JP4683100B2 - Bonding apparatus and bonding tool - Google Patents

Description

  The present invention relates to an electronic component bonding apparatus and a bonding tool for bonding an object to be bonded such as an electronic component to a surface to be bonded such as an electrode of a substrate.

  As a method for bonding an object to be bonded such as an electronic component to a surface to be bonded such as an electrode of a substrate, ultrasonic pressure welding is known. This method applies ultrasonic vibration to the electronic component while pressing the electronic component against the surface to be bonded, and causes the bonding surface to vibrate minutely to adhere. A bonding tool used for ultrasonic pressure welding has an elongated horn that transmits vibration of a vibration generation source to an electronic component, and a load and vibration are applied to the electronic component by a joint acting portion provided on the horn. However, the electronic component is bonded to the surface to be bonded by pressure bonding.

As such a bonding tool, there is a known tool that incorporates a heater in a horn and performs bonding while heating an electronic component through a bonding operation part. When this heater built-in type requires temperature control during heating. Is provided with temperature measuring means (see, for example, Patent Document 1). In this patent document example, a non-contact type temperature measuring means such as an infrared thermometer is used to detect the temperature of the side surface of the bonding tool.
Japanese Patent Laid-Open No. 2000-200961 (FIG. 3)

  By the way, with recent diversification of component types, electronic components that require finer temperature control than those in the past have appeared during bonding operations. However, when a non-contact type temperature measuring device such as the above-mentioned patent document is applied to such an electronic component, the temperature of the temperature detection portion is not necessarily the original temperature control target portion, that is, the electronic component. The temperature does not coincide with the temperature of the bonding portion that contacts and heats, and tends to cause a temperature detection error. As a result, in the heating process of the bonding operation, an error may occur in the temperature control of the bonding operation part. Furthermore, since a non-contact type temperature sensor is provided separately from the horn body as temperature measuring means, it has been difficult to reduce the overall configuration and cost of the bonding tool.

  Accordingly, an object of the present invention is to provide a bonding apparatus and a bonding tool that are excellent in temperature control accuracy, compact, and low in cost.

The invention described in claim 1 is a bonding apparatus for bonding a bonding target object to a surface to be bonded while applying a load and vibration to the bonding target object, the bonding tool contacting the bonding target object, and the bonding tool Pressing means for pressing the object to be joined, and the bonding tool includes a horizontally long horn, a vibrator that applies longitudinal vibration to the horn in a first direction along the longitudinal direction of the horn, A convex portion provided so as to protrude from the horn in a second direction substantially orthogonal to the first direction, a joining action portion provided at an end portion of the convex portion and contacting the object to be joined, and provided in the horn A heating means for heating the joining action portion, and a temperature measuring means provided inside the horn for measuring the temperature of the joining action portion, wherein the temperature measuring means is rod-shaped, and the horn has a first direction. In the mounting hole having an inner diameter larger than the outer diameter of the temperature measuring means provided along the horn, it is not fixed to the horn, and is inserted in a loose state in a movable manner while maintaining a gap with the inner surface of the mounting hole. and wherein the temperature measuring means so as to prevent falling off from the mounting hole by the stiffness of the second lead, the opening end of the mounting hole, elastically supporting the second lead wire to the horn by a plug To do .

The invention according to claim 2 is a bonding tool for bonding the object to be bonded to the surface to be bonded while applying a load and vibration to the object to be bonded, and the bonding tool includes a horizontally long horn and the horn. A vibrator that imparts longitudinal vibration in a first direction along the longitudinal direction of the horn, a convex portion that protrudes from the horn in a second direction substantially orthogonal to the first direction, and the convex portion A bonding action part provided at the end of the horn and contacting the object to be joined; heating means provided at the horn for heating the bonding action part; and a temperature of the bonding action part provided within the horn. Temperature measuring means, the temperature measuring means is rod-shaped, and is not fixed to the horn in the mounting hole having an inner diameter larger than the outer diameter of the temperature measuring means provided in the first direction in the horn. Between the inner surface of this mounting hole It is inserted in movable loose state maintained between, and said temperature measuring means so as to prevent falling off from the mounting hole by the stiffness of the second lead, the opening end of the mounting hole, wherein The second lead wire is elastically supported on the horn by a plug .

