JP2008277487A - Ultrasonic bonding apparatus, and bonding method of electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To bond an electronic component and a wiring board together in the region wherein the difference of the ultrasonic vibration between the central portion and the end portion of the electronic component can be permitted enough. <P>SOLUTION: The length 20 of an ultrasonic vibrator 1 in the direction perpendicular to the ultrasonic vibration direction 5 is set to be smaller than the length 8 of the electronic component 4 in the direction perpendicular to the ultrasonic vibration direction 5, and the length 7 of a tool 3 and an ultrasonic horn 2 in the direction perpendicular to the ultrasonic vibration direction 5 is set to be larger than the length 8 of the electronic component 4 in the direction perpendicular to the ultrasonic vibration direction 5. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an ultrasonic bonding apparatus that bonds a wiring electrode on a wiring board such as ceramic or polyimide and an electrode of an electronic component such as a semiconductor chip using ultrasonic vibration, and a method for bonding the electronic component.

  As one method for joining electrodes on an electronic component and wiring on a wiring board, a joining method using ultrasonic vibration has been conventionally used.

  6A and 6B are explanatory views showing a state in which the electronic component and the wiring board are being bonded by a conventional ultrasonic bonding apparatus. FIG. 6A is a front view, and the right view of FIG. The bottom view excluding the substrate and the left figure in FIG. 6B are explanatory diagrams showing the relationship between the position on the tool and the ultrasonic amplitude when there is no load.

  As shown in FIG. 6A, the ultrasonic vibration generated by the ultrasonic vibrator 1 is transmitted through an ultrasonic horn 2 that transmits the ultrasonic vibration and a tool 3 that directly contacts the mounted electronic component 4. Are transmitted to the electronic component 4, and the electrode on the electronic component 4 and the wiring electrode on the wiring substrate 14 are joined. The ultrasonic amplitude 9 when there is no load shown in the left diagram of FIG. 6B approximately represents the transmission amount of ultrasonic vibration when the load is applied.

  FIG. 7 is a diagram illustrating a relationship between a load condition and an ultrasonic vibration condition applied to each joint portion of the electronic component and a non-defective product or a defective product of each joint portion of the electronic component. In the low load or low ultrasonic vibration region, due to insufficient load energy, the connection interface peels off due to insufficient bonding strength, and in the high load or high ultrasonic vibration region, the electronic component 4 or the wiring board 14 is destroyed due to overload energy.

Therefore, it is necessary to set the load value and the ultrasonic vibration value, which are the bonding conditions, within a range in which the bonding strength can be secured and the electronic component 4 or the wiring board 14 is not broken.
JP 2004-330228 A

  In the prior art, in order to transmit ultrasonic vibration uniformly to the entire surface of the electronic component 4, the tool 3 needs to be in contact with the entire surface of the electronic component 4 to be joined. The length in the direction perpendicular to the vibration direction 5 is desirably larger than the length in the direction perpendicular to the ultrasonic vibration direction 5 in the electronic component 4.

  Further, when the ultrasonic horn 2 and the tool 3 are enlarged, the portion where the ultrasonic vibration energy generated by the ultrasonic vibrator 1 is consumed increases. Therefore, in order to easily transmit the ultrasonic vibration, the ultrasonic horn 2 and tool 3 should be as small as possible. Therefore, in the prior art, the length 8 of the electronic component 4 perpendicular to the ultrasonic vibration direction 5 and the length 7 of the tool 3 perpendicular to the ultrasonic vibration direction 5 are the same length. .

  However, in recent years, the superiority of the ultrasonic bonding method capable of bonding the low-temperature electronic component 4 in a short time compared to other bonding methods such as AuSn eutectic bonding and solder bonding has been recognized. Application to bonding forms is expected. In particular, in the case of electronic component joining forms such as image display drive driver ICs, which are expected to have a narrow electrode pitch, problems such as misalignment of the joining position occur due to thermal expansion of each component due to temperature load. The application of an ultrasonic bonding method capable of bonding is most expected.

