JP2009177166A - Inspection device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inspection device which mounts a plurality of substrates to be inspected of various sizes without changing arrangements, and automatically, accurately inspects them after mounting. <P>SOLUTION: The inspection device includes: a holding plate 3 for substrate inspection which holds a substrate to be inspected W and has a plurality of containing recesses 31, 32, 33 containing substrates W of various sizes; an inspection instrument 4 which inspects the substrate held on the holding plate 3; a distance adjusting mechanism 6 which adjusts a distance between an surface to be inspected of the substrate W held on the holding plate 3 and the inspection instrument 4; and a size detection mechanism 5 which detects the size of the substrate W held on the holding plate 3. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an inspection apparatus using a substrate inspection holding plate capable of holding a plurality of types of inspection target substrates having different sizes.

  Conventionally, in order to manually place an inspection target substrate such as a semiconductor wafer having a different size (for example, a diameter) on a stage top plate with high accuracy, a positioning jig is attached or the stage top plate itself is dedicated. It is necessary to change the setup according to the board to be inspected, such as changing to a top board.

  However, it takes time and labor to change the setup, and it is necessary to prepare a positioning jig and a dedicated stage top in advance. This requires a storage space and costs. Furthermore, there is a possibility of mistakes in attachment and replacement, and the work becomes complicated.

  Further, as shown in Patent Document 1, when a transfer robot that can transfer substrates of different sizes is used, no setup change is required, and a plurality of types of substrates are placed on the stage top plate with high accuracy. be able to.

However, there is a problem that the entire apparatus becomes complicated and the price becomes expensive.
JP-A-11-208886

  Therefore, the present invention has been made to solve the above-mentioned problems all at once, and a plurality of types of substrates to be inspected having different sizes can be placed without changing the setup, and can be inspected automatically and accurately after placement. Doing it is the main desired task.

  That is, an inspection apparatus according to the present invention inspects a substrate inspection holding plate having a plurality of receiving recesses for receiving inspection target substrates of different sizes, and an inspection for inspecting an inspection target substrate held by the substrate inspection holding plate. A device, a distance adjusting mechanism for adjusting a distance between the inspection target surface of the inspection target substrate held on the substrate inspection holding plate and the inspection device, and an inspection target held on the substrate inspection holding plate A size detection mechanism for detecting the size of the substrate is provided, and the distance adjustment mechanism adjusts the distance between the inspection target surface of the inspection target substrate and the inspection device based on the detection result of the size detection mechanism. And

  In such a case, it is not necessary to change the setup such as preparing a positioning jig or a dedicated stage top for each inspection target substrate having a different size. In addition, a plurality of types of substrates to be inspected having different sizes can be placed. Furthermore, it becomes possible to inspect a plurality of types of substrates to be inspected continuously and automatically with high accuracy.

  In order to make it possible to securely hold the substrate to be inspected while downsizing the substrate inspection holding plate, the housing recess is formed so as to overlap at least partially in plan view. It is desirable that the depth of the accommodating recess corresponding to the inspection target substrate is formed in increasing order of the size of the target substrate. In this case, even if the substrate inspection holding plate is small, many inspection target substrates can be placed.

  It is particularly desirable that the housing recesses for housing the substrates to be inspected of different sizes are formed coaxially. In this case, the center of the inspection target substrate held on the holding plate is the same position even when the sizes are different, so that the control and setting of the inspection apparatus for each inspection target substrate can be facilitated.

  In order to enable placement with high positional accuracy even when placing manually, a positioning unit that positions the inspection target substrate by contacting the receiving recess with a positioning structure formed on the inspection target substrate. It is desirable to have.

  Furthermore, in order to perform positioning with high accuracy, it is desirable to include a pressing mechanism that presses the inspection target substrate accommodated in the accommodating recess toward the positioning portion.

  In order to accommodate the substrate to be inspected roughly with respect to the housing recess and then automatically and accurately position the substrate, any substrate having a vibration generating mechanism that vibrates the substrate inspection holding plate may be used. If it is such, the position with respect to the said accommodation recessed part of the said test object board | substrate will shift | deviate by vibrating the said board | substrate test | inspection holding plate, and the said test object board | substrate will naturally fit in the said accommodation recessed part and position it. Is done. Therefore, even when placing manually, it is only necessary to roughly place the substrate, so that it is possible to avoid the trouble of placing the substrate to be inspected in the accommodating recess, and to prepare for inspection. This time can be shortened.

