JP3922672B2 - ポジ型感光性樹脂組成物及びパターン形成方法 - Google Patents

ポジ型感光性樹脂組成物及びパターン形成方法 Download PDF

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Publication number
JP3922672B2
JP3922672B2 JP22979398A JP22979398A JP3922672B2 JP 3922672 B2 JP3922672 B2 JP 3922672B2 JP 22979398 A JP22979398 A JP 22979398A JP 22979398 A JP22979398 A JP 22979398A JP 3922672 B2 JP3922672 B2 JP 3922672B2
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Japan
Prior art keywords
group
solvent
acid
photosensitive resin
resin composition
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Expired - Fee Related
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JP22979398A
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English (en)
Japanese (ja)
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JP2000066380A5 (enExample
JP2000066380A (ja
Inventor
保雅 河辺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Corp
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Fujifilm Corp
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Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Priority to JP22979398A priority Critical patent/JP3922672B2/ja
Priority to US09/295,329 priority patent/US6806022B1/en
Priority to KR1019990014184A priority patent/KR100601078B1/ko
Priority to EP99107339.6A priority patent/EP0952489B1/en
Publication of JP2000066380A publication Critical patent/JP2000066380A/ja
Priority to US10/315,182 priority patent/US6846610B2/en
Publication of JP2000066380A5 publication Critical patent/JP2000066380A5/ja
Application granted granted Critical
Publication of JP3922672B2 publication Critical patent/JP3922672B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Materials For Photolithography (AREA)
JP22979398A 1998-04-22 1998-08-14 ポジ型感光性樹脂組成物及びパターン形成方法 Expired - Fee Related JP3922672B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP22979398A JP3922672B2 (ja) 1998-08-14 1998-08-14 ポジ型感光性樹脂組成物及びパターン形成方法
US09/295,329 US6806022B1 (en) 1998-04-22 1999-04-21 Positive photosensitive resin composition
KR1019990014184A KR100601078B1 (ko) 1998-04-22 1999-04-21 포지티브 감광성 수지 조성물
EP99107339.6A EP0952489B1 (en) 1998-04-22 1999-04-21 Positive photosensitive resin composition
US10/315,182 US6846610B2 (en) 1998-04-22 2002-12-10 Positive photosensitive resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22979398A JP3922672B2 (ja) 1998-08-14 1998-08-14 ポジ型感光性樹脂組成物及びパターン形成方法

Publications (3)

Publication Number Publication Date
JP2000066380A JP2000066380A (ja) 2000-03-03
JP2000066380A5 JP2000066380A5 (enExample) 2005-02-24
JP3922672B2 true JP3922672B2 (ja) 2007-05-30

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Application Number Title Priority Date Filing Date
JP22979398A Expired - Fee Related JP3922672B2 (ja) 1998-04-22 1998-08-14 ポジ型感光性樹脂組成物及びパターン形成方法

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JP (1) JP3922672B2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3430028B2 (ja) * 1998-09-08 2003-07-28 松下電器産業株式会社 パターン形成方法
JP2001281853A (ja) * 2000-04-03 2001-10-10 Fujifilm Arch Co Ltd ポジ型感光性樹脂組成物
JP2002006483A (ja) * 2000-06-20 2002-01-09 Sumitomo Chem Co Ltd フォトレジスト組成物
US7463338B2 (en) 2003-07-08 2008-12-09 Hoya Corporation Container for housing a mask blank, method of housing a mask blank, and mask blank package
JP4347110B2 (ja) * 2003-10-22 2009-10-21 東京応化工業株式会社 電子線又はｅｕｖ用ポジ型レジスト組成物
JP2007071902A (ja) * 2005-09-02 2007-03-22 Fujifilm Corp 感光性組成物及び該感光性組成物を用いたパターン形成方法
TW200736855A (en) * 2006-03-22 2007-10-01 Quanta Display Inc Method of fabricating photoresist thinner

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Publication number Publication date
JP2000066380A (ja) 2000-03-03

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