JP2002329753A - Electronic component bonding apparatus - Google Patents

Electronic component bonding apparatus

Info

Publication number
JP2002329753A
JP2002329753A JP2002127770A JP2002127770A JP2002329753A JP 2002329753 A JP2002329753 A JP 2002329753A JP 2002127770 A JP2002127770 A JP 2002127770A JP 2002127770 A JP2002127770 A JP 2002127770A JP 2002329753 A JP2002329753 A JP 2002329753A
Authority
JP
Japan
Prior art keywords
electronic component
horn
surface
vibration
connecting portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002127770A
Other languages
Japanese (ja)
Other versions
JP2002329753A5 (en
JP3912172B2 (en
Inventor
Masafumi Hisaku
雅史 檜作
Original Assignee
Matsushita Electric Ind Co Ltd
松下電器産業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd, 松下電器産業株式会社 filed Critical Matsushita Electric Ind Co Ltd
Priority to JP2002127770A priority Critical patent/JP3912172B2/en
Publication of JP2002329753A publication Critical patent/JP2002329753A/en
Publication of JP2002329753A5 publication Critical patent/JP2002329753A5/ja
Application granted granted Critical
Publication of JP3912172B2 publication Critical patent/JP3912172B2/en
Application status is Expired - Fee Related legal-status Critical
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector

Abstract

(57) [Problem] To provide an electronic component bonding apparatus that suppresses the occurrence of vertical bending vibration and does not impair the quality of the electronic component. SOLUTION: In a bonding apparatus for an electronic component, which applies vibration while pressing an electronic component against a substrate by using a bonding tool, a mounting seat 15a for fixing the bonding tool 14 to a block 13 which moves up and down with respect to the substrate. It is provided at a position corresponding to the antinode of the standing wave of the vibration of the horn 15, and the mounting seat 15a and the horn 15 main body are connected by a connecting portion A having a thin section and a vertically symmetric notch B. I did it. Thereby, the bending rigidity of the cross section of the connecting portion A can be reduced, the transmission of the bending vibration excited by the fixed portion to the horn body is suppressed, and the occurrence of vertical displacement due to the bending vibration of the horn 15 is suppressed. be able to.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component bonding apparatus for bonding an electronic component to a surface to be compressed such as a substrate.

[0002]

2. Description of the Related Art As a method for mounting an electronic component such as an electronic component with bumps on a work such as a substrate, a method using ultrasonic pressure welding is known. In this method, ultrasonic vibration is applied while pressing the bumps of the electronic component against the substrate, and the bonding surfaces are rubbed against each other for bonding. The bonding tool used in this method has a horn, which is an elongated rod that transmits the vibration of the ultrasonic vibrator, which is the vibration source, to the joint, and a node of the standing wave of the vibration generated in the horn. Is fixed, and the portion corresponding to the antinode having the largest amplitude is pressed against the joint to effectively use the vibration.

[0003]

However, the position of the node of the standing wave of vibration is not always in a fixed position in any state, and the temperature state of the bonding tool and the load applied to the bonding tool are not always constant. Slightly displaced depending on the state of. For this reason, at the time of actual bonding, vibration also exists at the position set at the design stage as the position of the node where the vibration is originally minimal, and this vibration is transmitted to the fixed portions protruding on both sides of the horn. Then, a new vibration is excited in the fixed portion by the vibration.
At this time, the fixed part has a mechanically asymmetric structure in which the upper part is fixed to the bonding apparatus and the lower part is the free end, so that the vibration excited by the fixed part has the amplitude of the lower free end part. Is larger than the upper part, that is, bending vibration that generates bending stress in the fixed part.

[0004] The bending vibration excited in the fixed portion is transmitted to the horn, and acts on the horn body as a vibrating force to induce the bending vibration. When bending vibration occurs in the horn, a displacement occurs in the horn in the vertical direction, that is, the direction in which the electronic component is pressed against the surface to be pressed. Since this vertical displacement does not contribute to the thermocompression bonding of electronic components at all, it also causes damage to the electronic components and causes poor quality, so bending vibration of the horn must be eliminated as much as possible. . However, in the conventional bonding tool, no consideration is given to the bending vibration generated in the horn, and a bonding tool that takes this surface into consideration has been desired.