  However, the transmission of the ultrasonic vibration becomes worse as the part of the tool 3 moves away from the center line 17 of the ultrasonic transducer 1 shown in the right diagram of FIG. 6B in the direction perpendicular to the center line 17. That is, as shown in the left diagram of FIG. 6B, there is a difference in the transmission of ultrasonic amplitude, that is, ultrasonic vibration, between the center portion of the tool 3 and the end portion of the tool 3. The transmission of ultrasonic vibration becomes extremely small.

  Furthermore, the ultrasonic vibrator 1 is usually composed of a piezoelectric element, but it is difficult to produce the piezoelectric element when the forming process of the piezoelectric element is 15 mm or more. However, since many image display driver ICs are composed of electronic parts 4 having a long side of 15 mm or more, the length of the ultrasonic transducer 1 in the direction perpendicular to the ultrasonic vibration direction 5 is long. However, it may be smaller than the length of the electronic component 4 in the direction perpendicular to the ultrasonic vibration direction 5. In this case, the difference in ultrasonic vibration between the central portion and the end portion of the tool 3 and the electronic component 4 is further increased.

  As described above, the bonding condition of the electronic component 4 needs to be a condition in which the electronic component 4 and the wiring substrate 14 are not bonded and destroyed. When a difference occurs in the transmission of the sonic vibration, the bonding condition actually applied to each joint in the electronic component 4 has a range as shown in FIG. It is not possible to find a joining condition that satisfies both strength securing and non-destructiveness of the joining portion of the electronic component 4 and the wiring board 14.

  The object of the present invention is to solve the above-mentioned conventional problems and to join the electronic component and the wiring board in a region where the difference in ultrasonic vibration between the central portion and the end portion of the electronic component is sufficiently allowed. An object of the present invention is to provide an ultrasonic bonding apparatus and an electronic component bonding method.

  In order to achieve the above object, the invention relating to the ultrasonic bonding apparatus according to claim 1 transmits the ultrasonic vibration generated from the ultrasonic vibrator to the electronic component on the wiring board via the ultrasonic horn and the tool. In the ultrasonic bonding apparatus for bonding the electronic component and the wiring board, the length in the direction perpendicular to the ultrasonic vibration direction in the ultrasonic vibrator is in the ultrasonic vibration direction in the electronic component to be bonded. The length in the direction perpendicular to the direction of ultrasonic vibration in the tool and the ultrasonic horn is smaller than the length in the direction perpendicular to the direction of ultrasonic vibration in the electronic component. Is set to be larger.

  According to a second aspect of the present invention, in the ultrasonic bonding apparatus according to the first aspect, the ultrasonic horn has a maximum amplitude point of ultrasonic vibration at a central portion in the longitudinal direction, and the tool has a maximum amplitude of ultrasonic vibration. It is arranged at the center of the ultrasonic horn as a point.

  According to a third aspect of the present invention, in the ultrasonic bonding apparatus according to the first or second aspect, the ultrasonic horn is fixed by the support member only at the nodal portion of the ultrasonic horn that is not affected by the ultrasonic vibration. It is characterized by.

  The invention according to claim 4 is the ultrasonic bonding apparatus according to any one of claims 1 to 3, wherein the contact portion of the load application member that applies a load to the tool with the ultrasonic horn is the maximum of the ultrasonic horn. It is arrange | positioned on the installation position of the tool which is an amplitude point, and it was set as the structure which contacts the contact part of a load application member, and an ultrasonic horn, and applies an ultrasonic wave to an electronic component.

  The invention relating to the electronic component bonding method according to claim 5 is a bonding method for bonding an electronic component and a wiring board using the ultrasonic bonding apparatus according to any one of claims 1 to 4, The electronic component and the wiring board are joined at a position where the center of the tool and the center of the electronic component overlap in a direction perpendicular to the sound wave vibration direction.

  According to the present invention, the electronic component and the wiring board can be joined within a region where a difference in ultrasonic vibration between the central portion and the end portion of the electronic component is sufficiently allowed. Since sufficient bonding and nondestructiveness can be satisfied at the same time, it is possible to stably bond the electronic component and the wiring board.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a schematic configuration diagram of an embodiment of an ultrasonic bonding apparatus according to the present invention.

