JP2004095810A - Bonding apparatus and bonding tool of electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a bonding apparatus and a bonding tool of an electronic component which can control, as much as possible, stress generated at a heating portion to heat the bonding tool to a smaller value. <P>SOLUTION: The bonding apparatus is provided with the bonding tool 14 which is in contact with the electronic component 40 and a pressing means to press the bonding tool 14 to the electronic component 40. The bonding tool 14 is provided with a rectangular horn 15, a vibrator 17 which gives vibration to the horn 15, a pressure-bonding portion 30 which is provided at the antinode of a vibration wave W of the horn 15 to bond the electronic component 40, and a heater 50 which is provided at an area corresponding to the antinode of the vibration wave W of the horn 15 to heat the horn 15. Since the stress generated at the area corresponding to the antinode of the vibration wave W is rather small, damage applied on the heater 50 is small and its operation life can therefore be extended. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an electronic component bonding apparatus and a bonding tool for bonding an electronic component such as an electronic component with a bump to a surface to be bonded such as an electrode of a substrate.
[0002]
[Prior art]
As a method for bonding an electronic component to a surface to be bonded such as an electrode of a substrate, a method using ultrasonic bonding is known. In this method, ultrasonic vibration is applied while pressing an electronic component against a surface to be bonded by a crimping portion, and the bonding surface is minutely vibrated to bring the bonding surface into close contact. The bonding tool used in this method has an elongated horn for transmitting the vibration of the ultrasonic vibrator, which is the vibration source, to the electronic component, and the crimping portion provided on the horn applies a load to the electronic component. The electronic component is bonded to the surface to be joined while applying vibration.
[0003]
The crimping portion is generally provided at a position corresponding to the antinode of vibration having the largest amplitude in the horn. The electronic component is joined to the crimping portion by vibration transmitted through a horn. In addition, a heater is provided in the bonding tool to increase the bonding effect, thereby heating the pressure-bonded portion. Conventionally, the heater is provided in a portion corresponding to a node of vibration.
[0004]
[Problems to be solved by the invention]
However, the portion corresponding to the node of the vibration of the horn has a large stress and strain due to the ultrasonic vibration, so that a large stress is generated in the heater, the heater is easily damaged, and the life of the heater is shortened. there were.
[0005]
SUMMARY OF THE INVENTION It is an object of the present invention to provide an electronic component bonding apparatus and a bonding tool capable of minimizing stress generated in a heating section such as a heater for heating a crimping section of a bonding tool.
[0006]
[Means for Solving the Problems]
An electronic component bonding apparatus according to claim 1, wherein the electronic component is bonded to a surface to be bonded while applying a load and vibration to the electronic component, and a bonding tool that contacts the electronic component. Pressing means for pressing the bonding tool against the electronic component, wherein the bonding tool includes a horizontally long horn, a vibrator for applying vibration to the horn, and an electronic device provided at an antinode of vibration of the horn. And a crimping portion for crimping the component, and a heating portion for heating the horn is provided at a portion corresponding to the antinode of vibration of the horn.
[0007]
The electronic component bonding tool according to claim 2, further comprising a horizontally long horn, a vibrator for imparting vibration to the horn, and a crimping portion provided on an antinode of vibration of the horn to crimp the electronic component, A heating unit for heating the horn was provided at a position corresponding to the belly.
[0008]
According to the present invention, since the heating section for heating the horn is provided at a portion corresponding to the antinode of the vibration of the horn, the stress generated in the heating section for heating the bonding tool can be minimized, and the life of the heating section is extended. Become. In addition, since the crimping portion and the heating portion are provided on the antinode of the vibration, the crimping member can be heated with high efficiency by the heating portion.
[0009]
BEST MODE FOR CARRYING OUT THE INVENTION
(Embodiment 1)
FIG. 1 is a front view of an electronic component bonding apparatus according to Embodiment 1 of the present invention, FIG. 2 is a front view of an electronic component bonding tool according to Embodiment 1 of the present invention, and FIG. 3 is Embodiment 1 of the present invention. , FIG. 4 is a perspective view of the electronic component bonding tool according to the first embodiment of the present invention, and FIG. 5 is a perspective view of the electronic component bonding tool according to the first embodiment of the present invention. FIG. 6 is a partial sectional view, and FIG. 6 is a partial plan view of an electronic component bonding tool according to the first embodiment of the present invention.