  As described above, according to the present invention, a plurality of types of substrates to be inspected having different sizes can be placed without changing the setup, and after placement, inspection can be automatically performed with high accuracy.

  Next, an embodiment of an inspection apparatus 1 according to the present invention will be described with reference to the drawings. 1 is a schematic configuration diagram of the inspection apparatus 1 according to the present embodiment, FIG. 2 is a plan view of the substrate inspection holding plate 3, FIG. 3 is a perspective view of the substrate inspection holding plate 3, and FIG. It is the elements on larger scale of 31, 32, and 33, and its sectional drawing.

  <Device configuration>

  The inspection apparatus 1 according to the present embodiment measures the film thickness, optical constant (refractive index, extinction coefficient, etc.), transmittance, etc. of the surface of the inspection target substrate W such as a semiconductor wafer or a glass substrate, and the presence or absence of defects. It performs a quality inspection to inspect.

  Specifically, as shown in FIG. 1, this device includes a stage 2, a substrate inspection holding plate 3, and an inspection device 4.

  Hereinafter, each part 2-4 is demonstrated.

  The stage 2 is an XY stage that is provided on a base (not shown) and is slidable in a horizontal direction (X-axis direction and Y-axis direction) by a drive unit including a motor and a rail member (not shown). A substrate inspection holding plate 3 is placed horizontally on the stage 2.

  As shown in FIGS. 2 and 3, the substrate inspection holding plate 3 is placed on the stage 2 and is a flat plate having a substantially rectangular shape in plan view. On the upper surface of the substrate inspection holding plate 3, a plurality of different accommodation recesses 31, 32, 33 for accommodating inspection target substrates W of different sizes are formed. Here, the size refers to a shape in a plan view. For example, when the inspection target substrate is a semiconductor wafer, the size is the size of a film formation surface (inspection surface) that is the upper surface of the semiconductor wafer. In the present embodiment, this is the diameter of the substrate to be inspected, particularly in plan view.

  In the present embodiment, in order to be able to hold three types of substantially disc-shaped inspection target substrates W each having a different diameter, receiving recesses 31, 32, and 33 having three different types of inner diameters are formed. Specifically, the first accommodation recess 31 for accommodating the inspection target substrate W having the largest diameter, the second accommodation recess 32 for accommodating the inspection target substrate W having the second largest diameter, and the third largest diameter. A third accommodating recess 33 is formed for accommodating the inspection target substrate W having the above. With such housing recesses 31, 32, 33, positioning can be performed with a certain degree of accuracy even when manually placed, even if there is no positioning portion to be described later.

  These accommodating recesses 31, 32, and 33 have substantially the same shape as the inspection target substrate W in plan view. That is, the dimensions of the housing recesses 31, 32, 33 are such that when the inspection target substrate W is stored, the displacement of the inspection target substrate W with respect to the storage recesses 31, 32, 33 is within a predetermined range. . Specifically, the inner peripheral surfaces of the accommodating recesses 31, 32, and 33 are formed so as to contact the outer peripheral surface of the inspection target substrate W in a state where the inspection target substrate W is stored.

  The receiving recesses 31, 32, 33 are formed so as to at least partially overlap in a plan view, and the receiving recesses 31, 32 corresponding to the inspection target substrate W in ascending order of the size of the inspection target substrate W. 33 have a large depth. Thereby, when accommodating the test object board | substrate W in a certain accommodation recessed part, another accommodation recessed part does not interfere.

  In the present embodiment, as shown in FIG. 4, the second receiving recess 32 is included in the first receiving recess 31 and the third receiving recess 33 is included in the second receiving recess 32 in plan view. Has been. In more detail, the 1st, 2nd and 3rd accommodation recessed parts 31, 32, and 33 are formed concentrically.

