JP3525866B2 - Electronic component bonding apparatus and bonding tool - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component bonding apparatus and a bonding tool for bonding an electronic component such as an electronic component with a bump such as a flip chip to a surface to be joined such as an electrode of a substrate.

[0002]

2. Description of the Related Art As a method of bonding an electronic component to a surface to be bonded such as an electrode of a substrate, a method using ultrasonic pressure welding is known. In this method, ultrasonic vibration is applied to the electronic component while pressing the electronic component against the surfaces to be joined, and the joint surfaces are caused to vibrate slightly to generate friction, thereby bringing the joint surfaces into close contact with each other. The bonding tool used in this method has a horn, which is an elongated rod body that transmits the vibration of an ultrasonic oscillator, which is a vibration source, to electronic components. Electronic components are bonded to the surfaces to be joined by pressure bonding while applying load and vibration to the components.

Since a load (load and vibration) upon bonding acts on the crimping element, its lower surface (adsorption surface of electronic parts) is easily worn by repeated use. If this wear becomes severe, normal bonding cannot be performed, so the crimps must be replaced regularly. Therefore, in a bonding tool for ultrasonic bonding, it is generally used to avoid waste of replacing the entire horn and replace the crimping member with another part that is detachable from the horn body. There is.

As an example of a structure in which such a crimping member is provided as a separate component, a horn is provided with a concave tapered surface, and a crimping member having a projecting tapered surface that fits into this tapered surface is fastened to the horn body with a screw. A method for doing so is known (Japanese Patent Laid-Open No. Hei 1)
0-52768 gazette 8th Embodiment shown in FIG. 8). In this method, a crimping element is screwed to the main body and a pressing force is applied to the tapered surface to bring the contact surface into close contact.

[0005]

However, the method of screwing the crimping element through the tapered surface has the following problems. In a bonding tool in which the crimping piece is a separate component, it is necessary to firmly press the crimping piece against the horn body and maintain a good contact state in order to ensure good vibration transmission characteristics.

However, in recent years, electronic parts have been downsized, and along with this, the bonding tool used for bonding electronic parts has also been downsized, and the rigidity of the horn has been reduced. If a large fastening force is applied to the horn having such a small rigidity to realize a strong contact state, the horn is likely to be deformed. Since it is necessary to maintain a highly accurate posture for crimping electronic components, even a slight deformation of the horn adversely affects the posture accuracy during bonding and the vibration characteristics of the horn, and as a result the bonding quality cannot be ensured. .

As described above, the conventional bonding tool has a problem that it is difficult to secure good bonding quality when the crimping element as a consumable part is a separate part for the purpose of cost reduction. It was

[0008] Therefore, an object of the present invention is to provide a bonding apparatus and a bonding tool for electronic parts, which can perform stable bonding while performing stable vibration at low cost.

[0009]

According to a first aspect of the present invention, there is provided an electronic component bonding apparatus for crimping an electronic component onto a surface to be joined while applying load and vibration to the electronic component. A bonding tool that comes into contact with the electronic component and a pressing unit that presses the bonding tool against the electronic component are provided. The bonding tool includes a horizontally long horn, a vibrator that applies vibration to the horn, and a horn of the horn. A first groove provided on the surface on the pressure-bonding side and having a pair of tapered surfaces; a second groove provided on the surface opposite to the first groove and having a pair of tapered surfaces;
A crimping member having a convex tapered surface that comes into contact with the tapered surface of the groove of and a joining action portion that projects to the opposite side of the convex tapered surface;
A fitting member having a convex tapered surface that abuts the tapered surface of the second groove, a through hole provided through the first groove and the second groove, and the crimper through the through hole. And the fitting member are joined together, and the convex tapered surface of the crimping element is closely attached to the tapered surface of the first groove, and the convex tapered surface of the fitting member is closely attached to the tapered surface of the second groove. And a fastening means for allowing the fastening.

According to a second aspect of the present invention, there is provided a bonding tool for an electronic component, which is a bonding tool for crimping the electronic component to a surface to be bonded while applying a load and a vibration to the electronic component. A first groove having a pair of tapered surfaces provided on the surface of the horn on the pressure-bonding side, and a first groove having a pair of tapered surfaces provided on the surface opposite to the first groove. No. 2 groove, a convex taper surface that comes into contact with the tapered surface of the first groove, and a crimp having a joining action portion that projects to the opposite side of this convex tapered surface, and comes into contact with the tapered surface of the second groove While fitting the fitting member having the convex tapered surface, the through hole provided through the first groove and the second groove, and the crimping member and the fitting member through the through hole, The convex taper surface of the pressure A convex tapered surface of the fitting member and a fastening means for contact respectively the tapered surface of the groove.

