JP3557955B2 - Bonding device and bonding tool for electronic components - Google Patents

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an electronic component bonding apparatus and a bonding tool for bonding an electronic component such as an electronic component with a bump such as a flip chip to a surface to be bonded such as an electrode of a substrate.
[0002]
[Prior art]
As a method for bonding an electronic component to a surface to be bonded such as an electrode of a substrate, a method using ultrasonic pressure welding is known. According to this method, ultrasonic vibration is applied to the electronic component while pressing the electronic component against the surface to be bonded, and the bonding surface is minutely vibrated to cause friction to bring the bonding surface into close contact. The bonding tool used in this method has a horn, which is an elongated rod that transmits the vibration of the ultrasonic vibrator, which is a vibration source, to an electronic component. While applying a load and vibration to the component, the electronic component is bonded to the surface to be joined by pressing. Since the load (load and vibration) at the time of bonding acts on the crimping element, the lower surface (the suction surface of the electronic component) is easily worn by repeated use. If the wear becomes excessive, normal bonding cannot be performed, and the crimping element must be periodically replaced. Conventionally, this crimping element has been replaced by replacing the entire horn or, when the crimping element is detachable from the horn body as a separate component, only exchanging the separate component.
[0003]
[Problems to be solved by the invention]
However, when replacing the entire horn, the horn, which is an expensive component, is discarded as a consumable component, and the running cost increases. In addition, even in the case where only the crimping element is attached and detached and replaced, it is difficult for the conventional bonding tool to reproduce a stable fixed state due to an unstable mounting state due to a method of fastening the crimping element to the horn body, Therefore, there has been a problem that the vibration characteristics are likely to fluctuate and stable bonding cannot be performed.
[0004]
SUMMARY OF THE INVENTION It is an object of the present invention to provide an electronic component bonding apparatus and a bonding tool capable of performing stable bonding while performing stable vibration at low cost.
[0005]
[Means for Solving the Problems]
The bonding device for an electronic component according to claim 1, wherein the bonding device presses the electronic component to a surface to be bonded while applying a load and vibration to the electronic component, and a bonding tool that contacts the electronic component. Pressing means for pressing the bonding tool against the electronic component, the bonding tool corresponding to a horizontally long horn, a vibrator for applying vibration to the horn, and an antinode of standing wave vibration of the horn. A through-hole provided at a position orthogonal to the longitudinal direction of the horn, and a crimping element that is detachably fastened to the horn by fastening means that passes through the through-hole and has a distal end abutting on the electronic component. A suction hole for vacuum-sucking the electronic component is provided at a tip portion of the crimping device, and the suction hole is provided on the horn with the crimping device fastened to the horn. It communicates with the vacuum suction holes.
[0006]
According to a second aspect of the present invention, there is provided a bonding tool for an electronic component, which applies a load and vibration to the electronic component and presses the electronic component against a surface to be joined, and applies vibration to the horizontally long horn and the horn. A vibrator, a through hole provided at a position corresponding to the antinode of the standing wave vibration of the horn, and a through hole provided orthogonal to the longitudinal direction of the horn, and detachably attached to the horn by fastening means inserted through the through hole. and entered into the distal end portion is brought into contact with the electronic component possess a crimping element for pressing the electronic component, is provided with suction holes for vacuum suction of electronic components to the tip portion of the Atchakuko, the suction holes A state in which the crimping element is fastened to the horn communicates with a vacuum suction hole provided in the horn .
[0007]
An electronic component bonding tool according to a third aspect is the electronic component bonding tool according to the second aspect , wherein the suction hole communicates with the vacuum suction hole via a suction hole provided in the fastening means. .
[0008]
According to the present invention, a through-hole provided at right angles to the longitudinal direction of the horn is provided at a position corresponding to the antinode of the standing wave vibration of the horn, and a crimping element that presses against the electronic component by pressing the through-hole is formed through the through-hole. By detachably fastening to the horn by the fastening means for inserting the hole, a stable fixed state and vibration characteristics can be maintained.
[0009]
BEST MODE FOR CARRYING OUT THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a front view of an electronic component bonding apparatus according to an embodiment of the present invention, FIG. 2 is an upside down perspective view of the electronic component bonding tool, FIG. 3 is a front view of the electronic component bonding tool, and FIG. (A), (b), FIGS. 5 (a), (b), FIGS. 6 (a), (b) are partial cross-sectional views of a bonding tool for the electronic component.