  That is, the second housing recess 32 is formed on the bottom surface of the first housing recess 31, and the third housing recess 33 is formed on the bottom surface of the second housing recess 32. At this time, the inner peripheral surfaces of the housing recesses 31, 32, 33 are stepped. Therefore, the second housing recess 32 is formed below the first housing recess 31, and the third housing recess 33 is formed below the second housing recess 32.

  In addition, the housing recesses 31, 32, and 33 of the present embodiment include a positioning unit that contacts the orientation flat formed on the inspection target substrate W to position the inspection target substrate W in the circumferential direction. The positioning portions of the housing recesses 31, 32, 33 are formed in the same radial direction with respect to the central axis. The positioning portion of the present embodiment is a flat portion 311, 321, 331 that is in surface contact with the orientation flat formed on the side surface that forms the housing recesses 31, 32, 33. Accordingly, the orientation flat of the inspection target substrate W is accommodated while being in contact with the flat portions 311, 321, 331, thereby positioning the circumferential position of the inspection target substrate W, that is, the position of the rotation direction with respect to the central axis. it can. The central axis of the inspection target substrate W is positioned when the inner peripheral surfaces of the housing recesses 31, 32, 33 are in contact with the outer peripheral surface of the inspection target substrate W. Thus, since the positioning part exhibits a positioning function together with the housing recesses 31, 32, 33, position reproducibility is good even when compared with a conventional positioning pin alone. Therefore, the measurement accuracy of the inspection target substrate W can be improved.

  And in the accommodation recessed part 31, 32, 33, the side facing the plane parts 311, 321, 331, such as tweezers for gripping the substrate W when accommodating the inspection target substrate W in the accommodation recessed parts 31, 32, 33, etc. In order to prevent the gripping means from getting in the way, in plan view, one end is positioned in the third receiving recess 33, the other end is positioned outside the first receiving recess 31, and from the third receiving recess 33. Also, a deeply recessed portion 34 is provided.

  Further, the substrate inspection holding plate 3 of the present embodiment has a plurality of sets of receiving recesses 31, 32, 33 each including a first receiving recess 31, a second receiving recess 32, and a third receiving recess 33 (FIG. 2). 9 sets in FIG. 3). More specifically, as is apparent from FIG. 2, the adjacent groups are formed at equal intervals.

  The inspection device 4 is specifically a film thickness meter. The film thickness meter 4 includes a light irradiation unit 41 for irradiating the inspection target surface of the inspection target substrate W held on the substrate inspection holding plate 3 on the stage 2 with the inspection light L1, and an inspection target irradiated with the inspection light L1. And a light detector 42 for detecting the reflected and scattered light L2 from the inspection target surface of the substrate W, and measuring changes in the polarization state of the inspection light L1 and the reflected and scattered light L2 on the surface of the substrate W. The film thickness and refractive index of the thin film are calculated from the obtained data. The light irradiation unit 41 includes a laser light source such as a He—Ne laser, a polarizer, and the like, and the light detection unit 42 includes a photodiode or the like. Since such a film thickness meter 4 is used, non-contact, non-destructive and highly accurate measurement can be easily performed.

  The film thickness meter 4 as an inspection device is supported by a support member (not shown) standing on the base so as to be slidable in the vertical direction (Z-axis direction) via the Z-axis moving mechanism 6. The Z-axis moving mechanism 6 includes a motor and a rail member extending in the vertical direction.

  As shown in FIG. 1, the inspection apparatus 1 according to this embodiment includes a size detection mechanism for detecting the size of the inspection target substrate W held on the substrate inspection holding plate 3 and the substrate inspection holding plate 3. A distance adjustment mechanism that adjusts the distance in the vertical direction between the inspection target surface of the inspection target substrate W and the inspection device 4 in accordance with the size of the inspection target substrate W held.

  The size detection mechanism uses an imaging means 5 such as a CCD camera. The image data from the CCD camera 5 is subjected to image processing by an information processing device (not shown), thereby detecting the size of the inspection target substrate W to be inspected by the film thickness meter 4.

