JP2002043377A - Tool for ultrasonic oscillation bonding - Google Patents

Tool for ultrasonic oscillation bonding

Info

Publication number
JP2002043377A
JP2002043377A JP2000227813A JP2000227813A JP2002043377A JP 2002043377 A JP2002043377 A JP 2002043377A JP 2000227813 A JP2000227813 A JP 2000227813A JP 2000227813 A JP2000227813 A JP 2000227813A JP 2002043377 A JP2002043377 A JP 2002043377A
Authority
JP
Japan
Prior art keywords
tool
support portion
joining
bonding
slope
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000227813A
Other languages
Japanese (ja)
Other versions
JP3492298B2 (en
Inventor
Shigeru Sato
茂 佐藤
Seiya Nakai
誠也 中居
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Altecs Co Ltd
Original Assignee
Altecs Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Altecs Co Ltd filed Critical Altecs Co Ltd
Priority to JP2000227813A priority Critical patent/JP3492298B2/en
Priority to CA002314733A priority patent/CA2314733A1/en
Priority to TW089115331A priority patent/TW460345B/en
Priority to DE60003761T priority patent/DE60003761T2/en
Priority to US09/630,410 priority patent/US6247628B1/en
Priority to EP00116595A priority patent/EP1074330B1/en
Priority to CNB00122624XA priority patent/CN1173796C/en
Priority to KR10-2000-0044744A priority patent/KR100374077B1/en
Publication of JP2002043377A publication Critical patent/JP2002043377A/en
Application granted granted Critical
Publication of JP3492298B2 publication Critical patent/JP3492298B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75Apparatus for connecting with bump connectors or layer connectors

Abstract

PROBLEM TO BE SOLVED: To provide a tool for ultrasonic oscillation bonding which can be positioned accurately by remedying its defect that the tool is not positioned accurately in the lateral direction and, accordingly, the position of the tool is deviated from a pressurizing mechanism which raises and lowers a holder, and the tool becomes impossible of performing appropriate bonding. SOLUTION: Upper and lower clampers 21 and 22 hold the supporting section 4 of a resonator 1 between them from the upside and downside in a state where slopes 5 and 25 are brought into contact with each other, slopes 5 and 29 are also brought into contact with each other under the elastic action of an elastic body 33, and the lower clamper 22 positions the tool for ultrasonic oscillation boding by utilizing the wedging actions of the slopes 5, 25, and 29 which are in contact with each other even when the resonator 1 swells.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、複数の重ね合され
た接合対象部材を超音波振動で接合するためのツールに
関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a tool for joining a plurality of members to be joined by ultrasonic vibration.

【0002】[0002]

【従来の技術】図9は特開平11−307583号会報
で開示された共振器の支持装置の外観を示す。図9にお
いて、ツール101の最小振動振幅点より外側に突出さ
れた支持部102がツール101の接合作用面103と
平行な平坦面104を備え、加圧機構の可動端に装着さ
れたホルダ105が支持部102の平坦面104と平行
な平坦面106を備え、支持部102の平坦面104と
ホルダ105の平坦面106とが互いに上下で接触され
て固定されるようになっている。
2. Description of the Related Art FIG. 9 shows the appearance of a resonator supporting device disclosed in the bulletin of Japanese Patent Application Laid-Open No. Hei 11-307585. In FIG. 9, a support portion 102 protruding outward from the minimum vibration amplitude point of the tool 101 has a flat surface 104 parallel to the joining action surface 103 of the tool 101, and a holder 105 mounted on the movable end of the pressurizing mechanism. A flat surface 106 parallel to the flat surface 104 of the support portion 102 is provided, and the flat surface 104 of the support portion 102 and the flat surface 106 of the holder 105 are vertically contacted and fixed to each other.

【0003】[0003]

【発明が解決しようとする課題】しかし、前記従来例
は、平坦面104と平坦面106とが互いに固定される
構造であるので、ホルダ105にツール101を取付け
る場合、平坦面104と平坦面106との左右横方向の
位置出しが正確に取れず、ホルダ105を昇降駆動する
加圧機構に対するツール101の位置がずれて、適切な
接合ができなくなる。
However, since the conventional example has a structure in which the flat surface 104 and the flat surface 106 are fixed to each other, when the tool 101 is mounted on the holder 105, the flat surface 104 and the flat surface 106 are fixed. The position of the tool 101 with respect to the pressing mechanism that drives the holder 105 up and down is displaced, and proper joining cannot be performed.

【0004】そこで、本発明は、位置出しが正確にでき
る超音波振動接合用ツールを提供するものである。
Accordingly, an object of the present invention is to provide an ultrasonic vibration bonding tool capable of accurately positioning.

【0005】[0005]

【課題を解決するための手段】本発明にあっては、共振
器の最小振動振幅点より外側に突出された支持部と、支
持部に取付面として形成された斜面とを備えたことを特
徴としている。よって、本発明によれば、ツールのホル
ダヘの取付位置が正確となり、接合対象部材を適切に接
合することができる。又、本発明にあっては、斜面は支
持部の下側の取付面として形成され、支持部の上側の取
付面はホーンの接合作用面と平行な平坦面として形成さ
れれば、接合時の加重が斜めの分力を生じることなく支
持部に垂直方向に加わり、支持部が振動方向に移動する
ような外力を受けることはない。
According to the present invention, a support portion protruding outside the minimum vibration amplitude point of the resonator and a slope formed as a mounting surface on the support portion are provided. And Therefore, according to the present invention, the attachment position of the tool to the holder becomes accurate, and the joining target members can be appropriately joined. Also, in the present invention, if the inclined surface is formed as a lower mounting surface of the support portion, and the upper mounting surface of the support portion is formed as a flat surface parallel to the bonding operation surface of the horn, the bonding at the time of bonding is performed. The load is applied to the support portion in the vertical direction without generating an oblique component force, and the support portion does not receive an external force that moves in the vibration direction.

