JP3525892B2 - Bonding device and bonding tool for electronic components - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component bonding apparatus and a bonding tool for bonding an electronic component such as a bumped electronic component to a surface to be bonded such as an electrode of a substrate.

[0002]

2. Description of the Related Art As a method of bonding an electronic component to a surface to be bonded such as an electrode of a substrate, a method using ultrasonic pressure welding is known. In this method, ultrasonic vibration is applied to the electronic component while pressing the electronic component against the surfaces to be joined, and the joint surfaces are caused to vibrate slightly to generate friction, thereby bringing the joint surfaces into close contact with each other. The bonding tool used in this method has a horn that is an elongated rod body that transmits the vibration of the ultrasonic vibrator, which is the vibration source, to the electronic components. While applying load and vibration to the electronic component, the electronic component is pressure-bonded to the surfaces to be bonded for bonding.

Since a load (load and vibration) at the time of bonding acts on the joining action portion, the contact surface with the electronic component is easily worn by repeated use. For this reason, the joining action portion is configured to be attachable to and detachable from the horn, and only the joining action portion is replaced when the component is worn due to wear. In general, it is desirable to use a material having a high hardness and a high toughness, such as a cemented carbide, for the joining action portion, for the purpose of realizing wear resistance and firm fastening to the horn.

[0004]

However, depending on the type of electronic component, the quality of the joint may depend on the nature of the contact surface of the joint acting portion that contacts the electronic component. For example, in the case of an electronic component having a non-smooth surface, if the joining action part made of a high hardness material as described above is used, slippage occurs on the abutting surface and vibration cannot be transmitted well. In order to eliminate this difficulty, if a soft material that does not easily slip on the contact surface with the electronic component is used as the material of the replaceable joint action part, the contact surface of the mounting part to the horn is deformed by the fastening load. However, the firm fastening is hindered and the reproducibility of the vibration transfer characteristics cannot be ensured.

As described above, in the bonding tool used in the conventional bonding apparatus, the reproducibility of the vibration transfer characteristic from the horn to the joining action portion and the joining action portion are caused due to the material setting of the replaceable joining action portion. However, there is a problem in that vibration transmission from the electronic component to the electronic component is not ensured and the joining quality is not stable.

Therefore, an object of the present invention is to provide a bonding apparatus and a bonding tool for an electronic component which can ensure stable vibration transmission at low cost and can perform stable quality bonding.

[0007]

According to a first aspect of the present invention, there is provided an electronic component bonding apparatus for crimping an electronic component onto a surface to be joined while applying load and vibration to the electronic component. A bonding tool that comes into contact with the electronic component and a pressing unit that presses the bonding tool against the electronic component are provided. The bonding tool includes a horizontally long horn, a vibrator that applies vibration to the horn, and a horn of the horn. The electronic component has a joining action portion that is detachably fastened to a position corresponding to an antinode of standing wave vibration and that applies load and vibration to the electronic component. The joining action portion is made of a hard material and fastened to the horn. The main body portion and the abutting portion which is made of a metal material softer than the hard material and extends downward from the main body portion to come into contact with an electronic component.

According to a second aspect of the present invention, there is provided a bonding tool for an electronic component, which is a bonding tool for crimping the electronic component to a surface to be bonded while applying a load and a vibration to the electronic component. And a joining action part that is detachably fastened to a position corresponding to an antinode of standing wave vibration of the horn and applies load and vibration to the electronic component. The main body portion is made of a hard material and is fastened to the horn, and the contact portion is made of a metal material that is softer than the hard material and extends downward from the main body portion to abut an electronic component.

According to the present invention, the joining action portion that is detachably fastened to the horn is composed of a main body portion made of a hard material and fastened to the horn, and a metal material softer than the hard material, which is located below the main body portion. By configuring with the contact portion that extends and contacts the electronic component, it is possible to maintain the vibration transmission characteristic from the horn to the joining action portion and ensure good vibration transmission of the contact surface with the electronic component. .

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments of the present invention will be described with reference to the drawings. 1 is a front view of a bonding apparatus for an electronic component according to an embodiment of the present invention, FIG. 2 is a vertically inverted perspective view of a bonding tool for an electronic component according to an embodiment of the present invention, and FIG. FIG. 4 is a front view of a bonding tool for an electronic component according to this embodiment, and FIGS. 4 and 5 are partial cross-sectional views of the bonding tool for an electronic component according to an embodiment of the present invention.

