JP3944485B2 - Substrate chucking device - Google Patents

Description

  The present invention relates to a substrate chucking device, and more particularly to a substrate chucking device that can hold substrates of different sizes without replacement or adjustment of components.

  In the manufacturing process of various substrates such as semiconductor wafer substrates, glass substrates, printed substrates, lenses, etc., the substrate chucking device holds the side surfaces or end surfaces of these substrates and carries out various operations such as transport, cleaning, drying, and chemical treatment. There is.

FIG. 1 is a side view of a typical example of a conventional substrate chucking apparatus. In this substrate chucking apparatus, a substantially L-shaped chuck 1 is supported by a base 2 with its end as a fulcrum, and can be raised and lowered. When the chuck 1 is in the closed state A, the substrate 3 is held, and when the chuck 1 is in the open state B indicated by a broken line, the substrate 3 is detached.
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  In this conventional substrate chucking apparatus, since the chuck 1 is displaced in a non-linear manner between the closed state A and the open state B, the substrate 3 must be positioned using a highly accurate mechanism. Adjustment also had to be performed with high accuracy. Further, in this conventional substrate chucking apparatus, it is necessary to replace the chuck 1 every time the size of the substrate 3 changes, and to perform high-precision assembly adjustment each time.

  The present invention has been made as a solution to the above-described problems of the substrate chucking apparatus for horizontally holding various substrates, and reliably holds the substrates 3 of different sizes without performing component replacement or troublesome adjustments. An object of the present invention is to provide a substrate chucking apparatus that can perform the above-described process.

A chuck opening / closing guide member 10 capable of moving up and down formed with a guide elongated hole 11 inclined with respect to the vertical direction, a horizontal arm portion 6 and a vertical arm portion 7 rising upward from the horizontal arm portion 6, A guide pin 12 disposed at an end is inserted into the guide through hole 9 through the chuck 4 slidably engaged with the guide long hole 11 of the chuck opening / closing guide member 10 and the horizontal arm portion 6 of the chuck 4. Accordingly, the support member 8 that slidably supports this in the left-right direction constitutes a substrate chucking device, and the chuck opening / closing guide member 10 is moved up and down by an arbitrary amount of movement, whereby the vertical arm portion 7 of the chuck 4, The above-mentioned problem was solved by setting the interval between 7 freely so that substrates of different sizes can be sandwiched .

By raising and lowering the chuck opening / closing guide member 10 by an arbitrary amount of movement, the distance between the vertical arm portions 7 and 7 of the chuck 4 can be freely changed, so that the substrates 3 having different sizes can be freely held. . Further, since the chuck 4 moves only in the left-right direction, positioning when chucking the substrate 3 is extremely easy. Furthermore, the structure is simple, there is little risk of failure or deformation, and it can be used stably for a long time.

A long guide hole 11 that is inclined with respect to the vertical direction is formed in the chuck opening / closing guide member 10, and a guide pin 12 is slidably engaged with the chuck opening / closing guide member 10 so that the chuck 4 can be moved only in the horizontal direction. There is a structural feature of the present invention in that the guide member 10 can be stopped at an arbitrary position.

  FIG. 2 is a front view of Embodiment 1 of the substrate chucking apparatus according to the present invention. In the figure, reference numeral 4 denotes a chuck, which has a substantially L shape comprising a horizontal arm portion 6 and a vertical arm portion 7 rising upward from the horizontal arm portion 6, and a substrate is held near the upper end of the vertical arm portion 7. Part 5 is formed. The chuck 4 has a horizontal arm portion 6 slidably inserted in a guide through hole 9 provided in a support member 8 planted from a base portion (not shown), and slides only in the horizontal direction. It can be done. Reference numeral 10 denotes a chuck opening / closing guide member, and an upper guide hole 11 is formed in the upper portion of the chuck opening / closing guide member 10 such that the upper end portion is located closer to the center and the lower end portion is located closer to the outside. The guide elongated hole 11 is slidably engaged with a guide pin 12 projecting from the end of the horizontal arm portion 6 of the chuck 4. A driving means 13 such as a motor or an air cylinder is connected to the lower end of the chuck opening / closing guide member 10 so that the chuck opening / closing guide 10 can be slid in the vertical direction and stopped at an arbitrary position. .