【0006】[0006]

【発明の実施の形態】図1〜図6は本発明の第1実施形
態であって、図1はツール1及び支持装置20を分解し
た外観を示し、図2はツール1の上面を示し、図3はツ
ール1の正面を示し、図4はツール1が支持装置20で
支持された正面を示し、図5はツール1が支持装置20
で支持された右側面を示し、図6は超音波接合装置41
の正面を示す。
1 to 6 show a first embodiment of the present invention. FIG. 1 shows an exploded appearance of a tool 1 and a supporting device 20, and FIG. 3 shows a front view of the tool 1, FIG. 4 shows a front view of the tool 1 supported by the support device 20, and FIG.
FIG. 6 shows an ultrasonic bonding apparatus 41.
The front of is shown.

【0007】図1を参照し、ツール1及びそれの支持装
置について説明する。第1実施形態では、ツール1は、
ホーン本体2、接合作用面3、支持部4、斜面5、連結
部6、根元部7、先端部8、中間部9、結合部10を備
えた、アルミニウム又はチタンのような合金又は焼入れ
された鉄等のような音響特性の良い素材からなる単一ボ
ディとして形成される。ツール1は振動子35から伝達
された超音波振動の共振周波数の1波長の長さ(最大振
動振幅点flから最大振動振幅点f5までの長さ)を有
する棒状である。結合部10にはツール1に振動子35
又は図外のブースタを無頭ねじ36により同軸状に取付
けるためのねじ孔であって、ホーン本体2の左右端面の
中央部に形成される。振動子35は図外の超音波発振器
から受ける電気的なエネルギーにより所定周波数を有す
る縦波の超音波振動を発生して出力するものである。ツ
ール1で振動振幅を増幅するために根元部7の間に位置
するホーン本体2の中間部にはくびれ部11を形成した
が、くびれ部11は設けられないこともある。
Referring to FIG. 1, the tool 1 and its supporting device will be described. In the first embodiment, the tool 1
Alloy or quenched alloy such as aluminum or titanium with horn body 2, joint working surface 3, support 4, slope 5, connection 6, root 7, tip 8, middle 9, joint 10 It is formed as a single body made of a material with good acoustic characteristics such as iron. The tool 1 has a rod shape having a length of one wavelength of the resonance frequency of the ultrasonic vibration transmitted from the vibrator 35 (the length from the maximum vibration amplitude point fl to the maximum vibration amplitude point f5). A vibrator 35 is attached to the tool 1 at the joint 10.
Alternatively, a screw hole for attaching a booster (not shown) coaxially with a headless screw 36 is formed at the center of the left and right end surfaces of the horn body 2. The vibrator 35 generates and outputs longitudinal ultrasonic vibration having a predetermined frequency by electric energy received from an ultrasonic oscillator (not shown). In order to amplify the vibration amplitude with the tool 1, the constriction 11 is formed in the middle of the horn body 2 located between the roots 7, but the constriction 11 may not be provided.

【0008】支持装置20は上下クランパ21;22及
び弾性体33により形成される。上下クランパ21;2
2は支持部4を上下方向より支持可能に分割された形態
である。上クランパ21は、把持部24、斜面25、結
合部26を備えた、鉄系の素材からなる単一ボディとし
て形成される。把持部24は支持部4と位置が対応する
ように上クランパ21の四隅部より下方に突出する。把
持部24の下面は支持部4の上側の斜面5と接触するよ
うに平坦な斜面25に形成される。結合部26は図6に
示す超音波振動接合装置41の加圧機構であるエアシリ
ンダ44のピストンロッド45に上クランパ21を取付
けるためのねじ孔であって、上クランパ21の中央部に
形成される。
The support device 20 is formed by upper and lower clampers 21 and 22 and an elastic body 33. Upper and lower clampers 21; 2
Reference numeral 2 denotes a form in which the support portion 4 is divided so as to be supported in the vertical direction. The upper clamper 21 is formed as a single body made of an iron-based material and provided with a grip portion 24, a slope 25, and a coupling portion 26. The grip 24 protrudes below the four corners of the upper clamper 21 so that the position of the grip 24 corresponds to the position of the support 4. The lower surface of the grip portion 24 is formed as a flat slope 25 so as to contact the upper slope 5 of the support portion 4. The coupling portion 26 is a screw hole for attaching the upper clamper 21 to a piston rod 45 of an air cylinder 44 which is a pressing mechanism of the ultrasonic vibration bonding device 41 shown in FIG. You.

【0009】下クランパ22は前後に分割されており、
下クランパ22のそれぞれは把持部28、斜面29を備
えた、鉄系の素材からなる単一ボディとして形成され
る。各下クランパ22の把持部28は支持部4と位置が
対応するように各下クランパ22の左右端部より上方に
突出する。把持部28の上面は支持部4の下側の斜面5
と接触するように平坦な斜面29に形成される。
The lower clamper 22 is divided into front and rear,
Each of the lower clampers 22 is formed as a single body made of an iron-based material and provided with a grip portion 28 and a slope 29. The gripping portions 28 of the lower clampers 22 project upward from the left and right ends of the lower clampers 22 so that the positions correspond to the support portions 4. The upper surface of the grip portion 28 is the lower slope 5 of the support portion 4.
Is formed on a flat inclined surface 29 so as to contact with.

