JP2001035888A - Tool and device for bonding electronic part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a bonding device and bonding tool for electronic part which perform stable bonding at a low cost and stable vibration. SOLUTION: A bonding tool compression-bonds an electronic part to a bonding surface under a load and vibration. Here, a through hole 15c is provided, orthogonally to a length wise direction, at an electronic part pressurizing position corresponding to the loop of a standing wave vibration at the center of a horn 15, and a chucking part 30 which chucks and holds an electronic part 40 while pressurizing it to a substrate for compression-bonding is detachably fastened to the horn 15 with a bolt 33 penetrating the through hole 15c. Thus, no mechanism or part for fastening is required at the attaching surface of the chucking part 30, assuring a design flexibility for the chucking part 30 is assured as appropriate for a symmetrical electronic part, and stable tight- fitting state and vibration characteristics are kept.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component bonding apparatus and a bonding tool for bonding an electronic component such as an electronic component with a bump such as a flip chip to a surface to be bonded such as an electrode of a substrate.

[0002]

2. Description of the Related Art As a method for bonding an electronic component to a surface to be bonded such as an electrode of a substrate, a method using ultrasonic pressure welding is known. According to this method, ultrasonic vibration is applied to the electronic component while pressing the electronic component against the surface to be bonded, and the bonding surface is minutely vibrated to cause friction to bring the bonding surface into close contact. The bonding tool used in this method has a horn, which is an elongated rod that transmits the vibration of the ultrasonic vibrator, which is a vibration source, to an electronic component. While applying a load and vibration to the component, the electronic component is bonded to the surface to be joined by pressing. Since the load (load and vibration) at the time of bonding acts on the crimping element, the lower surface (the suction surface of the electronic component) is easily worn by repeated use. If the wear becomes excessive, normal bonding cannot be performed. Therefore, the crimping element must be periodically replaced. Conventionally, the replacement of the crimping element has been performed by replacing the entire horn or, when the crimping element is detachable from the horn body as a separate component, only exchanging the separate component.

[0003]

However, when the entire horn is replaced, the horn, which is an expensive part, is discarded as a consumable part, and the running cost is increased. In addition, even when only the crimping element is attached and detached and replaced, it is difficult to reproduce a stable fixed state with an unstable mounting state due to the method of fastening the crimping element to the horn body with the conventional bonding tool, Therefore, there has been a problem that the vibration characteristics tend to fluctuate and stable bonding cannot be performed.

An object of the present invention is to provide an electronic component bonding apparatus and a bonding tool which can perform stable bonding while performing stable vibration at low cost.

[0005]

According to a first aspect of the present invention, there is provided a bonding apparatus for an electronic component, which applies a load and a vibration to the electronic component while pressing the electronic component to a surface to be joined. A bonding tool that abuts the electronic component; and a pressing unit that presses the bonding tool against the electronic component. The bonding tool includes a horizontally long horn, a vibrator that applies vibration to the horn, and a A through-hole provided at a position corresponding to the antinode of the standing wave vibration, orthogonal to the longitudinal direction of the horn, and a fastening means which is inserted through the through-hole and detachably fastened to the horn, and a tip end of which is formed by the electronic device. And a crimping element for contacting the component.

According to a second aspect of the present invention, there is provided a bonding tool for an electronic component, which presses the electronic component to a surface to be joined while applying a load and vibration to the electronic component. And a through-hole provided at a position corresponding to the antinode of the standing wave vibration of the horn at a position orthogonal to the length direction of the horn, and a fastening means for inserting the through-hole into the horn. A crimping device that is detachably fastened and has a tip portion abutting against the electronic component and pressing the electronic component.

According to a third aspect of the present invention, there is provided a bonding tool for an electronic component according to the second aspect, wherein a suction hole for vacuum-suctioning the electronic component is provided at a tip end of the crimping element. The suction hole communicates with a vacuum suction hole provided in the horn with the crimping element fastened to the horn.

According to the present invention, a through hole is provided at a position corresponding to the antinode of the standing wave vibration of the horn so as to be orthogonal to the longitudinal direction of the horn, and is pressed against an electronic component. Can be detachably fastened to the horn by fastening means passing through the through hole, whereby a stable fixed state and vibration characteristics can be maintained.

[0009]

Embodiments of the present invention will now be described with reference to the drawings. FIG. 1 is a front view of an electronic component bonding apparatus according to an embodiment of the present invention. FIG. 2 is an upside down perspective view of the electronic component bonding tool. FIG. 3 is a front view of the electronic component bonding tool. (A),
FIGS. 5B, 5A, 5B, 6A, and 6B are partial cross-sectional views of a bonding tool for the electronic component.

