JP2003179102A - Bonding tool and bonding unit for electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a bonding tool which is used for an electronic component, capable of ensuring necessary bending rigidity, and which is superior in utilization factor of vibrations, and to provide a compact bonding unit. <P>SOLUTION: This electronic component bonding unit fixes an electronic component 30 to a board 32 by pressure, as it presses the component 30 against the board 32 with a bonding tool 14 and gives vibrations to the electronic component 30. The sectional area of the horn 15 of the bonding tool 14 is so formed that the sectional area of the pressure-fixing face 15f of the horn 15 which fixes the electronic component 30 by pressure and is formed at a position corresponding to the loop of standing waves of vibrations is set smaller than that of the horn 15 on the side of a vibrator 17, and the sectional shape of the pressure-fixing face 15f of the horn 15 is so formed as to make the pressure- fixing face 15f have maximum bending rigidity, in the direction in which the pressure-fixing face is pressed against the board 32. Using this setup, the amplitude of the vibrator 17 can be amplified, and the horn 15 is restrained from deforming due to bonding load and capable of properly carrying out a bonding operation. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component bonding tool and a bonding apparatus for bonding an electronic component to a pressure-bonded surface such as a substrate.

[0002]

2. Description of the Related Art A method using ultrasonic pressure welding is known as a method for bonding an electronic component such as a flip chip to a surface to be pressure-bonded such as a substrate. In this method, ultrasonic vibration is applied while pressing the bumps of the electronic component against the substrate, and the bonding surfaces are rubbed against each other for bonding. As a bonding tool for pressing electronic parts used in this method, a crimping surface for pressing and crimping electronic parts is formed in the center of a cylindrical horn, and an ultrasonic transducer is attached to the end of this horn. It has been known. At the time of bonding, it is necessary to press the electronic component against the surface to be pressure-bonded with an appropriate bonding load, so this pressing load acts on the horn. At this time, the electronic component must be held in an appropriate posture in order to perform good bonding, and therefore the horn is required to have appropriate rigidity with respect to this load.

The ultrasonic vibration generated by the ultrasonic vibrator is transmitted along the longitudinal direction of the horn. However, when the cross-sectional area of the horn changes in the longitudinal direction, the transmitted amplitude is It has the property that it depends on the cross-sectional area. Therefore, it is necessary to set the shape of the horn appropriately in order to use the vibration efficiently.

[0004]

However, since the conventional bonding tool for crimping electronic parts has been manufactured by turning, the horn has to be based on a cylindrical shape. If the dimensions of the horn are set so as to ensure the above-mentioned appropriate rigidity based on such a cylindrical shape, the cross-sectional area of the horn will inevitably increase and the amplitude of vibration transmitted to the electronic component will decrease. As a result, the utilization efficiency of vibration is reduced. Also, if the utilization efficiency of vibration is to be improved based on the cross-sectional area of the horn set in this way, the cross-sectional area of the ultrasonic transducer side of the horn must be made even larger, resulting in a large horn. There was a problem that As described above, the conventional bonding tool for electronic components has a problem in that it is difficult to realize a bonding tool that satisfies requirements for vibration utilization efficiency, is compact, and can secure necessary bending rigidity.

Therefore, an object of the present invention is to provide a bonding tool and a bonding apparatus for a compact electronic component, which is excellent in vibration utilization efficiency while ensuring necessary bending rigidity.

[0006]

The invention according to claim 1 is
A bonding tool for an electronic component, which abuts against an electronic component and presses the electronic component against the surface to be crimped to apply vibration to the surface to be crimped, the horn vibrating by a vibrator, and an electronic component formed on the horn. It has a crimping surface for crimping the component and a suction hole formed on this crimping surface for vacuum suctioning the electronic component, and the cross section of the horn in the direction perpendicular to the longitudinal direction is closer to the vibrator than to the crimping surface side. It has a wide cross-sectional area and is rectangular.