According to the present invention, the first groove and the second groove each having a pair of tapered surfaces are provided on the pressure-bonding side surface and the opposite surface of the horn, and the tapered surface of the first groove and the second groove are provided. The crimping member and the fitting member, each having a convex tapered surface, are pressed against the taper surface of the groove by the fastening means to be in close contact with each other, so that the fastening force for fixing the crimper to the horn acts vertically symmetrically. Therefore, it is possible to prevent the horn from being deformed due to the biased fastening force.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments of the present invention will be described with reference to the drawings. 1 is a front view of a bonding apparatus for an electronic component according to an embodiment of the present invention, FIG. 2 is a vertically inverted perspective view of a bonding tool for an electronic component according to an embodiment of the present invention, and FIG. FIG. 4 is a front view of a bonding tool for an electronic component according to this embodiment, and FIGS. 4 and 5 are partial cross-sectional views of the bonding tool for an electronic component according to an embodiment of the present invention.

First, the overall structure of a bonding apparatus for electronic components will be described with reference to FIG. Reference numeral 1 denotes a support frame, on the front surface of which a first elevating plate 2 and a second elevating plate 3 are vertically movable. A cylinder 4 is mounted on the first lifting plate 2, and a rod 5 of the cylinder 4 is connected to the second lifting plate 3. A bonding head 10 is attached to the second lift plate 3. A Z-axis motor 6 is provided on the upper surface of the support frame 1. Z-axis motor 6 has vertical feed screw 7
To rotate. The feed screw 7 is screwed into a nut 8 provided on the back surface of the first elevating plate 2. Therefore, when the Z-axis motor 6 is driven and the feed screw 7 rotates, the nut 8 moves up and down along the feed screw 7, and the first lifting plate 2 and the second lifting plate 3 are moved.
Also moves up and down.

In FIG. 1, a substrate 46 whose upper surface is a surface to be joined of an electronic component is placed on a substrate holder 47,
The substrate holder 47 is placed on the table 48. The table 48 is a movable table, and horizontally moves the substrate 46 in the X direction and the Y direction to position the substrate 46 at a predetermined position. The table 48 is the substrate 4 for the electronic component 40.
It is a positioning means for moving the 6 relatively.

Reference numeral 42 denotes a camera, which is a uniaxial table 43.
Is attached to. A lens barrel 44 extends forward from the camera 42. The camera 42 is moved forward along the uniaxial table 43, and the tip of the lens barrel 44 is adsorbed and held on the lower surface of the bonding tool 14 as shown by the chain line to hold the bumped electronic component 40 and the substrate 46. The position of the electronic component 40 and the substrate 46 is observed by the camera 42 in this state.

A recognition unit 53 recognizes the images of the electronic component 40 and the substrate 46 picked up by the camera 42 and detects their positions. Reference numeral 50 denotes a main control unit that controls the vertical movement of the Z-axis motor 6, that is, the bonding head 10 via a motor drive unit 51, and positions the table 48, that is, the substrate 46, via the table control unit 52. Further, the main control unit 50 calculates the positional deviation between the electronic component 40 and the substrate 46 in the horizontal plane from the positions detected by the recognition unit 53, and drives the table 48 so as to correct the positional deviation. Further, the load control unit 54 and the suction device 56 are connected to the main control unit 50.

The cylinder 4 as the pressing means is connected to the main control unit 50 via the load control unit 54, and the projection output of the rod 5 of the cylinder 4, that is, the bonding tool 1
At 4, the pressing load for pressing the bump of the electronic component 40 against the substrate 46 is controlled. The suction device 56 receives the command from the main control unit 50, and the electronic component 4 by the bonding tool 14
Performs suction / release of 0. The transducer 17, which is an ultrasonic transducer, is connected to the main controller 5 via the ultrasonic transducer driver 55.
0, and performs ultrasonic vibration according to a command from the main control unit 50.

A holder 12 is connected to the lower end of the main body 11 of the bonding head 10. A block 13 is attached to the holder 12, and a bonding tool 14 is fixed to the block 13. The protrusion 13 a on the side of the block 13 is connected to the suction device 56. The bonding tool 14 will be described below with reference to FIGS. 2 and 3.

As shown in FIGS. 2 and 3, the bonding tool 14 is mainly composed of a horizontally long horn 15. The horn 15 is an elongated rod-shaped body, and has a tapered surface 1 that gradually narrows from both sides toward the center in plan view.
5a. At the center of the horn 15, the suction part 3
No. 0 (compressor) projects downward and is detachably attached.