  As shown in FIG. 1, the ultrasonic bonding apparatus includes a wiring board holding unit 24 that holds the wiring board 14, and is held by the wiring board holding unit 24 on the (+ Z) direction side of the wiring board holding unit 24. A joining mechanism 21 for joining the electronic component 4 to the wiring board 14 is provided. An imaging mechanism 27 that images the electronic component 4 and the wiring board 14 is disposed between the wiring board holding unit 24 and the bonding mechanism 21. Further, a supply mechanism (not shown) for supplying the electronic component 4 to the joining mechanism 21 is installed. In this ultrasonic bonding apparatus, these mechanisms are controlled by the control unit 40, whereby the wiring board 14 and the electronic component 4 are bonded.

  The wiring board holding unit 24 includes a stage 25 that holds the wiring board 14 and a stage moving mechanism 26 that moves the stage 25 in the X direction and the Y direction. The bonding mechanism 21 includes a bonding head 23 and a lifting mechanism 22 that moves (lifts) the bonding head 23 in the Z direction. The imaging mechanism 27 includes an imaging unit 28 that images the electronic component 4 and the wiring board 14, and an imaging unit moving mechanism 29 that moves in the X direction and the Y direction.

  FIG. 2 is a flowchart relating to the operation of bonding the electronic component 4 to the wiring board 14 using the ultrasonic bonding apparatus shown in FIG.

  In FIG. 2, the electronic component 4 supplied by the supply mechanism is first adsorbed by the bonding head 23 under the control of the control unit 40 (S11). Next, the imaging unit 28 moves between the electronic component 4 and the wiring board 14, and images the sucked electronic component 4 and the wiring board 14 held on the stage 25 (S12). Next, the image data is sent to the control unit 40, and the electronic component 4 stored in advance and the image data of the wiring board 14 are respectively compared to detect the position and orientation of the electronic component 4 and the wiring board 14 (S13). . Next, based on the detection result, the electronic component 4 and the wiring board 14 are corrected to a preset relative position and orientation (S14). The imaging unit 28 is retracted to a position where it does not come into contact with the electronic component 4 or the bonding head 23, and the bonding head 23 descends to bond the electronic component 4 and the wiring board 14 (S15). And the adsorption | suction of the electronic component 4 by the joining head 23 is cancelled | released, and the joining head 23 raises (S16), and one cycle of joining operation | movement is completed.

  In the step of correcting the electronic component 4 and the wiring board 14 to the preset relative position and orientation (S14), a correction mechanism is provided by providing a separate moving mechanism in the joining mechanism 21 instead of the stage moving mechanism 26 shown in FIG. May be performed.

  FIG. 3 is a diagram showing profiles of ultrasonic vibration conditions and load conditions, which are conditions for bonding the electronic component 4, and the electronic component 4 and the wiring board 14 portions at each bonding time. FIG. 3A shows a profile of ultrasonic vibration and load conditions. FIGS. 3B1 to 3B3 show the electronic component 4 and the wiring board 14 and the electronic component 4 and the wiring board 14 at each bonding time. FIG. 3 (c1) to FIG. 3 (c3) are cross-sectional views showing the configuration of the bonding material 13 for bonding the electrodes, and FIG. 3 (c3) shows the electrons of the bonding material 13 arranged between the electronic component 4 and the wiring board 14 at each bonding time. It is a figure which shows the area | region of a contact surface with the electrode 12 on components. In addition, 5 in a figure shows an ultrasonic vibration direction.

  Hereinafter, the relationship between each profile of the ultrasonic vibration condition and the load condition and the state of the electronic component 4 and the wiring board 14 at each bonding time will be described with reference to FIG. First, the wiring board 14 in which the bonding material 13 is arranged on the wiring electrode 15 and the electronic component 4 are prepared [FIG. 3 (a) at 0 second, FIG. 3 (b1), FIG. 3 (c1): initial region 30. ]. Next, only a load is applied for t1 seconds [FIG. 3 (a) 0 second to t1 second, FIG. 3 (b2), FIG. 3 (c2): region 31 enlarged by load]. The load F [N] applied at this time is set to a sufficient value so that the electronic component 4 is not displaced when ultrasonic vibration is applied after t1 [s]. Next, ultrasonic vibration P [W] and load F [N] are applied until t2 seconds after t1 second to complete the bonding profile [FIG. 3 (a) t1 to t2 seconds, FIG. 3 (b3). FIG. 3 (c3): Region 32 enlarged by load + ultrasonic vibration].