According to a second aspect of the present invention, there is provided an electronic component bonding apparatus for pressing an electronic component against a surface to be crimped by a bonding tool to apply vibration to the surface to be crimped. A lifting member that moves up and down,
It has a bonding tool fixed to this lifting member,
The bonding tool has a horn vibrated by a vibrator, a crimping surface formed on the horn for crimping electronic parts, and a suction hole formed on the crimping surface for vacuum-sucking electronic parts. The cross section in the direction perpendicular to the direction has a wider cross-sectional area on the vibrator side than on the crimping surface side,
And it is rectangular.

According to the invention described in each claim, the amplitude of the vibrator can be amplified during bonding, and
Good bending can be performed while suppressing the bending of the horn due to the bonding load.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments of the present invention will be described with reference to the drawings. 1 is a front view of a bonding apparatus for electronic components according to an embodiment of the present invention, FIG. 2 is a perspective view of a bonding tool for the electronic components, and FIG. 3A is a front view of a bonding tool for the electronic components. 3 (b) is a plan view of a bonding tool for the electronic component, FIG. 4 (a),
(B), (c) is a fragmentary sectional view of the bonding tool of the same electronic component.

First, the overall structure of an electronic component bonding apparatus will be described with reference to FIG. Reference numeral 1 denotes a support frame, on the front surface of which a first elevating plate 2 and a second elevating plate 3 are vertically movable. A cylinder 4 is mounted on the first lifting plate 2, and a rod 5 of the cylinder 4 is connected to the second lifting plate 3. A bonding head 10 is attached to the second lift plate 3. A Z-axis motor 6 is provided on the upper surface of the support frame 1. Z-axis motor 6 has vertical feed screw 7
To rotate. The feed screw 7 is screwed into a nut 8 provided on the back surface of the first elevating plate 2. Therefore, when the Z-axis motor 6 is driven and the feed screw 7 rotates, the nut 8 moves up and down along the feed screw 7, and the first lifting plate 2 and the second lifting plate 3 are moved.
Also moves up and down.

In FIG. 1, the substrate 32, which is the surface to be pressed, is placed on a substrate holder 34, and the substrate holder 34 is placed on a table 35. The table 35 is a movable table and horizontally moves the substrate 32 in the X direction and the Y direction to position the substrate 32 at a predetermined position.

Reference numeral 42 denotes a camera, which is a uniaxial table 43.
Is attached to. A lens barrel 44 extends forward from the camera 42. The camera 42 is moved forward along the uniaxial table 43, and the front end of the lens barrel 44 is positioned between the electronic component 30 and the substrate 32, which are held by being adsorbed on the lower surface of the bonding tool 14 as shown by the chain line. And electronic components 3
The positions of 0 and the substrate 32 are observed by the camera 42. Then, the relative displacement between the electronic component 30 and the substrate 32 is detected based on this observation result. Table 3 shows the detected misalignment.
This is corrected by driving 5 to move the substrate 32 horizontally in the X direction and the Y direction.
Two registrations are made.

In FIG. 1, reference numeral 50 denotes a main control unit, which controls the Z-axis motor 6 via a motor drive unit 51, controls the table 35 via a table control unit 52, and also recognizes a unit 53. Connected to the camera 42. Further, the cylinder 4 is connected to the main control unit 50 via the load control unit 54, and the protrusion output of the rod 5 of the cylinder 4, that is, the pressing load for pressing the electronic component 30 against the substrate 32 by the bonding tool 14 is controlled.

A holder 12 is connected to the lower end of the main body 11 of the bonding head 10. A block 13 as an elevating member is attached to the holder 12, and the block 13
A bonding tool 14 is fixed to the. Less than,
The block 13 and the bonding tool 14 will be described with reference to FIGS. 2 and 3.

As shown in FIG. 2, the bonding tool 1
The horn 15 of No. 4 is an elongated rod-shaped body.
A mounting seat 15a is provided integrally with the horn 15 on the side surface of the. The mounting seats 15a are arranged symmetrically with respect to the longitudinal direction of the horn at four positions equidistant from the center of the horn 15. The bonding tool 14 is fixed by bringing the upper plane of the mounting seat 15a into contact with the mounting plane of the lower surface of the block 13, and the mounting seat 15a is fixed to the horn 15.
It is a fixed part for fixing.

