JP2004330228A - Ultrasonic joining apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an ultrasonic joining apparatus of semiconductor components or the like utilizing the ultrasonic vibration in which the weight of an vibrating body including an ultrasonic horn is reduced, the positioning accuracy is enhanced, the positioning control is facilitated, and the joining work time is suppressed. <P>SOLUTION: The ultrasonic joining apparatus is provided with: an ultrasonic horn 12 which is preset in length to the value of one wavelength of the ultrasonic frequency and has the maximum vibration amplitude point at both ends and a center part in the longitudinal direction; a joining function part 12b provided at the maximum vibration amplitude point in the center of the longitudinal direction; an ultrasonic vibrator 32 which is coaxially connected to one end part of the ultrasonic horn 12 to perform lateral vibration of the ultrasonic horn 12; a supporting member 26 to attachably/detachably fix two nodal points Pn of the ultrasonic horn 12 via a fixing bolt 30; a Z-stage 19 to pressurize the ultrasonic horn 12; and a pressurizing means consisting of a Z-slide 11 to position the Z-stage 19. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an ultrasonic bonding apparatus that uses an ultrasonic horn of a lateral vibration type and, for example, ultrasonically bonds a bump of a bare chip of an integrated circuit directly to a land portion of a printed circuit board, and particularly, a holding structure of the ultrasonic horn. The present invention relates to an ultrasonic bonding apparatus improved from the above.
[0002]
[Prior art]
As shown in FIGS. 6 and 7, a conventional ultrasonic bonding apparatus has a length of at least one wavelength of a predetermined frequency of an ultrasonic wave. An ultrasonic horn 50 having three maximum vibration amplitude points, an engagement tip 51 projecting out of the ultrasonic horn at the center maximum vibration amplitude point of the ultrasonic horn 50 and engaging with the joined members W1 and W2; , Are connected coaxially to the maximum vibration amplitude points at both ends of the ultrasonic horn 50, have a half-wave length of the ultrasonic frequency, and have the maximum vibration amplitude points at both ends and the nodal point ( Boosters 52 and 53 having zero points of vibration amplitudes of wavelengths) Pn and Pn, an ultrasonic transducer 54 coaxially connected to one of these boosters 52 and 53, and an external nodal in each of the boosters 52 and 53. The supporting members 55R and 55L, in which the points Pn and Pn are clamped by mechanical clamping means, and the support 56 on which the supporting members 55R and 55L and the members W1 and W2 are placed are relatively moved to be covered. Pressurizing means for pressing the engaging tip 51 to the joining members W1 and W2 is provided.
[0003]
Stepped holes 57R and 57L are formed in the support members 55R and 55L, and female screws 58 and 58 are formed on the inner peripheral surfaces of the large diameter portions of the stepped holes 57R and 57L. Then, the boosters 52 and 53 are inserted into the stepped holes 57R and 57L of the support members 52 and 53, and the tightening members 60R and 60L having the external threads 59 and 59 formed on the outer peripheral surface thereof are screwed and tightened, thereby increasing the booster. The projections 52F, 53F of the 52, 53 are firmly clamped to the support members 55R, 55L.
[0004]
Here, the support members 55R, 55L on which the boosters 52, 53 are supported are moved by a pressing means in a direction orthogonal to the vibration direction, and the engaging tips 51 provided on the ultrasonic horn 50 are connected to the members W1, While being brought into contact with W2, ultrasonic bonding is performed by applying vibration while applying pressure. At this time, the boosters 52 and 53 that sandwich the ultrasonic horn 50 are mechanically and strongly connected to the supporting members 55R and 55L at the nodal points Pn and Pn. The attachment of the ultrasonic horn 50 is suppressed. Therefore, the life of the ultrasonic horn 50 is extended, and the energy loss of the ultrasonic wave is reduced (for example, see Patent Document 1).
