JP3664155B2 - Electronic component bonding apparatus and bonding tool - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component bonding apparatus and a bonding tool for bonding an electronic component such as an electronic component with a bump to a surface to be bonded such as an electrode of a substrate.
[0002]
[Prior art]
As a method for bonding an electronic component to a surface to be bonded such as an electrode of a substrate, a method using ultrasonic pressure welding is known. In this method, ultrasonic vibration is applied to the electronic component while pressing the electronic component against the surface to be joined, and the joining surface is brought into close contact by causing the joining surface to vibrate minutely to generate friction. The bonding tool used in this method has a horn that is an elongated rod body that transmits vibrations of an ultrasonic vibrator, which is a vibration generation source, to an electronic component. While applying a load and vibration to the component, the electronic component is bonded to the surface to be bonded by bonding. In order to increase the bonding effect, a heater is provided in the horn, and the crimping portion is heated by this heater.
[0003]
[Problems to be solved by the invention]
The heat of the heater is transmitted to the ultrasonic vibrator through the horn, and the ultrasonic vibrator is heated. However, since the ultrasonic vibrator is vulnerable to heat, this heating may cause a reduction in life and fluctuations in vibration characteristics.
[0004]
SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic component bonding apparatus and a bonding tool that can reduce adverse effects on a vibrator by a heater for heating a crimping portion.
[0005]
[Means for Solving the Problems]
The present invention relates to an electronic component bonding apparatus for bonding an electronic component to a surface to be bonded while applying a load and vibration to the electronic component with a bonding tool, the bonding tool being mounted on the horizontally long horn A vibrator that applies vibration to the lever, a crimping part that is provided on the horn and crimps an electronic component, and a heater that heats the crimping part, and the horn between the vibrator and the crimping part A ventilation part for preventing heat transfer to the vibrator was formed.
[0006]
The present invention also relates to an electronic component bonding tool for bonding an electronic component to a surface to be bonded while applying a load and vibration to the electronic component. The horizontal horn is attached to the horn to impart vibration to the horn. A vibrator that is provided on the horn and crimps an electronic component, and a heater that heats the crimp part, and heat transfer to the vibrator is transmitted to the horn between the vibrator and the crimping part. A ventilation part for preventing the above was formed.
[0007]
According to the present invention, it is possible to suppress the heating of the vibrator by the heat transfer of the heater for heating the crimping portion by the ventilation portion, and to obtain a vibration characteristic in which the life of the vibrator is stabilized.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
(Embodiment 1)
1 is a front view of an electronic component bonding apparatus according to an embodiment of the present invention, FIG. 2 is a perspective view of an electronic component bonding tool according to an embodiment of the present invention, and FIG. 3 is an embodiment of the present invention. FIG. 4 is a partially enlarged plan view of a mounting portion of an electronic component bonding tool according to an embodiment of the present invention.
[0009]
First, the overall structure of an electronic component bonding apparatus will be described with reference to FIG. Reference numeral 1 denotes a support frame, and a first elevating plate 2 and a second elevating plate 3 are provided on the front surface thereof so as to be movable up and down. A cylinder 4 is mounted on the first lifting plate 2, and its rod 5 is coupled to the second lifting plate 3. A bonding head 10 is attached to the second lifting plate 3. A Z-axis motor 6 is provided on the upper surface of the support frame 1 as vertical movement means. The Z-axis motor 6 rotates a vertical feed screw 7. The feed screw 7 is screwed into a nut 8 provided on the back surface of the first lifting plate 2. Therefore, when the Z-axis motor 6 is driven and the feed screw 7 rotates, the nut 8 moves up and down along the feed screw 7, and the first lifting plate 2 and the second lifting plate 3 move up and down.
[0010]
In FIG. 1, a substrate 46 that is an object to be bonded is placed on a substrate holder 47, and the substrate holder 47 is placed on a table 48. The circuit pattern surface on the upper surface of the substrate 46 is a surface to be joined of the electronic component. The table 48 is a movable table, and horizontally moves the substrate 46 in the X direction, Y direction, and θ direction to position the substrate 46 at a predetermined position. The table 48 serves as a positioning means for the substrate 46 that moves the substrate 46 relative to the electronic component 40.