【0010】上下クランパ21;22には弾性体33を
係留するばね掛部31;32が装着される。弾性体33
は上下クランパ21;22を互いに近づく方向に付勢す
るものであって、コイルばねにより形成される。弾性体
33の上端が上クランパ21のばね掛部31に掛け止め
られ、弾性体33の下端が下クランパ22のばね掛部3
2に掛け止められることにより、弾性体33が上クラン
パ21と下クランパ22とを連結する。
The upper and lower clampers 21 and 22 are provided with spring hooks 31 and 32 for anchoring the elastic body 33. Elastic body 33
Urges the upper and lower clampers 21 and 22 toward each other, and is formed by a coil spring. The upper end of the elastic body 33 is hooked on the spring hook 31 of the upper clamper 21, and the lower end of the elastic body 33 is held by the spring hook 3 of the lower clamper 22.
2, the elastic body 33 connects the upper clamper 21 and the lower clamper 22.

【0011】図2及び図3を参照し、ツール1の詳細に
ついて説明する。接合作用面3はホーン本体2における
中央の最大振動振幅点f3の位置でホーン本体2の外側
面に配置され、支持部4は最大振動振幅点f3より左右
両側に等距離の最小振動振幅点f2;f4の位置でホー
ン本体2の外側面に配置される。接合作用面3がホーン
本体2の上下面に設けられ、支持部4がホーン本体2の
前後面に設けられるというように、接合作用面3と支持
部4とは互いに直交するようにホーン本体2に設けられ
る。接合作用面3は、上下面と同一面であっても上下面
より窪んでいても良いが、図示のようにホーン本体2の
上下面より突出していれば、厚さの薄い態合対象品を接
合する場合に、接合作用面3が接合対象品と接触し、ホ
ーン本体2の接合作用面3周りの面が接合対象品と接触
しないので、最適である。仮想線Llは振動振幅の変位
を示す波形である。
The details of the tool 1 will be described with reference to FIGS. The joining surface 3 is disposed on the outer surface of the horn body 2 at the position of the center maximum vibration amplitude point f3 in the horn main body 2, and the support portion 4 is located at the same vibration minimum point f2 on the left and right sides of the maximum vibration amplitude point f3. Placed on the outer side of the horn body 2 at the position f4. The bonding action surface 3 and the support portion 4 are orthogonal to each other, such that the bonding action surface 3 is provided on the upper and lower surfaces of the horn body 2 and the support portions 4 are provided on the front and rear surfaces of the horn body 2. Is provided. The joining action surface 3 may be the same as the upper and lower surfaces or may be recessed from the upper and lower surfaces. However, as shown in FIG. In the case of joining, the joining action surface 3 comes into contact with the article to be joined, and the surface around the joining action face 3 of the horn body 2 does not come into contact with the article to be joined. The imaginary line Ll is a waveform indicating the displacement of the vibration amplitude.

【0012】支持部4はホーン本体2にツール1の振動
方向Xと平行な線対称軸Lを軸として対称に設けられ
る。つまり、支持部4はホーン本体2の前後左右に配置
された対象形であって、支持部4の上下面は取付面とし
て接合作用面3に対して傾斜する平坦な斜面5に形成さ
れる。連結部6はホーン本体2と支持部4とを非接触に
連結するものであって、根元部7と先端部8と中間部9
とよりなるクランク形状である。接合作用面3は振動方
向Xに平行する平坦な平坦面である。上側に位置する左
右の斜面5は最小振動振幅点f3を通る垂線L3上の或
る1つの一点Plで交差し、これら上側左右の斜面5の
垂線L3と成す角度θ1は同じである。下側に位置する
左右の斜面5は垂線L3上のもう1つの一点P2で交差
し、これら下側左右の斜面5の垂線L3と成す角度θ2
は同じである。垂線L3は線対称軸L2と直交する。
The support portion 4 is provided on the horn body 2 symmetrically about a line symmetry axis L parallel to the vibration direction X of the tool 1. That is, the support portion 4 is a symmetrical shape disposed on the front, rear, left and right sides of the horn main body 2, and the upper and lower surfaces of the support portion 4 are formed as flat attachment surfaces 3 with flat slopes 5 inclined with respect to the joint action surface 3. The connecting portion 6 connects the horn body 2 and the supporting portion 4 in a non-contact manner, and includes a root portion 7, a tip portion 8, and an intermediate portion 9.
And a crank shape consisting of The joining action surface 3 is a flat flat surface parallel to the vibration direction X. The left and right slopes 5 located on the upper side intersect at a certain point Pl on a perpendicular L3 passing through the minimum vibration amplitude point f3, and the angle θ1 formed with the perpendicular L3 of the upper and left slopes 5 is the same. The left and right slopes 5 located on the lower side intersect at another point P2 on the perpendicular L3, and the angle θ2 formed with the perpendicular L3 of these lower left and right slopes 5
Is the same. The perpendicular L3 is orthogonal to the axis of symmetry L2.

【0013】連結部6のクランク形状は前後左右対象形
状であるが、左右同じ向きでも良い。根元部7は接合作
用面3より左右両側に等距離の最小振動振幅点f2;f
4の位置でホーン本体2より外側に振動方向Xと直交す
るようにまっすぐ突出する厚肉な板状である。先端部8
は支持部4の一端より振動方向Xと直交するようにまっ
すぐ突出する厚肉な板状である。中間部9は根元部7と
先端部8とを繋ぐものであって、振動方向Xと平行する
方向の薄肉な板状である。
Although the crank shape of the connecting portion 6 is symmetrical in the front-rear and left-right directions, the right-left and right directions may be the same. The root portion 7 is at a minimum vibration amplitude point f2;
It is a thick plate that projects straight out of the horn body 2 at a position 4 so as to be orthogonal to the vibration direction X. Tip 8
Is a thick plate that protrudes straight from one end of the support 4 so as to be orthogonal to the vibration direction X. The intermediate portion 9 connects the root portion 7 and the distal end portion 8 and has a thin plate shape in a direction parallel to the vibration direction X.