First, the overall structure of an electronic component bonding apparatus will be described with reference to FIG. Reference numeral 1 denotes a support frame, on the front surface of which a first lifting plate 2 and a second lifting plate 3 are provided so as to be able to move up and down. A cylinder 4 is mounted on the first lifting plate 2, and its rod 5 is connected to the second lifting plate 3. The bonding head 10 is mounted on the second lifting plate 3. On the upper surface of the support frame 1, a Z-axis motor 6 is provided. The Z-axis motor 6 has a vertical feed screw 7
To rotate. The feed screw 7 is screwed into a nut 8 provided on the back surface of the first lifting plate 2. Therefore, when the Z-axis motor 6 is driven and the feed screw 7 is rotated, the nut 8 moves up and down along the feed screw 7, and the first lifting plate 2 and the second lifting plate 3
Also move up and down.

In FIG. 1, a substrate 46 whose upper surface is a surface to which electronic components are joined is placed on a substrate holder 47,
The substrate holder 47 is placed on a table 48. The table 48 is a movable table, and horizontally moves the substrate 46 in the X direction and the Y direction to position the substrate 46 at a predetermined position. The table 48 holds the electronic component 40 on the substrate 4
6 serves as positioning means for relatively moving.

Reference numeral 42 denotes a camera, which is a uniaxial table 43
It is attached to. Reference numeral 44 denotes a lens barrel extending forward from the camera 42. The camera 42 is moved forward along the uniaxial table 43, and as shown by a dashed line, the tip of the lens barrel 44 is attracted to the lower surface of the bonding tool 14 by suction and held as a bonded article, for example, an electronic component with a bump such as a flip chip. The electronic component 40 and the substrate 46 are observed by the camera 42 in this state.

Reference numeral 53 denotes a recognition unit which recognizes images of the electronic component 40 and the board 46 captured by the camera 42 and detects their positions. Reference numeral 50 denotes a main control unit which controls the vertical movement of the Z-axis motor 6, that is, the bonding head 10 via a motor drive unit 51, and positions the table 48, that is, the substrate 46, via a table control unit 52. Further, the main control unit 50 calculates a displacement between the electronic component 40 and the board 46 in the horizontal plane based on the positions of the electronic component 40 and the board 46 detected by the recognition unit 53, and drives the table 48 to correct the displacement. Further, a load control unit 54 and a suction device 56 are connected to the main control unit 50.

The cylinder 4 as a pressing means is connected to the main control unit 50 via a load control unit 54, and the projection output of the rod 5 of the cylinder 4, that is, the bonding tool 14
The pressing load for pressing the electronic component with bumps 40 against the substrate 46 is controlled. The suction device 56 is operated by the bonding tool 14 in response to a command from the main control unit 50.
Suction of 0 and release of suction are performed. The vibrator 17 composed of an ultrasonic vibrator is connected to the main control unit 5 via an ultrasonic vibrator driving unit 55.
0, and performs ultrasonic vibration according to a command from the main control unit 50.

A holder 12 is connected to the lower end of the main body 11 of the bonding head 10. A block 13 is mounted on the holder 12, and a bonding tool 14 is fixed to the block 13. The protrusion 13 a on the side of the block 13 is connected to the suction device 56. Hereinafter, the bonding tool 14 will be described with reference to FIGS. 2, 3 and 4.
Will be described.

As shown in FIGS. 2, 3 and 4, the bonding tool 14 is mainly composed of a horizontally long horn 15. The horn 15 is a slender rod-shaped body, and has a tapered surface 15a that becomes gradually narrower from both sides to the center in plan view. At the center of the horn 15, a suction part 30 (crimp) is mounted. The suction part 30 has a cross-sectional shape narrowed by the stepped part 31, and a suction hole 32 is provided at a tip part protruding downward (upward in FIG. 2). The suction hole 32 communicates with a vacuum suction hole 30c formed inside the suction unit 30, and communicates with a vacuum suction hole 16a provided inside the horn 15 when the suction unit 30 is fastened to the horn 15. . The vacuum suction hole 16a further communicates with a vacuum suction hole 16c opened on the upper surface of the horn 15 via a vacuum suction hole 16b inside the horn 15.

In FIG. 1, a suction pad 19 is mounted on a protrusion 13a provided on a side surface of the block 13, and the suction pad 19 is provided on the vacuum suction hole 1 on the upper surface of the horn 15.
6c. Accordingly, by driving the suction device 56 (FIG. 1) connected to the suction pad 19 to suck air, an opening is formed at the distal end of the suction unit 30 through the horn 15 and the vacuum suction holes inside the suction unit 30. Vacuum suction is performed from the suction hole 32 (FIG. 3), and the electronic component 40 with the bump can be suction-held on the lower surface of the suction portion 30 (see also FIG. 4B). The suction unit 30 sucks and holds the electronic component 40, and presses the electronic component 40 against the substrate 46 by abutting the front end portion of the electronic component 40 during bonding.

