JP3908705B2 - Liquid cooling device and liquid cooling system - Google Patents

Liquid cooling device and liquid cooling system Download PDF

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JP3908705B2
JP3908705B2 JP2003307688A JP2003307688A JP3908705B2 JP 3908705 B2 JP3908705 B2 JP 3908705B2 JP 2003307688 A JP2003307688 A JP 2003307688A JP 2003307688 A JP2003307688 A JP 2003307688A JP 3908705 B2 JP3908705 B2 JP 3908705B2
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refrigerant
liquid cooling
flow path
cooling device
channel
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JP2005079337A (en
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秀夫 岩崎
勝美 久野
伴直 高松
治彦 大田
康一 鈴木
洋 河村
宜之 阿部
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Toshiba Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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Description

半導体素子等の発熱体を冷媒により冷却する液冷装置及び液冷システムに関し、特に発熱体から冷媒への熱伝達を促進することで、発熱体を均等に冷却できると同時に冷媒の流量を低減できるものに関する。   The present invention relates to a liquid cooling device and a liquid cooling system for cooling a heating element such as a semiconductor element with a refrigerant, and in particular, by promoting heat transfer from the heating element to the refrigerant, the heating element can be cooled uniformly and at the same time the flow rate of the refrigerant can be reduced. About things.

ＩＧＢＴ等の高発熱パワー素子（発熱体）を備えた電気装置の水冷構造が従来より知られている（例えば特許文献１参照）。   2. Description of the Related Art Conventionally, a water-cooling structure for an electric device provided with a high heat-generating power element (heating element) such as an IGBT is known (see, for example, Patent Document 1).

図３７は上述したような水冷構造が組み込まれた液冷システム１０の一例を示す構成図、図３８はこの液冷システム１０に組み込まれた液冷装置３０を示す縦断面図である。液冷システム１０は、液相の冷媒Ｌを貯溜する冷媒溜１１と、この冷媒溜１１に配管１２を介して接続され冷媒Ｌを送り出すポンプ１３と、このポンプ１３及び冷媒溜１１にそれぞれ配管１４，１５を介して接続された流量調整装置１６と、この流量調整装置１６に配管１７を介して接続された液冷装置３０と、この液冷装置３０に配管１８を介して接続された熱交換器１９と、この熱交換器１９と冷媒溜１１とを接続する配管２０とを備えている。なお、冷媒溜１１には圧力調整装置２１が設けられている。流量調整装置１６は、所定の流量の冷媒Ｌが液冷装置３０に供給されるように調整する機能を有している。   FIG. 37 is a configuration diagram showing an example of the liquid cooling system 10 in which the water cooling structure as described above is incorporated, and FIG. 38 is a longitudinal sectional view showing the liquid cooling device 30 incorporated in the liquid cooling system 10. The liquid cooling system 10 includes a refrigerant reservoir 11 that stores a liquid-phase refrigerant L, a pump 13 that is connected to the refrigerant reservoir 11 via a pipe 12 and sends out the refrigerant L, and a pipe 14 that is connected to the pump 13 and the refrigerant reservoir 11, respectively. , 15, the flow rate adjusting device 16 connected via the pipe 15, the liquid cooling device 30 connected to the flow rate adjusting device 16 via the pipe 17, and the heat exchange connected to the liquid cooling apparatus 30 via the pipe 18. And a pipe 20 connecting the heat exchanger 19 and the refrigerant reservoir 11. The refrigerant reservoir 11 is provided with a pressure adjusting device 21. The flow rate adjusting device 16 has a function of adjusting so that the refrigerant L having a predetermined flow rate is supplied to the liquid cooling device 30.

液冷装置３０は、銅材製の内部に冷却流路３２が形成された筐体３１を備え、筐体３１の外壁面には高発熱パワー素子（発熱体）Ｐ等の半導体素子が搭載された基板Ｓが取付けられている。なお、高発熱パワー素子Ｐは、基板Ｓにはんだを用いて取り付けられており、基板Ｓは高発熱パワー素子Ｐを基板Ｓに取り付けるはんだよりも融点の低いはんだを用いて接続される。また、冷却流路３２には冷媒Ｌとして純水等が通流する。
特開２００２−３１４２８１号公報 The liquid cooling device 30 includes a casing 31 in which a cooling channel 32 is formed inside a copper material, and a semiconductor element such as a high heat generating power element (heating element) P is mounted on the outer wall surface of the casing 31. A substrate S is attached. The high heat generating power element P is attached to the substrate S using solder, and the substrate S is connected using solder having a lower melting point than the solder attaching the high heat generating power element P to the substrate S. In addition, pure water or the like as the refrigerant L flows through the cooling flow path 32.
JP 2002-314281 A

上述した液冷システムであると次のような問題があった。すなわち、液冷装置３０では冷却流路３２の下流にいくにつれて冷媒Ｌの温度が上昇するとともに、高発熱パワー素子Ｐで発生した熱を冷媒Ｌに伝達する流路壁面（伝熱面Ｈ）の温度境界層が厚くなって熱伝達率が低下する。このため冷却流路３２の下流側に実装された高発熱パワー素子Ｐほど温度が高くなるという問題がある。   The liquid cooling system described above has the following problems. That is, in the liquid cooling device 30, the temperature of the refrigerant L rises as it goes downstream of the cooling flow path 32, and the flow path wall surface (heat transfer surface H) that transmits heat generated by the high heat generating power element P to the refrigerant L. The temperature boundary layer becomes thick and the heat transfer coefficient decreases. For this reason, there exists a problem that temperature becomes high, so that the high heat_generation | fever power element P mounted downstream of the cooling flow path 32 exists.

特に大容量のパワーデバイス等の半導体素子ではモジュールサイズが大きいため、冷却流路の上流側に位置する半導体素子と下流側に位置する半導体素子とではその温度差が大きくなるという傾向がある。   In particular, since a module size is large in a semiconductor element such as a large-capacity power device, there is a tendency that the temperature difference between the semiconductor element located on the upstream side of the cooling flow path and the semiconductor element located on the downstream side becomes large.

パワーデバイスでは電気的な導通抵抗は素子温度に影響を受けるため、複数の素子を用いる、あるいは単一のウエハを使用する形態のように１つの素子の面積が広いとき、温度分布によりデバイスの性能を十分に引き出すことができなくなる虞がある。一般にはモジュール内の複数の素子あるいは単一のウエハ内での温度差は概ね５℃以下に制御することが好ましいとされている。また、温度分布はモジュール内部での熱膨張の差を発生させるためはんだ接合面等の信頼性に対しても悪影響を及ぼす可能性もある。   In a power device, the electrical conduction resistance is affected by the element temperature. Therefore, when the area of one element is large as in the case of using a plurality of elements or using a single wafer, the device performance depends on the temperature distribution. May not be able to be fully extracted. Generally, it is preferable to control the temperature difference within a plurality of elements in a module or within a single wafer to about 5 ° C. or less. In addition, since the temperature distribution generates a difference in thermal expansion inside the module, there is a possibility of adversely affecting the reliability of the solder joint surface and the like.

一方、このような温度分布がもたらす問題を回避するために、冷媒の流量を増やして冷媒Ｌの温度上昇を小さくするという方法が考えられるが、この方法ではポンプ動カが増大し、冷却のために費やすエネルギが増加するという問題が新たに生ずる。   On the other hand, in order to avoid such a problem caused by the temperature distribution, a method of increasing the flow rate of the refrigerant to reduce the temperature rise of the refrigerant L can be considered. A new problem arises in that the energy consumed in the process increases.

そこで本発明は、発熱体を均一に冷却することにより、発熱体の電気的特性及び機械的信頼性等を向上させると同時に、少ない冷媒流量で高い冷却特性が得られ、冷却に消費されるエネルギの低減を図ることが可能な液冷装置及び液冷システムを提供することを目的とする。   Therefore, the present invention uniformly improves the electrical characteristics and mechanical reliability of the heating element by cooling the heating element uniformly, and at the same time obtains high cooling characteristics with a small refrigerant flow rate, and energy consumed for cooling. An object of the present invention is to provide a liquid cooling device and a liquid cooling system capable of reducing the above.

上記課題を解決し目的を達成するために、本発明の液冷装置及び液冷システムは次のように構成されている。   In order to solve the above problems and achieve the object, the liquid cooling apparatus and the liquid cooling system of the present invention are configured as follows.

（１）発熱体を冷媒により冷却する液冷装置において、上記冷媒が通流するとともに上記発熱体に熱的に接続された主流路と、この主流路よりも上記発熱体から離間した位置に設けられ、上記冷媒が通流する副流路とを備え、上記主流路と上記副流路との間には上記冷媒を通流させる連通流路が設けられている。 (1) In a liquid cooling apparatus that cools a heating element with a refrigerant, a main flow path through which the refrigerant flows and is thermally connected to the heating element, and a position further away from the heating element than the main flow path And a sub-flow path through which the refrigerant flows, and a communication flow path through which the refrigerant flows is provided between the main flow path and the sub-flow path.

（２）上記（１）に記載された液冷装置であって、上記主流路の上流側に比べて下流側に多く又は大口径の連通流路が設けられていることを特徴とする。 (2) The liquid cooling apparatus according to (1), wherein a communication channel having a larger or larger diameter is provided on the downstream side than the upstream side of the main channel.

（３）上記（１）に記載された液冷装置であって、上記主流路内の上記冷媒の通流方向と上記副流路内の上記冷媒の通流方向とが逆方向であることを特徴とする。 (3) In the liquid cooling device described in (1) above, the flow direction of the refrigerant in the main flow path and the flow direction of the refrigerant in the sub flow path are opposite to each other. Features.

（４）発熱体を冷媒により冷却する液冷システムにおいて、上記発熱体に設けられた液冷装置と、この液冷装置に冷媒を送るポンプと、このポンプにより送られた冷媒を分流して上記液冷装置に供給する分岐装置と、上記液冷装置から排出された冷媒を冷却する熱交換器とを備え、上記液冷装置は、上記冷媒が通流するとともに上記発熱体に熱的に接続された主流路と、この主流路よりも上記発熱体から離間した位置に設けられ、上記冷媒が通流する副流路とを備え、上記主流路と上記副流路との間には上記冷媒を通流させる連通流路が設けられていることを特徴とする。 ( 4 ) In a liquid cooling system for cooling a heating element with a refrigerant, a liquid cooling device provided in the heating element, a pump that sends the refrigerant to the liquid cooling device, and a refrigerant sent by the pump is divided to The liquid cooling device includes a branch device that supplies the liquid cooling device and a heat exchanger that cools the refrigerant discharged from the liquid cooling device, and the liquid cooling device is thermally connected to the heating element while allowing the refrigerant to flow therethrough. And a sub-flow path that is provided at a position farther from the heating element than the main flow path and through which the refrigerant flows. The refrigerant is provided between the main flow path and the sub-flow path. A communication flow path for allowing flow is provided.