[0010]
First, the overall structure of an electronic component bonding apparatus will be described with reference to FIG. Reference numeral 1 denotes a support frame, on the front surface of which is provided a first elevating plate 2 and a second elevating plate 3 so as to be able to move up and down. A cylinder 4 as a pressing means of a bonding tool is mounted on the first lifting plate 2, and a rod 5 thereof is connected to the second lifting plate 3. The bonding head 10 is mounted on the second lifting plate 3. On the upper surface of the support frame 1, a Z-axis motor 6 is provided. The Z-axis motor 6 rotates a vertical feed screw 7. The feed screw 7 is screwed into a nut 8 provided on the back of the first lifting plate 2. Accordingly, when the Z-axis motor 6 is driven to rotate the feed screw 7, the nut 8 moves up and down along the feed screw 7, and the first lifting plate 2 and the second lifting plate 3 also move up and down.
[0011]
In FIG. 1, a substrate 46 as an electronic component bonding object is mounted on a substrate holder 47, and the substrate holder 47 is mounted on a table 48. The upper surface of the substrate 46 is the surface to be joined of the electronic component. The table 48 is a movable table, and horizontally moves the substrate 46 in the X direction and the Y direction to position the substrate 46 at a predetermined position. The table 48 serves as positioning means for moving the board 46 relative to the electronic component 40.
[0012]
Reference numeral 42 denotes a camera, which is mounted on the uniaxial table 43. A lens barrel 44 extends forward from the camera 42. The camera 42 is moved forward along the uniaxial table 43 and the tip of the lens barrel 44 is positioned between the electronic component 40 with bumps and the substrate 46 held by being sucked and held on the lower surface of the bonding tool 14 as shown by a chain line. In this state, the positions of the electronic component 40 and the substrate 46 are observed by the camera 42.
[0013]
A recognition unit 53 recognizes images of the electronic component 40 and the board 46 captured by the camera 42 and detects their positions. Reference numeral 49 denotes a main control unit which controls the vertical movement of the Z-axis motor 6, that is, the bonding head 10 via a motor drive unit 51, and controls the table 48 via the table control unit 52, that is, positions the substrate 46. Further, the main control unit 49 calculates a displacement between the electronic component 40 and the board 46 in the horizontal plane based on the positions of the electronic component 40 and the board 46 detected by the recognition unit 53, and drives the table 48 so as to correct the displacement. Further, the main control unit 49 is connected with a load control unit 54, suction devices 56a and 56b, and the like.
[0014]
The cylinder 4 as the pressing means is connected to the main control unit 49 via the load control unit 54, and the pressing load for pressing the bump of the electronic component 40 against the substrate 46 by the bonding tool 14, that is, the projection output of the rod 5 of the cylinder 4 is applied. Controlled. The suction device 56a performs suction and release of suction of the electronic component 40 by the bonding tool 14 according to a command from the main control unit 49. The vibrator 17 is connected to the main control unit 49 via the ultrasonic vibrator drive unit 55, and the vibrator 17 is driven by the ultrasonic vibrator drive unit 55 according to a command from the main control unit 49. Ultrasonic vibration is applied to the bonding tool 14. At this time, the vibration of the bonding tool 14 is in a resonance state, and the phase difference between the voltage and the current applied to the vibrator 17 is almost zero.
[0015]
A holder 12 is coupled to the lower end of the main body 11 of the bonding head 10. A block 13 as a mounting body for a bonding tool 14 is mounted on the holder 12, and the bonding tool 14 is fixed below the block 13. The pad 19a is in contact with the opening end of the first suction hole 16a formed in the horn 15 (see also FIG. 2), and is connected to the first suction device 56a.
[0016]
Hereinafter, the bonding tool 14 will be described with reference to FIGS. As shown in FIG. 2, the bonding tool 14 mainly includes a horizontally long horn 15. The horn 15 is a rod-shaped body made of a metal material (for example, stainless steel, aluminum, titanium, or the like), and a vibrator 17 made of an ultrasonic vibrator is mounted on one side end of the horn 15. By driving the vibrator 17, longitudinal vibration is applied in a direction along the longitudinal direction of the horn 15.
[0017]
A strip-shaped connecting portion 20 is provided on both sides of the horn 15, and a block-shaped mounting portion 21 is formed at the tip of the connecting portion 20. The connecting portion 20 is an elastic bendable portion. In addition, an insertion hole 22 for inserting a fastener 24 such as a screw, and a slit 23 are formed in the mounting portion 21 so as to penetrate vertically. By inserting the stopper 24 into the insertion hole 22 and screwing it to the leg 13 a of the block 13, the horn 15 is held and fixed to the block 13 in a double-supported state. The bonding tool 14 is detachably attached to the block 13 by being inserted into and removed from the stopper 24. On the lower surface of the central part of the horn 15, a crimping part 30 is detachably mounted. A total of four mounting portions 21 are provided on the left and right side surfaces of the horn 15 symmetrically about the crimping portion 30.
