JP3487166B2 - Bonding tool and bonding device for electronic components - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component bonding tool and a bonding apparatus for bonding an electronic component to a pressure-bonded surface such as a substrate.

[0002]

2. Description of the Related Art As a method for crimping an electronic component such as a bumped electronic component to a surface to be crimped such as a substrate, a method using ultrasonic pressure welding is known. In this method, ultrasonic vibration is applied while pressing the bumps of the electronic component against the substrate, and the bonding surfaces are rubbed against each other for bonding. As a bonding tool for pressing electronic parts used in this method, a crimping surface for pressing and crimping electronic parts is formed in the center of a cylindrical horn, and an ultrasonic transducer is attached to the end of this horn. Are known (for example, Japanese Patent Laid-Open No.
-57466 publication). The vibration of the ultrasonic oscillator is amplified by the horn and transmitted to the electronic component via the pressure bonding surface, and the entire horn is fixed to the elevating member of the bonding apparatus via the mounting member.

By the way, in the bonding of electronic parts by ultrasonic pressure welding, it is first required to uniformly rub each part of the bonding surface in order to secure good bonding quality. Therefore, at the time of bonding, it is necessary to press the electronic component against the substrate with high parallel accuracy. For example, in the case of an electronic component having a width of about 10 mm, the allowable tilt amount at both ends is within 5 μm, and extremely high accuracy is required.

[0004]

However, since the conventional bonding tool for crimping electronic parts has been manufactured by turning, the horn has to be based on a cylindrical shape. In order to attach the horn having such a shape to the elevating member of the bonding apparatus, it is necessary to interpose a plurality of attaching members, so it is very difficult to ensure the parallelism of the crimping surface of the electronic component after the attaching. , Needed delicate adjustment work.

However, even if the adjustment is performed once, the reproducibility of the parallelism in terms of shape is originally not ensured, so that a complicated readjustment work is required each time the product type is changed. Further, there is a problem that the parallelism is likely to change even during the bonding work, which makes it difficult to stabilize the bonding quality.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a bonding tool and a bonding apparatus for electronic parts which can secure the parallel accuracy of the crimping surface and can obtain stable bonding quality.

[0007]

A bonding tool for an electronic component according to claim 1 is a bonding tool for an electronic component, which abuts on the electronic component and presses the electronic component against a surface to be crimped while applying vibration to crimp it. There is a horn that vibrates by the vibrator, a crimp surface that is formed at a position corresponding to the antinode of the standing wave of the vibration of this horn and that presses electronic parts, and a symmetrical arrangement with respect to the longitudinal centerline of the horn. in and from the crimping surface position spaced equidistantly to both ends of said horn, comprising a fixed part having the horn integrally formed with and the crimped surface parallel to the plane of the planar bonding device It is made possible to abut on a mounting plane formed on the lower surface of the elevating member so as to be fixed to the elevating member.

According to a second aspect of the present invention, there is provided an electronic component bonding apparatus for bonding an electronic component to a pressure-bonded surface by applying vibration while pressing a bump of the electronic component against the pressure-bonded surface with a bonding tool. there, a lifting member for lifting up and down with respect to the crimping surfaces having the bonding tool which is fixed to the elevating member, said bonding tool, and the horn which vibrates the vibrator, this
Is formed at a position corresponding to the antinode of the standing wave of the horn vibration.
A crimping surface for pressing the electronic component, the placement of symmetry and from the crimping surface position spaced equidistantly to both ends of the horn relative to the longitudinal center line of the horn, formed integrally with the horn And a fixing portion having a flat surface parallel to the crimping surface, and the flat surface is brought into contact with a mounting plane formed on the lower surface of the elevating member and fixed to the elevating member.

According to the invention described in each of the claims, the bonding tool is arranged symmetrically with the horn vibrating by the vibrator and with respect to the center line in the longitudinal direction of the horn, and from the crimping surface to both end sides of the horn. A fixed part which is formed integrally with the horn and has a flat surface parallel to the crimping surface, at a position corresponding to the nodes of the standing wave that are equidistantly separated from each other;
By fixing the plane to the mounting plane formed on the lower surface of the elevating member and fixing the plane to the elevating member, it is possible to ensure the parallel accuracy of the crimping surface of the electronic component during bonding.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The following embodiments of the present invention will be described with reference to the drawings. 1 is a front view of a bonding apparatus for an electronic component according to an embodiment of the present invention, FIG. 2 is a perspective view of a bonding tool for the electronic component, and FIG. 3A is a front view of a bonding tool for the electronic component. FIG. 3B is a plan view of a bonding tool for the electronic component.