[0005]
[Patent Document 1]
Japanese Patent No. 2583398 (pages 3, 4 and 2, 3)
[0006]
[Problems to be solved by the invention]
However, in such a conventional ultrasonic bonding apparatus, an ultrasonic horn 50 having a length of one wavelength at a predetermined ultrasonic frequency is replaced with a pair of boosters 52 having a half-wave length of the ultrasonic frequency. 53, and are mechanically connected to the support members 55R, 55L at the nodal points Pn, Pn of the boosters 52, 53, so that the vibrating body (ultrasonic The horn 50 and the boosters 52 and 53) have a length of at least two wavelengths of a predetermined ultrasonic frequency. In this case, the weight of the vibrating body increases, and the weight of the movable body including the vibrating body also increases, thereby lowering the positioning accuracy. There were limits to cost reduction.
[0007]
The present invention has been made in view of such circumstances, and in an ultrasonic bonding apparatus for a semiconductor component or the like using ultrasonic vibration, the weight of a vibrating body including an ultrasonic horn is reduced, and positioning accuracy is improved. It is another object of the present invention to provide an ultrasonic bonding apparatus that facilitates positioning control and suppresses a bonding operation time.
[0008]
[Means for Solving the Problems]
In order to achieve the above object, the invention according to claim 1 of the present invention mounts and fuses by applying ultrasonic vibration in a horizontal direction to an electronic component using a lateral vibration type ultrasonic horn. In the ultrasonic bonding apparatus, an ultrasonic horn which is set in advance to a length corresponding to one wavelength of the ultrasonic frequency, and has a maximum vibration amplitude point at both ends and a longitudinal center thereof, and a longitudinal center of the ultrasonic horn. A joint acting portion provided at the maximum vibration amplitude point of the ultrasonic horn, an ultrasonic vibrator connected coaxially to one end of the ultrasonic horn, and configured to laterally vibrate the ultrasonic horn; A support member having a dull point detachably fixed via fixing bolts, and a pressurizing means for pressurizing the ultrasonic horn are provided.
[0009]
In this way, for example, in ultrasonic bonding, which is melt-bonded and mounted by applying horizontal ultrasonic vibration to a land portion on the circuit board side as a mating component on a bump of an electronic component such as a chip component, The maximum vibration amplitude point at the center in the longitudinal direction of the ultrasonic horn is pressurized, and the two nodal points of the ultrasonic horn are detachably fixed to the support member via fixing bolts, so that the half-wavelength of the conventional horn is used. A pair of boosters having a length is not required, and the vibrator to be excited by the ultrasonic vibrator is substantially only an ultrasonic horn having a length of one wavelength, so that the weight of the vibrator is significantly reduced. In addition, energy loss of ultrasonic waves can be suppressed. Furthermore, in order to prevent the chip components from hitting the circuit board and causing damage, it was necessary to lower the ultrasonic horn and reduce the descending speed just before the two contacted with each other. Since the weight of the vibrating body is reduced, such positioning control is facilitated, and the joining operation time can be reduced.
[0010]
The invention according to claim 2 of the present invention is directed to an ultrasonic bonding apparatus for melting and mounting by applying a horizontal ultrasonic vibration to an electronic component using a horizontal vibration type ultrasonic horn. An ultrasonic horn which is preset at a length corresponding to one wavelength of the ultrasonic frequency and has a maximum vibration amplitude point at both ends and a center in the longitudinal direction; and a maximum vibration amplitude point at the center in the longitudinal direction of the ultrasonic horn. And a sliding portion fixed to the upper surface opposite to the joining action portion, and an ultrasonic wave which is coaxially connected to one end of the ultrasonic horn and laterally vibrates the ultrasonic horn. A vibrator, and a support member having two nodal points of the ultrasonic horn detachably fixed via fixing bolts, wherein the sliding portion is formed of a member having a small coefficient of friction; A pressure receiving portion was provided.
[0011]
As described above, by forming the sliding portion with a member having a small coefficient of friction and using the pressure receiving portion of the ultrasonic horn, the joining property can be improved and the joining operation can be performed effectively.