（５）発熱体を冷媒により冷却する液冷システムにおいて、上記発熱体に設けられた液冷装置と、この液冷装置に上記冷媒を送る主流路用ポンプと、上記液冷装置に上記冷媒を送る副流路用ポンプと、上記液冷装置から排出された冷媒を冷却する熱交換器とを備え、上記液冷装置は、上記主流路用ポンプから供給された上記冷媒が通流するとともに上記発熱体に熱的に接続された主流路と、この主流路よりも上記発熱体から離間した位置に設けられ、上記副流路用ポンプから供給された上記冷媒が通流する副流路とを備え、上記主流路と上記副流路との間には上記冷媒を通流させる連通流路が設けられていることを特徴とする。 ( 5 ) In a liquid cooling system for cooling a heating element with a refrigerant, a liquid cooling device provided in the heating element, a main channel pump for sending the refrigerant to the liquid cooling device, and the refrigerant in the liquid cooling device. A sub-flow channel pump to be sent and a heat exchanger for cooling the refrigerant discharged from the liquid cooling device, and the liquid cooling device allows the refrigerant supplied from the main flow channel pump to flow and A main channel thermally connected to the heating element, and a sub channel provided at a position farther from the heating element than the main channel and through which the refrigerant supplied from the sub channel pump flows. And a communication channel for allowing the refrigerant to flow between the main channel and the sub channel.

本発明によれば、発熱体を均一に冷却することができるため、発熱体の電気的特性及び機械的信頼性等を向上させると同時に、少ない冷媒流量で高い冷却特性が得られるため冷却に消費されるエネルギの低減を図ることが可能となる。   According to the present invention, since the heating element can be uniformly cooled, the electrical characteristics and mechanical reliability of the heating element are improved, and at the same time, high cooling characteristics can be obtained with a small refrigerant flow rate. Energy can be reduced.

パワー素子（発熱体）Ｐを冷媒Ｌにより冷却する液冷装置において、冷媒Ｌが通流するとともにパワー素子Ｐに熱的に接続された主流路と、この主流路よりもパワー素子Ｐから離間した位置に設けられ、冷媒Ｌが通流する副流路とを備え、主流路と副流路との間には冷媒Ｌを通流させる連通流路が設けられている。   In the liquid cooling device that cools the power element (heating element) P with the refrigerant L, the main flow path through which the refrigerant L flows and is thermally connected to the power element P is further separated from the power element P than the main flow path. And a sub-flow path through which the refrigerant L flows, and a communication flow path through which the refrigerant L flows is provided between the main flow path and the sub-flow path.

図１は本発明の第１の実施の形態に係る液冷システム１００を示す図である。液冷システム１００は、液相の冷媒Ｌを貯溜する冷媒溜１０１と、この冷媒溜１０１に配管１０２を介して接続され冷媒Ｌを送り出すポンプ１０３と、このポンプ１０３及び冷媒溜１０１にそれぞれ配管１０４，１０５を介して接続された流量調整装置１０６と、この流量調整装置１０６に配管１０７を介して接続された分岐装置１０８と、この分岐装置１０８と主流路配管１０９と副流路配管１１０とを介して接続された液冷装置２００と、この液冷装置２００に配管１１１を介して接続された熱交換器１１２と、この熱交換器１１２と冷媒溜１０１とを接続する配管１１３とを備えている。なお、冷媒溜１０１には圧力調整装置１１４が設けられている。   FIG. 1 is a diagram showing a liquid cooling system 100 according to a first embodiment of the present invention. The liquid cooling system 100 includes a refrigerant reservoir 101 that stores a liquid-phase refrigerant L, a pump 103 that is connected to the refrigerant reservoir 101 via a pipe 102 and sends out the refrigerant L, and a pipe 104 that is connected to the pump 103 and the refrigerant reservoir 101, respectively. , 105, a flow control device 106 connected through the flow control device 106, a branch device 108 connected to the flow control device 106 through a pipe 107, and the branch device 108, the main flow pipe 109 and the sub flow pipe 110. A liquid cooling apparatus 200 connected via the pipe, a heat exchanger 112 connected to the liquid cooling apparatus 200 via a pipe 111, and a pipe 113 connecting the heat exchanger 112 and the refrigerant reservoir 101. Yes. The refrigerant reservoir 101 is provided with a pressure adjusting device 114.

流量調整装置１０６は、所定の流量の冷媒Ｌが液冷装置２００に供給されるように調整する機能を有しており、流量センサ（不図示）からの検出値に基づいて流路をバルブで絞る、又は、ポンプ１０３ヘの電カの供給を制御する。なお、ポンプ１０３の安定した運転に適した領域よりも流量を低くするときには冷媒溜１０１に一部の冷媒Ｌを戻すようにしている。分岐装置１０８は、バルブや絞り機構等により構成されている。   The flow rate adjusting device 106 has a function of adjusting the refrigerant L at a predetermined flow rate so as to be supplied to the liquid cooling device 200, and the flow path is configured by a valve based on a detection value from a flow rate sensor (not shown). The power supply to the pump 103 is controlled. A part of the refrigerant L is returned to the refrigerant reservoir 101 when the flow rate is made lower than the region suitable for stable operation of the pump 103. The branch device 108 includes a valve, a throttle mechanism, and the like.

液冷装置２００は、図２に示すように、筐体２０１と、この筐体２０１に設けられ、冷媒Ｌが通流する主流路２１０と、この主流路２１０に隔壁２２０により隔てられて設けられた副流路２３０とを備えている。隔壁２２０の材質は、副流路２３０内の液相の冷媒Ｌが主流路２１０内の液体冷媒との熱交換により温度上昇しないように、例えばＳＵＳ３０４のように銅よりも熱伝導性の低い金属や耐熱プラスチック等が望ましい。   As shown in FIG. 2, the liquid cooling device 200 is provided in a casing 201, a main channel 210 provided in the casing 201, through which the refrigerant L flows, and the main channel 210 separated by a partition wall 220. And a secondary flow path 230. The material of the partition 220 is a metal having a lower thermal conductivity than copper, such as SUS304, so that the liquid-phase refrigerant L in the sub-channel 230 does not rise in temperature due to heat exchange with the liquid refrigerant in the main channel 210. Or heat-resistant plastic is desirable.

筐体２０１の主流路２１０側の外壁には、パワー素子（発熱体）Ｐを搭載した基板Ｓが取付けられている。主流路２１０は前述した主流路配管１０９に接続され、副流路２３０は前述した副流路配管１１０に接続されている。隔壁２２０には、主流路２１０と副流路２３０とを連通する連通流路２２１が設けられている。   A substrate S on which a power element (heating element) P is mounted is attached to the outer wall of the housing 201 on the main flow path 210 side. The main flow path 210 is connected to the main flow path pipe 109 described above, and the sub flow path 230 is connected to the sub flow path pipe 110 described above. The partition wall 220 is provided with a communication channel 221 that communicates the main channel 210 and the sub-channel 230.

このように構成された液冷システム１００においては、次のようにしてパワー素子Ｐの冷却が行われる。すなわち、冷媒溜１０１内の液相の冷媒Ｌはポンプ１０３によって汲み上げられ、流量調整装置１０６内に導入される。流量調整装置１０６では冷媒Ｌの流量が調整され、過剰分の冷媒Ｌが配管１０５を介して冷媒溜１０１内に戻される。さらに、所定の流量の冷媒Ｌは分岐装置１０８に導入され、分岐装置１０８では所定の割合で主流路２１０と副流路２３０に冷媒Ｌを分流して液冷装置２００に供給する。   In the liquid cooling system 100 configured as described above, the power element P is cooled as follows. That is, the liquid-phase refrigerant L in the refrigerant reservoir 101 is pumped up by the pump 103 and introduced into the flow rate adjusting device 106. In the flow rate adjusting device 106, the flow rate of the refrigerant L is adjusted, and an excessive amount of the refrigerant L is returned into the refrigerant reservoir 101 through the pipe 105. Further, the refrigerant L having a predetermined flow rate is introduced into the branching device 108, and the branching device 108 divides the refrigerant L into the main flow path 210 and the sub flow path 230 at a predetermined ratio and supplies the refrigerant L to the liquid cooling apparatus 200.

液冷装置２００に供給された冷媒Ｌは後述するようにして、パワー素子Ｐにより加熱され、液冷装置２００から排出される。液冷装置２００から排出された冷媒Ｌは熱交換器１１２にて所定温度まで冷却され、冷媒溜１０１に戻される。   The refrigerant L supplied to the liquid cooling apparatus 200 is heated by the power element P and discharged from the liquid cooling apparatus 200 as described later. The refrigerant L discharged from the liquid cooling device 200 is cooled to a predetermined temperature by the heat exchanger 112 and returned to the refrigerant reservoir 101.

ここで、液冷装置２００における熱移動について説明する。パワー素子Ｐからの熱は基板Ｓを経由して主流路２１０内を流れる冷媒Ｌに放熱される。一方、副流路２３０内に供給された冷媒Ｌは、連通流路２２１を介して主流路２１０内に流入する。隔壁２２０の下流側に連通流路２２１が配置されていることから、主流路２１０内の冷媒Ｌは下流においても温度上昇が抑えられ、さらに伝熱面Ｈに向かって副流路２３０冷媒Ｌが噴出されることにより温度境界層を薄くして熱伝達率を向上させることが可能となる。この結果、複数のパワー素子Ｐを均一に冷却することができる。   Here, heat transfer in the liquid cooling apparatus 200 will be described. Heat from the power element P is radiated to the refrigerant L flowing through the main flow path 210 via the substrate S. On the other hand, the refrigerant L supplied into the sub-channel 230 flows into the main channel 210 via the communication channel 221. Since the communication flow path 221 is disposed on the downstream side of the partition wall 220, the temperature of the refrigerant L in the main flow path 210 is suppressed from rising even downstream, and the sub flow path 230 refrigerant L is further directed toward the heat transfer surface H. By ejecting, the temperature boundary layer can be thinned to improve the heat transfer coefficient. As a result, the plurality of power elements P can be uniformly cooled.

上述したように、本第１の実施の形態に係る液冷システム１００によれば、パワー素子Ｐ等の発熱体を均一に冷却することができるため、パワー素子Ｐの電気的特性及び機械的信頼性等を向上させると同時に、少ない冷媒流量で高い冷却特性が得られるため冷却に消費されるエネルギの低減を図ることが可能となる。   As described above, according to the liquid cooling system 100 according to the first embodiment, since the heating element such as the power element P can be cooled uniformly, the electrical characteristics and mechanical reliability of the power element P can be reduced. At the same time, it is possible to reduce the energy consumed for cooling because high cooling characteristics can be obtained with a small refrigerant flow rate.

したがって、比較的大きな伝熱面Ｈであっても均一に冷却することが可能であり、特に高発熱のパワーデバイス等の冷却に適している。なお、パーソナルコンピュータ等の小型電子機器にも適用可能なのはもちろんである。   Therefore, even a relatively large heat transfer surface H can be uniformly cooled, and is particularly suitable for cooling a power device having a high heat generation. Of course, the present invention can also be applied to small electronic devices such as personal computers.