Accordingly, an object of the present invention is to provide an electronic component bonding apparatus which suppresses the occurrence of bending vibration in the vertical direction and does not impair the quality of the electronic component.

[0006]

According to a first aspect of the present invention, there is provided an electronic component bonding apparatus for applying a vibration while pressing an electronic component against a surface to be compressed by contacting the electronic component and pressing the electronic component against the surface to be compressed. An electronic component bonding apparatus provided with a bonding tool, wherein the bonding tool is formed at a position corresponding to an antinode of a standing wave of vibration of the horn, A crimping surface that presses against the surface, a thin connecting portion protruding from a side surface of the horn at a position corresponding to a node of the standing wave equidistant from the crimping surface to both ends of the horn, and the connecting portion. And a fixing portion formed at a tip portion of the horn to fix the horn to an elevating member of a bonding apparatus, wherein the connecting portion projects horizontally from both side surfaces of the horn.

According to a second aspect of the present invention, there is provided an electronic component bonding apparatus, wherein a notch is provided in a connecting portion.

According to a third aspect of the present invention, there is provided a bonding apparatus for an electronic component, comprising: a suction hole provided in a pressure-bonding surface; a suction hole formed in the horn and communicating with the suction hole; a suction pad abutting on the suction hole; And a block to be fixed, wherein the suction pad is provided on the block.

According to the invention described in each claim, a thin connecting portion protruding from the side surface of the horn of the bonding tool,
By providing a fixing portion formed at the tip of the connecting portion and fixing the horn to the elevating member of the bonding apparatus,
The transmission of the bending vibration excited by the fixed portion to the horn body can be suppressed, and the occurrence of vertical displacement due to the bending vibration of the horn can be suppressed.

[0010]

Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a front view of an electronic component bonding apparatus according to one embodiment of the present invention, FIG. 2 is a perspective view of an electronic component bonding tool according to one embodiment of the present invention,
FIG. 3A is a front view of an electronic component bonding tool according to one embodiment of the present invention, FIG. 3B is a plan view of an electronic component bonding tool according to one embodiment of the present invention, and FIG.
1A and 1B are partial perspective views of an electronic component bonding tool according to an embodiment of the present invention.

First, the overall structure of an electronic component bonding apparatus will be described with reference to FIG. Reference numeral 1 denotes a support frame, on the front surface of which is provided a first elevating plate 2 and a second elevating plate 3 so as to be able to move up and down. A cylinder 4 is mounted on the first lifting plate 2, and its rod 5 is connected to the second lifting plate 3. The bonding head 10 is mounted on the second lifting plate 3. On the upper surface of the support frame 1, a Z-axis motor 6 is provided. Z-axis motor 6 has vertical feed screw 7
To rotate. The feed screw 7 is screwed into a nut 8 provided on the back surface of the first lifting plate 2. Therefore, when the Z-axis motor 6 is driven and the feed screw 7 rotates, the nut 8 moves up and down along the feed screw 7, and the first lifting plate 2 and the second lifting plate 3
Also move up and down.

Referring to FIG. 1, a substrate 32 to be pressed is placed on a substrate holder 34, and the substrate holder 34 is placed on a table 35. The table 35 is a movable table, and horizontally moves the substrate 32 in the X direction and the Y direction to position the substrate 32 at a predetermined position.

Reference numeral 42 denotes a camera, which is a uniaxial table 43
It is attached to. Reference numeral 44 denotes a lens barrel extending forward from the camera 42. The camera 42 is moved forward along the uniaxial table 43, and the tip of the lens barrel 44 is positioned between the electronic component 30 with bumps and the substrate 32 held by being sucked and held on the lower surface of the bonding tool 14, as shown by a chain line, In this state, the positions of the electronic component 30 with the bump and the substrate 32 are observed with the camera 42. Then, the relative displacement between the electronic component 30 and the substrate 32 is detected based on the observation result. The detected displacement is determined by driving the table 35 to move the substrate 32 in the X direction or Y direction.
The correction is performed by horizontally moving the electronic component 30 with bumps, and thereby the electronic component 30 with bumps and the substrate 32 are aligned.