[0012]
Preferably, as in the invention according to claim 3, the pressurizing means positions a Z stage guided by a guide bar via a static pressure bearing so as to be movable in the axial direction, and positions the Z stage so as to be able to move forward and backward. If a Z-slide is provided and a motor is mounted on the Z-slide, and the rotation of the motor is converted into a linear motion by a ball screw, stick-slip of the Z-stage can be suppressed as much as possible. As a result, the Z-axis control accuracy of the ultrasonic horn is improved, the linear motion of the ball screw can be smoothly performed, and the positioning accuracy can be significantly improved.
[0013]
According to a fourth aspect of the present invention, at the maximum vibration amplitude point at the longitudinal center of the ultrasonic horn, a protruding sliding portion is provided on the upper surface thereof, and a dog is provided at the lower end of the Z stage. Then, since the sliding portion is pressurized through the pressure detector facing the dog, it is possible to improve the accuracy of the pressing force and perform stable ultrasonic bonding without lowering the bonding strength. The quality of the joint can be improved.
[0014]
According to a fifth aspect of the present invention, since the supporting member is guided by the guide bar via the hydrostatic bearing so as to be freely movable in the axial direction, the ultrasonic horn is not stably tilted and accurately. It can be supported, improving the accuracy of the pressing force.
[0015]
Preferably, as in the invention according to claim 6, if the support member is suspended from the Z stage by a spring, the weight of the support member and the like does not apply to the ultrasonic horn, and Since the weight of the vibrating body including the horn can be further reduced, the positioning control is facilitated, and the joining operation time can be reduced.
[0016]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a schematic diagram showing an embodiment of an ultrasonic bonding apparatus according to the present invention. In the present embodiment, a flip chip bonder in which a bare chip (semiconductor chip) 14 is mounted on a printed board 15 will be described as an example. The flip chip bonder 1 includes a Y1 slide 2 provided on a base, an X1 slide 3 mounted on the Y1 slide 2, a substrate stage 4 provided on the X1 slide 3, a Y2 slide 5, and an X2 slide. 6, a bare-chip camera 7 supported by the Y6 slide 8, a bonding collet 9 supported by the Y3 slide 8, an ultrasonic horn 12 supported by the X3 slide 10, and the Z slide 11, a bare chip positioning stage 13, and a tray stage (not shown). Computer. The tray stage is vertically movable and accommodates a large number of bare chips 14 with their electrode forming surfaces facing upward.
[0017]
The Y1 slide 2 and the X1 slide 3 convert the rotations of the two AC servomotors into linear directions by a ball screw mechanism (not shown), and can move in two orthogonal directions in a horizontal plane. A substrate stage 4 is provided on the X1 slide 3, and the printed circuit boards 15 are transferred one by one by a transfer means (not shown). The transferred printed circuit board 15 is corrected for warpage and distortion on the substrate stage 4 and is preheated by a heater (not shown).
[0018]
The bare chip camera 7 is composed of a small camera having two fields of view, such as a CCD camera, and is disposed above and below the substrate stage 4 so as to be able to move forward and backward. The bare chip 14 is turned upside down on the bare chip positioning stage 13 in front of the printed circuit board 15, and is positioned by the Y3 slide 8 and the X3 slide 10. It is placed on the printed circuit board 15. The bonding collet 9 has a suction nozzle 9a for sucking and holding the bare chip 14 by air, and can be replaced as appropriate according to the shape and size of the bare chip 14. Each of the Y2 slide 5, the X2 slide 6, the Y3 slide 8, and the X3 slide 10 converts the rotation of two AC servomotors into a linear direction by a ball screw mechanism (not shown), and moves in two directions orthogonal to each other in a horizontal plane. It is possible.
[0019]
The ultrasonic horn 12 is supported by the Z slide 11 and descends above the printed board 15 positioned on the board stage 4 and the bare chip 14 positioned on the printed board 15, and stops at a predetermined position. A vacuum hole (not shown) is formed at the tip of the ultrasonic horn 12 so as to be coaxial with the center of rotation of the head, and the bare chip 14 is held by suction. The vacuum hole is used for controlling the computer equipped with the keyboard and the CRT. The information parameter such as the type of the bare chip 14 input from the keyboard while watching the display screen of the CRT and the program built in the computer for controlling the CRT. Therefore, the operation of each part of the flip chip bonder 1 is controlled. In addition, the image captured by the bare chip camera 7 is subjected to image processing, and the relative position between the bare chip 14 and the printed board 15 being transferred by the bonding collet 9 is confirmed from the result.