なお、分岐装置１０８と流量調整装置１０６とは一体の装置としてポンプ１０３の下流に配置するようにしてもよい。   The branching device 108 and the flow rate adjusting device 106 may be disposed downstream of the pump 103 as an integrated device.

図３は液冷装置２００において沸騰冷却を行う場合を示す縦断面図である。パワー素子Ｐの発熱量がより大きい場合、あるいは冷媒Ｌの流量が少ない場合には、沸騰現象を利用した液冷装置として作動する。すなわち、沸騰は冷媒が液相から気相へ相変化する現象であり、非常に高い熱伝達性能を得ることができる。   FIG. 3 is a longitudinal sectional view showing a case where boiling cooling is performed in the liquid cooling apparatus 200. When the heat generation amount of the power element P is larger, or when the flow rate of the refrigerant L is small, it operates as a liquid cooling device utilizing the boiling phenomenon. In other words, boiling is a phenomenon in which the refrigerant undergoes a phase change from the liquid phase to the gas phase, and extremely high heat transfer performance can be obtained.

例えば、冷媒Ｌとしてフロロカーボンを使用する場合、強制対流による典型的な熱伝達率が２００〜２０００Ｗ／（ｍ２Ｋ）であるのに対して、沸騰においては２０００〜６０００Ｗ／（ｍ２Ｋ）といった高い熱伝達率が得られる（香山晋監訳，マイクロエレクトロニクスパッケージングハンドブック，日経ＢＰ社，１９９１，ｐ．１３８）。さらに、平滑面による水の沸騰熱伝達において熱伝達率は１０万Ｗ／（ｍ２Ｋ）以上に達し、通常の強制対流熱伝達に対して桁違いの熱伝達性能が期待できる。また、熱の輸送は潜熱により行われるため顕熱に比較して非常に高い熱輸送性能が得られ、冷媒流量を小さくすることができる。 For example, when using a fluorocarbon as a refrigerant L, whereas a typical heat transfer rate by forced convection is 200~2000W / (m 2 K), in boiling such 2000~6000W / (m 2 K) A high heat transfer coefficient can be obtained (translated by Kayama Kaoru, Microelectronics Packaging Handbook, Nikkei Business Publications, 1991, p.138). Furthermore, in the boiling heat transfer of water by a smooth surface, the heat transfer coefficient reaches 100,000 W / (m 2 K) or more, and an order of magnitude heat transfer performance can be expected for normal forced convection heat transfer. Moreover, since heat is transported by latent heat, a very high heat transport performance can be obtained compared to sensible heat, and the refrigerant flow rate can be reduced.

したがって、沸騰現象の利用は、省エネルギ及び機器の小型化に極めて有効である。しかるに、冷媒Ｌとして水を使用する場合には、大気圧での沸点は１００℃となるため半導体素子の温度は通常のＳｉを用いた半導体素子の許容温度よりも高くなることが多く、ＳｉＣ等、高温動作が可能な半導体素子の冷却に適している。   Therefore, the use of the boiling phenomenon is extremely effective for energy saving and equipment miniaturization. However, when water is used as the refrigerant L, the boiling point at atmospheric pressure is 100 ° C., so the temperature of the semiconductor element is often higher than the allowable temperature of a semiconductor element using ordinary Si, such as SiC. It is suitable for cooling a semiconductor element capable of operating at a high temperature.

例えば、ＳｉＣ素子を用いてモジュールを構成し、水をほぼ大気圧で沸騰させることにより冷却を行なうと、液冷装置の下流において約１００℃の高温の水を得られる。環境温度との差が大きい冷媒が排出されるほど排熱利用には適しており、液冷装置という範囲での省エネルギにとどまらず、半導体素子が損失するエネルギの回収ということでもＳｉＣ素子と水の沸騰という組合せは優れている。   For example, when a module is formed using SiC elements and cooling is performed by boiling water at approximately atmospheric pressure, high-temperature water of about 100 ° C. can be obtained downstream of the liquid cooling device. The more the refrigerant with a large difference from the ambient temperature is discharged, the more suitable it is for exhaust heat utilization. It is not only energy saving in the range of liquid cooling devices, but also the recovery of energy lost by semiconductor elements, SiC elements and water. The combination of boiling is excellent.

一方、冷媒の沸騰熱伝達を用いる場合には、主流路２１０内で冷媒Ｌの蒸気泡Ｍが発生する。蒸気泡Ｍは下流にいくにつれて他の蒸気泡Ｍと合体し、大きな蒸気泡Ｍとなる。やがて主流路２１０内で蒸気充満状態となり、伝熱面Ｈが液相の冷媒Ｌで濡れていない状態となる。このような状態においては、放熱が阻害され、バーンアウト現象に陥る危険がある。バーンアウト現象が発生すると伝熱面温度は急激に上昇して１０００℃以上に達することもあり、機器の損傷は避け難い。したがって、バーンアウト現象は機器の信頼性と安全の上から回避する必要がある。   On the other hand, when the boiling heat transfer of the refrigerant is used, the vapor bubbles M of the refrigerant L are generated in the main flow path 210. The vapor bubble M merges with other vapor bubbles M as it goes downstream, and becomes a large vapor bubble M. Eventually, the main flow path 210 becomes full of steam, and the heat transfer surface H is not wetted by the liquid-phase refrigerant L. In such a state, heat dissipation is hindered and there is a risk of falling into a burnout phenomenon. When the burnout phenomenon occurs, the heat transfer surface temperature rapidly rises and may reach 1000 ° C. or higher, and it is difficult to avoid damage to the equipment. Therefore, it is necessary to avoid the burnout phenomenon from the viewpoint of reliability and safety of the equipment.

液冷装置２００によれば、副流路２３０から主流路２１０に過冷状態の冷媒Ｌを合体した蒸気泡Ｍに注入することにより、蒸気泡Ｍを凝縮崩壊させることが可能であり、バーンアウト現象を回避することができる。また過冷度の小さくなっている冷媒Ｌの主流路２１０の下流側に過冷度の大きい冷媒Ｌを供給することにより主流路２１０内の冷媒Ｌの過冷度をほぼ均一に制御することが可能となり、その結果、複数の素子をほぼ均一に冷却することが可能となる。   According to the liquid cooling device 200, the vapor bubble M can be condensed and collapsed by injecting the supercooled refrigerant L from the sub-flow channel 230 into the main flow channel 210 into the vapor bubble M. The phenomenon can be avoided. In addition, the supercooling degree of the refrigerant L in the main channel 210 can be controlled almost uniformly by supplying the refrigerant L having a high degree of supercooling to the downstream side of the main channel 210 of the refrigerant L having a low degree of supercooling. As a result, a plurality of elements can be cooled almost uniformly.

図４は上述した液冷装置２００の第１変形例を示す縦断面図である。なお、この図において図２と同一機能部分には同一符号を付し、その詳細な説明は省略する。   FIG. 4 is a longitudinal sectional view showing a first modification of the liquid cooling apparatus 200 described above. In this figure, the same functional parts as those in FIG. 2 are denoted by the same reference numerals, and detailed description thereof is omitted.

本変形例においては、連通流路２２１の分布が図２のものとは異なっている。すなわち、主流路２１０の上流から下流にいくにしたがい、連通流路２２１の設置密度が増えている。この構成により主流路２１０内の冷媒Ｌの温度をきめ細かく制御することができ、複数のパワー素子Ｐをより均一な温度に冷却することができる。   In this modification, the distribution of the communication channel 221 is different from that in FIG. That is, the installation density of the communication flow path 221 increases as it goes from the upstream to the downstream of the main flow path 210. With this configuration, the temperature of the refrigerant L in the main channel 210 can be finely controlled, and the plurality of power elements P can be cooled to a more uniform temperature.

なお、設置密度を増やす代わりに、主流路２１０の上流から下流にいくにしたがい、連通流路２２１の内径を拡大するようにしてもよい。   Instead of increasing the installation density, the inner diameter of the communication channel 221 may be increased as the main channel 210 moves from the upstream to the downstream.

図５は上述した液冷装置２００の第２変形例を示す縦断面図である。なお、この図において図２と同一機能部分には同一符号を付し、その詳細な説明は省略する。本変形例においては、主流路２１０と副流路２３０で冷媒Ｌの流れる向きが対向している。すなわち、隔壁２２０に熱伝導性の低い材料を用いても熱を完全に遮ることはできないため、主流路２１０と副流路２３０の流れが同じ方向であるよりも、本変形例のように逆方向に対向して流れているほうが、主流路２１０の下流に供給される液相の冷媒Ｌの過冷度を大きくすることができ、液相の冷媒Ｌの注入による蒸気泡Ｍの凝縮崩壊をより効果的に行なうことができる。   FIG. 5 is a longitudinal sectional view showing a second modification of the liquid cooling apparatus 200 described above. In this figure, the same functional parts as those in FIG. 2 are denoted by the same reference numerals, and detailed description thereof is omitted. In this modification, the main flow path 210 and the sub flow path 230 face each other in the direction in which the refrigerant L flows. That is, even if a material having low thermal conductivity is used for the partition wall 220, heat cannot be completely blocked. Therefore, the flow in the main flow path 210 and the sub flow path 230 are reversed in the same direction as in this modification. Flowing in the opposite direction can increase the degree of supercooling of the liquid-phase refrigerant L supplied downstream of the main flow path 210, and condenses and collapses the vapor bubbles M due to the injection of the liquid-phase refrigerant L. This can be done more effectively.

図６は上述した液冷装置２００の第３変形例を示す縦断面図である。なお、この図において図２と同一機能部分には同一符号を付し、その詳細な説明は省略する。本変形例においては、主流路２１０中に副流路２３０を挿入し、主流路２１０の両側にパワー素子Ｐを配置することにより、一組の主流路２１０と副流路２３０で２つの伝熱面Ｈを冷却することが可能となる。複数のパワー素子Ｐを搭載したモジュールを２組を冷却する場合において、各モジュールにそれぞれ液冷装置２００を取り付けた場合には、冷媒Ｌの入出力配管の接続箇所が４ケ所となる。一方、本変形例の液冷装置２００においては、液冷装置２００への冷媒Ｌの入出力配管の接続箇所が２箇所となる。このため、入出力配管の接続箇所を減らすことができ、構造上の信頼性を高めることができる。   FIG. 6 is a longitudinal sectional view showing a third modification of the liquid cooling apparatus 200 described above. In this figure, the same functional parts as those in FIG. 2 are denoted by the same reference numerals, and detailed description thereof is omitted. In this modification, by inserting the sub-flow channel 230 into the main flow channel 210 and disposing the power element P on both sides of the main flow channel 210, two sets of the main flow channel 210 and the sub-flow channel 230 can transfer two heat transfers. It becomes possible to cool the surface H. In the case of cooling two sets of modules each equipped with a plurality of power elements P, when the liquid cooling device 200 is attached to each module, the number of connection points of the input / output piping of the refrigerant L is four. On the other hand, in the liquid cooling device 200 of the present modification, there are two connection points of the input / output piping of the refrigerant L to the liquid cooling device 200. For this reason, the connection location of input-output piping can be reduced, and the structural reliability can be improved.

