JP3966234B2

JP3966234B2 - Electronic component bonding apparatus and bonding tool

Info

Publication number: JP3966234B2
Application number: JP2003171934A
Authority: JP
Inventors: 誠司 ▲高▼橋; 健一大竹; 隆稔石川; 誠岡崎
Original assignee: Panasonic Corp; Matsushita Electric Industrial Co Ltd
Current assignee: Panasonic Corp; Panasonic Holdings Corp
Priority date: 2003-06-17
Filing date: 2003-06-17
Publication date: 2007-08-29
Anticipated expiration: 2020-07-06
Also published as: JP2003347361A

Description

【０００１】
【発明の属する技術分野】
本発明は、フリップチップのようなバンプ付き電子部品などの電子部品を基板の電極などの被接合面にボンディングする電子部品のボンディング装置およびボンディングツールに関するものである。
【０００２】
【従来の技術】
電子部品を基板の電極などの被接合面にボンディングする方法として、超音波圧接を用いる方法が知られている。この方法は、電子部品を被接合面に対して押圧しながら電子部品に超音波振動を与え、接合面を微小に振動させて摩擦を生じさせることにより接合面を密着させるものである。この方法に用いられるボンディングツールは、振動発生源である超音波振動子の振動を電子部品に伝達させる細長形状の棒体であるホーンを有しており、このホーンに備えられた圧着子によって電子部品に荷重と振動を作用させながら、電子部品を被接合面に圧着してボンディングするようになっている。圧着子にはボンディング時の負荷（荷重と振動）が作用するため、繰り返し使用によってその下面（電子部品の吸着面）が摩耗しやすい。この摩耗が甚しくなると正常なボンディングを行うことが出来なくなるため、定期的に圧着子を交換せねばならない。このため、超音波接合用のボンディングツールでは、ホーン全体を交換することの無駄を避け、圧着子をホーン本体に対して着脱可能な別部品としてこの別部品のみを交換する方法が一般に用いられている。
【０００３】
【発明が解決しようとする課題】
ところで、電子部品のボンディングツールは、電子部品を移送して基板に実装する移載用のツールとして用いられる場合が多い。このような移載機能を併せ持ったボンディングツールには、電子部品に当接する接合作用部に真空吸着用の吸着孔が設けられ、ホーン内部に設けられた真空吸引孔を介してこの吸着孔から真空吸引することにより、電子部品を保持するようになっている。
【０００４】
しかしながら、前述のように圧着子を別部品として構成されたボンディングツールでは、圧着部に設けられた吸着孔とホーン内部の真空吸引孔とを連通させることが構造上難しく、簡単な構造で真空吸着系を構成する方法が望まれていた。
【０００５】
そこで本発明は、圧着子を別部品として交換でき、しかも簡単な構造で真空吸着系を構成できる電子部品のボンディング装置およびボンディングツールを提供することを目的とする。
【０００６】
【課題を解決するための手段】
請求項１記載の電子部品のボンディング装置は、電子部品に荷重と振動を作用させながらこの電子部品を被接合面に圧着する電子部品のボンディング装置であって、電子部品を接合するボンディングツールと、このボンディングツールを前記電子部品に押圧する押圧手段とを備え、前記ボンディングツールは、横長のホーンと、このホーンに振動を付与する振動子と、前記ホーンの定在波振動の腹に相当する位置に設けられた貫通孔と、この貫通孔の下部を密封して装着され先端部に前記電子部品に当接する接合作用部が設けられた圧着子と、この貫通孔の上部を密封して装着され貫通孔を介して前記圧着子と締結手段によって結合された結合部材と、前記圧着子の前記接合作用部から開口して前記貫通孔の上下を前記圧着子および結合部材によって密封されて形成された内部空間に連通する吸着孔と、前記ホーンに設けられ前記内部空間を真空吸引する吸引孔とを備えた。
【０００７】
請求項２記載の電子部品のボンディング装置は、請求項１記載の電子部品のボンディング装置であって、前記締結手段は前記圧着子に設けられた内ねじ部およびこの内ねじ部に螺合する外ねじ部が形成された外ねじ部材であり、前記結合部材は前記貫通孔の上部に設けられた内テーパ部に嵌合する外テーパ部を有し前記外ねじ部材が挿通する嵌合部材を含む。
【０００８】
請求項３記載の電子部品のボンディング装置は、請求項１記載の電子部品のボンディング装置であって、前記締結手段は前記圧着子に設けられた外ねじ部およびこの外ねじ部に螺合する内ねじ部が形成された内ねじ部材を含む。
【０００９】
請求項４記載の電子部品のボンディング装置は、請求項１記載の電子部品のボンディング装置であって、前記締結手段は前記圧着子に設けられた外ねじ部およびこの外ねじ部に螺合する内ねじ部が形成された内ねじ部材であり、前記結合部材は前記貫通孔の上部に設けられた内テーパ部に嵌合する外テーパ部を有し前記外ねじ部が挿通する嵌合部材を含む。
【００１０】
請求項５記載の電子部品のボンディング装置は、請求項１記載の電子部品のボンディング装置であって、前記締結手段は１組の内ねじ部と外ねじ部より構成され、これらのねじ部を締め付けることにより前記圧着子と前記結合部材とで貫通孔の上部と下部を塞いで密封する。
【００１１】
請求項６記載の電子部品のボンディングツールは、電子部品に荷重と振動を作用させながらこの電子部品を被接合面に圧着するボンディングツールであって、横長のホーンと、このホーンに振動を付与する振動子と、前記ホーンの定在波振動の腹に相当する位置に設けられた貫通孔と、この貫通孔の下部を密封して装着され先端部に前記電子部品に当接する接合作用部が設けられた圧着子と、この貫通孔の上部を密封して装着され貫通孔を介して前記圧着子と締結手段によって結合された結合部材と、前記圧着子の前記接合作用部から開口して前記貫通孔の上下を前記圧着子および結合部材によって密封されて形成された内部空間に連通する吸着孔と、前記ホーンに設けられ前記内部空間を真空吸引する吸引孔とを備えた。
【００１２】
請求項７記載の電子部品のボンディングツールは、請求項６記載の電子部品のボンディングツールであって、前記締結手段は前記圧着子に設けられた内ねじ部およびこの内ねじ部に螺合する外ねじ部が形成された外ねじ部材であり、前記結合部材は前記貫通孔に設けられた内テーパ部と嵌合する外テーパ部を有し前記外ねじ部材が挿通する嵌合部材を含む。
【００１３】
請求項８記載の電子部品のボンディングツールは、請求項６記載の電子部品のボンディングツールであって、前記締結手段は前記圧着子に設けられた外ねじ部およびこの外ねじ部に螺合する内ねじ部材を含む。
【００１４】
請求項９記載の電子部品のボンディングツールは、請求項６記載の電子部品のボンディングツールであって、前記締結手段は前記圧着子に設けられた外ねじ部およびこの外ねじ部に螺合する内ねじ部材であり、前記結合部材は前記貫通孔に設けられた内テーパ部と嵌合する外テーパ部を有し前記外ねじ部が挿通する嵌合部材を含む。
【００１５】
請求項１０記載の電子部品のボンディングツールは、請求項６記載の電子部品のボンディングツールであって、前記締結手段は１組の内ねじ部と外ねじ部より構成され、これらのねじ部を締め付けることにより前記圧着子と前記結合部材とで貫通孔の上部と下部を塞いで密封する。
【００１６】
本発明によれば、ホーンの定在波振動の腹に相当する位置にホーンの長さ方向に直交して設けられた貫通孔内部の上下を圧着子および結合部材によって密封して内部空間を形成し、圧着子の接合作用部に開口して設けられた吸着孔とホーンに設けられた真空吸引孔とをこの内部空間を介して連通させることにより、吸着部の着脱自在な交換性を損なうことなく簡単な構造で真空吸引系を構成することができる。
【００１７】
【発明の実施の形態】
（実施の形態１）
図１は本発明の実施の形態１の電子部品のボンディング装置の正面図、図２は本発明の実施の形態１の電子部品のボンディングツールの上下反転斜視図、図３は本発明の実施の形態１の電子部品のボンディングツールの正面図、図４、図５は本発明の実施の形態１の電子部品のボンディングツールの部分断面図である。
【００１８】
まず、図１を参照して電子部品のボンディング装置の全体構造を説明する。１は支持フレームであって、その前面には第１昇降板２と第２昇降板３が昇降自在に設けられている。第１昇降板２にはシリンダ４が装着されており、そのロッド５は第２昇降板３に結合されている。第２昇降板３にはボンディングヘッド１０が装着されている。支持フレーム１の上面にはＺ軸モータ６が設けられている。Ｚ軸モータ６は垂直な送りねじ７を回転させる。送りねじ７は第１昇降板２の背面に設けられたナット８に螺合している。したがってＺ軸モータ６が駆動して送りねじ７が回転すると、ナット８は送りねじ７に沿って上下動し、第１昇降板２や第２昇降板３も上下動する。
【００１９】
図１において、上面が電子部品の被接合面である基板４６は基板ホルダ４７上に載せられており、基板ホルダ４７はテーブル４８上に載せられている。テーブル４８は可動テーブルであって、基板４６をＸ方向やＹ方向へ水平移動させ、基板４６を所定の位置に位置決めする。テーブル４８は電子部品４０に対して基板４６を相対的に移動させる位置決め手段となっている。
【００２０】
４２はカメラであって、一軸テーブル４３に装着されている。４４はカメラ４２から前方へ延出する鏡筒である。カメラ４２を一軸テーブル４３に沿って前進させ、鎖線で示すように鏡筒４４の先端部をボンディングツール１４の下面に吸着して保持された接合物としてのバンプ付きの電子部品４０と基板４６の間に位置させ、その状態で電子部品４０と基板４６の位置をカメラ４２で観察する。
【００２１】
５３は認識部であり、カメラ４２で撮像された電子部品４０や基板４６の画像を認識してこれらの位置を検出する。５０は主制御部であり、モータ駆動部５１を介してＺ軸モータ６すなわちボンディングヘッド１０の昇降動作を制御し、テーブル制御部５２を介してテーブル４８すなわち基板４６の位置決めを行う。また主制御部５０は、認識部５３によって検出された電子部品４０と基板４６の位置より、水平面内における両者の位置ずれを演算し、この位置ずれを補正するようにテーブル４８を駆動する。さらに主制御部５０には、荷重制御部５４と吸引装置５６が接続されている。
【００２２】
押圧手段としてのシリンダ４は荷重制御部５４を介して主制御部５０に接続されており、シリンダ４のロッド５の突出力すなわちボンディングツール１４で電子部品４０のバンプを基板４６に押し付ける押圧荷重が制御される。吸引装置５６は主制御部５０からの指令によってボンディングツール１４による電子部品４０の吸引・吸引解除を行う。振動子１７は、超音波振動子駆動部５５を介して主制御部５０に接続されており、主制御部５０からの指令に従って超音波振動を行う。
【００２３】
ボンディングヘッド１０の本体１１の下端部にはホルダ１２が結合されている。ホルダ１２にはブロック１３が装着され、ブロック１３にはボンディングツール１４が固定されている。ブロック１３の側部の突部１３ａは吸引装置５６に接続されている。以下、図２、図３を参照してボンディングツール１４について説明する。
【００２４】
図２および図３に示すように、ボンディングツール１４は横長のホーン１５を主体としている。ホーン１５は細長形状の棒状体であり、平面視してその両側部からセンターへ向って次第に幅狭となるテーパ面１５ａを有している。ホーン１５のセンターには吸着部３０（圧着子）が下方へ突出して着脱自在に装着されている。図１において、ブロック１３の側面に設けられた突部１３ａには吸着パッド１９が装着されている。
【００２５】
ホーン１５には吸着部３０の吸着孔３２に連通する吸引孔１６ａ，１６ｂが形成されており、吸着パッド１９はホーン１５の上面の吸引孔１６ｂに嵌合している。したがって吸着パッド１９に接続された吸引装置５６（図１）を駆動してエアを吸引することにより、吸着部３０に開口した吸着孔３２（図３（ａ），（ｂ））から真空吸引し、この吸着部３０の下面にバンプ付きの電子部品４０を真空吸着して保持することができる。
【００２６】
吸着部３０の下部は下方に突出した接合作用部３０ａとなっており、吸着部３０の曲げ振動と押圧手段（シリンダ４）の押圧荷重を電子部品４０に作用させる。吸着部３０は電子部品４０を吸着して保持するとともに、ボンディング時には接合作用部３０ａが電子部品４０の上面に当接して電子部品４０を基板４６に対して押圧する。
【００２７】
吸着部３０から等距離隔てられた４ヶ所には、リブ１５ｃがホーン１５と一体的に設けられている。ブロック１３への取り付けバランスを良くするために、４個のリブ１５ｃはホーン１５のセンターの吸着部３０を中心として平面視して対称に突設されている。ボンディングツール１４は、リブ１５ｃに形成された貫通孔２０にボルトを螺入することにより、ブロック１３の下面に着脱自在に装着されている。
【００２８】
図２において、ホーン１５の側端部には振動付与手段である振動子１７が装着されている。振動子１７を駆動することにより、ホーン１５には縦振動（ホーン１５の長手方向の振動）が付与され、吸着部３０は水平方向ａ（ホーン１５の長手方向）に振動する。図３（ａ），（ｂ）に示すように、ホーン１５の形状は両端部から中央部に向かって側面のテーパ面１５ａおよび上下面のテーパ面１５ｂを経て順次幅および高さが絞られた形状となっている。
【００２９】
これにより、振動子１７より吸着部３０に伝達される経路において超音波振動の振幅は増幅され、吸着部３０には振動子１７が発振する振幅以上の振動が伝達され、この振動は接合作用部３０ａを介して電子部品４０に伝達される。この電子部品４０への振動伝達においては、振動子１７によってホーン１５を介して伝達される縦振動のみならず、ホーン１５の縦振動によって突出形状の吸着部３０に誘起される曲げ振動が重畳して伝達される。
【００３０】
次に図４、図５を参照して吸着部３０のホーン１５への装着について説明する。図４に示すように、ホーン１５の中心部には上下方向に貫通する貫通孔１５ｈが設けられている。この貫通孔１５ｈは、ホーン１５に振動子１７により誘起される定在波振動の腹に相当する位置にホーン１５の長さ方向に直交して設けられており、貫通孔１５ｈの上部および下部にはそれぞれ内テーパ部１５ｇ，１５ｅが設けられている。