First, the overall structure of an electronic component bonding apparatus will be described with reference to FIG. Reference numeral 1 denotes a support frame, on the front surface of which a first elevating plate 2 and a second elevating plate 3 are vertically movable. A cylinder 4 is mounted on the first lifting plate 2, and a rod 5 of the cylinder 4 is connected to the second lifting plate 3. A bonding head 10 is attached to the second lift plate 3. A Z-axis motor 6 is provided on the upper surface of the support frame 1. Z-axis motor 6 has vertical feed screw 7
To rotate. The feed screw 7 is screwed into a nut 8 provided on the back surface of the first elevating plate 2. Therefore, when the Z-axis motor 6 is driven and the feed screw 7 rotates, the nut 8 moves up and down along the feed screw 7, and the first lifting plate 2 and the second lifting plate 3 are moved.
Also moves up and down.

In FIG. 1, the substrate 32, which is the surface to be pressure-bonded, is placed on a substrate holder 34, and the substrate holder 34 is placed on a table 35. The table 35 is a movable table and horizontally moves the substrate 32 in the X direction and the Y direction to position the substrate 32 at a predetermined position.

Reference numeral 42 denotes a camera, which is a uniaxial table 43.
Is attached to. A lens barrel 44 extends forward from the camera 42. The camera 42 is moved forward along the uniaxial table 43, and the front end of the lens barrel 44 is positioned between the electronic component 30 and the substrate 32, which are held by being adsorbed on the lower surface of the bonding tool 14 as shown by the chain line. And electronic components 3
The positions of 0 and the substrate 32 are observed by the camera 42. Then, the relative displacement between the electronic component 30 and the substrate 32 is detected based on this observation result. Table 3 shows the detected misalignment.
This is corrected by driving 5 to move the substrate 32 horizontally in the X direction and the Y direction.
Two registrations are made.

In FIG. 1, reference numeral 50 is a main control unit, which controls the Z-axis motor 6 via a motor drive unit 51, controls the table 35 via a table control unit 52, and also recognizes a unit 53. Connected to the camera 42. Further, the cylinder 4 is connected to the main control unit 50 via the load control unit 54, and the protrusion output of the rod 5 of the cylinder 4, that is, the pressing load for pressing the electronic component 30 against the substrate 32 by the bonding tool 14 is controlled.

A holder 12 is connected to the lower end of the main body 11 of the bonding head 10. A block 13 as an elevating member is attached to the holder 12, and the block 13
A bonding tool 14 is fixed to the. Less than,
The block 13 and the bonding tool 14 will be described with reference to FIGS. 2 and 3.

As shown in FIG. 2, the bonding tool 1
The horn 15 of No. 4 is an elongated rod-shaped body.
A mounting seat 15a is provided integrally with the horn 15 on the side surface of the. The mounting seats 15a are arranged symmetrically with respect to the longitudinal direction of the horn at four positions equidistant from the center of the horn 15. The bonding tool 14 is fixed by bringing the upper plane of the mounting seat 15a into contact with the mounting plane of the lower surface of the block 13, and the mounting seat 15a is fixed to the horn 15.
It is a fixed part for fixing.

On the lower surface of the central portion of the bonding tool 14, there is provided a holding portion 15e which projects downward and holds the electronic component 30 by vacuum suction, and the lower surface of the holding portion 15e serves as a crimping surface 15f for pressing the electronic component. Has become. In the processing step of the bonding tool 14, the pressure bonding surface 15f is
The processing tolerance is set so as to maintain parallelism within a predetermined accuracy range with the upper plane of the mounting seat 15a, and the upper plane of the mounting seat 15a and the crimping surface 15 of the completed bonding tool 14 are
With f, a predetermined parallel accuracy is maintained. As a result, when the bonding tool 14 is mounted on the block 13, the crimping surface 15f is always kept highly parallel to the mounting plane on the lower surface of the block 13, and the parallelism when exchanging the bonding tool is excellent. ing.