【0014】上下クランパ21;22にツール1を組付
ける場合について説明すると、先ず、上クランパ21が
図1の状態より裏返されて図外の作業台に載せられる。
つまり、作業台に載せられた上クランパ21は4個所の
把持部24が上方に向けられた格好である。その状態に
おいて、ツール1が図1の状態より裏返され、4個所の
支持部4における斜面5が上クランパ21における4個
所の把持部24の斜面25に載せられる。このように4
個所の支持部4が4個所の把持知24に載せられた状態
においては、ツール1の接合作用面3や連結部6は上ク
ランパ21と非接触である。
The case where the tool 1 is assembled to the upper and lower clampers 21 and 22 will be described. First, the upper clamper 21 is turned over from the state shown in FIG. 1 and placed on a work table (not shown).
That is, the upper clamper 21 placed on the workbench has a shape in which four grip portions 24 are directed upward. In this state, the tool 1 is turned over from the state shown in FIG. 1, and the slopes 5 of the four support portions 4 are placed on the slopes 25 of the four grip portions 24 of the upper clamper 21. Thus 4
When the four supporting portions 4 are placed on the four grips 24, the joining surface 3 and the connecting portion 6 of the tool 1 are not in contact with the upper clamper 21.

【0015】次に、2個の下クランパ22が図1の状態
より裏返され、2個の下クランパ22における合計2個
所の把持部28における斜面29がツール1における4
個所の支持部4の斜面5に載せられる。このように4個
所の把持部28が4個所の支持部4に載せられた状態に
おいては、ツール1の接合作用面3や連結部6は下クラ
ンパ22と非接触である。
Next, the two lower clampers 22 are turned over from the state shown in FIG.
It is placed on the slope 5 of the support part 4 at the location. In the state where the four grip portions 28 are placed on the four support portions 4 as described above, the joining action surface 3 and the connecting portion 6 of the tool 1 are not in contact with the lower clamper 22.

【0016】更に、上クランパ21の把持部24にはツ
ール1の支持部4が載り、ツール1の支持部4には下ク
ランパ22の把持部28が載せられ、上クランパ21の
斜面25とツール1の斜面5とが接触し、下クランパ2
2の斜面29とツール1の斜面5とが接触した状態にお
いて、4本の弾性体33が上下クランパ21;22のば
ね掛部31;32に掛け止められる。
Further, the support portion 4 of the tool 1 is mounted on the holding portion 24 of the upper clamper 21, and the holding portion 28 of the lower clamper 22 is mounted on the support portion 4 of the tool 1. 1 comes into contact with the slope 5 and the lower clamper 2
In a state where the second inclined surface 29 and the inclined surface 5 of the tool 1 are in contact with each other, the four elastic bodies 33 are hooked on the spring engaging portions 31; 32 of the upper and lower clampers 21; 22.

【0017】このように4本の弾性体33が4個所のば
ね掛部31;32に係留された状態においては、弾性体
33はツール1や上下クランパ21;22より離隔され
ており、弾性体33は縮む方向のばね力を発生してお
り、係るばね力が上下クランパ21;22を互いに近づ
く方向に付勢する。これによって、図4及び図5に示す
ように、上下クランパ21;22がツール1を弾性作用
下で挟み付けるように支持する。図4において、ツール
1の下側の接合作用面3は下クランパ22の下面よりも
下方に突出している。
In a state where the four elastic members 33 are moored by the four spring hooks 31 and 32, the elastic members 33 are separated from the tool 1 and the upper and lower clampers 21 and 22. 33 generates a spring force in the contracting direction, and the spring force urges the upper and lower clampers 21 and 22 in directions approaching each other. Thereby, as shown in FIGS. 4 and 5, the upper and lower clampers 21 and 22 support the tool 1 so as to sandwich it under elastic action. In FIG. 4, the lower joining operation surface 3 of the tool 1 projects below the lower surface of the lower clamper 22.

【0018】図6を参照し、図4及び図5に示したツー
ル1を弾性体33による弾性作用下で支持した上下クラ
ンパ21;22を使用する超音波振動接合装置41につ
いて説明する。超音波振動接合装置41の装置本体42
はその前側下部に前方及び左右に開放された作業空間4
3を有し、作業空間43の上部を区画した装置本体42
の上部分の内部には加圧機構としてのエアシリンダ44
を有する。エアシリンダ44の下方に突出するピストン
ロッド45の下端は作業空間43に配置される。
Referring to FIG. 6, an ultrasonic vibration bonding apparatus 41 using the upper and lower clampers 21 and 22 supporting the tool 1 shown in FIGS. 4 and 5 under the elastic action of the elastic body 33 will be described. Apparatus main body 42 of ultrasonic vibration bonding apparatus 41
Is a work space 4 open to the front and lower left and right
Apparatus main body 42 having an upper part of a work space 43
Air cylinder 44 as a pressurizing mechanism
Having. The lower end of the piston rod 45 projecting below the air cylinder 44 is disposed in the working space 43.