  According to the present invention, by providing the temperature measuring means for measuring the temperature of the bonding action portion inside the horn provided with the heating means for heating the bonding action portion, the bonding is excellent in temperature control accuracy, compact and low cost. A tool can be realized.

  Next, embodiments of the present invention will be described with reference to the drawings. 1 is a front view of a bonding apparatus according to an embodiment of the present invention, FIG. 2 is a front view of a bonding tool according to an embodiment of the present invention, and FIG. 3 is a plan view of the bonding tool according to an embodiment of the present invention. 4 is a partial cross-sectional view of a bonding tool according to an embodiment of the present invention, FIG. 5 is a side view of the bonding tool according to an embodiment of the present invention, and FIG. 6 is a bonding tool according to an embodiment of the present invention. FIG. 7 is an explanatory view of a heating state, FIG. 7 is an explanatory view of a mounting state of a vibrator in the bonding tool of one embodiment of the present invention, and FIG. It is explanatory drawing.

  First, the structure of the bonding apparatus will be described with reference to FIG. This bonding apparatus has a function of pressing and bonding a semiconductor chip to a substrate as a bonded surface while applying a load and vibration to the semiconductor chip as a bonding target. In FIG. 1, a substrate 3 is held by a substrate holder 2 provided on the upper surface of the positioning table 1. A semiconductor chip 4 having a plurality of bumps 4a provided on the lower surface thereof is pressed onto the substrate 3 by ultrasonic bonding.

  A bonding mechanism is disposed above the positioning table 1. The bonding mechanism is configured by attaching a bonding tool 7 to the lower surface of an elevating block 6 that elevates by an elevating and pressing mechanism 5. The bonding tool 7 is mainly composed of a horn 8 that is a horizontally long rod-like member, and a vibrator 11 is mounted on one end of the horn 8. A convex portion 9 a is provided at the center of the lower surface 8 a of the horn 8, and the bonding action portion 10 is fixed to the end of the convex portion 9 a. The lower surface of the bonding operation portion 10 is an abutting surface 10 a that abuts on the semiconductor chip 4 to be bonded.

In a state where the semiconductor chip 4 is held on the contact surface 10a of the bonding tool 7, the semiconductor chip 4 is moved to the substrate 3 by lowering the bonding tool 7 by the elevation pressing mechanism 5.
Is pressed against. When the vibrator 11 is driven in this state, a load and vibration are applied to the semiconductor chip 4 via the horn 8 and the bonding operation part 10, whereby the semiconductor chip 4 is bonded to the substrate 3. Therefore, the elevation pressing mechanism 5 is a pressing means for pressing the bonding tool 7 against the semiconductor chip 4.

  Hereinafter, the structure of the bonding tool 7 will be described with reference to FIGS. 2, 3, 4, and 5. The horn 8 of the bonding tool 7 is made of a metal material (for example, stainless steel, aluminum, titanium, etc.) and the like, and is a rod-shaped body having a rectangular cross section. As shown in FIG. 2, the lower surface 8 a of the horn 8 is provided with a convex portion 9 a that protrudes in a second direction orthogonal to the longitudinal direction (first direction) of the horn 8.

  A vibrator 11 is bolted to a side end portion of one side of the horn 8 via a spacer 12, and the vibrator 11 is connected to the vibrator driving unit 13 via an electrode 11 a protruding on the side surface. The function of the spacer 12 will be described later. By driving the vibrator 11 by the vibrator driving unit 13, longitudinal vibration is applied in the first direction along the longitudinal direction of the horn 8. Therefore, the vibrator 11 is a vibration applying unit that applies vibration in the first direction along the longitudinal direction of the horn 8. The spacer 12 is not essential.

  As shown in FIG. 3, ribs 8c for horn attachment are provided on the side surfaces 8d on both sides of the horn 8 so as to protrude outward from the horn 8, and bolts (not shown) are provided in attachment holes provided in the rib 8c. ) Is fastened to the lifting block 6 and the horn 8 is fixed to the lifting block 6 in a both-end supported state. The raising / lowering block 6 is an attachment member for attaching the bonding tool 7 to the raising / lowering pressing mechanism 5 which is a pressing means.