【００３１】
吸着部３０の上面には内ねじ部３０ｂが設けられ、内ねじ部３０ｂの外周面は内テーパ部１５ｅに対応した外テーパ部３０ｃとなっている。嵌合部材３４は内テーパ部１５ｇに嵌合する外テーパ部３４ａを有しており、嵌合部材３４の内孔３４ｂには外ねじ部材３３が挿通する。外ねじ部材３３の下部には吸着部３０の内ねじ部３０ｂと螺合する外ねじ部３３ａが設けられており、外ねじ部材３３の内部には中間部の側面に開口し下端部まで連通する吸引孔３３ｂが形成されている。
【００３２】
吸着部３０の締結時には、図５に示すように吸着部３０の外テーパ部３０ｃを内テーパ部１５ｅに、嵌合部材３４の外テーパ部３４ａを内テーパ部１５ｇにそれぞれ嵌合させた状態で、外ねじ部材３３を嵌合部材３４の内孔３４ｂに挿通させ、外ねじ部３３ａを吸着部３０の内ねじ部３０ｂと螺合させて締め付ける。これにより吸着部３０の外テーパ部３０ｃは、外ねじ部材３３によってホーン１５のテーパ部１５ｅに押しつけられ固定締結される。
【００３３】
この外ねじ部材３３による締結において、嵌合部材３４の外テーパ部３４ａは内テーパ部１５ｇに押しつけられた状態で締結される。したがって、嵌合部材３４および外ねじ部材３３は、貫通孔１５ｈを介して吸着部３０と結合される結合部材となっており、外ねじ部３３ａおよび内ねじ部３０ｂは吸着部３０と嵌合部材３４とを結合する締結手段となっている。
【００３４】
吸着部３０および嵌合部材３４をホーン１５に締結した状態では、貫通孔１５ｈの下部は吸着部３０によって、また上部は嵌合部材３４および外ねじ部材３３によってそれぞれ密封され、貫通孔１５ｈの内部には上下を密封された内部空間１５ｉが形成される。内部空間１５ｉには吸引孔１６ａが開口しており、吸引孔１６ａから真空吸引することにより、内部空間１５ｉが真空吸引される。また外ねじ部材３３が吸着部３０の内ねじ部３０ｂに螺合した状態では、吸引孔３３ｂが吸着部３０の接合作用部３０ａに開口した吸着孔３２と連通し、吸着孔３２は吸引孔３３ｂを介して内部空間１５ｉと連通する。
【００３５】
すなわちこの締結状態においてホーン１５に設けられた吸引孔１６ａは、内部空間１５ｉを介して吸着孔３２と連通する。これにより、固定部品であるホーン１５とこのホーン１５に着脱自在に装着される吸着部３０との間を連通させる真空吸引系の構成において、別部品に形成される吸引孔相互の位置を精密に一致させる必要がなく、自由度の高い吸引孔配置が可能となっている。
【００３６】
上記のような締結方法を採用することにより、以下に説明するような優れた効果を得ることができる。まず、上記締結方法では、貫通孔１５ｈを挿通する外ねじ部材３３によってホーン１５の上側から吸着部３０を引き上げることにより内テーパ部１５ｇに押し当てている。このため、吸着部３０の周囲にはホーン１５への締結用の部品を配置する必要がなく、吸着部３０の形状設定や、真空吸引孔の配置などにおける自由度が確保される。
【００３７】
これにより、対象とする電子部品の形状や必要とされる振動特性に適合した吸着部３０を実現できるとともに、吸着部３０を十分な面圧でホーン１５に押し付けて安定した固着状態を実現できる。そして吸着部３０の締結部にホーン１５の長手方向の振動が作用する際にも、これらの締結用の各部材相互の水平方向の変位が拘束され、強固な締結が実現される。
【００３８】
さらには、嵌合部材３４と外ねじ部材３３のホーン１５の上側に突出する部分の形状・寸法を、吸着部３０の形状・寸法に対して適切に設定することにより、ホーン１５の上下方向の質量分布を振動伝達特性上望ましい質量分布に調整することが可能となる。すなわち、嵌合部材３４や外ねじ部材３３を質量バランス部として用いることができ、これにより良好な振動特性を得ることができる。
【００３９】
（実施の形態２）
図６、図７は、本発明の実施の形態２の電子部品のボンディングツールの部分断面図である。
【００４０】
図６において、ホーン１５には、実施の形態１と同様の貫通孔１５ｈ、吸引孔１６ａが設けられている。貫通孔１５ｈの上部および下部にはそれぞれ内テーパ部１５ｇ，１５ｅが設けられている。
【００４１】
吸着部３０’には内テーパ部１５ｅに嵌合する外テーパ部３０ｃが設けられている。外テーパ部３０ｃからは更に上方に柄部３０ｄが延出しており、柄部３０ｄの上部には外ねじ部３０ｅが設けられている。また、吸着部３０’の内部には、柄部３０ｄの側面に開口し吸着孔３２と連通する吸引孔３０ｆが形成されている。嵌合部材３４は内テーパ部１５ｇと嵌合して密着する外テーパ部３４ａを有しており、嵌合部材３４の内孔３４ｂには柄部３０ｄが挿通する。
【００４２】
吸着部３０’の締結時には、図７に示すように吸着部３０’の外テーパ部３０ｃを内テーパ部１５ｅに、嵌合部材３４の外テーパ部３４ａを内テーパ部１５ｇにそれぞれ嵌合させた状態で、柄部３０ｄを嵌合部材３４の内孔３４ｂに下方から挿通させ、外ねじ部３０ｅを内ねじ部材３５の内ねじ部３５ａに螺合させて締め付ける。これにより吸着部３０’は、外テーパ部３０ｃが外テーパ部１５ｅに嵌合して押しつけられることにより、ホーン１５に固定締結される。
【００４３】
この締結において、嵌合部材３４の外テーパ部３４ａは内テーパ部１５ｇに嵌合した状態で締結される。したがって、嵌合部材３４および内ねじ部材３５は、貫通孔１５ｈを介して吸着部３０’と結合される結合部材となっており、外ねじ部３０ｅおよび内ねじ部３５ａは吸着部３０’と嵌合部材３４とを結合する締結手段となっている。
【００４４】
吸着部３０’および嵌合部材３４の締結状態では、貫通孔１５ｈの下部は接合作用部３０ａによって、また上部は嵌合部材３４によってそれぞれ密封される。そしてこの状態では、貫通孔１５ｈの内部には実施の形態１と同様に上下をそれぞれ密封された内部空間１５ｉが形成される。そして吸着部３０’を締結した状態では、柄部３０ｄの吸引孔３０ｆが接合作用部３０ａに開口した吸着孔３２と連通し、したがって吸着孔３２は、本実施の形態２においても内部空間１５ｉと連通する。すなわちこの締結状態においてホーン１５に設けられた吸引孔１６ａは、実施の形態１と同様に内部空間１５ｉを介して吸着孔３２と連通する。
【００４５】
（実施の形態３）
図８、図９は、本発明の実施の形態３の電子部品のボンディングツールの部分断面図である。
【００４６】
図８において、ホーン１５には、貫通孔１５ｈ、吸引孔１６ａが設けられている。貫通孔１５ｈの下部には内テーパ部１５ｅが設けられている。内テーパ部１５ｅには、吸着部３０（実施の形態１に示す吸着部３０と同様）の外テーパ部３０ｃが嵌合する。貫通孔１５ｈには、下部に吸着部３０の内ねじ部３０ｂと螺合する外ねじ部３３ａが設けられた外ねじ部材３３’が挿通する。外ねじ部材３３’の内部には、中間部の側面に開口し下端部まで連通する吸引孔３３ｂが形成されている。
【００４７】
吸着部３０の締結時には、図９に示すように吸着部３０の外テーパ部３０ｃを内テーパ部１５ｅに嵌合させた状態で、外ねじ部材３３’をホーン１５の上方からシール部材３６を介して貫通孔１５ｈに挿通させ、外ねじ部３３ａを吸着部３０の内ねじ部３０ｂと螺合させて締め付ける。これにより吸着部３０のテーパ部３０ｃは、外ねじ部材３３’によってテーパ部１５ｅに嵌合して押しつけられ固定締結される。
【００４８】
したがって、この実施の形態３においては、外ねじ部材３３’の外ねじ部３３ａおよび吸着部３０の内ねじ部３０ｂが締結手段となっており、シール部材３６およびシール部材３６を介して貫通孔１５ｈの上部に装着された外ねじ部材３３’が、吸着部３０と結合される結合部材となっている。
【００４９】
吸着部３０の締結状態では、貫通孔１５ｈの下部は吸着部３０によって、また上部はシール部材３６によってそれぞれ密封される。この状態では、貫通孔１５ｈの内部には上下を密封された内部空間１５ｉが形成される。そして内部空間１５ｉは、吸引孔１６ａによって真空吸引される。すなわちこの締結状態においても、実施の形態１と同様にホーン１５に設けられた吸引孔１６ａは、内部空間１５ｉを介して吸着孔３２と連通する。なおシール部材３６を省略し、外ねじ部材３３’の頭部で直接貫通孔１５ｈの上部を密封するようにしてもよい。
【００５０】
（実施の形態４）
図１０、図１１は、本発明の実施の形態４の電子部品のボンディングツールの部分断面図である。
【００５１】
図１０において、ホーン１５には、実施の形態１と同様の貫通孔１５ｈ、吸引孔１６ａが設けられている。貫通孔１５ｈの下部には内テーパ部１５ｅが設けられている。吸着部３０’は実施の形態２に示すものと同様であり、吸着部３０’の締結時には、図９に示すように吸着部３０’の柄部３０ｄを貫通孔１５ｈに下方から挿通させて外テーパ部３０ｃを内テーパ部１５ｅに嵌合させる。
【００５２】
そして外ねじ部３０ｅをホーン１５の上方に突出させ、シール部材３６を介して内ねじ部材３５の内ねじ部３５ａを外ねじ部３０ｅに螺合させて締め付ける。これにより吸着部３０’は、外テーパ部３０ｃが外テーパ部１５ｅに嵌合して押しつけられ、ホーン１５に固定締結される。したがって、外ねじ部３０ｅおよび内ねじ部３５ａが締結手段となっており、シール部材３６と内ねじ部材３５は接合作用部３０ａと結合される結合部材となっている。
【００５３】
吸着部３０’の締結状態では、実施の形態３と同様に貫通孔１５ｈの内部には上下を密封された内部空間１５ｉが形成され、ホーン１５に設けられた吸引孔１６ａは同様に内部空間１５ｉを介して吸着孔３２と連通する。なお、シール部材３６を省略して内ねじ部材３５で貫通孔１５ｈの上部を密封する構成でもよい。
【００５４】
上記説明したように、上記各実施の形態のボンディングツールは、電子部品４０に嵌合して振動と荷重を伝達する圧着子としての吸着部３０，３０’をホーン１５本体に対して着脱自在とし、しかも吸着部３０，３０’の吸着孔３２をホーン１５内部に形成された内部空間１５ｉを介して吸引孔１６ａと連通させるようにしたものである。これにより、吸着部３０，３０’の接合作用部３０ａが損耗した場合の交換性を損なうことなく、吸着孔３２を真空吸引源に連通させることができる。
【００５５】
なお、本実施の形態では、ホーン１５の形状として高さ・幅寸法をテーパ状に中心に向かって漸減させる中細形状のものを用いているが、これ以外の平行形状のホーンに対しても本発明を適用することができる。
【００５６】
また本実施の形態のような２点支持（両端支持）構造のボンディングツールに限らず、片持ち支持構造のボンディングツールにも適用することができる。
【００５７】
【発明の効果】
本発明によれば、ホーンの定在波振動の腹に相当する位置にホーンの長さ方向に直交して設けられた貫通孔内部の上下を圧着子および結合部材によって密封して内部空間を形成し、圧着子の接合作用部に開口して設けられた吸着孔とホーンに設けられた真空吸引孔とをこの内部空間を介して連通させるようにしたので、吸着部の着脱自在な交換性を損なうことなく簡単な構造で真空吸引系を構成することができる。
【図面の簡単な説明】
【図１】本発明の実施の形態１の電子部品のボンディング装置の正面図
【図２】本発明の実施の形態１の電子部品のボンディングツールの上下反転斜視図
【図３】本発明の実施の形態１の電子部品のボンディングツールの正面図
【図４】本発明の実施の形態１の電子部品のボンディングツールの部分断面図
【図５】本発明の実施の形態１の電子部品のボンディングツールの部分断面図
【図６】本発明の実施の形態２の電子部品のボンディングツールの部分断面図
【図７】本発明の実施の形態２の電子部品のボンディングツールの部分断面図
【図８】本発明の実施の形態３の電子部品のボンディングツールの部分断面図
【図９】本発明の実施の形態３の電子部品のボンディングツールの部分断面図
【図１０】本発明の実施の形態４の電子部品のボンディングツールの部分断面図
【図１１】本発明の実施の形態４の電子部品のボンディングツールの部分断面図
【符号の説明】
１４ボンディングツール
１５ホーン
１５ｈ貫通孔
１５ｉ内部空間
１６ａ、１６ｂ吸引孔
１７振動子
３０、３０’ 吸着部
３２吸着孔
３３外ねじ部材
３４嵌合部材
３５内ねじ部材
３６シール部材
４０電子部品
４６基板[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component bonding apparatus and bonding tool for bonding an electronic component such as a bumped electronic component such as a flip chip to a surface to be bonded such as an electrode of a substrate.
[0002]
[Prior art]
As a method for bonding an electronic component to a surface to be bonded such as an electrode of a substrate, a method using ultrasonic pressure welding is known. In this method, ultrasonic vibration is applied to the electronic component while pressing the electronic component against the surface to be joined, and the joining surface is brought into close contact by causing the joining surface to vibrate minutely to generate friction. The bonding tool used in this method has a horn that is an elongated rod body that transmits the vibration of an ultrasonic vibrator, which is a vibration generation source, to an electronic component. While applying a load and vibration to the component, the electronic component is bonded to the surface to be bonded by bonding. Because the load (load and vibration) during bonding acts on the crimper, its lower surface (the suction surface of the electronic component) is likely to wear due to repeated use. If this wear becomes excessive, normal bonding cannot be performed, and the crimper must be periodically replaced. For this reason, in a bonding tool for ultrasonic bonding, a method of replacing only this separate part as a separate part that can be attached to and detached from the horn body is generally used, avoiding the waste of replacing the entire horn. Yes.