[0011]
A camera 42 is mounted on the movable table 43. Reference numeral 44 denotes a lens barrel extending forward from the camera 42. The camera 42 is advanced along the movable table 43, and as shown by the chain line, the tip of the lens barrel 44 is attracted to the lower surface of the bonding tool 14 and held between the bumped electronic component 40 and the substrate 46. The position of the electronic component 40 and the board | substrate 46 is observed with the camera 42 in that state.
[0012]
Reference numeral 73 denotes a recognition unit that recognizes images of the electronic component 40 and the substrate 46 captured by the camera 42 and detects their positions. Reference numeral 70 denotes a main control unit which controls the raising / lowering operation of the Z-axis motor 6, that is, the bonding head 10 through the motor driving unit 71, and controls the table 48, that is, positions the substrate 46 through the table control unit 72. Further, the main control unit 70 calculates a positional shift between the electronic component 40 and the substrate 46 detected by the recognition unit 73 in the horizontal plane, and drives the table 48 so as to correct the positional shift. Further, a load control unit 74 and a suction device 76 are connected to the main control unit 70.
[0013]
The cylinder 4 as the pressing means is connected to the main control unit 70 via the load control unit 74, and a pressing load that presses the bump of the electronic component 40 against the substrate 46 by the projecting output of the rod 5 of the cylinder 4, that is, the bonding tool 14. Be controlled. The suction device 76 performs suction / suction release of the electronic component 40 by the crimping portion of the bonding tool 14 according to a command from the main control unit 70. The vibrator 17 is connected to the main control unit 70 via the ultrasonic vibrator driving unit 75 and performs ultrasonic vibration in accordance with a command from the main control unit 70.
[0014]
A holder 12 is coupled to the lower end of the main body 11 of the bonding head 10. The holder 12 is provided with a block 13 as a bonding tool mounting body, and the block 13 is a bonding tool mounting body. The connecting portion 13 a at the side of the block 13 is connected to the suction device 76. Hereinafter, the bonding tool 14 will be described with reference to FIGS. 2 and 3.
[0015]
As shown in FIG. 2, the bonding tool 14 mainly includes a horizontally long horn 15 attached to the lower part of the block 13. The horn 15 is an elongated rod-like body, and has a tapered surface 15a that is a side surface that gradually becomes narrower from both ends toward the center (center position) in plan view. The upper and lower surfaces of the horn 15 are also tapered surfaces 15b that become narrower toward the center. A crimping portion 30 is detachably attached to the lower surface of the center position of the horn 15. In FIG. 1, a suction pad 19 is connected to a connecting portion 13 a provided on the side surface of the block 13.
[0016]
The horn 15 is formed with a suction hole 16 a communicating with the nozzle 31 of the crimping portion 30 (see FIG. 2), and the suction pad 19 is connected to the suction hole 16 a opened on the upper surface of the horn 15. Therefore, by driving the suction device 76 (FIG. 1) connected to the suction pad 19 to suck air, the electronic component 40 with bumps can be vacuum-sucked and held at the lower end of the nozzle 31.
[0017]
In FIG. 2, square ribs 50 for attaching the bonding tool 14 to the block 13 are provided at four locations that are equidistant from the crimping portion 30. In order to improve the mounting balance to the block 13, a plurality (four in this example) of the four ribs 50 are provided symmetrically in plan view with the crimping portion 30 at the center of the horn 15 as the center. . The bonding tool 14 is detachably attached to the lower portion of the block 13 by inserting a stopper 18 such as a screw or a bolt into a through hole 51 formed in the rib 50. That is, the bonding tool 14 is attached to the lower part of the block 13 in a state where both sides are supported by the ribs 50 located on both sides of the crimping part 30.
