JP3567805B2 - Bonding device and bonding tool for electronic components - Google Patents

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an electronic component bonding apparatus and a bonding tool for bonding an electronic component such as an electronic component with a bump such as a flip chip to a surface to be bonded such as an electrode of a substrate.
[0002]
[Prior art]
As a method for bonding an electronic component to a surface to be bonded such as an electrode of a substrate, a method using ultrasonic pressure welding is known. According to this method, ultrasonic vibration is applied to the electronic component while pressing the electronic component against the surface to be bonded, and the bonding surface is minutely vibrated to cause friction to bring the bonding surface into close contact. The bonding tool used in this method has a horn, which is an elongated rod that transmits the vibration of the ultrasonic vibrator, which is a vibration source, to an electronic component. While applying a load and vibration to the component, the electronic component is bonded to the surface to be joined by pressing. Since the load (load and vibration) at the time of bonding acts on the crimping element, the lower surface (the suction surface of the electronic component) is easily worn by repeated use. If the wear becomes excessive, normal bonding cannot be performed, and the crimping element must be periodically replaced. Conventionally, this crimping element has been replaced by replacing the entire horn or, when the crimping element is detachable from the horn body as a separate component, only exchanging the separate component.
[0003]
[Problems to be solved by the invention]
However, when replacing the entire horn, the horn, which is an expensive component, is discarded as a consumable component, and the running cost increases. In addition, even in the case where only the crimping element is attached and detached and replaced, it is difficult for the conventional bonding tool to reproduce a stable fixed state due to an unstable mounting state due to a method of fastening the crimping element to the horn body, Therefore, there has been a problem that the vibration characteristics are likely to fluctuate and stable bonding cannot be performed.
[0004]
SUMMARY OF THE INVENTION It is an object of the present invention to provide an electronic component bonding apparatus and a bonding tool capable of performing stable bonding while performing stable vibration at low cost.
[0005]
[Means for Solving the Problems]
2. A bonding device for an electronic component according to claim 1, wherein said bonding device presses said electronic component onto a surface to be joined while applying a load and vibration to said electronic component. A pressing means for pressing the first horn member against the electronic component, wherein the bonding tool includes a first horn member, a vibrator for imparting vibration to the first horn member, and a longitudinal direction substantially symmetrical to the first horn member. A second horn member having a through-hole, a crimping member having a through-hole detachably sandwiched between the first horn member and the second horn member and having a through-hole communicating with the through-hole, and having a distal end portion in contact with the electronic component; Fastening means inserted through the through-hole of the second horn and the through-hole of the crimping element and having an end connected to the first horn member. Is fixed between the wood and the second horn member, and, projecting from each side of the the mounting portion first horn and the second horn, the symmetry in plan view around the Atchakuko that provided integrally.
[0006]
A bonding tool for an electronic component according to claim 2, wherein the bonding tool presses the electronic component to a surface to be joined while applying a load and vibration to the electronic component. A vibrator for imparting vibration, a second horn member having a substantially symmetrical shape with the first horn member and having a through-hole in the longitudinal direction, and the through-hole being detachably sandwiched between the first horn member and the second horn member. A crimping element having a through-hole communicating with the hole and having a tip portion abutting against the electronic component and pressing the electronic component; and a first horn member inserted through the through-hole of the second horn and the through-hole of the crimping element. Fastening means to which ends are connected, the crimping element is fixed between the first horn member and the second horn member by the fastening means , and the mounting portion is connected to the first horn and the first horn member. On each side of the second horn Projecting, that provided integrally with the symmetry in plan view around the Atchakuko.
[0007]
ADVANTAGE OF THE INVENTION According to this invention, a vibration transmission is carried out stably by a simple structure by clamping the crimping | compression-contacting element which contacts and presses an electronic component from both sides by the 1st horn member and the 2nd horn member, and was compressed. Properties can be obtained.
[0008]
BEST MODE FOR CARRYING OUT THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a front view of an electronic component bonding apparatus according to an embodiment of the present invention, FIG. 2 is an upside down perspective view of the electronic component bonding tool, FIG. 3 is a front view of the electronic component bonding tool, and FIG. Is a partial sectional view of a bonding tool for the electronic component, and FIG. 5 is a partial front view of a bonding apparatus for the electronic component.