[0003]
[Problems to be solved by the invention]
Incidentally, an electronic component bonding tool is often used as a transfer tool for transferring an electronic component and mounting it on a substrate. In a bonding tool having such a transfer function, a suction hole for vacuum suction is provided in a bonding portion that comes into contact with an electronic component, and a vacuum is sucked from this suction hole through a vacuum suction hole provided inside the horn. The electronic component is held by sucking.
[0004]
However, it is difficult to connect the suction hole provided in the crimping part with the vacuum suction hole inside the horn in the bonding tool configured as a separate part with the crimper as described above. A method for constructing the system has been desired.
[0005]
SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic component bonding apparatus and a bonding tool in which a crimper can be replaced as a separate part and a vacuum suction system can be configured with a simple structure.
[0006]
[Means for Solving the Problems]
An electronic component bonding apparatus according to claim 1 is an electronic component bonding apparatus that crimps the electronic component to a surface to be bonded while applying a load and vibration to the electronic component, and a bonding tool for bonding the electronic component; A pressing means for pressing the bonding tool against the electronic component, the bonding tool including a horizontally long horn, a vibrator for applying vibration to the horn, and a position corresponding to an antinode of standing wave vibration of the horn. A through-hole provided in the sealing member, and a lower part of the through-hole sealed and attached, and a crimping member provided with a joining action part that contacts the electronic component at the tip, and the upper part of the through-hole is sealed and attached. A coupling member coupled to the crimper by a fastening means through a through hole; and the crimper and the coupling member that are opened from the joining operation portion of the crimper and above and below the through hole. Thus with a suction hole communicating with the sealed interior space formed by, and a suction hole for vacuum suction of the inner space provided on the horn.
[0007]
The electronic component bonding apparatus according to claim 2 is the electronic component bonding apparatus according to claim 1, wherein the fastening means is an internal thread portion provided in the crimper and an external threading engagement with the internal thread portion. An external thread member having a threaded portion, wherein the coupling member includes an external taper part that fits into an internal taper part provided in an upper part of the through hole, and includes a fitting member through which the external thread member is inserted. .
[0008]
The electronic component bonding apparatus according to claim 3 is the electronic component bonding apparatus according to claim 1, wherein the fastening means is an external thread portion provided in the crimper and an internal threadedly engaged with the external thread portion. An internal thread member having a threaded portion is included.
[0009]
The electronic component bonding apparatus according to claim 4 is the electronic component bonding apparatus according to claim 1, wherein the fastening means is an external thread portion provided in the crimper and an internal threadedly engaged with the external thread portion. An internal thread member in which a threaded portion is formed, and the coupling member includes an external taper portion that fits into an internal taper portion provided in an upper portion of the through hole, and includes a fitting member through which the external thread portion is inserted. .
[0010]
The electronic component bonding apparatus according to claim 5 is the electronic component bonding apparatus according to claim 1, wherein the fastening means is composed of a set of inner screw portions and outer screw portions, and tightens these screw portions. Thereby, the upper part and the lower part of the through hole are closed and sealed with the crimper and the coupling member.
[0011]
A bonding tool for an electronic component according to claim 6 is a bonding tool for crimping the electronic component to a surface to be bonded while applying a load and vibration to the electronic component, and applies a vibration to the horn and the horn. A vibrator, a through hole provided at a position corresponding to the antinode of the standing wave vibration of the horn , and a joining action portion that seals and attaches a lower portion of the through hole to contact the electronic component at a tip portion A crimping member, a coupling member which is attached by sealing the upper part of the through hole and is coupled to the crimper by a fastening means through the through hole, and is opened from the joining action portion of the crimping member to pass through the through hole. A suction hole communicating with an internal space formed by sealing the upper and lower sides of the hole with the crimper and the coupling member, and a suction hole provided in the horn for vacuum suction of the internal space.
[0012]
The electronic component bonding tool according to claim 7 is the electronic component bonding tool according to claim 6, wherein the fastening means is an internal thread portion provided in the crimper and an external threading engagement with the internal thread portion. It is an external thread member in which a thread part is formed, and the coupling member includes an external taper part that fits an internal taper part provided in the through hole, and includes a fitting member through which the external thread member is inserted.
