontal and parallel to the component holding surface 133a.
After the mounting operation of one or a plurality of bare IC chips 3 is completed as described above, the holding member moving device 132 is operated to start the component of the component holding member 133 in the mounting head 131 before starting the next mounting operation. The holding surface 133a is moved above the abrasive 161 of the polishing apparatus 130. On the other hand, in the polishing device 160, the rotating mechanism 165, the dust intrusion prevention device 166, the abrasive adsorbing device 167, and the dust suction device 168 are operated, the cover member 1661 is disposed in the open position, and polishing is performed. While the material 161 is adsorbed to the abrasive holding base 162, the rotation speed is within a range of about 100 rpm to 1200 rpm, and the rotation is mainly set at a rotation speed set based on the degree of contamination of the component holding surface 133a. Further, when the polishing operation is performed by reciprocating the component holding surface 133a in the X direction as described above, for example, the rotation of the abrasive 161 is slowed for roughing in the forward path and the rotational speed for finishing is accelerated in the backward path. Control can be performed.
[0048]
After the movement, it is a part that fulfills the control function in the control device 180 and operates the pressing device 134 under the control of the pressing control unit 182 shown in FIG. 6 to press the component holding surface 133a against the abrasive 161. The applied load is a value in the range of about 500 mN to about 500 N as described above, and the set value is changed based on the size of the component holding surface 133a, for example. As an example, when the component holding surface 133a has a size of □ 16 mm, it is about 50N. In the present embodiment, in addition to the pressing operation, the component holding surface 133a is ultrasonically vibrated by the ultrasonic vibration generator 135 under the control of the ultrasonic vibration control unit 183 shown in FIG. Under the control of the movement control unit 184, the holding member moving device 132 reciprocates the component holding surface 133a together with the mounting head 131 in the X direction. In this embodiment, the reciprocation is one reciprocation, and the moving speed is a value within a range of about 1 to 5 mm / sec. For example, the set value is based on the degree of contamination and the size of the component holding surface 133a. To change. Further, when the polishing operation is performed by reciprocating the component holding surface 133a in the X direction as described above, for example, the moving speed of the component holding member 133 is slowed for roughing in the forward path, and the moving is made fast for finishing in the return path. Such control can be performed.
The moving distance is within the range of the size of the rotating abrasive 161.
Further, dust or the like removed from the component holding surface 133 a during the polishing operation is sucked by the dust suction device 168 and is not scattered into the component mounting device 101. In the present embodiment, the polishing operation of the component holding surface 133a ends when the reciprocating motion of the component holding surface 133a is completed. However, the number of reciprocations is not limited to the one reciprocation, and may be set as appropriate based on the degree of contamination of the component holding surface 133a.
[0049]
In the present embodiment, during the above polishing operation, the pressing force of the component holding surface 133a to the abrasive 161 is changed with the passage of time from the contact of the component holding surface 133a to the abrasive 161 to the separation. As an example, in the present embodiment, the pressing operation is performed with different pressing forces in the forward path and the return path, and the pressing force in the forward path is made larger than the pressing force in the return path. Specifically, the pressing force in the forward path is about 25N when the size of the component holding surface 133a is, for example, □ 10 mm, and the pressing force in the return path is about 10N. For example, the pressing force in the forward path is about 1.5 to 1000 times that in the return path, and is set in consideration of, for example, the size of the component holding surface 133a and the degree of contamination.
Note that the change in the pressing force with the passage of time is not limited to the above example, but the smoothness is continuously and smoothly with the passage of time from the contact of the component holding surface 133a to the abrasive 161 to the separation. The pressing force may be changed.
In addition, since the abrasive 161 clogs with use, a mechanism for performing so-called correction in the dressing operation may be provided.
[0050]
As described above, in the present embodiment, the ultrasonic vibration operation and the reciprocating operation are performed during the pressing operation of the component holding surface 133a against the rotating abrasive 161. It is good or only either one may act.
[0051]
As described above, the component holding surface 133a is pressed against the abrasive 161 and polished to remove the base material of the bare IC chip 3 fixed to the component holding surface 133a, and the surface roughness of the component holding surface 133a is set to a predetermined level. The part holding surface 133a can be regenerated by repairing within the range. Therefore, even if the component holding member 133 holds the bare IC chip 3 of 4 mm square or more, where the conditions of ultrasonic bonding at the time of component mounting are severe, and the component holding member 133 is heated, the component holding It is possible to regenerate the surface 133a, and it is possible to prevent defective bonding between the component and the circuit board due to deterioration of the surface roughness of the component holding surface 133a.