[0020]
FIG. 2 is a partially sectional front view showing an embodiment of the Z slide in the flip chip bonder 1 according to the present invention. The Z slide 11 includes an AC servomotor 16, a ball screw shaft 18a connected to a motor shaft 16a of the motor 16 via a coupling 17, a nut 18b externally fitted to the ball screw shaft 18a, and a nut 18b. And a Z stage 19 to which 18b is fixed. Helical screw grooves (not shown) are formed on the outer peripheral surface of the ball screw shaft 18a and the inner peripheral surface of the nut 18b, and a number of balls (not shown) are formed on the ball rolling path formed by these screw grooves. A so-called ball screw 18 which is accommodated so as to freely roll is configured. The rotation of the motor 16 is converted into a linear motion in the Z-axis direction by the ball screw 18.
[0021]
The ball screw shaft 18a is rotatably supported on the housing 20 via a rolling bearing 21 and cannot move in the axial direction. On the other hand, the nut 18b is fixed to the Z stage 19, and is arranged so as not to rotate and move freely in the axial direction.
[0022]
The Z stage 19 is supported by a pair of guide bars 25 via a static pressure bearing 24 described later so as to be movable in the axial direction. A support member 26 is provided at a lower end of the Z stage 19. The support member 26 is supported via a hydrostatic bearing 24 so as to be axially movable with respect to a pair of guide bars 25. Thereby, the ultrasonic horn 12 can be stably and accurately supported without inclination or the like, and the accuracy of the pressing force can be improved.
[0023]
The ultrasonic horn 12 is detachably attached to the support member 26, and the support member 26 is suspended from the Z stage 19 by a pair of coil springs 27. Therefore, the own weight of the support member 26 is canceled, and the vibrating body to be vibrated by the ultrasonic vibrator 32 is substantially only the ultrasonic horn 12, and the weight of the vibrating body is remarkably reduced.
[0024]
A dog 28 protrudes from the lower end of the Z stage 19, and a load cell 29 is provided to face the dog 28. The pressure of the ultrasonic horn 12 can be detected by the load cell 29. Then, load control is performed based on the output signal of the load cell 29.
[0025]
The ultrasonic horn 12 is formed in a rectangular cross section, has a maximum vibration amplitude point at both ends and a central part in the longitudinal direction, has a nodal point Pn at an inner point approximately ４ from both ends, and has an ultrasonic horn. The length is set in advance to one wavelength of the frequency (see FIG. 4). Further, the ultrasonic horn 12 has a sliding portion 12a protruding from the upper surface and a joining portion 12b protruding from the lower surface at the maximum vibration amplitude point at the center. Then, the sliding portion 12 a, that is, the central portion in the longitudinal direction of the ultrasonic horn 12 is pressed via the pressure detector 29 facing the dog 28. Thereby, while improving the accuracy of the pressing force, stable ultrasonic bonding can be performed without lowering the bonding strength, and the quality of the bonded portion can be improved. At least the surfaces of the sliding portion 12a and the joining action portion 12b are formed of a material having a high wear resistance and a small friction coefficient, such as a cemented carbide or a diamond alloy using a cemented carbide as a binder. Thereby, while improving durability, joining property can be improved. In addition, a suction hole (not shown) for sucking the bare chip 14 is formed in the joint action portion 12b.