[0010]
First, the overall structure of an electronic component bonding apparatus will be described with reference to FIG. Reference numeral 1 denotes a support frame, on the front surface of which is provided a first elevating plate 2 and a second elevating plate 3 so as to be able to move up and down. A cylinder 4 is mounted on the first lifting plate 2, and its rod 5 is connected to the second lifting plate 3. The bonding head 10 is mounted on the second lifting plate 3. On the upper surface of the support frame 1, a Z-axis motor 6 is provided. The Z-axis motor 6 rotates a vertical feed screw 7. The feed screw 7 is screwed into a nut 8 provided on the back of the first lifting plate 2. Accordingly, when the Z-axis motor 6 is driven to rotate the feed screw 7, the nut 8 moves up and down along the feed screw 7, and the first lifting plate 2 and the second lifting plate 3 also move up and down.
[0011]
In FIG. 1, a substrate 46 whose upper surface is a surface to which electronic components are joined is placed on a substrate holder 47, and the substrate holder 47 is placed on a table 48. The table 48 is a movable table, and horizontally moves the substrate 46 in the X direction and the Y direction to position the substrate 46 at a predetermined position. The table 48 serves as positioning means for moving the board 46 relative to the electronic component 40.
[0012]
Reference numeral 42 denotes a camera, which is mounted on the uniaxial table 43. A lens barrel 44 extends forward from the camera 42. The camera 42 is moved forward along the uniaxial table 43, and the tip of the lens barrel 44 is attracted to the lower surface of the bonding tool 14 as indicated by a dashed line, and a bumped electronic component such as a flip chip is held as a bonded product. The electronic component 40 and the board 46 are observed by the camera 42 in this state.
[0013]
A recognition unit 53 recognizes images of the electronic component 40 and the board 46 captured by the camera 42 and detects their positions. Reference numeral 50 denotes a main control unit which controls the vertical movement of the Z-axis motor 6, that is, the bonding head 10 via a motor drive unit 51, and positions the table 48, that is, the substrate 46, via a table control unit 52. Further, the main control unit 50 calculates a displacement between the electronic component 40 and the board 46 in the horizontal plane from the positions of the electronic component 40 and the board 46 detected by the recognition unit 53, and drives the table 48 so as to correct the displacement. Further, a load control unit 54 and a suction device 56 are connected to the main control unit 50.
[0014]
The cylinder 4 as the pressing means is connected to the main control unit 50 via the load control unit 54, and the pressing force for pressing the electronic component 40 with bumps against the substrate 46 by the projection output of the rod 5 of the cylinder 4, that is, the bonding tool 14, is applied. Controlled. The suction device 56 performs suction and release of suction of the electronic component 40 by the bonding tool 14 according to a command from the main control unit 50. The vibrator 17 composed of an ultrasonic vibrator is connected to the main control unit 50 via an ultrasonic vibrator driving unit 55, and performs ultrasonic vibration according to a command from the main control unit 50.
[0015]
A holder 12 is coupled to the lower end of the main body 11 of the bonding head 10. A block 13 is mounted on the holder 12, and a bonding tool 14 is fixed to the block 13. The protrusion 13 a on the side of the block 13 is connected to the suction device 56. Hereinafter, the bonding tool 14 will be described with reference to FIGS. 2, 3, and 4. FIG.
[0016]
As shown in FIGS. 2, 3, and 4, the bonding tool 14 mainly includes a horizontally long horn 15. The horn 15 is an elongated rod-like body, and has a tapered surface 15a that gradually narrows from both sides to the center in plan view. At the center of the horn 15, a suction unit 30 (crimp) is mounted. The suction portion 30 has a cross-sectional shape whose width is reduced by the stepped portion 31, and a suction hole 32 is provided at a distal end portion protruding downward (upward in FIG. 2). The suction hole 32 communicates with a vacuum suction hole 30 c formed inside the suction unit 30, and communicates with a vacuum suction hole 16 a provided inside the horn 15 when the suction unit 30 is fastened to the horn 15. . The vacuum suction hole 16a further communicates with a vacuum suction hole 16c opened on the upper surface of the horn 15 via a vacuum suction hole 16b inside the horn 15.
[0017]
In FIG. 1, a suction pad 19 is mounted on a protrusion 13 a provided on a side surface of the block 13, and the suction pad 19 is in contact with a vacuum suction hole 16 c on the upper surface of the horn 15. Therefore, by driving the suction device 56 (FIG. 1) connected to the suction pad 19 to suck air, an opening is formed at the distal end of the suction unit 30 through the horn 15 and the vacuum suction holes inside the suction unit 30. Vacuum suction is performed from the suction hole 32 (FIG. 3), and the electronic component 40 with the bump can be suction-held on the lower surface of the suction portion 30 (see also FIG. 4B). The suction unit 30 sucks and holds the electronic component 40, and also presses the electronic component 40 against the substrate 46 by abutting the top end of the electronic component 40 at the time of bonding.