  The rib 8c is disposed at the center distribution position with the convex portion 9a as the center, and the dimension between the two ribs 8c is shown in FIG. 2 in order to minimize the vibration attenuation caused by fixing the vibration portion. As shown in FIG. 4, the length is set to be equal to the half wavelength (L / 2) of the longitudinal vibration applied by the vibrator 11. In addition, the said dimension should just be the range which can attenuate | dampen a vibration, and does not necessarily need to be equal to L / 2.

  FIG. 2 shows a graph of the amplitude of standing wave vibration induced on the horn 8 by the vibrator 11 together with a front view of the bonding tool 7. The vibrator 11 is driven at an appropriate frequency according to the horn 8. Then, by applying a longitudinal vibration in the first direction to the horn 8 to create a resonance state, a standing wave vibration as shown in the graph of FIG. In the standing wave vibration of the horn 8, the position of the rib 8c is a node with little horizontal displacement, and the position of the convex portion 9a located at the center of the rib 8c corresponds to the antinode where the horizontal amplitude is maximum. . That is, the lifting block 6 for attaching the bonding tool 7 to the lifting and pressing mechanism 5 is connected to the horn 8 via a node of standing wave vibration induced in the horn 8. The vibration of the convex portion 9a is transmitted to the semiconductor chip 4 through the contact surface 10a.

  On the opposite side of the convex portion 9a in the horn 8 (a symmetric direction with respect to the central axis in the first direction), a vibration balance portion 9b protruding substantially in the same shape as the convex portion 9a is provided. The vibration balance portion 9b is provided in the bonding tool 7 in order to maintain the vibration balance of the horn 8 mainly by maintaining the mass balance. The vibration balance portion 9b allows the vibration distribution and the mass distribution of the horn 8 to be maintained. It becomes almost symmetrical with respect to the central axis in the first direction, and uniform vibration transmission is ensured.

Inside the horn 8, there is provided a suction hole 8b opened on the top surface of the horn. One end of the suction hole 8b is closed by a plug 18 provided at the right end of the horn 8, and the other end communicates with an internal space 9c provided in the convex portion 9a (see FIG. 5). Further, the internal space 9 c communicates with the suction hole 10 b provided in the bonding operation portion 10. The suction hole 8b is connected to a vacuum suction source 15 via a pad 14 that is in contact with the upper surface of the horn 8. By driving the vacuum suction source 15, vacuum suction is performed from the suction hole 10b, and thereby the contact surface 10a. The semiconductor chip 4 that is in contact with is held on the contact surface 10a by vacuum suction.

  In the vicinity of the left end surface where the vibrator 11 is coupled to the horn 8, a plurality of slits 8 e are provided in a horizontal direction (perpendicular to the paper surface in FIG. 2) perpendicular to the longitudinal direction. Each slit 8 e is connected to an air supply source 17 through an air flow path hole 8 f provided perpendicular to the horn 8 and a pad 16 in contact with the upper surface of the horn 8. Driving the air supply source 17 causes air to be ejected from the slit 8e, whereby the horn 8 in the vicinity of the slit 8e is cooled by air cooling. Since the pad 16 is made of a flexible resin such as a silicone resin, it is difficult to hinder the vibration of the bonding tool 7.

  Due to this cooling effect, when the horn 8 is heated by the heating means described below, the temperature rise of the vibrator 11 due to heat transfer from the heating means is prevented, and fluctuations in vibration characteristics due to temperature fluctuations of the vibrator 11 are prevented. It can be prevented. The slit 8e, the air flow path hole 8f, and the air supply source 17 are provided between the heating unit and the vibrator 11, and serve as a cooling unit that cools the vibrator 11.