[0013]
The electronic component bonding tool according to claim 8 is the electronic component bonding tool according to claim 6, wherein the fastening means is an external thread portion provided in the crimper and an internal threadedly engaged with the external thread portion. Includes a screw member.
[0014]
The electronic component bonding tool according to claim 9 is the electronic component bonding tool according to claim 6, wherein the fastening means is an external thread portion provided in the crimper and an internal threadedly engaged with the external thread portion. It is a screw member, and the coupling member includes a fitting member that has an outer taper portion that fits with an inner taper portion provided in the through hole and through which the outer screw portion is inserted.
[0015]
The electronic component bonding tool according to claim 10 is the electronic component bonding tool according to claim 6, wherein the fastening means is composed of a set of an inner screw portion and an outer screw portion, and tightens these screw portions. Thereby, the upper part and the lower part of the through hole are closed and sealed with the crimper and the coupling member.
[0016]
According to the present invention, the inner space is formed by sealing the upper and lower portions inside the through hole provided perpendicular to the length direction of the horn at a position corresponding to the antinode of the standing wave vibration of the horn by the crimper and the coupling member. In addition, the detachable exchangeability of the suction portion is impaired by connecting the suction hole provided in the bonding operation portion of the crimper and the vacuum suction hole provided in the horn through this internal space. The vacuum suction system can be configured with a simple structure.
[0017]
DETAILED DESCRIPTION OF THE INVENTION
(Embodiment 1)
FIG. 1 is a front view of an electronic component bonding apparatus according to Embodiment 1 of the present invention, FIG. 2 is a vertically inverted perspective view of an electronic component bonding tool according to Embodiment 1 of the present invention, and FIG. 3 is an embodiment of the present invention. FIG. 4 and FIG. 5 are partial cross-sectional views of the electronic component bonding tool according to the first embodiment of the present invention.
[0018]
First, the overall structure of an electronic component bonding apparatus will be described with reference to FIG. Reference numeral 1 denotes a support frame, and a first elevating plate 2 and a second elevating plate 3 are provided on the front surface thereof so as to be movable up and down. A cylinder 4 is mounted on the first lifting plate 2, and its rod 5 is coupled to the second lifting plate 3. A bonding head 10 is attached to the second lifting plate 3. A Z-axis motor 6 is provided on the upper surface of the support frame 1. The Z-axis motor 6 rotates a vertical feed screw 7. The feed screw 7 is screwed into a nut 8 provided on the back surface of the first lifting plate 2. Therefore, when the Z-axis motor 6 is driven and the feed screw 7 rotates, the nut 8 moves up and down along the feed screw 7, and the first lifting plate 2 and the second lifting plate 3 also move up and down.
[0019]
In FIG. 1, a substrate 46 whose upper surface is a surface to be joined of an electronic component is placed on a substrate holder 47, and the substrate holder 47 is placed on a table 48. The table 48 is a movable table, and horizontally moves the substrate 46 in the X direction or the Y direction to position the substrate 46 at a predetermined position. The table 48 serves as positioning means for moving the substrate 46 relative to the electronic component 40.
[0020]
Reference numeral 42 denotes a camera, which is mounted on the uniaxial table 43. Reference numeral 44 denotes a lens barrel extending forward from the camera 42. The camera 42 is moved forward along the uniaxial table 43, and as shown by a chain line, the tip of the lens barrel 44 is adsorbed to the lower surface of the bonding tool 14 and held between the bumped electronic component 40 and the substrate 46. The position of the electronic component 40 and the board | substrate 46 is observed with the camera 42 in that state.
[0021]
A recognition unit 53 recognizes images of the electronic component 40 and the board 46 captured by the camera 42 and detects their positions. Reference numeral 50 denotes a main control unit which controls the raising / lowering operation of the Z-axis motor 6, that is, the bonding head 10 through the motor driving unit 51, and positions the table 48, that is, the substrate 46 through the table control unit 52. Further, the main control unit 50 calculates a positional shift between the electronic component 40 and the substrate 46 detected by the recognition unit 53 in the horizontal plane, and drives the table 48 so as to correct the positional shift. Further, a load control unit 54 and a suction device 56 are connected to the main control unit 50.
[0022]
The cylinder 4 as the pressing means is connected to the main control unit 50 via the load control unit 54, and a pressing load that presses the bump of the electronic component 40 against the substrate 46 by the projecting output of the rod 5 of the cylinder 4, that is, the bonding tool 14. Be controlled. The suction device 56 performs suction / release of suction of the electronic component 40 by the bonding tool 14 according to a command from the main control unit 50. The transducer 17 is connected to the main control unit 50 via the ultrasonic transducer driving unit 55, and performs ultrasonic vibration according to a command from the main control unit 50.
[0023]
A holder 12 is coupled to the lower end of the main body 11 of the bonding head 10. A block 13 is attached to the holder 12, and a bonding tool 14 is fixed to the block 13. The protrusion 13 a on the side of the block 13 is connected to the suction device 56. Hereinafter, the bonding tool 14 will be described with reference to FIGS. 2 and 3.
[0024]
