JP3960890B2 - 半導体パッケージに用いられる端子のタブレットに用いる樹脂粉末及びその製造方法 - Google Patents

半導体パッケージに用いられる端子のタブレットに用いる樹脂粉末及びその製造方法 Download PDF

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Publication number
JP3960890B2
JP3960890B2 JP2002274181A JP2002274181A JP3960890B2 JP 3960890 B2 JP3960890 B2 JP 3960890B2 JP 2002274181 A JP2002274181 A JP 2002274181A JP 2002274181 A JP2002274181 A JP 2002274181A JP 3960890 B2 JP3960890 B2 JP 3960890B2
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resin powder
resin
tablet
filler
powder
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JP2003213092A5 (enExample
JP2003213092A (ja
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勉 杉山
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Tomoegawa Co Ltd
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Tomoegawa Paper Co Ltd
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JP2002274181A 2001-11-16 2002-09-20 半導体パッケージに用いられる端子のタブレットに用いる樹脂粉末及びその製造方法 Expired - Fee Related JP3960890B2 (ja)

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Application Number Priority Date Filing Date Title
JP2002274181A JP3960890B2 (ja) 2001-11-16 2002-09-20 半導体パッケージに用いられる端子のタブレットに用いる樹脂粉末及びその製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001351238 2001-11-16
JP2001-351238 2001-11-16
JP2002274181A JP3960890B2 (ja) 2001-11-16 2002-09-20 半導体パッケージに用いられる端子のタブレットに用いる樹脂粉末及びその製造方法

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JP2003213092A JP2003213092A (ja) 2003-07-30
JP2003213092A5 JP2003213092A5 (enExample) 2005-07-21
JP3960890B2 true JP3960890B2 (ja) 2007-08-15

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