In addition, since the abrasive 161 rotates, and the component holding surface 133a moves in the X direction, the efficiency of the regeneration processing of the component holding surface 133a can be improved, and the regeneration processing in a shorter time can be achieved. The downtime in the component mounting work can be shortened.
[0052]
As described above, in the present embodiment, the reproduction operation is executed using the number of mounting operations as a criterion. However, based on the contamination state of the component holding surface 133a obtained from the image processing result of the imaging information of the component holding surface 133a. It may be possible to determine whether or not to perform the reproduction operation, or to determine whether or not to perform the reproduction operation based on the vibration state of the ultrasonic vibration during the mounting operation of the bare IC chip 3. Can take measures that can be conceived.
[0053]
In the polishing operation as described above, in the present embodiment, the abrasive 161 rotates but does not move in the X and Y directions. However, the present invention is not limited to this structure. For example, as shown in FIG. 7, the abrasive 161 may be rotated while being moved in at least one of the X and Y directions by a relative movement device. Further, the component holding surface 133a is also moved in the X direction by the holding member moving device 132 while the abrasive 161 is moved in at least one of the X and Y directions by the relative moving device and rotated by the rotating mechanism 165. Alternatively, the component holding surface 133a may be stopped.
Further, when the structure in which at least one of the abrasive 161 and the component holding surface 133a moves in at least one of the X and Y directions is taken, the rotational operation of the abrasive 161 may be stopped.
[0054]
An example of the regeneration processing operation by the above-described polishing operation will be described below. The load applied to the component holding surface 133a by the pressing device 134 is about 5N to about 50N, and the ultrasonic vibration generated by the ultrasonic vibration generator 135 has a frequency of 40 kHz and a vibration amplitude of 0.5 to 8 μm. The material 161 is a combination of ceramic abrasive grains having a roughness of # 400 to # 1500 and a Rockwell hardness of 5 to 65. The abrasive 161 is rotated at a speed of 100 rpm to 1200 rpm, and the mounting head 131 is rotated. That is, the component holding surface 133a was moved 10-20 mm at a speed of 1-5 mm / sec. In the case of this example, the component holding surface 133a could be regenerated with sufficient surface roughness in about 14 seconds.
[0055]
Next, the cleaning operation will be described. In the present embodiment, after the polishing operation, the following cleaning operation is further performed under the control of the dust removal control unit 185 shown in FIG. However, the cleaning operation is not an essential process.
The cleaning operation is performed as follows. That is, first, when the polishing operation is completed, the pressing device 134 is operated to temporarily raise the component holding surface 133a from the abrasive 161, and then the holding member moving device 132 is operated to move the mounting head 131 together with the component holding surface. 133 a is moved in the X direction to above the dust removing material 163. At this time, the dust removing material 163 has already been rotated by the operation of the rotating mechanism 165. After the component holding surface 133a moves above the dust removing material 163, the pressing device 134 is operated again to lower the component holding surface 133a and press the dust removing material 163. The pressing force is in the range of about 500 mN to about 50 N. For example, the set value can be changed based on the size of the component holding surface 133a.
[0056]
Dust removed from the component holding surface 133 a when the component holding surface 133 a is pressed against the dust removing material 163 is sucked by the dust suction device 168 and is not scattered into the component mounting device 101.
Further, during the cleaning operation of the component holding surface 133a by the dust removing material 163, the ultrasonic vibration generator 135 may be further operated to ultrasonically vibrate the component holding surface 133a. Then, the component holding surface 133a may be moved in the X direction together with the mounting head 131.
[0057]
By performing the cleaning operation with the dust removing material 163 after the polishing operation degree as described above, it is possible to remove the deposits present on the component holding surface 133a, the abrasive powder clogged on the component holding surface 133a, and the like by the polishing operation. it can. Furthermore, by performing the above-described cleaning operation while applying ultrasonic vibration, cleaning of the component holding surface 133a can be achieved more efficiently and in a short time by friction due to ultrasonic vibration. Therefore, the time for the cleaning process can be shortened, and the downtime in the component mounting work can be shortened.
It should be noted that the above-described polishing operation and further the regeneration processing of the component holding surface 133a by the cleaning operation are controlled and executed by the control device 180 under optimum conditions.