As shown in FIGS. 2 and 3, the bonding tool 14 mainly includes a horizontally long horn 15. The horn 15 is an elongated rod-like body, and has a tapered surface 15a that becomes gradually narrower from both side portions toward the center in a plan view. At the center of the horn 15, an adsorbing portion 30 (crimper) protrudes downward and is detachably mounted. In FIG. 1, a suction pad 19 is attached to a protrusion 13 a provided on the side surface of the block 13.
[0025]
The horn 15 is formed with suction holes 16 a and 16 b communicating with the suction hole 32 of the suction portion 30, and the suction pad 19 is fitted in the suction hole 16 b on the upper surface of the horn 15. Therefore, by sucking air by driving the suction device 56 (FIG. 1) connected to the suction pad 19, vacuum suction is performed from the suction holes 32 (FIGS. 3A and 3B) opened in the suction portion 30. The electronic component 40 with bumps can be vacuum-sucked and held on the lower surface of the suction portion 30.
[0026]
The lower part of the suction part 30 is a joining action part 30a protruding downward, and the bending vibration of the suction part 30 and the pressing load of the pressing means (cylinder 4) are applied to the electronic component 40. The adsorbing unit 30 adsorbs and holds the electronic component 40, and the bonding operation unit 30 a abuts against the upper surface of the electronic component 40 and presses the electronic component 40 against the substrate 46 during bonding.
[0027]
Ribs 15 c are provided integrally with the horn 15 at four locations that are equidistant from the suction portion 30. In order to improve the mounting balance to the block 13, the four ribs 15 c are projected symmetrically in plan view with the suction portion 30 at the center of the horn 15 as the center. The bonding tool 14 is detachably mounted on the lower surface of the block 13 by screwing a bolt into the through hole 20 formed in the rib 15c.
[0028]
In FIG. 2, a vibrator 17 that is a vibration applying unit is attached to a side end of the horn 15. By driving the vibrator 17, longitudinal vibration (vibration in the longitudinal direction of the horn 15) is applied to the horn 15, and the suction unit 30 vibrates in the horizontal direction a (longitudinal direction of the horn 15). As shown in FIGS. 3 (a) and 3 (b), the width and height of the horn 15 are successively reduced from both end portions toward the central portion through the side tapered surface 15a and the top and bottom tapered surfaces 15b. It has a shape.
[0029]
As a result, the amplitude of the ultrasonic vibration is amplified in the path transmitted from the vibrator 17 to the adsorption unit 30, and vibration larger than the amplitude oscillated by the vibrator 17 is transmitted to the adsorption unit 30. It is transmitted to the electronic component 40 via 30a. In the vibration transmission to the electronic component 40, not only the longitudinal vibration transmitted through the horn 15 by the vibrator 17 but also the bending vibration induced in the protruding adsorbing portion 30 by the longitudinal vibration of the horn 15 is superimposed. Is transmitted.
[0030]
Next, with reference to FIGS. 4 and 5, attachment of the suction portion 30 to the horn 15 will be described. As shown in FIG. 4, a through hole 15 h penetrating in the vertical direction is provided at the center of the horn 15. The through-hole 15h is provided at a position corresponding to the antinode of standing wave vibration induced in the horn 15 by the vibrator 17, perpendicular to the length direction of the horn 15, and is formed above and below the through-hole 15h. Are respectively provided with inner tapered portions 15g and 15e.
[0031]
An inner screw portion 30b is provided on the upper surface of the suction portion 30, and an outer peripheral surface of the inner screw portion 30b is an outer tapered portion 30c corresponding to the inner tapered portion 15e. The fitting member 34 has an outer taper portion 34 a that fits into the inner taper portion 15 g, and the outer screw member 33 is inserted into the inner hole 34 b of the fitting member 34. An external thread portion 33a that engages with the internal thread portion 30b of the suction portion 30 is provided at the lower portion of the external thread member 33. The external thread member 33 is open to the side surface of the intermediate portion and communicates to the lower end portion. A suction hole 33b is formed.
[0032]
As shown in FIG. 5, when the suction portion 30 is fastened, the outer tapered portion 30c of the suction portion 30 is fitted to the inner tapered portion 15e, and the outer tapered portion 34a of the fitting member 34 is fitted to the inner tapered portion 15g. The outer screw member 33 is inserted into the inner hole 34b of the fitting member 34, and the outer screw portion 33a is screwed into the inner screw portion 30b of the suction portion 30 and tightened. As a result, the outer taper portion 30c of the suction portion 30 is pressed against the taper portion 15e of the horn 15 by the external screw member 33 and fixedly fastened.
[0033]
In the fastening by the outer screw member 33, the outer tapered portion 34a of the fitting member 34 is fastened while being pressed against the inner tapered portion 15g. Therefore, the fitting member 34 and the outer screw member 33 are coupling members that are coupled to the suction portion 30 through the through-hole 15h, and the outer screw portion 33a and the inner screw portion 30b are formed of the suction portion 30 and the fitting member. 34 is a fastening means for coupling with 34.
[0034]
In a state where the suction part 30 and the fitting member 34 are fastened to the horn 15, the lower part of the through hole 15h is sealed by the suction part 30, and the upper part is sealed by the fitting member 34 and the external screw member 33, respectively. Is formed with an internal space 15i sealed in the upper and lower sides. A suction hole 16a is opened in the internal space 15i, and the internal space 15i is vacuum-sucked by vacuum suction from the suction hole 16a. Further, in a state where the outer screw member 33 is screwed into the inner screw portion 30b of the suction portion 30, the suction hole 33b communicates with the suction hole 32 opened in the joining operation portion 30a of the suction portion 30, and the suction hole 32 is in the suction hole 33b. It communicates with the internal space 15i via.
[0035]