  The distance adjusting mechanism is configured by a Z-axis moving mechanism 6 provided on a support member that supports the inspection device 4. The distance adjusting mechanism 6 is controlled by a control signal from the information processing device calculated from the height information of the substrate W surface (inspection target surface) stored in relation to the size of the inspection target substrate W, and the film The height position from the inspection target surface of the inspection target substrate W of the film thickness meter 4 is adjusted so that the focal point of the thickness meter 4 is positioned on the surface of the substrate W. That is, the heights H1, H2, and H3 (see FIG. 4) from the surface of the substrate W to the film thickness meter 4 when the inspection target substrate W that conforms to each of the housing recesses 31, 32, and 33 is placed on the information processing apparatus. It is input in advance (it may be an actual measurement value or a value determined by the standard), and control is performed so that the focal point of the film thickness meter 4 is positioned on the surface of this height.

  The information processing apparatus is a general purpose or dedicated device having a CPU, memory, input / output channels, input means such as a keyboard, output means such as a display, etc., and the input / output channels include an A / D converter, D / An analog-digital conversion circuit such as an A converter or an amplifier is connected.

  Next, the operation and operation method of the inspection apparatus 1 configured as described above will be described.

  First, the substrate inspection holding plate 3 is placed on the stage 2 and the inspection target substrate W is held on the substrate inspection holding plate 3 by a person or a transfer device. A substrate inspection holding plate 3 that holds the inspection target substrate W in advance may be placed on the stage 2.

  When an activation button (not shown) of the inspection apparatus 1 is pressed, the information processing apparatus controls the stage 2 so that the inspection target substrate W to be inspected first is located at the inspection position of the film thickness meter 4 (below the film thickness meter 4). ). Then, the inspection target substrate W is imaged by the CCD camera 5, and the imaging data is output to the information processing apparatus. The information processing apparatus acquires imaging data from the CCD camera 5, detects the size of the inspection target substrate W, and adjusts the height position of the inspection target substrate W of the film thickness meter 4 from the inspection target surface.

  Thereafter, the information processing apparatus moves the stage 2 in the X-axis direction and the Y-axis direction based on the inspection program, and scans the inspection light L1 on the inspection target surface of the inspection target substrate W.

  After the film thickness measurement is completed by scanning the entire inspection target surface of the inspection target substrate W, the information processing apparatus controls the stage 2 so that the next inspection target substrate W is inspected by the inspection position (film Move to below (thickness gauge 4). The subsequent operation is the same as described above.

  <Effect of this embodiment>

  According to the inspection apparatus 1 of the present embodiment configured as described above, it is not necessary to change the stage for each inspection target substrate W having a different size, such as attaching a positioning jig or replacing the stage 2 top plate. Further, even when the inspection target substrate W is manually placed, it can be placed with high accuracy by the positioning unit. Furthermore, it is possible to continuously measure a plurality of types of inspection target substrates W.

  Further, since the housing recesses are formed concentrically on the substrate inspection holding plate 3, the center of the inspection target substrate W held on the holding plate 3 is the same position even when the sizes are different. When the center of W is set as the measurement origin, the control and setting of the inspection apparatus 1 for each inspection target substrate W can be facilitated. In addition, conventional inspection software can be easily used.

  Furthermore, when holding the inspection target substrates W having different diameters by the holding plate 3 of the present embodiment, the heights of the inspection target surfaces are different, but the inspection target of the film thickness meter 4 and the inspection target substrate W is provided by the distance adjusting mechanism. Since the distance to the surface is adjusted, the film thickness meter 4 can be focused on each inspection target substrate W. Therefore, the film thickness of the inspection target substrate W can be accurately measured.

  <Other modified embodiments>

  The present invention is not limited to the above embodiment. In the following description, the same reference numerals are given to members corresponding to the above-described embodiment.

  For example, in the above-described embodiment, all the inspection target substrates W having different sizes have a substantially circular shape in a plan view, but may have a rectangular shape in a plan view. In this case, as shown in FIG. 5, the housing recesses 31, 32, 33 have a substantially rectangular shape in plan view. In this case, a rectangular corner portion can be used as the positioning portion. The plurality of receiving recesses 31, 32, 33 may be formed coaxially.

  Further, the substrate inspection holding plate 3 may be configured to be able to hold the inspection target substrates W having different shapes in plan view. That is, as shown in FIG. 6, the substrate inspection holding plate 3 has a housing recess 3 </ b> A for housing the substrate W having a substantially circular shape in plan view, and a housing recess for housing the substrate W having a substantially rectangular shape in plan view. 3B may be provided.