[0018]
In FIG. 3, a bendable strip-shaped connecting portion 52 having elasticity protrudes from the side surface of the horn 15, and a rib 50 is integrally formed at the tip of the connecting portion 52. A laterally long slit 53 is formed in the rib 50 in the longitudinal direction of the horn 15. It is desirable to form the ribs 50 by using an elastic resin or the like because the flexibility is further increased. The rib 50 and the connecting portion 52 are attachment portions for attaching the bonding tool 14 to the block 13.
[0019]
In FIG. 3, when the vibrator 17 is driven, the horn 15 vibrates in the longitudinal direction a, but also slightly vibrates in the direction b orthogonal to the longitudinal direction a. On the other hand, the horn 15 is fixed to the block 13 at a plurality of locations (four locations in this example) by fasteners 18 as fixing means. Even if the horn 15 vibrates in the longitudinal direction a or the orthogonal direction b, the position of the fixing means (stopper 18) is constant and does not move. The vibration in the longitudinal direction a is allowed when the connecting portion 52 swings in the longitudinal direction of the horn 15 (arrow a ′ in FIG. 4). That is, the bendable connecting portion 52 protruding sideways from the horn 15 is a vibration allowing portion in the longitudinal direction a of the horn 15.
[0020]
In FIG. 4, the vibration of the horn 15 in the orthogonal direction b is permitted by elastically deforming the rib 50 in the orthogonal direction b ′ as shown by the dotted line by opening the slit 53. The rib 50 is preferably made of a material such as a resin that is easily elastically deformed, and in addition to this, a slit 53 that is a through-hole is formed so that the rib 50 is easily elastically deformed, thereby elastically moving in the orthogonal direction b ′. It is easy to deform. That is, the rib 50 and the slit 53 made of an elastic body serve as a vibration allowing portion that allows the horn 15 to vibrate in a direction b orthogonal to the longitudinal direction a.
[0021]
The structure of the vibration allowing portion that allows the vibration in the longitudinal direction a of the horn 15 and the direction b orthogonal thereto is not limited to the present embodiment. Etc., so that the horn 15 can sufficiently vibrate without being disturbed.
[0022]
In FIG. 2, a vibrator 17 that is a vibration applying unit is attached to a side end of the horn 15. By driving the vibrator 17, longitudinal vibration (vibration in the longitudinal direction “a” of the horn 15) is applied to the horn 15, and the crimping portion 30 vibrates in the same direction “a”. The shape of the horn 15 is a stop shape in which the width and height are successively reduced from both end portions toward the center portion through the side tapered surface 15a and the top and bottom tapered surfaces 15b. As a result, the amplitude of the ultrasonic vibration is amplified in the path transmitted from the vibrator 17 to the crimping portion 30, and a vibration greater than the amplitude oscillated by the vibrator 17 is transmitted to the crimping portion 30. Is transmitted to the electronic component 40 through the nozzle 31 which is a bonding operation portion protruding downward.
[0023]
In the vibration transmission to the electronic component 40, not only the longitudinal vibration transmitted through the horn 15 by the vibrator 17 but also the bending vibration induced in the protruding crimping portion 30 by the longitudinal vibration of the horn 15 is superimposed. Is transmitted. The mounting portion of the horn 15 (the position of the rib 50) and the central portion of the horn (the position of the crimping portion 30) become the nodes and antinodes of the standing wave vibration W (FIG. 2) of the horn 15, respectively.
[0024]
2 and 3, a sheet-like heater 38 is attached to the surface of the horn 15, preferably in the vicinity of the crimping part 30 such as both sides of the central part, with a resin 39 as an adhesive. Heat from the heater 38 is transmitted to the crimping part 30 through the horn 15 and heats the crimping part 30 and its nozzle 31. By heating the electronic component 40 vacuum-adsorbed to the lower end portion of the nozzle 31 via the crimping portion 30 and the nozzle 31, the bonding effect of the electronic component 40 on the surface to be bonded is enhanced.