  Next, heating means and temperature measuring means provided in the horn 8 will be described. As shown in FIG. 2, a first lead wire 22 and a second lead wire 23 are inserted into the horn 8 from the right end surface in the first direction. The lead wires 22 and 23 are electric wirings for connecting the heater 19 and the thermocouple 20, which are electrical components, to the external heating power supply unit 25, respectively, and are coupled to the bracket 26 via a resin cushion 24. The bracket 26 is a thin metal plate member and is fastened to the elevating block 6 by bolts 28. A washer 27 is interposed between the lifting block 6 and the bracket 26 so as to prevent direct contact between the lifting block 6 and the bracket 26.

  As shown in FIG. 4, the heater 19 and the thermocouple 20 are respectively inserted into mounting holes 8g and 8h having a circular cross section provided in the right half of the horn 8 along the longitudinal direction (first direction) of the horn 8. ing. As shown in FIG. 5, the mounting holes 8g and 8h are provided at positions that do not overlap with the suction hole 8b in the cross section perpendicular to the first direction of the horn 8. Note that a cross section indicated by hatching in FIG. 4 indicates a cross section along the broken line a in FIG.

  The heater 19 inserted in the first direction into the mounting hole 8g is a rod-shaped heating means, and the horn 8 is heated by operating the heater 19, whereby the semiconductor is connected via the contact surface 10a of the joining portion 10. The chip 4 is heated. By this heating, it is possible to efficiently perform the pressure bonding of the semiconductor chip 4 to the substrate 3 in a bonding operation in a short time.

  When the heater 19 is continuously operated, the heat generated from the heater 19 is transmitted to the vibrator 11 through the horn 8 and raises the temperature of the vibrator 11. Since the temperature rise of the vibrator 11 causes a variation in vibration characteristics, it is desirable to suppress heat transfer to the vibrator 11 as much as possible. For this reason, in the horn 8 shown in the present embodiment, the slit 8e is provided on the near side in the heat transfer direction of the vibrator 11 as described above, and the air supplied through the pad 16 is blown out from the slit 8e. Thus, the heat transmitted through the horn 8 is dissipated by the slit 8e so that the amount of heat transferred to the vibrator 11 is minimized.

The thermocouple 20 inserted in the mounting hole 8h in the first direction is a rod-shaped temperature measuring means, and measures the temperature of the bonding portion 10 when heated by the heater 19. This temperature measurement is performed by measuring the temperature inside the horn 8 at the closest position of the bonding operation portion 10. The temperature signal measured by the thermocouple 20 is fed back to the temperature control unit of the heating power supply unit 25 (FIG. 2) via the lead wire 23, and the heater 19 is feedback-controlled based on the temperature measurement result. Thereby, the temperature of the joining action part 10 is hold | maintained at preset temperature, and the semiconductor chip 4 is heated to predetermined temperature by the heat transfer via the contact surface 10a.

  In this temperature measurement, since the thermocouple 20 is disposed in the immediate vicinity of the bonding operation part 10 inside the horn 8, it is possible to precisely perform temperature measurement for heating control of the semiconductor chip 4 to be bonded. Therefore, it is possible to ensure high temperature control accuracy as compared with the prior art in which the surface temperature of the horn is detected without contact. Furthermore, since the structure which mounts the thermocouple 20 which is a temperature measuring means inside the horn 8 is employ | adopted, the compact structure and cost reduction of the whole structure of the bonding tool 7 can be achieved.

  Next, a method for attaching the heater 19 and the thermocouple 20 to the horn 8 will be described. The inner diameter of the mounting hole 8g is set slightly larger than the outer diameter of the heater 19, and when the heater 19 is inserted into the mounting hole 8g and mounted, it is between the outer surface of the heater 19 and the inner surface of the mounting hole 8g. A slight gap G1 is ensured. The mounting hole 8h has a stepped shape with different inner diameters depending on the position in the longitudinal direction. This stepped shape is not essential. The inner diameter of the tip hole 8h * into which the temperature measuring part of the thermocouple 20 is inserted is set slightly larger than the outer diameter of the temperature measuring part, and the temperature measuring part is inserted into the tip hole 8h * and attached. , A slight gap G2 is secured between the outer surface of the temperature measuring unit and the inner surface of the tip hole 8h *. That is, the heater 19 and the thermocouple 20 are mounted in a state in which they can move within each mounting hole without being fixed to the horn 8, that is, in a loose mounting state.