[0018]
3 and 4, the crimping portion 30 is formed by projecting a box-shaped projection 32 on a plate-like base 31. A concave portion 33 is formed on the lower surface of the protruding portion 32, and a suction hole 34 of the electronic component 40 is formed in the center of the concave portion 33. A projection 35 serving as a frame-shaped closed loop peripheral wall is provided at an edge of the projection 32 so as to surround the suction hole 34, and a rib is provided at a position corresponding to a bump (described later) of the recess 33. A plurality of projections 36 are provided as spots.
[0019]
A concave portion 37 into which the base portion 31 is fitted is formed shallowly on the lower surface of the central portion of the horn 15, and a groove-shaped ventilation portion 38 is formed on the surface of the concave portion 37 in a frame-shaped closed loop shape. In the center of the concave portion 37, a first suction hole 16a connected to the suction hole 34 is formed.
[0020]
In FIG. 2, by driving the first suction device 56a, the electronic component 40 is vacuum-sucked on the lower surface of the crimping portion 30. The pad 19a, the first suction hole 16a, and the suction hole 34 form a vacuum suction path. As shown in FIG. 4, in this state, at a position corresponding to the bump 41 of the electronic component 40, a projection 35 and a rib 36 projecting in a wall shape around the projection 32 are located. The bumps 41 can be backed up from behind by the protrusions 35 and the ribs 36, and the bumps 41 can be firmly pressed against the substrate 46.
[0021]
When the vibrator 17 is driven, the horn 15 has a node at an attachment position to the block 13 (a position where the attachment portion 21 is fixed by the stopper 24), and a standing wave having an antinode at the center portion (the attachment position of the crimping portion 30). Vibrate. In FIG. 2, W indicates this vibration wave. A cylindrical heater 50 as a heating unit is provided at a position corresponding to the antinode of the vibration wave W of the horn 15.
[0022]
In FIG. 4, a second suction hole 16 b formed in the horn 15 communicates with the ventilation part 38. As shown in FIG. 2, a pad 19b is connected to the open end of the second suction hole 16b, and the pad 19b is connected to the second suction device 56b (FIG. 1). Accordingly, when the second suction device 56b is driven, the base portion 31 is vacuum-sucked to the ventilation portion 38 by the vacuum suction pressure (see also FIG. 5), whereby the crimping portion 30 is held on the lower surface of the horn 15. . When the vacuum suction state by the second suction device 56b is released, the crimping portion 30 is detached from the horn 15. That is, the second suction device 56b is a holding unit that holds the crimping unit 30 detachably on the horn 15. Needless to say, the suction means for sucking the electronic component 40 and the crimping section 30 can be arbitrarily designed. One suction device is provided, and a valve is provided in the suction path. The electronic component 40 and the crimping part 30 may be selectively or simultaneously vacuum-sucked and held by switching the opening and closing of the suction path.
[0023]
This electronic component bonding apparatus attaches and holds the electronic component 40 to the lower surface of the crimping unit 30 by vacuum suction, grounds the bump 41 to the electrode of the substrate 46, and ultrasonically vibrates the horn 15, thereby providing the electronic component 40 with the electronic component 40. By applying a load and vibration, the bump 41 is bonded to the electrode. At this time, the horn 15 is heated by the heater 50 in order to enhance the bonding effect. However, since the heater 50 is provided at a portion corresponding to the antinode of the vibration wave W, no large stress is generated in the heater 50. Further, since the crimping portion 30 and the heater 50 are provided close to each other on the antinode of the vibration, the heater 50 can heat the crimping portion 30 with high thermal efficiency. Further, since the protrusions 35 and the ribs 36 are formed directly above the bumps 41 of the electronic component 40, the bumps 41 are firmly pressed against the substrate 46 by the protrusions 35 and the ribs 36.
[0024]
In FIG. 6, the horn 15 vibrates in the longitudinal direction a due to the driving of the vibrator 17 and also slightly vibrates in the direction b perpendicular thereto. Here, the vibration in the longitudinal direction a is allowed by bending the protruding piece 20 in the same direction a ′, and the vibration in the orthogonal direction b is obtained by elastically deforming the mounting portion 21 in the direction of the arrow b ′ as shown by the broken line. Permissible. The elastic deformation of the mounting portion 21 in the direction of the arrow b ′ is allowed by the formation of the slit 23 and the elasticity of the mounting portion 21 itself. In this manner, the elastic deformation of the connecting portion 20 and the mounting portion 21 in the direction of the arrow a ′ and the direction of the arrow b ′ allows the horn 15 to vibrate in the direction of the arrow a and the direction of the arrow b. Can vibrate. Therefore, the connecting portion 20 is a vibration permitting portion in the longitudinal direction a of the horn 15, and the slit 23 is a vibration permitting portion in the orthogonal direction b.