[0025]
The resin 39 is preferably a resin having heat resistance and elasticity (for example, epoxy resin or silicon resin). If the heater 38 is mounted on the surface of the horn 15 with the resin 39 having elasticity in this way, the heater 38 is unlikely to hinder the vibration characteristics of the horn 15. As the heater, a sheet-like heater 38 as in the present embodiment is desirable, but a cartridge-type heater may be attached to the horn 15 with a resin 39. Further, the heater is preferably mounted at a location close to the crimping portion 30, and may be attached to the surface of the crimping portion 30 with a resin 39. In addition, the conventional heater was built in the inside of a horn, For this reason, it was easy to inhibit the vibration characteristic of a horn.
[0026]
2 and 3, a slit 25 as a ventilation portion is formed at the end of the horn 15 near the vibrator 17. In this embodiment, a plurality of horizontally long slits 25 are formed in the vertical direction in the longitudinal direction of the horn 15. This is preferable because the longitudinal vibration propagation direction of the horn 15 and the slit 25 are parallel to each other, and the influence of the slit formation on the vibration state can be reduced. The slit 25 may be formed at any position between the crimping portion 30 and the vibrator 17, but in order not to adversely affect the vibration characteristics of the crimping portion 30, the slit 25 is located as close as possible to the vibrator 17. desirable. By forming the slit 25 in this way, the surface area (heat radiation area) of the horn 15 is increased, thereby enhancing the heat radiation effect of the horn 15 and making the vibrator 17 difficult to heat.
[0027]
A fan 26 as a cooling means is provided on the side of the slit 25, and the fan 26 rotates to send cool air to the slit 25 to cool the slit 25. A refrigerant may be allowed to flow.
[0028]
FIG. 5 is a perspective view of an electronic component bonding tool according to another embodiment of the present invention. The horn 15 'of the bonding tool 14' is a cantilever type, and is only the substantially left half of the bonding tool 14 shown in FIG. The same elements as those in the above embodiment are given the same reference numerals. Therefore, this also has the same effect as the above embodiment.
[0029]
【The invention's effect】
According to the present invention, it is possible to suppress the heating of the vibrator by the heat transfer of the heater for heating the crimping portion by the ventilation portion, and to obtain a vibration characteristic in which the life of the vibrator is stabilized.
[Brief description of the drawings]
FIG. 1 is a front view of an electronic component bonding apparatus according to an embodiment of the present invention. FIG. 2 is a perspective view of an electronic component bonding tool according to an embodiment of the present invention. FIG. 4 is a partially enlarged plan view of a mounting portion of an electronic component bonding tool according to an embodiment of the present invention. FIG. 5 is an electronic component according to another embodiment of the present invention. Perspective view of bonding tool
14, 14 'Bonding tool 15, 15' Horn 17 Vibrator 25 Slit 26 Fan 30 Crimp part 38 Heater 39 Resin 40 Electronic component

Claims (6)

An electronic component bonding apparatus for bonding an electronic component to a surface to be bonded while applying a load and vibration to the electronic component by a bonding tool, the bonding tool being mounted on the horn and mounted on the horn. A vibrator for applying vibration; a crimping portion provided on the horn for crimping an electronic component; and a heater for heating the crimping portion; and the vibrator on the horn between the vibrator and the crimping portion. A bonding apparatus for electronic parts, characterized in that a ventilation part for preventing heat transfer is formed. 2. The electronic component bonding apparatus according to claim 1, wherein the ventilation portion is a horizontally long slit in the longitudinal direction of the horn. 3. The electronic component bonding apparatus according to claim 1, further comprising cooling means for cooling the ventilation portion. An electronic component bonding tool for bonding an electronic component to a surface to be bonded while applying a load and vibration to the electronic component, a horizontally long horn, and a vibrator that is attached to the horn and imparts vibration to the horn, A crimping part that is provided on the horn and crimps an electronic component, and a heater that heats the crimping part, and prevents heat transfer to the vibrator between the vibrator and the crimping part. An electronic component bonding tool characterized by forming a ventilation portion. 5. The electronic component bonding tool according to claim 4, wherein the ventilation portion is a horizontally long slit in a longitudinal direction of the horn. 6. The electronic component bonding tool according to claim 4, further comprising cooling means for cooling the ventilation portion.

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