  Further, in the above embodiment, the housing recesses 31, 32, 33 having different sizes overlap each other, but as shown in FIG. 7, the housing recesses 31, 32, 33 do not overlap each other, that is, each other. It may be formed independently without being overlapped.

  In the embodiment, as shown in FIG. 4, the corners 3 </ b> A of the receiving recesses 31, 32, 33 of the substrate inspection holding plate 3 are perpendicular (the surface on which the inspection target substrate W is placed and the side surface of the substrate W). However, it may have a rounded shape. However, if the peripheral edge of the inspection target substrate W is not a right angle, it is particularly desirable that the corner 3A of the housing recesses 31, 32, 33 is a right angle.

  Furthermore, in the inspection apparatus 1 of the above embodiment, the inspection device is a film thickness meter, but in addition, an interferometer, a transmittance meter, a laser displacement meter or a resistivity meter, a laser scattering type foreign matter inspection device, a foreign matter due to pattern recognition An inspection device or a foreign matter removing device may be used.

  In particular, in the case where the inspection device irradiates a laser beam substantially perpendicularly to the inspection target substrate and detects the reflected light, such as an interferometer or a laser displacement meter, the surface of the holding plate 3 is detected. It is conceivable to apply an antireflection treatment such as a blackening treatment. In this case, noise due to reflection on the surface of the holding plate 3 can be removed.

  In addition, as a size detection mechanism, in addition to image recognition using a CCD camera, a mechanism in which a vacuum chuck is provided in each housing recess and the vacuum chuck is used may be considered. That is, by detecting the pressure in the intake line connected to the suction hole opened at the bottom surface of each storage recess, it is detected which storage recess the test target substrate is suctioned. Since only the pressure in the intake line connected to the intake hole of the receiving recess in which the board to be inspected is stored is smaller than the pressure in the intake line connected to the intake port of the other receiving recess, The accommodation recess in which the substrate W is accommodated is known, and as a result, the size of the inspection target substrate W can be detected from the relationship between the size and height of the inspection target substrate stored in advance. In addition, for example, another sensor such as a photo interrupter may be provided in the housing recess to detect the size.

  Moreover, although the accommodation recessed part of the said embodiment can hold | maintain three types of test object board | substrates from which a diameter differs, you may enable it to hold | maintain 2 types, or 4 or more types of test object board | substrates. All of the same type of inspection target substrates may be held, or different types of inspection target substrates may be held.

  Furthermore, in the said embodiment, although the 1st accommodation recessed part 31, the 2nd accommodation recessed part 32, and the 3rd accommodation recessed part 33 are formed on the concentric circle, as shown in FIG. The second receiving recess 32 is included, and the second receiving recess 32 is formed so that the third receiving recess 33 is included, while the central axes of the receiving recesses 31, 32, 33 are decentered. May be. In this case, the flat portions 311, 321, and 331, which are the positioning portions of the housing recesses 31, 32, and 33, are the same common surface. Thereby, processing can be reduced and manufacturing cost can be reduced.

  Moreover, as a positioning part, as shown in FIG. 9, it is good also as two or more protrusion pins 35 which contact the orientation flat of the test object board | substrate W other than a plane part. In this case, the length of the protruding pin 35 is shorter than the depth of the housing recesses 31, 32, 33 provided with the protruding pin 35.

  In addition, when positioning the inspection target substrate in the circumferential direction using the notch formed in the inspection target substrate, the positioning part may be constituted by one protruding pin, or the inner side forming the accommodation recess You may comprise by the protrusion part which protrudes in a radial inside from a surrounding surface.

  It is also conceivable that the housing recess has an orientation flat protruding pin that contacts an orientation flat formed on the inspection target substrate and a notch protrusion pin that contacts a notch formed on the inspection target substrate. In this case, the orientation flat protruding pin is provided so as to be buried in the bottom surface of the housing recess so that the orientation flat protruding pin does not become an obstacle when the inspection target substrate is positioned by the notch protruding pin.