A holding portion 15e is provided on the lower surface of the central portion of the bonding tool 14 and protrudes downward to hold the electronic component 30 by vacuum suction. The lower surface of the holding portion 15e serves as a crimping surface 15f for pressing the electronic component. Has become. The pressure-bonding surface 15f has a vacuum suction inner hole 1 provided in the horn 15.
One end of 6 is open to form a suction hole 16a. The other end of the inner hole 16 is opened at the position of the mounting seat 15a on the upper surface of the horn 15 to form a suction hole 16b. Block 13
The projection 13a provided on the side surface of the horn 15 is provided with a pipe portion 18 projecting downward. As shown in FIG. It is in contact with the position of the suction hole 16b. Therefore, the suction device 21 is driven to suck air from the tube 20 that is connected to the protrusion 13a and communicates with the pipe portion 18 by the inner hole 13b of the protrusion 13a, and thus the pressure is applied to the crimping surface 15f through the inner hole 16. The suction holes 16a (FIG. 3 (a),
Vacuum suction is performed from (b), and the electronic component 30 can be vacuum-sucked and held on the crimping surface 15f.

A vibrator 17 is mounted on the side end surface of the horn 15. By driving the vibrator 17, vertical vibration is applied to the horn 15, and the holding portion 15e vibrates in the horizontal direction. As shown in FIG. 3B, the shape of the horn 15 is such that the horn 15 has a central portion 15d through both end portions 15b and a tapered portion 15c.
The width is gradually reduced in the direction of. That is, the vertical cross section of the horn 1 in the longitudinal direction has a shape having a wider cross-sectional area on the vibrator 17 side than on the crimping surface 15f side. As a result, the amplitude of ultrasonic vibration is amplified in the path transmitted from the vibrator 17 to the holding unit 15e,
Vibration having an amplitude equal to or larger than the amplitude oscillated by the vibrator 17 is transmitted to the holding portion 15e, and the vibration utilization efficiency can be improved.

The sectional shape of the horn 15 in the direction perpendicular to the longitudinal direction is, as shown in FIG.
c (see cross section a) and the central portion 1 on the side of the crimping surface 15f
In any of 5c (see section B), the height dimension H is a rectangle larger than the width dimensions B1 and B2, that is, the bending rigidity becomes maximum in the direction in which the pressure bonding surface 15f is pressed against the substrate 32. It has a cross-sectional shape. By making the cross section of the horn 15 into such a shape, the bending rigidity of the horn 15 can be maximized in the bonding load direction while keeping the size of the bonding tool 14 as compact as possible. Bending can be suppressed to the minimum and good bonding can be performed. In addition to the rectangular shape, an ellipse having the major axis in the up-down direction as shown in FIG.
It is also possible to use a vertically elongated polygonal shape as shown in FIG.

Next, the mode of vibration excited by the vibrator 17 in the horn 15 will be described. As shown in FIG. 3A, the standing wave of the vibration excited in the horn 15 is
The positions of the mounting surface of the vibrator 17 and the pressure bonding surface 15f of the holding portion 15e located at the center of the horn 15 are the antinodes of the standing wave,
The positions of the mounting seat 15a and the suction hole 16b, which serve as a fixing portion for fixing the horn 15 to the block 13, are configured to serve as nodes of the standing wave. That is, such a standing wave can be generated in the horn 15 by appropriately setting the shape size and mass distribution of each part of the horn 15.

Therefore, the mounting seat 15a which is the fixed portion is
Provided integrally with the horn 15 at a position corresponding to a node of the standing wave that is equidistantly spaced from the crimping surface 15f, which is a position corresponding to the antinode of the standing wave of the vibration of the horn 15, toward both ends of the horn 15. Has been. As a result, the bonding tool 14
At the position of the mounting seat 15a where is fixed, the displacement due to the vertical vibration of the horn 15 becomes minimal, and at the position of the holding portion 15e that holds the electronic component 30, a maximum amplitude is obtained,
The ultrasonic vibration can be most effectively used for bonding the electronic component 30.