図７は本発明の第２の実施の形態に係る液冷システム１００に組み込まれた液冷装置３００を示す横断面図、図８は縦断面図である。   FIG. 7 is a transverse sectional view showing a liquid cooling apparatus 300 incorporated in the liquid cooling system 100 according to the second embodiment of the present invention, and FIG. 8 is a longitudinal sectional view.

液冷装置３００は、筐体３０１と、この筐体３０１に設けられ、冷媒Ｌが通流する主流路３１０と、この主流路３１０に隔壁３２０により隔てられて設けられた副流路３３０とを備えている。   The liquid cooling device 300 includes a housing 301, a main flow channel 310 provided in the housing 301 through which the refrigerant L flows, and a sub flow channel 330 provided in the main flow channel 310 separated by a partition wall 320. I have.

筐体３０１の主流路３１０側の外壁には、パワー素子（発熱体）Ｐを搭載した基板Ｓが取付けられている。なお、図８中３０２は蓋体を示している。主流路３１０は前述した主流路配管１０９に接続され、副流路３３０は前述した副流路配管１１０に接続されている。   A substrate S on which a power element (heating element) P is mounted is attached to the outer wall of the housing 301 on the main flow path 310 side. In FIG. 8, reference numeral 302 denotes a lid. The main flow path 310 is connected to the main flow path pipe 109 described above, and the sub flow path 330 is connected to the sub flow path piping 110 described above.

主流路３１０内の最上流側に孔部３１１が配置されるとともに、後述するノズル３２１の上流側に気泡破砕部材３１２が設けられている。気泡破砕部材３１２は後述するように気泡破砕部材を有している。気泡破砕部材３１２は、主流路３１０の伝熱面Ｈから突設された第１の板群３１３と、隔壁３２２側の対向面Ｆから突設された第２の板群３１４とから構成されている。第１の板群３１３と第２の板群３１４は冷媒Ｌの流れに対して異なる角度を持って取り付けられている。隔壁３２０には、主流路３１０と副流路３３０とを連通するノズル（連通流路）３２１が設けられている。   A hole 311 is arranged on the most upstream side in the main flow path 310, and a bubble crushing member 312 is provided on the upstream side of a nozzle 321 described later. The bubble crushing member 312 has a bubble crushing member as will be described later. The bubble crushing member 312 includes a first plate group 313 projecting from the heat transfer surface H of the main flow path 310 and a second plate group 314 projecting from the facing surface F on the partition wall 322 side. Yes. The first plate group 313 and the second plate group 314 are attached with different angles with respect to the flow of the refrigerant L. The partition 320 is provided with a nozzle (communication channel) 321 that communicates the main channel 310 and the sub-channel 330.

このように構成された液冷装置３００によれば、上述した液冷装置２００と同様にしてパワー素子Ｐで発生した熱が主流路３１０内を通流する冷媒Ｌに伝達され、冷媒Ｌは伝熱面Ｈで沸騰し、蒸気泡Ｍを発生する。過冷状態の冷媒Ｌは副流路３３０によりノズル位置３２１まで供給される。   According to the liquid cooling apparatus 300 configured as described above, the heat generated in the power element P is transmitted to the refrigerant L flowing through the main flow path 310 in the same manner as the liquid cooling apparatus 200 described above, and the refrigerant L is transmitted. Boils on the hot surface H and generates a vapor bubble M. The supercooled refrigerant L is supplied to the nozzle position 321 through the sub-channel 330.

蒸気泡Ｍは気泡破砕部材３１２に導入され、第１の板群３１３と第２の板群３１４の隙間よりも寸法が大きくなると分断される。第１の板群３１３と第２の板群３１４の隙間の流路は、下流側へ次第に幅が広がる流路３１５と、下流側へ次第に幅が狭まる流路３１６とが隣り合っているため、分断された蒸気泡Ｍが気泡破砕部材３１２を抜け出したときには隣接する流路間の出口の流速の差により流れ方向の蒸気泡Ｍの位置がずれる。このため、下流で広がる流路３１５では蒸気泡Ｍが第１の板群３１３と第２の板群３１４から離れやすくなり、気泡破砕部材３１２入口で分断された蒸気泡Ｍが気泡破砕部材３１２出口で合体しにくくなる。すなわち、大型の蒸気泡Ｍが形成されてにくい。さらに、気泡破砕部材３１２の下流側には過冷状態の冷媒Ｌがノズル３２１から供給されるため、破砕されて表面積が大きくなった蒸気泡Ｍと過冷状態の冷媒Ｌが混合し、蒸気泡Ｍが消滅あるいは減容する。このため、バーンアウト現象の発生を抑制することが可能となる。   The vapor bubble M is introduced into the bubble crushing member 312 and is divided when the dimension becomes larger than the gap between the first plate group 313 and the second plate group 314. Since the flow path in the gap between the first plate group 313 and the second plate group 314 is adjacent to the flow path 315 gradually widening to the downstream side and the flow path 316 gradually narrowing to the downstream side, When the divided vapor bubbles M exit the bubble crushing member 312, the position of the vapor bubbles M in the flow direction is shifted due to the difference in the flow velocity at the outlet between the adjacent flow paths. For this reason, in the flow path 315 spreading downstream, the vapor bubbles M are easily separated from the first plate group 313 and the second plate group 314, and the vapor bubbles M divided at the inlet of the bubble crushing member 312 are discharged from the bubble crushing member 312. It becomes difficult to unite. That is, it is difficult to form a large steam bubble M. Further, since the supercooled refrigerant L is supplied from the nozzle 321 to the downstream side of the bubble crushing member 312, the vapor bubbles M that are crushed and have a large surface area are mixed with the supercooled refrigerant L, and the vapor bubbles are mixed. M disappears or is reduced in volume. For this reason, it is possible to suppress the occurrence of the burnout phenomenon.

なお、気泡破砕部材３１２の形成方法としては、伝熱面Ｈと対向面Ｆそれぞれに同一の方向を持つ板群を設ければよく、切削等の機械加工や複数の板を並べて蝋付やカシメにより取り付けるときには、片方の面に角度の異なる板を交互に取り付けるよりも製造が容易になる。また、金属材料を用いたダイカストや鋳造あるいは樹脂の射出成型など、金型に材料を流し込む方法で製作してもよいし、伝熱面Ｈあるいは対向面Ｆのいずれかに向きの異なる板をすべてまとめて取り付けてもよい。さらに、枠で板群を保持した構造物を主流路３１０内に挿入する形式でもよい。   As a method for forming the bubble crushing member 312, a plate group having the same direction may be provided on each of the heat transfer surface H and the opposing surface F, and machining such as cutting or a plurality of plates are arranged and brazed or caulked. When mounting by the method, manufacturing is easier than mounting plates with different angles alternately on one side. Moreover, it may be manufactured by a method in which a material is poured into a mold, such as die casting using metal material, casting, or resin injection molding, or all plates having different orientations on either the heat transfer surface H or the opposing surface F are used. They may be attached together. Further, a structure in which a structure holding a plate group with a frame is inserted into the main flow path 310 may be used.

切削による加工では、例えばＣ１１００のような熱伝導性の高い銅材料を採用できるものは製造コストが高く、鋳造あるいはダイカストに適した材料は熱伝導性が低くなる。このため、製造方法と板を伝熱面Ｈに付けるか対向面Ｆに取り付けるか、あるいは伝熱面Ｈと対向面Ｆのどちらに取り付けるかは、要求される放熱性能とコスト、信頼性に依存する。例えば対向面Ｆ側を樹脂製とし、気泡破砕部材を対向面Ｆと一体に樹脂の射出成型で製造すればコストは低いが金属材料よりも信頼性は低下し、対向面Ｆは主要な放熱経路とはならないものの放熱性能も低下する。   In the processing by cutting, for example, a material that can adopt a copper material having high thermal conductivity such as C1100 has a high manufacturing cost, and a material suitable for casting or die casting has low thermal conductivity. For this reason, whether the manufacturing method and the plate are attached to the heat transfer surface H, the attachment surface F, or the heat transfer surface H or the attachment surface F depends on the required heat radiation performance, cost, and reliability. To do. For example, if the opposing surface F side is made of resin and the bubble crushing member is manufactured by injection molding of resin integrally with the opposing surface F, the cost is low but the reliability is lower than that of a metal material. Although this is not the case, the heat dissipation performance is also reduced.

図９は上述した液冷装置３００の第１変形例を示す横断面図、図１０は縦断面図である。なお、これらの図において図７及び図８と同一機能部分には同一符号を付し、その詳細な説明は省略する。本変形例における気泡破砕部材３１２では、第１の板群３１３と第２の板群３１４を構成する板が途中で折曲している。直線的な形状では板間隔と気泡破砕部材３１２の流れ方向の長さは独立した設計パラメータとして扱うことができないが、曲線にすることにより、これらのパラメータを独立して自由に変更することができる。例えば、熱流束が高い場合には蒸気泡Ｍの寸法が大きくなる傾向にあるが、冷媒Ｌの流速が大きい場合にも蒸気泡Ｍが流れ方向に伸びた扁平形状になるため、気泡破砕部材３１２の主流方向の長さＬをある程度長くしなければならない。   FIG. 9 is a transverse sectional view showing a first modification of the liquid cooling apparatus 300 described above, and FIG. 10 is a longitudinal sectional view. In these drawings, the same functional parts as those in FIGS. 7 and 8 are denoted by the same reference numerals, and detailed description thereof is omitted. In the bubble crushing member 312 in this modification, the plates constituting the first plate group 313 and the second plate group 314 are bent halfway. In the linear shape, the plate interval and the length of the bubble crushing member 312 in the flow direction cannot be handled as independent design parameters. However, by making a curve, these parameters can be freely changed independently. . For example, when the heat flux is high, the size of the vapor bubble M tends to increase, but even when the flow rate of the refrigerant L is large, the vapor bubble M has a flat shape extending in the flow direction, and thus the bubble crushing member 312. The length L in the mainstream direction must be increased to some extent.

図１１は液冷装置３００に組み込まれた平行フィンの要部を示す模式図である。本変形例における気泡破砕部材３１２では、第１の板群３１３と第２の板群３１４を構成する板が互いに平行に配置され、第１の板群３１３の図中下側の面は凹凸が形成されており、第２の板群３１４の図中上側の面は凹凸が形成されている。   FIG. 11 is a schematic diagram showing the main part of the parallel fins incorporated in the liquid cooling apparatus 300. FIG. In the bubble crushing member 312 in this modification, the plates constituting the first plate group 313 and the second plate group 314 are arranged in parallel to each other, and the lower surface of the first plate group 313 is uneven. The upper surface of the second plate group 314 in the drawing is uneven.

このため、板により仕切られた隣り合う流路３１５，３１６間の流体抵抗は凹凸により差異が生じ、冷媒Ｌの流速に差が発生する。このため、蒸気泡Ｍが気泡破砕部材３１２により分断された後、気泡破砕部材３１２の出口側に蒸気泡Ｍが排出される時間がずれるため、蒸気泡Ｍが再合体しにくい。   For this reason, the fluid resistance between the adjacent flow paths 315 and 316 partitioned by the plate is different due to the unevenness, and the flow rate of the refrigerant L is different. For this reason, after the vapor bubbles M are separated by the bubble crushing member 312, the time for the vapor bubbles M to be discharged to the outlet side of the bubble crushing member 312 shifts, so that the vapor bubbles M are unlikely to rejoin.