  In this embodiment, the heater 19 and the thermocouple 20 are held by the following method so that the heater 19 and the thermocouple 20 mounted in such a loosely attached state do not fall off the horn 8. First, as shown in FIG. 4, the lead wires 22 and 23 are bent in an L shape outside the insertion end of the horn 8. The bent lead wires 22 and 23 are held by a bracket 26 via a resin cushion 24. As a result, the heater 19 and the thermocouple 20 are restrained loosely in the longitudinal direction of the heater 19 and the thermocouple 20 by the rigidity of the lead wires 22 and 23, and are prevented from coming off from the horn 8. As for the thermocouple 20, the lead wire 23 is elastically supported on the horn 8 by a plug 21 which is a pipe-like member made of a soft resin such as silicone resin at the opening end of the mounting hole 8h. Thereby, the lead wire 23 is held at a substantially central position of the mounting hole 8h, and the temperature measuring part of the thermocouple 20 can be inserted into the tip hole 8h * without difficulty. The plug 21 is not essential.

  Here, since the bracket 26 is coupled to the elevating block 6 connected to the horn 8 at the node of the standing wave vibration, the vibration transmitted from the horn 8 to the elevating block 6 is minimized, and therefore the lead wire. The lead wires 22 and 23 can be stably held by the bracket 26 without applying excessive vibration to the wires 22 and 23. The lead wire 22 and the lead wire 23 do not necessarily have to be bent in an L shape, and the position and holding form for holding the lead wires 22 and 23 may be appropriately selected according to the relative arrangement of the elevating block 6 and the horn 8. .

  In the above configuration, the heater 19 and the thermocouple 20 are mounted with a gap between the mounting holes 8g and 8h provided in the horn 8 and connected to the outside by lead wires 22 and 23 which are electrical wirings. By holding the lead wires 22 and 23 on a bracket 26 provided on the elevating block 6 which is an electrical component and an attachment member, the heaters 19 and the thermoelectrics from the mounting holes 8g and 8h are caused by the rigidity of the lead wires 22 and 23 themselves. The pair 20 is prevented from falling off.

  In this way, by adopting a configuration in which the mounting of the heater 19 and the thermocouple 20 is loosely attached and is held by the rigidity of the lead wires 22 and 23, the heater 19 and the thermocouple 20 are attached to the respective mounting holes 8g, No contact pressure is pressed against the inner surface of 8h. For this reason, even when expansion / contraction of the horn 8 occurs due to a temperature change, the mounting state does not change, and a constant mounting state is always maintained. Therefore, the rigidity distribution of the entire horn 8 does not change in the process of repeatedly performing the bonding operation, and stable vibration characteristics are maintained. Further, since the heater 19 and the thermocouple 20 are not firmly fixed to the horn 8, the ultrasonic vibration is not directly transmitted to the heater 19 and the thermocouple 20. For this reason, the heater 19 and the thermocouple 20 are less likely to be damaged due to vibration, and the life of the parts of the heater 19 and the thermocouple 20 can be extended.

  As a method for holding the heater 19 and the thermocouple 20 to the horn 8, at the position of the rib 8c for mounting the horn, that is, at the position of the node of the standing wave vibration induced in the horn 8 by the vibrator 11, the heater 19, The thermocouple 20 may be fixed to the horn 8 with a set bolt. According to this method, since the heater 19 and the thermocouple 20 are in contact with the horn 8 at a position where the amplitude of the standing wave vibration is minimized, transmission of ultrasonic vibration to the heater 19 and the thermocouple 20 is suppressed as much as possible. Can do.

  Next, the longitudinal arrangement of the heater 19 in the horn 8 will be described with reference to FIG. In FIG. 6, a curve b is a graph qualitatively showing the temperature distribution in the longitudinal direction of the convex portion 9 a provided with the bonding action portion 10. That is, in the horn 8, the left side from the center of the bonding portion 10 is cooled by the air blown from the slit 8 e, so that the temperature distribution of the horn 8 does not become a uniform temperature distribution along the longitudinal direction, and is like a curve b. The temperature on the left side tends to be lower than the temperature on the right side.