[0018]
Ribs 15b are provided integrally with the horn 15 at four locations equidistant from the suction unit 30. The four ribs 15b are symmetrically protruded from the center of the horn 15 in plan view in order to improve the attachment balance to the block 13. The bonding tool 14 is detachably attached to the lower surface of the block 13 by screwing a bolt into a through hole 20 formed in the rib 15b. That is, the rib 15b is a mounting portion for mounting the horn 15 on the block 13.
[0019]
In FIG. 2, a vibrator 17 as a vibration applying means is mounted on a side end of the horn 15. By driving the vibrator 17, longitudinal vibration (vibration in the longitudinal direction of the horn 15) is applied to the horn 15, and the suction unit 30 vibrates in the horizontal direction a (longitudinal direction of the horn 15). The shape of the horn 15 is such that the width is gradually reduced from both end portions toward the center portion via a tapered surface 15a on the side surface. As a result, the amplitude of the ultrasonic vibration is amplified in the path transmitted from the vibrator 17 to the suction unit 30, and a vibration equal to or greater than the amplitude oscillated by the vibrator 17 is transmitted to the suction unit 30. Is transmitted to.
[0020]
Next, the attachment of the suction unit 30 to the horn 15 will be described with reference to FIG. As shown in FIG. 4A, a through hole 15c is provided in the center of the horn 15 in the vertical direction. The through hole 15c is provided at a position corresponding to the antinode of the standing wave vibration induced by the vibrator 17 in the horn 15 and is orthogonal to the length direction of the horn 15, and a taper is formed below the through hole 15c. A recess having a surface 15d is formed. The vacuum suction hole 16a is open on the tapered surface 15d.
[0021]
A screw hole 30b is provided on the upper surface of the suction portion 30 corresponding to the position of the through hole 15c, and a contact surface 30a having a shape corresponding to the tapered surface 15d is formed on both sides of the screw hole 30b. The vacuum suction hole 30a is open on the contact surface 30a. As shown in FIG. 4B, when the suction portion 30 is mounted, the bolt 33 is inserted through the through hole 15c with the contact surface 30a contacting the tapered surface 15d, and the bolt 33 is inserted into the screw hole 30b. By screwing, the suction unit 30 is fastened to the horn 15. By pulling out the bolt 33, the fastening of the suction part 30 is released. Therefore, the bolt 33 is a fastening means for detachably fastening the suction portion 30 to the horn 15.
[0022]
By employing the above-described fastening method, excellent effects as described below can be obtained. First, in the above-mentioned fastening method, the contact portion 30a is pressed against the tapered surface 15d by lifting the suction portion 30 from above the horn 15 with the bolt 33 inserted through the through hole 15c. For this reason, it is not necessary to arrange a part for fastening to the horn 15 around the suction unit 30, and the degree of freedom in setting the shape of the suction unit 30 and arranging the vacuum suction holes is ensured. It is possible to realize a suction portion 30 suitable for the shape of the electronic component and the required vibration characteristics, and to realize a stable fixed state by pressing the suction portion 30 against the horn 15 with a sufficient surface pressure.
[0023]
Further, by appropriately setting the shape and size of the portion of the bolt 33 projecting above the horn 15, it is possible to adjust the vertical mass distribution of the horn 15 to a desirable mass distribution for vibration transmission. In other words, this protruding portion can be used as a mass balance portion, whereby good vibration characteristics can be obtained.
[0024]
5 and 6 show examples of other mounting methods of the suction unit. FIG. 5 shows a structure in which a suction unit 30 'similar to the suction unit 30 shown in FIG. 4 is fastened by a combination of a bolt and a nut. In FIG. 5A, a bolt 34 is formed integrally with the suction portion 30 '. When the suction portion 30' is mounted, the bolt 34 is moved downward into the through hole 15c as shown in FIG. 5B. And project from the upper surface of the horn 15. Then, the suction portion 30 is fastened to the horn 15 by screwing and tightening the nut 35 to the bolt 34. In this example, the same effect as described above can be obtained. In this case, the nut 35 can be used as a mass balance unit.
[0025]
FIG. 6 shows an example of the arrangement of the vacuum suction holes communicating with the suction holes 32. In FIG. 6A, the suction unit 37 has a configuration in which the vacuum suction hole 30c is removed from the suction unit 30 shown in FIG. 4, and similarly to the suction unit 30, a screw hole 37 for fastening and a contact surface 37a are formed. Have. The suction portion 37 is fastened by a bolt 36 inserted into the through hole 15c, and cross-shaped suction holes 36b and 36c are provided inside a shaft portion 36a of the bolt 36. A ring groove 15e is provided in the middle of the through hole 15c, and the ring groove 15e communicates with a vacuum suction hole 16d inside the horn 15.