[0009]
First, the overall structure of an electronic component bonding apparatus will be described with reference to FIG. Reference numeral 1 denotes a support frame, on the front surface of which is provided a first elevating plate 2 and a second elevating plate 3 so as to be able to move up and down. A cylinder 4 is mounted on the first lifting plate 2, and its rod 5 is connected to the second lifting plate 3. The bonding head 10 is mounted on the second lifting plate 3. On the upper surface of the support frame 1, a Z-axis motor 6 is provided. The Z-axis motor 6 rotates a vertical feed screw 7. The feed screw 7 is screwed into a nut 8 provided on the back of the first lifting plate 2. Accordingly, when the Z-axis motor 6 is driven to rotate the feed screw 7, the nut 8 moves up and down along the feed screw 7, and the first lifting plate 2 and the second lifting plate 3 also move up and down.
[0010]
In FIG. 1, a substrate 46 whose upper surface is a surface to which electronic components are joined is placed on a substrate holder 47, and the substrate holder 47 is placed on a table 48. The table 48 is a movable table, and horizontally moves the substrate 46 in the X direction and the Y direction to position the substrate 46 at a predetermined position. The table 48 serves as positioning means for moving the board 46 relative to the electronic component 40.
[0011]
Reference numeral 42 denotes a camera, which is mounted on the uniaxial table 43. A lens barrel 44 extends forward from the camera 42. The camera 42 is moved forward along the uniaxial table 43, and the tip of the lens barrel 44 is attracted to the lower surface of the bonding tool 14 as indicated by a dashed line, and a bumped electronic component such as a flip chip is held as a bonded product. The electronic component 40 and the board 46 are observed by the camera 42 in this state.
[0012]
A recognition unit 53 recognizes images of the electronic component 40 and the board 46 captured by the camera 42 and detects their positions. Reference numeral 50 denotes a main control unit which controls the vertical movement of the Z-axis motor 6, that is, the bonding head 10 via a motor drive unit 51, and positions the table 48, that is, the substrate 46, via a table control unit 52. Further, the main control unit 50 calculates a displacement between the electronic component 40 and the board 46 in the horizontal plane from the positions of the electronic component 40 and the board 46 detected by the recognition unit 53, and drives the table 48 so as to correct the displacement. Further, a load control unit 54 and a suction device 56 are connected to the main control unit 50.
[0013]
The cylinder 4 as the pressing means is connected to the main control unit 50 via the load control unit 54, and the pressing force for pressing the electronic component 40 with bumps against the substrate 46 by the projection output of the rod 5 of the cylinder 4, that is, the bonding tool 14, is applied. Controlled. The suction device 56 performs suction and release of suction of the electronic component 40 by the bonding tool 14 according to a command from the main control unit 50. The vibrator 17 composed of an ultrasonic vibrator is connected to the main control unit 50 via an ultrasonic vibrator driving unit 55, and performs ultrasonic vibration according to a command from the main control unit 50.
[0014]
A holder 12 is coupled to the lower end of the main body 11 of the bonding head 10. A block 13 is mounted on the holder 12, and a bonding tool 14 is fixed to the block 13. The protrusion 13 a on the side of the block 13 is connected to the suction device 56. Hereinafter, the bonding tool 14 will be described with reference to FIGS. 2, 3, and 4. FIG.
[0015]
As shown in FIGS. 2 and 3, the bonding tool 14 mainly includes a horizontally long horn 15. The horn 15 is an elongated rod-shaped body as a whole, and includes three members, namely, a first horn member 15A, a second horn member 15B substantially symmetrical to the first horn member 15A, and a first horn member 15A and a second horn member. 15B. The first horn member 15A, the second horn member 15B, and the suction portion (crimp) 30 are fastened by bolts 18. The first horn member 15A and the second horn member 15B have tapered surfaces 15a that gradually become narrower from both sides thereof toward the center in plan view.
[0016]
As shown in FIG. 2, ribs 15b are integrally provided at four locations equidistant from the suction portion 30 on the tapered surface 15a, which is the side surface of each of the first horn member 15A and the second horn member 15B. ing. The four ribs 15 b are symmetrically protruded from the suction portion 30 in plan view in order to improve the attachment balance to the block 13. The bonding tool 14 is detachably mounted on the lower surface of the block 13 by screwing a bolt 21 into a through hole 20 formed in the rib 15b. That is, the rib 15b is a mounting portion for mounting the horn 15 on the block 13. Note that the illustration of the rib 15b is omitted in FIG.
