JP3947332B2 - Warp measuring device for film carrier tape for mounting electronic parts and method for measuring warp of film carrier tape for mounting electronic parts - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention is a film carrier tape for mounting electronic components (TAB (Tape Automated Bonding) tape, T-BGA (Tape Ball Grid Array) tape, CSP (Chip Size Package) tape, ASIC (Application Specific Integrated Circuit) tape, etc.)) Hereinafter, the film carrier tape for electronic component mounting, and the electronic component for extracting the sample before shipment and measuring the warp of the sample are simply referred to as “film carrier tape for electronic component mounting”. The present invention relates to a method for measuring warpage of a film carrier tape for mounting.
[0002]
[Prior art]
With the development of the electronics industry, the demand for printed wiring boards for mounting electronic components such as ICs (integrated circuits) and LSIs (large-scale integrated circuits) is increasing rapidly. High functionality is demanded, and as a method for mounting these electronic components, recently, a mounting method using a film carrier tape for mounting electronic components such as TAB tape, T-BGA tape, and ASIC tape has been adopted. In particular, the importance is increasing in the electronic industry using a liquid crystal display element (LCD) such as a personal computer, for which high definition, thinning, and narrowing of the frame area of a liquid crystal screen are desired.
[0003]
In such a film carrier tape for mounting electronic components, if the warp is large, bonding failure may occur when mounting a device such as an IC. Quality inspection is performed to extract and measure the warpage of the sample.
In this case, as a method of measuring the curvature of the sample of the film carrier tape for mounting an electronic component, the highest position of the sample is visually measured using a metal microscope, and the highest position is visually measured using the depth of focus.
[0004]
[Problems to be solved by the invention]
In such a measuring method, since an inspector performs a visual measurement using a depth of focus with a metal microscope, it is difficult to perform an accurate measurement, and since it is a manual operation, it takes a long time to measure a large amount of samples. Can not be processed in a short time, and is therefore unsuitable for mass production and causes high costs.
[0005]
In consideration of such a current situation, the present invention is an electronic component mounting film carrier capable of measuring the warpage of a sample of a film carrier tape for mounting an electronic component accurately, accurately and in a short time. An object of the present invention is to provide a tape warpage measuring apparatus and a method for measuring the warpage of a film carrier tape for mounting electronic components.
[0006]
[Means for Solving the Problems]
The present invention has been made in order to achieve the above-described problems and objects in the prior art, and an electronic component mounting film carrier tape warpage measuring apparatus is provided with an electronic component mounting film carrier tape. A mounting table,
A warp measurement unit that is movable along the longitudinal direction with respect to the mounting table,
A laser beam irradiation unit disposed on one side of the mounting table of the warp measurement unit;
A laser beam receiving unit disposed on the other side across the mounting table of the warp measurement unit,
From the laser beam irradiation unit, the height position of the uppermost part of the electronic component mounting film carrier tape mounted on the mounting table is moved along the longitudinal direction with respect to the mounting table. The laser beam irradiated in the horizontal direction is shielded by the electronic component mounting film carrier tape, and measured by a height position that does not reach the laser beam receiver,
The warpage of the film carrier tape for mounting electronic parts is measured by the difference from the height position of the surface of the mounting table measured in advance.
[0007]
Moreover, the warp measuring method of the film carrier tape for mounting electronic components of the present invention is a warping measuring method of the film carrier tape for mounting electronic components,
Place the electronic component mounting film carrier tape on the mounting table,
While moving the warp measurement unit movable along the longitudinal direction with respect to the mounting table along the longitudinal direction with respect to the mounting table,
Irradiate the laser beam from the laser beam irradiation unit disposed on one side of the mounting table of the warp measurement unit,
The laser beam irradiated in the horizontal direction from the laser beam irradiation unit is shielded by the electronic component mounting film carrier tape, and is disposed on the other side across the mounting table of the warp measurement unit. Measure the height position of the uppermost part of the film carrier tape for mounting electronic components placed on the mounting table according to the height position that does not reach
The warp of the electronic component mounting film carrier tape is measured by the difference between the measured height position of the uppermost portion of the electronic component mounting film carrier tape and the previously measured height position of the mounting table surface. It is configured as described above.