Further, one end of a vacuum suction inner hole 16 provided in the horn 15 is opened in the pressure-bonding surface 15f so that the suction hole 16 is formed.
a is formed. The other end of the inner hole 16 is opened at the position of the mounting seat 15a on the upper surface of the horn 15 to form a suction hole 16b. Projection 13a provided on the side surface of the block 13
The pipe portion 18 is provided so as to project downward, and the suction pad 1 attached to the lower end portion of the pipe portion 18 as shown in FIG.
9 is in contact with the position of the suction hole 16b on the upper surface of the horn 15. Therefore, the suction device 21 is driven to suck air from the tube 20 that is connected to the protrusion 13a and communicates with the pipe portion 18 by the inner hole 13b of the protrusion 13a, and the air is sucked into the crimping surface 15e through the inner hole 16. Adsorption hole 1
6a (FIGS. 3 (a) and 3 (b)) can be vacuum-sucked, and the electronic component 30 can be vacuum-sucked and held on the pressure-bonding surface 15f.

A vibrator 17 is mounted on the side end surface of the horn 15. By driving the vibrator 17, vertical vibration is applied to the horn 15, and the holding portion 15e vibrates in the horizontal direction. As shown in FIG. 3B, the shape of the horn 15 is such that the horn 15 has a central portion 15d through both end portions 15b and a tapered portion 15c.
The width of the ultrasonic vibration is gradually narrowed in the direction of, and as a result, the amplitude of ultrasonic vibration is amplified in the path transmitted from the vibrator 17 to the holding unit 15e, and the vibrator 17 oscillates in the holding unit 15e. Vibrations with an amplitude greater than that are transmitted.

Next, a vibration mode excited by the vibrator 17 in the horn 15 will be described. As shown in FIG. 3A, the standing wave of the vibration excited in the horn 15 is
The positions of the mounting surface of the vibrator 17 and the pressure bonding surface 15f of the holding portion 15e located at the center of the horn 15 are the antinodes of the standing wave,
The positions of the mounting seat 15a and the suction hole 16b, which serve as a fixing portion for fixing the horn 15 to the block 13, are configured to serve as nodes of the standing wave. That is, such a standing wave can be generated in the horn 15 by appropriately setting the shape size and mass distribution of each part of the horn 15.

Therefore, the mounting seat 15a which is the fixed portion is
Provided integrally with the horn 15 at a position corresponding to a node of the standing wave that is equidistantly spaced from the crimping surface 15f, which is a position corresponding to the antinode of the standing wave of the vibration of the horn 15, toward both ends of the horn 15. Has been. As a result, the bonding tool 14
At the position of the mounting seat 15a where is fixed, the displacement due to the vertical vibration of the horn 15 becomes minimal, and at the position of the holding portion 15e that holds the electronic component 30, a maximum amplitude is obtained,
The ultrasonic vibration can be most effectively used for bonding the electronic component 30. Further, by integrating the mounting seat 15a with the horn 15, the bonding tool 14
It is not necessary to interpose a mounting member between the block 1 and the block 13, and therefore the block 1 of the bonding tool 14
3 can be mounted with good workability, and mounting errors due to backlash between members can be eliminated.
The parallelism of the pressure bonding surface 15f of No. 4 is always ensured with good reproducibility,
No complicated adjustment work is required.

This electronic component bonding apparatus is configured as described above, and its operation will be described below. In FIG. 1, the electronic component 30 is vacuum-sucked and held on the pressure bonding surface 15 e of the bonding tool 14 and is positioned above the substrate 32. Then, the lens barrel 44 is moved forward, the camera 42 obtains the images of the electronic component 30 and the substrate 32, and the image data is sent to the recognition unit 53. The main controller 50 detects the relative positional deviation between the electronic component 30 and the substrate 32 from this image data, drives the table 35 according to the detection result, and
2 is moved horizontally to correct the position.