  Here, since the region 31 enlarged by the load of the bonding material 13 shown in FIG. 3C2 has a low bonding strength, the load F [N] is sufficient for the electronic component 4 not to be displaced, and A small value is desirable.

  In the present embodiment, a bonding method in which the wiring substrate 14 on which the bonding material 13 is previously arranged on the wiring and the electronic component 4 are bonded to each other will be described as an example. However, the bonding material 13 is previously arranged on the electronic component 4. It may be. Further, the load or ultrasonic vibration after t1 [s] does not necessarily have to be constant as shown in FIG. 3A, and the control factor of the ultrasonic vibration is not the power W, but the voltage or current. It may be.

  FIG. 4 is an explanatory diagram showing the relationship between the load condition and ultrasonic vibration condition applied to each joint portion of the electronic component 4 and the non-defective / defective products at each joint portion of the electronic component 4 according to this embodiment. In FIG. 4, a region 36 indicates a range of bonding conditions that are actually loaded in each region of the electronic component.

  As shown in FIG. 4, it is necessary to set the load value and ultrasonic vibration, which are bonding conditions, within a range in which bonding strength can be ensured and the electronic component 4 or the wiring board 14 does not break down. Although depending on the characteristics of the material, for example, about 5N to 500N is appropriate for a load, and about 0.5 μm to 10 μm is appropriate for ultrasonic vibration when converted to an ultrasonic amplitude at no load.

  When heat is applied to the joint between the electronic component 4 and the wiring board 14 in addition to the load and ultrasonic vibration, mutual diffusion of the bonding material 13, the electronic component upper electrode 12, and the wiring electrode 15 on the wiring board 14 is caused. This facilitates bonding with a lower load and lower ultrasonic vibration, so that the margin of bonding conditions is widened, and a more stable quality can be obtained.

  FIG. 5 is a configuration diagram of the joining head 23 shown in FIG. FIG. 5A is a front sectional view of the joining head, the right view of FIG. 5B is a bottom view of the joining head, and the left view of FIG. FIG. 5B is an explanatory diagram showing the relationship between the ultrasonic amplitude, the lower diagram in FIG. 5B is an explanatory diagram showing the relationship between the ultrasonic horn and the ultrasonic amplitude when there is no load, and FIG. 5C is a component of the joining head. It is a bottom view which shows the positional relationship of the suction hole for adsorption | suction of the electronic component in a tool, the electronic component, and the screw hole for tool attachment / detachment. FIG. 5 also shows the electronic components held by the bonding head. Moreover, the ultrasonic amplitude 9 at the time of no load shown in the left figure of FIG.5 (b) represents the transmission amount of the ultrasonic vibration at the time of a load application approximately.

  As shown in FIG. 5, the bonding head 23 includes a tool 3 that attracts the electronic component 4, an ultrasonic vibrator 1 that generates ultrasonic vibrations, an ultrasonic horn 2 that transmits ultrasonic vibrations to the tool 3, and an ultrasonic horn 2. Support member 10 and load application member 11. The ultrasonic horn 2 has a maximum amplitude point 35 of ultrasonic vibration in the central portion in the longitudinal direction, and the tool 3 is disposed in the central portion of the ultrasonic horn 2 that is the maximum amplitude point 35 of ultrasonic vibration. . With this configuration, ultrasonic vibration can be transmitted to the electronic component 4 most efficiently.

  The ultrasonic transducer 1 is disposed at one end of the ultrasonic horn 2 in the longitudinal direction, and ultrasonically vibrates in the longitudinal direction of the ultrasonic wave. The ultrasonic horn 2 is fixed by the support member 10 only at the nodal portion 34 (node portion) in ultrasonic vibration. With such a configuration, the ultrasonic horn 2 can be held without inhibiting the ultrasonic vibration of the ultrasonic horn 2.