図１２は上述した液冷装置３００の第２変形例を示す横断面図、図１３は図１２における１２Ａ−１２Ａ線で切断して矢印方向に見た縦断面図、図１４は図１２における１２Ｂ−１２Ｂ線で切断して矢印方向に見た縦断面図である。なお、これらの図において図７及び図８と同一機能部分には同一符号を付し、その詳細な説明は省略する。   12 is a transverse sectional view showing a second modification of the liquid cooling apparatus 300 described above, FIG. 13 is a longitudinal sectional view taken along the line 12A-12A in FIG. 12 and viewed in the direction of the arrow, and FIG. 14 is 12B in FIG. It is the longitudinal cross-sectional view cut | disconnected by the -12B line and looked at the arrow direction. In these drawings, the same functional parts as those in FIGS. 7 and 8 are denoted by the same reference numerals, and detailed description thereof is omitted.

主流路３１０内には気泡破砕部材３４０が形成されている。気泡破砕部材３４０は、主流路３１０の流路高さの約半分の高さをもつ突起群３４１と、対向面Ｆに設けられた同様な突起群３４２とを備えている。気泡破砕部材３４０の入口側で破砕された蒸気泡Ｍの一部は伝熱面Ｈに近い位置に、残りは対向面Ｆに近い位置に放出される。   A bubble crushing member 340 is formed in the main channel 310. The bubble crushing member 340 includes a projection group 341 having a height that is approximately half the channel height of the main channel 310 and a similar projection group 342 provided on the facing surface F. A part of the steam bubbles M crushed on the inlet side of the bubble crushing member 340 is discharged to a position close to the heat transfer surface H, and the rest is discharged to a position close to the facing surface F.

一方、ノズル３２１から過冷状態の冷媒Ｌが噴き出すが、気泡破砕部材３４０の出口で対向面Ｆの近くに吐き出された蒸気泡Ｍは対向面Ｆから同じ高さに吐き出される他の蒸気泡Ｍとの間の隙間に冷媒Ｌが噴出されることになるため、他の気泡と合体しにくくなる。このため、バーンアウト現象の発生を抑制することが可能となる。   On the other hand, although the supercooled refrigerant L is ejected from the nozzle 321, the vapor bubble M discharged near the opposing surface F at the outlet of the bubble crushing member 340 is another vapor bubble M discharged from the opposing surface F to the same height. Since the refrigerant L is ejected into the gap between the two, it is difficult to unite with other bubbles. For this reason, it is possible to suppress the occurrence of the burnout phenomenon.

なお、ノズル３２１は、突起群３４２の下流に配置しても良いし、突起群３４２の伝熱面Ｈに近い位置や、突起群３４２の側面に配置しても良い。   The nozzle 321 may be disposed downstream of the projection group 342, or may be disposed at a position near the heat transfer surface H of the projection group 342 or on the side surface of the projection group 342.

図１５は上述した液冷装置３００の第３変形例の原理を示す説明図、図１６は図１５における１５Ａ−１５Ａ線で切断して矢印方向に見た断面図、図１７は図１５における１５Ｂ−１５Ｂ線で切断して矢印方向に見た断面図である。   15 is an explanatory view showing the principle of the third modification of the liquid cooling apparatus 300 described above, FIG. 16 is a sectional view taken along the line 15A-15A in FIG. 15 and viewed in the direction of the arrow, and FIG. It is sectional drawing cut | disconnected by the -15B line | wire and seeing in the arrow direction.

本変形例では気泡破砕部材３５０が設けられている。気泡破砕部材３５０は、複数の管状部材３５１〜３５３とを備えている。気泡破砕部材３５０に導入された蒸気泡Ｍは、入口で破砕される。これら分離された蒸気泡Ｍは気泡破砕部材３５０の出口では、冷媒Ｌの通流方向に直交する断面において、入口とは異なる位置に排出される。このため、蒸気泡Ｍが再合体にしにくい。なお、管状部材３５１〜３５３の長さを異ならせる、内壁面に凹凸を形成する等してさらに蒸気泡Ｍの再合体を確実に防止するようにしてもよい。   In this modification, a bubble crushing member 350 is provided. The bubble crushing member 350 includes a plurality of tubular members 351 to 353. The vapor bubble M introduced into the bubble crushing member 350 is crushed at the inlet. The separated vapor bubbles M are discharged from the outlet of the bubble crushing member 350 to a position different from the inlet in a cross section orthogonal to the flow direction of the refrigerant L. For this reason, it is difficult for the vapor bubbles M to be reunited. In addition, you may make it prevent the recombination of the vapor bubble M reliably by making the length of the tubular members 351-353 different, forming an unevenness | corrugation in an inner wall surface, etc.

図１８は上述した液冷装置３００の第４変形例を示す図であって、図１９における１９Ａ−１９Ａ線で切断して矢印方向に見た断面図、図１９は図１８における１８Ａ−１８Ａ線で切断して矢印方向に見た断面図である。なお、これらの図において図７及び図８と同一機能部分には同一符号を付し、その詳細な説明は省略する。   18 is a view showing a fourth modification of the liquid cooling device 300 described above, which is a cross-sectional view taken along the line 19A-19A in FIG. 19 and viewed in the direction of the arrow, and FIG. 19 is a line 18A-18A in FIG. It is sectional drawing cut | disconnected by and seen in the arrow direction. In these drawings, the same functional parts as those in FIGS. 7 and 8 are denoted by the same reference numerals, and detailed description thereof is omitted.

気泡破砕部材３６０は、伝熱面Ｈに設けられた第１の板群３６１と対向面Ｆに設けられた第２の板群３６２とを備えている。第１の板群３６１及び第２の板群３６２はいずれも主流路３１０の流路高さの約半分の高さを有し、冷媒Ｌの通流方向に対する傾斜角度が異なって取り付けられている。主流路３１０は板群の傾斜に沿って、気泡破砕部材３６０の下流側で主流路３１０の上半分と下半分で異なる方向に曲げられている。気泡破砕部材３６０の下流には副流路３３０から主流路３１０に冷媒Ｌを供給するためのノズル３２１が設けられている。   The bubble crushing member 360 includes a first plate group 361 provided on the heat transfer surface H and a second plate group 362 provided on the facing surface F. Each of the first plate group 361 and the second plate group 362 has a height that is about half of the flow path height of the main flow path 310, and is attached with different inclination angles with respect to the flow direction of the refrigerant L. . The main channel 310 is bent in different directions in the upper half and the lower half of the main channel 310 on the downstream side of the bubble crushing member 360 along the inclination of the plate group. A nozzle 321 for supplying the refrigerant L from the sub flow path 330 to the main flow path 310 is provided downstream of the bubble crushing member 360.

気泡破砕部材３６０に到達して分割された蒸気泡Ｍの上半分と下半分とは異なる方向へ排出されるため、再び合体しにくい。なお、第１の板群３６１及び第２の板群３６２はほぼ同じ高さであるが、例えば第１の板群３６１の高さを高くして第２の板群３６２の高さを低くしたり、その逆であってもよい。   Since the upper half and the lower half of the vapor bubbles M that have reached the bubble crushing member 360 and are divided are discharged in different directions, it is difficult to unite again. The first plate group 361 and the second plate group 362 have substantially the same height. For example, the height of the first plate group 361 is increased and the height of the second plate group 362 is decreased. Or vice versa.

図２０は上述した液冷装置３００の第５変形例の要部を示す縦断面図、図２１は動作原理を示す説明図である。なお、これらの図において図７及び図８と同一機能部分には同一符号を付し、その詳細な説明は省略する。本変形例では主流路３１０内に気泡破砕部材３７０が突設されている。   FIG. 20 is a longitudinal sectional view showing an essential part of a fifth modification of the liquid cooling apparatus 300 described above, and FIG. 21 is an explanatory view showing the operating principle. In these drawings, the same functional parts as those in FIGS. 7 and 8 are denoted by the same reference numerals, and detailed description thereof is omitted. In the present modification, a bubble crushing member 370 is protruded from the main channel 310.

気泡破砕部材３７０は、対向面Ｆに上流側が細く、下流側が太くなった突起状に形成されている。また、ノズル３２１が気泡破砕部材３７０の下流側端面に設けられている。気泡破砕部材３７０により分断された蒸気泡Ｍは気泡破砕部材３７０の出口で互いに過冷状態の冷媒Ｌにより仕切られるため、蒸気泡Ｍが再合体しにくくなると同時に、蒸気泡Ｍと冷媒Ｌとの熱交換も促進され、蒸気泡Ｍの消滅あるいは減容を効果的に行なうことができる。   The bubble crushing member 370 is formed in a protruding shape in which the upstream side is thin on the facing surface F and the downstream side is thick. A nozzle 321 is provided on the downstream end face of the bubble crushing member 370. Since the vapor bubbles M divided by the bubble crushing member 370 are separated from each other by the supercooled refrigerant L at the outlet of the bubble crushing member 370, the vapor bubbles M are difficult to recombine and at the same time, Heat exchange is also promoted, and the vapor bubbles M can be effectively eliminated or reduced in volume.

図２２は上述した液冷装置３００の第６変形例の要部を示す横断面図、図２３は要部を示す縦断面図である。これらの図において、図７及び図８と同一機能部分には同一符号を付し、その詳細な説明は省略する。   FIG. 22 is a cross-sectional view showing the main part of a sixth modification of the liquid cooling apparatus 300 described above, and FIG. 23 is a vertical cross-sectional view showing the main part. In these drawings, the same functional parts as those in FIGS. 7 and 8 are denoted by the same reference numerals, and detailed description thereof is omitted.

本変形例では、主流路３１０の一部であって上述した気泡破砕部材３１２の上流側直前に凹部３８０を設け、冷媒Ｌの通流方向に直交する方向の断面積を拡大するようにしている。   In this modification, a recess 380 is provided in part of the main flow path 310 and immediately upstream of the above-described bubble crushing member 312 so as to increase the cross-sectional area in the direction orthogonal to the flow direction of the refrigerant L. .

一般的に、放熱性能を高めるために主流路３１０の流速を大きくし、蒸気泡Ｍが通流方向に伸長し細長形状となった場合には気泡破砕部材３１２による分割数が少なくなる虞がある。このため、気泡破砕部材３１２を通過しても蒸気泡Ｍが比較的大きい状態で残る可能性がある。一方、気泡を小さく分割するためには気泡破砕部材の板間の隙間を小さくしなければならなくなる。これは流体抵抗を上昇させ、また製造も困難となる。   In general, when the flow velocity of the main flow path 310 is increased in order to improve the heat dissipation performance and the vapor bubbles M are elongated in the flow direction and become elongated, the number of divisions by the bubble crushing member 312 may be reduced. . For this reason, even if it passes through the bubble crushing member 312, the vapor bubbles M may remain in a relatively large state. On the other hand, in order to divide the bubbles into small pieces, the gaps between the plates of the bubble crushing member must be reduced. This increases fluid resistance and makes it difficult to manufacture.