In FIG. 1, reference numeral 50 denotes a main control unit, which controls the Z-axis motor 6 via a motor drive unit 51, controls the table 35 via a table control unit 52, and receives a control signal via a recognition unit 53. Connected to the camera 42. Further, the cylinder 4 is connected to the main control unit 50 via a load control unit 54, and the protrusion output of the rod 5 of the cylinder 4, that is, the pressing load for pressing the electronic component 30 against the substrate 32 by the bonding tool 14 is controlled.

A holder 12 is connected to the lower end of the main body 11 of the bonding head 10. A block 13 (elevating member) is mounted on the holder 12, and a bonding tool 14 is fixed to the block 13. Hereinafter, FIG.
The block 13 and the bonding tool 14 will be described with reference to FIGS.

As shown in FIG. 2, the bonding tool 1
The horn 15 is an elongated rod-shaped body, and mounting seats 15a, which are fixed portions, are provided on four sides of the horn 1 at four locations equidistant from the center of the horn 15 via a connecting portion (described later).
5 are provided integrally. Bonding tool 14
Is fixed to the lower surface of the block 13 by the mounting seat 15a. That is, the mounting seat 15a is a fixing portion for fixing the horn 15 to the elevating member of the bonding apparatus.

A holding portion 15e, which projects downward and holds the electronic component 30 by vacuum suction, is provided on the lower surface at the center of the bonding tool 14, and the lower surface of the holding portion 15e serves as an electronic component 30 crimping surface 15f. I have. One end of a vacuum suction inner hole 16 provided in the horn 15 is opened in the crimping surface 15f to form a suction hole 16a. The other end of the inner hole 16 opens at the position of the mounting seat 15a on the upper surface of the horn 15 to form a suction hole 16b.

The protrusion 13 provided on the side surface of the block 13
4A is provided with a tube portion 18 projecting downward.
The suction pad 19 attached to the lower end of the tube 18 is in contact with the position of the suction hole 16b on the upper surface of the horn 15, as shown in FIG. Therefore, the projection 13a is connected to the projection 13a.
Tube 20 communicating with the tube portion 18 by the inner hole 13b of the tube 20
Then, the suction device 1 is driven to suck the air to suck the air into the suction hole 1 opened on the pressure-bonding surface 15 e through the inner hole 16.
6a (FIGS. 3 (a) and 3 (b)), it is possible to hold the electronic component 30 with the bump by vacuum suction on the crimping surface 15f.

A vibrator 17 is mounted on a side end surface of the horn 15. By driving the vibrator 17, longitudinal vibration is applied to the horn 15, and the holding portion 15e vibrates in the horizontal direction. As shown in FIG. 3B, the shape of the horn 15 is such that the center portion 15d is formed from both end portions 15b through a tapered portion 15c.
, The amplitude of the ultrasonic vibration is amplified in the path transmitted from the vibrator 17 to the holding portion 15e, and the vibrator 17 oscillates in the holding portion 15e. Vibration greater than or equal to the amplitude is transmitted.

Next, the mode of vibration excited by the vibrator 17 to the horn 15 will be described. As shown in FIG. 3A, the standing wave of the vibration excited by the horn 15 is
The position of the mounting surface of the vibrator 17 and the position of the crimping surface 15f of the holding portion 15e located at the center of the horn 15 are the antinodes of the standing wave,
The position of the connecting portion of the mounting seat 15a for fixing the horn 15 to the block 13 and the position of the suction hole 16b are formed to be nodes of the standing wave. That is, such a standing wave can be generated in the horn 15 by appropriately setting the shape, dimensions, and mass distribution of each part of the horn 15.

Therefore, the mounting seat 15a as a connecting portion is
It is provided integrally at a position corresponding to a node of the standing wave, which is equidistant from the crimping surface 15f in a direction corresponding to the antinode of the standing wave of the vibration of the horn 15 toward both ends of the horn 15. . Accordingly, the displacement due to the longitudinal vibration of the horn 15 is minimized at the position of the mounting seat 15a to which the bonding tool 14 is fixed, and the maximum amplitude is obtained at the position of the crimping surface 15f for crimping the electronic component 30 with bumps. The vibration can be used most effectively for bonding the electronic component 30 with bumps. Further, by integrating the mounting seat 15a with the horn 15, the mounting of the bonding tool 14 to the block 13 (elevating member) can be performed with good workability.