First, the overall structure of an electronic component bonding apparatus will be described with reference to FIG. Reference numeral 1 denotes a support frame, on the front surface of which a first elevating plate 2 and a second elevating plate 3 are vertically movable. A cylinder 4 is mounted on the first lifting plate 2, and a rod 5 of the cylinder 4 is connected to the second lifting plate 3. A bonding head 10 is attached to the second lift plate 3. A Z-axis motor 6 is provided on the upper surface of the support frame 1. Z-axis motor 6 has vertical feed screw 7
To rotate. The feed screw 7 is screwed into a nut 8 provided on the back surface of the first elevating plate 2. Therefore, when the Z-axis motor 6 is driven and the feed screw 7 rotates, the nut 8 moves up and down along the feed screw 7, and the first lifting plate 2 and the second lifting plate 3 are moved.
Also moves up and down.

In FIG. 1, a substrate 46 whose upper surface is a surface to be joined of an electronic component is placed on a substrate holder 47,
The substrate holder 47 is placed on the table 48. The table 48 is a movable table, and horizontally moves the substrate 46 in the X direction and the Y direction to position the substrate 46 at a predetermined position. The table 48 is the substrate 4 for the electronic component 40.
It is a positioning means for moving the 6 relatively.

Reference numeral 42 denotes a camera, which is a uniaxial table 43.
Is attached to. A lens barrel 44 extends forward from the camera 42. The camera 42 is moved forward along the uniaxial table 43, and the tip of the lens barrel 44 is adsorbed and held on the lower surface of the bonding tool 14 as shown by the chain line to hold the bumped electronic component 40 and the substrate 46. The position of the electronic component 40 and the substrate 46 is observed by the camera 42 in this state.

A recognition unit 53 recognizes the images of the electronic component 40 and the substrate 46 picked up by the camera 42 and detects their positions. Reference numeral 50 denotes a main control unit that controls the vertical movement of the Z-axis motor 6, that is, the bonding head 10 via a motor drive unit 51, and positions the table 48, that is, the substrate 46, via the table control unit 52. Further, the main control unit 50 calculates the positional deviation between the electronic component 40 and the substrate 46 in the horizontal plane from the positions detected by the recognition unit 53, and drives the table 48 so as to correct the positional deviation. Further, the load control unit 54 and the suction device 56 are connected to the main control unit 50.

The cylinder 4 as the pressing means is connected to the main controller 50 via the load controller 54, and the projection output of the rod 5 of the cylinder 4, that is, the bonding tool 14 is connected.
Thus, the pressing load for pressing the bumps of the electronic component 40 against the substrate 46 is controlled. The suction device 56 receives the command from the main control unit 50, and the electronic component 40 by the bonding tool 14
Suction and release of suction. The oscillator 17 is connected to the main control unit 50 via the ultrasonic oscillator drive unit 55, and performs ultrasonic vibration according to a command from the main control unit 50.

A holder 12 is connected to the lower end of the main body 11 of the bonding head 10. A block 13 is attached to the holder 12, and a bonding tool 14 is fixed to the block 13. The protrusion 13 a on the side of the block 13 is connected to the suction device 56. The bonding tool 14 will be described below with reference to FIGS. 2 and 3.

As shown in FIGS. 2 and 3, the bonding tool 14 mainly includes a horizontally long horn 15. The horn 15 is an elongated rod-shaped body, and has a tapered surface 1 that gradually narrows from both sides toward the center in plan view.
5a. At the center of the horn 15, a joining acting portion 30 (compressor) is detachably attached so as to project downward. In FIG. 1, a suction pad 19 is attached to the protrusion 13 a provided on the side surface of the block 13.

The horn 15 has a suction hole 3 of the joining action portion 30.
2 are formed with vacuum suction holes 16a and 16b, and the suction pad 19 serves as the vacuum suction hole 1 on the upper surface of the horn 15.
6b is fitted. Therefore, by sucking air by driving the suction device 56 (FIG. 1) connected to the suction pad 19, vacuum suction is performed from the suction hole 32 (FIG. 5) opened in the joining action portion 30. The electronic component 40 with bumps can be vacuum-sucked and held on the lower surface of the.

The joining acting portion 30 is a main body portion 3 as will be described later.
0a and the contact portion 30 protruding downward from the body portion 30a
b and vibration and pressing means (cylinder 4)
The pressing load is applied to the electronic component 40. Joining part 3
0 adsorbs and holds the electronic component 40, and at the time of bonding, the contact portion 30b contacts the upper surface of the electronic component 40 and presses the electronic component 40 against the substrate 46.