  The load applying member 11 that applies a load to the tool 3 is disposed on the position of the tool 3 that is the maximum amplitude point 35 of the ultrasonic horn 2 and is not fixedly coupled to the ultrasonic horn 2 with screws, bolts, or the like. The load application member 11 and the surface including the maximum amplitude point 35 of the ultrasonic horn 2 on the opposite surface of the tool 3 are in contact with each other. The contact surface of the load application member 11 with the ultrasonic horn 2 is preferably made of a material having high friction resistance and a small friction coefficient. For example, a cemented carbide or diamond may be used.

  According to this configuration, for example, the load can be applied in a larger area than the load applied to the ultrasonic horn 2 only by the support member 10 that is the nodal portion 34 of the ultrasonic vibration. 11, a large load can be applied without worrying about the rigidity of the motor 11, and the ultrasonic horn 2 can be vibrated ultrasonically without being disturbed by the load application member 11. 4 can be applied.

  Here, if the shape of the contact portion of the load application member 11 with the ultrasonic horn 2 is an acute angle portion of 90 degrees or less, the superposition of the load application member 11 is caused by friction with the ultrasonic horn 2 during ultrasonic vibration. Since the sharp portion of the contact portion with the sonic horn 2 is easily chipped and becomes a dust generation source, the contact portion C of the load applying member 11 with the ultrasonic horn 2 is, for example, an inclined surface as shown in FIG. A shape without an acute angle part is desired by processing or the like.

  The tool 3 is made of stainless steel having vibration characteristics and vibration transmission characteristics suitable for joining the electronic component 4, and includes a plurality of suction holes 33 used for suction of the electronic component 4.

  Here, in order to attract and hold the electronic component 4 with the tool 3 without displacement even when the bonding head 23 moves, it is necessary to suck the entire surface of the electronic component 4 evenly. In addition, it is desirable to install a plurality of suction pumps corresponding to the respective suction holes to increase the apparatus cost. Therefore, it is desirable that the plurality of suction holes be connected to one suction pump. Therefore, all the suction holes 33 must be sealed with the electronic component 4 in order to develop the suction force of the electronic component 4 stably. That is, in order to stably suck the electronic component 4 with the tool 3, for example, the plurality of suction holes 33 as shown in FIG. 5C are in the region of the sucked electronic component 4 and the electronic component 4. It is desirable to be evenly arranged in all areas.

  Further, the length 20 in the direction perpendicular to the ultrasonic vibration direction 5 in the ultrasonic vibrator 1 is smaller than the length 8 in the direction perpendicular to the ultrasonic vibration direction 5 in the electronic component 4 to be joined, and the tool. 3 and the length 7 in the direction perpendicular to the ultrasonic vibration direction 5 in the ultrasonic horn 2 are both larger than the length 8 in the direction perpendicular to the ultrasonic vibration direction 5 in the electronic component 4. According to the present embodiment, since the ultrasonic transducer 1 is smaller than the electronic component 4, it is possible to apply the existing ultrasonic transducer 1 having a size that can be manufactured even for the electronic component 4 having a large size. it can.

  Like the ultrasonic vibration waveform 9 shown in the left diagram of FIG. 5B, the ultrasonic amplitude in the tool 3, that is, the difference between the ultrasonic vibrations, except for the end of the tool 3 in the direction perpendicular to the ultrasonic vibration direction 5. Therefore, for example, the length in the direction perpendicular to the ultrasonic vibration direction 5 is smaller than the length in the direction perpendicular to the ultrasonic vibration direction 5 in the region where the difference in ultrasonic amplitude in the tool 3 is small. By preparing the electronic component 4 and joining the electronic component 4 at a position where the center of the tool 3 and the center of the electronic component 4 overlap in a direction perpendicular to the ultrasonic vibration direction 5, the ultrasonic vibration direction in the electronic component 4 5, the transmission of ultrasonic vibration can be made approximately the same at the center and the end in the vertical direction.