【0019】作業空間43に配置されたピストンロッド
45の下端には図4のツール1を弾性体33による弾性
作用下で支持した上下クランパ21;22が取付けられ
る。作業空間43の背部を区画した装置本体42の下部
分は超音波振動接合装置41を製造ライン等に組付ける
ためのベースを構成する定盤46の上に設置される。作
業空間43の下部分を区画した定盤46の上面には受台
47が設置される。
At the lower end of the piston rod 45 disposed in the work space 43, upper and lower clampers 21 and 22 which support the tool 1 shown in FIG. The lower part of the apparatus main body 42 that divides the back of the work space 43 is installed on a surface plate 46 that constitutes a base for mounting the ultrasonic vibration bonding apparatus 41 on a production line or the like. A receiving table 47 is installed on the upper surface of the surface plate 46 that defines the lower part of the work space 43.

【0020】超音波振動接合装置41を用いた、超音波
振動接合のやり方について説明する。ツール1の組付け
られた支持装置20がピストンロッド45の下端に取付
けられ、ツール1と振動子35とが無頭ねじ36により
結合される。この結合はツール1の一端と振動子35の
出力端とが接触した形態である。又、受台47の上には
金属よりなる複数の接合対象部材51;52が互いに重
ね合されて搭載される。
The manner of ultrasonic vibration bonding using the ultrasonic vibration bonding apparatus 41 will be described. The support device 20 to which the tool 1 is attached is attached to the lower end of the piston rod 45, and the tool 1 and the vibrator 35 are connected by the headless screw 36. This connection is a form in which one end of the tool 1 and the output end of the vibrator 35 are in contact. A plurality of members to be joined 51 and 52 made of metal are mounted on the cradle 47 so as to overlap each other.

【0021】その状態において、支持装置20がエアー
シリンダ44の動作により図4の矢印Y方向に下降し、
接合作用面3と受台47とが接合対象部材51;52を
加圧保持すると共に、振動子35から出力された超音波
振動がツール1に伝達し、接合作用面3が矢印X方向に
振動し、この振動が接合作用面3から接合対象部材5
1;52に伝達し、接合対象部材51;52の合せ面が
接合作用面3と受台47とで加圧されたまま横方向に互
い違いに振動して活性化されつつ接合される。
In this state, the support device 20 is lowered in the direction of arrow Y in FIG.
The joining action surface 3 and the receiving table 47 press and hold the joining target members 51 and 52, and the ultrasonic vibration output from the vibrator 35 is transmitted to the tool 1, so that the joining action surface 3 vibrates in the arrow X direction. Then, this vibration is generated from the joining action surface 3 by the joining target member 5.
1; 52, the joining surfaces of the joining target members 51; 52 are alternately vibrated in the lateral direction while being pressed by the joining action surface 3 and the receiving table 47, and are joined while being activated.

【0022】第1実施形態の構造によれば、弾性体33
による弾性作用下で、しかも、斜面5と斜面25とが互
いに接触し、斜面5と斜面29とが互いに接触した状態
で、上下クランパ21;22がツール1の支持部4を上
下方向より把持した形態である。このため、互いに接触
し合った斜面5;25;29の楔作用により、上下クラ
ンパ21;22に対するツール101の位置出しが正確
にでき、接合対象部材51;52を適切に接合すること
ができる。
According to the structure of the first embodiment, the elastic body 33
The upper and lower clampers 21 and 22 grip the support portion 4 of the tool 1 from above and below while the slope 5 and the slope 25 are in contact with each other and the slope 5 and the slope 29 are in contact with each other under the elastic action of It is a form. Therefore, the tool 101 can be accurately positioned with respect to the upper and lower clampers 21 and 22 by the wedge action of the inclined surfaces 5; 25 and 29 which are in contact with each other, and the members 51 and 52 can be appropriately bonded.

【0023】接合時において、上クランパ21からツー
ル1に加重がかかることによって、根元部7に対するツ
ール1の最小振動振幅点f2;f4の位置が理論上の位
置よりずれて、根元部7が振動した場合であっても、中
間部9が根元部7から先端部8側への振動を吸収する。
よって、振動子35で発生した超音波振動がツール1か
ら接合作用面3に効率良く適切に伝達でき、ツール1は
もとより上下クランパ21;22や弾性体33及びピス
トンロッド45ががたつくことはない。
At the time of joining, the weight is applied to the tool 1 from the upper clamper 21, so that the position of the minimum vibration amplitude point f2; f4 of the tool 1 with respect to the root 7 is shifted from the theoretical position, and the root 7 is vibrated. Even in this case, the intermediate portion 9 absorbs the vibration from the root 7 to the tip 8.
Therefore, the ultrasonic vibration generated by the vibrator 35 can be efficiently and appropriately transmitted from the tool 1 to the joining operation surface 3, and the upper and lower clampers 21 and 22, the elastic body 33, and the piston rod 45 do not rattle.

【0024】ツール1が支持装置20に両支持形態で取
付けられた場合において、一方の根元部7からもう一方
の根元部7までの支持間距離が共振周波数の1波長以内
に設定でき、ツール1が小形で軽量となる。例えば、接
合対象部材51;52が半導体チップと回路基板であっ
て、半導体チップを回路基板に超音波振動接合により面
実装したところ、半導体チップのバンプ数が少ないこと
から、接合加重が低加重の場合でも、接合時における接
合加重の制御がやりやすかった。半導体チップのバンプ
数が多く、接合加重が高加重の場合でも、支持間距離が
共振周波数の1波長以内に設定されたことにより、半導
体チップの回路基板への面実装に悪影響を及ぼすような
撓みがツール1に発生せず、半導体チップの全部のバン
プと回路基板の全部のパッドとが適切に接合していた。
When the tool 1 is mounted on the support device 20 in the form of both supports, the distance between the supports from one root 7 to the other root 7 can be set within one wavelength of the resonance frequency. Is small and lightweight. For example, when the bonding target members 51 and 52 are a semiconductor chip and a circuit board, and the semiconductor chip is surface-mounted on the circuit board by ultrasonic vibration bonding, the number of bumps on the semiconductor chip is small, so that the bonding weight is low. Even in this case, it was easy to control the joining weight at the time of joining. Even when the number of bumps on the semiconductor chip is large and the bonding weight is high, the distance between supports is set within one wavelength of the resonance frequency, so that the bending that adversely affects the surface mounting of the semiconductor chip on the circuit board is performed. Did not occur in the tool 1, and all the bumps of the semiconductor chip and all the pads of the circuit board were properly bonded.