[0025]
When the crimping section 30 is used for a long time, the lower surface thereof gradually wears. In this case, the crimping portion 30 is removed from the horn 15 and the lower surface thereof is polished to flatten the lower surface. However, the lower surface of the crimping portion 30 is not a flat surface over its entire surface. Since the projections are provided in a spot-like manner, the lower surfaces of the projections 35 and the ribs 36 may be polished so as to be flush with each other, and the polishing for obtaining the flat surface can be easily performed.
[0026]
(Embodiment 2)
FIG. 7 is a partial perspective view of an electronic component bonding tool according to the second embodiment of the present invention, and FIG. 8 is a plan view of the electronic component bonding tool according to the second embodiment of the present invention.
[0027]
In the second embodiment, instead of the heater 50 of the first embodiment, a sheet-like heater 60 is adhered to the surface of the horn 15 by an adhesive 61 having elasticity and heat resistance. In the present embodiment, the heater 60 is attached to the front and back of the horn 15. The heater 60 on the back is not shown.
[0028]
A strip-shaped second connection portion 71 is protrudingly provided at a tip end of the strip-shaped first connection portion 70 protruding from the side surface of the horn 15. The first connecting portion 70 and the second connecting portion 71 have a T-shape in plan view, and a mounting portion 73 is formed at the tip of the second connecting portion 71. The first connecting portion 70 and the second connecting portion 71 are elastic and bendable portions. The attachment portion 73 has an insertion hole 74 for the stopper 24. The configuration other than the mounting structure of the heater 60 and the mounting portion 73 is the same as that of the first embodiment.
[0029]
Since the heater 60 is adhered to the horn 15 with the adhesive 61 having elasticity, the vibration of the horn 15 is not hindered, and the horn 15 is sufficiently vibrated. The vibration of the horn 15 in the longitudinal direction a is absorbed by the first connecting portion 70 bending in the same direction a ′, and the vibration of the horn 15 in the orthogonal direction b is absorbed by the second connecting portion 71 in FIG. It is absorbed by bending as shown by the broken line. That is, the first connecting portion 70 is a vibration permitting portion in the longitudinal direction a of the horn 15, and the second connecting portion 71 is a vibration permitting portion in the orthogonal direction. As is clear from each of the above embodiments, various forms are possible for the vibration permitting portion of the horn 15.
[0030]
【The invention's effect】
According to the present invention, since the heating unit for heating the horn is provided at a portion corresponding to the antinode of the vibration of the horn, the stress generated in the heating unit is small, and therefore, the damage to the heating unit due to the vibration is small, and the life of the heating unit is reduced. Becomes longer. In addition, since the crimping portion and the heating portion are provided at the antinode of the vibration, the crimping portion can be heated with high efficiency by the heating portion.
[Brief description of the drawings]
FIG. 1 is a front view of an electronic component bonding apparatus according to Embodiment 1 of the present invention; FIG. 2 is a front view of an electronic component bonding tool according to Embodiment 1 of the present invention; FIG. FIG. 4 is a plan view of an electronic component bonding tool according to the first embodiment of the present invention. FIG. 4 is an upside down partial perspective view of the electronic component bonding tool according to the first embodiment of the present invention. FIG. 6 is a partial plan view of an electronic component bonding tool according to the first embodiment of the present invention. FIG. 7 is a partial perspective view of an electronic component bonding tool according to the second embodiment of the present invention. Plan view of electronic component bonding tool according to Embodiment 2 of the present invention.
14 bonding tool 15 horn 16a first suction hole 16b second suction hole 17 vibrator 30 crimping part 34 suction hole 35 protrusion 36 rib 38 ventilation part 40 electronic component 41 bump 46 substrate 50 heater (heating part)
56a first suction device 56b second suction device

Claims (2)

An electronic component bonding apparatus for joining an electronic component to a surface to be joined while applying a load and vibration to the electronic component, comprising: a bonding tool that contacts the electronic component; and a pressing tool that presses the bonding tool against the electronic component. Means, the bonding tool has a horizontally long horn, a vibrator for imparting vibration to the horn, and a crimping portion provided on the antinode of the vibration of the horn and crimping an electronic component. A bonding device for an electronic component, wherein a heating unit for heating the horn is provided at a portion corresponding to an antinode of vibration. A horizontally long horn, a vibrator for imparting vibration to the horn, and a crimping portion provided on the antinode of the vibration of the horn to press the electronic component and heat the horn to a portion corresponding to the antinode. An electronic component bonding tool, comprising: a heating unit.

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