  Since the transmission of the ultrasonic vibration can be made approximately the same in this way, the region 32 expanded by the load + ultrasonic vibration shown in FIG. Thus, the electrodes at the center and the end in the vertical direction can be made approximately the same, and the junction between the electrode at the center and the end in the direction perpendicular to the ultrasonic vibration direction 5 in the electronic component 4 The strength can be made approximately the same, and the load applied to the electrode portions of the central portion and the end portion in the direction perpendicular to the ultrasonic vibration direction 5 in the electronic component 4 can be made approximately the same at the time of joining. can do.

  Therefore, the range 36 of the bonding condition that is actually loaded on each joint of the electronic component 4 is much smaller than that in the past, and is actually loaded on each joint of the electronic component 4 as shown in FIG. It is possible to set the joining condition range 36 within the range of the good joining product.

  In particular, experiments have shown that it is sufficient if the length of the tool 3 and the ultrasonic horn 2 in a direction perpendicular to the ultrasonic vibration direction 5 is 1.5 times or more that of the electronic component 4, for example, When the length of the electronic component 4 in the direction perpendicular to the ultrasonic vibration direction 5 is 20 mm, it is sufficient that the length of the tool 3 in the direction perpendicular to the ultrasonic vibration direction 5 is 30 mm or more.

  Further, the tool 3 is not necessarily integrated with the ultrasonic horn 2 and may be detachable by a tool attaching / detaching screw 18 in order to improve maintainability.

  The configuration shown in FIG. 5 is such that the tool 3 can be attached and detached, and the cross-sectional thickness of the tool 3 perpendicular to the contact surface with the electronic component 4 is as shown in FIG. As shown in FIG. 5C, the flat surface of the tool 3 parallel to the surface in contact with the electronic component 4 is thinner than the portion in which the screw 18 is fastened. Each corner has a screw hole 19 for attaching / detaching a tool.

  Further, as shown in FIG. 5B, the contact surface of the tool 3 with the electronic component 4 is parallel to the contact surface of the electronic component 4 with the tool 3, and the tool attaching / detaching screw 18 is provided with the electronic component. The tool 3 is fastened to the ultrasonic horn 2 by four tool attaching / detaching screws 18 so as not to contact with the tool 4.

  According to the above configuration, since the tool 3 is thin at the fastening portion of the tool attaching / detaching screw 18, the tool attaching / detaching screw 18 does not interfere with the electronic component 4, and thus an ultrasonic device that does not destroy the electronic component 4 is provided. be able to.

  Further, as the material of each member, it is considered that a piezoelectric element is suitable for the ultrasonic vibrator 1 and stainless steel is suitable for the ultrasonic horn 2.

  As described above, for example, when the electronic component 4 having a long side of about 20 mm is bonded to the wiring board 14 by a conventional method, a difference occurs in the ultrasonic vibration transmitted depending on the location in the electronic component 4. Although a defect occurs, according to the present embodiment, the same ultrasonic vibration can be transmitted to the entire area of the electronic component 4, so that a stable product can be produced without causing a defect.

  According to the present invention, when bonding an electronic component on a wiring board, sufficient bonding and non-destructiveness between the electronic component and the wiring board can be satisfied at the same time. For example, a semiconductor chip that is a large and narrow pitch electrode is mounted. This is useful in the field of drive driver ICs for image display devices that need to be performed.