[0026]
The ultrasonic horn 12 is fastened to the support member 26 via a pair of fixing bolts 30. As shown in FIG. 3, the fixing portion is set at the nodal point Pn. At the position of the nodal point Pn inside the ultrasonic horn 12, an insertion hole 31 having a diameter larger than the outer diameter of the fixing bolt 30 is formed in the vertical direction. A female screw 31a is formed at the center of the insertion hole 31, that is, at the nodal point Pn in the center of the cross section of the ultrasonic horn 12, and the ultrasonic horn 12 is detachable by screwing the fixing bolt 30 to the female screw 31. Can be fastened to the support member 26. Instead of the female screw 31, a fixing bolt 30 may be inserted into the nodal point Pn inside and fastened with a fixing nut (not shown). Here, examples of the material of the ultrasonic horn 12 include an aluminum alloy, brass, stainless steel, and a titanium alloy.
[0027]
An ultrasonic vibrator 32 is coaxially connected to one end of the ultrasonic horn 12. The ultrasonic vibrator 32 is supplied with electric power from an ultrasonic generator (not shown), generates a longitudinal ultrasonic wave having a predetermined frequency, and converts electric energy to be output to mechanical energy, such as a piezoelectric element or a magnetostrictive element. Energy converter. As described above, the nodal point Pn of the ultrasonic horn 12 is fixed to the support member 26 via the fixing bolt 30, and the ultrasonic horn 12 is The ultrasonic horn 12 is moved downward by driving the motor 16 to lower the Z stage 19 via the ball screw 18 while applying ultrasonic vibration in the longitudinal direction of the ultrasonic horn 12. Then, the printed circuit board 15 placed on the receiving table 33 and the bare chip 14 come into contact with each other, and both are pressed. In this way, by applying ultrasonic vibration while pressurizing the printed board 15 and the bare chip 14, the oxide film on the contact surface is removed, the activated metal surface is exposed, and the local temperature at the boundary due to friction is increased. With the increase, the distance between the active atoms is reduced and metal bonding is performed.
[0028]
FIG. 5 is a sectional perspective view showing an embodiment of the hydrostatic bearing 24. The hydrostatic bearing 24 includes a bearing portion 36 made of a porous sintered metal and a back metal 37 externally fitted to the bearing portion 36. An annular intake groove 37a is formed on the inner peripheral surface of the back metal 37, and opens to an intake port 37c through an intake chamber 37b communicating with the intake groove 37a. The intake port 37c communicates with an air supply source via an intake pipe (not shown).
[0029]
The bearing portion 36 is made of a copper-based sintered metal, a solid lubricant such as graphite, and a binder for binding the same, and is formed in a mold at a predetermined pressure, and then heat-treated. Pores of a desired size can be formed by the particle size and molding pressure of the powder, and the inner peripheral surface serving as a bearing surface is appropriately closed to form a desired porous restriction to form a highly rigid bearing. be able to. The bearing portion 36 made of the porous sintered metal has an extremely small coefficient of friction and can suppress stick-slip as much as possible. Further, the lubricating oil is unnecessary, and the use environment can be maintained cleanly, and the maintenance-free operation can be realized.
[0030]
By regulating the radial clearance between the hydrostatic bearing 24 and the guide bar 25 within the range of 5 to 15 μm and adjusting the flow rate, desired bearing rigidity and load capacity can be appropriately set. Normally, bearing stiffness is inversely proportional to the radial clearance of the bearing, so a high-precision slider can be obtained by setting it as small as possible.However, taking into account the parallelism, squareness and roundness of the pair of guide bars 25, In the embodiment, it is set in the range of 7 to 12 μm.
[0031]
In the present embodiment, the static pressure bearing 24 made of porous sintered metal capable of increasing the load capacity among the static pressure bearings is exemplified. However, the present invention is not limited to this. It may be a pressure bearing. Although the guide bar 25 is made of a bar having a circular cross section, a rectangular bar having a rectangular cross section may be used here. In a test conducted by the present applicant, when the hydrostatic bearing 24 made of porous sintered metal was used as a guide mechanism for the Z slide 11, the Z-axis control accuracy of the ultrasonic horn 12 was remarkably improved. A resolution of 1.2 μm was obtained, and a mounting accuracy of the bare chip 14 of ± 5 μm or less could be achieved. Further, when the pressing force was in the range of 5 to 100 N, it was possible to achieve a pressing accuracy of ± 0.5 N or less. Therefore, the joining strength was improved as compared with the conventional case, and the shear strength was able to achieve 0.5 N or more per unit bump, and the defective rate in joining could be remarkably suppressed.