[0017]
The suction portion 30 has a cross-sectional shape narrowed by the tapered portion 31, and a suction hole 32 is provided at a distal end portion protruding downward (upward in FIG. 2). The suction hole 32 communicates with a vacuum suction hole 30c formed inside the suction unit 30, and when the suction unit 30 is sandwiched between the first horn member 15A and the second horn member 15B, the first suction hole 32c is in the first position. It communicates with the vacuum suction hole 16a formed inside the horn member 15A. The vacuum suction holes 16a further communicate with the vacuum suction holes 16b opened on the upper surface of the first horn member 15A via the internal vacuum suction holes 16b.
[0018]
In FIG. 1, a suction pad 19 is mounted on a protrusion 13a provided on a side surface of the block 13, and the suction pad 19 is in contact with a vacuum suction hole 16b on the upper surface of the first horn member 15A. Accordingly, by driving the suction device 56 (FIG. 1) connected to the suction pad 19 to suck air, the suction device 30 is opened to the suction portion 30 through the first horn member 15A and the vacuum suction holes inside the suction portion 30. Vacuum suction is performed from the suction hole 32 (FIG. 3), and the electronic component 40 with the bump can be suction-held on the lower surface of the suction portion 30 and held. The suction unit 30 sucks and holds the electronic component 40, and also presses the electronic component 40 against the substrate 46 by abutting the top end of the electronic component 40 at the time of bonding.
[0019]
As shown in FIG. 4, the second horn member 15B and the suction portion 30 are provided with longitudinal through-holes 15Ba and 30a, respectively. When the second horn member 15B and the suction portion 30 are assembled, the through-hole 15Ba is provided. , 30a communicate. By inserting the shaft portion 18a of the bolt 18 through the through holes 15Ba and 30a and screwing it into the screw hole 15Aa provided in the first horn member 15A and fastening the same, the suction portion 30 is connected to the first horn member 15A and the first horn member 15A. It is sandwiched and fixed between the two horn members 15B. Therefore, the bolt 18 is a fastening means for the suction unit 30. Instead of providing the screw hole 15Aa in the first horn member 15A, a bolt is implanted in the first horn member 15A, and the bolt is inserted through the through hole 30a of the suction part 30 and the through hole 15Ba of the second horn member 15B. The suction portion 30 may be sandwiched between the first horn member 15A and the second horn member 15B by screwing and fastening a nut to the tip of the bolt.
[0020]
In FIG. 2, a vibrator 17 as a vibration applying means is mounted on a side end of the first horn member 15A. By driving the vibrator 17, longitudinal vibration (vibration in the longitudinal direction of the horn 15) is applied to the first horn member 15A, and the suction portion 30 fastened to the first horn member 15A is moved in the horizontal direction a (horn 15). Vibrates in the longitudinal direction). The shape of the first horn member 15A is a shape in which the width is sequentially reduced from the end to the center through the tapered surface 15a on the side surface.
[0021]
As a result, the amplitude of the ultrasonic vibration is amplified in the path transmitted from the vibrator 17 to the suction unit 30, and a vibration equal to or greater than the amplitude oscillated by the vibrator 17 is transmitted to the suction unit 30. Is transmitted to. Since the contact surface between the first horn member 15A and the suction portion 30 in this transmission path is compressed by the bolt 18 with a sufficient surface pressure in the longitudinal direction, vibration transmission at this contact surface causes loss. Performed well without any problems. Further, the tapered portion 31 protruding below the suction portion 30 has a function as a bending vibration portion that induces bending vibration by longitudinal vibration transmitted through the first horn member 15A. In the configuration shown in the embodiment, there is no need to provide a fastening surface between the components in the bending vibration portion. Therefore, it is possible to prevent loss of vibration transmission in the bending vibration section and improve transmission efficiency.