  When a temperature gradient is generated in the horn 8 in this way, the thermal deformation of the horn 8 is not uniform in the longitudinal direction, and exhibits a thermal deformation behavior in which the convex portion 9a is slightly inclined. As a result, the bonding operation portion 10 is not correctly leveled, and the semiconductor chip 4 and the contact surface 10a are likely to come into contact with each other in the bonding operation, resulting in a deterioration in bonding quality due to a poor pressing posture. Therefore, the temperature distribution of the horn 8 is required to be as uniform as possible along the longitudinal direction.

  For this reason, in the present embodiment, as shown in FIG. 6, the arrangement of the heater 19 in the horn 8 in the longitudinal direction is on the left side (slit 8e side) from the center line CL indicating the center in the longitudinal direction of the bonding action portion 10. I try to bias it. That is, the heater 19 is arranged so as to be biased closer to the vibrator 11 than the center line CL, and the center position (heating center 19c) of the curve c indicating the heating distribution in the longitudinal direction of the heater 19 is more than the center line CL. The heaters 19 are biased so as to be located closer to each other. Thereby, when the heater 19 is operated, the heating by the heater 19 is performed biased to the left side of the center line CL. As a result, the temperature gradient of the horn 8 caused by the cooling action of the slit 8e is corrected, and the contact surface 10a of the joining action part 10 can be kept as horizontal as possible during heating.

  Even when the heating means is arranged substantially symmetrically with respect to the center line CL, the cooling action of the slit 8e is achieved by heating the portion near the cooling means of the heating means with a larger output than the other parts. The temperature gradient of the horn 8 due to the above can be corrected. In this case, it is desirable to use a plurality of (for example, two) heaters 19 as heating means because temperature control becomes easy.

Next, the mounting of the vibrator 11 will be described with reference to FIG. As described above, the vibrator 11 is bolted to the end of the horn 8 via the spacer 12. That is, as shown in FIG. 7A, the male screw portion 11 b of the vibrator 11 is screwed to the female screw portion 8 i provided on the end face of the horn 8 and fastened. At this time, as shown in FIG. 7B, the thickness t of the spacer 12 is set so that the connection electrode 11a protruding from the side surface of the vibrator 11 protrudes in the horizontal direction as much as possible.

  That is, since the vibrator 11 and the horn 8 are manufactured separately, the electrode 11a is not necessarily in the state shown in FIG. 7 in a state where the male screw portion 11b is screwed into the female screw portion 8i and tightened with a necessary fastening torque. As shown in FIG. 7C, the vibrator 11 may be fastened to the horn 8 with the electrode 11a protruding in the vertical direction. In such a case, there is a problem that the electrode 11a interferes with the substrate 3 during the bonding operation, and a normal bonding operation cannot be performed.

  For this reason, in assembling the bonding tool 7 of the present embodiment, the thickness t of the spacer 12 is determined according to the combination of the individual vibrators 11 and the horns 8. Specifically, a plurality of types of spacers 12 having different thicknesses t are prepared in advance, and the electrode 11a protrudes in the horizontal direction in a state where the male screw portion 11b is fastened to the female screw portion 8i with a required torque. A spacer 12 having a thickness is selected. Thereby, the malfunction that the electrode 11a interferes with the board | substrate 3 can be prevented reliably.

  Next, with reference to FIG. 8, the coupling | bonding method in the case of couple | bonding thin plate members, such as the bracket 26, with block-shaped members, such as the raising / lowering block 6 and the horn 8, is demonstrated. In the bonding tool 7, it is necessary to fix a thin plate member such as a bracket 26 to the elevating block 6 or the horn 8 as shown in FIG. 8A in order to hold the above-described lead wires 22 and 23 and other wirings. There is.