Ribs 15b are provided integrally with the horn 15 at four places equidistant from the suction section 30.
In order to improve the mounting balance to the block 13,
The four ribs 15b are provided at the suction portion 30 at the center of the horn 15.
Are projected symmetrically in plan view with respect to the center. The bonding tool 14 has a through hole 2 formed in a rib 15b.
It is detachably attached to the lower surface of the block 13 by screwing a bolt into the block 0. That is, the rib 15b is a mounting portion for mounting the horn 15 on the block 13.

In FIG. 2, a vibrator 17 as a vibration applying means is mounted on a side end of the horn 15. By driving the vibrator 17, longitudinal vibration (vibration in the longitudinal direction of the horn 15) is applied to the horn 15, and the suction unit 30 vibrates in the horizontal direction a (longitudinal direction of the horn 15). The shape of the horn 15 is such that the width is sequentially reduced from both end portions toward the center portion via a tapered surface 15a on the side surface.
As a result, the amplitude of the ultrasonic vibration is amplified in the path transmitted from the vibrator 17 to the suction unit 30, and a vibration having an amplitude greater than or equal to the oscillation of the vibrator 17 is transmitted to the suction unit 30. Is transmitted to

Next, referring to FIG.
5 will be described. As shown in FIG. 4A, a through hole 15c is provided in the center of the horn 15 in the vertical direction. During this time, the through hole 15c is provided at a position corresponding to the antinode of the standing wave vibration induced by the vibrator 17 in the horn 15 and is orthogonal to the longitudinal direction of the horn 15,
A recess having a tapered surface 15d is formed below the through hole 15c. The vacuum suction hole 16a is open on the tapered surface 15d.

A screw hole 30b is provided on the upper surface of the suction portion 30 corresponding to the position of the through hole 15c, and a contact surface 30a having a shape corresponding to the tapered surface 15d is formed on both sides of the screw hole 30b. . The vacuum suction hole 30a is open on the contact surface 30a. As shown in FIG. 4 (b), when the suction portion 30 is mounted, the bolt 33 is inserted through the through hole 15c with the contact surface 30a contacting the tapered surface 15d, and the bolt 33 is inserted into the screw hole 30b. By screwing, the suction portion 30
To the horn 15. By pulling out the bolt 33, the fastening of the suction part 30 is released. Therefore, the bolt 33 is a fastening means for detachably fastening the suction portion 30 to the horn 15.

By employing the above-described fastening method, the following excellent effects can be obtained. First, in the above-mentioned fastening method, the suction portion 30 is pulled up from the upper side of the horn 15 by the bolt 33 inserted through the through hole 15c, so that the contact portion 30a is tapered 15d.
Pressed against. For this reason, it is not necessary to arrange a part for fastening to the horn 15 around the suction unit 30, and the degree of freedom in setting the shape of the suction unit 30 and arranging the vacuum suction holes is ensured. The suction unit 30 can be realized in conformity with the shape of the electronic component and the required vibration characteristics.
To achieve a stable fixing state.

Further, by appropriately setting the shape and dimensions of the portion of the bolt 33 projecting above the horn 15, the vertical mass distribution of the horn 15 can be adjusted to a desirable mass distribution for transmitting vibration. Becomes That is,
This protruding portion can be used as a mass balance portion, whereby good vibration characteristics can be obtained.

FIGS. 5 and 6 show examples of other mounting methods of the suction section. FIG. 5 shows a case in which a suction unit 30 'similar to the suction unit 30 shown in FIG. 4 is fastened by a combination of a bolt and a nut. In FIG. 5A, a bolt 34 is formed integrally with the suction unit 30 ′, and the suction unit 30 ′ is formed.
At the time of mounting, as shown in FIG.
Is inserted through the through hole 15c from below, and protrudes from the upper surface of the horn 15. Then, the suction portion 30 is fastened to the horn 15 by screwing and tightening the nut 35 to the bolt 34. In this example, the same effect as described above can be obtained. In this case, the nut 35 can be used as a mass balance unit.

FIG. 6 shows an example of the arrangement of the vacuum suction holes communicating with the suction holes 32. In FIG. 6A, the suction unit 37 has a configuration in which the vacuum suction hole 30c is removed from the suction unit 30 shown in FIG. 4, and similarly to the suction unit 30, a screw hole 37 for fastening and a contact surface 37a are formed. Have.
The suction portion 37 is fastened by a bolt 36 inserted through the through hole 15c. Cross-shaped suction holes 36b and 36c are provided inside a shaft portion 36a of the bolt 36. A ring groove 15e is provided in the middle of the through hole 15c, and the ring groove 15e communicates with a vacuum suction hole 16d inside the horn 15.