[0058]
The dust removing material 163 for the cleaning operation of the component holding surface 133a is not limited to the configuration using the brush of the present embodiment. For example, as shown in FIG. 8, the glass plate 190 may be sucked and held on the mounting surface 1641 a of the upper panel 1641, and the dust removing material 191 may be provided on the support surface 190 a of the glass plate 190. As the dust removing material 191, for example, a cleaning cloth made of a non-woven fabric can be used, and the component holding surface 133 a is pressed against the dust removing material 191. Other configurations and operations are the same when the above-described brush-shaped dust removing material 163 is provided. By using the glass plate 190, the glass plate 190 does not undergo elastic deformation when the component holding surface 133a is pressed, unlike the case of a metal plate. Therefore, the support surface 190a horizontally adjusted by the adjusting bolt 1644 or the like is used. Can maintain the horizontal state. The glass plate 190 is preferably a polished glass having high flatness. However, the member is not limited to the glass plate 190, and such a member can be used as long as the same effect as that of the glass plate 190 can be obtained.
[0059]
Further, a transfer device 192 having a supply roller 1921, a take-up roller 1922, and a motor 1923 for moving the dust removing material 191 on the glass plate 190 is provided using a cleaning cloth of the dust removing material 191, and the dust removing material is provided. It is preferable to move 191. With this configuration, the dust removing material 191 is sequentially updated by transferring the dust removing material 191 or intermittently or continuously during the cleaning once or after every necessary cleaning process. Can be achieved automatically. Therefore, it is not necessary to replace the dust removing material 191 every cleaning operation, and the cleaning process can be performed stably and repeatedly.
[0060]
Even in the structure using the dust removing material 191 described above, the same effect as that provided with the dust removing material 163 can be obtained. In addition, when a dust removing material 191 made of a cleaning cloth is used, dust is scattered in the component mounting apparatus 101 when removing the adhered matter on the component holding surface 133a after polishing. It can be effectively prevented and is preferable. In addition, since the dust suction device 168 is provided, the dust can be sufficiently prevented from being scattered even with a dry cleaning cloth.
[0061]
In the above description, the case where the component mounting apparatus 101 includes the polishing apparatus 160 has been described. On the other hand, as shown in FIG. 2, at least the abrasive 161, the abrasive holding base 162, the first rotating shaft 170, and the rotating mechanism 165 in the polishing device 160, the component holding member 133, the pressing device 134, and The control device 180 can constitute a component holding member reproduction device. Further, the component holding member reproducing device includes the ultrasonic generator 135, the holding member moving device 132, the dust removing material 163, the removing material holding base 164, and the dust suction device 168 in the polishing device 160. You can also.
[0062]
【The invention's effect】
As described above in detail, according to the component holding member regeneration device of the first aspect of the present invention, the component mounting device of the second aspect, and the component mounting method of the third aspect, the pressing device and the polishing device for pressing the component holding member And a control device, the component holding surface of the component holding member is pressed against the abrasive material provided in the polishing device and polished to regenerate the component holding surface. Accordingly, the component holding surface can be easily regenerated regardless of the size and temperature of the component holding surface of the component holding member.
[0063]
Further, by changing the load when the component holding surface is pressed against the abrasive under the control of the control device, the component holding surface can be regenerated more effectively.
Furthermore, an ultrasonic vibration generator is provided, and when the component holding surface is pressed against the abrasive under the control of the control device, ultrasonic vibration is performed, so that the component holding surface can be regenerated more effectively.
Furthermore, a holding member moving device is provided, and the component holding surface can be more effectively regenerated by moving the component holding surface when the component holding surface is pressed against the abrasive under the control of the control device.
[0064]
Further, the polishing apparatus includes a dust removing device, and the dust attached to the component holding surface by the polishing operation can be removed by pressing the component holding surface against the dust removing material after the polishing operation. Therefore, it is possible to further improve the cleanliness of the component holding surface after the above regeneration process, and to prevent the adhering material or the like on the component holding surface from adversely affecting the bonding between the component and the circuit board in the component mounting operation. it can.
[0065]
In addition, the polishing apparatus may be provided with a dust removing cloth, and the dust attached to the component holding surface may be removed by pressing the component holding surface against the dust removing cloth after the polishing operation. In addition, the component holding surface includes a horizontal adjustment member that makes the polishing surface of the abrasive parallel and horizontal to the component holding surface, and further includes a vertical adjustment member that adjusts the vertical degree of the rotating shaft that supports the abrasive. Can be adjusted horizontally, and the reproduction process of the component holding surface can be performed without deviation.