  Furthermore, as shown in FIG. 10, a pressing mechanism 8 that presses the inspection target substrate W accommodated in the accommodating recesses 31, 32, 33 toward the positioning portion may be provided. The pressing mechanism 8 is provided to face the positioning portion (plane portions 311, 321, 331) and moves forward and backward with respect to the positioning portion (plane portions 311, 321, 331), and the pressing structure And a drive unit (not shown) for driving the body 81. When applied to the holding body 3 of the above-described embodiment, the pressing structure 81 is accommodated in an accommodation groove M provided in communication with each of the accommodation recesses 31, 32, 33, and the accommodation recesses 31, 32, 33. Are formed in the same step shape. That is, the pressing structure 81 can press the inspection target substrate W in correspondence with all sizes.

  In addition, in the embodiment, the second receiving recess 32 is included in the first receiving recess 31 and the third receiving recess 33 is included in the second receiving recess 32 in plan view. As shown in FIG. 11, the housing recesses 31, 32, and 33 may be partially overlapped. In this case, the second housing recess 32 is deeper than the first housing recess 31, and the third housing recess 33 is deeper than the second housing recess 32. Thereby, each accommodation recessed part 31, 32, 33 can hold | maintain all the test object substrates W, without interfering with holding | maintenance of the test object substrate W.

  Furthermore, the distance adjusting mechanism of the embodiment is configured by a Z-axis moving mechanism provided on the support member, but may be configured by a stage when the stage is an XYZ stage. When the inspection device is moved by the Z-axis movement mechanism, there is a problem that the optical system of the inspection device is defocused due to the weight of the inspection device, the accuracy of the Z-axis movement mechanism, the vibration of the Z-axis movement mechanism, and the like. When the inspection device is moved, the optical system needs to be adjusted. However, when the distance adjusting mechanism using the stage is configured, such a problem can be solved.

  In the above embodiment, the distance between the inspection device and the inspection target surface of the inspection target substrate is adjusted based on the detection result of the size detection mechanism. You may provide the distance meter (height meter) which measures distance (height). In this case, the distance of the inspection device with respect to the inspection target surface of the inspection target substrate is roughly adjusted based on the detection result of the size detection mechanism, and then finely adjusted based on the measurement result of the distance meter. Thereby, the error by the fluctuation | variation of the distance of the test object surface of a test object board | substrate and test equipment by the film thickness formed on the test object board | substrate can be eliminated. Moreover, the adjustment time of the distance of the inspection device with respect to the inspection target surface of the inspection target substrate can be shortened. Further, even a distance meter that cannot measure the distance unless the distance is suitable to some extent can be used.

  In the embodiment, the distance between the inspection target surface of the inspection target substrate and the inspection device is adjusted according to the size (specifically, the diameter) of the inspection target substrate. The inspection target based on the diameter) and the recipe of each inspection process of the inspection target substrate (including the measurement conditions such as the setting of the inspection equipment and the measurement position (including the Z coordinate) determined by the film thickness of the inspection target substrate, etc.) The distance between the inspection target surface of the substrate and the inspection device may be adjusted. The thickness of the substrate to be inspected is changed by processing such as increasing the thickness by forming a film on the upper surface thereof. If the substrate to be inspected becomes thicker, it becomes slightly smaller than the desired distance adjusted only by the size of the substrate to be inspected. Such an error can be removed by adjusting in consideration of the recipe of each process. Specifically, a reference substrate (reference sample) is selected from among the inspection target substrates subjected to each process, and the inspection target surface and inspection equipment of the inspection target substrate subjected to each process are selected using the reference sample. Set the reference distance. Then, a reference distance is set for each size and each recipe. The distance adjusting mechanism adjusts the distance between the inspection target surface of the inspection target substrate and the measuring device so that the reference distance is set for each size and each recipe at the time of inspection. Further, the content of the recipe (for example, a measurement position such as a Z coordinate) may be corrected using information on the size of the specimen target substrate.

  Further, in order to measure an inspection target substrate having a plurality of thicknesses with one size, a plurality of distances may be set for one size, and it may be selected at which distance the inspection is performed.

  The height information in the embodiment is information indicating the height of the substrate surface, but may be information indicating the height of the stage. In any case, the height information needs to include position information in the direction perpendicular to the inspection target surface of the inspection target substrate.