That is, in this fastened state, the suction hole 16a provided in the horn 15 communicates with the suction hole 32 through the internal space 15i. Thereby, in the structure of the vacuum suction system which connects between the horn 15 which is a fixed part and the suction part 30 which is detachably attached to the horn 15, the positions of the suction holes formed in the separate parts are precisely positioned. It is not necessary to match, and suction hole arrangement with a high degree of freedom is possible.
[0036]
By adopting the fastening method as described above, excellent effects as described below can be obtained. First, in the above fastening method, the suction portion 30 is pulled up from the upper side of the horn 15 by the external screw member 33 inserted through the through-hole 15h and pressed against the inner tapered portion 15g. For this reason, it is not necessary to arrange components for fastening to the horn 15 around the suction portion 30, and a degree of freedom in setting the shape of the suction portion 30 and arranging the vacuum suction holes is secured.
[0037]
As a result, it is possible to realize the suction part 30 that is suitable for the shape of the target electronic component and the required vibration characteristics, and it is possible to realize a stable fixed state by pressing the suction part 30 against the horn 15 with sufficient surface pressure. Even when the longitudinal vibration of the horn 15 acts on the fastening portion of the suction portion 30, the horizontal displacement between the fastening members is restricted, and a firm fastening is realized.
[0038]
Furthermore, by appropriately setting the shape / dimension of the fitting member 34 and the external screw member 33 protruding above the horn 15 with respect to the shape / dimension of the suction portion 30, It is possible to adjust the mass distribution to a mass distribution desirable for vibration transmission characteristics. That is, the fitting member 34 and the external screw member 33 can be used as a mass balance part, and thereby good vibration characteristics can be obtained.
[0039]
(Embodiment 2)
6 and 7 are partial cross-sectional views of a bonding tool for electronic components according to Embodiment 2 of the present invention.
[0040]
In FIG. 6, the horn 15 is provided with the same through-hole 15h and suction hole 16a as in the first embodiment. Inner taper portions 15g and 15e are provided at the upper and lower portions of the through hole 15h, respectively.
[0041]
The adsorption portion 30 ′ is provided with an outer tapered portion 30c that fits into the inner tapered portion 15e. A handle portion 30d extends further upward from the outer tapered portion 30c, and an outer screw portion 30e is provided on the upper portion of the handle portion 30d. In addition, a suction hole 30f that opens on the side surface of the handle 30d and communicates with the suction hole 32 is formed inside the suction part 30 ′. The fitting member 34 has an outer tapered portion 34 a that fits and closely contacts the inner tapered portion 15 g, and the handle portion 30 d is inserted into the inner hole 34 b of the fitting member 34.
[0042]
When fastening the suction portion 30 ', as shown in FIG. 7, the outer taper portion 30c of the suction portion 30' is fitted to the inner taper portion 15e, and the outer taper portion 34a of the fitting member 34 is fitted to the inner taper portion 15g. In this state, the handle portion 30d is inserted into the inner hole 34b of the fitting member 34 from below, and the outer screw portion 30e is screwed into the inner screw portion 35a of the inner screw member 35 and tightened. As a result, the suction portion 30 ′ is fixedly fastened to the horn 15 by the outer taper portion 30 c being fitted and pressed against the outer taper portion 15 e.
[0043]
In this fastening, the outer tapered portion 34a of the fitting member 34 is fastened in a state of being fitted to the inner tapered portion 15g. Therefore, the fitting member 34 and the inner screw member 35 are coupling members that are coupled to the suction portion 30 ′ via the through hole 15h, and the outer screw portion 30e and the inner screw portion 35a are fitted to the suction portion 30 ′. It is a fastening means for joining the joint member 34.
[0044]
In the fastened state of the adsorbing part 30 ′ and the fitting member 34, the lower part of the through hole 15 h is sealed by the joining action part 30 a and the upper part is sealed by the fitting member 34. In this state, an internal space 15i is formed in the through-hole 15h in the same manner as in the first embodiment, with the top and bottom sealed. In the state where the suction part 30 ′ is fastened, the suction hole 30f of the handle part 30d communicates with the suction hole 32 opened in the joining action part 30a. Therefore, the suction hole 32 is also connected to the internal space 15i in the second embodiment. Communicate. That is, in this fastened state, the suction hole 16a provided in the horn 15 communicates with the suction hole 32 through the internal space 15i as in the first embodiment.
[0045]
(Embodiment 3)
8 and 9 are partial cross-sectional views of a bonding tool for electronic components according to Embodiment 3 of the present invention.
[0046]
In FIG. 8, the horn 15 is provided with a through hole 15h and a suction hole 16a. An inner tapered portion 15e is provided below the through hole 15h. The outer tapered portion 30c of the suction portion 30 (similar to the suction portion 30 shown in the first embodiment) is fitted to the inner tapered portion 15e. An outer screw member 33 ′ having an outer screw portion 33a screwed to the inner screw portion 30b of the suction portion 30 is inserted through the through hole 15h. Inside the external screw member 33 ′, a suction hole 33b that opens to the side surface of the intermediate portion and communicates to the lower end portion is formed.
[0047]
When fastening the suction portion 30, the outer screw member 33 ′ is inserted from above the horn 15 through the seal member 36 with the outer taper portion 30c of the suction portion 30 fitted to the inner taper portion 15e as shown in FIG. Then, the outer screw portion 33a is screwed into the inner screw portion 30b of the suction portion 30 and tightened. Thereby, the taper part 30c of the adsorption | suction part 30 is fitted and pressed on the taper part 15e by external screw member 33 ', and is fixedly fastened.