[0026]
When the contact surface 37a is brought into contact with the tapered surface 15d of the concave portion provided below the through hole 15c and the bolt 36 is screwed into the screw hole 37b as shown in FIG. 6B, the contact surface 37a Is pressed against the tapered surface 15 d, and the suction portion 37 is fastened to the horn 15. In this state, the suction hole 36b of the bolt 36 communicates with the ring groove 15e. Therefore, by sucking the vacuum from the vacuum suction hole 16d, the suction part 37 holds the electronic component 40 by vacuum suction in the suction hole 32 at the distal end. Also in this example, the same effect as that of the above-described suction unit 30 can be obtained.
[0027]
As described above, the bonding tool according to the present embodiment makes the suction portion as a crimping device that contacts the electronic component and transmits vibration and load detachable to the horn body, and furthermore, the suction portion attaches to the horn. A fastening method that does not require a fastening mechanism or member on the mounting surface is employed. Thus, when the contact surface of the suction portion with the electronic component is worn, only the suction portion needs to be replaced, and the running cost can be reduced. Moreover, according to the above-described fastening method, the degree of freedom in setting the shape and dimensions of the suction portion is ensured, so that a bonding tool having a stable fixed state and vibration characteristics can be realized.
[0028]
【The invention's effect】
According to the present invention, a through-hole provided at right angles to the longitudinal direction of the horn is provided at a position corresponding to the antinode of the standing wave vibration of the horn, and a crimping device that abuts against and presses the electronic component is penetrated through the through-hole. Since the horn is detachably fastened to the horn by fastening means for inserting the hole, when the crimping element is worn out by use, it is sufficient to replace only the crimping element, and the running cost can be reduced. And vibration characteristics can be maintained.
[Brief description of the drawings]
FIG. 1 is a front view of an electronic component bonding apparatus according to an embodiment of the present invention; FIG. 2 is an upside down perspective view of an electronic component bonding tool according to an embodiment of the present invention; FIG. 4A is a partial cross-sectional view of an electronic component bonding tool according to one embodiment of the present invention; FIG. 4B is a front view of an electronic component bonding tool according to one embodiment of the present invention; FIG. 5A is a partial cross-sectional view of a bonding tool for an electronic component according to an embodiment of the present invention. FIG. 5B is a partial cross-sectional view of a bonding tool for an electronic component according to an embodiment of the present invention. 6A is a partial cross-sectional view of a bonding tool for an electronic component according to one embodiment of the present invention; FIG. 6B is a partial cross-sectional view of a bonding tool for an electronic component according to one embodiment of the present invention;
14 bonding tool 15 horn 15c through hole 16a, 16b, 16c vacuum suction hole 17 vibrator 30, 30 ', 37 suction part 32 suction hole 33, 36 bolt 40 electronic component 46 substrate

Claims (3)

What is claimed is: 1. A bonding apparatus for an electronic component, which applies pressure and vibration to an electronic component while applying a load and vibration to the electronic component, comprising: a bonding tool that contacts the electronic component; and a pressing tool that presses the bonding tool against the electronic component. Means, the bonding tool comprises a horizontally long horn, a vibrator for imparting vibration to the horn, and a direction perpendicular to the length direction of the horn at a position corresponding to the antinode of the standing wave vibration of the horn. a through hole provided, the fastened tip detachably on the horn by a fastening means inserted through the through-hole is perforated and crimping element which abuts the electronic component, the electronic component at the tip of the Atchakuko and suction holes are provided to vacuum suction, the electronic unit the suction hole, characterized in that the communication with the vacuum suction hole provided in the horn while fastening the crimping element to the horn Bonding apparatus. What is claimed is: 1. A bonding tool for compressing an electronic component to a surface to be joined while applying a load and vibration to the electronic component, comprising: a horizontally long horn, a vibrator for applying vibration to the horn, and a standing wave vibration of the horn. A through hole provided at a position corresponding to the belly in a direction orthogonal to the length direction of the horn, and a detachable fastening to the horn by fastening means for inserting the through hole, the tip of which abuts on the electronic component. possess a crimping element for pressing the electronic component, is provided with suction holes for vacuum suction of electronic components to the tip portion of the Atchakuko, the horn while the suction holes that entered into the crimping element to the horn A bonding tool for an electronic component, which communicates with a provided vacuum suction hole . 3. The electronic component bonding tool according to claim 2, wherein the suction hole communicates with the vacuum suction hole via a suction hole provided in the fastening means .

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