Here, the shape of the mounting seat 15a will be described with reference to FIG. As shown in FIG. 4A, the mounting seat 15a is connected to the horn 15 by thin connecting portions A that project horizontally from both side surfaces of the main body of the horn 15. Further, a notch B having a vertically symmetrical shape is provided at an upper portion and a lower portion of the connecting portion A. The cross-sectional shape of the connecting portion A (see the hatched portion in the drawing) is set to a size and shape such that the bending rigidity of the cross-section is as small as possible within a range sufficient for the bonding load of the target electronic component 30. . That is, the thickness t of the connecting portion A is made as small as possible and the cutout portion B is made as large as possible within a range having sufficient strength against the pressing load at the time of bonding. Reducing the bending stiffness of the cross section of the connecting portion A in this way has a great significance in improving the use efficiency of ultrasonic vibration during bonding and preventing damage to the electronic component 30 during bonding, as described below. Having.

That is, as described above, the connecting portion A is set at a position corresponding to a node of a standing wave generated in the horn at the design stage. However, during actual bonding, the connecting portion A is generally set by various uncertain factors. The position of A does not completely coincide with the node of the standing wave. Therefore, vibration also exists at the position of the connecting portion A, and this vibration is transmitted to the mounting seat 15a. Here, since the wavy portion of the mounting seat 15a is fixed to the block 13 and the lower portion is a free end, bending vibration is excited in the mounting seat 15a as shown in FIG. 4B. When this bending vibration is transmitted to the main body of the horn 15 via the connecting portion A, the horn 15 is displaced in the vertical direction due to the bending vibration shown by the broken line. This vertical displacement does not contribute to the bonding of electronic components at all,
Since it acts as a force for pressing the electronic component against the substrate unnecessarily, it becomes a factor of poor quality.

Here, by minimizing the bending rigidity of the cross section of the connecting portion A as much as possible, it is possible to minimize the degree to which the bending vibration excited by the mounting seat 15a is transmitted to the main body of the horn 15. it can. Therefore, horn 1
5 can reduce the vertical displacement due to the bending vibration induced by 5, and reduce the ratio of the energy of the ultrasonic vibration consumed as the vertical vibration displacement that does not contribute to the bonding, thereby improving the vibration use efficiency. In addition, the occurrence of damage to the electronic component can be reduced.

This electronic component bonding apparatus is configured as described above. Next, the operation will be described. In FIG. 1, the electronic component 30 with bumps is held on the suction surface 15 e of the bonding tool 14 by vacuum suction and positioned above the substrate 32. Then, the lens barrel 44 is advanced and the camera 42
The image of the electronic component with bumps 30 and the substrate 32 is obtained, and the image data is sent to the recognition unit 53. The main control unit 50 detects a relative displacement between the electronic component 30 with bumps and the board 32 from the image data, drives the table 35 according to the detection result, and performs the position correction by moving the board 32 horizontally.

Next, the Z-axis motor 6 is driven to lower the bonding head 10 and press the bumps of the electronic component 30 with bumps against the substrate 32. At this time, the substrate 32 is heated by a heating means (not shown). Then, the vibrator 17 is driven in a pressed state to apply vibration to the bumped electronic component 30. As a result, the pressing surface between the bump 31 and the electrode of the substrate 32 is rubbed by vibration, and the bump 31 is bonded to the electrode of the substrate 32. At this time, the mounting seat 15a for fixing the horn 15 to the block 13 is provided with a thin connecting portion A, and the cross-sectional shape of the connecting portion A is set so as to reduce bending rigidity. As described above, the use efficiency of the ultrasonic vibration can be improved, and damage to the electronic component can be prevented.

[0027]

According to the present invention, the transmission of the bending vibration excited by the fixed portion to the horn can be suppressed. Therefore, the vertical displacement of the horn due to the bending vibration of the horn is suppressed, and the vertical displacement that does not contribute to the thermocompression bonding can be suppressed to improve the use efficiency of the ultrasonic vibration, and the damage to the electronic components can be reduced. Can be prevented.

[Brief description of the drawings]

FIG. 1 is a front view of an electronic component bonding apparatus according to an embodiment of the present invention.

FIG. 2 is a perspective view of an electronic component bonding tool according to an embodiment of the present invention.