Ribs 15c are provided integrally with the horn 15 at four locations that are equidistant from the joining action portion 30. In order to improve the mounting balance on the block 13, the four ribs 15c are provided so as to project symmetrically in a plan view with the joining action portion 30 at the center of the horn 15 as the center. The bonding tool 14 is detachably mounted on the lower surface of the block 13 by screwing a bolt into the through hole 20 formed in the rib 15c.

In FIG. 2, a vibrator 17 as a vibration applying means is mounted on the side end of the horn 15. By driving the vibrator 17, longitudinal vibration (vibration in the longitudinal direction of the horn 15) is applied to the horn 15, and the bonding action portion 3
0 vibrates in the horizontal direction a (longitudinal direction of the horn 15).
As shown in FIGS. 3 (a) and 3 (b), the shape of the horn 15 is gradually narrowed in width and height from both ends toward the center through the side tapered surface 15a and the upper and lower tapered surfaces 15b. It has a shape.

As a result, the vibrating element 17 is connected to the joining action portion 3
The amplitude of the ultrasonic vibration is amplified in the path transmitted to 0, and the vibration having the amplitude equal to or larger than the vibration of the vibrator 17 is transmitted to the bonding action portion 30, and this vibration is transmitted to the electronic component 40 via the contact portion 30b. Transmitted. In transmitting the vibration to the electronic component 40, not only the longitudinal vibration transmitted by the vibrator 17 via the horn 15, but also the bending vibration induced in the protruding joining action portion 30 by the longitudinal vibration of the horn 15 is superimposed. And then transmitted.

Next, with reference to FIG. 4 and FIG.
The configuration and attachment of the joining action portion 30 to the horn 15 will be described. As shown in FIG. 4 and FIG.
Reference numeral 0 is composed of a main body 30a attached to the horn 15 and an abutting portion 30b extending downward from the main body 30a and abutting on the upper surface of the electronic component 40. The main body 30a is a horn 1.
It is made of a cemented carbide, which is a hard material having high hardness and excellent toughness so that it can be firmly fastened with No. 5.

On the other hand, when selecting the material of the contact portion 30b, the compatibility with the electronic component 40 to be bonded is taken into consideration. The example shown in the present embodiment is intended for electronic components such as SAW filters, which are likely to cause slippage during transmission of vibration, and therefore stainless steel, which is a softer metal material than the cemented carbide used for the main body portion 30a. The material of is selected. At the contact portion 30b, the suction hole 32 has the contact portion 3
The contact surface 31 on the lower surface of 0b is opened.

As shown in FIG. 4, a horn 15 is provided at its center with a through hole 15h penetrating vertically.
The through hole 15h is provided in the horn 15 at a position corresponding to an antinode of standing wave vibration induced by the oscillator 17, and is orthogonal to the length direction of the horn 15. The through hole 15h is provided above and below the through hole 15h. Are provided with inner tapered portions 15g and 15e, respectively.

An inner screw portion 30c is provided on the upper surface of the main body portion 30a, and an outer peripheral surface of the inner screw portion 30c is an inner tapered portion 15e.
The outer taper portion 30d corresponds to. Fitting member 3
4 has an outer taper portion 34a that fits into the inner taper portion 15d, and the outer screw member 3 is fitted in the inner hole 34b of the fitting member 34.
3 is inserted. The main body portion 30a is provided below the outer screw member 33.
An outer threaded portion 33a that is screwed into the inner threaded portion 30c is provided. Inside the outer threaded member 33, a suction hole 33b that opens to the side surface of the intermediate portion and communicates with the lower end is formed.

When the joining action portion 30 is fastened, as shown in FIG. 5, the outer taper portion 30d of the body portion 30a is connected to the inner taper portion 1 as shown in FIG.
5e, with the outer tapered portion 34a of the fitting member 34 fitted to the inner tapered portion 15g, the outer screw member 33 is inserted into the inner hole 34b of the fitting member 34, and the outer screw portion 33a.
Is screwed into the inner threaded portion 30c of the body portion 30a and tightened. As a result, the outer taper portion 30d of the body portion 30a is pressed against the taper portion 15e of the horn 15 by the outer screw member 33 and fixedly fastened.