【0025】図7は本発明の第2実施形態を示す。図7
に示すように、第2実施形態では、上クランパ21には
腕部55が下方に向けて延設され、腕部55には下クラ
ンパ22が図外のガイドを介して上下方向に移動可能に
装着され、腕部55より内側に向けて突設されたばね受
部56と下クランパ22との隙間には弾性体57が縮ん
だ状態で配置され、弾性体57の下端が受部56に接触
し、弾性体57の上端が下クランパ22と接触する。
FIG. 7 shows a second embodiment of the present invention. FIG.
As shown in FIG. 2, in the second embodiment, the upper clamper 21 has an arm portion 55 extending downward, and the arm portion 55 has the lower clamper 22 movable vertically through a guide (not shown). The elastic body 57 is arranged in a contracted state in a gap between the lower clamper 22 and the spring receiving part 56 mounted and protruding inward from the arm part 55, and the lower end of the elastic body 57 contacts the receiving part 56. The upper end of the elastic body 57 contacts the lower clamper 22.

【0026】その状態において、弾性体57が伸び方向
のばね力を発生しており、係るばね力が上下クランパ2
1;22を互いに近づく方向に付勢する。これによっ
て、斜面5と斜面25とが接触し、斜面5と斜面5と斜
面29とが接触し、上下クランパ21;22がツール1
を弾性作用下で挟み付けるように支持し、ツール1の下
側の接合作用面3は受部56の下面よりも下方に突出し
ており、第1実施形態と同様に互いに接触し合った斜面
5;25;29の楔作用により、上下クランパ21;2
2に対するツール1の位置出しが正確にでき、接合対象
部材51;52を適切に接合することができる。
In this state, the elastic body 57 generates a spring force in the extending direction, and the spring force is applied to the upper and lower clampers 2.
1:22 are urged toward each other. Thereby, the slope 5 and the slope 25 come into contact, the slope 5 and the slope 5 and the slope 29 come into contact, and the upper and lower clampers 21;
Are supported so as to be clamped under elastic action, and the lower joining action surface 3 of the tool 1 projects below the lower surface of the receiving portion 56, and the slopes 5 which are in contact with each other as in the first embodiment. 25; 29, the upper and lower clampers 21; 2
Positioning of the tool 1 with respect to 2 can be accurately performed, and the joining target members 51 and 52 can be appropriately joined.

【0027】各実施形態ではツール1を共振周波数の1
波長の長さとしたが、その整数倍でも良い。
In each embodiment, the tool 1 is set at the resonance frequency of 1
Although the length is set to the wavelength, it may be an integral multiple thereof.

【0028】各実施形態ではツール1の一端に振動子3
5を直接的に結合したが、ツール1に共振周波数の1/
2波長又は1/2波長の整数倍の長さを有する図外のブ
ースタを介在させて振動子35を取付けても良い。この
場合、ツール1とブースタとが図1の無頭ねじ36に相
当する無頭ねじで同軸状に結合される。又、ツール1が
接合作用面3を超音波ホーンと支持部4を有するブース
タとにより構成される構造でも同様に適用できる。この
場合、超音波ホーンとブースタとが無頭ねじ36に相当
する無頭ねじにより同軸状に結合される。
In each embodiment, the vibrator 3 is attached to one end of the tool 1.
5 were directly coupled, but the tool 1
The vibrator 35 may be mounted with a booster (not shown) having a length equal to an integral multiple of two wavelengths or 波長 wavelength. In this case, the tool 1 and the booster are coaxially connected by a headless screw corresponding to the headless screw 36 in FIG. Further, the present invention can be similarly applied to a structure in which the tool 1 has the bonding action surface 3 formed by an ultrasonic horn and a booster having the support portion 4. In this case, the ultrasonic horn and the booster are coaxially coupled by a headless screw corresponding to the headless screw 36.

【0029】中間部9にスロットや穴又はスリットを形
成して振動のバランスを調整することも可能である。
It is also possible to form a slot, a hole or a slit in the intermediate portion 9 to adjust the balance of vibration.

【0030】ホーン本体2と接合作用面3と支持部4及
び連結部6等を単一ボディとしたが、ホーン本体2と接
合作用面3と支持部4及び連結部6等を別体に形成し、
ホーン本体2に接合作用面3と支持部4及び連結部6を
ねじ固定しても良い。
Although the horn body 2, the joining action surface 3, the support portion 4, the connecting portion 6, and the like are formed as a single body, the horn body 2, the joining action surface 3, the supporting portion 4, the connecting portion 6, and the like are formed separately. And
The bonding surface 3, the support portion 4, and the connecting portion 6 may be fixed to the horn body 2 by screws.