  As shown in FIG. 12, a vibrator V may be attached to the substrate inspection holding plate 3 as a vibration generating mechanism for vibrating the substrate inspection holding plate 3. In this case, for example, the outer peripheral surface of the inspection target substrate W is only partially in contact with the inner peripheral surfaces of the accommodating recesses 31, 32, 33, and the inspection target substrate W is inclined obliquely so as to be accommodated. Even if it is accommodated in 33, the substrate inspection holding plate 3 is vibrated by the vibrator V so that all the outer peripheral surfaces of the substrate W are in contact with the inner peripheral surfaces of the accommodating recesses 31, 32, 33. It can be performed.

  Therefore, since positioning can be performed even if the inspection target base W is not precisely stored in the receiving recesses 31, 32, 33, when the inspection target substrate is manually placed in the receiving recesses 31, 32, 33 Therefore, the time required for preparation for the inspection can be shortened.

  Further, instead of attaching a vibrator to the substrate inspection holding plate 3, the stage 2 may be used as a vibration generating mechanism, and the stage 2 may be moved to vibrate the substrate inspection holding plate 3.

  In the above embodiment, there is one vibration generating mechanism, but a plurality of vibration generating mechanisms may be provided. That is, it is sufficient that at least one vibration generating mechanism is attached. Further, the vibration generating mechanism may not be installed on the substrate inspection holding plate, and as a result, the substrate inspection holding plate may vibrate.

  In addition, some or all of the above-described embodiments and modified embodiments may be combined as appropriate, and the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present invention. .

1 is a schematic configuration diagram of an inspection apparatus according to an embodiment of the present invention. The top view of the board | substrate inspection holding plate. The perspective view of the board | substrate inspection holding plate. The elements on larger scale of an accommodating recessed part, and its sectional drawing. The top view of the board | substrate inspection holding | maintenance board which shows the modification of an accommodation recessed part. The top view of the board | substrate inspection holding | maintenance board which shows the modification of an accommodation recessed part. The top view of the board | substrate inspection holding | maintenance board which shows the modification of an accommodation recessed part. The elements on larger scale which show the modification of an accommodation recessed part, and its sectional drawing. The elements on larger scale which show the modification of an accommodation recessed part, and its sectional drawing. The elements on larger scale which show an accommodation recessed part and a press mechanism, and its sectional drawing. The top view which shows the modification of the board | substrate inspection holding plate. The perspective view which shows the modification of the board | substrate inspection holding plate

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Inspection apparatus 2 ... Stage 3 ... Holding board 3A for board | substrate inspection ... Positioning part (plane part)
31, 32, 33 ... receiving recess W ... inspection target substrate 4 ... inspection device 5 ... size detection mechanism (CCD camera)
6 ... Distance adjustment mechanism (Z-direction movement mechanism)
8: Pressing mechanism V: Vibration generating mechanism

Claims (6)

A substrate inspection holding plate having a plurality of receiving recesses for receiving inspection target substrates of different sizes;
An inspection device for inspecting the inspection target substrate held by the substrate inspection holding plate;
A distance adjusting mechanism for adjusting the distance between the inspection target surface of the inspection target substrate held by the substrate inspection holding plate and the inspection device;
A size detection mechanism for detecting the size of a substrate to be inspected held on the substrate inspection holding plate;
The inspection apparatus in which the distance adjustment mechanism adjusts the distance between the inspection target surface of the inspection target substrate and the inspection device based on the detection result of the size detection mechanism.   2. The housing recess is formed so as to at least partially overlap in plan view, and the depth of the housing recess corresponding to the inspection target substrate is increased in order of increasing size of the inspection target substrate. The inspection device described.   The inspection apparatus according to claim 2, wherein the accommodating recesses for accommodating the substrates to be inspected of different sizes are formed coaxially.   4. The inspection apparatus according to claim 1, wherein the housing recess includes a positioning unit that contacts the positioning structure formed on the inspection target substrate to position the inspection target substrate.   The inspection apparatus according to claim 4, further comprising a pressing mechanism that presses the inspection target substrate accommodated in the accommodation recess toward the positioning portion.   The inspection apparatus according to claim 1, further comprising a vibration generating mechanism that vibrates the substrate inspection holding plate.