Schematic configuration diagram of an embodiment of an ultrasonic bonding apparatus according to the present invention Flow chart related to bonding operation in this embodiment It is a figure which shows the profile of the ultrasonic vibration conditions and load conditions in this embodiment, and the electronic component and arrangement | positioning board | substrate part in each joining time, Comprising: (a) is a figure which shows the profile of ultrasonic vibration and load conditions, b1) to (b3) are cross-sectional views showing configurations of the electronic component, the wiring board, and the bonding material at each bonding time, and (c1) to (c3) are arranged between the electronic component and the wiring board at each bonding time. The figure which shows the area of the contact surface with the electrode on the electronic component of the bonding material Explanatory drawing which shows the relationship between the load condition and ultrasonic vibration condition which are loaded to each junction part of the electronic component in this embodiment, and the quality goods and inferior goods of each junction part of an electronic component The joining head in this embodiment is shown, (a) is sectional drawing, (b) The right figure is a bottom view, (b) The left figure is explanatory drawing which shows the relationship between the position on a tool at the time of no load, and an ultrasonic amplitude. The lower figure of (b) is explanatory drawing which shows the relationship between the ultrasonic horn and ultrasonic amplitude at the time of no load, (c) is the adsorption | suction hole for electronic components in the tool which is a structural member of a joining head, an electronic component, and a tool Bottom view showing the positional relationship of the detachable screw holes It is explanatory drawing which shows the state which is implementing the joining of the electronic component and wiring board by the conventional ultrasonic bonding apparatus, Comprising: (a) is a front view, The right figure of (b) is a bottom view except a wiring board, The left figure of (b) is explanatory drawing which shows the relationship between the position on a tool at the time of no load, and an ultrasonic amplitude. Explanatory drawing which showed the relationship between the load condition and ultrasonic vibration condition which are applied to each joint part of the electronic component in the conventional apparatus, and the non-defective / defective product of each joint part of the electronic component

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Ultrasonic vibrator 2 Ultrasonic horn 3 Tool 4 Electronic component 5 Ultrasonic vibration direction 6 Ultrasonic horn length 7 Tool length 8 Electronic component length 9 Ultrasonic amplitude 10 under no load 10 Ultrasonic horn support member 11 Load applying member 12 Electrode Upper Electrode 13 Bonding Material 14 Wiring Board 15 Wiring Electrode 17 Center Line of Ultrasonic Vibrator 18 Tool Removable Screw 19 Tool Removable Screw Hole 20 Ultrasonic Vibrator Length 21 Bonding Mechanism 22 Lifting Mechanism 23 Bonding Head 24 Wiring Substrate holder 25 Stage 26 Stage moving mechanism 27 Imaging mechanism 28 Imaging unit 29 Imaging unit moving mechanism 30 Initial area 31 Area enlarged by load 32 Area enlarged by load + ultrasonic vibration 33 Adsorption hole 34 Nodal part 35 Maximum amplitude point 36 Range of joining conditions actually applied to each area of electronic component 40

Claims (5)

In an ultrasonic bonding apparatus that transmits ultrasonic vibration generated from an ultrasonic vibrator to an electronic component on a wiring board via an ultrasonic horn and a tool, and bonds the electronic component and the wiring board.
The length in the direction perpendicular to the ultrasonic vibration direction in the ultrasonic vibrator is smaller than the length in the direction perpendicular to the ultrasonic vibration direction in the electronic component to be joined, and the length in the tool and the ultrasonic horn is An ultrasonic bonding apparatus characterized in that a length in a direction perpendicular to a sound wave vibration direction is set to be longer than a length in a direction perpendicular to the ultrasonic vibration direction in the electronic component.   The ultrasonic horn has a maximum amplitude point of ultrasonic vibration at a central portion in the longitudinal direction, and the tool is disposed at the central portion of the ultrasonic horn which is the maximum amplitude point of ultrasonic vibration. The ultrasonic bonding apparatus according to claim 1.   The ultrasonic bonding apparatus according to claim 1, wherein the ultrasonic horn is fixed by a support member only at a nodal portion of the ultrasonic horn that is not affected by ultrasonic vibration.   The contact portion of the load application member that applies a load to the tool and the ultrasonic horn is disposed on the installation position of the tool that is the maximum amplitude point of the ultrasonic horn, and the contact portion of the load application member and the The ultrasonic bonding apparatus according to claim 1, wherein an ultrasonic wave is applied to the electronic component in contact with an ultrasonic horn. A bonding method for bonding an electronic component and a wiring board using the ultrasonic bonding apparatus according to any one of claims 1 to 4,
An electronic component joining method comprising joining the electronic component and the wiring board at a position where a center of a tool and a center of the electronic component overlap in a direction perpendicular to an ultrasonic vibration direction.

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