Next, the Z-axis motor 6 is driven and the bonding head 10 is lowered, so that the bumps of the electronic component 30 are mounted on the substrate 32.
Press on. At this time, the substrate 32 is heated by the heating means (not shown). Then, in the pressed state, the vibrator 17
To drive the electronic component 30 to vibrate. As a result, the pressing surface between the bump 31 and the electrode of the substrate 32 is rubbed by the vibration, and the bump 31 is bonded to the electrode of the substrate 32.

At this time, as described above, the suction surface 15f always maintains a high degree of parallelism with the block 13, and the mounting seat 15a is symmetrically arranged with respect to the crimping surface 15f. Further, since the bonding tool 14 is not attached to the block 13 by an extra attachment member, the crimping surface 15f is in a very good state and the electronic component 30 is mounted on the substrate 32 without tilting.
Press against. Therefore, the bumps 31 are uniformly pressed by the electrodes of the substrate 32, and good bonding can be performed.

[0025]

According to the present invention, the bonding tool is moved up and down by the fixing portion which is symmetrically arranged with respect to the crimping surface of the electronic component and which is integrally formed with the horn and has a plane parallel to the crimping surface. Since it is fixed by abutting against the mounting plane formed on the lower surface of the member, it is possible to press the electronic component with high parallel accuracy on the surface to be crimped without tilting at the time of bonding, and thus bonding with good accuracy can be performed. In addition to the need for complicated adjustment of parallelism when exchanging the bonding tool, it is possible to easily perform the setup change work when the product type is changed.

[Brief description of drawings]

FIG. 1 is a front view of an electronic component bonding apparatus according to an embodiment of the present invention.

FIG. 2 is a perspective view of a bonding tool for electronic components according to an embodiment of the present invention.

FIG. 3A is a front view of a bonding tool for an electronic component according to an embodiment of the present invention. FIG. 3B is a plan view of a bonding tool for an electronic component according to an embodiment of the present invention.

[Explanation of symbols]

10 Bonding head 13 blocks 14 Bonding tool 15 horn 15a Mounting seat 15e holding part 15f crimping surface 16 bore 16a Adsorption hole 16b suction hole 17 oscillators 19 Suction pad 21 Suction device 30 electronic components 32 substrates 50 Main control unit

Continuation of the front page (56) References JP-A-10-22308 (JP, A) JP-A-8-19877 (JP, A) JP-A-9-57467 (JP, A) JP-A-9-122934 (JP , A) JP-A-11-265914 (JP, A) JP-A-11-265915 (JP, A) JP3346272 (JP, B2) (58) Fields investigated (Int.Cl. ⁷ , DB name) H01L 21 / 60 H01L 21/607 B06B 1/00 B23K 20/00 H05K 3/32

Claims (2)

(57) [Claims] 1. A bonding tool for an electronic component, which abuts against an electronic component and presses the electronic component against a surface to be crimped while applying vibration to the electronic component, the horn vibrating by a vibrator, and a vibration of the horn. A crimping surface which is formed at a position corresponding to the antinode of the standing wave and presses the electronic component, and a symmetrical arrangement with respect to the longitudinal centerline of the horn, and is equidistantly spaced from the crimping surface to both ends of the horn. to the position, comprising a fixed part having the horn integrally formed with and the crimped surface parallel to the plane, it is brought into contact with the plane to the mounting plane formed on the lower surface of the lifting member of a bonding device this A bonding tool for electronic parts, which can be fixed to a lifting member. 2. An electronic component bonding apparatus for crimping an electronic component by applying vibration while pressing the electronic component against the surface to be crimped with a bonding tool, and an elevating member that moves up and down with respect to the surface to be crimped. , A bonding tool fixed to the elevating member, the bonding tool being a horn vibrated by a vibrator, and a crimp for pressing an electronic component formed at a position corresponding to an antinode of a standing wave of vibration of the horn the surface, the arrangement of symmetry and from the crimping surface position spaced equidistantly to both ends of the horn relative to the longitudinal center line of the horn, said horn and is integrally formed and said crimping surfaces A bonder for an electronic component, comprising: a fixing portion having parallel planes, the plane being brought into contact with a mounting plane formed on a lower surface of the elevating member to be fixed to the elevating member. Grayed apparatus.