The first embodiment has the configuration as described above, and when the chuck opening / closing guide member 10 is raised as shown in FIG. 3 by the driving means 13, the guide pin 12 of the chuck 4 moves in the guide long hole 11. Accordingly, the chuck 4 is pushed outward, the distance between the vertical arm portions 7 and 7 of the pair of chucks 4 and 4 is widened, and the guide pin 12 shown in FIG. , The substrate holding portions 5, 5 of the pair of vertical arm portions 7.
The interval between is the maximum. On the contrary, when the chuck opening / closing guide member 10 is lowered, the guide pin 12 of the chuck 4 is moved upward in the guide long hole 11, and accordingly, the chuck 4 is drawn inward, and the state shown in FIG. The distance between the substrate holding portions 5 and 5 of the pair of vertical arm portions 7 is minimized. Therefore, by stopping the chuck opening / closing guide member 10 at an arbitrary position by the driving means 13 such as a motor or an air cylinder, the substrate 3 of any size can be reliably held within the movement range of the chuck 4. . At this time, since the chuck 4 moves only in the left-right direction, the positioning of the substrate 3 during the chucking operation can be performed smoothly and easily.

  In the above embodiment, a pair of chucks 4 is provided. However, four chucks 4 are provided by displacing the chuck 4 by 90 ° so as to hold the four sides of the square substrate 3, Three chucks 4 may be provided by being displaced by 120 ° so as to hold the peripheral edge. In this case, as many guide elongated holes 11 as the number of chucks 4 are provided.

  5 and 6 show a second embodiment of the substrate chucking apparatus according to the present invention. In this second embodiment, the guide slot 11 has a gentle slope at the bottom and a steep slope at the top. Is formed in a quadratic curve shape. The other parts are the same as those in the first embodiment.

In the second embodiment, since the guide long hole 11 is formed in a quadratic curve shape, the chuck 4 when the guide pin 12 passes through the gently inclined portion of the guide long hole 11 as shown in FIG. As shown in FIG. 5, the amount of left and right movement of the chuck 4 when passing through a steep portion is small, so that the initial movement operation of the chuck 4 is quickly performed near the holding position of the substrate 3. The moving operation at can be performed at low speed and with high precision.
Further, the guide long hole 11 is formed into a multi-order curve shape in which curves having different curvatures are combined as shown in FIG. 7, or straight lines having different inclination angles are continuously formed as shown in FIG. In these cases, the lateral movement of the chuck 4 can be set more finely according to the size of the substrate 3.

  It has sufficient applicability in the manufacturing process of various substrates such as semiconductor wafer substrates, glass substrates, printed substrates, and lenses.

The front view of the typical example of the conventional board | substrate chucking apparatus. The front view of the state holding the board | substrate 3 of Example 1 of the board | substrate chucking apparatus based on this invention. Similarly, the front view of the state which expanded the space | interval between a pair of chuck | zipper 4,4. Similarly, the front view of the state which expanded the space | interval between a pair of chuck | zipper 4 and 4 to the maximum. The front view of the state which hold | maintained the board | substrate of Example 2 of the board | substrate chucking apparatus based on this invention. Similarly, the front view of the state which expanded the space | interval between a pair of chuck | zipper 4 and 4 to the maximum. The partial front view of the Example which made the guide elongate hole 11 the multi-dimensional curve shape which the curve with a different curvature combined. The partial front view of the Example which comprised the guide long hole 11 combining the straight line which has a different inclination | tilt angle.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Chuck 2 Base 3 Board | substrate 4 Chuck 5 Board | substrate holding | maintenance part 6 Horizontal arm part 7 Vertical arm part 8 Support member 9 Guide through-hole 10 Chuck opening / closing guide member 11 Guide long hole 12 Guide pin 13 Drive means

Claims (5)

A chuck opening / closing guide member 10 capable of moving up and down formed with a guide elongated hole 11 inclined with respect to the vertical direction, a horizontal arm portion 6 and a vertical arm portion 7 rising upward from the horizontal arm portion 6, A guide pin 12 disposed at an end is inserted into the guide through hole 9 through the chuck 4 slidably engaged with the guide long hole 11 of the chuck opening / closing guide member 10 and the horizontal arm portion 6 of the chuck 4. Thus, the support member 8 is slidably supported in the left-right direction. By moving the chuck opening / closing guide member 10 up and down by an arbitrary amount of movement, the interval between the vertical arm portions 7 and 7 of the chuck 4 can be freely set. A substrate chucking device characterized in that it can be set and can hold substrates of different sizes . 2. The substrate chucking apparatus according to claim 1, wherein the guide long hole is inclined linearly. 2. The substrate chucking apparatus according to claim 1, wherein the guide long holes are inclined in a multi-degree curve. 2. The substrate chucking apparatus according to claim 1, wherein the guide slot 11 is formed by combining two or more continuous inclination angles. 5. The substrate chucking apparatus according to claim 1, wherein the chuck opening / closing guide member is moved up and down by a driving means that can be stopped at an arbitrary position.

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