[0032]
In the present embodiment, the nodal point Pn of the ultrasonic horn 12 having no vibration amplitude is fixed to the support member 26 via the fixing bolt 30, and the maximum vibration amplitude point at the center in the longitudinal direction is pressurized. A pair of boosters having a length corresponding to a half wavelength as in the related art becomes unnecessary, and the vibrating body to be excited by the ultrasonic vibrator 32 is substantially only the ultrasonic horn 12 having a length corresponding to one wavelength. Since the weight of the body is remarkably reduced, energy loss of ultrasonic waves can be suppressed. Furthermore, conventionally, it was necessary to lower the ultrasonic horn 12 and reduce the descent speed just before the two 14 and 15 were in contact with each other so that the bare chip 14 did not collide with and damage the printed board 15. Since the weight of the vibrating body including the ultrasonic horn 12 is reduced, such positioning control is facilitated and the joining operation time can be reduced. Shortening the working time in ultrasonic bonding greatly contributes to lowering the cost of chip components, and thus has a great effect in mass production.
[0033]
In the present embodiment, the flip chip bonder has been described. However, the ultrasonic bonding apparatus according to the present invention is not limited to this, and it is needless to say that the ultrasonic bonding apparatus can be applied to general ultrasonic bonding apparatuses such as gang bonders and other terminal bonding. No.
[0034]
As described above, the embodiments of the present invention have been described. However, the present invention is not limited to these embodiments at all, but is merely an example, and may be variously modified without departing from the gist of the present invention. The scope of the present invention is, of course, indicated by the appended claims, and further includes the equivalent meanings described in the appended claims and all modifications within the scope. Including.
[0035]
【The invention's effect】
As described in detail above, the ultrasonic bonding apparatus according to the present invention uses ultrasonic vibration horns of a lateral vibration type to apply ultrasonic vibrations in the horizontal direction to electronic components, thereby performing ultrasonic bonding and melting and mounting. In the apparatus, an ultrasonic horn having a maximum vibration amplitude point set at both ends and a longitudinal center thereof, which is preset to a length corresponding to one wavelength of the ultrasonic frequency, and a maximum vibration at the longitudinal center of the ultrasonic horn. A joining action portion provided at an amplitude point, an ultrasonic vibrator which is coaxially connected to one end of the ultrasonic horn and laterally vibrates the ultrasonic horn, and two nodal points of the ultrasonic horn. Since a supporting member detachably fixed via fixing bolts and a pressurizing means for pressurizing the ultrasonic horn are provided, a pair of boosters having a length corresponding to a half wavelength as in the related art is unnecessary, Ultrasonic transducer Vibrators vibrated substantially becomes only the ultrasonic horn length of one wavelength, the weight of the vibrating body is remarkably reduced, it is possible to suppress the ultrasonic energy loss. Furthermore, in order to prevent the chip components from hitting the circuit board and causing damage, it was necessary to lower the ultrasonic horn and reduce the descending speed just before the two contacted with each other. Since the weight of the vibrating body is reduced, such positioning control is facilitated, and the joining operation time can be reduced.
[Brief description of the drawings]
FIG. 1 is a schematic view showing an embodiment of an ultrasonic bonding apparatus according to the present invention.
FIG. 2 is a front view showing an embodiment of a Z slide according to the present invention.
FIG. 3 is an enlarged sectional view of a main part of the above.
FIG. 4 is an explanatory diagram showing a relationship between an ultrasonic horn according to the present invention and ultrasonic vibration.
FIG. 5 is a sectional perspective view showing a hydrostatic bearing according to the present invention.
FIG. 6 is an enlarged view of a main part of a conventional ultrasonic bonding apparatus.
FIG. 7 is an explanatory diagram showing a relationship between a conventional ultrasonic vibration, an ultrasonic horn, and a booster.