This electronic component bonding apparatus is configured as described above, and its operation will be described below. In FIG. 1, the electronic component 30 is vacuum-sucked and held on the pressure bonding surface 15 e of the bonding tool 14 and is positioned above the substrate 32. Then, the lens barrel 44 is moved forward, the camera 42 obtains the images of the electronic component 30 and the substrate 32, and the image data is sent to the recognition unit 53. The main controller 50 detects the relative positional deviation between the electronic component 30 and the substrate 32 from this image data, drives the table 35 according to the detection result, and
2 is moved horizontally to correct the position.

Next, the Z-axis motor 6 is driven and the bonding head 10 is lowered, so that the bumps of the electronic component 30 are mounted on the substrate 32.
Press on. At this time, the substrate 32 is heated by the heating means (not shown). Then, in the pressed state, the vibrator 17
To drive the electronic component 30 to vibrate. As a result, the pressing surface between the bump 31 and the electrode of the substrate 32 is rubbed by the vibration, and the bump 31 is bonded to the electrode of the substrate 32.

At this time, as described above, the cross-sectional shape of the horn 15 is such that the amplitude of the ultrasonic vibration transmitted from the vibrator 17 is amplified, and the vibration utilization efficiency is excellent and efficient. Since the bonding tool 14 can be made compact and the bending rigidity in the crimping direction is maximized, the bonding tool 14 can be made compact and the horn 15 at the time of bonding can be made.
Bending can be suppressed to a minimum and good bonding can be performed.

[0024]

According to the present invention, the amplitude of the vibrator can be amplified at the time of bonding to perform bonding with excellent vibration utilization efficiency, the bonding tool 14 can be made compact, and the horn due to the bonding load can be used. Bending can be suppressed and good bonding can be performed.

[Brief description of drawings]

FIG. 1 is a front view of a bonding apparatus for electronic components according to an embodiment of the present invention.

FIG. 2 is a perspective view of a bonding tool for electronic components according to an embodiment of the present invention.

FIG. 3A is a front view of a bonding tool for electronic components according to one embodiment of the present invention. FIG. 3B is a plan view of a bonding tool for electronic components according to one embodiment of the present invention.

4A is a partial sectional view of a bonding tool for an electronic component according to an embodiment of the present invention. FIG. 4B is a partial sectional view of a bonding tool for an electronic component according to an embodiment of the present invention. 1 is a partial cross-sectional view of a bonding tool for electronic components according to an embodiment.

[Explanation of symbols]

10 Bonding head 13 blocks 14 Bonding tool 15 horn 15a Mounting seat 15e holding part 15f crimping surface 16 bore 16a Adsorption hole 16b suction hole 17 oscillators 19 Suction pad 21 Suction device 30 electronic components 32 substrates 50 Main control unit

Claims (2)

[Claims] 1. A bonding tool for an electronic component, which abuts against an electronic component and presses the electronic component against the surface to be crimped while applying vibration to the surface to be crimped, the horn vibrating by a vibrator, The horn has a crimping surface for crimping the electronic component and a suction hole formed on the crimping surface for vacuum sucking the electronic component, and the cross section in the direction perpendicular to the longitudinal direction of the horn vibrates more than the crimping surface side. A bonding tool for electronic parts, characterized in that the child side has a wider cross-sectional area and is rectangular. 2. A bonding device for an electronic component, which presses an electronic component against a surface to be crimped by a bonding tool while applying vibration to the surface to be crimped, and is an elevating member that moves up and down with respect to the surface to be crimped. And a bonding tool fixed to the lifting member, the bonding tool including a horn vibrated by a vibrator, a crimping surface formed on the horn for crimping an electronic component, and an electronic component formed on the crimping surface. And a suction hole for vacuum-sucking the horn, and the cross section of the horn in a direction perpendicular to the longitudinal direction has a wider cross-sectional area on the vibrator side than on the crimping surface side and is rectangular. Bonding equipment for electronic parts.