本変形例によれば、気泡破砕部材３１２の上流で主流路３１０を流れる冷媒Ｌの流速が低下し、細長形状の蒸気泡Ｍが一旦偏平形状となる。このため、蒸気泡Ｍの分割数を増やすことができるとともに、圧力損失が小さく、かつ、気泡破砕部材３１２も容易に製造が可能となる。   According to this modification, the flow rate of the refrigerant L flowing through the main channel 310 upstream of the bubble crushing member 312 is reduced, and the elongated vapor bubble M once becomes a flat shape. For this reason, the number of divisions of the vapor bubbles M can be increased, the pressure loss is small, and the bubble crushing member 312 can be easily manufactured.

図２４は本発明の第３の実施の形態に係る液冷装置４００の要部を示す平面図、図２５は斜視図である。これらの図において、図２と同一機能部分には同一符号を付し、その詳細な説明は省略する。   FIG. 24 is a plan view showing the main part of a liquid cooling apparatus 400 according to the third embodiment of the present invention, and FIG. 25 is a perspective view. In these drawings, the same functional parts as those in FIG. 2 are denoted by the same reference numerals, and detailed description thereof is omitted.

液冷装置４００は、筐体４０１と、この筐体４０１に設けられ、冷媒Ｌが通流する主流路４１０と、この主流路４１０の両側に隔壁４２０により隔てられて設けられた一対の副流路４３０とを備えている。   The liquid cooling device 400 includes a casing 401, a main flow path 410 that is provided in the casing 401 and through which the refrigerant L flows, and a pair of substreams that are provided on both sides of the main flow path 410 and separated by a partition wall 420. Road 430 is provided.

筐体４０１の主流路４１０側の外壁には、パワー素子（不図示）を搭載した基板Ｓが取付けられている。主流路４１０は前述した主流路配管１０９に接続され、副流路４３０は前述した副流路配管１１０に接続されている。   A substrate S on which a power element (not shown) is mounted is attached to the outer wall of the housing 401 on the main flow path 410 side. The main channel 410 is connected to the main channel pipe 109 described above, and the sub channel 430 is connected to the sub channel pipe 110 described above.

一対の副流路４３０間には管状路４３１が設けられている。管状路４３１には、冷媒Ｌが通流する連通流路４３２が設けられている。   A tubular path 431 is provided between the pair of sub flow paths 430. The tubular channel 431 is provided with a communication channel 432 through which the refrigerant L flows.

このように構成された液冷装置４００によれば、上述した液冷装置２００と同様にしてパワー素子Ｐで発生した熱が主流路４１０内を通流する冷媒Ｌに伝達され、冷媒Ｌは伝熱面Ｈで沸騰し、蒸気泡Ｍを発生する。過冷状態の冷媒Ｌは副流路４３０により管状路４３１を介して連通流路４３２まで供給される。冷媒Ｌが連通流路４３２を通して主流路３１０に噴出する。   According to the liquid cooling apparatus 400 configured as described above, the heat generated in the power element P is transmitted to the refrigerant L flowing through the main flow path 410 in the same manner as the liquid cooling apparatus 200 described above, and the refrigerant L is transmitted. Boils on the hot surface H and generates a vapor bubble M. The supercooled refrigerant L is supplied to the communication channel 432 through the tubular channel 431 by the sub-channel 430. The refrigerant L is ejected to the main flow path 310 through the communication flow path 432.

液冷装置４００によれば、上述した液冷装置２００と同様の効果を得ることができる。また、管状路４３１は図示のとおりほぼ均等に配置されていもよいし、主流路４１０の下流側ほど本数を増やしたり、下流側のみに配置するようにしてもよい。また、必ずしも管状路４３１は流れと直交していなくてもよいし、管状路４３１の断面積や管状路４３１に設けられた連通流路４３２の形状は各連通流路４３２からの噴出量を制御するため場所により変化させてもよい。また、管状路４３１の材質は噴出される冷媒Ｌの温度と主流路４１０内の冷媒Ｌの温度との差ができる限り大きくなるように、熱伝導率の低い材質を用いることが望ましい。副流路４３０に流す冷媒Ｌは伝熱面Ｈ前方にて主流路４１０から分流された冷媒Ｌではなく、主流路４１０に冷媒Ｌを供給するものとは別系統の循環経路による冷媒Ｌを流してもよい。   According to the liquid cooling apparatus 400, the same effect as the liquid cooling apparatus 200 described above can be obtained. Further, the tubular passages 431 may be arranged substantially equally as shown in the figure, or the number of the tubular passages 431 may be increased toward the downstream side of the main flow path 410 or may be arranged only on the downstream side. In addition, the tubular passage 431 does not necessarily have to be orthogonal to the flow, and the cross-sectional area of the tubular passage 431 and the shape of the communication channel 432 provided in the tubular channel 431 control the ejection amount from each communication channel 432. Therefore, it may be changed depending on the place. Moreover, it is desirable to use a material having a low thermal conductivity so that the difference between the temperature of the refrigerant L to be ejected and the temperature of the refrigerant L in the main channel 410 is as large as possible. The refrigerant L flowing through the sub-flow path 430 is not the refrigerant L diverted from the main flow path 410 in front of the heat transfer surface H, but flows through the circulation path of a system different from that supplying the refrigerant L to the main flow path 410. May be.

図２６は上述した液冷装置４００の第１変形例の要部を示す平面図である。この図において、図２４と同一機能部分には同一符号を付し、その詳細な説明は省略する。本変形例では、副流路４３０が主流路４１０の片側にのみ設けられている。なお、管状路４３１の主流路４１０の反対側の壁面付近、すなわち副流路４３０から最も離れた先端部は閉じられていても良いし、連通流路４３２と同様の穴が開けられていてもよい。   FIG. 26 is a plan view showing a main part of a first modification of the liquid cooling apparatus 400 described above. In this figure, the same functional parts as those in FIG. 24 are denoted by the same reference numerals, and detailed description thereof is omitted. In this modification, the sub flow channel 430 is provided only on one side of the main flow channel 410. Note that the vicinity of the wall surface on the opposite side of the main channel 410 of the tubular channel 431, that is, the distal end portion farthest from the sub-channel 430 may be closed, or a hole similar to the communication channel 432 may be formed. Good.

図２７は上述した液冷装置４００の第２変形例の要部を示す斜視図である。この図において、図２４と同一機能部分には同一符号を付し、その詳細な説明は省略する。本変形例においては、管状路４３１の外形が円形となっている。   FIG. 27 is a perspective view showing a main part of a second modification of the liquid cooling apparatus 400 described above. In this figure, the same functional parts as those in FIG. 24 are denoted by the same reference numerals, and detailed description thereof is omitted. In this modification, the outer shape of the tubular path 431 is circular.

図２８は上述した液冷装置の第３変形例の要部を示す斜視図である。この図において、図２４と同一機能部分には同一符号を付し、その詳細な説明は省略する。本変形例においては、管状路４３１の外形が楕円形となっている。このため、主流路４１０内を通流する冷媒Ｌの流体抵抗を軽減できる。   FIG. 28 is a perspective view showing an essential part of a third modification of the liquid cooling apparatus described above. In this figure, the same functional parts as those in FIG. 24 are denoted by the same reference numerals, and detailed description thereof is omitted. In this modification, the outer shape of the tubular path 431 is an ellipse. For this reason, the fluid resistance of the refrigerant L flowing through the main flow path 410 can be reduced.

図２９は上述した液冷装置の第４変形例の要部を示す斜視図である。この図において、図２４と同一機能部分には同一符号を付し、その詳細な説明は省略する。本変形例においては、管状路４３１の外形が楕円形であり、かつ、気泡破砕部材４３３が取付けられている。   FIG. 29 is a perspective view showing a main part of a fourth modification of the liquid cooling apparatus described above. In this figure, the same functional parts as those in FIG. 24 are denoted by the same reference numerals, and detailed description thereof is omitted. In this modification, the outer shape of the tubular path 431 is an ellipse, and the bubble crushing member 433 is attached.

図３０は本発明の第４の実施の形態に係る液冷装置５００の要部を示す縦断面図、図３１は横断面図である。これらの図において、図７及び図８と同一機能部分には同一符号を付し、その詳細な説明は省略する。   FIG. 30 is a longitudinal sectional view showing a main part of a liquid cooling apparatus 500 according to the fourth embodiment of the present invention, and FIG. 31 is a transverse sectional view. In these drawings, the same functional parts as those in FIGS. 7 and 8 are denoted by the same reference numerals, and detailed description thereof is omitted.

液冷装置５００は、筐体５０１と、この筐体５０１に設けられ、冷媒Ｌが通流する主流路５１０と、この主流路５１０の凹部５１１の近傍に配置された羽根車５２０を備えている。筐体５０１の外壁には、パワー素子Ｐを搭載した基板Ｓが取付けられている。主流路５１０は前述した主流路配管１０９に接続されている。   The liquid cooling apparatus 500 includes a housing 501, a main channel 510 provided in the housing 501, through which the refrigerant L flows, and an impeller 520 disposed in the vicinity of the recess 511 of the main channel 510. . A substrate S on which the power element P is mounted is attached to the outer wall of the housing 501. The main flow path 510 is connected to the main flow path pipe 109 described above.

羽根車５２０の回転軸５２１は、主流路５１０の中心から所定だけずれた位置に配置されており、この回転軸５２１の周囲に羽根５２２が取付けられており、羽根５２２の先端が伝熱面Ｈに非常に近い場所を通過するようになっている。なお、回転軸５２１には、モータ等の駆動手段は取付けられていない。   The rotating shaft 521 of the impeller 520 is disposed at a position deviated from the center of the main flow path 510 by a predetermined amount, and the blade 522 is attached around the rotating shaft 521, and the tip of the blade 522 has a heat transfer surface H. It is supposed to pass through a place very close to. Note that a driving means such as a motor is not attached to the rotating shaft 521.

このように構成された液冷装置５００においては、主流路５１０を通流する冷媒Ｌの流れによって羽根車５２０が回転する。羽根車５２０の回転に伴って伝熱面Ｈ近傍の冷媒Ｌが攪拌される。このため、伝熱面Ｈ近傍に形成された温度境界層を破壊し熱伝達を促進することができる。また、沸騰により蒸気泡Ｍが発生している場合には、羽根５２２により蒸気泡Ｗが破砕され、伝熱面Ｈに付着した蒸気泡Ｍが強制的に引き剥がされ、バーンアウト現象の発生を防止することができる。   In the liquid cooling apparatus 500 configured as described above, the impeller 520 is rotated by the flow of the refrigerant L flowing through the main flow path 510. As the impeller 520 rotates, the refrigerant L near the heat transfer surface H is agitated. For this reason, the temperature boundary layer formed in the vicinity of the heat transfer surface H can be broken and heat transfer can be promoted. Further, when the vapor bubble M is generated by boiling, the vapor bubble W is crushed by the blade 522, the vapor bubble M adhering to the heat transfer surface H is forcibly peeled off, and a burnout phenomenon is generated. Can be prevented.

