JP2003213092A5 - - Google Patents
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- Publication number
- JP2003213092A5 JP2003213092A5 JP2002274181A JP2002274181A JP2003213092A5 JP 2003213092 A5 JP2003213092 A5 JP 2003213092A5 JP 2002274181 A JP2002274181 A JP 2002274181A JP 2002274181 A JP2002274181 A JP 2002274181A JP 2003213092 A5 JP2003213092 A5 JP 2003213092A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002274181A JP3960890B2 (ja) | 2001-11-16 | 2002-09-20 | 半導体パッケージに用いられる端子のタブレットに用いる樹脂粉末及びその製造方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001351238 | 2001-11-16 | ||
| JP2001-351238 | 2001-11-16 | ||
| JP2002274181A JP3960890B2 (ja) | 2001-11-16 | 2002-09-20 | 半導体パッケージに用いられる端子のタブレットに用いる樹脂粉末及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2003213092A JP2003213092A (ja) | 2003-07-30 |
| JP2003213092A5 true JP2003213092A5 (enExample) | 2005-07-21 |
| JP3960890B2 JP3960890B2 (ja) | 2007-08-15 |
Family
ID=27667281
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002274181A Expired - Fee Related JP3960890B2 (ja) | 2001-11-16 | 2002-09-20 | 半導体パッケージに用いられる端子のタブレットに用いる樹脂粉末及びその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3960890B2 (enExample) |
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2002
- 2002-09-20 JP JP2002274181A patent/JP3960890B2/ja not_active Expired - Fee Related