[0008]
With this configuration, the warp measuring unit is moved along the longitudinal direction with respect to the mounting table while the electronic component mounting film carrier tape to be measured is mounted on the mounting table. By simply irradiating the laser beam horizontally from the laser beam irradiator disposed on one side of the mounting table of the warp measuring unit, the irradiated laser beam is shielded by the film carrier tape for mounting electronic components. The height position of the uppermost part of the electronic component mounting film carrier tape is measured by the height position that does not reach the laser light receiving unit disposed on the other side across the mounting table of the warp measuring unit. It can be measured over the entire film carrier tape for mounting electronic components.
[0009]
Accordingly, it is possible to accurately measure the warpage of a sample of a film carrier tape for mounting electronic components on a large amount of samples in a short time.
In addition, the warp measuring device for a film carrier tape for mounting electronic components of the present invention comprises a gripping tool for detachably gripping a side end portion of the film carrier tape for mounting electronic components on the mounting table. Features.
[0010]
Thereby, since the film carrier tape for electronic component mounting which is a measuring object can be fixed on a mounting table, the precision of the measurement of curvature can be improved.
In the electronic component mounting film carrier tape warpage measuring apparatus of the present invention, the gripping tool is detachably mounted on the mounting table.
[0011]
As a result, the film carrier tape for mounting electronic components can be fixed on the mounting table in advance after being fixed to the holding tool, so that the handling is convenient and the film carrier tape for mounting electronic components is accurately placed on the mounting table. Can be placed.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments (examples) of the present invention will be described with reference to the drawings.
FIG. 1 is a top view of a warp measuring device for a film carrier tape for mounting electronic components of the present invention, FIG. 2 is an end view in the direction A of FIG. 1, and FIG. 3 is a film carrier tape for mounting electronic components of the present invention. It is a figure which shows typically the method of measuring the curvature of the film carrier tape for electronic component mounting using a curvature measuring apparatus.
[0013]
As shown in FIG. 1 and FIG. 2, reference numeral 10 denotes a warp measuring device (hereinafter simply referred to as “warping measuring device”) for a film carrier tape for mounting electronic components according to the present invention as a whole.
The warpage measuring apparatus 10 includes a rectangular plate-like mounting table 16 fixed on four support column members 14 a to 14 d erected at a central portion on the base base 12.
[0014]
In addition, the warpage measurement device 10 includes a warpage measurement unit 11 that is movable along the longitudinal direction with respect to the mounting table.
That is, the guide rail members 18 and 20 are formed on both sides of the mounting table 16 of the base base 12 along the longitudinal direction of the mounting table 16, respectively. Guide members 22 and 24 are mounted on the guide rail members 18 and 20 so as to be slidable on the guide rail members 18 and 20, respectively.
[0015]
The guide members 22 and 24 support the warp measuring unit that extends below the mounting table 16 across the horizontal direction of the mounting table 16 between the supporting column members 14a and 14b and the supporting column members 14c and 14d. It is fixed below the member 26.
Above the warp measurement unit support member 26, a laser beam irradiation unit 28 disposed on one side of the mounting table 16, and a warp measurement unit so as to face the laser beam irradiation unit 28. A laser light receiving unit 30 disposed on the other side of the mounting table 16 is fixed.
[0016]
In addition, a guide member 13 is provided above the warp measuring unit support member 26, and the guide member 13 is slidable on a guide rail member 15 formed at the center below the mounting table 16 over the longitudinal direction. It is attached to.
An operation handle 32 for operating the warp measurement unit is fixed to one end of the warp measurement unit support member 26. On the other hand, at the four corners of the base base 12, operation foot members 34 for operating a substantially inverted U-shaped warp measurement unit are fixed.
[0017]
Accordingly, the warp measuring unit 11 is moved along the longitudinal direction with respect to the mounting table 16 by holding the operation foot member 34 with one hand and operating the operation handle 32 with the other hand. Be able to.
The laser light irradiation unit 28 is not particularly limited. For example, using a red light laser with a wavelength of 670 μm does not damage the film carrier tape for mounting electronic components. preferable.