【0031】複数の接合対象部材を受台47に搭載した
後に接合作用面3と受台47とで加圧するようにした
が、接合作用面3に吸引孔を形成して、吸引手段による
吸引動作で接合作用面3に図6の一方の接合対象部材5
1を吸着し、図6の他方の接合対象部材52を受台47
の上に載せておき、エアーシリンダ44の下降動作によ
るツール1の下降により、接合対象部材51を接合対象
部材52に重ね合せつつ加圧する構造も適用できる。
After a plurality of members to be joined are mounted on the pedestal 47, pressure is applied between the joining surface 3 and the pedestal 47. However, a suction hole is formed in the joining surface 3 and the suction operation by the suction means is performed. 6, one of the members 5 to be joined in FIG.
6 and the other joining target member 52 of FIG.
A structure in which the tool 1 is lowered by the lowering operation of the air cylinder 44 and the member to be welded 51 is pressed while being overlapped with the member to be welded 52 is also applicable.

【0032】この場合、ツール1の接合作用面3以外の
外側面には吸引手段のホースが接続されるホース接続部
が設けられ、ツール1の内部には吸引孔とホース接続部
とに連なる吸引通路が形成される。又、接合作用面3に
吸着される接合対象部材51が半導体チップのように小
形の場合には、接合作用面3に小径の吸引孔を有する接
合チップをろう付け等により接合しても良い。又、図2
の最小振動振幅点f2;f4(図1参照)の位置でツー
ル1の上面よりツール1の内部に連なるヒータ用孔を設
け、ヒータ用孔に挿入装着した電熱ヒータでツール1を
加熱することにより、超音波振動による接合エネルギー
と電熱ヒータによる接合エネルギーとの双方で複数の接
合対象部材を接合することも可能である。
In this case, a hose connecting portion to which a hose of a suction means is connected is provided on an outer surface other than the joining operation surface 3 of the tool 1, and a suction hole connected to the suction hole and the hose connecting portion is provided inside the tool 1. A passage is formed. When the joining target member 51 to be attracted to the joining action surface 3 is small like a semiconductor chip, a joining tip having a small-diameter suction hole on the joining action surface 3 may be joined by brazing or the like. Also, FIG.
At the position of the minimum vibration amplitude point f2; f4 (see FIG. 1) from the upper surface of the tool 1 to the inside of the tool 1, and heating the tool 1 with an electric heater inserted and mounted in the heater hole. Also, it is possible to join a plurality of members to be joined with both the joining energy by the ultrasonic vibration and the joining energy by the electric heater.

【0033】斜面5は支持部4の上面又は下面の何れか
に設け、支持部4の斜面5に対応する斜面を上下クラン
パ21;22のどちらかに設けても同様に適用できる。
例えば、支持部4の上面を斜面5に形成し、支持部4の
下面を接合作用面3と平行する平坦な平坦面に形成した
場合は、上クランパ21に斜面25を形成し、下クラン
パ22の把持部28の上面は支持部4の平坦面と対応す
る平坦面に形成する。
The same applies to the case where the slope 5 is provided on either the upper surface or the lower surface of the support portion 4 and the slope corresponding to the slope 5 of the support portion 4 is provided on one of the upper and lower clampers 21 and 22.
For example, when the upper surface of the support portion 4 is formed on the slope 5 and the lower surface of the support portion 4 is formed as a flat flat surface parallel to the bonding surface 3, the slope 25 is formed on the upper clamper 21 and the lower clamper 22 is formed. Is formed on a flat surface corresponding to the flat surface of the support 4.

【0034】又、図8に示すように、支持部4の上面を
接合作用面3と平行する平坦な平坦面61に形成し、支
持部4の下面を斜面5に形成した場合は、上クランパ2
1の把持部24の下面は支持部4の平坦面61と対応す
る平坦面62に形成し、下クランパ22に斜面29を形
成する。この図8の場合には、上クランパ21からの加
重が斜めの分力を生じることなくツール1の支持部4に
垂直方向に加わり、支持部4が振動方向Xに移動するよ
うな斜めの外力を受けることがなく、接合時における接
合加重の制御が最善にやりやすかった。
As shown in FIG. 8, when the upper surface of the support portion 4 is formed on a flat flat surface 61 parallel to the bonding action surface 3 and the lower surface of the support portion 4 is formed on the inclined surface 5, 2
The lower surface of one grip portion 24 is formed on a flat surface 62 corresponding to the flat surface 61 of the support portion 4, and the inclined surface 29 is formed on the lower clamper 22. In the case of FIG. 8, the load from the upper clamper 21 is applied to the support portion 4 of the tool 1 in the vertical direction without generating an oblique component force, and the oblique external force such that the support portion 4 moves in the vibration direction X. It was easy to control the joining weight at the time of joining without receiving any.

【0035】斜面5の傾斜はツール1の中央側から両端
側に行くに従って支持部4の上下幅が徐々に大きくなる
ように、図1の傾斜と逆向きでも良い。この場合、逆向
きの斜面5と接触する斜面25;29の傾斜も図1と逆
向きとなる。
The inclination of the slope 5 may be opposite to the inclination of FIG. 1 so that the vertical width of the support portion 4 gradually increases from the center side to both end sides of the tool 1. In this case, the inclinations of the slopes 25 and 29 in contact with the slope 5 in the opposite direction are also opposite to those in FIG.

【図面の簡単な説明】[Brief description of the drawings]

【図1】 本発明の第1実施形態を示す分解斜視図。FIG. 1 is an exploded perspective view showing a first embodiment of the present invention.

【図2】 同第1実施形態の共振器を示す上面図。FIG. 2 is a top view showing the resonator of the first embodiment.

【図3】 同第1実施形態の共振器を示す正面図。FIG. 3 is a front view showing the resonator of the first embodiment.

【図4】 同第1実施形態の組立正面図。FIG. 4 is an assembled front view of the first embodiment.

【図5】 同第1実施形態の組立右側面図。FIG. 5 is an assembled right side view of the first embodiment.