[0048]
Therefore, in the third embodiment, the outer screw portion 33a of the outer screw member 33 ′ and the inner screw portion 30b of the suction portion 30 serve as fastening means, and the through hole 15h is interposed via the seal member 36 and the seal member 36. An outer screw member 33 ′ mounted on the upper part of the upper part of the member is a connecting member that is connected to the adsorbing part 30.
[0049]
In the fastened state of the suction part 30, the lower part of the through hole 15 h is sealed by the suction part 30 and the upper part is sealed by the seal member 36. In this state, an internal space 15i whose top and bottom are sealed is formed inside the through hole 15h. The internal space 15i is vacuumed by the suction hole 16a. That is, even in this fastened state, the suction hole 16a provided in the horn 15 communicates with the suction hole 32 through the internal space 15i as in the first embodiment. Note that the seal member 36 may be omitted, and the upper portion of the through hole 15h may be sealed directly with the head of the external screw member 33 ′.
[0050]
(Embodiment 4)
10 and 11 are partial cross-sectional views of a bonding tool for electronic components according to Embodiment 4 of the present invention.
[0051]
In FIG. 10, the horn 15 is provided with the same through-hole 15h and suction hole 16a as in the first embodiment. An inner tapered portion 15e is provided below the through hole 15h. The suction portion 30 ′ is the same as that shown in the second embodiment. When the suction portion 30 ′ is fastened, the handle 30d of the suction portion 30 ′ is inserted into the through-hole 15h from below as shown in FIG. The tapered portion 30c is fitted to the inner tapered portion 15e.
[0052]
Then, the outer screw portion 30e is protruded above the horn 15, and the inner screw portion 35a of the inner screw member 35 is screwed into the outer screw portion 30e via the seal member 36 and tightened. As a result, the adsorbing portion 30 ′ is fixedly fastened to the horn 15 by the outer tapered portion 30 c being fitted and pressed against the outer tapered portion 15 e. Accordingly, the outer screw portion 30e and the inner screw portion 35a are fastening means, and the seal member 36 and the inner screw member 35 are coupling members that are coupled to the joining operation portion 30a.
[0053]
In the fastened state of the adsorbing portion 30 ′, an internal space 15i whose top and bottom are sealed is formed inside the through hole 15h as in the third embodiment, and the suction hole 16a provided in the horn 15 is similarly formed in the internal space 15i. And communicates with the suction hole 32. In addition, the structure which abbreviate | omits the sealing member 36 and seals the upper part of the through-hole 15h with the internal screw member 35 may be sufficient.
[0054]
As described above, in the bonding tool of each of the above embodiments, the adsorbing portions 30 and 30 ′ serving as crimpers that are fitted to the electronic component 40 and transmit vibration and load are detachable from the horn 15 body. In addition, the suction holes 32 of the suction portions 30 and 30 ′ are communicated with the suction holes 16 a through an internal space 15 i formed inside the horn 15. Thereby, the suction hole 32 can be communicated with the vacuum suction source without impairing the exchangeability when the joining action portion 30a of the suction portions 30, 30 ′ is worn.
[0055]
In the present embodiment, the horn 15 has a medium-thin shape that gradually decreases in height and width toward the center in a tapered shape, but other parallel-shaped horns are also used. The present invention can be applied.
[0056]
Further, the present invention can be applied not only to a bonding tool having a two-point support (both end support) structure as in the present embodiment but also to a bonding tool having a cantilever support structure.
[0057]
【The invention's effect】
According to the present invention, the inner space is formed by sealing the upper and lower portions inside the through hole provided perpendicular to the length direction of the horn at a position corresponding to the antinode of the standing wave vibration of the horn by the crimper and the coupling member. In addition, since the suction hole provided in the bonding operation portion of the crimper and the vacuum suction hole provided in the horn are communicated with each other through this internal space, detachable exchangeability of the suction portion is achieved. A vacuum suction system can be configured with a simple structure without loss.
[Brief description of the drawings]
FIG. 1 is a front view of an electronic component bonding apparatus according to a first embodiment of the present invention. FIG. 2 is a vertically inverted perspective view of an electronic component bonding tool according to a first embodiment of the present invention. FIG. 4 is a partial cross-sectional view of the electronic component bonding tool according to the first embodiment of the present invention. FIG. 5 is an electronic component bonding tool according to the first embodiment of the present invention. FIG. 6 is a partial sectional view of an electronic component bonding tool according to a second embodiment of the present invention. FIG. 7 is a partial sectional view of an electronic component bonding tool according to a second embodiment of the present invention. FIG. 9 is a partial cross-sectional view of an electronic component bonding tool according to a third embodiment of the present invention. FIG. 9 is a partial cross-sectional view of an electronic component bonding tool according to a third embodiment of the present invention. Electronic components Partial cross-sectional view of the down loading tool 11 is a partial cross-sectional view of a bonding tool of electronic parts according to a fourth embodiment of the present invention Description of Reference Numerals]
14 Bonding tool 15 Horn 15h Through hole 15i Internal space 16a, 16b Suction hole 17 Vibrator 30, 30 'Suction part 32 Suction hole 33 Outer screw member 34 Fitting member 35 Inner screw member 36 Seal member 40 Electronic component 46 Substrate

