JP3916476B2 - Communication equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component that operates at a low temperature, and more particularly to a communication device that includes two or more electronic components that operate at different temperatures.
[0002]
[Prior art]
Some electronic components operate at a low temperature or an extremely low temperature. By providing two or more electronic components as described above, it is possible to configure a communication device with good performance.
[0003]
FIG. 2 shows an example of a communication device provided with the two or more electronic components, particularly a receiving communication device. 1 is an antenna that receives a signal, 2 is a bandpass filter that selects a signal in a desired band, 3 is a low-noise amplifier that amplifies the signal in the band selected by the bandpass filter to a desired level, Reference numeral 4 denotes a cold head which is a cooling member for bringing the electronic component into a cryogenic state, 5 denotes a heat shielding container which accommodates the electronic component and the cooler and insulates from the outside, and 6 is a cooling for cooling the cold head It is a vessel.
[0004]
Here, the bandpass filter 2 is a superconducting filter having, for example, a superconducting material as a component. The superconducting material is preferably a high temperature superconducting material. The high-temperature superconducting material is, for example, a Bi-based, Ti-based, Pb-based, Y-based copper oxide. The high temperature superconducting filter (HTSF) is, for example, a thin film HTSF having a microstrip structure or a thick film HTSF having a cavity resonator structure. Power for operating the low-noise amplifier 3 is supplied from an external power source via the amplifier power supply terminal 8. Moreover, it is preferable to accommodate in the said heat shielding container 5 for noise reduction. In this case, the low-noise amplifier 3 is preferably a cryogenic amplifier (CLNA: Cryogenic Low Noise Amplifier). The heat shielding container 5 is, for example, a Dewar bottle having a structure that blocks heat entry from the outside by vacuum insulation.
[0005]
The cooler 6 uses the cold head 4 to cool the band filter 2 to a temperature at which the band-pass filter 2 exhibits a superconducting state. Electric power for operating the cooler 6 is supplied from the outside through a cooler power terminal 7. The cooler here is, for example, a cryogenic cooler. The cryogenic cooler maintains a cryogenic temperature of several tens of K (K = −273 ° C.) by using a heat exchange cycle by compression / expansion of helium gas or the like. The cryogenic cooler may be a cooler that employs a small Stirling pulse cooling system, for example.
[0006]
In the communication device configured as described above, the band filter 2 and the low noise amplifier 3 are cooled at a very low temperature, thereby reducing the thermal noise generated in the band filter 2 and the low noise amplifier 3, and the band filter 2. Insertion loss and the attenuation characteristic of the bandpass filter 2 can be made steep. As a result, by using the communication device shown in FIG. 1, for example, a C / N (carrier power versus noise power) reception output can be obtained even for a low level reception signal.
[0007]
[Problems to be solved by the invention]
However, cryogenic amplifiers that are guaranteed to operate at extremely low temperatures are expensive, and when low-noise amplifiers are installed outside the heat shield container, expensive cryogenic amplifiers that are guaranteed to operate at extremely low temperatures are used. There is no need to do this, but the length of the signal transmission path connecting the band-pass filter and the low-noise amplifier increases and the loss increases.
[0008]
An object of the present invention is to solve the above-described problems, and enables two or more electronic components having different operating temperatures to be cooled at different temperatures.
[0009]
[Means for Solving the Problems]
In the communication device according to claim 1 of the present invention, a filter and an amplifier are accommodated in a heat shielding container provided with a cooler, the filter is provided in contact with the cooling member, and the amplifier is separated from the cooling member. In addition to being provided in a state, it is provided in contact with a radiation plate that receives radiant heat.
[0010]
A communication device according to claim 2 of the present invention is characterized in that the filter according to claim 1 is made of a superconducting material, and the superconducting material is cooled by a cooler and is in a superconducting state. .
[0011]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 shows an embodiment of the present invention. 1 that are the same as those shown in FIG. 2 are given the same reference numerals, and descriptions thereof are omitted.
[0012]
In FIG. 1, reference numeral 9 denotes a radiation plate which increases the temperature of an electronic component provided in contact with the radiation plate by receiving radiant heat.
[0013]
The radiation plate 9 has a high emissivity and a good thermal conductivity so that it can receive radiant heat effectively. For example, it is preferable to use an aluminum plate subjected to black alumite treatment.
[0014]
In FIG. 1, since the band-pass filter 2 is directly attached to the cold head 4, the band-pass filter 2 is cooled to a cryogenic temperature by the cooler 6 through the cold head 4.
[0015]
Here, since the low noise amplifier 3 is not directly attached to the cold head 4, the temperature becomes higher than that of the band-pass filter 2. Further, since the radiation plate 9 is provided in contact with the radiation plate 9, the radiation plate 9 absorbs radiant heat from the outside of the heat shielding container 5 and transmits it to the low noise amplifier 3. Is further increased.
[0016]
In other words, in the same heat shielding container, cooling can be performed at different temperatures according to the guaranteed operating temperature of the bandpass filter and the low noise amplifier by a single system of cooling means (the cold head 4 and the cooler 6). It becomes possible.
[0017]
Here, as one of means for adjusting the cooling temperature in accordance with the operation guarantee temperature of the low noise amplifier 3, adjusting the amount of heat received by the radiation plate 9 can be mentioned. The amount of heat received can be adjusted by adjusting the heat receiving area of the radiation plate 9. As an example, it has been confirmed that when a 2W77K cooler is used and a 2500 square mm radiation plate treated with black alumite is attached to a low noise amplifier, the temperature is about 200K.
[0018]
【The invention's effect】
As described above, according to the present invention, the bandpass filter and the low noise amplifier are accommodated in the heat shielding container provided with the cooler, the bandpass filter is provided in contact with the cold head, and the low noise amplifier is the cooling member. By being provided in a state separated from the radiation plate, by being provided in contact with the radiation plate, it is possible to prevent the low noise amplifier from being excessively cooled, and further, by adjusting the heat receiving area of the radiation plate, It can be adjusted to a temperature that matches the guaranteed operating temperature of the low noise amplifier. As a result, it is possible to reduce thermal noise generated in the low noise amplifier without using an expensive cryogenic amplifier for the low noise amplifier.
[Brief description of the drawings]
FIG. 1 is a configuration diagram illustrating an embodiment of the present invention.
FIG. 2 is a configuration example diagram showing a conventional example.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Antenna 2 Bandpass filter 3 Low noise amplifier 4 Cold head 5 Heat shielding container 6 Cooler 7 Power supply terminal 8 for cooler Power supply terminal 9 for amplifier Radiant plate

Claims (2)

A filter and an amplifier are accommodated in a heat shielding container provided with a cooler, the filter is provided in contact with the cooling member, the amplifier is provided in a state of being separated from the cooling member, and receives a radiant heat. A communication device, wherein the communication device is provided in contact with the device. The communication device according to claim 1, wherein the filter is made of a superconductive material, and the superconductive material is cooled by a cooler and is in a superconductive state.

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