なお、回転軸５２１が主流路５１０の中心からずれているために羽根車５２２の円周の一部分は主流路５１０の側壁を膨らませた凹部５１１に入る構造となっているが、この凹部５１１に副流路５３０からの過冷状態の冷媒Ｌを連通流路５３１を介して送ることで、伝熱面Ｈに効果的に冷媒Ｌを供給することもできる。また、冷媒Ｌを供給する連通流路５３１の向きを調整することにより、冷媒Ｌが噴出す力を羽根車５２０を回転させる動力として用いても良い。   Since the rotation shaft 521 is displaced from the center of the main flow path 510, a part of the circumference of the impeller 522 enters a recess 511 in which the side wall of the main flow path 510 is expanded. The refrigerant L can also be effectively supplied to the heat transfer surface H by sending the supercooled refrigerant L from the flow path 530 through the communication flow path 531. Further, by adjusting the direction of the communication flow path 531 for supplying the refrigerant L, the force ejected by the refrigerant L may be used as power for rotating the impeller 520.

なお、羽根車５２０の羽根５２２の高さは主流路５１０の流路高さとほぼ等しいが、主流路５１０の流れあるいは副流路５３０から供給される冷媒Ｌの流れにより羽根車５２０を回転させる動力に不足がなければ羽根高さを低くすることができる。この場合、回転する羽根５２２は伝熱面Ｈ近くのみに存在するため、主流路５１０を流れる冷媒Ｌの流体抵抗が羽根高さが高い場合に比較して小さくなる。   The height of the blade 522 of the impeller 520 is substantially equal to the height of the main flow path 510, but the power for rotating the impeller 520 by the flow of the main flow path 510 or the flow of the refrigerant L supplied from the sub flow path 530. If there is no shortage, the blade height can be lowered. In this case, since the rotating blade 522 exists only near the heat transfer surface H, the fluid resistance of the refrigerant L flowing through the main flow path 510 is smaller than that when the blade height is high.

図３２は上述した液冷装置５００の第１変形例の要部を示す断面図、図３３は羽根車の一例を示す正面図、図３４は羽根車の別の例を示す正面図。これらの図において、図３０及び図３１と同一機能部分には同一符号を付し、その詳細な説明は省略する。   32 is a cross-sectional view showing the main part of the first modification of the liquid cooling apparatus 500 described above, FIG. 33 is a front view showing an example of an impeller, and FIG. 34 is a front view showing another example of the impeller. In these drawings, the same functional parts as those in FIGS. 30 and 31 are denoted by the same reference numerals, and detailed description thereof is omitted.

本変形例では、主流路５１０内に軸流の羽根車５４０が配置されている。この羽根車５４０の回転軸５４１は冷媒Ｌの通流方向に平行である。羽根車５４０は主流路５１０内に１つ配置されていてもよいし、複数配置されていてもよい。羽根車５４０の回転軸５４１には複数の羽根５４２が設けられており、羽根５４２の先端部と伝熱面Ｈとの間隙は狭くなるように設定されている。   In this modification, an axial flow impeller 540 is disposed in the main flow path 510. The rotating shaft 541 of the impeller 540 is parallel to the flow direction of the refrigerant L. One impeller 540 may be disposed in the main flow path 510, or a plurality of impellers 540 may be disposed. The rotating shaft 541 of the impeller 540 is provided with a plurality of blades 542, and the gap between the tip of the blade 542 and the heat transfer surface H is set to be narrow.

図３５は上述した液冷装置５００の第２変形例の要部を示す縦断面図である。この図において、図３０及び図３１と同一機能部分には同一符号を付し、その詳細な説明は省略する。本変形例においては、冷媒Ｌの通流方向に複数の羽根車５４０が配置されている。主流路５１０内の冷媒流速が大きいとき、沸騰により発生した蒸気泡Ｍは通流方向に伸びた形状となるが、このような羽根車５４０の配置とすることにより、通流方向に長い蒸気泡Ｍを分断することもできる。   FIG. 35 is a longitudinal sectional view showing a main part of a second modification of the liquid cooling apparatus 500 described above. In this figure, the same functional parts as those in FIGS. 30 and 31 are denoted by the same reference numerals, and detailed description thereof is omitted. In this modification, a plurality of impellers 540 are arranged in the flow direction of the refrigerant L. When the refrigerant flow rate in the main channel 510 is large, the vapor bubbles M generated by boiling have a shape extending in the flow direction. By arranging such an impeller 540, the vapor bubbles long in the flow direction are provided. M can also be divided.

図３６は本発明の第５の実施の形態に係る液冷システム６００の構成を示す図である。なお、図３６において図１と同一機能部分には同一符号を付し、その詳細な説明は省略する。   FIG. 36 is a diagram showing a configuration of a liquid cooling system 600 according to the fifth embodiment of the present invention. 36, the same functional parts as those in FIG. 1 are denoted by the same reference numerals, and detailed description thereof is omitted.

液冷システム６００においては、１つのポンプと１つの分岐装置の組み合わせではなく、２組のポンプを設けるようにしたものである。液冷システム６００は、液相の冷媒Ｌを貯溜する冷媒溜６０１と、液冷装置２００の主流路２１０に冷媒Ｌを供給する冷媒主供給部６１０と、液冷装置２００の副流路２３０に冷媒Ｌを供給する冷媒副供給部６２０と、液冷装置２００と、この液冷装置２００に配管６３０を介して接続された熱交換器６３１と、この熱交換器６３１と冷媒溜６０１とを接続する配管６３２とを備えている。なお、冷媒溜６０１には圧力調整装置６０２が設けられている。   In the liquid cooling system 600, two sets of pumps are provided instead of a combination of one pump and one branching device. The liquid cooling system 600 includes a refrigerant reservoir 601 that stores the liquid phase refrigerant L, a refrigerant main supply unit 610 that supplies the refrigerant L to the main flow path 210 of the liquid cooling apparatus 200, and a sub flow path 230 of the liquid cooling apparatus 200. A refrigerant sub-supply unit 620 for supplying the refrigerant L, a liquid cooling device 200, a heat exchanger 631 connected to the liquid cooling device 200 via a pipe 630, and the heat exchanger 631 and the refrigerant reservoir 601 are connected. And a piping 632 to be used. The refrigerant reservoir 601 is provided with a pressure adjusting device 602.

冷媒主供給部６１０は、冷媒溜６０１に配管６１１を介して接続され冷媒Ｌを送り出すポンプ６１２と、このポンプ６１２及び冷媒溜６０１にそれぞれ配管６１３，６１４を介して接続された流量調整装置６１５とを備えている。なお、流量調整装置６１５は配管６１６を介して主流路２１０に接続されている。   The refrigerant main supply unit 610 is connected to the refrigerant reservoir 601 via a pipe 611 and sends out the refrigerant L, and a flow rate adjusting device 615 connected to the pump 612 and the refrigerant reservoir 601 via pipes 613 and 614, respectively. It has. The flow rate adjusting device 615 is connected to the main flow path 210 via a pipe 616.

流量調整装置６１５は、所定の流量の冷媒Ｌが主流路２１０に供給されるように調整する機能を有しており、流量センサ（不図示）からの検出値に基づいて流路をバルブで絞る、又は、ポンプ６１２ヘの電カの供給を制御する。なお、ポンプ６２１の安定した運転に適した領域よりも流量を低くするときには冷媒溜６０１に一部の冷媒Ｌを戻すようにしている。   The flow rate adjusting device 615 has a function of adjusting the refrigerant L at a predetermined flow rate so as to be supplied to the main flow path 210, and throttles the flow path with a valve based on a detection value from a flow rate sensor (not shown). Alternatively, the power supply to the pump 612 is controlled. Note that when the flow rate is made lower than the region suitable for stable operation of the pump 621, a part of the refrigerant L is returned to the refrigerant reservoir 601.

冷媒副供給部６２０は、冷媒溜６０１に配管６２１を介して接続され冷媒Ｌを送り出すポンプ６２２と、このポンプ６２２及び冷媒溜６０１にそれぞれ配管６２３，６２４を介して接続された流量調整装置６２５とを備えている。なお、流量調整装置６２５は配管６２６を介して主流路２３０に接続されている。   The refrigerant sub-supply unit 620 is connected to the refrigerant reservoir 601 via a pipe 621 and sends out the refrigerant L, and the flow rate adjusting device 625 connected to the pump 622 and the refrigerant reservoir 601 via pipes 623 and 624, respectively. It has. The flow rate adjusting device 625 is connected to the main flow path 230 via a pipe 626.

流量調整装置６２５は、所定の流量の冷媒Ｌが副流路２３０に供給されるように調整する機能を有しており、流量センサ（不図示）からの検出値に基づいて流路をバルブで絞る、又は、ポンプ６２２ヘの電カの供給を制御する。なお、ポンプ６２２の安定した運転に適した領域よりも流量を低くするときには冷媒溜６０１に一部の冷媒Ｌを戻すようにしている。   The flow rate adjusting device 625 has a function of adjusting the refrigerant L at a predetermined flow rate so as to be supplied to the sub flow path 230, and the flow path is controlled by a valve based on a detection value from a flow rate sensor (not shown). The power supply to the pump 622 is controlled. It should be noted that a part of the refrigerant L is returned to the refrigerant reservoir 601 when the flow rate is made lower than the region suitable for stable operation of the pump 622.

このように主流路２１０に導入される冷媒Ｌと副流路２３０主流路に導入される冷媒Ｌとが別系統によるもの場合、それぞれの冷媒Ｌのモジュール入口での温度を別個に制御可能であり、副流路２３０に供給する冷媒Ｌの温度を主流路２１０に供給する冷媒Ｌの温度よりも低くできる。このとき、主流路２１０と副流路２３０に供給する冷媒温度は同一の場合よりも副流路２３０に供給する冷媒流量は小さくても同じ効果を期待できる。   In this way, when the refrigerant L introduced into the main flow path 210 and the refrigerant L introduced into the sub flow path 230 are in different systems, the temperatures at the module inlets of the respective refrigerant L can be controlled separately. In addition, the temperature of the refrigerant L supplied to the sub flow path 230 can be lower than the temperature of the refrigerant L supplied to the main flow path 210. At this time, the same effect can be expected even if the refrigerant flow rate supplied to the sub-channel 230 is smaller than the case where the refrigerant temperatures supplied to the main channel 210 and the sub-channel 230 are the same.

なお、本発明は上記実施形態そのままに限定されるものではなく、実施段階ではその要旨を逸脱しない範囲で構成要素を変形して具体化できる。また、上記実施形態に開示されている複数の構成要素の適宜な組み合わせにより、種々の発明を形成できる。例えば、実施形態に示される全構成要素から幾つかの構成要素を削除してもよい。さらに、異なる実施形態にわたる構成要素を適宜組み合わせてもよい。   Note that the present invention is not limited to the above-described embodiment as it is, and can be embodied by modifying the components without departing from the scope of the invention in the implementation stage. In addition, various inventions can be formed by appropriately combining a plurality of components disclosed in the embodiment. For example, some components may be deleted from all the components shown in the embodiment. Furthermore, constituent elements over different embodiments may be appropriately combined.