3A is a front view of an electronic component bonding tool according to an embodiment of the present invention; FIG. 3B is a plan view of an electronic component bonding tool according to an embodiment of the present invention;

4A is a partial perspective view of a bonding tool for an electronic component according to one embodiment of the present invention; FIG. 4B is a partial perspective view of a bonding tool for an electronic component according to one embodiment of the present invention;

[Explanation of symbols]

 Reference Signs List 10 bonding head 13 block 14 bonding tool 15 horn 15a mounting seat 15e holding portion 15f crimping surface 16 inner hole 16a suction hole 16b suction hole 17 vibrator 19 suction pad 21 suction device 30 electronic component 32 substrate 50 main control portion A connection portion B Notch

Claims (3)

[Claims]
1. A bonding apparatus for an electronic component, comprising: a bonding tool for an electronic component for applying vibration while pressing an electronic component against a surface to be compressed by contacting the electronic component and pressing the electronic component against the surface to be compressed. A bonding tool, a horn vibrated by a vibrator, a crimping surface formed at a position corresponding to an antinode of a standing wave of vibration of the horn and pressing an electronic component against a crimped surface, and both ends of the horn from the crimping surface A connecting portion thinner than the side surface of the horn at a position corresponding to the node of the standing wave equidistantly spaced to the side, and a fixation formed at the tip of the connecting portion to fix the horn to an elevating member of a bonding apparatus And a connecting portion protruding in a horizontal direction from both side surfaces of the horn.
2. A bonding apparatus for an electronic component, comprising: a bonding tool for an electronic component for applying vibration while pressing the electronic component against a surface to be compressed by contacting the electronic component and pressing the electronic component against the surface to be compressed. A bonding tool, a horn vibrated by a vibrator, a crimping surface formed at a position corresponding to an antinode of a standing wave of vibration of the horn and pressing an electronic component against a crimped surface, and both ends of the horn from the crimping surface A connecting portion thinner than the side surface of the horn at a position corresponding to the node of the standing wave equidistantly spaced to the side, and a fixation formed at the tip of the connecting portion to fix the horn to an elevating member of a bonding apparatus And a notch portion provided in the connection portion.
3. An electronic component bonding apparatus comprising an electronic component bonding tool for applying vibration while pressing an electronic component against a surface to be compressed by contacting the electronic component and pressing the electronic component against the surface to be compressed. A bonding tool, a horn vibrated by a vibrator, a crimping surface formed at a position corresponding to an antinode of a standing wave of vibration of the horn and pressing an electronic component against a crimped surface, and both ends of the horn from the crimping surface A connecting portion thinner than the side surface of the horn at a position corresponding to the node of the standing wave which is equidistant to the side, and a fixing portion formed at a tip portion of the connecting portion and fixing the horn to an elevating member of a bonding apparatus A suction hole formed in the crimping surface, a suction hole formed in the horn and communicating with the suction hole, a suction pad in contact with the suction hole, and a block for fixing the fixing portion. And a click, a bonding apparatus of electronic components, characterized in that said suction pads are provided on the block.
JP2002127770A 2002-04-30 2002-04-30 Electronic component bonding equipment Expired - Fee Related JP3912172B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002127770A JP3912172B2 (en) 2002-04-30 2002-04-30 Electronic component bonding equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002127770A JP3912172B2 (en) 2002-04-30 2002-04-30 Electronic component bonding equipment

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP10109083 Division

Publications (3)

Publication Number Publication Date
JP2002329753A true JP2002329753A (en) 2002-11-15
JP2002329753A5 JP2002329753A5 (en) 2002-11-15
JP3912172B2 JP3912172B2 (en) 2007-05-09

Family

ID=19194269

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002127770A Expired - Fee Related JP3912172B2 (en) 2002-04-30 2002-04-30 Electronic component bonding equipment

Country Status (1)

Country Link
JP (1) JP3912172B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7354181B2 (en) 2005-11-24 2008-04-08 Siemens Aktiengesellschaft Cockpit module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7354181B2 (en) 2005-11-24 2008-04-08 Siemens Aktiengesellschaft Cockpit module

Also Published As

Publication number Publication date
JP3912172B2 (en) 2007-05-09

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