The contact surface 37a is brought into contact with the tapered surface 15d of the concave portion provided below the through hole 15c, as shown in FIG.
When the bolt 36 is screwed into the screw hole 37b as shown in FIG. 7, the contact surface 37a is pressed against the tapered surface 15d, and the suction portion 37 is fastened to the horn 15. In this state, the suction hole 36b of the bolt 36 communicates with the ring groove 15e.
Therefore, by suctioning the vacuum through the vacuum suction hole 16d, the suction part 37 is inserted into the suction hole 32 at the tip end by the electronic component 40
Is held by vacuum suction. Also in this example, the same effect as that of the above-described suction unit 30 can be obtained.

As described above, in the bonding tool according to the present embodiment, the suction portion as a crimping device for transmitting vibration and load by coming into contact with the electronic component can be detachably attached to the horn body. This adopts a fastening method that does not require a fastening mechanism or member on the mounting surface to the horn. Thus, when the contact surface of the suction section with the electronic component is worn out, only the suction section needs to be replaced, and the running cost can be reduced. Moreover, according to the above-described fastening method, the degree of freedom in setting the shape and dimensions of the suction portion is ensured, so that a bonding tool having a stable fixed state and vibration characteristics can be realized.

[0028]

According to the present invention, a through-hole is provided at a position corresponding to the antinode of the standing wave vibration of the horn, and the through-hole is provided to be orthogonal to the longitudinal direction of the horn, and is pressed against the electronic component. Since the crimping element is detachably fastened to the horn by fastening means for inserting the through-hole, when the crimping element is worn out by use, it is sufficient to replace only the crimping element, and the running cost can be reduced. In addition, a stable fixing state and vibration characteristics can be maintained.

[Brief description of the drawings]

FIG. 1 is a front view of an electronic component bonding apparatus according to an embodiment of the present invention.

FIG. 2 is an upside down perspective view of a bonding tool for an electronic component according to an embodiment of the present invention.

FIG. 3 is a front view of the electronic component bonding tool according to the embodiment of the present invention;

4A is a partial cross-sectional view of a bonding tool for an electronic component according to one embodiment of the present invention; FIG. 4B is a partial cross-sectional view of a bonding tool for an electronic component according to one embodiment of the present invention;

5A is a partial cross-sectional view of a bonding tool for an electronic component according to an embodiment of the present invention. FIG. 5B is a partial cross-sectional view of a bonding tool for an electronic component according to an embodiment of the present invention.

6A is a partial cross-sectional view of a bonding tool for an electronic component according to an embodiment of the present invention; FIG. 6B is a partial cross-sectional view of a bonding tool for an electronic component according to an embodiment of the present invention;

[Explanation of symbols]

 Reference Signs List 14 bonding tool 15 horn 15c through hole 16a, 16b, 16c vacuum suction hole 17 vibrator 30, 30 ', 37 suction part 32 suction hole 33, 36 volt 40 electronic component 46 substrate

Continuation of the front page (72) Inventor Kenichi Otake 1006 Kazuma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. F term (reference) 5F044 PP16

Claims (3)

[Claims] An electronic component bonding apparatus for pressing an electronic component against a surface to be joined while applying a load and vibration to the electronic component, wherein the bonding tool abuts on the electronic component, and the bonding tool is connected to the electronic component. Pressing means for pressing the component, the bonding tool,
A horizontally long horn, a vibrator for imparting vibration to the horn, a through hole provided at a position corresponding to the antinode of the standing wave vibration of the horn, and a through hole provided orthogonally to the length direction of the horn; And a crimping device, which is detachably fastened to the horn by fastening means for inserting the electronic component, and a tip of which is in contact with the electronic component. 2. A bonding tool for pressing an electronic component to a surface to be joined while applying a load and vibration to the electronic component, comprising: a horizontally long horn; a vibrator for applying vibration to the horn; A through-hole provided at a position corresponding to the antinode of the standing wave vibration, orthogonal to the longitudinal direction of the horn, and a fastening means which is inserted through the through-hole and detachably fastened to the horn, and a tip end of which is formed by the electronic device. A bonding tool for contacting the component and pressing the electronic component. 3. A suction hole for vacuum-sucking an electronic component is provided at a tip of the crimping device, and the suction hole communicates with a vacuum suction hole provided on the horn when the crimping device is fastened to the horn. The electronic component bonding tool according to claim 2, wherein