  FIG. 8A shows an example in which the bracket 26 is screwed to the elevating block 6 with bolts 28. At this time, when a thin plate member is coupled to these members to which ultrasonic vibrations are transmitted, the thin plate member resonates and an abnormal vibration sound (so-called “billing sound”) is generated. There is. In the bonding tool 7 of the present embodiment, a bonding method as shown in FIG. 8B is employed to prevent such a problem. That is, the washer 27 is interposed between the lifting block 6 and the bracket 26 so that the bracket 26 does not directly contact the lifting block 6 at a portion other than the washer 27.

  Desirably, a buffer material 29 such as a thin resin film is sandwiched in the middle portion of the screw fastening position by the bolt 28. Thus, in a state where the bolt 28 is tightened and the bracket 26 is fixed to the lifting block 6, vibration is not directly transmitted from the lifting block 6 to the bracket 26 and resonates, thereby preventing the occurrence of abnormal vibration noise. it can. Such a coupling method is also employed when a thin plate member is directly coupled to the horn 8.

  The bonding apparatus and the bonding tool of the present invention have an effect of realizing a compact and low-cost bonding apparatus with excellent temperature control accuracy, and a bonding object such as a semiconductor element is bonded to a substrate as a bonded surface by bonding. It is useful for applications that

The front view of the bonding apparatus of one embodiment of this invention The front view of the bonding tool of one embodiment of the present invention The top view of the bonding tool of one embodiment of the present invention The fragmentary sectional view of the bonding tool of one embodiment of the present invention The side view of the bonding tool of one embodiment of the present invention Explanatory drawing of the heating state in the bonding tool of one embodiment of the present invention Explanatory drawing of the mounting state of the vibrator in the bonding tool of one embodiment of the present invention Explanatory drawing of the combined state of the plate-shaped member in the bonding tool of one embodiment of this invention

Explanation of symbols

DESCRIPTION OF SYMBOLS 3 Substrate 4 Semiconductor chip 5 Elevating and pressing mechanism 6 Elevating block 7 Bonding tool 8 Horn 8e Slit 8g, 8h Mounting hole 9a Convex part 10 Joining action part 11 Vibrator 19 Heater 20 Thermocouple 22 First lead wire 23 Second lead Lead wire 26 Bracket

Claims (2)

A bonding apparatus for bonding a bonding target to a surface to be bonded while applying a load and vibration to the bonding target, and a bonding tool that contacts the bonding target, and pressing the bonding tool against the bonding target The bonding tool includes a horizontally long horn, a vibrator that applies longitudinal vibration to the horn in a first direction along a longitudinal direction of the horn, and the first direction from the horn. A projecting portion that protrudes in a second direction perpendicular to each other, a joining operation portion that is provided at an end portion of the projecting portion and that abuts on the object to be joined, and is provided on the horn and heats the joining operation portion. A heating means, and a temperature measuring means provided inside the horn for measuring the temperature of the joining portion, the temperature measuring means being rod-shaped, and provided before the horn is provided along the first direction. It is inserted in movable loose state with a gap between the not fixed to the horn large inner diameter of the mounting hole than the outer diameter and the inner surface of the mounting hole of the temperature measuring means, and said temperature measuring means so as to prevent falling off from the mounting hole by the stiffness of the second lead, the opening end of the mounting hole, bonding, characterized in that for elastically supporting the second lead wire to the horn by a plug apparatus. A bonding tool that joins an object to be joined to a surface to be joined while applying a load and vibration to the object to be joined. The bonding tool includes a horizontally long horn and a longitudinal direction of the horn with respect to the horn. A vibrator that imparts longitudinal vibration in the first direction, a convex portion that protrudes from the horn in a second direction substantially orthogonal to the first direction, and the joint provided at an end of the convex portion A bonding action part that comes into contact with an object, a heating means that is provided in the horn and heats the bonding action part, and a temperature measuring means that is provided inside the horn and measures the temperature of the bonding action part, The temperature measuring means is rod-shaped and is not fixed to the horn in the mounting hole having an inner diameter larger than the outer diameter of the temperature measuring means provided along the first direction in the horn. Free to move with a gap Is inserted over's condition, and the temperature measuring means so as to prevent falling off from the mounting hole by the stiffness of the second lead, the opening end of the mounting hole, the second lead wire A bonding tool characterized by elastically supporting the horn by a plug .

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