[0022]
In FIG. 3, a protrusion 33 is provided above the suction unit 30. By appropriately setting the shape and dimensions of the projections 33, it is possible to adjust the vertical mass distribution of the suction unit 30 to a desirable mass distribution for transmitting vibration. That is, the protrusion 33 can be used as a mass balance portion. However, in the present embodiment, the suction portion 30 is also integrally formed with the protrusion 33 as a mass balance portion. At the time of design, the balance of the mass distribution can be taken into account, and a bonding tool having excellent vibration characteristics can be realized.
[0023]
Further, when replacing the suction part 30 as a consumable part, it is not necessary to remove the entire bonding tool 14 and the operation can be performed easily. That is, as shown in FIG. 6, the attachment / detachment of the suction portion 30 can be performed in a state where the first horn member 15A is fixed to the holder 12 via the rib 15b, and the replacement operation is performed by the bolts 21 for fixing the second horn member 15B. It is performed only by inserting and removing the bolt 18 that sandwiches the suction section 30.
[0024]
As described above, the bonding tool according to the present embodiment makes the suction portion as a crimping device that contacts the electronic component and transmits vibration and load detachable to the horn body, and furthermore, the suction portion attaches to the horn. As the fastening mode, a mode is adopted in which the longitudinal vibration from the horn main body is transmitted in a state where the contact surface between the suction portion and the horn main body, that is, the vibration transmitting surface is compressed with a sufficient surface pressure. Thus, when the contact surface of the suction portion with the electronic component is worn, only the suction portion needs to be replaced, and the running cost can be reduced. Moreover, according to the above-described fastening method, the stability of vibration transmission to the suction portion is ensured, so that a bonding tool having stable fixed state and vibration characteristics can be realized.
[0025]
【The invention's effect】
According to the present invention, since the crimping member that is pressed against the electronic component is clamped between the first horn member and the second horn member from both sides and compressed, the crimping member is worn by use. In this case, only the crimping element needs to be replaced, and the running cost can be reduced, and a stable fixing state and vibration characteristics can be maintained.
[Brief description of the drawings]
FIG. 1 is a front view of an electronic component bonding apparatus according to one embodiment of the present invention; FIG. 2 is an upside down perspective view of an electronic component bonding tool according to one embodiment of the present invention; FIG. 4 is a front view of an electronic component bonding tool according to an embodiment of the present invention. FIG. 4 is a partial cross-sectional view of an electronic component bonding tool according to an embodiment of the present invention. Partial front view of [Description of symbols]
14 Bonding tool 15 Horn 15A First horn member 15B Second horn member 17 Vibrator 18 Bolt 30 Suction part 30a Through hole 32 Suction hole 40 Electronic component

Claims (2)

A bonding apparatus for applying pressure and vibration to an electronic component while pressing the electronic component against a surface to be joined, comprising: a bonding tool that abuts on the electronic component; and pressing means for pressing the bonding tool against the electronic component. A first horn member, a vibrator for imparting vibration to the first horn member, a second horn member substantially symmetrical to the first horn member and having a longitudinal through-hole, A crimping element having a through-hole detachably sandwiched between the horn member and the second horn member and communicating with the through-hole, the tip of which contacts the electronic component; and a through-hole of the second horn and a crimping element. Fastening means, which are inserted into the through holes and whose ends are connected to the first horn member, wherein the crimping element is fixed between the first horn member and the second horn member by the fastening means ; And Projecting from each side of the the mounting portion first horn and the second horn, bonding electronic components characterized that you have provided integrally with the symmetry in plan view around the Atchakuko apparatus. What is claimed is: 1. A bonding tool for compressing an electronic component to a surface to be joined while applying a load and vibration to the electronic component, comprising: a first horn member; a vibrator for applying vibration to the first horn member; A second horn member having a longitudinal through-hole substantially symmetrical to the first horn member, and a through-hole detachably sandwiched between the first horn member and the second horn member and communicating with the through-hole; A crimping device for abutting against the electronic component and pressing the electronic component; and fastening means inserted into the through-hole of the second horn and the through-hole of the crimping device and having an end connected to the first horn member. The crimping element is fixed between the first horn member and the second horn member by the fastening means , and the mounting portions are provided to protrude from respective side surfaces of the first horn and the second horn. , When viewed in plan with the crimping element as a center. Electronic components bonding tool characterized that you have provided integrally with the.

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