[0066]
According to the component holding member reproducing device of the fourth aspect of the present invention, the abrasive material provided in the relative movement device includes a pressing device for pressing the component holding member, a relative movement device having a polishing unit, and a control device. The component holding surface of the component holding member is pressed, the abrasive and the component holding surface are moved relatively, the component holding surface is polished, and the component holding surface is regenerated. Accordingly, the component holding surface can be easily regenerated regardless of the size and temperature of the component holding surface of the component holding member.
[Brief description of the drawings]
FIG. 1 is a perspective view of a component mounting apparatus according to an embodiment of the present invention.
FIG. 2 is a perspective view of a polishing apparatus provided in the component mounting apparatus shown in FIG.
FIG. 3 is a view for explaining the structure of the polishing apparatus shown in FIG. 2;
4 is a view showing a state in which a bare IC chip is bonded to an electrode portion of a circuit board by a component holding member provided in the component mounting apparatus shown in FIG. 1;
FIG. 5 is a perspective view of a component holding member provided in the component mounting apparatus shown in FIG. 1;
6 is a block diagram for explaining functions of a control device provided in the component mounting apparatus shown in FIG. 1; FIG.
FIG. 7 is a perspective view of a modification of the polishing apparatus provided in the component mounting apparatus shown in FIG.
FIG. 8 is a perspective view of another modification of the polishing apparatus provided in the component mounting apparatus shown in FIG. 1;
FIG. 9 is a diagram showing a structure of a conventional component mounting apparatus.
[Explanation of symbols]
3 ... Bare IC chip, 11 ... Bump, 20 ... Circuit board, 21 ... Electrode part,
101: Component mounting device, 132: Holding member moving device,
133: Component holding member, 133a: Component holding surface, 134: Pressing device,
135 ... Ultrasonic vibration generator, 160 ... Polishing device,
161 ... Abrasive material, 161a ... Abrasive surface, 162 ... Abrasive material holder,
163 ... Dust removing material, 164 ... Dust removing material holding base, 170 ... First rotating shaft,
165 ... Rotating mechanism, 180 ... Control device, 191 ... Dust removing material,
1641 ... Upper board, 1642 ... Lower board, 1643 ... Swing member,
1644 ... Adjustment bolt.

Claims (7)

部品保持面（１３３ａ）に部品（３）を保持する部品保持部材（１３３）と、
上記部品保持面を研磨し該部品保持面を再生する研磨材（１６１）を研磨材保持台（１６２）に設け、該研磨材保持台を第１回転軸（１７０）の軸周り方向へ回転させる研磨材保持台回転装置（１６５）を有する研磨装置（１６０）と、
上記部品保持部材に接続され上記部品保持面を上記研磨材へ押圧する押圧装置（１３４）と、
上記研磨装置及び上記押圧装置が接続され、上記部品保持面を上記研磨材に押圧させる動作制御を上記押圧装置に対して行い、押圧動作では、上記研磨材への上記部品保持面の接触から離脱までの時間経過に伴い押圧荷重を変化させ、かつ上記押圧動作のとき上記研磨材保持台の回転動作制御を上記研磨材保持台回転装置に対して行う制御装置（１８０）と、
を備えたことを特徴とする部品保持部材再生装置。A component holding member (133) for holding the component (3) on the component holding surface (133a);
An abrasive material (161) for polishing the component holding surface and regenerating the component holding surface is provided on the abrasive material holding table (162), and the abrasive material holding table is rotated about the first rotation shaft (170). A polishing device (160) having an abrasive holding table rotating device (165);
A pressing device (134) connected to the component holding member and pressing the component holding surface against the abrasive;
The polishing device and the pressing device are connected, and the pressing device controls the operation of pressing the component holding surface against the abrasive. In the pressing operation, the component holding surface is released from contact with the polishing material. A control device (180) for changing the pressing load with the lapse of time and performing the rotational operation control of the abrasive holding table on the abrasive holding table rotating device during the pressing operation;