In FIG. 1, a suction pad 19 is attached to the protrusion 13a provided on the side surface of the block 13. The horn 15 is formed with vacuum suction holes 16a and 16b communicating with the suction holes 32 of the suction unit 30, and the suction pad 19 is in contact with the vacuum suction hole 16b on the upper surface of the horn 15. Therefore, by driving the suction device 56 (FIG. 1) connected to the suction pad 19 to suck air,
Vacuum suction can be performed from the suction holes 32 (FIG. 3B) opened in the suction unit 30, and the electronic component 40 with bumps can be vacuum-held and held on the lower surface of the suction unit 30.

The lower part of the suction part 30 is a joining action part 30a protruding downward, and the bending vibration of the suction part 30 and the pressing load of the pressing means (cylinder 4) act on the electronic component 40. The suction unit 30 sucks and holds the electronic component 40, and at the time of bonding, the bonding action unit 30a contacts the upper surface of the electronic component 40 and presses the electronic component 40 against the substrate 46.

Ribs 15c are provided integrally with the horn 15 at four locations equidistant from the suction portion 30. In order to improve the mounting balance on the block 13, the four ribs 15c are provided so as to project symmetrically in a plan view with the suction portion 30 at the center of the horn 15 as the center. The bonding tool 14 is detachably mounted on the lower surface of the block 13 by screwing a bolt into the through hole 20 formed in the rib 15c.

In FIG. 2, a vibrator 17 as a vibration imparting means is attached to the side end of the horn 15. By driving the vibrator 17, longitudinal vibration (vibration in the longitudinal direction of the horn 15) is applied to the horn 15, and the suction portion 30 vibrates in the horizontal direction a (the longitudinal direction of the horn 15). Figure 3
As shown in (a) and (b), the horn 15 has a shape in which the width and height are sequentially reduced from both ends toward the center through the side tapered surface 15a and the upper and lower tapered surfaces 15b. Has become.

As a result, the amplitude of ultrasonic vibration is amplified in the path transmitted from the vibrator 17 to the suction unit 30,
Vibration having an amplitude equal to or larger than the vibration of the vibrator 17 is transmitted to the suction portion 30, and this vibration is transmitted to the electronic component 40 via the joining action portion 30a. In transmitting the vibration to the electronic component 40, not only the longitudinal vibration transmitted by the vibrator 17 via the horn 15, but also the bending vibration induced in the protruding suction portion 30 by the longitudinal vibration of the horn 15 is superimposed. Be transmitted.

Next, the mounting of the suction portion 30 on the horn 15 will be described with reference to FIGS. As shown in FIG. 4, a first groove 15d having a pair of left and right convex tapered surfaces 15e is provided on the lower surface of the central portion of the horn 15, that is, the surface on the crimping side. In addition, on the surface opposite to the first groove 15d, left and right 1
A second groove 15f having a pair of convex tapered surfaces 15g is provided. The convex taper surface 30c provided on the upper portion of the suction portion 30 (on the opposite side of the joining action portion 30a) contacts the convex taper surface 15e of the first groove 15d. Also, the second
The convex tapered surface 15a of the groove 15f is in contact with the convex tapered surface 34a of the fitting member 34 having the fastening hole 34b in the vertical direction.

The central position of the horn 15, that is, the horn 1.
In the position corresponding to the antinode of the standing wave vibration induced by the vibrator 17 in FIG. 5, a through hole 15h is provided penetrating the first groove 15d and the second groove 15f. The suction member 30 and the fitting member 34 are fixed and fastened to the horn 15 using the screw member 3
3 is inserted through the fastening hole 34b of the fitting member 34 and the through hole 15h of the horn 15, and the outer screw portion 33 of the screw member 33 is inserted.
It is performed by screwing a into an inner threaded portion 30b formed on the suction portion 30 and tightening the screwed portion.

That is, the screw member 33 has a through hole 15h.
The suction part 30 and the fitting member 34 are coupled to each other via the convex grooved surface 15e of the first groove 15d and the convex taper surface 30c of the suction part 30 to the convex grooved surface of the second groove 15f. The convex tapered surface 3 of the fitting member 34 with respect to the tapered surface 15g
It serves as a fastening means for bringing the 4a into close contact with each other.

A vacuum suction hole 16a provided inside the horn 15 is opened at an intermediate portion of the through hole 15h, and inside the screw member 33, a suction hole is opened at a side surface of the intermediate portion and communicates with a lower end portion. 33b is formed. When the suction portion 30 is fastened, as shown in FIG. 5, the vacuum suction hole 16 a is attached to the suction portion 30 via the suction hole 33 b provided in the screw member 33.
Of the suction holes 32.