【図6】 同第1実施形態の超音波接合装置を示す正面
図。
FIG. 6 is a front view showing the ultrasonic bonding apparatus according to the first embodiment.

【図7】 本発明の第2実施形態の組立右側面図。FIG. 7 is an assembled right side view of the second embodiment of the present invention.

【図8】 本発明の第3実施形態の組立正面図。FIG. 8 is an assembled front view of a third embodiment of the present invention.

【図9】 従来の共振器支持装置を示す斜視図。FIG. 9 is a perspective view showing a conventional resonator supporting device.

【符号の説明】[Explanation of symbols]

1 ツール 2 ホーン本体 4 支持部 5 斜面 61;62平坦面 DESCRIPTION OF SYMBOLS 1 Tool 2 Horn main body 4 Support part 5 Slope 61; 62 Flat surface

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 FI テーマコート゛(参考) B23K 20/10 B23K 20/10 Fターム(参考) 4E067 BF00 CA01 5D107 AA14 AA16 AA20 BB01 CC04 CC10 FF01 FF03 FF06 FF09 5F044 PP16 ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) B23K 20/10 B23K 20/10 F term (Reference) 4E067 BF00 CA01 5D107 AA14 AA16 AA20 BB01 CC04 CC10 FF01 FF03 FF06 FF09 5F044 PP16

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】ホーン本体の最小振動振幅点より外側に突
出された支持部と、支持部に取付面として形成された斜
面とを備えたことを特徴とする超音波振動接合用ツー
ル。
An ultrasonic vibration bonding tool comprising: a support portion protruding outside a minimum vibration amplitude point of a horn main body; and a slope formed as a mounting surface on the support portion.
【請求項2】斜面は支持部の下側の取付面として形成さ
れ、支持部の上側の取付面はホーン本体の接合作用面と
平行な平坦面として形成されたことを特徴とする請求項
1記載の超音波振動接合用ツール。
2. The device according to claim 1, wherein the inclined surface is formed as a lower mounting surface of the support portion, and the upper mounting surface of the support portion is formed as a flat surface parallel to the joining action surface of the horn body. The ultrasonic vibration bonding tool according to the above.
JP2000227813A 1999-08-02 2000-07-27 Ultrasonic vibration bonding tool and supporting device Expired - Fee Related JP3492298B2 (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2000227813A JP3492298B2 (en) 2000-07-27 2000-07-27 Ultrasonic vibration bonding tool and supporting device
TW089115331A TW460345B (en) 1999-08-02 2000-07-31 Joining device by ultrasonic vibration
CA002314733A CA2314733A1 (en) 1999-08-02 2000-07-31 Ultrasonic vibration bonding tool
US09/630,410 US6247628B1 (en) 1999-08-02 2000-08-01 Ultrasonic vibration bonding tool
DE60003761T DE60003761T2 (en) 1999-08-02 2000-08-01 Ultrasonic bonding tool
EP00116595A EP1074330B1 (en) 1999-08-02 2000-08-01 Ultrasonic vibration bonding tool
CNB00122624XA CN1173796C (en) 1999-08-02 2000-08-02 Tool used in ultrasonic wave vibration connection
KR10-2000-0044744A KR100374077B1 (en) 1999-08-02 2000-08-02 Ultrasonic vibration bonding tool

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000227813A JP3492298B2 (en) 2000-07-27 2000-07-27 Ultrasonic vibration bonding tool and supporting device

Publications (2)

Publication Number Publication Date
JP2002043377A true JP2002043377A (en) 2002-02-08
JP3492298B2 JP3492298B2 (en) 2004-02-03

Family

ID=18721212

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000227813A Expired - Fee Related JP3492298B2 (en) 1999-08-02 2000-07-27 Ultrasonic vibration bonding tool and supporting device

Country Status (1)

Country Link
JP (1) JP3492298B2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1273380A1 (en) * 2001-07-06 2003-01-08 Ultex Corporation Resonator for ultrasonic wire bonding
EP2113331A1 (en) * 2008-04-28 2009-11-04 Ultex Corporation Ultrasonic vibration bonding resonator
US8201722B2 (en) 2009-06-22 2012-06-19 Ultex Corporation Resonator for joining metal members together utilizing ultrasonic vibration
JP2013216099A (en) * 2012-04-05 2013-10-24 Eurocopter Deutschland Gmbh Ultrasonic welding device and method of the operating device
CN108787407A (en) * 2018-05-31 2018-11-13 河南理工大学 Single excitation matched become spiral it is vertical-turn round composite ultraphonic vibration processing method and device

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1273380A1 (en) * 2001-07-06 2003-01-08 Ultex Corporation Resonator for ultrasonic wire bonding
US6669074B2 (en) 2001-07-06 2003-12-30 Ultex Corporation Resonator for ultrasonic wire bonding
EP2113331A1 (en) * 2008-04-28 2009-11-04 Ultex Corporation Ultrasonic vibration bonding resonator
JP2009267265A (en) * 2008-04-28 2009-11-12 Arutekusu:Kk Ultrasonic vibration bonding resonator and supporting device for supporting it
JP4564548B2 (en) * 2008-04-28 2010-10-20 株式会社アルテクス Resonator for ultrasonic vibration bonding and supporting device for supporting the same
US7854247B2 (en) 2008-04-28 2010-12-21 Ultex Corporation Ultrasonic vibration bonding resonator
US8201722B2 (en) 2009-06-22 2012-06-19 Ultex Corporation Resonator for joining metal members together utilizing ultrasonic vibration
JP2013216099A (en) * 2012-04-05 2013-10-24 Eurocopter Deutschland Gmbh Ultrasonic welding device and method of the operating device
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