[Explanation of symbols]
1 Flip chip bonder 2 Y1 slide 3 … X1 slide 4 ...... Substrate stage 5… Y2 slide 6… ... X2 slide 7 Camera 8 Y3 slide 9 ...... Bonding collet 9a Suction nozzle 10 X3 slide 11 ... Z-slide 12 ... Ultrasonic horn 12a ... Sliding part 12b .... Joint action part 13 Bare chip positioning stage 14 Bare chip 15 Printed circuit board 16 ... Motor 16a ... Motor shaft 17 ... Coupling 18 ... ········· Ball screw 18a ····· Ball screw shaft 18b ······ Nut 19 ... Z stage 20 ... Housing 21 ... Rolling bearing 24 ... ··· Static pressure bearing 25 ··· Guide bar 26 ··· Support member 27 ... 28 ··· Dog 29 ··· Load cell 30 ··· Fixing bolt 31 ... Insertion hole 31a Female screw 32 Ultrasonic transducer 36: Bearing part 37: Backup metal 37a: Intake groove 37b ····· Intake chamber 37c ······· Intake port 50 ····· Ultrasonic horn 51: Engagement tips 52, 53 Boosters 52F, 53F: Protrusion 54 ... ..... Ultrasonic transducers 55R, 55L ... Support member 56 ... Receptacle 57R, 57L ... Stepped hole 58 ... ······ Female screw 59 ··· Male screw 60R, 60L .... Nodal points W1, W2.

Claims (6)

In ultrasonic bonding equipment that fuses and mounts electronic components by applying horizontal ultrasonic vibration to the electronic components using a transverse vibration type ultrasonic horn,
An ultrasonic horn having a maximum vibration amplitude point set in advance at a length corresponding to one wavelength of the frequency of the ultrasonic wave and at both ends and a center in the longitudinal direction, and a maximum vibration amplitude point at the center in the longitudinal direction of the ultrasonic horn. The provided joint action part, an ultrasonic vibrator connected coaxially to one end of the ultrasonic horn and laterally vibrating the ultrasonic horn, and a fixing bolt for fixing two nodal points of the ultrasonic horn. An ultrasonic bonding apparatus, comprising: a support member detachably fixed via a member; and pressurizing means for pressing the ultrasonic horn. In ultrasonic bonding equipment that fuses and mounts electronic components by applying horizontal ultrasonic vibration to the electronic components using a transverse vibration type ultrasonic horn,
An ultrasonic horn having a maximum vibration amplitude point set in advance at a length corresponding to one wavelength of the frequency of the ultrasonic wave and at both ends and a center in the longitudinal direction, and a maximum vibration amplitude point at the center in the longitudinal direction of the ultrasonic horn. The provided joint action portion, a sliding portion fixed to the upper surface opposite to the joint action portion, and an ultrasonic vibration which is coaxially connected to one end of the ultrasonic horn and laterally vibrates the ultrasonic horn. And a support member having two nodal points of the ultrasonic horn detachably fixed via fixing bolts, and the sliding portion is formed of a member having a small coefficient of friction. An ultrasonic bonding apparatus comprising a pressure receiving portion. The pressurizing means includes a Z stage guided axially movably by a guide bar via a static pressure bearing, and a Z slide for positioning the Z stage so as to be able to move forward and backward. A motor is mounted on the Z slide. 3. The ultrasonic bonding apparatus according to claim 1, wherein the rotation of the motor is converted into a linear motion of the Z stage by a ball screw. At the maximum vibration amplitude point at the longitudinal center of the ultrasonic horn, a projecting slide is provided on the upper surface thereof, and a dog is provided at the lower end of the Z stage, and a pressure detector facing the dog is provided. The ultrasonic bonding apparatus according to claim 3, wherein the sliding portion is pressurized through the interposition. The ultrasonic welding device according to claim 3, wherein the support member is guided by the guide bar via an aerostatic bearing so as to be movable in the axial direction. The ultrasonic bonding apparatus according to claim 3, wherein the support member is suspended from the Z stage by a spring.

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