A component holding member reproducing apparatus comprising: 上記押圧荷重は、上記接触から離脱までを前半及び後半に分けたとき、上記前半を上記後半に比べて大きい荷重とする、請求項１記載の部品保持部材再生装置。 2. The component holding member regeneration device according to claim 1, wherein, when the pressing load is divided into the first half and the second half from the contact to the release, the first half is a larger load than the second half . 部品保持面（１３３ａ）に部品（３）を保持する部品保持部材（１３３）と、
上記部品保持面を研磨し該部品保持面を再生する研磨材（１６１）を研磨材保持台（１６２）に設け、該研磨材保持台を第１回転軸（１７０）の軸周り方向へ回転させる研磨材保持台回転装置（１６５）を有する研磨装置（１６０）と、
上記部品保持部材に接続され上記部品保持面を上記研磨材へ押圧する押圧装置（１３４）と、
上記研磨装置及び上記押圧装置が接続され、上記部品保持面を上記研磨材に押圧させる動作制御を上記押圧装置に対して行い、かつ押圧動作のとき上記研磨材保持台の回転動作制御を上記研磨材保持台回転装置に対して行う制御装置（１８０）と、
を備え、
上記部品保持面の研磨後において該部品保持面の塵埃を除去する塵埃除去材（１６３）を除去材保持台（１６４）に設け、かつ上記除去材保持台を第２回転軸（１７１）の軸周り方向へ回転させる除去材保持台回転装置（１６５）を有しかつ上記制御装置に接続される塵埃除去装置を上記研磨装置はさらに備え、上記制御装置は、上記研磨材による上記部品保持面の研磨後、上記部品保持面を上記塵埃除去材に押圧する押圧動作制御を上記押圧装置に対して行い、かつ該塵埃除去材に対する押圧動作制御のとき上記除去材保持台を回転させる回転動作制御を上記除去材保持台回転装置に対して行うことを特徴とする部品保持部材再生装置。 A component holding member (133) for holding the component (3) on the component holding surface (133a);
An abrasive material (161) for polishing the component holding surface and regenerating the component holding surface is provided on the abrasive material holding table (162), and the abrasive material holding table is rotated about the first rotation shaft (170). A polishing device (160) having an abrasive holding table rotating device (165);
A pressing device (134) connected to the component holding member and pressing the component holding surface against the abrasive;
The polishing device and the pressing device are connected to perform operation control for pressing the component holding surface against the abrasive with respect to the pressing device, and during the pressing operation, rotational control of the abrasive holding table is controlled with the polishing. A control device (180) for the material holding table rotating device;
With
A dust removing material (163) for removing dust on the component holding surface after polishing the component holding surface is provided on the removing material holding table (164), and the removing material holding table is provided on the shaft of the second rotating shaft (171). The polishing apparatus further includes a dust removing device having a removing material holding table rotating device (165) that rotates in a circumferential direction and connected to the control device, and the control device is configured to control the component holding surface of the abrasive material. After polishing, the pressing device performs pressing operation control for pressing the component holding surface against the dust removing material, and rotational operation control for rotating the removing material holding base when pressing operation control for the dust removing material is performed. A component holding member recycling apparatus, which is performed on the removing material holding table rotating device. 部品保持面（１３３ａ）に部品（３）を保持する部品保持部材（１３３）と、
上記部品保持面を研磨し該部品保持面を再生する研磨材（１６１）を研磨材保持台（１６２）に設け、該研磨材保持台を第１回転軸（１７０）の軸周り方向へ回転させる研磨材保持台回転装置（１６５）を有する研磨装置（１６０）と、
上記部品保持部材に接続され上記部品保持面を上記研磨材へ押圧する押圧装置（１３４）と、
上記研磨装置及び上記押圧装置が接続され、上記部品保持面を上記研磨材に押圧させる動作制御を上記押圧装置に対して行い、かつ押圧動作のとき上記研磨材保持台の回転動作制御を上記研磨材保持台回転装置に対して行う制御装置（１８０）と、
を備え、
上記部品保持面の研磨後において該部品保持面の塵埃を除去する塵埃除去布（１９１）を上記研磨装置はさらに備え、上記制御装置は、上記研磨材による上記部品保持面の研磨後、上記部品保持面を上記塵埃除去布に押圧する押圧動作制御を上記押圧装置に対して行 うことを特徴とする部品保持部材再生装置。 A component holding member (133) for holding the component (3) on the component holding surface (133a);
An abrasive material (161) for polishing the component holding surface and regenerating the component holding surface is provided on the abrasive material holding table (162), and the abrasive material holding table is rotated about the first rotation shaft (170). A polishing device (160) having an abrasive holding table rotating device (165);
A pressing device (134) connected to the component holding member and pressing the component holding surface against the abrasive;