本発明によれば、発熱体から冷媒への熱伝達を促進することで、発熱体を均等に冷却できると同時に冷媒の流量を低減できる液冷装置及び液冷システムが得られる。   ADVANTAGE OF THE INVENTION According to this invention, the liquid cooling apparatus and liquid cooling system which can reduce the flow volume of a refrigerant | coolant while being able to cool a heat generating body uniformly by promoting the heat transfer from a heat generating body to a refrigerant | coolant are obtained.

本発明の第１の実施の形態に係る液冷システムの構成を示す図。The figure which shows the structure of the liquid cooling system which concerns on the 1st Embodiment of this invention. 同液冷システムに組み込まれた液冷装置の要部を示す縦断面図。The longitudinal cross-sectional view which shows the principal part of the liquid cooling apparatus integrated in the liquid cooling system. 同液冷装置の作用を示す縦断面図。The longitudinal cross-sectional view which shows the effect | action of the liquid cooling device. 同液冷装置の第１変形例を示す縦断面図。The longitudinal cross-sectional view which shows the 1st modification of the liquid cooling device. 同液冷装置の第２変形例を示す縦断面図。The longitudinal cross-sectional view which shows the 2nd modification of the liquid cooling device. 同液冷装置の第３変形例を示す縦断面図。The longitudinal cross-sectional view which shows the 3rd modification of the liquid cooling device. 本発明の第２の実施の形態に係る液冷システムに組み込まれた液冷装置を示す横断面図。The cross-sectional view which shows the liquid cooling device integrated in the liquid cooling system which concerns on the 2nd Embodiment of this invention. 同液冷装置の縦断面図。The longitudinal cross-sectional view of the liquid cooling device. 同液冷装置の第１変形例を示す横断面図。The cross-sectional view which shows the 1st modification of the liquid cooling device. 同液冷装置の縦断面図。The longitudinal cross-sectional view of the liquid cooling device. 同液冷装置に組み込まれた平行フィンの要部を示す模式図。The schematic diagram which shows the principal part of the parallel fin integrated in the liquid cooling device. 同液冷装置の第２変形例を示す横断面図。The cross-sectional view which shows the 2nd modification of the liquid cooling device. 同液冷装置を図１２における１２Ａ−１２Ａ線で切断して矢印方向に見た縦断面図。The longitudinal cross-sectional view which cut | disconnected the liquid cooling device by the 12A-12A line | wire in FIG. 12, and looked at the arrow direction. 同液冷装置を図１２における１２Ｂ−１２Ｂ線で切断して矢印方向に見た縦断面図。The longitudinal cross-sectional view which cut | disconnected the liquid cooling device by the 12B-12B line | wire in FIG. 12, and looked at the arrow direction. 同液冷装置の第３変形例の原理を示す説明図。Explanatory drawing which shows the principle of the 3rd modification of the liquid cooling device. 同液冷装置の要部を図１５における１５Ａ−１５Ａ線で切断して矢印方向に見た断面図。Sectional drawing which cut | disconnected the principal part of the liquid cooling device by the 15A-15A line in FIG. 15, and looked at the arrow direction. 同液冷装置の要部を図１５における１５Ｂ−１５Ｂ線で切断して矢印方向に見た断面図。Sectional drawing which cut | disconnected the principal part of the liquid cooling device by the 15B-15B line | wire in FIG. 15, and looked at the arrow direction. 同液冷装置の第４変形例を示す図であって、図１９における１９Ａ−１９Ａ線で切断して矢印方向に見た断面図。It is a figure which shows the 4th modification of the liquid cooling device, Comprising: Sectional drawing cut | disconnected by the 19A-19A line | wire in FIG. 同液冷装置を図１８における１８Ａ−１８Ａ線で切断して矢印方向に見た断面図。Sectional drawing which cut | disconnected the liquid cooling device by the 18A-18A line in FIG. 18, and looked at the arrow direction. 同液冷装置の第５変形例の要部を示す縦断面図。The longitudinal cross-sectional view which shows the principal part of the 5th modification of the liquid cooling device. 同液冷装置の動作原理を示す説明図。Explanatory drawing which shows the operating principle of the liquid cooling device. 同液冷装置の第６変形例の要部を示す横断面図。The cross-sectional view which shows the principal part of the 6th modification of the liquid cooling device. 同液冷装置の要部を示す縦断面図。The longitudinal cross-sectional view which shows the principal part of the liquid cooling device. 本発明の第３の実施の形態に係る液冷装置の要部を示す平面図。The top view which shows the principal part of the liquid cooling device which concerns on the 3rd Embodiment of this invention. 同液冷装置を示す斜視図。The perspective view which shows the liquid cooling device. 同液冷装置の第１変形例の要部を示す平面図。The top view which shows the principal part of the 1st modification of the liquid cooling device. 同液冷装置の第２変形例の要部を示す斜視図。The perspective view which shows the principal part of the 2nd modification of the liquid cooling device. 同液冷装置の第３変形例の要部を示す斜視図。The perspective view which shows the principal part of the 3rd modification of the liquid cooling device. 同液冷装置の第４変形例の要部を示す斜視図。The perspective view which shows the principal part of the 4th modification of the liquid cooling device. 本発明の第４の実施の形態に係る液冷装置の要部を示す縦断面図。The longitudinal cross-sectional view which shows the principal part of the liquid cooling device which concerns on the 4th Embodiment of this invention. 同液冷装置の要部を示す横断面図。The cross-sectional view which shows the principal part of the liquid cooling device. 同液冷装置の第１変形例の要部を示す断面図。Sectional drawing which shows the principal part of the 1st modification of the liquid cooling device. 同液冷装置に組み込まれた羽根車の一例を示す正面図。The front view which shows an example of the impeller integrated in the liquid cooling device. 同液冷装置に組み込まれた羽根車の別の例を示す正面図。The front view which shows another example of the impeller integrated in the liquid cooling device. 同液冷装置の第２変形例の要部を示す縦断面図。The longitudinal cross-sectional view which shows the principal part of the 2nd modification of the liquid cooling device. 本発明の第５の実施の形態に係る液冷システムの構成を示す図。The figure which shows the structure of the liquid cooling system which concerns on the 5th Embodiment of this invention. 液冷システムの一例を示す図。The figure which shows an example of a liquid cooling system. 同液冷システムに組み込まれた液冷装置を示す縦断面図。The longitudinal cross-sectional view which shows the liquid cooling apparatus integrated in the liquid cooling system.

符号の説明Explanation of symbols

１００，６００…液冷システム、２００，３００，４００，５００…液冷装置、Ｐ…パワー素子（発熱体）、Ｌ…冷媒。   DESCRIPTION OF SYMBOLS 100,600 ... Liquid cooling system, 200,300,400,500 ... Liquid cooling device, P ... Power element (heating element), L ... Refrigerant.

Claims (5)

発熱体を冷媒により冷却する液冷装置において、
上記冷媒が通流するとともに上記発熱体に熱的に接続された主流路と、
この主流路よりも上記発熱体から離間した位置に設けられ、上記冷媒が通流する副流路とを備え、
上記主流路と上記副流路との間には上記冷媒を通流させる連通流路が設けられていることを特徴とする液冷装置。 In a liquid cooling device that cools a heating element with a refrigerant,
A main flow path through which the refrigerant flows and is thermally connected to the heating element;
Provided in a position farther from the heating element than the main flow path, and a sub flow path through which the refrigerant flows,
A liquid cooling apparatus, wherein a communication channel for allowing the refrigerant to flow therethrough is provided between the main channel and the sub channel. 上記主流路の上流側に比べて下流側に多く又は大口径の連通流路が設けられていることを特徴とする請求項１に記載の液冷装置。   The liquid cooling device according to claim 1, wherein a communication channel having a larger or larger diameter is provided on the downstream side than the upstream side of the main channel. 上記主流路内の上記冷媒の通流方向と上記副流路内の上記冷媒の通流方向とが逆方向であることを特徴とする請求項１に記載の液冷装置。   The liquid cooling device according to claim 1, wherein a flow direction of the refrigerant in the main flow path and a flow direction of the refrigerant in the sub flow path are opposite to each other. 発熱体を冷媒により冷却する液冷システムにおいて、
上記発熱体に設けられた液冷装置と、
この液冷装置に冷媒を送るポンプと、
このポンプにより送られた冷媒を分流して上記液冷装置に供給する分岐装置と、
上記液冷装置から排出された冷媒を冷却する熱交換器とを備え、
上記液冷装置は、上記冷媒が通流するとともに上記発熱体に熱的に接続された主流路と、
この主流路よりも上記発熱体から離間した位置に設けられ、上記冷媒が通流する副流路とを備え、
上記主流路と上記副流路との間には上記冷媒を通流させる連通流路が設けられていることを特徴とする液冷システム。 In a liquid cooling system that cools a heating element with a refrigerant,
A liquid cooling device provided in the heating element;
A pump for sending refrigerant to the liquid cooling device;
A branch device for diverting the refrigerant sent by the pump and supplying the refrigerant to the liquid cooling device;
A heat exchanger for cooling the refrigerant discharged from the liquid cooling device,
The liquid cooling device includes a main flow path through which the refrigerant flows and is thermally connected to the heating element;
Provided in a position farther from the heating element than the main flow path, and a sub flow path through which the refrigerant flows,
A liquid cooling system, wherein a communication channel for allowing the refrigerant to flow is provided between the main channel and the sub channel. 発熱体を冷媒により冷却する液冷システムにおいて、
上記発熱体に設けられた液冷装置と、
この液冷装置に上記冷媒を送る主流路用ポンプと、
上記液冷装置に上記冷媒を送る副流路用ポンプと、
上記液冷装置から排出された冷媒を冷却する熱交換器とを備え、
上記液冷装置は、上記主流路用ポンプから供給された上記冷媒が通流するとともに上記発熱体に熱的に接続された主流路と、
この主流路よりも上記発熱体から離間した位置に設けられ、上記副流路用ポンプから供給された上記冷媒が通流する副流路とを備え、
上記主流路と上記副流路との間には上記冷媒を通流させる連通流路が設けられていることを特徴とする液冷システム。 In a liquid cooling system that cools a heating element with a refrigerant,
A liquid cooling device provided in the heating element;
A main channel pump for sending the refrigerant to the liquid cooling device;
A sub-channel pump for sending the refrigerant to the liquid cooling device;
A heat exchanger for cooling the refrigerant discharged from the liquid cooling device,
The liquid cooling device includes a main flow path through which the refrigerant supplied from the main flow path pump flows and is thermally connected to the heating element;
Provided in a position farther from the heating element than the main flow path, and a sub flow path through which the refrigerant supplied from the sub flow path pump flows,
A liquid cooling system, wherein a communication channel for allowing the refrigerant to flow is provided between the main channel and the sub channel.
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