[0018]
Although not shown, the laser beam irradiation unit 28 irradiates the laser beam in the horizontal direction, and is configured so that the laser beam irradiation position can be freely changed up and down.
A method for measuring the warp of the film carrier tape for mounting an electronic component using the warp measuring device 10 of the present invention configured as described above will be described.
[0019]
As shown in FIG. 2 and FIG. 3, for example, a film carrier tape for mounting electronic components of a type such as CSP or BGA, which has a strip-like shape from the film carrier tape for mounting electronic components that has been completely manufactured. Sample S is extracted and set as a measurement target.
And this sample S is mounted so that the longitudinal direction may correspond to the longitudinal direction of the mounting table 16.
[0020]
In this state, as shown in FIG. 3, the laser light irradiation height of the laser light irradiation unit 28 is set at a height position sufficiently higher than the uppermost position of the warp of the sample S set in advance. The warp measuring unit 11 is moved in the longitudinal direction with respect to the mounting table 16 by gripping the operation foot member 34 with one hand and operating the operation handle 32 with the other hand. Move along.
[0021]
And it is discriminate | determined whether the laser beam L0 irradiated from the laser beam irradiation part 28 reaches | attains the laser beam light-receiving part 30. FIG.
When the laser beam L0 irradiated from the laser beam irradiation unit 28 reaches the laser beam receiving unit 30 disposed on the other side across the mounting table 16 of the warp measurement unit 11, the irradiation height of the laser beam is increased. The warp measuring unit 11 is moved along the longitudinal direction with respect to the mounting table 16 by operating the operation handle 32 with the height lowered below a predetermined scale interval.
[0022]
The laser beam Lh irradiated from the laser beam irradiation unit 28 is shielded by the sample S, and the laser beam receiving unit disposed on the other side of the mounting table 16 of the warp measurement unit 11. Repeat until the height is reached.
Then, the height position Xh is measured, and as shown in FIG. 2, the difference from the height position X0 of the surface of the mounting table 16 measured in advance is set as the warp X of the sample S.
[0023]
In this case, the manner in which the sample S is placed on the placing table 16 depends on the type of the electronic component mounting film carrier tape, but as shown in FIGS. As shown in FIG. 4, in addition to using the provided portion as an upper surface, measurement is performed by fixing one end of the sample S on the mounting table 16 with a clip member 40 constituting a gripping tool that is detachably locked. May be.
[0024]
As shown in FIG. 5, this gripping tool is provided with a clip member 44 on a mounting plate member 42 that is separate from the mounting table 16, and one end of the sample S is detachably locked. However, this may be placed on the placement table 16.
Moreover, in the said Example, although the laser beam irradiation part 28 was comprised so that a laser beam irradiation position might be changed up and down, it irradiates a several laser beam with the preset scale interval, and mounts the curvature measurement part 11 in it. It is also possible to measure the warp of the sample S at once by a single operation of moving along the longitudinal direction with respect to the mounting table 16.
[0025]
FIG. 6 is a schematic configuration diagram of a second embodiment in which the warpage measuring apparatus 10 of the present invention automatically measures warpage.
The configuration is basically the same as that of the first embodiment described above, and the same components are denoted by the same reference numerals and description thereof is omitted.
In the warpage measuring device 10 of this embodiment, the warpage measuring unit 11 is automatically moved along the longitudinal direction by the control device 50 with respect to the mounting table 16 by a moving mechanism such as a piston cylinder mechanism and a motor (not shown). It can be moved back and forth.
[0026]
Further, the measurement result of the warp measuring unit 11 is input into the control device 50 and is subjected to arithmetic processing to calculate a warp value, and the result is input from an input device 60 such as a barcode reader provided separately. Along with the unique information such as the lot number and sample number of the sample S, it is output to the management device 70 such as a host computer.
[0027]
In this way, quality control can be centrally managed and implemented for a large number of samples.
The preferred embodiment of the present invention has been described above, but the present invention is not limited to this. For example, in the present invention, the present invention is used to measure the warp of a film carrier tape for mounting electronic components. Various modifications can be made without departing from the object of the present invention, for example, the thickness of the electronic component mounting film carrier tape can also be used to measure whether the thickness is within a predetermined range. .