The polishing device and the pressing device are connected to perform operation control for pressing the component holding surface against the abrasive with respect to the pressing device, and during the pressing operation, rotational control of the abrasive holding table is controlled with the polishing. A control device (180) for the material holding table rotating device;
With
The polishing apparatus further includes a dust removal cloth (191) for removing dust on the component holding surface after polishing the component holding surface, and the control device is configured to polish the component holding surface after polishing the component holding surface with the abrasive. the holding surface pressing operation control for pressing to the dust removing cloth component holding member reproducing apparatus according to claim row Ukoto against the pressing device. 突起電極（１１）を設けた部品（３）の上記突起電極を装着対象物（２０）の電極部（２１）に接触させて、かつ上記部品に超音波振動を与えて上記突起電極と上記電極部とを接合して上記部品を上記装着対象物に装着する部品装着方法であって、The protruding electrode and the electrode are formed by bringing the protruding electrode of the component (3) provided with the protruding electrode (11) into contact with the electrode portion (21) of the mounting object (20) and applying ultrasonic vibration to the component. A component mounting method for joining the component and mounting the component on the mounting target,
上記装着動作のときに上記部品を保持している部品保持面（１３３ａ）を、上記装着動作終了後に、回転している研磨材（１６１）に押圧して上記部品保持面の再生を行い、上記部品保持面の上記研磨材への押圧荷重は、上記研磨材への上記部品保持面の接触から離脱までの時間経過に伴い変化させることを特徴とする部品装着方法。  After the mounting operation, the component holding surface (133a) holding the component during the mounting operation is pressed against the rotating abrasive (161) to regenerate the component holding surface, A component mounting method, wherein the pressing load of the component holding surface to the abrasive is changed with the passage of time from contact of the component holding surface to the abrasive to separation. 突起電極（１１）を設けた部品（３）の上記突起電極を装着対象物（２０）の電極部（２１）に接触させて、かつ上記部品に超音波振動を与えて上記突起電極と上記電極部とを接合して上記部品を上記装着対象物に装着する部品装着方法であって、The protruding electrode and the electrode are formed by bringing the protruding electrode of the component (3) provided with the protruding electrode (11) into contact with the electrode portion (21) of the mounting object (20) and applying ultrasonic vibration to the component. A component mounting method for joining the component and mounting the component on the mounting target,
上記装着動作のときに上記部品を保持している部品保持面（１３３ａ）を、上記装着動作終了後に、回転している研磨材（１６１）に押圧して上記部品保持面の再生を行い、  The component holding surface (133a) holding the component during the mounting operation is pressed against the rotating abrasive (161) after the mounting operation is completed, and the component holding surface is regenerated.
上記部品保持面の上記再生動作後、上記部品保持面を回転している塵埃除去材（１６３）に押圧して上記部品保持面の塵埃を除去することを特徴とする部品装着方法。  A component mounting method comprising: pressing the component holding surface against a rotating dust removing material (163) after the regenerating operation of the component holding surface to remove dust on the component holding surface. 突起電極（１１）を設けた部品（３）の上記突起電極を装着対象物（２０）の電極部（２１）に接触させて、かつ上記部品に超音波振動を与えて上記突起電極と上記電極部とを接合して上記部品を上記装着対象物に装着する部品装着方法であって、The protruding electrode and the electrode are formed by bringing the protruding electrode of the component (3) provided with the protruding electrode (11) into contact with the electrode portion (21) of the mounting object (20) and applying ultrasonic vibration to the component. A component mounting method for joining the component and mounting the component on the mounting target,
上記装着動作のときに上記部品を保持している部品保持面（１３３ａ）を、上記装着動作終了後に、回転している研磨材（１６１）に押圧して上記部品保持面の再生を行い、  The component holding surface (133a) holding the component during the mounting operation is pressed against the rotating abrasive (161) after the mounting operation is completed, and the component holding surface is regenerated.
上記部品保持面の上記再生動作後、上記部品保持面を塵埃除去布（１９１）に押圧して上記部品保持面の塵埃を除去することを特徴とする部品装着方法。  A component mounting method comprising: removing the dust on the component holding surface by pressing the component holding surface against a dust removing cloth (191) after the regenerating operation of the component holding surface.
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