Claims

An electronic component bonding apparatus for pressing an electronic component against a surface to be bonded while applying a load and vibration to the electronic component, a bonding tool for bonding the electronic component, and a pressing means for pressing the bonding tool against the electronic component The bonding tool includes a horizontally long horn, a vibrator that applies vibration to the horn, a through-hole provided at a position corresponding to an antinode of standing wave vibration of the horn , and a through-hole of the through-hole. A crimper having a lower portion sealed and mounted with a bonding action portion that contacts the electronic component at the tip, and an upper portion of the through-hole sealed and mounted, and the crimper and the fastening means through the through-hole. The combined coupling member is opened from the bonding operation portion of the crimper and communicates with the inner space formed by sealing the upper and lower sides of the through hole with the crimper and the coupling member. Suction holes and bonding apparatus for electronic components, characterized in that a suction hole for vacuum suction of the inner space provided on the horn.

The fastening means is an external thread member in which an internal thread part provided in the crimper and an external thread part screwed into the internal thread part are formed, and the coupling member is an internal thread provided in the upper part of the through hole. 2. The electronic component bonding apparatus according to claim 1, further comprising a fitting member having an outer taper portion that fits into the taper portion and through which the outer screw member is inserted.

2. The electronic component bonding apparatus according to claim 1, wherein the fastening means includes an internal thread member provided with an external thread portion provided in the crimper and an internal thread portion that is screwed into the external thread portion. .

The fastening means is an internal thread member in which an external thread portion provided in the crimper and an internal thread portion that is screwed to the external thread portion are formed, and the coupling member is an internal thread member provided in an upper portion of the through hole. 2. The electronic component bonding apparatus according to claim 1, further comprising a fitting member having an outer taper portion fitted to the taper portion and through which the outer screw portion is inserted.

The fastening means is composed of a pair of internal thread portions and external thread portions, and by tightening these thread portions, the upper and lower portions of the through hole are closed and sealed by the crimper and the coupling member. The electronic component bonding apparatus according to claim 1.

A bonding tool for pressing an electronic component against a surface to be bonded while applying a load and vibration to the electronic component, a horizontally long horn, a vibrator for applying vibration to the horn, and a standing wave vibration of the horn . A through-hole provided at a position corresponding to the stomach, a crimping member having a lower end of the through-hole sealed and mounted with a bonding action portion that contacts the electronic component at the tip, and an upper portion of the through-hole A coupling member that is hermetically mounted and is coupled to the crimper by a fastening means through a through hole, and an opening from the joining operation portion of the crimper, and the upper and lower sides of the through hole are sealed by the crimper and the coupling member. A bonding tool for electronic parts, comprising: a suction hole communicating with the formed internal space, and a suction hole provided in the horn for vacuum suction of the internal space.

The fastening means is an external thread member formed with an internal thread portion provided in the crimper and an external thread portion screwed into the internal thread portion, and the coupling member is an internal taper portion provided in the through hole. The electronic component bonding tool according to claim 6, further comprising a fitting member having an outer taper portion to be fitted with the outer screw member.

7. The electronic component bonding tool according to claim 6, wherein the fastening means includes an external thread portion provided on the crimper and an internal thread member screwed into the external thread portion.

The fastening means is an outer screw portion provided in the crimper and an inner screw member that is screwed to the outer screw portion, and the coupling member is an outer taper portion that is fitted to the inner taper portion provided in the through hole. The electronic component bonding tool according to claim 6, further comprising a fitting member through which the outer screw portion is inserted.

The fastening means is composed of a pair of internal thread portions and external thread portions, and by tightening these thread portions, the upper and lower portions of the through hole are closed and sealed by the crimper and the coupling member. The electronic component bonding tool according to claim 6.