[0028]
【The invention's effect】
According to the present invention, the warp measuring unit is moved along the longitudinal direction with respect to the mounting table while the electronic component mounting film carrier tape to be measured is mounted on the mounting table. By simply irradiating the laser beam from the laser beam irradiation unit disposed on one side of the mounting table of the measurement unit in the horizontal direction, the irradiated laser beam is shielded by the electronic component mounting film carrier tape, The height of the uppermost part of the electronic component mounting film carrier tape is determined by the height not reaching the laser beam receiving unit disposed on the other side across the mounting table of the warp measuring unit. It can be measured over the entire mounting film carrier tape.
[0029]
Therefore, it is an extremely excellent invention that has many effects such as that the warp of the sample of the film carrier tape for mounting electronic components can be measured accurately and accurately, and the warp of a large amount of samples can be measured in a short time.
[Brief description of the drawings]
FIG. 1 is a top view of a warp measuring device for a film carrier tape for mounting electronic components according to the present invention.
FIG. 2 is an end view in the A direction of FIG. 1;
FIG. 3 is a diagram schematically showing a method for measuring the warpage of a film carrier tape for mounting electronic components using the warp measuring apparatus for film carrier tape for mounting electronic components according to the present invention.
FIG. 4 is a partially enlarged cross-sectional view illustrating a gripping tool used in a warp measuring device for a film carrier tape for mounting electronic components according to the present invention.
FIG. 5 is a partially enlarged cross-sectional view for explaining another embodiment of a gripping tool used in a warp measuring device for a film carrier tape for mounting electronic components according to the present invention.
FIG. 6 is a schematic configuration diagram of a second embodiment in which the warpage measuring apparatus of the present invention automatically measures warpage.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 Measurement apparatus 11 Measurement part 12 Base base 14a Support pillar member 14c Support pillar member 16 Mounting table 18 Guide rail member 22 Guide member 26 Measurement part support member 28 Laser beam irradiation part 30 Laser beam receiver 32 Operation handle 34 For operation Foot member 40 Clip member 42 Mounting plate member 44 Clip member 50 Control device 60 Input device 70 Management device

Claims (4)

A mounting table for mounting a film carrier tape for mounting electronic components;
A warp measurement unit that is movable along the longitudinal direction with respect to the mounting table,
A laser beam irradiation unit disposed on one side of the mounting table of the warp measurement unit;
A laser beam receiving unit disposed on the other side across the mounting table of the warp measurement unit,
From the laser beam irradiation unit, the height position of the uppermost part of the electronic component mounting film carrier tape mounted on the mounting table is moved along the longitudinal direction with respect to the mounting table. The laser beam irradiated in the horizontal direction is shielded by the electronic component mounting film carrier tape, and measured by a height position that does not reach the laser beam receiver,
An apparatus for measuring the warpage of a film carrier tape for mounting electronic parts, wherein the warp of the film carrier tape for mounting electronic parts is measured based on a difference from a height position of the surface of the mounting table previously measured. . The warp of the film carrier tape for mounting electronic components according to claim 1, further comprising a gripping tool for detachably holding a side end portion of the film carrier tape for mounting electronic components on the mounting table. measuring device. The warp measuring device for an electronic component mounting film carrier tape according to claim 1 or 2, wherein the gripping tool is detachably mounted on the mounting table. A method for measuring warpage of a film carrier tape for mounting electronic components,
Place the electronic component mounting film carrier tape on the mounting table,
While moving the warp measurement unit movable along the longitudinal direction with respect to the mounting table along the longitudinal direction with respect to the mounting table,
Irradiate the laser beam from the laser beam irradiation unit disposed on one side of the mounting table of the warp measurement unit,
The laser beam irradiated in the horizontal direction from the laser beam irradiation unit is shielded by the electronic component mounting film carrier tape, and is disposed on the other side across the mounting table of the warp measurement unit. Measure the height position of the uppermost part of the film carrier tape for mounting electronic components placed on the mounting table according to the height position that does not reach
The warp of the electronic component mounting film carrier tape is measured by the difference between the measured height position of the uppermost portion of the electronic component mounting film carrier tape and the previously measured height position of the mounting table surface. A method for measuring a warp of a film carrier tape for mounting an electronic component, wherein

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