In the fastening by the screw member 33, the suction portion 30 is pressed against the convex taper surface 15e of the first groove 15d, and the fitting member 34 is convex taper of the second groove 15f. It is fastened while being pressed against the surface 15g. Since the first groove 15d and the second groove 15f have substantially the same shape, in the state where the suction member 30 and the fitting member 34 are fastened to the horn 15 from above and below by the screw member 33, A fastening external force that is substantially vertically symmetrical acts on the horn 15.

Therefore, even when the screw member 33 is tightened with a large fastening force in a bonding tool using a horn having small rigidity for small parts,
The horn 15 is not vertically deformed by the external fastening force. That is, in the bonding tool using the detachable suction unit 30, it is possible to achieve both strong fastening of the suction unit 30 to the horn 15 and high shape accuracy in the mounted state of the suction unit 30.

Further, by appropriately setting the shapes and dimensions of the fitting member 34 and the screw member 33 that project upward from the horn 15, the shape and dimensions of the suction portion 30 can be adjusted. It is possible to adjust the directional mass distribution to a desired mass distribution in terms of vibration transfer characteristics. That is, the fitting member 34 and the screw member 33 can be used as the mass balance portion, and thus good vibration characteristics can be obtained.

In this embodiment, as the shape of the horn 15, a medium-thin shape whose height and width are gradually tapered toward the center is used, but other shapes such as a parallel shape and a cylindrical shape are used. The present invention can be applied to the horn.

[0033]

According to the present invention, a first groove and a second groove each having a pair of taper surfaces are provided on the crimping side surface and the opposite surface of the horn. Since the crimping member and the fitting member each having a convex tapered surface are pressed against the taper surface of the groove 2 by the fastening means so as to be in close contact, the fastening force for fixing the crimping finger to the horn is vertically symmetrical. It is possible to prevent the deformation of the horn due to the biased fastening force.

[Brief description of drawings]

FIG. 1 is a front view of an electronic component bonding apparatus according to an embodiment of the present invention.

FIG. 2 is an upside down perspective view of a bonding tool for an electronic component according to an embodiment of the present invention.

FIG. 3 is a front view of a bonding tool for electronic components according to an embodiment of the present invention.

FIG. 4 is a partial sectional view of a bonding tool for an electronic component according to an embodiment of the present invention.

FIG. 5 is a partial cross-sectional view of a bonding tool for electronic components according to an embodiment of the present invention.

[Explanation of symbols]

14 Bonding tool 15 horn 15d first groove 15e Convex taper surface 15f second groove 15g convex taper surface 15h through hole 16a, 16b Vacuum suction hole 17 oscillators 30 Adsorption part 30a Joining action part 32 suction holes 33 Screw member 34 Fitting member 40 electronic components

─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Takatoshi Ishikawa 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (56) Reference JP 2000-174069 (JP, A) JP 11-345819 (JP, A) JP 2001-35888 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) H01L 21/60 311

Claims (2)

(57) [Claims] 1. A bonding apparatus for an electronic component, wherein an electronic component is pressure-bonded to a surface to be joined while a load and vibration are applied to the electronic component, the bonding tool being in contact with the electronic component, and the bonding tool being the electronic component. And a pressing means for pressing the component, the bonding tool,
A horizontally long horn, a vibrator for imparting vibration to the horn, a first groove having a pair of tapered surfaces provided on the pressure-bonding side surface of the horn, and a surface opposite to the first groove. A second groove having a pair of tapered surfaces, a convex tapered surface that abuts the tapered surface of the first groove, and a crimping member that has a joining action portion that projects to the opposite side of the convex tapered surface; A fitting member having a convex tapered surface that abuts the tapered surface of the second groove, a through hole provided through the first groove and the second groove, and the crimping member through the through hole. The convex taper surface of the crimping member is brought into close contact with the taper surface of the first groove and the convex taper surface of the fitting member is brought into close contact with the taper surface of the second groove, respectively. An electronic component bonding apparatus comprising: a fastening means. 2. A bonding tool for crimping an electronic component to a surface to be joined while applying load and vibration to the electronic component, which is a horizontally long horn, a vibrator for applying vibration to the horn, and a horn of the horn. A first groove provided on the surface on the pressure-bonding side and having a pair of tapered surfaces; a second groove provided on the surface on the opposite side of the first groove and having a pair of tapered surfaces; A crimping member having a convex tapered surface that abuts the tapered surface and a joining action portion that projects to the opposite side of the convex tapered surface, and a fitting member that has a convex tapered surface that abuts the tapered surface of the second groove. , A through hole provided through the first groove and the second groove, and the crimping member and the fitting member are coupled through the through hole, and with respect to the tapered surface of the first groove. The convex tapered surface of the crimping element is set to the convex tapered surface of the fitting member with respect to the tapered surface of the second groove. A bonding tool for electronic parts which is characterized in that a fastening means for contact respectively.