In the fastening with the outer screw member 33,
The outer tapered portion 34a of the fitting member 34 is fastened while being pressed against the inner tapered portion 15g. Therefore, the outer threaded portion 33a and the inner threaded portion 30c serve as fastening means for joining the joining action portion 30 and the fitting member 34 together.

When the joining action portion 30 and the fitting member 34 are fastened to the horn 15, the lower portion of the through hole 15h is formed by the body portion 30a of the joining action portion 30, and the upper portion is formed by the fitting member 34 and the outer screw member 33. Each is hermetically sealed, and an inner space 15i that is sealed at the top and bottom is formed inside the through hole 15h. A suction hole 16a is provided in the internal space 15i.
Is opened, and the internal space 15i is vacuumed by vacuum suction from the suction hole 16a. Further, when the outer screw member 33 is screwed into the inner screw portion 30c of the main body portion 30a, the suction hole 33b communicates with the suction hole 32 opened in the contact surface 31 of the joining action portion 30, and the suction hole 32 is the suction hole. 33b
Through the internal space 15i. That is, in this fastening state, the vacuum suction hole 16a provided in the horn 15
Communicate with the suction holes 32 through the internal space 15i.

By adopting the above configuration,
In the bonding tool in which the joining action section 30 is detachably replaceable, it is possible to always ensure good vibration transmission characteristics when the joining action section 30 is attached. That is, in the bonding tool shown in the present embodiment, as the material of the main body portion 30a to be fastened to the horn 15, a hard material such as cemented carbide that can be firmly fastened is used. Is fastened to the horn 15 with sufficient surface pressure.

As a result, even if the contact portion 30b of the joining action portion 30 is made of a soft metal material according to the type of the electronic component to be bonded, the joining action portion 30 is formed.
Insufficient fastening force, which occurs when the whole is made of a soft metal material, does not occur, and good vibration transmission characteristics can always be reproduced.

[0032]

According to the present invention, the joining action portion detachably fastened to the horn is composed of a main body portion made of a hard material and fastened to the horn, and a main body portion made of a metal material softer than the hard material. Since it is configured with the contact portion that extends downward and contacts the electronic component, it is possible to maintain the vibration transmission characteristic from the horn to the joining action portion and to ensure good vibration transmission of the contact surface with the electronic component. it can.

[Brief description of drawings]

FIG. 1 is a front view of an electronic component bonding apparatus according to an embodiment of the present invention.

FIG. 2 is an upside down perspective view of a bonding tool for an electronic component according to an embodiment of the present invention.

FIG. 3 is a front view of a bonding tool for electronic components according to an embodiment of the present invention.

FIG. 4 is a partial sectional view of a bonding tool for an electronic component according to an embodiment of the present invention.

FIG. 5 is a partial cross-sectional view of a bonding tool for electronic components according to an embodiment of the present invention.

[Explanation of symbols]

14 Bonding tool 15 horn 15h through hole 16a, 16b Vacuum suction hole 17 oscillators 30 Joint action part 30a main body 30b contact part 32 suction holes 40 electronic components 46 board

─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Makoto Okazaki 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (56) Reference JP-A-11-74315 (JP, A) JP-A-2000-91385 (JP, A) JP 2000-315708 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01L 21/60 311

Claims (2)

(57) [Claims] 1. A bonding apparatus for an electronic component, wherein an electronic component is pressure-bonded to a surface to be joined while a load and vibration are applied to the electronic component, the bonding tool being in contact with the electronic component, and the bonding tool being the electronic component. And a pressing means for pressing the component, the bonding tool,
A horizontally long horn, a vibrator that applies vibration to the horn, and a joining action portion that is detachably fastened to a position corresponding to an antinode of standing wave vibration of the horn and that applies load and vibration to the electronic component. The joining action portion has a main body portion made of a hard material and fastened to the horn, and a contact portion made of a metal material softer than the hard material and extending downward from the main body portion to come into contact with an electronic component. A bonding apparatus for electronic components, which is configured by: 2. A bonding tool for crimping an electronic component to a surface to be joined while applying load and vibration to the electronic component, which is a horizontally long horn, a vibrator for applying vibration to the horn, and a horn of the horn. The electronic component has a joining action portion that is detachably fastened to a position corresponding to an antinode of standing wave vibration and that applies load and vibration to the electronic component. The joining action portion is made of a hard material and fastened to the horn. An electronic component bonding tool, comprising: a main body portion; and an abutting portion which is made of a metal material softer than the hard material and extends downward from the main body portion to abut an electronic component.